Ultra-thin glass substrate, manufacturing method of ultra-thin glass substrate and panel manufacturing method

Abstract

The present invention provides an ultra-thin glass substrate, a manufacturing method for the ultra-thin glass substrate, and a panel manufacturing method. The ultra-thin glass substrate includes: a glass substrate, on the first side of which there is at least one bending stress dissipation groove extending along a preset bending path; and a polymer reinforcing layer, the polymer reinforcing layer fills the bending stress dissipation groove, and the polymer reinforcing layer is exposed on the upper surface of the glass substrate and is flush with the upper surface of the glass substrate. The present invention can obtain the glass substrate from the glass base material, and at the same time, set bending stress dissipation grooves filled with polymer reinforcing layers on the glass base material, enhance the bending performance of the panel along the preset bending path during the subsequent panel manufacturing process, save the time of the functional layer manufacturing process, and at the same time improve the anti-bending performance and anti-impact performance of the ultra-thin glass substrate, greatly improving the product quality of the ultra-thin glass substrate.

Description

Technical Field

[0001] The present invention relates to the technical field of panel manufacturing processes, and specifically, to an ultra-thin glass substrate, a manufacturing method for an ultra-thin glass substrate, and a panel manufacturing method. Background Art

[0002] As an important component of a foldable cover plate, the quality of an ultra-thin glass substrate (UTG substrate) itself is crucial to achieve the effect of a smaller or even a bending radius of R = 2 mm. Especially after the UTG substrate is cut into a specific size, special treatment of its edge, that is, defects such as chipping and micro-cracks generated by cutting need to be removed, so as to avoid the breakage of the glass due to micro-cracks during bending. Generally speaking, two aspects of problems need to be solved: 1) What cutting method should be adopted to obtain relatively straight edge quality; 2) What methods such as polishing should be adopted to remove edge defects.

[0003] Currently, wheel knife cutting is limited to straight cutting and still faces difficulties in cutting product special shapes (rounded corners). Moreover, a UTG substrate of about 100 um without chemical strengthening treatment is very fragile and it is difficult to withstand the mechanical pressure during wheel knife cutting, resulting in a high proportion of fragments, or obvious chipping and corner missing at the edge of the substrate that are not expected. These defects are very fatal for subsequent edge polishing and may directly lead to the scrapping of the substrate. Therefore, finding a suitable cutting method to obtain a substrate with a straight edge is an important part of the work.

[0004] In contrast, laser cutting with non-mechanical force can obtain better edge cutting effects and may become the mainstream method for cutting ultra-thin substrates in the future. Laser cutting means that the energy released when a laser beam irradiates the surface of a workpiece melts and evaporates the workpiece to achieve the purpose of cutting and slicing. Laser cutting does not apply pressure to the glass surface, so it will not cause fragmentation of the glass substrate, and various special-shaped cuttings can be made at the same time.

[0005] On the other hand, the UTG substrate is extremely prone to quality defects such as scratches on the glass surface or mutual extrusion and damage during processing and transportation. Currently, the method of spraying protective ink on both surfaces of the glass is adopted to reduce or avoid the occurrence of the above problems, and a processing process of cutting a large UTG mother board glass - edge polishing - chemical strengthening - spraying protective ink is formed. Finally, a functional film is coated on the UTG substrate after chemical strengthening treatment to form a foldable cover plate.

[0006] Therefore, the common implementation method is as follows: after spraying protective ink on the UTG ultra-thin substrate, laser cutting is carried out or subsequent processing is performed according to the desired size. However, evenly spraying ink on the surface of the UTG substrate is a very difficult task. In particular, it is very difficult to eliminate related bubbles, ensure uniform film thickness, uniform color, and a clean spraying environment. At the same time, due to the often uneven spraying on the laser cutting path, problems such as laser scattering in this area occur, ultimately resulting in incomplete laser cutting of the glass, difficult fragmenting, or serious edge chipping and other defects. These defects seriously affect the subsequent edge polishing process.

[0007] Moreover, when the bent screen cover plate includes ultra-thin glass (UTG), the required bending radius is getting smaller and smaller, and the strength requirement for the glass is gradually increasing. However, to improve the bending performance, the thickness of the UTG will become thinner and thinner, but the impact resistance of the too-thin UTG is weak.

