Processing control method, device and storage medium based on ultra-thin glass laser cutting

Abstract

This application discloses a processing control method, device, and storage medium based on ultra-thin glass laser cutting, relating to the field of cutting technology. A specific implementation scheme comprises: acquiring a first image of a workpiece to be cut a second time, captured by an image acquisition device; detecting the first image to determine the coordinates of the first cutting reference points of each of the multiple cutting reference points in the workpiece to be cut a second time on a machine tool; acquiring first drawing data; and controlling the cutting device to cut the workpiece to be cut a second time according to the first cutting dimension data based on the coordinates of the first cutting reference points of each of the multiple cutting reference points. This application improves the accuracy of the secondary cutting and enhances cutting efficiency.

Description

Technical Field

[0001] The present application relates to the field of laser cutting technology, and in particular to a processing control method, device and storage medium based on ultra-thin glass laser cutting. Background Art

[0002] The ultra-thin glass UTG laser cutting industry is increasingly demanding in terms of cutting efficiency and automation. However, depending on the process flow, some workpieces require secondary processing to achieve the desired cutting effect. To achieve the desired cutting effect, this is usually achieved only by changing the process flow or manually positioning the machine. This means that the process flow sequence must be changed or the machine tool must be manually moved to the positioning area and visually confirmed. This process not only poses safety risks but also reduces cutting accuracy, affecting processing efficiency. Summary of the Invention

[0003] The present application provides a processing control method, device and storage medium based on ultra-thin glass laser cutting.

[0004] According to a first aspect of the present application, a processing control method based on ultra-thin glass laser cutting is provided, wherein the method is applied to a UTG laser cutting system, wherein the system includes a machine tool, a cutting device, and an image acquisition device; the method includes:

[0005] Acquire a first image of the workpiece to be cut twice captured by the image acquisition device; wherein the first image is an image captured by the image acquisition device when the workpiece to be cut twice is placed on the machine tool;

[0006] Detecting the first image to determine the coordinates of first cutting reference points of each of the plurality of cutting reference points in the workpiece to be cut a second time on the machine tool;

[0007] Acquire first drawing data; wherein the first drawing data includes a first cutting size;

[0008] Based on the first cutting reference point coordinates of each of the multiple cutting reference points and in accordance with the first cutting size data, the cutting device is controlled to cut the workpiece to be cut a second time.

[0009] According to one embodiment of the present application, the method further includes:

[0010] Acquiring a second image captured by the image acquisition device; the second image is an image of the workpiece placed on the machine tool after the first cutting;

[0011] Detecting the second image to determine position information of a target cutting frame on the machine tool; wherein the target cutting frame is a cutting area obtained after the workpiece is cut for the first time;

[0012] Determining position information of each of a plurality of boundary points within the target cutting frame according to position information of the target cutting frame on the machine tool;

[0013] Calculating the coordinates of the second cutting reference points corresponding to each of the plurality of boundary points based on the position information of each of the plurality of boundary points and the preset secondary cutting process requirements;

[0014] According to the coordinates of the second cutting reference points corresponding to the plurality of boundary points, the cutting device is controlled to cut the workpiece to be cut a second time, so that the plurality of cutting reference points exist on the workpiece to be cut a second time.

[0015] According to one embodiment of the present application, the first drawing data further includes relative position information of the plurality of cutting reference points and the target cutting frame, and based on the first cutting reference point coordinates of each of the plurality of cutting reference points and in accordance with the first cutting size data, controlling the cutting device to cut the workpiece to be cut again includes:

[0016] acquiring the relative position information according to the first drawing data;

[0017] Determining a cutting position of the workpiece to be cut twice according to the relative position information and the coordinates of the first cutting reference points of each of the plurality of cutting reference points;

[0018] According to the cutting position, the cutting device is controlled to cut the workpiece to be cut a second time.

[0019] According to an embodiment of the present application, after acquiring the relative position information according to the first drawing data, the method further includes:

[0020] determining a first size of an area formed by the plurality of cutting reference points in the first drawing data based on the relative position information;

[0021] determining a second size of an area formed by the plurality of cutting reference points in the workpiece to be cut again based on the first cutting reference point coordinates of each of the plurality of cutting reference points;

[0022] performing a ratio comparison on the first size and the second size to obtain a comparison result;

[0023] In response to the ratio result not meeting a preset requirement, the first drawing data is adjusted so that the first size data and the second size data have the same ratio.

[0024] According to one embodiment of the present application, controlling the cutting device to cut the workpiece to be cut again according to the first cutting size data based on the coordinates of the first cutting reference points of each of the multiple cutting reference points includes:

[0025] Comparing the coordinates of the second cutting reference points corresponding to each of the plurality of boundary points with the coordinates of the first cutting reference points corresponding to each of the plurality of cutting reference points to determine the inclination angle of the cutting frame;

[0026] adjusting the cutting direction of the cutting device according to the tilt angle;

[0027] Based on the cutting direction and the coordinates of the first cutting reference points of each of the plurality of cutting reference points, the cutting device is controlled to cut the workpiece to be cut a second time.

[0028] According to one embodiment of the present application, detecting the second image to determine the position information of the target cutting frame on the machine tool includes:

[0029] identifying the target cutting frame in the second image;

[0030] In response to identifying the target cutting frame, position information of the image acquisition device on the machine tool is determined to determine first position information of the target cutting frame on the machine tool.

[0031] According to one embodiment of the present application, in response to identifying the target cutting frame, determining the position information of the image acquisition device on the machine tool includes:

[0032] In response to identifying a sideline of the target cutting frame, determining a deviation value between the sideline and a centerline of the second image;

[0033] Adjusting the position of the image acquisition device based on the deviation value until the sideline coincides with the centerline in the acquired second image;

[0034] Determine the position information of the edge line according to the current position information of the image acquisition device on the machine tool;

[0035] In response to determining the position information of all edges of the target cutting frame, the position information of the target cutting frame on the machine tool is obtained.

[0036] According to a second aspect of the present application, a processing control device based on ultra-thin glass laser cutting is provided, wherein the device is applied to a UTG laser cutting system, wherein the system includes a machine tool, a cutting device, and an image acquisition device; the device includes:

[0037] A first acquisition module is configured to acquire a first image of the workpiece to be cut twice, which is acquired by the image acquisition device; wherein the first image is an image captured by the image acquisition device when the workpiece to be cut twice is placed on the machine tool;

[0038] a first determining module, configured to detect the first image and determine the coordinates of first cutting reference points of each of the plurality of cutting reference points in the workpiece to be cut a second time on the machine tool;

[0039] A second acquisition module is configured to acquire first drawing data; wherein the first drawing data includes a first cutting size;

[0040] A control module is used to control the cutting device to cut the workpiece to be cut twice according to the first cutting size data based on the first cutting reference point coordinates of each of the multiple cutting reference points.

[0041] According to one embodiment of the present application, the device further includes:

[0042] a second acquisition module, configured to acquire a second image acquired by the image acquisition device; the second image being an image of the workpiece placed on the machine tool after the first cutting;

[0043] a second determining module, configured to detect the second image and determine position information of a target cutting frame on the machine tool; wherein the target cutting frame is a cutting area obtained after the workpiece is cut for the first time;

[0044] a third determining module, configured to determine position information of respective boundary points within the target cutting frame according to position information of the target cutting frame on the machine tool;

[0045] a calculation module, configured to calculate the coordinates of the second cutting reference points corresponding to each of the plurality of boundary points based on the position information of each of the plurality of boundary points and a preset secondary cutting process requirement;

[0046] The control module is used to control the cutting device to cut the workpiece to be cut twice according to the coordinates of the second cutting reference points corresponding to the multiple boundary points, so that the multiple cutting reference points exist on the workpiece to be cut twice.

[0047] According to one embodiment of the present application, the first drawing data further includes relative position information of the plurality of cutting reference points and the target cutting frame, and the control module includes:

[0048] A first acquisition submodule, configured to acquire the relative position information according to the first drawing data;

[0049] A first determining submodule is configured to determine a cutting position of the workpiece to be cut twice based on the relative position information and the coordinates of the first cutting reference points of each of the plurality of cutting reference points;

[0050] The first control submodule is used to control the cutting device to cut the workpiece to be cut a second time according to the cutting position.

[0051] According to one embodiment of the present application, the first acquisition submodule is specifically configured to:

[0052] determining a first size of an area formed by the plurality of cutting reference points in the first drawing data based on the relative position information;

[0053] determining a second size of an area formed by the plurality of cutting reference points in the workpiece to be cut again based on the first cutting reference point coordinates of each of the plurality of cutting reference points;

[0054] performing a ratio comparison on the first size and the second size to obtain a comparison result;

[0055] In response to the ratio result not meeting a preset requirement, the first drawing data is adjusted so that the first size data and the second size data have the same ratio.

[0056] According to one embodiment of the present application, the control module includes:

[0057] a second determining submodule, configured to compare the coordinates of the second cutting reference points corresponding to the plurality of boundary points with the coordinates of the first cutting reference points corresponding to the plurality of cutting reference points, to determine the inclination angle of the cutting frame;

[0058] an adjusting submodule, configured to adjust the cutting direction of the cutting device according to the tilt angle;

[0059] The second control submodule is used to control the cutting device to cut the workpiece to be cut twice based on the cutting direction and the coordinates of the first cutting reference points of each of the multiple cutting reference points.

