Semiconductor silicon wafer fully automatic edge polishing device and method

Abstract

The present invention belongs to the field of edge polishing of semiconductor silicon wafers, and specifically relates to a fully automatic edge polishing device and method for semiconductor silicon wafers. The device includes a cabinet, and silicon wafer loading manipulators and unloading water troughs are correspondingly arranged on the sides of the feed port and the discharge port inside the cabinet, and a wafer transfer box, an aerial walking unmanned transport vehicle and an AGV trolley are arranged on the right side of the cabinet body; a linear motion mechanism is arranged on the side of the cabinet body, and a plurality of silicon wafer front and rear clamping manipulators and silicon wafer left and right clamping manipulators are arranged on the linear motion mechanism; a V-Notch and flat edge rough polishing device, a V-Notch and flat edge fine polishing device are arranged in sequence behind the feed port inside the cabinet, and a unloading cleaning device, an edge fine polishing device and an edge rough polishing device are arranged in sequence behind the unloading water trough. The present invention simultaneously meets the edge polishing requirements of two different types of semiconductor silicon wafers, solves the problem of consistent surface roughness of the edge polishing of silicon wafers, and can effectively protect the front and back surfaces of silicon wafers from damage, thereby improving the qualified rate of polished wafers.

Description

Technical Field

[0001] The invention belongs to the field of edge polishing of semiconductor silicon wafers, and in particular relates to a fully automatic edge polishing device and method for semiconductor silicon wafers. Background Art

[0002] Semiconductor silicon wafers are the main substrate materials for manufacturing ultra-large-scale integrated circuits. With the rapid development of the semiconductor industry, the precision requirements for substrate materials are becoming higher and higher. Generally, the outer circumferential surface of the silicon wafer needs to be polished during substrate processing to ensure that the edge of the silicon wafer does not produce defects during subsequent processing, reduce stress concentration, reduce the fragmentation rate, and thus improve the yield rate. The edge polishing of silicon wafers generally requires special polishing equipment to be completed. Most of them adopt the method of mechanical chemical polishing, use polishing liquid and polishing cloth, and realize edge polishing under certain pressure and speed process conditions. After polishing, the surface roughness of the silicon wafer is required to be consistent. If a part of the outer circumferential surface is not polished sufficiently or has defects such as scratches, it will easily form a problem of multi-grain aggregation in the subsequent processing. At present, most of the silicon wafer polishing equipment at home and abroad has a low degree of automation, and the cleaning is not in place during the polishing process. The clamping method of the silicon wafer during polishing is also easy to cause secondary damage to the front and back of the silicon wafer, thereby affecting the final polishing quality of the silicon wafer. Therefore, the development of a device and method for fully automatic edge polishing of semiconductor silicon wafers will play a positive role in promoting the development of the domestic semiconductor industry. Summary of the invention

[0003] The present invention aims to solve the problem of uniform surface roughness of the edge polishing of semiconductor silicon wafers, protect the non-polished surface of the silicon wafer edge during polishing, realize full automation of the semiconductor silicon wafer polishing process, reduce manual intervention, and improve the polishing quality and efficiency.

[0004] In order to solve the problem of uniform surface roughness of the edge polishing surface of semiconductor silicon wafers and protect the non-polished surface, the solution adopted by the present invention is:

[0005] Provided is a fully automatic edge polishing device for semiconductor silicon wafers, comprising an operation panel, a cabinet, a loading and unloading device, a manipulator device and a polishing device;

[0006] The cabinet is a cubic box structure, and the loading and unloading devices include an aerial unmanned transport vehicle and an AGV trolley. The right wall of the cabinet is symmetrically provided with a feed port and a discharge port. Inside the cabinet, silicon wafer loading manipulators and unloading troughs are provided next to the feed port and the discharge port. The right side of the cabinet is provided with a wafer transfer box, an aerial unmanned transport vehicle and an AGV trolley. The aerial unmanned transport vehicle is used for loading, and the AGV trolley is used for unloading.

