A non-coupled dual-power inductor and a manufacturing method thereof

Abstract

The present invention discloses a high-temperature uncoupled dual-power inductor and a manufacturing method thereof. The inductor is composed of an inductor magnet and two inductor conductors. Two conductor fixing grooves are provided in the inductor magnet. The two inductor conductors are respectively embedded in the two conductor fixing grooves. The connecting pins on the two inductor conductors are bent and fitted to the circumferential side of the inductor magnet. Two grounding devices are also fixedly provided on the outer peripheral side of the inductor magnet. The grounding pins on the two grounding devices are bent and fitted to the lower end surface of the inductor magnet. The high-temperature uncoupled dual-power inductor of the present invention has a reduced finished product volume and occupied space, is suitable for various circuit structures, and has strong flexibility in the setting and use of the inductor device and rich application scenarios.

Description

Technical Field

[0001] The present invention relates to a high temperature inductor device, in particular to a high temperature uncoupled dual power inductor and a corresponding manufacturing method thereof, belonging to the technical field of inductor processing. Background Art

[0002] Inductor is the most common component in electronic equipment and is also one of the important components in circuits. It is widely used in various circuits to achieve the functions of filtering, energy storage, matching, and resonance.

[0003] With the continuous development of the Internet, the Internet of Things and other technologies in recent years, various hardware devices have been updated and iterated more frequently, and data processing capabilities have increased day by day. At the same time, some large devices that people traditionally know, such as servers and cloud servers, have also begun to develop towards integration and miniaturization. Since such hardware devices have high requirements for stability during operation, during the design stage, the requirements for their external dimensions, internal structure, etc. are relatively strict. It is necessary not only to consider the full utilization of the internal space of the hardware equipment, but also to ensure that the internal components of the hardware equipment can operate efficiently for a long time when in use.

[0004] Because of this, the requirements for power inductors used in such hardware devices are becoming increasingly stringent, including high frequency, high current, high temperature resistance, low DCR (Directive Current Resistance), low EMI (Electromagnetic Interference), etc. Under the constraints of the above requirements, it is difficult for existing power inductors to fully meet the actual needs of users. In addition, most of the common power inductors on the market at this stage are single-winding, independent structures, with a relatively loose overall structure and irregular shape. Such a structure will restrict its application in the circuit structure and affect the simplification of the circuit. Moreover, no matter how the external structure of these power inductors changes, their internal settings are basically the same. The pins of most power inductors are set on the upper and lower end faces. In this way, the overall layout of the circuit will be restricted to a certain extent, and there may be special applications where the inductor cannot be installed.

[0005] In response to the above technical problems, some industry researchers have tried to change the structure of power inductors and set the pins of power inductors on their circumferential sides. However, due to the particularity of inductor devices, changing the setting direction of the pins also means changing the setting direction of its internal coils and other conductors, which will change the direction of the magnetic field generated by the power inductor during subsequent operation, making it difficult to ensure that it will not affect the normal use of other components inside the device in highly integrated application scenarios with extremely tight component layout.

[0006] In summary, how to propose a new uncoupled power inductor and its corresponding manufacturing method based on the existing technology to address the above technical problems, so as to realize the integration and modernization of the structure of the inductor device itself, while ensuring its working efficiency and avoiding its impact on the normal use of other components inside the equipment, has become a problem that needs to be urgently solved by technicians in this field. Summary of the invention

[0007] In view of the above-mentioned defects in the prior art, the purpose of the present invention is to propose a high-temperature uncoupled dual-power inductor suitable for high-precision application scenarios such as server and cloud server components and a corresponding manufacturing method, as follows.

[0008] A high-temperature uncoupled dual-power inductor is composed of an inductor magnet and two inductor conductors. The inductor magnet includes a molded inductor body and a molded inductor cover plate. Both the molded inductor body and the molded inductor cover plate are integrally molded structures and are fixed together. Two conductor fixing grooves for arranging the inductor conductors are provided on the molded inductor body. The two inductor conductors are respectively embedded in the two conductor fixing grooves. The connecting pins on the two inductor conductors are bent and fitted to the circumferential side surface of the inductor magnet. Two grounding devices for connecting the inductor magnet to the grounding wire in the circuit system are also fixedly provided on the outer peripheral side of the inductor magnet. The grounding pins on the two grounding devices are bent and fitted to the lower end surface of the inductor magnet.