[0060] According to one embodiment of the present application, the second determining module includes:

[0061] a recognition submodule, configured to recognize the target cutting frame in the second image;

[0062] The third determining submodule is configured to determine position information of the image acquisition device on the machine tool in response to identifying the target cutting frame, so as to determine first position information of the target cutting frame on the machine tool.

[0063] According to one embodiment of the present application, the third determining submodule is specifically configured to:

[0064] In response to identifying a sideline of the target cutting frame, determining a deviation value between the sideline and a centerline of the second image;

[0065] Adjusting the position of the image acquisition device based on the deviation value until the sideline coincides with the centerline in the acquired second image;

[0066] Determine the position information of the edge line according to the current position information of the image acquisition device on the machine tool;

[0067] In response to determining the position information of all edges of the target cutting frame, the position information of the target cutting frame on the machine tool is obtained.

[0068] According to a third aspect of the present application, an electronic device is provided, including:

[0069] at least one processor; and

[0070] a memory communicatively connected to the at least one processor; wherein,

[0071] The memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to perform any one of the methods according to the first aspect.

[0072] According to a fourth aspect of the present application, a non-transitory computer-readable storage medium storing computer instructions is provided, wherein the computer instructions are used to enable the computer to execute any one of the methods according to the first aspect.

[0073] According to a fifth aspect of the present application, a computer program product is provided, comprising a computer program, which, when executed by a processor, implements the steps of the processing control method based on ultra-thin glass laser cutting as described in the first aspect.

[0074] According to the technical solution of the present application, an image of the workpiece to be cut is obtained through an image acquisition device to determine the position of the workpiece to be cut, so that the target cutting position of the workpiece can be accurately located, thereby improving the accuracy of workpiece cutting and effectively improving cutting efficiency.

[0075] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present application, nor is it intended to limit the scope of the present application. Other features of the present application will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0076] The accompanying drawings are provided to facilitate a better understanding of the present invention and do not constitute a limitation of the present application.

[0077] Figure 1 is a schematic diagram according to the first embodiment of the present application;

[0078] Figure 2 is a schematic diagram according to the second embodiment of the present application;

[0079] Figure 3 is a schematic diagram according to the third embodiment of the present application;

[0080] Figure 4 is a schematic diagram according to a fourth embodiment of the present application;

[0081] Figure 5 is a schematic diagram according to a fifth embodiment of the present application;

[0082] Figure 6 is a schematic diagram according to a sixth embodiment of the present application;

[0083] Figure 7 is a schematic diagram according to a seventh embodiment of the present application;

[0084] Figure 8 is a schematic diagram according to an eighth embodiment of the present application;

[0085] Figure 9 is a schematic diagram according to a ninth embodiment of the present application;

[0086] Figure 10 is a schematic diagram according to the tenth embodiment of the present application;

[0087] Figure 11 is a schematic diagram according to the eleventh embodiment of the present application;

[0088] Figure 12 is a schematic diagram according to the twelfth embodiment of the present application;

[0089] Figure 13 This is a block diagram of an electronic device used to implement the processing control method based on ultra-thin glass laser cutting according to an embodiment of the present application. DETAILED DESCRIPTION

[0090] The following description of exemplary embodiments of the present application is made in conjunction with the accompanying drawings, including various details of the embodiments of the present application to facilitate understanding. These details should be considered as merely exemplary. Therefore, those skilled in the art will recognize that various changes and modifications may be made to the embodiments described herein without departing from the scope and spirit of the present application. Similarly, for the sake of clarity and conciseness, descriptions of well-known functions and structures are omitted in the following description.

[0091] It should be noted that the ultra-thin glass UTG laser cutting industry is increasingly demanding in terms of cutting efficiency and automation. However, depending on the process flow, some workpieces require secondary processing to achieve the desired cutting effect. To achieve the desired cutting effect, this is usually achieved only by changing the process flow or manually positioning the workpiece. This means that the process flow sequence must be changed or the machine tool must be manually moved to the positioning area and the position must be confirmed by eye. This process not only poses safety risks but also reduces cutting accuracy, affecting processing efficiency.

[0092] Based on the above problems, this application proposes a processing control method, device and storage medium based on ultra-thin glass laser cutting. The image of the workpiece to be cut is obtained through an image acquisition device to determine the position of the workpiece to be cut, so that the target cutting position of the workpiece can be accurately located, thereby improving the accuracy of workpiece cutting and effectively improving the cutting efficiency.

[0093] Figure 1 It is a schematic diagram according to the first embodiment of the present application. It should be noted that the processing control method based on ultra-thin glass laser cutting in the embodiment of the present application can be used for the processing control device based on ultra-thin glass laser cutting in the embodiment of the present application, and the device can be configured in an electronic device. Figure 1 As shown, the processing control method based on ultra-thin glass laser cutting includes the following steps:

[0094] Step 101: Acquire a first image of a workpiece to be cut twice, which is captured by an image capture device.

[0095] In the embodiment of the present application, the first image is an image captured by an image acquisition device when the workpiece to be cut is placed on a machine tool. The above method can be applied to a UTG laser cutting system, which includes a machine tool, a cutting device, and an image acquisition device.

[0096] It should be noted that the image acquisition device may be a camera. The workpiece to be cut a second time may be a workpiece obtained after a first cut. The cutting equipment may be a laser cutting equipment.

[0097] As a possible example, a first image is obtained by taking a picture of the workpiece to be cut twice by a camera.

[0098] Step 102 : Detect the first image and determine the coordinates of the first cutting reference points of each of the plurality of cutting reference points in the workpiece to be cut a second time on the machine tool.

[0099] As a possible example, the first image is detected to determine whether there are cutting reference points on the workpiece to be cut a second time in the first image. In response to the existence of cutting reference points in the first image, the coordinates of the first cutting reference points of each of the multiple cutting reference points on the machine tool are determined.

[0100] Step 103: Acquire first drawing data.

[0101] In this embodiment of the present application, the first drawing data includes a first cutting size.

[0102] It is understandable that the first drawing data may be data obtained from the acquired first drawing, and the first drawing may be a CAD drawing or other electronic drawing, which is not limited in this embodiment.

[0103] As a possible example, the first cutting size in the first drawing data may be a cutting size for cutting the workpiece to be cut twice.

[0104] Step 104 : Based on the first cutting reference point coordinates of each of the plurality of cutting reference points and in accordance with the first cutting size data, control the cutting device to cut the workpiece to be cut for the second time.

[0105] As a possible example, the workpiece to be cut a second time may be a polymer material film. After the workpiece to be cut a second time is cut for the first time, the cutting frame formed by the first cutting will be glued into the UTG ultra-thin glass. The glue will block the cutting frame, so the position of the cutting frame cannot be obtained through the image acquisition device, and the cutting frame cannot be positioned. Therefore, the cutting frame needs to be positioned through the cutting reference point.

[0106] As a possible example, the UTG laser cutting system determines the cutting position based on the first cutting reference point coordinates and first cutting size data of each of the multiple cutting reference points, and controls the cutting equipment to cut the workpiece to be cut for the second time.

[0107] According to the processing control method based on ultra-thin glass laser cutting of the embodiment of the present application, a first image of the workpiece to be cut for the second time captured by the image acquisition device is obtained, the first image is detected, the first cutting reference point coordinates of each of the multiple cutting reference points in the workpiece to be cut for the second time on the machine tool are determined, the first drawing data is obtained, and based on the first cutting reference point coordinates of each of the multiple cutting reference points, the cutting equipment is controlled to cut the workpiece to be cut for the second time according to the first cutting size data, so that the target cutting position of the workpiece to be cut for the second time can be accurately located, thereby improving the accuracy of the secondary cutting and improving the cutting efficiency.

[0108] In order to ensure that the position of the target cutting frame is marked and the cutting reference point can be identified during secondary cutting, optionally, the coordinates of the second cutting reference points corresponding to multiple boundary points are calculated, and the cutting equipment is controlled to cut the workpiece to be cut for the second time so that there are multiple cutting reference points on the workpiece to be cut for the second time. Figure 2According to the schematic diagram of the second embodiment of the present application. It should be noted that the processing control method based on ultra-thin glass laser cutting in the embodiment of the present application can be executed by the processing control device based on ultra-thin glass laser cutting in the embodiment of the present application. In some embodiments of the present application, such as Figure 2 As shown, the processing control method based on ultra-thin glass laser cutting includes:

[0109] Step 201: Acquire a second image captured by an image capture device.

[0110] In this embodiment of the present application, the second image is an image of the workpiece placed on the machine tool after the first cutting.

[0111] As a possible example, the UTG laser cutting system controls the cutting device to cut the workpiece once to obtain a target cutting frame, and then controls the image acquisition device to acquire a second image of the workpiece.

[0112] Step 202: Detect the second image to determine the position information of the target cutting frame on the machine tool.

[0113] In this embodiment of the present application, the target cutting frame is the cutting area obtained after the workpiece is cut for the first time.

[0114] It can be understood that the target cutting frame can be a cutting area obtained after the UTG laser cutting system controls the cutting device to perform the first cutting on the workpiece according to the preset size.

[0115] As a possible example, the target cutting frame in the second image is detected, and in response to the detection of the target cutting frame, position information of the target cutting frame on the machine tool is determined.