[0007] The manipulator device comprises a linear motion mechanism arranged on three sides of the cabinet except the right side, and a plurality of silicon wafer front and rear clamping manipulators and silicon wafer left and right clamping manipulators are arranged on the linear motion mechanism.

[0008] The polishing device includes a silicon wafer calibrator, a V-Notch and flat edge rough polishing device, a V-Notch and flat edge fine polishing device and an intermediate cleaning device, which are arranged in sequence behind the feed port inside the cabinet. The V-Notch and flat edge rough polishing device and the V-Notch and flat edge fine polishing device have the same structure, and both include a polishing mechanism and a silicon wafer outer circumference clamping robot arranged at the same workstation.

[0009] The polishing mechanism includes a polishing head rotating spindle, the lower end of which is connected to a synchronous pulley, and the top end is detachably connected to a V-Notch polishing wheel or a flat edge polishing wheel, and a polishing cloth is covered on the polishing wheel. The synchronous pulley is connected to the motor through a synchronous belt, and the motor can drive the synchronous pulley to rotate forward and reverse, thereby driving the polishing head to rotate forward and reverse;

[0010] The silicon wafer outer circumference clamping manipulator includes a gripper fixing base and a clamping gripper. The bottom of the gripper fixing base is arranged on a gripper feeding guide rail through a slider, and a gripper feeding drive motor is arranged on the gripper feeding guide rail. A silicon wafer pressurizing cylinder and a synchronous pulley are also arranged at the bottom of the gripper fixing base. A horizontal flip shaft is arranged at the top of the gripper fixing base. One end of the flip shaft is connected to the gripper through a flip arm, and the other end is connected to the synchronous pulley through a synchronous belt, and the synchronous pulley is connected to the drive motor.

[0011] The silicon wafer pressurizing cylinder is used to drive the wafer feeding movement. Since the cylinder piston rod itself has a certain amount of expansion and contraction, and the pressure of the cylinder can be controlled by a pressure regulating valve, when the polishing pad gradually wears out during the polishing process, as long as it is within the expansion and contraction amount of the cylinder piston rod, the wafer can always stick to the polishing pad, thereby achieving the continuity of the wafer polishing process and the constant polishing force; the rotation of the motor drives the rotation of the synchronous pulley, thereby driving the rotation of the flip shaft, the flip mechanism includes a flip shaft and a flip arm, the flip shaft is connected to the synchronous belt transmission system, and the flip arm is connected to the outer circumference clamping manipulator, which is used to realize the up and down flipping function of the manipulator during the polishing process;

[0012] The clamping claw includes a support block and a front clamping block and a rear clamping block which are arranged at the left and right ends of the upper end surface of the support block. The front clamping block is connected to the support block through a fixed support column, and the rear clamping block is connected to one end of a telescopic rod, and the other end of the telescopic rod is connected to a cylinder arranged at the lower part of the support block. The silicon wafer is clamped between the front and rear clamping blocks.

[0013] The polishing device also includes a material cleaning device, an edge fine polishing device and an edge rough polishing device which are arranged in the cabinet and behind the material water tank in sequence.

[0014] As an improvement, the front and rear clamping robots for silicon wafers include an L-shaped support frame, the bottom of which is connected to a linear motion mechanism via a gripper lifting cylinder, and the side of the support frame is provided with a gripper opening and closing cylinder, which is connected to a silicon wafer clamping roller.

[0015] As an improvement, the left and right silicon wafer clamping robots include an L-shaped support frame, the bottom of the support frame is connected to the linear motion mechanism through a gripper lifting cylinder, and the side of the support frame is provided with a gripper flip opening and closing cylinder, which is connected to the silicon wafer clamping roller.

[0016] Note: FOUP in the following text is a wafer transfer box, OHT is an aerial unmanned transport vehicle, and AGV is a device equipped with electromagnetic or optical automatic guidance, which can travel along a specified guidance path.

