Method for manufacturing display device and device for manufacturing display device

Abstract

The present disclosure relates to a method for manufacturing a display device and a device for manufacturing a display device. The method for manufacturing a display device includes: fixing a display panel to a stand; attaching a printed circuit board to a first side surface of the fixed display panel; and irradiating the first side surface of the display panel with light from a first lighting device, and irradiating a second side surface of the display panel opposite to the first side surface of the display panel with light from a second lighting device to check the alignment of the printed circuit board.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and all rights arising from Korean Patent Application No. 10-2019-0124415, filed on October 8, 2019, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present disclosure relates to a method of manufacturing a display device and an apparatus for manufacturing a display device. Background Art

[0004] A display device is a device configured to display video or still images, and can be used not only as a display screen for each of portable electronic devices such as mobile phones, smart phones, tablet PCs, smart watches, watch phones, mobile communication terminals, electronic notebooks, electronic books, portable multimedia players ("PMP"), navigation devices, and ultra mobile personal computers ("UMPC"), but also as a display screen for each of various products such as televisions, notebook computers, monitors, billboards, or the Internet of Things.

[0005] In order to drive the light-emitting element of the display device, a printed circuit board including a driving circuit, a plurality of signal lines configured to electrically connect the light-emitting element, and a plurality of leads connected to the plurality of signal lines are generally used. The display device includes a display area in which an image is displayed and a portion configured to surround the display area and in which no image is displayed, i.e., a frame. In order to realize a frameless display device, the signal lines and the leads may be joined at the side surface of the display device. Summary of the invention

[0006] Exemplary embodiments of the present invention provide a method of manufacturing a display device, wherein the method is capable of checking alignment between a side pad and a lead bonded at a side surface of a display panel.

[0007] Another exemplary embodiment of the present invention provides an apparatus for manufacturing a display device, wherein the apparatus is capable of checking alignment between a side pad and a lead bonded at a side surface of a display panel.

[0008] However, the features of the present invention are not limited to the features set forth herein. The above and other features of the present invention will become more apparent to one of ordinary skill in the art to which the present invention pertains by referring to the detailed description of the present invention given below.

[0009] According to an exemplary embodiment, a method for manufacturing a display device includes: an operation of fixing a display panel to a stand; an operation of attaching a printed circuit board to a first side surface of the fixed display panel; and an operation of irradiating the first side surface of the display panel with light from a first lighting device and irradiating a second side surface of the display panel opposite to the first side surface of the display panel with light from a second lighting device to check the alignment of the printed circuit board.

[0010] In an exemplary embodiment, in the operation of fixing the display panel to the stage, the display panel may be fixed by suctioning air in a vacuum hole of the stage.

[0011] In an exemplary embodiment, between the operation of fixing the display panel and the operation of attaching the printed circuit board, the method may further include an operation of flipping the stage to allow the display panel to stand.

[0012] In an exemplary embodiment, in the operation of flipping the stage to allow the display panel to stand, the stage may maintain the display panel fixed.

[0013] In an exemplary embodiment, in the operation of turning over the stage to allow the display panel to stand, a stopper of the stage may fix the second side surface of the display panel.

[0014] In an exemplary embodiment, in the operation of attaching the printed circuit board to the first side surface of the fixed display panel, the printed circuit board may be attached to the first side surface of the display panel in a state in which the display panel stands.

[0015] In an exemplary embodiment, in the operation of irradiating the second side surface of the display panel opposite to the first side surface of the display panel with light from the second lighting device, the second lighting device may be embedded in the stage.

[0016] In an exemplary embodiment, the second lighting device may be disposed in the stopper of the stage.

[0017] In an exemplary embodiment, the operation of illuminating the second side surface of the display panel opposite to the first side surface of the display panel with light from the second lighting device to check the alignment of the printed circuit board may include an operation of reflecting the light irradiated from the second lighting device by a reflective layer provided between the display panel and the stage to check the alignment of the printed circuit board.

[0018] In an exemplary embodiment, in the operation of attaching the printed circuit board to the first side surface of the fixed display panel, the printed circuit board may be attached to the first side surface of the display panel in a state where the display panel lies flat.

[0019] In an exemplary embodiment, the display panel may include a liquid crystal display panel.