[0116] Step 203 : determining the position information of each of the plurality of boundary points in the target cutting frame according to the position information of the target cutting frame on the machine tool.

[0117] As a possible example, the position information of the target cutting frame on the machine tool may be the coordinates of the target cutting frame on the machine tool, and the coordinates of each of the plurality of boundary points in the target cutting frame may be obtained according to the coordinates.

[0118] Step 204 : Calculate the coordinates of the second cutting reference points corresponding to the plurality of boundary points based on the position information of the plurality of boundary points and the preset secondary cutting process requirements.

[0119] It should be noted that the preset secondary cutting process requirement may be the relative position relationship between a plurality of boundary points and the coordinates of the second cutting reference points corresponding thereto, and the preset secondary cutting process requirement may be set according to actual conditions.

[0120] As a possible example, based on the position information of each of the multiple boundary points and the relative positional relationship between the multiple boundary points and the corresponding second cutting reference point coordinates, the second cutting reference point coordinates corresponding to each of the multiple boundary points are calculated.

[0121] Step 205 : Controlling the cutting device to cut the workpiece to be cut twice according to the coordinates of the second cutting reference points corresponding to the plurality of boundary points, so that there are a plurality of cutting reference points on the workpiece to be cut twice.

[0122] As a possible example, the UTG laser cutting system controls the cutting device to cut the workpiece to be cut secondarily according to the coordinates of the second cutting reference points corresponding to the multiple boundary points, thereby cutting out multiple cutting reference points on the workpiece to be cut secondarily.

[0123] Step 206 : Acquire a first image of the workpiece to be cut twice, which is captured by an image capture device.

[0124] The first image is an image captured by an image acquisition device when the workpiece to be cut for the second time is placed on a machine tool.

[0125] In the embodiment of the present application, step 206 can be implemented in any of the ways in the embodiments of the present application. The embodiment of the present application does not limit this and will not be described in detail.

[0126] Step 207 : Detect the first image and determine the coordinates of the first cutting reference points of each of the plurality of cutting reference points in the workpiece to be cut a second time on the machine tool.

[0127] In the embodiment of the present application, step 207 can be implemented in any of the ways in the embodiments of the present application. The embodiment of the present application does not limit this and will not be described in detail.

[0128] Step 208: Acquire first drawing data; wherein the first drawing data includes a first cutting size.

[0129] As a possible example, the size of the target cutting frame is larger than the first cutting size.

[0130] Step 209 : Based on the first cutting reference point coordinates of each of the plurality of cutting reference points and in accordance with the first cutting size data, control the cutting device to cut the workpiece to be cut for the second time.

[0131] In the embodiment of the present application, step 209 can be implemented in any of the ways in the embodiments of the present application. The embodiment of the present application does not limit this and will not be described in detail.

[0132] According to the processing control method based on ultra-thin glass laser cutting of the embodiment of the present application, a second image captured by the image acquisition device is obtained, the second image is detected, and the position information of the target cutting frame on the machine tool is determined. According to the position information of the target cutting frame on the machine tool, the position information of each of the multiple boundary points in the target cutting frame is determined. Based on the position information of each of the multiple boundary points and the preset secondary cutting process requirements, the coordinates of the second cutting reference points corresponding to each of the multiple boundary points are calculated. According to the coordinates of the second cutting reference points corresponding to each of the multiple boundary points, the cutting equipment is controlled to cut the workpiece to be cut for the secondary cutting, so that there are multiple cutting reference points on the workpiece to be cut for the secondary cutting, thereby marking the position of the target cutting frame, and realizing that the cutting reference points can be identified during the secondary cutting, thereby realizing the positioning of the cutting reference points.

[0133] In order to ensure that the accurate cutting position can be obtained and thus improve the cutting accuracy, optionally, the cutting position of the workpiece to be cut for the second time is determined based on the relative position information and the coordinates of the first cutting reference points of each of the multiple cutting reference points, and the cutting equipment is controlled to cut the workpiece to be cut for the second time according to the cutting position. Figure 3 According to the schematic diagram of the third embodiment of the present application. It should be noted that the processing control method based on ultra-thin glass laser cutting in the embodiment of the present application can be executed by the processing control device based on ultra-thin glass laser cutting in the embodiment of the present application. In some embodiments of the present application, such as Figure 3 As shown, the processing control method based on ultra-thin glass laser cutting includes:

[0134] Step 301: Acquire a first image of a workpiece to be cut twice, which is captured by an image capture device.

[0135] In this embodiment of the present application, the first image is an image captured by an image acquisition device when the workpiece to be cut for the second time is placed on a machine tool.

[0136] In the embodiment of the present application, step 301 can be implemented in any of the ways in the embodiments of the present application. The embodiment of the present application does not limit this and will not be described in detail.

[0137] Step 302 : Detect the first image and determine the coordinates of the first cutting reference points of each of the plurality of cutting reference points in the workpiece to be cut a second time on the machine tool.

[0138] In the embodiment of the present application, step 302 can be implemented in any of the ways in the embodiments of the present application. The embodiment of the present application does not limit this and will not be described in detail.

[0139] Step 303: Acquire first drawing data; wherein the first drawing data includes a first cutting size.

[0140] In the embodiment of the present application, step 303 can be implemented in any of the ways in the embodiments of the present application. The embodiment of the present application does not limit this and will not be described in detail.

[0141] Step 304: Obtain relative position information according to the first drawing data.

[0142] In this embodiment of the present application, the first drawing data also includes relative position information of multiple cutting reference points and the target cutting frame.

[0143] As a possible example, relative position information between a plurality of cutting reference points and a target cutting frame in the first drawing data is obtained.

[0144] Step 305 : determining the cutting position of the workpiece to be cut a second time according to the relative position information and the coordinates of the first cutting reference points of each of the plurality of cutting reference points.

[0145] According to the coordinates of the first cutting reference points of each of the multiple cutting reference points, the current position of the cutting reference point on the machine tool is determined. According to the relative position information of the multiple cutting reference points and the target cutting frame, the cutting position of the workpiece to be cut for the second time can be calculated.

[0146] Step 306: Control the cutting device to cut the workpiece to be cut again according to the cutting position.

[0147] It can be understood that the UTG laser cutting system controls the cutting equipment to cut the workpiece to be cut twice according to the cutting position.

[0148] According to the processing control method based on ultra-thin glass laser cutting in an embodiment of the present application, relative position information is obtained based on the first drawing data, and the cutting position of the workpiece to be cut for the second time is determined based on the relative position information and the coordinates of the first cutting reference points of each of the multiple cutting reference points. According to the cutting position, the cutting equipment is controlled to cut the workpiece to be cut for the second time, so that an accurate cutting position can be obtained, thereby improving the cutting accuracy.

[0149] In order to further improve the cutting accuracy, optionally, the first drawing data is scaled. Figure 4 According to the schematic diagram of the fourth embodiment of the present application. It should be noted that the processing control method based on ultra-thin glass laser cutting in the embodiment of the present application can be executed by the processing control device based on ultra-thin glass laser cutting in the embodiment of the present application. In some embodiments of the present application, such as Figure 4 As shown, the processing control method based on ultra-thin glass laser cutting includes:

[0150] Step 401: Acquire a first image of a workpiece to be cut twice, which is captured by an image capture device.

[0151] In this embodiment of the present application, the first image is an image captured by an image acquisition device when the workpiece to be cut for the second time is placed on a machine tool.

[0152] In the embodiments of the present application, step 401 can be implemented in any of the ways in the embodiments of the present application. The embodiments of the present application do not limit this and will not be described in detail.

[0153] Step 402 : Detect the first image and determine the coordinates of the first cutting reference points of each of the plurality of cutting reference points in the workpiece to be cut a second time on the machine tool.

[0154] In the embodiment of the present application, step 402 can be implemented in any of the ways in the embodiments of the present application. The embodiment of the present application does not limit this and will not be described in detail.

[0155] Step 403: Acquire first drawing data; wherein the first drawing data includes a first cutting size.

[0156] In the embodiment of the present application, step 403 can be implemented in any of the ways in the embodiments of the present application. The embodiment of the present application does not limit this and will not be described in detail.

[0157] Step 404: Obtain relative position information according to the first drawing data.

[0158] In the embodiment of the present application, step 404 can be implemented in any of the ways in the embodiments of the present application. The embodiment of the present application does not limit this and will not be described in detail.

[0159] Step 405 : Determine a first size of an area formed by a plurality of cutting reference points in the first drawing data based on the relative position information.

[0160] As a possible example, based on the relative positions between multiple cutting reference points in the first drawing data, the area formed by multiple cutting reference points is determined, the area of the area is calculated based on the relative position information, and the above area is used as the first size.

[0161] Step 406 : Determine a second size of an area formed by the plurality of cutting reference points in the workpiece to be cut a second time based on the first cutting reference point coordinates of each of the plurality of cutting reference points.

[0162] As a possible example, based on connecting the first cutting reference point coordinates of multiple cutting reference points, the area formed by the multiple cutting reference points is determined, the area of the area is calculated according to the first cutting reference point coordinates, and the above area is used as the second size.

[0163] Step 407: perform a ratio comparison on the first size and the second size to obtain a comparison result.

[0164] Step 408 : In response to the ratio result not meeting the preset requirement, adjusting the first drawing data so that the ratio of the first size data and the second size data is the same.