[0017] The principle of this device is to use a mechanochemical polishing method. The semiconductor silicon wafer is fixed in position by a suction cup, and then a centrifugal rotating polishing head is designed on the edge. When the polishing head is stationary, the polishing cloth and the edge of the silicon wafer are not in contact. When the polishing head rotates around the edge of the silicon wafer at a certain angular velocity, the centrifugal force generated by the counterweight block allows the polishing cloth to fit tightly to the edge of the silicon wafer, and a certain amount of polishing liquid is introduced at the same time. The polishing liquid is an alkaline liquid containing some grinding particles, which can play a good role in cooling and improving polishing efficiency. The size of the centrifugal force can be accurately controlled by the rotation speed of the polishing head and the mass of the counterweight block, and there is more room for adjustment in the process.

[0018] When polishing the edge of the V-Notch or flat edge, the silicon wafer is fixed by holding the outer circumference tightly, and the claws do not directly contact the front and back of the silicon wafer, which can greatly reduce the risk of damage to the front and back of the silicon wafer. For polishing of non-V-Notch and flat edge parts, vacuum suction cups are used for adsorption. The vacuum suction cups have built-in cleaning pipes to regularly flush away polishing residues and alkaline liquids. At the same time, nozzles are designed on the outside to regularly flush the suction cups so that no particles remain on the surface of the suction cups, which can also protect the front and back surfaces of the silicon wafer.

[0019] The V-Notch and flat edge parts are all fixed by the outer circumference clamping manipulator, which can be turned ± 55°, so that the edge part can be fully polished. At the same time, the polishing pressure of the silicon wafer is provided by the feeding cylinder of the clamping manipulator. The cylinder is equipped with a pressure control valve, so that the feeding pressure of the silicon wafer can be accurately controlled and adjusted. The rotation direction of the polishing wheel is perpendicular to the horizontal plane of the silicon wafer. The width of the polishing wheel can be designed according to the width of the V-Notch and the flat edge. Generally speaking, when polishing the V-Notch part, the width of the polishing wheel should be smaller than the width of the V-Notch. When polishing the flat edge, the width of the polishing wheel should be larger than the width of the flat edge.

[0020] During the polishing process of silicon wafers, DIW cleaning and spraying stations are added. For example, nozzles are installed on the outer circumference clamping manipulator of silicon wafers. After the V-Notch part of the silicon wafer is polished, the polishing particles remaining on the surface are washed away to avoid affecting the next station. When all silicon wafers are polished, all wafers will be placed in a wafer box. The wafer box is soaked in DIW, which can keep the surface of the silicon wafer moist and prevent the polishing liquid from crystallizing on the surface of the silicon wafer, which has a good protective effect.

[0021] The working process of this device is as follows: silicon wafers are transported by OHT outside the side-throwing device. OHT transfers a box of silicon wafers from the previous station to the side-throwing FOUP station. The FOUP can carry the silicon wafer box, open the silicon wafer box and perform lifting and lowering movements. A handling robot is designed inside the side-throwing device. The robot can transfer the silicon wafer from the FOUP to the inside of the equipment. The polishing of the silicon wafer inside the equipment is all carried by an outer circumferential clamping robot to reduce damage to the front and back of the silicon wafer. Finally, when the edge polishing of the silicon wafer is completed, the unloading end is picked up by the AGV trolley. The AGV can take out the wafer box from the unloading end of the side-throwing device and then transfer it to the next station. This solves the problem of fully automatic polishing of silicon wafers. The entire process does not require human intervention and can be monitored by a computer throughout the process.

[0022] A fully automatic edge polishing method for semiconductor silicon wafers, comprising the following steps:

[0023] (1) OHT places the silicon wafer cassette that needs edge polishing on the FOUP stage;

[0024] (2) The FOUP starts the automatic cover opening and scanning functions to read the position parameters of each silicon wafer;

[0025] (3) The silicon wafer loading robot takes out the silicon wafers from the wafer box one by one and places them on the silicon wafer calibrator to calibrate the V-Notch / flat edge position;

[0026] (4) The front and rear clamping manipulators transfer the silicon wafer to the V-Notch and flat edge rough polishing and fine polishing stations, and first perform edge polishing of the V-Notch or flat edge;

[0027] (5) Before rough polishing and fine polishing of the edge, the polishing liquid and particles generated during the polishing process need to be cleaned at the intermediate cleaning station to avoid pits and scratches on the edge during subsequent polishing;

[0028] (6) When all edges are polished, the left and right gripping manipulators move the silicon wafer to the unloading and cleaning station to clean the remaining polishing liquid and polishing particles.