[0008] Therefore, the present invention provides an ultra-thin glass substrate, a manufacturing method of the ultra-thin glass substrate, and a panel manufacturing method. Summary of the Invention

[0009] Aiming at the problems in the prior art, the purpose of the present invention is to provide an ultra-thin glass substrate, a manufacturing method of the ultra-thin glass substrate, and a panel manufacturing method, which overcome the difficulties of the prior art. While obtaining a glass substrate from a glass base material, a bending stress dissipation groove filled with a polymer reinforcing layer is provided on the glass base material, enhancing the bending performance of the panel along a preset bending path during the subsequent panel manufacturing process, saving the time of the functional layer manufacturing process, and at the same time improving the anti-bending performance and anti-impact performance of the ultra-thin glass substrate, greatly improving the product quality of the ultra-thin glass substrate.

[0010] An embodiment of the present invention provides a manufacturing method of an ultra-thin glass substrate, including:

[0011] A glass substrate, at least one bending stress dissipation groove extending along a preset bending path is provided on the first side of the glass substrate, and a stress dissipation edge is formed at the edge of the substrate area; and

[0012] A polymer reinforcing layer, the polymer reinforcing layer fills the bending stress dissipation groove, and the polymer reinforcing layer is exposed on the upper surface of the glass substrate and is flush with the upper surface of the glass substrate.

[0013] Preferably, the polymer material of the polymer reinforcing layer has a light transmittance ≥ 90%, a refractive index range of 1.2 to 1.7, and an adhesion to the glass substrate of 5B.

[0014] Preferably, the components of the polymer reinforcement layer include liquid optical adhesive, acrylic, silicon-containing organic polymer material, epoxy resin, fluororesin, polyamide, polyimide, polycarbonate, polyethylene terephthalate, and poly(1,4-cyclohexanedimethylene terephthalate).

[0015] Preferably, any one of the following for the bending stress dissipation grooves:

[0016] A plurality of strip-shaped grooves all parallel to the preset bending path;

[0017] A rectangular groove body extending along the preset bending path;

[0018] An elliptical groove body extending along the preset bending path.

[0019] Preferably, it further includes: a panel functional layer, the panel functional layer is disposed on the first side of the glass substrate, and is adhered to the glass substrate by the polymer reinforcement layer.

[0020] Preferably, the bending stress dissipation grooves filled with the polymer reinforcement layer are also provided on the second side of the glass substrate; and the first projection of the bending stress dissipation grooves on the first side and the second projection of the bending stress dissipation grooves on the second side of the glass substrate are mutually misaligned based on the glass substrate.

[0021] An embodiment of the present invention further provides a method for manufacturing an ultra-thin glass substrate, which is characterized in that it is used for manufacturing the ultra-thin glass substrate as described above, and includes the following steps:

[0022] S110. Provide a glass mother material, on which n substrate regions and a skeleton region surrounding the substrate regions are preset, and n is greater than or equal to 2;

[0023] S120. Form etching protection layers on at least the upper and lower surfaces of the substrate regions of the glass mother material, and the etching protection layer includes a main body region and at least one thinning region extending along a preset bending path;

[0024] S130. Etch at least the skeleton region of the glass mother material, so that the substrate regions are separated from the glass mother material, form at least one bending stress dissipation groove along the preset bending path in the substrate regions through the thinning regions, and form stress dissipation edges at the edges of the substrate regions;

[0025] S140. Remove the etching protection layer to obtain an independent glass substrate with bending stress dissipation grooves;

[0026] S150. Set a polymer reinforcement layer in the bending stress dissipation grooves, and the polymer reinforcement layer is exposed on the upper surface of the glass substrate and is flush with the upper surface of the glass substrate.

[0027] Preferably, in the step S150, the polymer reinforcement layer is added to the bending stress dissipation groove by coating or printing.

[0028] Preferably, the components of the polymer reinforcement layer include liquid optical adhesive, acrylic, silicon-containing organic polymer material, epoxy resin, fluororesin, polyamide, polyimide, polycarbonate, polyethylene terephthalate and polyethylene terephthalate-1,4-cyclohexanedimethyl terephthalate.