[0020] In an exemplary embodiment, the operation of checking the alignment of the printed circuit board may include an operation of checking an alignment between a side surface pad disposed on the first side surface of the display panel and a lead of the printed circuit board.

[0021] In an exemplary embodiment, the operation of inspecting the alignment of the printed circuit board may include an operation of inspecting an indentation caused by a conductive ball of an anisotropic conductive film disposed between the side surface pad and the lead.

[0022] According to another exemplary embodiment, an apparatus for manufacturing a display device includes: a substrate placement and fixing component, which places a display panel thereon and fixes the display panel; a stopper, which is connected to the substrate placement and fixing component and is arranged on a second side surface of the display panel; and a light source component, which is connected to the stopper and irradiates the second side surface of the display panel with illumination light.

[0023] In an exemplary embodiment, the substrate seating and fixing member may define a plurality of vacuum holes passing through a surface thereof in a thickness direction.

[0024] In an exemplary embodiment, the light source part may be disposed in the stopper.

[0025] In an exemplary embodiment, the illumination light irradiated from the light source part may travel from the second side surface of the display panel to a first side surface of the display panel opposite to the second side surface of the display panel.

[0026] In an exemplary embodiment, the apparatus for manufacturing a display device may further include a reflective layer disposed on a main surface of the substrate seating and fixing part, wherein the reflective layer may reflect the illumination light provided from the light source part.

[0027] In an exemplary embodiment, the apparatus for manufacturing a display device may further include a flipping part, wherein the flipping part may allow the lying display panel to stand up.

[0028] In an exemplary embodiment, the stopper may support the second side surface of the display panel opposite to the first side surface of the standing display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The above and other aspects and features of the present disclosure will become more apparent by describing in detail exemplary embodiments of the present disclosure with reference to the accompanying drawings, in which:

[0030] Figure 1 is a flowchart of a method of manufacturing a display device according to an exemplary embodiment;

[0031] Figure 2 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Fig.10 is a perspective view of a process operation of a method of manufacturing a display device according to an exemplary embodiment;

[0032] Figure 3 It is along Figure 2 A cross-sectional view taken along line II';

[0033] Figure 8 It is along Figure 7 A cross-sectional view taken along line II-II';

[0034] Fig. 9 yes Figure 8 A partial view of

[0035] Fig.11 It is along Fig.10 A cross-sectional view taken along line III-III';

[0036] Fig.12 According to another exemplary embodiment, Fig.10 A cross-sectional view taken along line III-III';

[0037] Fig.13 is a block diagram of an apparatus for manufacturing a display device according to an exemplary embodiment;

[0038] Fig.14 , Fig.16 and Fig.17 is a perspective view of a process operation of a method of manufacturing a display device according to another exemplary embodiment; and

[0039] Fig.15 It is along Fig.14 A cross-sectional view taken along line IV-IV'. DETAILED DESCRIPTION

[0040] With reference to the exemplary embodiments that will be described in detail in conjunction with the accompanying drawings, the advantages and features of the present disclosure and the methods for achieving the above advantages and features will be clear and understandable. However, the present disclosure is not limited to the exemplary embodiments that will be described below and can be implemented in different forms. That is, the present disclosure is limited only by the scope of the claims.

[0041] The situation that an element or layer is "above" or "on" another element or layer includes not only the situation that the element or layer is directly on another element or layer, but also includes the situation that another element or layer is between the element or layer and the other element or layer. On the other hand, the situation that the element or layer is "directly on" another element or layer or "directly on" another element or layer "above" refers to the situation that there is no other element or layer between the element or layer and the other element or layer. It will be understood that, although the terms "first", "second", "third", etc. can be used in this article to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish an element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings herein, the "first element", "first component", "first region", "first layer" or "first part" discussed below can be named as the second element, second component, second region, second layer or second part. The terms used herein are only for the purpose of describing a specific embodiment, and are not intended to be restrictive. As used herein, unless the context clearly indicates otherwise, "one", "a kind of", "the (the)" and "at least one (kind)" do not represent quantitative limitations, and are intended to cover both the singular and the plural. For example, unless the context clearly indicates otherwise, "an element" has the same meaning as "at least one element". "At least one (kind)" should not be interpreted as being limited to "one" or "a kind". "Or" means "and / or". As used herein, the term "and / or" includes any combination and all combinations of one or more related listed items. It will also be understood that when used in this specification, the term "comprising" and / or "including" or "having" and / or "containing" indicates the presence of stated features, regions, wholes, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, regions, wholes, steps, operations, elements, components and / or their groups. In addition, relative terms such as "lower" or "bottom" and "upper" or "top" may be used herein to describe the relationship between an element and another element as shown in the accompanying drawings. It will be understood that relative terms are intended to encompass different orientations of a device in addition to the orientation depicted in the drawings. For example, if a device is flipped in one drawing, an element described as being on the "lower" side of other elements will subsequently be oriented to be on the "upper" side of the other elements. Thus, depending on the specific orientation of the drawings, the exemplary term "lower" may encompass both "lower" and "upper" orientations. Similarly, if a device is flipped in one drawing, an element described as being "below" or "below" other elements will subsequently be oriented to be "above" other elements. Thus, the exemplary terms "below" or "below" may encompass both "upper" and "lower" orientations.