[0029] (7) The polished wafers will be placed in the wafer box in the unloading tank. When the entire wafer box is full of wafers, the AGV will automatically come over to take away the entire wafer box and place an empty wafer box at the same time to facilitate the equipment to continue unloading, which will not affect the equipment's polishing rhythm.

[0030] Compared with the prior art, the technical effects of the present invention are:

[0031] 1. The present invention can simultaneously meet the edge polishing requirements of two different types of semiconductor silicon wafers (V-Notch and flat edge), solve the problem of uniform surface roughness of the edge polishing of silicon wafers, and effectively protect the front and back surfaces of the silicon wafer from damage, thereby improving the polishing pass rate.

[0032] 2. Design a variety of different types of automated handling mechanisms. The equipment has a very high degree of automation and can perform edge polishing and silicon wafer circulation without direct human intervention, which can realize intelligent polishing of silicon wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 It is a two-dimensional schematic diagram of a semiconductor silicon wafer (V-Notch and flat edge);

[0034] Figure 2 This is the overall effect diagram of the outer circumference clamping manipulator in the present invention;

[0035] Figure 3 The three-dimensional effect diagram of the polishing head for polishing the V-Notch and flat edge parts in the present invention;

[0036] Figure 4 It is a two-dimensional structural diagram of the external circle clamping manipulator in the present invention;

[0037] Figure 5 It is a schematic diagram of the two-dimensional structure of edge polishing of non-V-Notch and flat edge parts in the present invention;

[0038] Figure 6 This is a general layout effect diagram of the present invention;

[0039] Figure 7 This is a schematic diagram of the external automatic loading of the present invention;

[0040] Figure 8 is the internal layout diagram of the present invention;

[0041] Fig. 9 It is a three-dimensional effect diagram of the feeding robot in the present invention;

[0042] Fig.10 A three-dimensional layout diagram of a silicon wafer handling robot inside the device of the present invention;

[0043] Fig.11 A three-dimensional schematic diagram of the front and rear clamping manipulators in the present invention;

[0044] Fig.12 It is a three-dimensional schematic diagram of the left and right clamping manipulators in the present invention.

[0045] Figure numerals: 1- flat edge wafer, 2- V-Notch wafer, 3- semiconductor silicon wafer, 4- outer circumference clamping gripper, 5- gripper fixing base, 6- gripper feeding guide rail, 7- gripper feeding drive motor, 8- silicon wafer pressurizing cylinder, 9- synchronous belt transmission system, 10- polishing head rotating spindle, 11- polishing head transmission synchronous wheel, 12- V-Notch polishing wheel, 13- flat edge polishing wheel, 14-rear clamping block, 15-telescopic rod, 16-fixed support column, 17-front clamping block, 18-nozzle, 19-counterweight, 20-rocker, 21-wedge block, 22-suction cup, 23-suction cup polishing pad, 25-edge polishing device, 26-operation panel, 27-loading sheet box, 28-FOUP, 29-AGV trolley, 30-unloading sheet box, 31-OHT, 32-unloading water tank, 33-unloading cleaning device, 34-edge fine polishing device, 35-edge rough polishing device, 36-intermediate cleaning device, 37-V-Notch and flat edge fine polishing device, 38-V-Notch and flat edge rough polishing device, 39-silicon wafer front and rear clamping manipulator, 40-silicon wafer calibrator, 41-silicon wafer loading manipulator, 42-silicon wafer left and right clamping manipulator, 43-electric cylinder moving module, 44-silicon wafer clamping roller, 45-hand claw opening and closing cylinder, 46-hand claw lifting cylinder, 47-hand claw flip opening and closing cylinder. DETAILED DESCRIPTION

[0046] The specific implementation modes of the present invention are described in detail below in conjunction with the accompanying drawings.