[0009] Preferably, the two inductor conductors are symmetrically arranged, and the inductor conductor is formed by bending a Z-shaped double-ended right-angle sheet metal part. The two end portions of the inductor conductor are respectively perpendicular to the middle portion of the inductor conductor, and the middle portion of the inductor conductor serves as the inductor effective part, and the two end portions serve as a pair of connecting pins.

[0010] Preferably, the two grounding devices are symmetrically arranged, and the grounding device is formed by bending a rectangular sheet metal part, one end of the grounding device is perpendicular to the other end thereof, one end of the grounding device serves as a magnet connection section, and the other end serves as a grounding pin.

[0011] Preferably, the two conductor fixing grooves are symmetrically opened on the lower end surface of the molded inductor body, and the outer peripheral side of the molded inductor body is provided with a step surface for accommodating the connecting pins on the inductor conductor and the magnet connecting section on the grounding device; the outer peripheral side and the lower end surface of the molded inductor cover plate are both provided with a step surface for accommodating the grounding pins on the grounding device.

[0012] Preferably, the lower end surface of the formed inductor body and the upper end surface of the formed inductor cover are bonded and fixed to form a complete inductor magnet together, the inductor effect portion of the inductor conductor is embedded and fixed in the conductor fixing groove, the connecting pins of the inductor conductor are fixed to the outer peripheral side of the inductor magnet by means of the step surfaces provided on the formed inductor body and the formed inductor cover, the grounding device is bonded and fixed to the outer peripheral side of the inductor magnet, the magnet connecting section of the grounding device is fixed to the outer peripheral side of the inductor magnet by means of the step surfaces provided on the formed inductor body and the formed inductor cover, and the grounding pins of the grounding device are fixed to the lower end surface of the inductor magnet by means of the step surface provided on the lower end surface of the formed inductor cover.

[0013] Preferably, in the combined state of the inductor magnet, the inductor conductor and the grounding device, the outer end faces of the connecting pins on the inductor conductor are coplanar with the outer peripheral side of the inductor magnet where they are located, the outer end faces of the magnet connecting sections on the grounding device are concave inwardly relative to the outer peripheral side end faces of the inductor magnet where they are located, and the outer end faces of the grounding pins on the grounding device are convex outwardly relative to the lower end face of the inductor magnet where they are located.

[0014] Preferably, in a state where the inductor magnet and the inductor conductor are combined, a coupling coefficient between two of the inductor conductors is less than 0.2.

[0015] A method for manufacturing a high temperature uncoupled dual power inductor, used for processing the high temperature uncoupled dual power inductor as described above, comprises the following steps:

[0016] S1, inductor magnet processing, insulating powder, adhesive, lubricant and curing agent are mixed in proportion, mixed and granulated to form inductor magnet granules, the inductor magnet granules are molded by a mold, and after compression molding, high-temperature sintering is performed to obtain a molded inductor body and a molded inductor cover plate;

[0017] S2, processing of inductor conductor and grounding device, selecting substrate, and obtaining inductor conductor and grounding device by cold pressing sheet metal and bending;

[0018] S3, the inductor device is assembled and processed, the inductor conductor is embedded in the molded inductor body, the molded inductor body and the molded inductor cover are bonded and fixed to obtain an inductor magnet with the inductor conductor assembled inside, and the grounding device is bonded and fixed to the outer peripheral side of the inductor magnet to obtain a finished inductor device.

[0019] Preferably, in S1, the insulating powder is a combination of any one or more of iron powder, iron-silicon powder, iron-silicon-chromium powder, iron-silicon-aluminum powder, amorphous powder and nanocrystalline powder; the adhesive is a combination of any one or more of silicone resins; the lubricant is a combination of any one or more of stearic acid, aluminum stearate, magnesium stearate, calcium stearate and zinc stearate.