[0042] Throughout the specification, the same reference numerals will be used for the same or like components.

[0043] Hereinafter, exemplary embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0044] Figure 1 is a flowchart of a method of manufacturing a display device according to an exemplary embodiment, Figure 2 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Fig.10 is a perspective view of a process operation of a method of manufacturing a display device according to an exemplary embodiment, Figure 3 It is along Figure 2 A cross-sectional view taken along line II' of Figure 8 It is along Figure 7 A cross-sectional view taken along line II-II', Fig. 9 yes Figure 8 A partial view of Fig.11 It is along Fig.10 A cross-sectional view taken along line III-III'.

[0045] Reference Figures 1 to 11 , a method of manufacturing a display device according to an exemplary embodiment may include an operation S10 of fixing a display panel to a stand; an operation S20 of flipping the stand to allow the display panel to stand; an operation S30 of attaching a printed circuit board to one side surface (first side surface) of the fixed display panel; and an operation S40 of irradiating one side surface (first side surface) of the display panel with light from a lighting device (first lighting device) and irradiating another side surface (second side surface) of the display panel opposite to the one side surface (first side surface) of the display panel with light from another lighting device (second lighting device) to check alignment of the printed circuit board.

[0046] First, refer to Figures 1 to 3 , providing a target panel 1 or a display panel.

[0047] The target panel 1 may include a first substrate 100 including a first base substrate 101 , a second substrate 200 facing the first substrate 100 , and a plurality of connection lines 110 disposed between the first base substrate 101 and the second substrate 200 .

[0048] As the target panel 1, for example, an organic light emitting display panel may be applied. In an exemplary embodiment to be described later, although an example in which an organic light emitting display panel is applied as the target panel 1 is described, the present disclosure is not limited thereto, but various display panels such as a liquid crystal display ("LCD") panel, a quantum dot organic light emitting display ("QD-OLED") panel, a quantum dot liquid crystal display ("QD-LCD") panel, a quantum nano light emitting display panel ("Nano LED"), and a micro LED panel may be applied as the target panel 1.

[0049] The first substrate 100 may further include various elements disposed on the first base substrate 101 , and the second substrate 200 may further include a second base substrate and various elements disposed on the second base substrate.

[0050] Various elements of the first substrate 100 may include a plurality of insulating layers, a plurality of conductive layers, at least one thin film transistor, and an organic light emitting element connected to the at least one thin film transistor.

[0051] That is, the first substrate 100 may be a thin film transistor substrate or a backplane substrate including at least one thin film transistor.

[0052] The second substrate 200 may face the first substrate 100 and may be disposed on the first substrate 100. The second substrate 200 may include an encapsulation substrate configured to encapsulate the organic light emitting element of the first substrate 100.

[0053] Each of the first base substrate 101 of the first substrate 100 and the second base substrate 200 may include a base substrate. Each of the base substrate of the first substrate 100 and the base substrate of the second substrate 200 may include a rigid material such as glass or quartz.

[0054] The target panel 1 may further include a connection line 110 disposed between the first base substrate 101 and the second substrate 200 .

[0055] The target panel 1 may have a rectangular shape in which each corner has a right angle in a plan view. The target panel 1 may have a long side and a short side. The short side of the target panel 1 may be a side extending in the second direction DR2. The long side of the target panel 1 may be a side extending in the first direction DR1. The first substrate 100 and the second substrate 200 may have substantially the same planar shape.