[0029] Preferably, the step S150 further includes the following steps:

[0030] Step S160, the glass substrate is provided with one side of the bending stress dissipation groove, the panel functional layer is connected to the glass substrate through the polymer reinforcement layer, and the polymer reinforcement layer is cured by exposure or heating. The panel functional layer includes one or a combination of a TFT backplane, an organic light-emitting layer, a touch detection layer, a fingerprint recognition layer, and a cover plate.

[0031] Preferably, the substrate area matrix is ​​arranged on the glass mother material, and adjacent substrate areas are separated by the skeleton area. All skeleton areas in the glass mother material are eliminated by one etching, at least one bending stress dissipation groove is formed along a preset bending path in the substrate area, and a stress dissipation edge is formed at the edge of the substrate area.

[0032] Preferably, the thinned area is a strip-shaped area extending along a preset bending path.

[0033] Preferably, at least one narrow slit parallel to the preset bending path is provided in the thinned area, and a part of the substrate area is exposed in the narrow slit.

[0034] Preferably, the thickness of the thinned area of ​​the etch protection layer is smaller than the thickness of the main area of ​​the etch protection layer.

[0035] Preferably, the etching protection layer comprises an etching buffer layer for subtractive etching and an etching blocking layer for blocking etching which are arranged in the same layer, the etching buffer layer forms the thinning area, and the etching protection layer forms the main body area of ​​the etching protection layer.

[0036] An embodiment of the present invention further provides a display panel manufacturing method, including the ultra-thin glass substrate manufacturing method as described above.

[0037] The object of the present invention is to provide an ultra-thin glass substrate, a manufacturing method of the ultra-thin glass substrate and a panel manufacturing method, which can obtain a glass substrate from a glass base material, and at the same time, set a bending stress dissipation groove filled with a polymer reinforcing layer on the glass base material, enhance the bending performance of the panel on a preset bending path during the subsequent panel manufacturing process, save the time of the functional layer manufacturing process, and at the same time improve the anti-bending performance and anti-impact performance of the ultra-thin glass substrate, thus greatly improving the product quality of the ultra-thin glass substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Other features, objects and advantages of the present invention will become more apparent by reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings.

[0039] Figure 1 is a cross-sectional view of the first ultra-thin glass substrate of the present invention.

[0040] Figure 2 is a cross-sectional view of the second ultra-thin glass substrate of the present invention.

[0041] Figure 3 is a cross-sectional view of the second ultra-thin glass substrate in a curled state of the present invention.

[0042] Figure 4 is a cross-sectional view of the third ultra-thin glass substrate of the present invention.

[0043] Figure 5 is a cross-sectional view of the fourth ultra-thin glass substrate of the present invention.

[0044] Figure 6 is a cross-sectional view of the fifth ultra-thin glass substrate of the present invention.

[0045] Figure 7 is a flowchart of the manufacturing method of the ultra-thin glass substrate of the present invention.

[0046] Figures 8 to 16 is a schematic diagram of the first manufacturing process of the manufacturing method of the ultra-thin glass substrate of the present invention.

[0047] Figure 17 is a schematic diagram of the process of the second manufacturing process of the manufacturing method of the ultra-thin glass substrate of the present invention.

[0048] Figure 18 is a schematic diagram of the process of the third manufacturing process of the manufacturing method of the ultra-thin glass substrate of the present invention.

[0049] REFERENCE NUMERALS

[0050] 1 Glass base material

[0051] 11 Substrate area

[0052] 12 Frame area

[0053] 13 Stress dissipation edge

[0054] 14 Bending stress dissipation groove

[0055] 141 Bending stress dissipation groove

[0056] 142 Bending stress dissipation groove

[0057] 20 First etching protection layer

[0058] 21 Thinning area

[0059] 22 Main body area

[0060] 23 Functional layer

[0061] 24 Polymer reinforcement layer Detailed implementation manners

[0062] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in various forms and should not be construed as limited to the embodiments set forth herein. On the contrary, these embodiments are provided so that this invention will be thorough and complete, and will fully convey the concept of the example embodiments to those skilled in the art. Like reference numerals in the figures denote like or similar structures, and thus their repetitive description will be omitted.