[0165] It should be noted that if the relative position information is correct, the first size and the second size are the same. However, due to errors in the uploaded data, the ratio of the first size and the second size may be different. Therefore, in response to the response that the ratio result does not meet the preset requirements, it is necessary to adjust the first drawing data to make the ratio of the first size data and the second size data the same.

[0166] As a possible example, the preset requirement may be a preset scale range. In response to the result of the scale comparison being included in the above-mentioned preset scale range, the first drawing data is adjusted so that the scale of the first drawing is the same as the second size scale, and then based on the relative position information in the new first drawing.

[0167] Step 409 : determining the cutting position of the workpiece to be cut a second time based on the relative position information and the coordinates of the first cutting reference points of each of the plurality of cutting reference points.

[0168] In the embodiment of the present application, step 409 can be implemented in any of the ways in the embodiments of the present application. The embodiment of the present application does not limit this and will not be described in detail.

[0169] Step 410: Control the cutting device to cut the workpiece to be cut again according to the cutting position.

[0170] In the embodiments of the present application, step 410 can be implemented in any of the ways in the embodiments of the present application. The embodiments of the present application do not limit this and will not be described in detail.

[0171] According to the processing control method based on ultra-thin glass laser cutting of an embodiment of the present application, based on relative position information, a first size of an area formed by multiple cutting reference points in the first drawing data is determined, based on the first cutting reference point coordinates of each of the multiple cutting reference points, a second size of an area formed by multiple cutting reference points in the workpiece to be cut for the second time is determined, a proportional comparison is performed on the first size and the second size to obtain a comparison result, and in response to the proportional result not meeting the preset requirements, the first drawing data is adjusted so that the ratio of the first size data and the second size data is the same, thereby proportionally adjusting the first drawing data and improving the cutting accuracy.

[0172] In order to further improve the cutting accuracy, optionally, the cutting direction of the cutting device is adjusted according to the inclination angle of the workpiece. Figure 5According to the schematic diagram of the fifth embodiment of the present application. It should be noted that the processing control method based on ultra-thin glass laser cutting in the embodiment of the present application can be executed by the processing control device based on ultra-thin glass laser cutting in the embodiment of the present application. In some embodiments of the present application, such as Figure 5 As shown, the processing control method based on ultra-thin glass laser cutting includes:

[0173] Step 501: Acquire a second image captured by an image capture device.

[0174] In this embodiment of the present application, the second image is an image of the workpiece placed on the machine tool after the first cutting.

[0175] In the embodiments of the present application, step 501 can be implemented in any of the ways in the embodiments of the present application. The embodiments of the present application do not limit this and will not be described in detail.

[0176] Step 502: Detect the second image to determine the position information of the target cutting frame on the machine tool.

[0177] In this embodiment of the present application, the target cutting frame is the cutting area obtained after the workpiece is cut for the first time.

[0178] In the embodiment of the present application, step 502 can be implemented in any of the ways in the embodiments of the present application. The embodiment of the present application does not limit this and will not be described in detail.

[0179] Step 503: Determine the position information of each of the plurality of boundary points in the target cutting frame according to the position information of the target cutting frame on the machine tool.

[0180] In the embodiment of the present application, step 503 can be implemented in any of the ways in the embodiments of the present application. The embodiment of the present application does not limit this and will not be described in detail.

[0181] Step 504 : Calculate the coordinates of the second cutting reference points corresponding to the plurality of boundary points based on the position information of the plurality of boundary points and the preset secondary cutting process requirements.

[0182] In the embodiment of the present application, step 504 can be implemented in any of the ways in the embodiments of the present application. The embodiment of the present application does not limit this and will not be described in detail.

[0183] Step 505 : Controlling the cutting device to cut the workpiece to be cut twice according to the coordinates of the second cutting reference points corresponding to the plurality of boundary points, so that a plurality of cutting reference points exist on the workpiece to be cut twice.

[0184] In the embodiment of the present application, step 505 can be implemented in any of the ways in the embodiments of the present application. The embodiment of the present application does not limit this and will not be described in detail.

[0185] Step 506: Acquire a first image of the workpiece to be cut twice, which is captured by an image capture device.

[0186] The first image is an image captured by an image acquisition device when the workpiece to be cut for the second time is placed on a machine tool.

[0187] In the embodiment of the present application, step 506 can be implemented in any of the ways in the embodiments of the present application. The embodiment of the present application does not limit this and will not be described in detail.

[0188] Step 507 : Detect the first image and determine the coordinates of the first cutting reference points of each of the plurality of cutting reference points in the workpiece to be cut a second time on the machine tool.

[0189] In the embodiment of the present application, step 507 can be implemented in any of the ways in the embodiments of the present application. The embodiment of the present application does not limit this and will not be described in detail.

[0190] Step 508: Acquire first drawing data; wherein the first drawing data includes a first cutting size.

[0191] In the embodiment of the present application, step 508 can be implemented in any of the ways in the embodiments of the present application. The embodiment of the present application does not limit this and will not be described in detail.

[0192] Step 509 : Compare the coordinates of the second cutting reference points corresponding to each of the plurality of boundary points with the coordinates of the first cutting reference points corresponding to each of the plurality of cutting reference points to determine the tilt angle of the cutting frame.

[0193] As a possible example, two adjacent second cutting reference points among the plurality of second cutting reference points are connected to obtain a first straight line; and first cutting reference points corresponding to the two adjacent second cutting reference points among the plurality of first cutting reference points are connected to obtain a second straight line. The coordinate positions of the first straight line and the coordinate positions of the second straight line are determined respectively, and the angle between the first straight line and the second straight line is determined based on the coordinate positions of the first straight line and the second straight line. The angle is the inclination angle.

[0194] Step 510: Adjust the cutting direction of the cutting device according to the tilt angle.

[0195] It can be understood that the UTG laser cutting system adjusts the cutting direction of the cutting equipment according to the tilt angle to avoid the cutting direction of the cutting equipment not being consistent with the placement direction of the cutting frame, resulting in incorrect cutting position.

[0196] Step 511 : Based on the cutting direction and the coordinates of the first cutting reference points of the plurality of cutting reference points, control the cutting device to cut the workpiece to be cut twice.

[0197] As a possible example, the UTG laser cutting system controls the cutting device to cut the workpiece to be cut again based on the cutting direction and the coordinates of the first cutting reference point of each of the multiple cutting reference points.

[0198] According to the processing control method based on ultra-thin glass laser cutting in an embodiment of the present application, the coordinates of the second cutting reference points corresponding to each of the multiple boundary points are compared with the coordinates of the first cutting reference points of each of the multiple cutting reference points to determine the inclination angle of the cutting frame. According to the inclination angle, the cutting direction of the cutting device is adjusted. Based on the cutting direction and the coordinates of the first cutting reference points of each of the multiple cutting reference points, the cutting device is controlled to cut the workpiece to be cut for the second time, thereby realizing the adjustment of the cutting direction of the cutting device according to the inclination angle of the workpiece, and further improving the cutting accuracy.

[0199] In order to improve the accuracy of workpiece cutting, optionally, the position information of the target cutting frame is determined according to the position of the image acquisition device on the machine tool. Figure 6 According to the schematic diagram of the sixth embodiment of the present application. It should be noted that the processing control method based on ultra-thin glass laser cutting in the embodiment of the present application can be executed by the processing control device based on ultra-thin glass laser cutting in the embodiment of the present application. In some embodiments of the present application, such as Figure 6 As shown, the processing control method based on ultra-thin glass laser cutting includes:

[0200] Step 601: Acquire a second image captured by an image capture device.

[0201] In this embodiment of the present application, the second image is an image of the workpiece placed on the machine tool after the first cutting.

[0202] In the embodiment of the present application, step 601 can be implemented in any of the ways in the embodiments of the present application. The embodiment of the present application does not limit this and will not be described in detail.

[0203] Step 602: Identify the target cutting frame in the second image.

[0204] In this embodiment of the present application, the target cutting frame may be a cutting area obtained after the workpiece is cut for the first time.

[0205] As a possible example, the UTG laser cutting system recognizes the target cutting frame in the second image.

[0206] Step 603 : In response to identifying the target cutting frame, determining position information of the image acquisition device on the machine tool to determine first position information of the target cutting frame on the machine tool.

[0207] It can be understood that the UTG laser cutting system is capable of obtaining the position information of the image acquisition device on the machine tool.

[0208] As a possible example, by controlling the image acquisition device to move on the machine tool, multiple second images are continuously acquired. In response to identifying the presence of a target cutting frame in the current second image, the position information of the current image acquisition device on the machine tool is recorded, and the position information of the image acquisition device on the machine tool is used as the first position information of the target cutting frame on the machine tool.

[0209] Step 604 : determining the position information of each of the plurality of boundary points in the target cutting frame according to the position information of the target cutting frame on the machine tool.

[0210] In the embodiment of the present application, step 604 can be implemented in any of the ways in the embodiments of the present application. The embodiment of the present application does not limit this and will not be described in detail.

[0211] Step 605 : Calculate the coordinates of the second cutting reference points corresponding to the plurality of boundary points based on the position information of the plurality of boundary points and the preset secondary cutting process requirements.

[0212] In the embodiments of the present application, step 605 can be implemented in any of the ways in the embodiments of the present application. The embodiments of the present application do not limit this and will not be described in detail.