[0056] The target panel 1 may include a display area DA at a central portion thereof and a non-display area NA around the display area DA. The display area DA may include a plurality of pixels PX. The non-display area NA may be an area not including the plurality of pixels PX.

[0057] A sealing member SEAL may be disposed in the non-display area NA of the target panel 1. The sealing member SEAL may be disposed between the first substrate 100 and the second substrate 200 in the non-display area NA to combine the first substrate 100 and the second substrate 200.

[0058] The connection line 110 may pass through the non-display area NA (e.g., the lower short side portion of the non-display area NA in the first direction DR1) from the display area DA of the first substrate 100. The connection line 110 may be electrically connected to the pixel PX in the display area DA. Since the connection line 110 extends to the first side surface of one end of each of the first substrate 100 and the second substrate 200, the first side surface of the connection line 110 and the first side surface of each of the first substrate 100 and the second substrate 200 may be aligned in the thickness direction (i.e., the third direction DR3).

[0059] The first base substrate 101 of the first substrate 100 may further include a first side surface of one end portion like the first side surface of the first substrate 100. The first side surfaces of the first base substrate 101, the connection line 110, and the second substrate 200 may be aligned in the third direction DR3.

[0060] The connection line 110 may be plural in number. A plurality of connection lines 110 may be disposed to be spaced apart from each other in the second direction DR2.

[0061] The connection line 110 may include one or more metals selected from molybdenum (Mo), aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta), tungsten (W) and copper (Cu).

[0062] An outer surface of the sealing member SEAL may be aligned with a first side surface of each of the first substrate 100 and the second substrate 200 , but the present invention is not limited thereto.

[0063] A side surface pad SPAD may be further provided on a first side surface of each of the first substrate 100 and the second substrate 200. The side surface pad SPAD may be electrically connected to a lead of a printed circuit board to be described later.

[0064] The first side surface of each of the first substrate 100 and the second substrate 200 may be polished before the side surface pad SPAD is disposed thereon. More specifically, a polishing device (not shown) is disposed on the first side surface of the first base substrate 101, the first side surface of the second substrate 200, and the first side surface of each of the plurality of connecting lines 110, and may polish the first side surface of the first base substrate 101, the first side surface of the second substrate 200, and the first side surface of each of the plurality of connecting lines 110 as it moves along the surface. The polishing device may include, for example, a wheel device. The wheel device may have a circular planar shape relative to the second direction DR2. The wheel device having a circular planar shape may have a central axis extending in the second direction DR2 by forming a circular shape, and may polish the first side surface of the first base substrate 101, the first side surface of the second substrate 200, and the first side surface of each of the plurality of connecting lines 110.

[0065] Therefore, since the first side surface portion of each of the first substrate 100 and the second substrate 200 (for example, the lower short side portion in the first direction DR1) is polished, after polishing, the first side surface of the first substrate 100 and the first side surface of the second substrate 200 can be aligned in the direction in which the second substrate 200 faces the first substrate 100 (i.e., the third direction DR3).

[0066] A plurality of side surface pads SPAD may be disposed on the polished first side surface of the first substrate 100 , the first side surface of the second substrate 200 , and the first side surfaces of the plurality of connection lines 110 .

[0067] The side surface pads SPAD may be disposed to be spaced apart from each other in the second direction DR2. The side surface pads SPAD may be disposed to be in contact with the connection lines 110 corresponding thereto in the first direction DR1.

[0068] Reference Figure 1 and Figure 4 , providing a stand 400.

[0069] The stage 400 may include a substrate seating and adsorption part 410 , a stopper 430 connected to the substrate seating and adsorption part 410 , and a light source part 450 connected to the stopper 430 .

[0070] The substrate placement and adsorption member 410 of the stage 400 may have a rectangular shape in a plan view (i.e., a view observed from the third direction DR3). The substrate placement and adsorption member 410 may have a shape substantially the same as the plan shape of the above-mentioned target panel 1. Since the size of the substrate placement and adsorption member 410 in a plan view may be larger than the size of the target panel 1 in a plan view, sufficient space on which the target panel 1 is placed may be provided on the substrate placement and adsorption member 410.