[0020] Preferably, in S1, high temperature sintering is performed at a temperature of 700°C to 1000°C, and during the high temperature sintering process, N2 is continuously introduced into the high temperature sintering furnace for protection.

[0021] Compared with the prior art, the advantages of the present invention are mainly reflected in the following aspects:

[0022] A high-temperature uncoupled dual-power inductor of the present invention integrates two inductor conductors in a relative, horizontal manner into an integral inductor device through the splicing combination of parts, so that the finished product volume and occupied space of the inductor device are reduced, and it is suitable for various circuit structures. In the present invention, the two inductor conductors are uncoupled and the connecting pins of the two inductor conductors are arranged in pairs on the circumferential side of the inductor device. During the use of the inductor device, the operator can choose to use the inductor conductors independently or in combination according to the actual application scenario, thereby significantly improving the flexibility of the inductor device during the setting and use process and broadening the application scenario of the present invention.

[0023] At the same time, a high-temperature uncoupled dual-power inductor of the present invention takes into account the subsequent impact that may be caused by the change in the setting direction of the internal inductor conductor, and connects the entire inductor device with the ground wire in the external circuit by setting a pair of ground pins. This not only ensures that the normal operation of other components in the use scenario is not affected, but also improves the vibration resistance of the inductor device, and also makes the inductor device tolerate lower voltage, larger current and higher circuit adaptability during operation.

[0024] Corresponding to the inductor device in the present invention, a processing method of a high-temperature uncoupled dual-power inductor in the present invention has a clear process flow logic and a clear device assembly form, which not only makes the final processed inductor device have a good use effect, but also fully considers the development level of related technologies and the process difficulty of product manufacturing, thereby improving the processing efficiency and providing conditions for subsequent large-scale production.

[0025] In addition, the present invention also provides a reference for other related solutions in the same field, and can be expanded and extended based on this, and such structures and methods can be applied to technical solutions of other inductor devices, which has a very broad application prospect.

[0026] The specific implementation modes of the present invention are further described below in combination with the accompanying drawings of the embodiments, so that the technical solutions of the present invention are easier to understand and grasp. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a structural schematic diagram of the molded inductor body in the present invention;

[0028] Figure 2 It is a schematic diagram of the overall structure of the present invention in a combined state;

[0029] Figure 3 It is a schematic diagram of the assembly structure of the present invention in a disassembled state.

[0030] Among them: 1. molded inductor body; 11. conductor fixing groove; 2. molded inductor cover plate; 3. inductor conductor; 4. grounding device. DETAILED DESCRIPTION

[0031] The present invention proposes a high-temperature uncoupled dual-power inductor and a corresponding manufacturing method suitable for high-precision application scenarios such as server and cloud server components. The specific scheme is as follows.

[0032] like Figure 1~Figure 3 As shown, a high-temperature uncoupled dual-power inductor is composed of an inductor magnet and two inductor conductors 3. The inductor magnet includes a molded inductor body 1 and a molded inductor cover plate 2. The molded inductor body 1 and the molded inductor cover plate 2 are both integrally molded structures and are fixed together. The molded inductor body 1 is provided with two conductor fixing grooves 11 for arranging the inductor conductors 3. The two inductor conductors 3 are respectively embedded in the two conductor fixing grooves 11. The connecting pins on the two inductor conductors 3 are bent and fitted to the circumferential side surface of the inductor magnet; two grounding devices 4 for connecting the inductor magnet to the grounding wire in the circuit system are also fixedly arranged on the outer peripheral side of the inductor magnet, and the grounding pins on the two grounding devices 4 are bent and fitted to the lower end surface of the inductor magnet.

[0033] Furthermore, the two inductor conductors 3 are symmetrically arranged, and the inductor conductor 3 is formed by bending a Z-shaped double-ended right-angle sheet metal part. The two end portions of the inductor conductor 3 are respectively perpendicular to the middle portion, and the middle portion of the inductor conductor 3 serves as the inductor effective part, and the two end portions serve as a pair of connecting pins.