[0063] Figure 1 is a cross-sectional view of the first ultra-thin glass substrate of the present invention. As Figure 1 shown, the ultra-thin glass substrate of the present invention includes: a glass substrate 30 and a polymer reinforcement layer 24. At least one bending stress dissipation groove 14 extending along a preset bending path is provided on the first side of the glass substrate 30, and a stress dissipation edge is formed at the edge of the substrate area. The polymer reinforcement layer 24 fills the bending stress dissipation groove 14, and the polymer reinforcement layer 24 is exposed on the upper surface of the glass substrate 30 and is flush with the upper surface of the glass substrate 30. The present invention uses the method of etching patterns in the bending area of the ultra-thin glass and filling with polymer materials, which can produce ultra-thin glass with excellent bending performance, impact resistance and stiffness, and can design ultra-thin glass that meets specific stiffness and bending performance according to requirements by changing the etching patterns.

[0064] In a preferred embodiment, the polymer material of the polymer reinforcement layer 24 has a light transmittance ≥ 90%, a refractive index range of 1.2 to 1.7, and an adhesion to the glass substrate 30 of 5B, so that the polymer reinforcement layer 24 can be firmly embedded in the bending stress dissipation groove 14 and remain flush with the upper surface of the glass substrate 30. At the same time, the polymer reinforcement layer 24 can also have the characteristics of light transmission, flexibility and non-shedding, but is not limited thereto.

[0065] In a preferred embodiment, the components of the polymer reinforcing layer include liquid optical adhesive, acrylic, silicon-containing organic polymer material, epoxy resin, fluororesin, polyamide, polyimide, polycarbonate, polyethylene terephthalate, and poly(1,4-cyclohexanedimethylene terephthalate), but are not limited thereto.

[0066] In a preferred embodiment, any one of the following in the bending stress dissipation groove 14:

[0067] Figure 2 is a cross-sectional view of the second ultra-thin glass substrate of the present invention. Refer to Figure 2 , a plurality of strip-shaped grooves parallel to the preset bending path;

[0068] a rectangular groove body extending along the preset bending path;

[0069] an elliptical groove body extending along the preset bending path, but not limited thereto.

[0070] In a preferred embodiment, the stress dissipation edge is a circular arc edge, a blade edge or a polygonal edge. The blade edge or the polygonal edge includes at least one hypotenuse or an arc-shaped hypotenuse. The angle range between the hypotenuse and the glass base material is (15°, 90°), and the thickness of the glass base material is 10um to 150um; the stress dissipation edge surrounds the edge of the substrate area, and the width of the stress dissipation edge is 5um to 300um, but not limited thereto.

[0071] In the present invention, a part of the material in the bending area of the ultra-thin glass substrate is etched away and filled with another polymer material, and the non-bending area retains a relatively thick glass body, so that the stiffness and impact resistance of most areas are relatively strong. This polymer material needs to meet certain mechanical properties and optical properties. Mechanical properties: It does not fall off within the working bending radius after being combined with the ultra-thin glass substrate, and the material itself does not yield or break within the working radius. Optical properties: Penetrability, refractive index close to that of glass, so that there are no optical problems after being combined with glass.

[0072] Figure 3 is a cross-sectional view of the second ultra-thin glass substrate in a curled state of the present invention. Refer to Figure 3, the perimeter (preset bending path) of the curled portion of the ultra-thin glass substrate is S, and S = π×R, where π is the pi and R is the arc radius of the curled portion of the ultra-thin glass substrate. Then the overall width of the plurality of parallel bending stress dissipation grooves 14 on the ultra-thin glass substrate is (S + 2W), and the preset bending path (width S) is located in the middle of the overall bending stress dissipation grooves 14. In actual use, both sides of the curled portion of the ultra-thin glass substrate will also be affected by bending. In the present invention, the more flexible bending stress dissipation grooves 14 extend from the preset bending path to both sides, and an extension portion (the width of each extension portion is W) extends from both sides of the preset bending path respectively. The bending stress dissipation grooves 14 are also provided in the extension portion, so that the bending stress dissipation grooves 14 can fully cover both sides of the curled portion of the ultra-thin glass substrate that will be affected by bending. The width W of the extension portion can be 2 to 5 times the thickness h of the ultra-thin glass substrate, but not limited thereto. In this embodiment, W = 3h (that is, the width W of the extension portion is equal to 3 times the thickness h of the ultra-thin glass substrate). In order to weaken the stress mutation between the bending region and the straight region of the ultra-thin glass substrate, thereby effectively enhancing the curling characteristics of the ultra-thin glass substrate, but not limited thereto.