[0047] A fully automatic edge polishing device for semiconductor silicon wafers comprises an operation panel 26, an integrated cabinet, a manipulator device and a polishing device.

[0048] The cabinet is a cubic box structure, with a feed port and a discharge port symmetrically opened on the right wall. Inside the cabinet, silicon wafer loading manipulators 41 and discharge tanks 32 are correspondingly arranged beside the feed port and the discharge port. Wafer transfer boxes FOUP28, aerial unmanned transport vehicles OHT31 and AGV trolleys 29 are arranged on the right side outside the cabinet. The aerial unmanned transport vehicles are used for loading, and the AGV trolleys 29 are used for unloading.

[0049] The manipulator device includes a linear motion mechanism arranged on three sides of the cabinet except the right side, and a plurality of silicon wafer front and rear clamping manipulators 39 and silicon wafer left and right clamping manipulators 42 are arranged on the linear motion mechanism. The silicon wafer front and rear clamping manipulators 39 include an L-shaped support frame, the bottom of the support frame is connected to the linear motion mechanism through a hand claw lifting cylinder 46, and a hand claw opening and closing cylinder 45 is arranged on the side of the support frame, and the hand claw opening and closing cylinder 45 is connected to the silicon wafer clamping roller 44.

[0050] The silicon wafer left and right clamping manipulator 42 includes an L-shaped support frame, the bottom of which is connected to the linear motion mechanism through a gripper lifting cylinder 46, and the side of the support frame is provided with a gripper flip opening and closing cylinder 47, which is connected to the silicon wafer clamping roller 44.

[0051] The polishing device includes a silicon wafer calibrator 40, a V-Notch and flat edge rough polishing device 38, a V-Notch and flat edge fine polishing device 37, and an intermediate cleaning device 36, which are sequentially arranged behind the feed port inside the cabinet. A material cleaning device 33, an edge fine polishing device 34, and an edge rough polishing device 35 are sequentially arranged behind the material feeding trough 32 inside the cabinet.

[0052] The V-Notch and flat edge rough polishing devices and the V-Notch and flat edge fine polishing devices have the same structure, and both include a polishing mechanism and a silicon wafer outer circumference clamping manipulator arranged at the same station.

[0053] The polishing mechanism includes a polishing head rotating spindle, the lower end of which is connected to a synchronous pulley, and the top end is detachably connected to a V-Notch polishing wheel or a flat edge polishing wheel, and the polishing wheel is covered with a polishing cloth. The synchronous pulley is connected to the motor through a synchronous belt, and the motor can drive the synchronous pulley to rotate forward and reverse, thereby driving the polishing head to rotate forward and reverse.

[0054] Semiconductor silicon wafers are generally of two types, with V-Notch or flat edges. The two wafers have different shapes, so different polishing wheels are needed for edge polishing of this part.

[0055] like Figure 2As shown, in order to solve the problem of fixing the silicon wafer when the wafer is polished at the V-Notch part or the flat edge part, and reduce the damage to the non-polished surfaces on the front and back, the present invention provides an outer circumference clamping manipulator mechanism, which includes a clamping claw, a flipping mechanism, a claw feeding guide rail 6, a claw feeding drive motor 7, a silicon wafer pressurizing cylinder 8 and a synchronous belt transmission system 9. After the clamping claw holds the silicon wafer tightly, the flipping mechanism can flip up and down 55° along the flipping axis under the drive of the synchronous belt transmission system, and at the same time, the claw feeding drive motor 7 drives the feeding claw feeding guide rail 6 to move forward, and the claw feeding guide rail 6 is installed on the claw fixing base 5, so the problem of silicon wafer feeding can be met. When the silicon wafer is fed to the point of contacting the polishing wheel, the motor stops running, the silicon wafer pressurizing cylinder 8 is ventilated and extended, driving the claw fixing base 5 to move forward, and the pressure of the silicon wafer pressurizing cylinder 8 can be adjusted and controlled by the pressure valve, so that the polishing pressure of the silicon wafer can be accurately controlled.