[0034] Correspondingly, the two grounding devices 4 are symmetrically arranged. The grounding device 4 is formed by bending a rectangular sheet metal. One end of the grounding device 4 is perpendicular to the other end thereof. One end of the grounding device 4 serves as a magnet connection section and the other end serves as a grounding pin.

[0035] The two conductor fixing grooves 11 are symmetrically opened on the lower end surface of the molded inductor body 1, and the outer peripheral side of the molded inductor body 1 is provided with a step surface for accommodating the connecting pins on the inductor conductor 3 and the magnetic connecting section on the grounding device 4; the outer peripheral side and the lower end surface of the molded inductor cover plate 2 are both provided with a step surface for accommodating the grounding pins on the grounding device 4.

[0036] The lower end surface of the formed inductor body 1 and the upper end surface of the formed inductor cover plate 2 are bonded and fixed to form a complete inductor magnet together. The inductor effective part of the inductor conductor 3 is embedded and fixed in the conductor fixing groove 11. The connecting pins of the inductor conductor 3 are fixed to the outer peripheral side of the inductor magnet by means of the step surfaces provided on the formed inductor body 1 and the formed inductor cover plate 2. The grounding device 4 is bonded and fixed to the outer peripheral side of the inductor magnet. The magnet connecting section of the grounding device 4 is fixed to the outer peripheral side of the inductor magnet by means of the step surfaces provided on the formed inductor body 1 and the formed inductor cover plate 2. The grounding pin of the grounding device 4 is fixed to the lower end surface of the inductor magnet by means of the step surface provided on the lower end surface of the formed inductor cover plate 2.

[0037] It should be noted that, in the combined state of the inductor magnet, the inductor conductor 3 and the grounding device 4, the outer end faces of the connecting pins on the inductor conductor 3 are coplanar with the outer peripheral side of the inductor magnet where they are located, the outer end faces of the magnet connecting sections on the grounding device 4 are concave inwardly of the outer peripheral side end faces of the inductor magnet where they are located, and the outer end faces of the grounding pins on the grounding device 4 are convex outwardly of the lower end face of the inductor magnet where they are located.

[0038] Considering the non-coupling characteristics of the solution of the present invention, it should be emphasized that, in the combined state of the inductor magnet and the inductor conductor 3 , the coupling coefficient K between the two inductor conductors 3 is less than 0.2.

[0039] The calculation method of the coupling coefficient K is described below, and the two connecting pins of one inductor conductor 3 are marked as a first pin and a second pin, respectively, and the two connecting pins of another inductor conductor 3 are marked as a third pin and a fourth pin, respectively.

[0040] Test the first pin and the second pin, keep the third pin and the fourth pin disconnected, record the inductance value of the inductor at this time, and record it as L1; then test the first pin and the second pin, connect the third pin and the fourth pin at the same time to form a short circuit, and record the inductance value of the inductor at this time, and record it as L2.

[0041] The calculation formula of the coupling coefficient K between the two inductor conductors 3 is:

[0042] .

[0043] It can be seen from the above scheme that the high-temperature uncoupled dual-power inductor of the present invention integrates two inductor conductors in a relative, horizontal manner into an integral inductor device through the splicing combination of parts, so that the finished product volume and occupied space of the inductor device are reduced, and it is suitable for various circuit structures. In the present invention, the two inductor conductors are uncoupled and the connecting pins of the two inductor conductors are arranged in pairs on the circumferential side of the inductor device. During the use of the inductor device, the operator can choose to use the inductor conductors independently or in combination according to the actual application scenario, thereby significantly improving the flexibility of the inductor device during the setting and use process and broadening the application scenario of the present invention.

[0044] At the same time, a high-temperature uncoupled dual-power inductor of the present invention takes into account the subsequent impact that may be caused by the change in the setting direction of the internal inductor conductor, and connects the entire inductor device with the ground wire in the external circuit by setting a pair of ground pins. This not only ensures that the normal operation of other components in the use scenario is not affected, but also improves the vibration resistance of the inductor device, and also makes the inductor device tolerate lower voltage, larger current and higher circuit adaptability during operation.