[0071] like Figure 4 As shown in , the substrate seating and adsorption member 410 may define a plurality of vacuum holes VH that pass through the substrate seating and adsorption member 410 in a thickness direction (ie, the third direction DR3) from a surface thereof. Figure 4 Although the number of vacuum holes VH arranged in each of the first direction DR1 and the second direction DR2 is described as three, the present disclosure is not limited thereto, and the number of vacuum holes VH arranged in each of the first direction DR1 and the second direction DR2 may be two or four or more, and the vacuum holes VH may be arbitrarily arranged differently from the above.

[0072] Since the substrate seating and adsorption component 410 defines a plurality of vacuum holes VH, when the target panel 1 is seated on the substrate seating and adsorption component 410, the substrate seating and adsorption component 410 may be used to stably support the target panel 1 by adsorbing the seated target panel 1 by suctioning in the vacuum holes VH in the third direction DR3.

[0073] The stopper 430 may be disposed at a first side of the substrate seating and adsorption part 410 in the first direction DR1. The stopper 430 may extend along the second direction DR2. The stopper 430 may be disposed on a main surface of the substrate seating and adsorption part 410. However, the present disclosure is not limited thereto, and the stopper 430 may be configured in a state where it is not disposed on the main surface of the substrate seating and adsorption part 410 and is attached or connected to a side surface of the substrate seating and adsorption part 410.

[0074] As will be described later, when the target panel 1 is turned over in the direction of gravity (ie, so that Figure 6 The target panel 1 is provided with a first side surface of the target panel 1, the long side of the target panel 1 extending along the third direction DR3, the stopper 430 supports the target panel 1 so as to allow the target panel 1 to stand before the printed circuit board is attached to the first side surface of the target panel 1, and the stopper 430 can be used to support the second side surface of the target panel 1 opposite to the first side surface of the target panel 1. As used herein, "standing" means Figure 6 The target panel 1 is arranged as shown in , that is, the long side of the target panel 1 extends along the direction of gravity.

[0075] The light source part 450 may include a plurality of lighting devices. For example, the light source part 450 may include a first lighting device.

[0076] As will be described later, the light source component 450 can be used to check whether there is a fault in the alignment between the target panel 1 and the printed circuit board attached to the first side surface of the target panel 1 by irradiating light onto the second side surface of the target panel 1 (i.e., the side surface of the target panel 1 facing the light source component 450).

[0077] like Figure 4 As shown in FIG. 4 , the light source part 450 may be disposed to be embedded in the stage 400. More specifically, the light source part 450 may be disposed in the stopper 430. The light source part 450 may be disposed to be aligned with an inner side surface of the stopper 430.

[0078] Then, refer to Figure 1 and Figure 5 , the target panel 1 is set on the stage 400 (operation S10 ). That is, the target panel 1 may be fixed to the stage 400 .

[0079] The operation S10 of fixing the target panel 1 to the stage 400 may include an operation of disposing the target panel 1 on the substrate disposing and adsorbing part 410 of the stage 400, and an operation of fixing the disposed target panel 1 through the above-mentioned vacuum hole VH of the substrate disposing and adsorbing part 410 of the stage 400. Since the lower surface of the target panel 1 (i.e., the surface of the target panel 1 facing the substrate disposing and adsorbing part 410) is adsorbed by suction in the vacuum hole VH, the target panel 1 may be firmly fixed to the substrate disposing and adsorbing part 410.

[0080] The second side surface of the target panel 1 may face the stopper 430 , and further, may face the light source part 450 provided in the stopper 430 .

[0081] Then, refer to Figure 1 and Figure 6 , the target panel 1 is made to stand by turning over the stage 400 (operation S20).

[0082] In operation S20 of standing the target panel 1 by flipping the stage 400, the stage 400 and the target panel 1 may be flipped together in a previous thickness direction (i.e., the third direction DR3) before flipping, and the substrate seating and adsorption part 410 of the stage 400 and the long sides of the target panel 1 may stand to extend in the third direction DR3.

[0083] Therefore, the stopper 430 of the stage 400 may be located at the lower side in the third direction DR3.

[0084] In operation S20 in which the target panel 1 stands by turning over the stage 400 , the vacuum holes VH of the stage 400 may fix the target panel 1 .