[0056] The structure of the gripper is as follows: Figure 4 As shown, the gripper is mainly composed of a rear clamping block 14, a telescopic rod 15, a fixed support column 16 and a front clamping block 17. The front clamping block 17 is fixed to the base by the fixed support column 16 and does not move. The rear clamping block 14 on the other side is fixed to the base by the telescopic rod 15 and can perform telescopic movement. When the external conveying robot takes the silicon wafer, the telescopic rod 15 extends to drive the front clamping block 17 to retreat. When the silicon wafer drops to a suitable position, the telescopic rod 5 retracts again, so that the front clamping block 17 can firmly hold the outer circle of the silicon wafer together with the rear clamping block 14. In order to prevent particles and the like from being left on the back of the silicon wafer, a nozzle is added in the present invention, and the nozzle regularly rinses the back of the wafer, which can effectively solve the problem of residues on the back.

[0057] In order to solve the edge polishing problem of non-V-Notch and flat edge parts, the present invention provides a centrifugal rotating polishing mechanism, such as Figure 5As shown, the mechanism is mainly composed of a rotating polishing head and a suction cup. Since it is edge polishing, the clamping method of the silicon wafer can only be adopted by the back vacuum adsorption method. The suction cup 22 has a built-in vacuum and cleaning pipeline, which can not only adsorb the silicon wafer but also regularly clean the upper surface of the suction cup. A layer of suction cup polishing pad 23 is glued on the suction cup 22 to reduce the pollution to the back of the silicon wafer. The rotating polishing head is mainly composed of a counterweight block 19, a swing rod 20 and a wedge block 21. The shape of the wedge block 21 is consistent with the outer circumference of the silicon wafer. A layer of polishing cloth is glued on the surface with glue, so that it can fit the outer circumference of the silicon wafer. When the rotating polishing head is stationary, the counterweight 19 drives the pendulum rod to rotate, allowing the wedge block 21 to contact the outer circumference of the silicon wafer. When the rotating polishing head rotates at a certain angular velocity, under the action of centrifugal force, the counterweight 19 will be thrown outward, thereby driving the pendulum rod 20 to rotate in the opposite direction, and the wedge block 21 can stick to the outer circumference of the silicon wafer. At the same time, the nozzle provides a certain amount of polishing liquid, which can effectively reduce the polishing temperature and improve the polishing efficiency.

[0058] like Figure 3 As shown, in order to solve the compatibility problem of polishing the V-Notch and flat edge parts, the present invention provides an interchangeable polishing head mechanism, the main body of which mainly includes a transmission synchronous pulley 11 and a polishing head rotating spindle 10. The internal through hole diameters of the V-Notch polishing wheel 12 and the flat edge polishing wheel 13 are the same, and both are fixed by screwing three bolts into the end faces, which is also very convenient to disassemble. The total width of the V-Notch polishing wheel is consistent with the width of the flat edge polishing wheel. There are two polishing cloths on the V-Notch polishing wheel, which can increase the service life of the polishing wheel. When one of the polishing cloths is severely worn, the spare one can be used to continue polishing. The polishing cloth of the flat edge polishing wheel needs to be glued to the outer circumference of the polishing wheel with glue, and the joint interface must be an oblique line, which helps to prevent the generation of debris.