[0213] Step 606 : Controlling the cutting device to cut the workpiece to be cut twice according to the coordinates of the second cutting reference points corresponding to the plurality of boundary points, so that a plurality of cutting reference points exist on the workpiece to be cut twice.

[0214] In the embodiment of the present application, step 606 can be implemented in any of the ways in the embodiments of the present application. The embodiment of the present application does not limit this and will not be described in detail.

[0215] Step 607: Acquire a first image of the workpiece to be cut twice, which is captured by an image capture device.

[0216] The first image is an image captured by an image acquisition device when the workpiece to be cut for the second time is placed on a machine tool.

[0217] In the embodiment of the present application, step 607 can be implemented in any of the ways in the embodiments of the present application. The embodiment of the present application does not limit this and will not be described in detail.

[0218] Step 608 : Detect the first image and determine the coordinates of the first cutting reference points of each of the plurality of cutting reference points in the workpiece to be cut a second time on the machine tool.

[0219] In the embodiment of the present application, step 608 can be implemented in any of the ways in the embodiments of the present application. The embodiment of the present application does not limit this and will not be described in detail.

[0220] Step 609: Acquire first drawing data; wherein the first drawing data includes a first cutting size.

[0221] In the embodiment of the present application, step 609 can be implemented in any of the ways in the embodiments of the present application. The embodiment of the present application does not limit this and will not be described in detail.

[0222] Step 610 , based on the first cutting reference point coordinates of each of the plurality of cutting reference points and according to the first cutting size data, control the cutting device to cut the workpiece to be cut for the second time.

[0223] In the embodiments of the present application, step 610 can be implemented in any of the ways in the embodiments of the present application. The embodiments of the present application do not limit this and will not be described in detail.

[0224] According to the processing control method based on ultra-thin glass laser cutting in an embodiment of the present application, the target cutting frame in the second image is identified, and in response to the identification of the target cutting frame, the position information of the image acquisition device on the machine tool is determined to determine the first position information of the target cutting frame on the machine tool, so as to accurately obtain the position of the target cutting frame on the machine tool through the image acquisition device, thereby improving the accuracy of workpiece cutting.

[0225] In order to ensure accurate positioning of the target cutting frame according to the position information of the image acquisition device, the position of the image acquisition device is optionally adjusted based on the deviation value between the edge line in the second image and the center line of the second image. Figure 7 According to the schematic diagram of the seventh embodiment of the present application. It should be noted that the processing control method based on ultra-thin glass laser cutting in the embodiment of the present application can be executed by the processing control device based on ultra-thin glass laser cutting in the embodiment of the present application. In some embodiments of the present application, such as Figure 7 As shown, the processing control method based on ultra-thin glass laser cutting includes:

[0226] Step 701: Acquire a second image captured by an image capture device.

[0227] In this embodiment of the present application, the second image is an image of the workpiece placed on the machine tool after the first cutting.

[0228] In the embodiment of the present application, step 701 can be implemented in any of the ways in the embodiments of the present application. The embodiment of the present application does not limit this and will not be described in detail.

[0229] Step 702: Identify the target cutting frame in the second image.

[0230] In this embodiment of the present application, the target cutting frame is the cutting area obtained after the workpiece is cut for the first time.

[0231] In the embodiment of the present application, step 702 can be implemented in any of the ways in the embodiments of the present application. The embodiment of the present application does not limit this and will not be described in detail.

[0232] Step 703 : In response to identifying the target cutting frame, determining position information of the image acquisition device on the machine tool to determine first position information of the target cutting frame on the machine tool.

[0233] In the embodiment of the present application, step 703 can be implemented in any of the ways in the embodiments of the present application. The embodiment of the present application does not limit this and will not be described in detail.

[0234] Step 704 : determining the position information of each of the plurality of boundary points in the target cutting frame according to the position information of the target cutting frame on the machine tool.

[0235] In the embodiment of the present application, step 704 can be implemented in any of the ways in the embodiments of the present application. The embodiment of the present application does not limit this and will not be described in detail.

[0236] Step 705 : Calculate the coordinates of the second cutting reference points corresponding to the plurality of boundary points based on the position information of the plurality of boundary points and the preset secondary cutting process requirements.

[0237] In the embodiment of the present application, step 705 can be implemented in any of the ways in the embodiments of the present application. The embodiment of the present application does not limit this and will not be described in detail.

[0238] Step 706 : In response to identifying the edge of the target cutting frame, determine a deviation value between the edge and the center line of the second image.

[0239] As a possible example, in response to UTG laser cutting identifying the edge of the target cutting frame, the position coordinates of the edge of the identified target cutting frame in the second image are obtained, and the deviation value between the edge position coordinates and the center line position coordinates of the second image is calculated.

[0240] Step 707: Adjust the position of the image acquisition device based on the deviation value until the sideline and the centerline of the acquired second image coincide with each other.

[0241] As a possible example, the position of the image acquisition device is adjusted according to the deviation value, and then the graphics acquisition device is controlled to continue acquiring images, so that the edge position coordinates and the center line position coordinates in the second image currently acquired coincide with each other, that is, the edge is directly below the lens of the image acquisition device.

[0242] Step 708: Determine the position information of the edge line according to the current position information of the image acquisition device on the machine tool.

[0243] As a possible example, the position information of the current image acquisition device on the machine tool is used as the position information of the edge line.

[0244] Step 709 : In response to determining the position information of all edges of the target cutting frame, the position information of the target cutting frame on the machine tool is obtained.

[0245] As a possible example, the position information of all edges of the target cutting frame is determined, thereby obtaining complete position information of the target cutting frame.

[0246] Step 710: Acquire a first image of the workpiece to be cut twice, which is captured by an image capture device.

[0247] The first image is an image captured by an image acquisition device when the workpiece to be cut for the second time is placed on a machine tool.

[0248] In the embodiments of the present application, step 710 can be implemented in any of the ways in the embodiments of the present application. The embodiments of the present application do not limit this and will not be described in detail.

[0249] Step 711 : Detect the first image and determine the coordinates of the first cutting reference points of each of the plurality of cutting reference points in the workpiece to be cut a second time on the machine tool.

[0250] In the embodiments of the present application, step 711 can be implemented in any of the ways in the embodiments of the present application. The embodiments of the present application do not limit this and will not be described in detail.

[0251] Step 712: Acquire first drawing data; wherein the first drawing data includes a first cutting size.

[0252] In the embodiments of the present application, step 712 can be implemented in any of the ways in the embodiments of the present application. The embodiments of the present application do not limit this and will not be described in detail.

[0253] Step 713 : Based on the first cutting reference point coordinates of each of the plurality of cutting reference points and in accordance with the first cutting size data, control the cutting device to cut the workpiece to be cut for the second time.

[0254] In the embodiments of the present application, step 713 can be implemented in any of the ways in the embodiments of the present application. The embodiments of the present application do not limit this and will not be described in detail.

[0255] According to the processing control method based on ultra-thin glass laser cutting of an embodiment of the present application, in response to identifying the edge of the target cutting frame, the deviation value between the edge and the center line of the second image is determined, and based on the deviation value, the position of the image acquisition device is adjusted until the edge and the center line coincide in the acquired second image, and the position information of the edge is determined based on the position information of the current image acquisition device on the machine tool. In response to determining the position information of all edges of the target cutting frame, the position information of the target cutting frame on the machine tool is obtained, thereby accurately positioning the target cutting frame according to the position information of the image acquisition device.

[0256] In order to implement the above embodiments, the present application proposes a processing control device based on ultra-thin glass laser cutting.

[0257] Figure 8 Schematic diagram of the eighth embodiment of the present application. Figure 8 As shown, the device includes: a first acquisition module 801 , a first determination module 802 , a second acquisition module 803 and a control module 804 .

[0258] The first acquisition module 801 is used to acquire a first image of the workpiece to be cut twice, which is acquired by an image acquisition device; wherein the first image is an image captured by the image acquisition device when the workpiece to be cut twice is placed on a machine tool;

[0259] A first determining module 802 is configured to detect the first image and determine the coordinates of a first cutting reference point of each of a plurality of cutting reference points in the workpiece to be cut twice on the machine tool;

[0260] The second acquisition module 803 is used to acquire first drawing data; wherein the first drawing data includes a first cutting size;

[0261] The control module 804 is configured to control the cutting device to cut the workpiece to be cut for the second time based on the coordinates of the first cutting reference points of each of the plurality of cutting reference points and according to the first cutting size data.

[0262] According to the processing control device based on ultra-thin glass laser cutting of the embodiment of the present application, a first image of the workpiece to be cut for the second time captured by the image acquisition device is obtained, the first image is detected, the first cutting reference point coordinates of each of the multiple cutting reference points in the workpiece to be cut for the second time on the machine tool are determined, the first drawing data is obtained, and based on the first cutting reference point coordinates of each of the multiple cutting reference points, the cutting equipment is controlled to cut the workpiece to be cut for the second time according to the first cutting size data, so that the target cutting position of the workpiece to be cut for the second time can be accurately located, thereby improving the accuracy of the secondary cutting and improving the cutting efficiency.

[0263] In order to implement the above embodiments, the present application proposes a processing control device based on ultra-thin glass laser cutting.