[0073] In a variant, the distribution density of the bending stress dissipation grooves 14 decreases from high to low in the process from the bending region (preset bending path) to the straight region of the glass substrate 30, so that both the flexibility of the bending stress can be satisfied and the rigidity of the straight region portion of the glass substrate 30 can be maintained.

[0074] Figure 4 is a cross-sectional view of the third ultra-thin glass substrate of the present invention. In a preferred embodiment, refer to Figure 4 , the third ultra-thin glass substrate of the present invention further includes: a panel functional layer 23, which is disposed on the first side of the glass substrate 30 and is adhered to the glass substrate 30 by a polymer reinforcing layer 24. Since the panel functional layer 23 is adhered to the glass substrate 30 by the polymer reinforcing layer 24 embedded in the glass substrate 30. Therefore, there is no need to add an adhesive layer between the panel functional layer 23 and the glass substrate 30, further reducing the overall thickness of the ultra-thin glass substrate, but not limited thereto.

[0075] Figure 5 is a cross-sectional view of the fourth ultra-thin glass substrate of the present invention. In a preferred embodiment, as Figure 5As shown, the first side of the glass substrate 30 is also provided with a bending stress dissipation groove 141 filled with the polymer reinforcing layer 24. The second side of the glass substrate 30 is also provided with a bending stress dissipation groove 142 filled with the polymer reinforcing layer 24. And the first projection of the bending stress dissipation groove 141 on the first side of the glass substrate 30 is misaligned with the second projection of the bending stress dissipation groove 142 on the second side of the glass substrate 30, so that the glass substrate 30 exhibits better flexibility while being curled towards two different surfaces, and through the misalignment between the bending stress dissipation groove 141 and the bending stress dissipation groove 142, the weakening of the rigidity of the ultra-thin glass substrate caused by setting more bending stress dissipation grooves is avoided, but not limited thereto.

[0076] Figure 6 is a cross-sectional view of the fifth ultra-thin glass substrate of the present invention. In a preferred embodiment, as Figure 5 shown, the first side of the glass substrate 30 is also provided with a bending stress dissipation groove 141 filled with the polymer reinforcing layer 24. The panel functional layer 23 is disposed on the first side of the glass substrate 30 and is adhered to the first side of the glass substrate 30 by the polymer reinforcing layer 24. The second side of the glass substrate 30 is also provided with a bending stress dissipation groove 142 filled with the polymer reinforcing layer 24. The panel functional layer 23 is disposed on the second side of the glass substrate 30 and is adhered to the second side of the glass substrate 30 by the polymer reinforcing layer 24, but not limited thereto.

[0077] Figure 7 is a flowchart of the manufacturing method of the ultra-thin glass substrate of the present invention. As Figure 7 shown, the manufacturing method of the ultra-thin glass substrate of the present invention for manufacturing the ultra-thin glass substrate as claimed in claim 1 includes the following steps:

[0078] S110. Provide a glass mother material 1, and preset n substrate regions 11 and a skeleton region 12 surrounding the substrate regions 11 on the glass mother material 1, where n is greater than or equal to 2.

[0079] S120. Form etching protection layers on at least the upper and lower surfaces of the substrate regions 11 of the glass mother material. The etching protection layers include a main region and at least one thinning region extending along a preset bending path.

[0080] S130. Etch at least the skeleton region 12 of the glass mother material 1 to separate the substrate regions 11 from the glass mother material 1, form at least one bending stress dissipation groove 14 in the substrate regions 11 along the preset bending path through the thinning region, and form a stress dissipation edge 13 at the edge of the substrate regions 11.

[0081] S140. Remove the etching protection layers to obtain an independent glass substrate 3014 with bending stress dissipation grooves 14.

[0082] S150. A polymer reinforcement layer is provided in the bending stress dissipation groove 14, and the polymer reinforcement layer 24 is exposed on the upper surface of the glass substrate 30 and flush with the upper surface of the glass substrate 30.

[0083] In a preferred embodiment, the polymer reinforcement layer is added to the bending stress dissipation groove 14 by coating or spraying, but not limited thereto.