[0059] In order to improve the automation level of the equipment, reduce manual intervention, and realize intelligent polishing, the present invention provides a fully automatic edge polishing solution, such as Figure 6, 7, 8, OHT31 transfers the loading cassette 27 filled with silicon wafers from the previous station to the top of FOUP28, and then descends to FOUP28, and then the silicon wafer loading robot 41 will take out the silicon wafers from the loading cassette 27 one by one and place them on the silicon wafer calibrator 40, and then the front and rear silicon wafer clamping robot 39 inside the equipment will take the silicon wafers from the calibrator 40 to the next process V-Notch and flat edge rough polishing device 38 for preliminary polishing of the V-Notch and flat edge parts, and then further polish the V-Notch and flat edge parts in the V-Notch and flat edge fine polishing device 37. After polishing is completed, an intermediate cleaning mechanism is added, which can fully rinse the upper and lower surfaces of the silicon wafer. Next, the rough edge polishing device 35 performs the initial polishing of the non-V-Notch / flat edge part, and the fine edge polishing device 34 performs the fine edge polishing of the non-V-Notch / flat edge part. After all the polishing processes are completed, the wafers are placed in the unloading cleaning device 33 for the final cleaning, and the unloading manipulator puts the silicon wafers back into the unloading sheet box 30 immersed in the unloading water tank 32. Finally, the unloading sheet box 30 is taken away by the AGV trolley. The whole process is fully automated and does not require manual intervention.

[0060] like Fig. 9 As shown, the loading robot provided by the present invention can be purchased directly from the market without the need for additional design, manufacturing and assembly. For example, the SCR series robot produced by Japan's JEL company has multiple degrees of freedom, and the claws also use an external circle clamping method, which will not cause damage to the front and back sides of the silicon wafer.

[0061] like Fig.10 As shown in FIG11 , in the fully automatic edge polishing device of the present invention, the transfer of the internal silicon wafer is all carried out by a manipulator. The manipulators are of two types, one is a front and rear clamping manipulator 39 for silicon wafers, and the other is a left and right clamping manipulator 42 for silicon wafers. The left and right clamping manipulator 42 for silicon wafers has a flip function, which can meet the special needs of customers for silicon wafer unloading. The front and rear clamping manipulator 39 for silicon wafers is mainly composed of a clamping roller 44, a gripper opening and closing cylinder 45, and a gripper lifting cylinder 46. The left and right clamping manipulator 42 for silicon wafers is mainly composed of a clamping roller 44, a gripper flip opening and closing cylinder 47, and a gripper lifting cylinder 46.

[0062] Finally, it should be noted that the above examples are only specific embodiments of the present invention. Obviously, the present invention is not limited to the above examples, and there are many variations. All variations that can be directly derived or associated with the content disclosed by a person skilled in the art should be considered as the protection scope of the present invention.