[0264] Figure 9 Schematic diagram of the ninth embodiment of the present application. Figure 9 As shown, the device includes: a first acquisition module 901, a first determination module 902, a second acquisition module 903, a control module 904, a second acquisition module 905, a second determination module 906, a third determination module 907, a calculation module 908 and a control module 909.

[0265] The first acquisition module 901 is used to acquire a first image of the workpiece to be cut twice, which is acquired by an image acquisition device; wherein the first image is an image captured by the image acquisition device when the workpiece to be cut twice is placed on a machine tool;

[0266] A first determining module 902 is configured to detect the first image and determine the coordinates of a first cutting reference point of each of a plurality of cutting reference points in the workpiece to be cut twice on the machine tool;

[0267] The second acquisition module 903 is used to acquire first drawing data; wherein the first drawing data includes a first cutting size;

[0268] The control module 904 is configured to control the cutting device to cut the workpiece to be cut for the second time based on the first cutting reference point coordinates of each of the plurality of cutting reference points and according to the first cutting size data.

[0269] The second acquisition module 905 is used to acquire a second image acquired by the image acquisition device; the second image is an image of the workpiece placed on the machine tool after the first cutting;

[0270] The second determination module 906 is configured to detect the second image and determine the position information of the target cutting frame on the machine tool; wherein the target cutting frame is the cutting area obtained after the workpiece is cut for the first time;

[0271] The third determining module 907 is used to determine the position information of each of the plurality of boundary points in the target cutting frame according to the position information of the target cutting frame on the machine tool;

[0272] A calculation module 908 is configured to calculate the coordinates of the second cutting reference points corresponding to each of the plurality of boundary points based on the position information of each of the plurality of boundary points and the preset secondary cutting process requirements;

[0273] The control module 909 is used to control the cutting device to cut the workpiece to be cut twice according to the coordinates of the second cutting reference points corresponding to the multiple boundary points, so that there are multiple cutting reference points on the workpiece to be cut twice.

[0274] According to the processing control device based on ultra-thin glass laser cutting of the embodiment of the present application, a second image captured by the image acquisition device is obtained, the second image is detected, and the position information of the target cutting frame on the machine tool is determined. According to the position information of the target cutting frame on the machine tool, the position information of each of the multiple boundary points in the target cutting frame is determined. Based on the position information of each of the multiple boundary points and the preset secondary cutting process requirements, the coordinates of the second cutting reference points corresponding to each of the multiple boundary points are calculated. According to the coordinates of the second cutting reference points corresponding to each of the multiple boundary points, the cutting equipment is controlled to cut the workpiece to be cut for the secondary cutting, so that there are multiple cutting reference points on the workpiece to be cut for the secondary cutting, thereby marking the position of the target cutting frame, and realizing that the cutting reference points can be identified during the secondary cutting, thereby realizing the positioning of the cutting reference points.

[0275] In order to implement the above embodiments, the present application proposes a processing control device based on ultra-thin glass laser cutting.

[0276] Figure 10 1 is a schematic diagram according to the tenth embodiment of the present application. Figure 10 As shown, the device includes: a first acquisition module 1010 , a first determination module 1020 , a second acquisition module 1030 and a control module 1040 ; the control module 1040 includes a first acquisition submodule 1041 , a first determination submodule 1042 and a first control submodule 1043 .

[0277] The first acquisition module 1010 is used to acquire a first image of the workpiece to be cut twice captured by an image acquisition device; wherein the first image is an image taken by the image acquisition device when the workpiece to be cut twice is placed on a machine tool.

[0278] The first determination module 1020 is configured to detect the first image and determine the coordinates of first cutting reference points of each of the plurality of cutting reference points in the workpiece to be cut a second time on the machine tool.

[0279] The second acquisition module 1030 is configured to acquire first drawing data, wherein the first drawing data includes a first cutting size.

[0280] The control module 1040 is configured to control the cutting device to cut the workpiece to be cut for the second time based on the first cutting reference point coordinates of each of the plurality of cutting reference points and according to the first cutting size data.

[0281] In this embodiment, the first drawing data further includes relative position information of a plurality of cutting reference points and a target cutting frame, and the control module 1040 includes:

[0282] The first acquisition submodule 1041 is configured to acquire relative position information according to the first drawing data.

[0283] Among them, in this embodiment, the first acquisition submodule is specifically used to: determine the first size of the area formed by multiple cutting reference points in the first drawing data based on the relative position information; determine the second size of the area formed by multiple cutting reference points in the workpiece to be cut for the second time based on the first cutting reference point coordinates of each of the multiple cutting reference points; perform a proportional comparison between the first size and the second size to obtain a comparison result; in response to the proportional result not meeting the preset requirements, adjust the first drawing data so that the ratio of the first size data and the second size data is the same.

[0284] The first determining submodule 1042 is configured to determine a cutting position of the workpiece to be cut a second time based on the relative position information and the coordinates of the first cutting reference points of each of the plurality of cutting reference points.

[0285] The first control submodule 1043 is used to control the cutting device to cut the workpiece to be cut twice according to the cutting position.

[0286] According to the processing control device based on ultra-thin glass laser cutting of the embodiment of the present application, relative position information is obtained based on the first drawing data, and the cutting position of the workpiece to be cut for the second time is determined based on the relative position information and the first cutting reference point coordinates of each of the multiple cutting reference points. According to the cutting position, the cutting device is controlled to cut the workpiece to be cut for the second time, so that an accurate cutting position can be obtained, thereby improving the cutting accuracy. In addition, based on the relative position information, the first size of the area formed by the multiple cutting reference points in the first drawing data is determined, and based on the first cutting reference point coordinates of each of the multiple cutting reference points, the second size of the area formed by the multiple cutting reference points in the workpiece to be cut for the second time is determined. The first size and the second size are proportionally compared to obtain a comparison result. In response to the proportional result not meeting the preset requirements, the first drawing data is adjusted so that the first size data and the second size data have the same ratio, thereby proportionally adjusting the first drawing data and improving the cutting accuracy.

[0287] In order to implement the above embodiments, the present application proposes a processing control device based on ultra-thin glass laser cutting.

[0288] Figure 11 Schematic diagram of the eleventh embodiment of the present application. Figure 9 As shown, the device includes: a first acquisition module 1110, a first determination module 1120, a second acquisition module 1130, a control module 1140, a second acquisition module 1150, a second determination module 1160, a third determination module 1170 and a calculation module 1180; wherein, a second determination submodule 1191 and an adjustment submodule 1192.

[0289] The first acquisition module 1110 is configured to acquire a first image of the workpiece to be cut twice, which is captured by an image acquisition device. The first image is an image captured by the image acquisition device when the workpiece to be cut twice is placed on a machine tool.

[0290] A first determining module 1120 is configured to detect the first image and determine the coordinates of a first cutting reference point of each of a plurality of cutting reference points in the workpiece to be cut twice on the machine tool;

[0291] The second acquisition module 1130 is configured to acquire first drawing data, wherein the first drawing data includes a first cutting size;

[0292] The control module 1140 is configured to control the cutting device to cut the workpiece to be cut for the second time based on the first cutting reference point coordinates of each of the plurality of cutting reference points and according to the first cutting size data.

[0293] The second acquisition module 1150 is used to acquire a second image acquired by the image acquisition device; the second image is an image of the workpiece placed on the machine tool after the first cutting;

[0294] The second determination module 1160 is configured to detect the second image and determine position information of a target cutting frame on the machine tool; wherein the target cutting frame is a cutting area obtained after the workpiece is cut for the first time;

[0295] The third determining module 1170 is configured to determine the position information of each of the plurality of boundary points in the target cutting frame according to the position information of the target cutting frame on the machine tool;

[0296] A calculation module 1180 is configured to calculate the coordinates of the second cutting reference points corresponding to each of the plurality of boundary points based on the position information of each of the plurality of boundary points and the preset secondary cutting process requirements;

[0297] The control module 1190 is configured to control the cutting device to cut the workpiece to be cut twice according to the coordinates of the second cutting reference points corresponding to the plurality of boundary points, so that a plurality of cutting reference points exist on the workpiece to be cut twice.

[0298] In this embodiment of the present application, the control module includes:

[0299] The second determining submodule 1191 is configured to compare the coordinates of the second cutting reference points corresponding to the plurality of boundary points with the coordinates of the first cutting reference points corresponding to the plurality of cutting reference points to determine the inclination angle of the cutting frame;

[0300] An adjustment submodule 1192 is used to adjust the cutting direction of the cutting device according to the tilt angle;

[0301] The second control submodule 1193 is used to control the cutting device to cut the workpiece to be cut twice based on the cutting direction and the coordinates of the first cutting reference points of the plurality of cutting reference points.

[0302] According to the processing control device based on ultra-thin glass laser cutting of the embodiment of the present application, the coordinates of the second cutting reference points corresponding to each of the multiple boundary points are compared with the coordinates of the first cutting reference points of each of the multiple cutting reference points to determine the inclination angle of the cutting frame. According to the inclination angle, the cutting direction of the cutting device is adjusted. Based on the cutting direction and the coordinates of the first cutting reference points of each of the multiple cutting reference points, the cutting device is controlled to cut the workpiece to be cut for the second time, thereby realizing the adjustment of the cutting direction of the cutting device according to the inclination angle of the workpiece, and further improving the cutting accuracy.