[0045] A method for manufacturing a high temperature uncoupled dual power inductor, used for processing the high temperature uncoupled dual power inductor as described above, comprises the following steps:

[0046] S1, inductor magnet processing, insulating powder, adhesive, lubricant and curing agent are mixed in proportion, mixed and granulated to form inductor magnet granular material, the inductor magnet granular material is molded by a mold, and after compression molding, a molded inductor body 1 and a molded inductor cover plate 2 are obtained by high-temperature sintering.

[0047] In this step, the insulating powder is any one or more combinations of iron powder, iron silicon powder, iron silicon chromium powder, iron silicon aluminum powder, amorphous powder and nanocrystalline powder; the adhesive is any one or more combinations of silicone resins; the lubricant is any one or more combinations of stearic acid, aluminum stearate, magnesium stearate, calcium stearate and zinc stearate.

[0048] In addition, it should be added that the high-temperature sintering is carried out at a temperature of 700°C to 100°C, and in order to ensure the final product effect, N2 protection needs to be continuously introduced into the high-temperature sintering furnace during the high-temperature sintering process.

[0049] S2, processing of inductor conductor and grounding device, selecting a substrate, and obtaining the inductor conductor 3 and the grounding device 4 after cold pressing of sheet metal and bending.

[0050] S3, inductor device assembly processing, embedding the inductor conductor 3 inside the molded inductor body 1, bonding the molded inductor body 1 and the molded inductor cover plate 2 to obtain an inductor magnet with the inductor conductor 3 assembled inside, and then bonding and fixing the grounding device 4 to the outer peripheral side of the inductor magnet to obtain a finished inductor device.

[0051] Corresponding to the inductor device in the present invention, a processing method of a high-temperature uncoupled dual-power inductor in the present invention has a clear process flow logic and a clear device assembly form, which not only makes the final processed inductor device have a good use effect, but also fully considers the development level of related technologies and the process difficulty of product manufacturing, thereby improving the processing efficiency and providing conditions for subsequent large-scale production.

[0052] In addition, the present invention also provides a reference for other related solutions in the same field, and can be expanded and extended based on this, and such structures and methods can be applied to technical solutions of other inductor devices, which has a very broad application prospect.

[0053] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit and essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-limiting from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present invention, and any reference numerals in the claims should not be regarded as limiting the claims involved.

[0054] Finally, it should be understood that although this specification is described according to implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A non-coupled dual power inductor, characterized in that: The invention is composed of an inductor magnet and two inductor conductors (3), wherein two grounding devices (4) for connecting the inductor magnet to a grounding wire in a circuit system are fixedly arranged on the outer peripheral side of the inductor magnet, wherein the inductor magnet comprises a molded inductor body (1) and a molded inductor cover plate (2), wherein the molded inductor body (1) and the molded inductor cover plate (2) are both integrally molded structures and are fixedly matched therebetween, wherein two conductor fixing grooves (11) for arranging the inductor conductors (3) are symmetrically arranged on the lower end surface of the molded inductor body (1), wherein the outer peripheral side of the molded inductor body (1) is provided with a step surface for accommodating a connecting pin on the inductor conductor (3) and a magnet connecting section on the grounding device (4), wherein the outer peripheral side of the molded inductor cover plate (2) and the The lower end surface is provided with a step surface for accommodating the grounding pin on the grounding device (4); the two inductor conductors (3) are respectively embedded in the two conductor fixing grooves (11), and the connecting pin on each inductor conductor (3) is bent and fitted to the circumferential side surface of the inductor magnet; the grounding pins on the two grounding devices (4) are bent and fitted to the lower end surface of the inductor magnet.