[0084] In a preferred embodiment, the components of the polymer reinforcement layer include liquid optical adhesive, acrylic, silicon-containing organic polymer material, epoxy resin, fluororesin, polyamide, polyimide, polycarbonate, polyethylene terephthalate, and poly(1,4-cyclohexanedimethylene terephthalate), but not limited thereto.

[0085] In a preferred embodiment, after step S150, the following steps are further included:

[0086] Step S160. On one side of the glass substrate 30 where the bending stress dissipation groove 14 is provided, the panel functional layer 23 is adhered to the glass substrate 30 through the polymer reinforcement layer, and then the polymer reinforcement layer is cured by exposure or heating. The panel functional layer 23 includes one or a combination of a TFT backplane, an organic light-emitting layer, a touch detection layer, a fingerprint recognition layer, and a cover plate, but not limited thereto.

[0087] In a preferred embodiment, the substrate regions 11 are arranged in a matrix on the glass base material 1, and the adjacent substrate regions 11 are separated by a framework region 12. By one etching, all the framework regions 12 in the glass base material 1 are eliminated, at least one bending stress dissipation groove 14 is formed in the substrate region 11 along a preset bending path, and a stress dissipation edge 13 is formed at the edge of the substrate region 11, but not limited thereto.

[0088] Figures 8 to 16 is a schematic diagram of the first manufacturing process of the ultra-thin glass substrate manufacturing method of the present invention. As Figures 8 to 16 shown, the first manufacturing process of the ultra-thin glass substrate manufacturing method of the present invention is as follows:

[0089] Refer to Figure 8 , first, a glass base material 1 is provided, the thickness of the glass base material 1 is 10 um to 150 um, and the substrate regions 11 are arranged in a matrix on the glass base material 1, and the adjacent substrate regions 11 are separated by a framework region 12.

[0090] Refer to Figure 9 , 10, n substrate regions 11 and a frame region 12 surrounding the substrate regions 11 are preset on the glass base material 1, where n is greater than or equal to 2. Etching protection layers 20 are respectively formed on the upper and lower surfaces of the substrate regions 11 of the glass base material. The etching protection layers 20 only cover the upper and lower surfaces of the substrate regions 11, and the upper and lower surfaces of the frame region 12 are exposed outside the etching protection layers 20, so that the upper and lower surfaces of the frame region 12 can be etched simultaneously in subsequent etching, and it is easy to form a stress dissipation edge 13 with multiple stress dissipation surfaces. The substrate regions 11 are arranged in a matrix on the glass base material 1, and there is a frame region 12 separating adjacent substrate regions 11. The etching protection layer 20 includes a main region 22 and at least one thinning region 21 extending along a preset bending path. In this embodiment, the thinning region 21 is a strip-shaped region extending along a preset bending path. At least one narrow slit parallel to the preset bending path is provided in the thinning region 21, and a partial substrate region 11 is exposed in the narrow slit, so that at least one bending stress dissipation groove 14 can be formed along the preset bending path in the substrate region 11 during the etching process.

[0091] Reference Figure 11 , 12 , 13, 14, etch the frame region 12 of the glass base material 1 to separate the substrate region 11 from the glass base material 1. At least one bending stress dissipation groove 14 is formed along the preset bending path in the substrate region 11 through the thinning region, and a stress dissipation edge 13 is formed at the edge of the substrate region 11. The etching buffer layer in the present invention cannot completely block the etching of the substrate region 11 below it during the etching process, but only weakens the etching of the substrate region 11 below it, so that shallow grooves extending along the preset bending path are left in the substrate region 11 corresponding to the thinning region (as a comparison, the substrate region 11 covered by the etching blocking layer is not etched at all). These shallow grooves can disperse the bending stress when the panel is bent and are used as bending stress dissipation grooves. In this embodiment, through the first etching process, all the frame regions 12 in the glass base material 1 are eliminated, and the substrate regions 11 protected by the etching protection layers 20 are left. The stress dissipation edge 13 is a blade edge. The stress dissipation edge 13 surrounds the edge of the substrate region 11, and the width of the stress dissipation edge 13 is 5um to 300um. In this embodiment, through one etching, all the frame regions 12 in the glass base material 1 are eliminated, at least one bending stress dissipation groove is formed along the preset bending path in the substrate region 11, and a stress dissipation edge 13 is formed at the edge of the substrate region 11, that is, three etching effects are achieved simultaneously during one etching process. In this embodiment, symmetric bending stress dissipation grooves 14 are formed on both sides of the substrate region 11 to disperse the stress in two bending directions respectively. In a variant, the bending stress dissipation groove 14 can also be provided only on one side of the substrate region 11 to disperse the stress in only one bending direction.