[0303] In order to implement the above embodiments, the present application proposes a processing control device based on ultra-thin glass laser cutting.

[0304] Figure 12 Schematic diagram of the twelfth embodiment of the present application. Figure 12 As shown, the device includes: a first acquisition module 1210, a first determination module 1220, a second acquisition module 1230, a control module 1240, a second acquisition module 1250, a second determination module 1260, a third determination module 1270, a calculation module 1280 and a control module 1290; wherein, the second determination module 1260 includes an identification submodule 1261 and a third determination submodule 1262.

[0305] The first acquisition module 1210 is configured to acquire a first image of the workpiece to be cut twice, which is captured by an image acquisition device. The first image is an image captured by the image acquisition device when the workpiece to be cut twice is placed on a machine tool.

[0306] A first determining module 1220 is configured to detect the first image and determine the coordinates of a first cutting reference point of each of a plurality of cutting reference points in the workpiece to be cut twice on the machine tool;

[0307] The second acquisition module 1230 is used to acquire first drawing data; wherein the first drawing data includes a first cutting size;

[0308] The control module 1240 is configured to control the cutting device to cut the workpiece to be cut for the second time based on the first cutting reference point coordinates of each of the plurality of cutting reference points and according to the first cutting size data.

[0309] The second acquisition module 1250 is used to acquire a second image acquired by the image acquisition device; the second image is an image of the workpiece placed on the machine tool after the first cutting;

[0310] The second determination module 1260 is configured to detect the second image and determine position information of a target cutting frame on the machine tool; wherein the target cutting frame is a cutting area obtained after the workpiece is cut for the first time;

[0311] In this embodiment of the present application, the second determining module 1260 includes:

[0312] The recognition submodule 1261 is used to recognize the target cutting frame in the second image;

[0313] The third determining submodule 1262 is configured to determine position information of the image acquisition device on the machine tool in response to identifying the target cutting frame, so as to determine first position information of the target cutting frame on the machine tool.

[0314] Among them, in the embodiment of the present application, the third determination submodule 1262 is specifically used to: in response to identifying the edge of the target cutting frame, determine the deviation value between the edge and the center line of the second image; based on the deviation value, adjust the position of the image acquisition device until the edge and the center line coincide with each other in the acquired second image; determine the position information of the edge based on the position information of the current image acquisition device on the machine tool; in response to determining the position information of all the edges of the target cutting frame, obtain the position information of the target cutting frame on the machine tool.

[0315] The third determining module 1270 is configured to determine the position information of each of the plurality of boundary points in the target cutting frame according to the position information of the target cutting frame on the machine tool;

[0316] A calculation module 1280 is configured to calculate the coordinates of the second cutting reference points corresponding to each of the plurality of boundary points based on the position information of each of the plurality of boundary points and the preset secondary cutting process requirements;

[0317] The control module 1290 is used to control the cutting device to cut the workpiece to be cut twice according to the coordinates of the second cutting reference points corresponding to the multiple boundary points, so that there are multiple cutting reference points on the workpiece to be cut twice.

[0318] According to the processing control device based on ultra-thin glass laser cutting according to the embodiment of the present application, the target cutting frame in the second image is identified. In response to the identification of the target cutting frame, the position information of the image acquisition device on the machine tool is determined to determine the first position information of the target cutting frame on the machine tool, thereby accurately obtaining the position of the target cutting frame on the machine tool through the image acquisition device, thereby improving the accuracy of workpiece cutting. In addition, in response to the identification of the edge of the target cutting frame, the deviation value between the edge and the center line of the second image is determined. Based on the deviation value, the position of the image acquisition device is adjusted until the edge and the center line coincide in the captured second image. The position information of the edge is determined based on the current position information of the image acquisition device on the machine tool. In response to the determination of the position information of all the edges of the target cutting frame, the position information of the target cutting frame on the machine tool is obtained, thereby accurately positioning the target cutting frame based on the position information of the image acquisition device.

[0319] like Figure 13 , is a block diagram of an electronic device according to a method for processing control of ultra-thin glass laser cutting according to an embodiment of the present application. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices, and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present application described and / or required herein.

[0320] like Figure 13 As shown, the electronic device includes: one or more processors 1301, a memory 1302, and interfaces for connecting various components, including a high-speed interface and a low-speed interface. The various components are connected to each other using different buses and can be installed on a common mainboard or installed in other ways as needed. The processor can process the instructions executed in the electronic device, including instructions stored in or on the memory to display the graphical information of the GUI on an external input / output device (such as a display device coupled to the interface). In other embodiments, if necessary, multiple processors and / or multiple buses can be used together with multiple memories and multiple memories. Similarly, multiple electronic devices can be connected, and each device provides some necessary operations (for example, as a server array, a group of blade servers, or a multi-processor system). Figure 13 A processor 1301 is taken as an example.

[0321] Memory 1302 is the non-transitory computer-readable storage medium provided in this application. The memory stores instructions executable by at least one processor, causing the at least one processor to execute the method for controlling the processing of ultra-thin glass laser cutting provided in this application. The non-transitory computer-readable storage medium of this application stores computer instructions for causing a computer to execute the method for controlling the processing of ultra-thin glass laser cutting provided in this application.

[0322] The memory 1302 is a non-transient computer-readable storage medium that can be used to store non-transient software programs, non-transient computer executable programs and modules, such as the program instructions / modules corresponding to the method for processing control based on ultra-thin glass laser cutting in the embodiment of the present application (for example, the attached Figure 8 The processor 1301 executes the non-transient software programs, instructions, and modules stored in the memory 1302 to execute various functional applications and data processing of the server, thereby implementing the method for processing control based on ultra-thin glass laser cutting in the above method embodiment.

[0323] The memory 1302 may include a program storage area and a data storage area, wherein the program storage area may store an operating system and application programs required for at least one function; the data storage area may store data created based on the use of the electronic device for processing control based on ultra-thin glass laser cutting, etc. In addition, the memory 1302 may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage device. In some embodiments, the memory 1302 may optionally include a memory remotely located relative to the processor 1301, and these remote memories may be connected to the electronic device for processing control based on ultra-thin glass laser cutting via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0324] The electronic device based on the processing control method of ultra-thin glass laser cutting may further include: an input device 1303 and an output device 1304. The processor 1301, the memory 1302, the input device 1303 and the output device 1304 may be connected via a bus or other means. Figure 13 The bus connection is taken as an example.

[0325] The input device 1303 can receive input digital or character information, and generate key signal input related to user settings and function control of electronic devices based on ultra-thin glass laser cutting processing control, such as input devices such as a touch screen, a keypad, a mouse, a trackpad, a touch pad, an indicator stick, one or more mouse buttons, a trackball, and a joystick. The output device 1304 may include a display device, an auxiliary lighting device (e.g., an LED), and a tactile feedback device (e.g., a vibration motor). The display device may include, but is not limited to, a liquid crystal display (LCD), a light emitting diode (LED) display, and a plasma display. In some embodiments, the display device may be a touch screen.

[0326] Various implementations of the systems and techniques described herein can be realized in digital electronic circuit systems, integrated circuit systems, dedicated ASICs (application specific integrated circuits), computer hardware, firmware, software, and / or combinations thereof. These various implementations can include being implemented in one or more computer programs that can be executed and / or interpreted on a programmable system that includes at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0327] These computer programs (also referred to as programs, software, software applications, or code) include machine instructions for a programmable processor and can be implemented using high-level procedural and / or object-oriented programming languages, and / or assembly / machine languages. As used herein, the terms "machine-readable medium" and "computer-readable medium" refer to any computer program product, apparatus, and / or device (e.g., a magnetic disk, an optical disk, a memory, a programmable logic device (PLD)) for providing machine instructions and / or data to a programmable processor, including a machine-readable medium that receives machine instructions as a machine-readable signal. The term "machine-readable signal" refers to any signal for providing machine instructions and / or data to a programmable processor.

[0328] To provide interaction with a user, the systems and techniques described herein can be implemented on a computer having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user can provide input to the computer. Other types of devices can also be used to provide interaction with the user; for example, the feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including acoustic input, voice input, or tactile input).

[0329] The systems and techniques described herein can be implemented in a computing system that includes back-end components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes front-end components (e.g., a user computer having a graphical user interface or a web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such back-end components, middleware components, or front-end components. The components of the system can be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include a local area network (LAN), a wide area network (WAN), and the Internet.

[0330] A computer system may include a client and a server. The client and server are generally remote from each other and typically interact via a communication network. The client-server relationship is established by computer programs running on the respective computers and establishing a client-server relationship with each other. The server may be a cloud server, also known as a cloud computing server or cloud host, a host product within a cloud computing service ecosystem that addresses the management difficulties and limited business scalability of traditional physical hosts and VPS services ("Virtual Private Servers" or "VPS").

[0331] It should be understood that the various forms of the processes shown above can be used to reorder, add, or delete steps. For example, the steps described in this application can be performed in parallel, sequentially, or in a different order, as long as the desired results of the technical solutions disclosed in this application can be achieved. This is not a limitation herein.

[0332] The above specific embodiments do not constitute a limitation on the scope of protection of this application. Those skilled in the art will appreciate that various modifications, combinations, sub-combinations, and substitutions may be made based on design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application shall be included within the scope of protection of this application.