2. The uncoupled dual power inductor according to claim 1, characterized in that: The two inductor conductors (3) are symmetrically arranged, and the inductor conductor (3) is formed by bending a Z-shaped double-ended right-angle sheet metal part, and the two end portions of the inductor conductor (3) are respectively perpendicular to the middle section portion, and the middle section portion of the inductor conductor (3) serves as an inductor effective part, and the two end portions serve as a pair of connection pins.

3. The uncoupled dual power inductor according to claim 2, characterized in that: The two grounding devices (4) are symmetrically arranged, and the grounding device (4) is formed by bending a rectangular sheet metal part, one end of the grounding device (4) is perpendicular to the other end thereof, and one end of the grounding device (4) serves as a magnet connection section, and the other end serves as a grounding pin.

4. The uncoupled dual power inductor according to claim 1, characterized in that: The lower end surface of the molded inductor body (1) and the upper end surface of the molded inductor cover plate (2) are bonded and fixed to form a complete inductor magnet; the inductor effect portion of the inductor conductor (3) is embedded and fixed in the conductor fixing groove (11); the connecting pin of the inductor conductor (3) is fixed to the outer peripheral side of the inductor magnet by means of the step surfaces provided on the molded inductor body (1) and the molded inductor cover plate (2); the grounding device (4) is bonded and fixed to the outer peripheral side of the inductor magnet; the magnet connecting section of the grounding device (4) is fixed to the outer peripheral side of the inductor magnet by means of the step surfaces provided on the molded inductor body (1) and the molded inductor cover plate (2); and the grounding pin of the grounding device (4) is fixed to the lower end surface of the inductor magnet by means of the step surface provided on the lower end surface of the molded inductor cover plate (2).

5. The uncoupled dual power inductor according to claim 4, characterized in that: In the combined state of the inductor magnet, the inductor conductor (3) and the grounding device (4), the outer end faces of the connecting pins on the inductor conductor (3) are coplanar with the outer peripheral side of the inductor magnet where they are located, the outer end faces of the magnet connecting sections on the grounding device (4) are concave inwardly at the outer peripheral side end faces of the inductor magnet where they are located, and the outer end faces of the grounding pins on the grounding device (4) are convex outwardly at the lower end faces of the inductor magnet where they are located.

6. The uncoupled dual power inductor according to claim 1, characterized in that: In a state where the inductor magnet and the inductor conductor (3) are combined, the coupling coefficient between the two inductor conductors (3) is less than 0.

2.

7. A method for manufacturing an uncoupled dual power inductor, used for processing the uncoupled dual power inductor as claimed in any one of claims 1 to 6, characterized in that: The steps include: S1, inductor magnet processing, insulating powder, adhesive, lubricant and curing agent are mixed in proportion, mixed and granulated to form inductor magnet granular material, the inductor magnet granular material is molded by a mold, and after compression molding, high-temperature sintering is performed to obtain a molded inductor body (1) and a molded inductor cover plate (2); S2, processing the inductor conductor and the grounding device, selecting a substrate, and subjecting the substrate to cold pressing and bending to obtain the inductor conductor (3) and the grounding device (4); S3, inductor device assembly processing, embedding the inductor conductor (3) inside the molded inductor body (1), bonding the molded inductor body (1) and the molded inductor cover plate (2) to obtain an inductor magnet with the inductor conductor (3) installed inside, and then bonding and fixing the grounding device (4) to the outer peripheral side of the inductor magnet to obtain a finished inductor device.

8. The method for manufacturing a non-coupled dual power inductor according to claim 7, characterized in that: In S1, the insulating powder is any one or more combinations of iron powder, iron silicon powder, iron silicon chromium powder, iron silicon aluminum powder, amorphous powder and nanocrystalline powder; the adhesive is any one or more combinations of silicone resins; the lubricant is any one or more combinations of stearic acid, aluminum stearate, magnesium stearate, calcium stearate and zinc stearate.

9. The method for manufacturing a non-coupled dual power inductor according to claim 7, characterized in that: In S1: high temperature sintering is performed at a temperature of 700°C to 1000°C, and during the high temperature sintering process, N2 is continuously introduced into the high temperature sintering furnace for protection.

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