[0092] See Figure 15, the etching protection layer is removed to obtain an independent glass substrate 30 with bending stress dissipation grooves.

[0093] Refer to Figure 16 , the etching protection layer is removed to obtain an independent glass substrate with bending stress dissipation grooves. A polymer reinforcing layer is provided in the bending stress dissipation grooves 14, and the polymer reinforcing layer 24 is exposed on the upper surface of the glass substrate 30 and flush with the upper surface of the glass substrate 30. The polymer reinforcing layer is added to the bending stress dissipation grooves 14 by coating or spraying, but not limited thereto. The components of the polymer reinforcing layer 24 include liquid optical glue, acrylic, silicon-containing organic polymer materials, epoxy resin, fluororesin, polyamide, polyimide, polycarbonate, polyethylene terephthalate, and poly(1,4-cyclohexanedimethylene terephthalate), but not limited thereto.

[0094] Figure 17 is a process schematic diagram of the second process of the ultra-thin glass substrate manufacturing method of the present invention. As Figure 17 shown, the ultra-thin glass substrate manufacturing method of the present invention can also be based on the process of Figures 8 to 16 . By setting multiple preset bending paths on both sides of the ultra-thin glass substrate, multiple bending stress dissipation grooves 14 are distributed on both surfaces of the glass substrate 30, and the polymer reinforcing layer 24 is filled in the bending stress dissipation grooves 14 on both surfaces of the glass substrate 30. So that the second process can provide better flexibility when the glass substrate 30 is bent at any position.

[0095] Figure 18 is a process schematic diagram of the third process of the ultra-thin glass substrate manufacturing method of the present invention. As Figure 18 shown, the ultra-thin glass substrate manufacturing method of the present invention can also be based on the process of Figures 8 to 17 . The panel functional layer 23 is adhered by the polymer reinforcing layer 24 in the bending stress dissipation grooves 14 on both sides of the glass substrate 30. Since the panel functional layer 23 is adhered to the glass substrate 30 by being embedded in the polymer reinforcing layer 24 of the glass substrate 30. Therefore, there is no need to add an adhesive layer between the panel functional layer 23 and the glass substrate 30, further reducing the overall thickness of the ultra-thin glass substrate with the panel functional layer 23, but not limited thereto.

[0096] So that the third process can enhance the overall flexibility of the glass substrate when the glass substrate is bent and restored, thereby improving the anti-fragmentation property of the glass substrate; at the same time, the use of the bending stress dissipation grooves 14 formed in the glass substrate improves the bending performance of the panel on the preset bending path during the subsequent panel manufacturing process, thus greatly saving the time of the functional layer manufacturing process and improving the product quality of the ultra-thin glass substrate.

[0097] In summary, the object of the present invention is to provide an ultra-thin glass substrate, a manufacturing method of the ultra-thin glass substrate, and a panel manufacturing method, which can obtain a glass substrate from a glass base material, and at the same time, provide a bending stress dissipation groove filled with a polymer reinforcing layer on the glass base material, enhance the bending performance of the panel along a preset bending path during the subsequent panel manufacturing process, save the time for the functional layer manufacturing process, and at the same time improve the anti-bending performance and anti-impact performance of the ultra-thin glass substrate, thereby greatly improving the product quality of the ultra-thin glass substrate.

[0098] The above content is a further detailed description of the present invention in combination with specific preferred embodiments, and it cannot be determined that the specific implementation of the present invention is only limited to these descriptions. For those of ordinary skill in the technical field to which the present invention pertains, without departing from the concept of the present invention, several simple deductions or substitutions can still be made, and all should be regarded as belonging to the protection scope of the present invention.