Claims

1. A processing control method based on ultra-thin glass laser cutting, characterized in that: The method is applied to an ultra-thin glass UTG laser cutting system, which includes a machine tool, a cutting device, and an image acquisition device; the method includes: Acquire a first image of the workpiece to be cut twice captured by the image acquisition device; wherein the first image is an image captured by the image acquisition device when the workpiece to be cut twice is placed on the machine tool; Detecting the first image to determine the coordinates of first cutting reference points of each of the plurality of cutting reference points in the workpiece to be cut a second time on the machine tool; Acquire first drawing data; wherein the first drawing data includes a first cutting size; Based on the first cutting reference point coordinates of each of the plurality of cutting reference points, and in accordance with the first cutting size data, controlling the cutting device to cut the workpiece to be cut twice; Before acquiring the first image of the workpiece to be cut again captured by the image acquisition device, the method further includes: Calculate the coordinates of the second cutting reference points corresponding to each of the multiple boundary points in the target cutting frame, and control the cutting device to cut the workpiece to be cut a second time based on the coordinates of the second cutting reference points corresponding to each of the multiple boundary points, so that there are multiple cutting reference points on the workpiece to be cut a second time; the target cutting frame is the cutting area obtained after the workpiece is cut for the first time.

2. The method according to claim 1, characterized in that The step of calculating the coordinates of the second cutting reference points corresponding to each of the plurality of boundary points in the target cutting frame, and controlling the cutting device to cut the workpiece to be cut again based on the coordinates of the second cutting reference points corresponding to each of the plurality of boundary points, so that a plurality of cutting reference points exist on the workpiece to be cut again, comprises: Acquiring a second image captured by the image acquisition device; the second image is an image of the workpiece placed on the machine tool after the first cutting; Detecting the second image to determine position information of the target cutting frame on the machine tool; Determining position information of each of a plurality of boundary points within the target cutting frame according to position information of the target cutting frame on the machine tool; Calculating the coordinates of the second cutting reference points corresponding to each of the plurality of boundary points based on the position information of each of the plurality of boundary points and the preset secondary cutting process requirements; According to the coordinates of the second cutting reference points corresponding to the plurality of boundary points, the cutting device is controlled to cut the workpiece to be cut a second time, so that the plurality of cutting reference points exist on the workpiece to be cut a second time.

3. The method according to claim 1, characterized in that The first drawing data further includes relative position information of the plurality of cutting reference points and the target cutting frame. Based on the first cutting reference point coordinates of each of the plurality of cutting reference points and in accordance with the first cutting size data, the cutting device is controlled to cut the workpiece to be cut again, including: acquiring the relative position information according to the first drawing data; determining a cutting position of the workpiece to be cut a second time according to the relative position information and the coordinates of the first cutting reference points of each of the plurality of cutting reference points; According to the cutting position, the cutting device is controlled to cut the workpiece to be cut a second time.

4. The method according to claim 3, characterized in that After acquiring the relative position information according to the first drawing data, the method further includes: determining a first size of an area formed by the plurality of cutting reference points in the first drawing data based on the relative position information; determining a second size of an area formed by the plurality of cutting reference points in the workpiece to be cut again based on the first cutting reference point coordinates of each of the plurality of cutting reference points; performing a ratio comparison on the first size and the second size to obtain a comparison result; In response to the ratio result not meeting a preset requirement, the first drawing data is adjusted so that the first size data and the second size data have the same ratio.

5. The method according to claim 2, characterized in that The controlling the cutting device to cut the workpiece to be cut again according to the first cutting size data based on the first cutting reference point coordinates of each of the plurality of cutting reference points includes: Comparing the coordinates of the second cutting reference points corresponding to each of the plurality of boundary points with the coordinates of the first cutting reference points corresponding to each of the plurality of cutting reference points to determine the inclination angle of the cutting frame; adjusting the cutting direction of the cutting device according to the tilt angle; Based on the cutting direction and the coordinates of the first cutting reference points of each of the plurality of cutting reference points, the cutting device is controlled to cut the workpiece to be cut a second time.

6. The method according to claim 2, characterized in that The detecting the second image to determine the position information of the target cutting frame on the machine tool includes: identifying the target cutting frame in the second image; In response to identifying the target cutting frame, position information of the image acquisition device on the machine tool is determined to determine first position information of the target cutting frame on the machine tool.

7. The method according to claim 6, characterized in that In response to identifying the target cutting frame, determining the position information of the image acquisition device on the machine tool includes: In response to identifying a sideline of the target cutting frame, determining a deviation value between the sideline and a centerline of the second image; Adjusting the position of the image acquisition device based on the deviation value until the sideline coincides with the centerline in the acquired second image; Determine the position information of the edge line according to the current position information of the image acquisition device on the machine tool; In response to determining the position information of all edges of the target cutting frame, the position information of the target cutting frame on the machine tool is obtained.

8. A processing control device based on ultra-thin glass laser cutting, characterized in that: The method according to any one of claims 1 to 7 is used, wherein the device is applied to a UTG laser cutting system, the system comprising a machine tool, a cutting device, and an image acquisition device; the device comprises: A first acquisition module is configured to acquire a first image of the workpiece to be cut twice, which is acquired by the image acquisition device; wherein the first image is an image captured by the image acquisition device when the workpiece to be cut twice is placed on the machine tool; a first determining module, configured to detect the first image and determine the coordinates of first cutting reference points of each of the plurality of cutting reference points in the workpiece to be cut a second time on the machine tool; A second acquisition module is configured to acquire first drawing data; wherein the first drawing data includes a first cutting size; A control module is used to control the cutting device to cut the workpiece to be cut twice according to the first cutting size data based on the first cutting reference point coordinates of each of the multiple cutting reference points.

9. The device according to claim 8, characterized in that Also includes: A second acquisition module, configured to acquire a second image acquired by the image acquisition device; The second image is an image of the workpiece placed on the machine tool after the first cutting; a second determining module, configured to detect the second image and determine position information of a target cutting frame on the machine tool; wherein the target cutting frame is a cutting area obtained after the workpiece is cut for the first time; a third determining module, configured to determine position information of respective boundary points within the target cutting frame according to position information of the target cutting frame on the machine tool; a calculation module, configured to calculate the coordinates of the second cutting reference points corresponding to each of the plurality of boundary points based on the position information of each of the plurality of boundary points and a preset secondary cutting process requirement; The control module is used to control the cutting device to cut the workpiece to be cut twice according to the coordinates of the second cutting reference points corresponding to the multiple boundary points, so that the multiple cutting reference points exist on the workpiece to be cut twice.

10. The device according to claim 8, characterized in that The first drawing data also includes relative position information of the plurality of cutting reference points and the target cutting frame, and the control module includes: A first acquisition submodule, configured to acquire the relative position information according to the first drawing data; A first determining submodule is configured to determine a cutting position of the workpiece to be cut twice based on the relative position information and the coordinates of the first cutting reference points of each of the plurality of cutting reference points; The first control submodule is used to control the cutting device to cut the workpiece to be cut a second time according to the cutting position.

11. The device according to claim 10, characterized in that The first acquisition submodule is specifically used for: determining a first size of an area formed by the plurality of cutting reference points in the first drawing data based on the relative position information; determining a second size of an area formed by the plurality of cutting reference points in the workpiece to be cut again based on the first cutting reference point coordinates of each of the plurality of cutting reference points; performing a ratio comparison on the first size and the second size to obtain a comparison result; In response to the ratio result not meeting a preset requirement, the first drawing data is adjusted so that the first size data and the second size data have the same ratio.

12. The device according to claim 9, characterized in that The control module includes: a second determining submodule, configured to compare the coordinates of the second cutting reference points corresponding to the plurality of boundary points with the coordinates of the first cutting reference points corresponding to the plurality of cutting reference points, to determine the inclination angle of the cutting frame; an adjusting submodule, configured to adjust the cutting direction of the cutting device according to the tilt angle; The second control submodule is used to control the cutting device to cut the workpiece to be cut twice based on the cutting direction and the coordinates of the first cutting reference points of each of the multiple cutting reference points.

13. The device according to claim 9, characterized in that The second determining module includes: a recognition submodule, configured to recognize the target cutting frame in the second image; The third determining submodule is configured to determine position information of the image acquisition device on the machine tool in response to identifying the target cutting frame, so as to determine first position information of the target cutting frame on the machine tool.

14. The device according to claim 13, characterized in that The third determining submodule is specifically configured to: In response to identifying a sideline of the target cutting frame, determining a deviation value between the sideline and a centerline of the second image; Adjusting the position of the image acquisition device based on the deviation value until the sideline coincides with the centerline in the acquired second image; Determine the position information of the edge line according to the current position information of the image acquisition device on the machine tool; In response to determining the position information of all edges of the target cutting frame, the position information of the target cutting frame on the machine tool is obtained.

15. An electronic device, characterized in that: include: at least one processor; as well as a memory communicatively connected to the at least one processor; wherein, The memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to perform the method according to any one of claims 1 to 7.

16. A non-transitory computer-readable storage medium storing computer instructions, characterized in that: The computer instructions are used to cause the computer to execute the method according to any one of claims 1 to 7.

17. A computer program product, comprising a computer program, wherein when the computer program is executed by a processor, the computer program implements the steps of the processing control method based on ultra-thin glass laser cutting according to any one of claims 1 to 7.

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