Claims

1. A fully automatic edge polishing device for semiconductor silicon wafers, characterized in that: It includes an operation panel, a cabinet, a loading and unloading device, a manipulator device and a polishing device; The cabinet is a cubic box structure, and the loading and unloading device includes an aerial unmanned transport vehicle and an AGV trolley; a feed port and a discharge port are symmetrically opened on the right wall of the cabinet, and a silicon wafer loading manipulator and a discharge water tank are correspondingly arranged beside the feed port and the discharge port inside the cabinet, and a wafer transfer box, an aerial unmanned transport vehicle and an AGV trolley are arranged on the right side of the cabinet body; the aerial unmanned transport vehicle is used for loading the device, and the AGV trolley is used for unloading the device; The manipulator device includes a linear motion mechanism arranged on three sides of the cabinet except the right side, and a plurality of front and rear silicon wafer clamping manipulators and left and right silicon wafer clamping manipulators are arranged on the linear motion mechanism. The front and rear silicon wafer clamping manipulators include an L-shaped support frame, the bottom of the support frame is connected to the linear motion mechanism through a hand claw lifting cylinder, and a hand claw opening and closing cylinder is arranged on the side of the support frame, and the hand claw opening and closing cylinder is connected to the silicon wafer clamping roller, and the silicon wafer clamping roller on the hand claw opening and closing cylinder is arranged in the axial direction of the output end of the hand claw opening and closing cylinder; the left and right silicon wafer clamping manipulators include an L-shaped support frame, the bottom of the support frame is connected to the linear motion mechanism through a hand claw lifting cylinder, and a hand claw flip opening and closing cylinder is arranged on the side of the support frame, and the hand claw flip opening and closing cylinder is connected to the silicon wafer clamping roller, and the silicon wafer clamping rollers on the hand claw flip opening and closing cylinder are respectively arranged on both sides of the axial direction of the output end of the hand claw flip opening and closing cylinder; The polishing device includes a silicon wafer calibrator, a V-Notch and a flat edge rough polishing device, a V-Notch and a flat edge fine polishing device, and an intermediate cleaning device, which are sequentially arranged inside the cabinet behind the feed port. The V-Notch and the flat edge rough polishing device, and the V-Notch and the flat edge fine polishing device have the same structure, and both include a polishing mechanism and a silicon wafer outer circumference clamping manipulator arranged at the same station; The polishing mechanism includes a polishing head rotating spindle, the lower end of which is connected to a synchronous belt wheel, and the top end is detachably connected to a V-Notch polishing wheel or a flat edge polishing wheel, and a polishing cloth is covered on the polishing wheel; the synchronous belt wheel is connected to the motor through a synchronous belt, and the motor can drive the synchronous belt wheel to rotate forward and reverse, thereby driving the polishing head to rotate forward and reverse; The silicon wafer outer circumference clamping manipulator comprises a gripper fixing base and a clamping gripper, the bottom of the gripper fixing base is arranged on a gripper feeding guide rail through a slider, and a gripper feeding driving motor is arranged on the gripper feeding guide rail; a silicon wafer pressurizing cylinder and a synchronous pulley are also arranged at the bottom of the gripper fixing base, a horizontal flip shaft is arranged at the top of the gripper fixing base, one end of the flip shaft is connected to the clamping gripper through a flip arm, and the other end is connected to the synchronous pulley through a synchronous belt, and the synchronous pulley is connected to the driving motor; The clamping claw includes a support block and a front clamping block and a rear clamping block which are arranged at the left and right ends of the upper end surface of the support block. The front clamping block is connected to the support block through a fixed support column, and the rear clamping block is connected to one end of a telescopic rod, and the other end of the telescopic rod is connected to a cylinder arranged at the lower part of the support block. The silicon wafer is clamped between the front and rear clamping blocks. The polishing device also includes a material discharge cleaning device, an edge fine polishing device and an edge rough polishing device which are arranged in sequence behind the material discharge water tank in the cabinet. The edge rough polishing device is used for rough polishing of non-V-Notch / flat edge parts, and the edge fine polishing device is used for edge fine polishing of non-V-Notch / flat edge parts.

2. A semiconductor silicon wafer fully automatic edge polishing device according to claim 1, characterized in that: The silicon wafer outer circumference clamping manipulator is also provided with a nozzle for regularly flushing the back side of the wafer to solve the problem of residue on the back side.

3. A polishing method using the semiconductor silicon wafer fully automatic edge polishing device according to claim 1, characterized in that: The steps are: (1) The aerial unmanned transport vehicle places the silicon wafer box that needs edge polishing on the wafer transfer box carrier; (2) The wafer transfer box starts the automatic cover opening and scanning function to read the position parameters of each silicon wafer; (3) The silicon wafer loading robot takes out the silicon wafers from the wafer box one by one and places them on the silicon wafer calibrator to calibrate the V-Notch / flat edge position; (4) The front and rear clamping manipulators transfer the silicon wafer to the V-Notch and flat edge rough polishing and fine polishing stations, and first perform edge polishing of the V-Notch or flat edge; (5) Before rough polishing and fine polishing of the edge, the polishing liquid and particles generated during the polishing process need to be cleaned at the intermediate cleaning station to avoid pits and scratches on the edge during subsequent polishing; (6) When all edges are polished, the left and right gripping manipulators move the silicon wafer to the unloading and cleaning station to clean the remaining polishing liquid and polishing particles; (7) The polished wafers are placed in a wafer box in the unloading tank. When the entire wafer box is filled with wafers, the AGV will automatically come over to take away the entire wafer box and place an empty wafer box at the same time.

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