Claims

1. An ultra-thin glass substrate, characterized in that, Comprising: A glass substrate (30), on the first side of which there is at least one bending stress dissipation groove extending along a preset bending path, and a stress dissipation edge is formed at the edge of the substrate area; And A polymer reinforcement layer (24), the polymer reinforcement layer (24) fills the bending stress dissipation groove, the polymer reinforcement layer (24) is exposed on the upper surface of the glass substrate (30) and is flush with the upper surface of the glass substrate (30), and the second side of the glass substrate (30) is also provided with the bending stress dissipation groove filled with the polymer reinforcement layer (24); and the bending stress dissipation groove on the first side is misaligned with the bending stress dissipation groove on the second side based on the second projection of the glass substrate (30) with respect to the first projection of the glass substrate (30). The polymer material of the polymer reinforcement layer has a light transmittance ≥ 90%, a refractive index range of 1.2 to 1.7, and an adhesion to the glass substrate (30) of 5B.

2. The ultra-thin glass substrate according to claim 1, wherein The bending stress dissipation groove is any one of the following: A plurality of strip-shaped grooves all parallel to the preset bending path; A rectangular groove body extending along the preset bending path; An elliptical groove body extending along the preset bending path.

3. The ultra-thin glass substrate according to claim 1, characterized in that, Further comprising: A panel functional layer (23), the panel functional layer (23) is disposed on the first side of the glass substrate (30) and is adhered to the glass substrate (30) by the polymer reinforcement layer (24).

4. A manufacturing method for an ultra-thin glass substrate, characterized in that, For manufacturing the ultra-thin glass substrate as described in claim 1, comprising the following steps: S110. Provide a glass mother material (1), on which n substrate areas (11) and a frame area (12) surrounding the substrate areas (11) are preset, where n is greater than or equal to 2; S120. Form etching protection layers on at least the upper and lower surfaces of the substrate area (11) of the glass mother material, and the etching protection layer includes a main area and at least one thinning area extending along a preset bending path; S130. Etch at least the frame area (12) of the glass mother material (1) to separate the substrate area (11) from the glass mother material (1), and form at least one bending stress dissipation groove along the preset bending path in the substrate area (11) through the thinning area, and form a stress dissipation edge (13) at the edge of the substrate area (11); S140. Remove the etching protection layer to obtain the independent glass substrate (30) with bending stress dissipation grooves. S150, a polymer reinforcing layer is arranged in the bending stress dissipation groove, the polymer reinforcing layer (24) is exposed on the upper surface of the glass substrate (30) and is flush with the upper surface of the glass substrate (30), and the second side of the glass substrate (30) is also provided with the bending stress dissipation groove filled with the polymer reinforcing layer (24); and the bending stress dissipation groove on the first side is offset from the bending stress dissipation groove on the second side based on the first projection of the glass substrate (30) and the bending stress dissipation groove on the second side is offset from the bending stress dissipation groove on the second side based on the second projection of the glass substrate (30), the polymer material of the polymer reinforcing layer has a light transmittance of ≥90%, a refractive index range of 1.2 to 1.7, and an adhesion to the glass substrate (30) of 5B.

5. The method for manufacturing an ultra-thin glass substrate according to claim 4, wherein In the step S150, the polymer reinforcement layer is added into the bending stress dissipation groove by coating or printing.

6. The method for manufacturing an ultra-thin glass substrate according to claim 4, wherein The step S150 further includes the following steps: Step S160: the glass substrate (30) is provided with one side of the bending stress dissipation groove, the panel functional layer (23) is bonded to the glass substrate (30) via the polymer reinforcement layer, and the polymer reinforcement layer is then cured by exposure or heating, wherein the panel functional layer (23) includes one or a combination of a TFT backplane, an organic light-emitting layer, a touch detection layer, a fingerprint recognition layer, and a cover plate.

7. The method for manufacturing an ultra-thin glass substrate according to claim 4, wherein The substrate regions (11) are arranged in a matrix on the glass mother material (1), and adjacent substrate regions (11) are separated by the skeleton regions (12). All the skeleton regions (12) in the glass mother material (1) are eliminated by one etching, and at least one bending stress dissipation groove is formed along a preset bending path in the substrate region (11), and a stress dissipation edge (13) is formed at the edge of the substrate region (11).

8. A method for manufacturing a display panel, characterized in that, The method comprises a process for manufacturing an ultra-thin glass substrate as claimed in any one of claims 4 to 7.

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