[0085] In operation S20 of standing the target panel 1 by turning over the stage 400, the stopper 430 of the stage 400 may fix the second side surface of the target panel 1. That is, the stopper 430 may directly contact the second side surface of the target panel 1 to fix the second side surface of the target panel 1 to the stopper 430.

[0086] Then, refer to Figure 1 and Figures 7 to 9 , the printed circuit board 500 is attached to the first side surface of the target panel 1 (operation S30).

[0087] In operation S30 of attaching the printed circuit board 500 to the first side surface of the target panel 1 , the printed circuit board 500 may be attached to the first side surface of the target panel 1 in a state in which the target panel 1 stands.

[0088] The printed circuit board 500 may include a base film, a plurality of leads LE disposed on the base film, and a driving integrated circuit 550 disposed on the base film and connected to the plurality of leads LE.

[0089] The driving integrated circuit 550 according to an exemplary embodiment may be implemented as a data driving chip, and may be implemented in a chip on film (“COF”) manner in which the chip is formed on the printed circuit board 500 as described above, but the present invention is not limited thereto.

[0090] The plurality of lead wires LE may be electrically connected to the side surface pads SPAD of the target panel 1 .

[0091] Between the side surface pads SPAD and the leads LE, an anisotropic conductive film AM may be provided. The anisotropic conductive film AM may include a resin layer and a plurality of conductive balls dispersed in the resin layer.

[0092] The operation S30 of attaching the printed circuit board 500 to the first side surface of the target panel 1 may include operations of disposing the anisotropic conductive film AM on the side surface pads SPAD and disposing the printed circuit board 500 on the anisotropic conductive film AM.

[0093] In the operation of disposing the printed circuit board 500 on the anisotropic conductive film AM, the printed circuit board 500 may be disposed so that the leads LE and the side surface pads SPAD of the printed circuit board 500 may be aligned in the first direction DR1.

[0094] A conductive ball of the anisotropic conductive film AM may be provided between the side surface pad SPAD and the lead LE for short-circuiting the side surface pad SPAD and the lead LE.

[0095] In the operation of attaching the side surface pads SPAD and the printed circuit board 500 through the anisotropic conductive film AM, the anisotropic conductive film AM may be compressed and hardened by heating while pressing the printed circuit board 500 in a direction toward the side surface pads SPAD.

[0096] In the method of manufacturing a display device according to an exemplary embodiment, in operation S30 of attaching the printed circuit board 500 to the first side surface of the target panel 1, since the printed circuit board 500 is attached to the first side surface of the target panel 1 in a state where the target panel 1 stands, the compression direction of the anisotropic conductive film AM may be the same as the gravity direction (i.e., the direction opposite to the third direction DR3). Therefore, the anisotropic conductive film AM may be more easily compressed.

[0097] Reference Figure 8 The side surface pad SPAD may be disposed to contact the first side surface 101S of the first base substrate 101 and the first side surface 110S of each of the connection lines 110 , and the first side surface 200S of the second substrate 200 .

[0098] The anisotropic conductive film AM may be disposed between the side surface pads SPAD and the leads LE of the printed circuit board 500. As described above, the substrate placement and adsorption part 410 of the stage 400 may define a plurality of vacuum holes VH. While the stage 400 adsorbs one main surface of the target panel 1 (i.e., one main surface facing the substrate placement and adsorption part 410) in the second direction DR2 by suction in the plurality of vacuum holes VH to fix the target panel 1 to the substrate placement and adsorption part 410, the above-mentioned stopper 430 of the stage 400 may be disposed in contact with the second side surface of the target panel 1 for supporting the second side surface of the target panel 1.

[0099] Reference Fig. 9 , the leads LE may be aligned in the first direction DR1. Each of the leads LE may extend along the second direction DR2. The printed circuit board 500 may be aligned so that the leads LE and the side surface pads SPAD may correspond to each other. The plurality of leads LE may be disposed on the first side surfaces 101S and 110S of the first substrate 100, the first side surface SEALS of the sealing member SEAL, and the first side surface 200S of the second substrate 200.

[0100] Then, refer to Figure 1 , Fig.10 and Fig.11, a first side surface of the target panel 1 is illuminated with light (illumination light) from the second lighting device 600, and a second side surface of the target panel 1 opposite to the first side surface of the target panel 1 is illuminated with light from the first lighting device to check the alignment of the printed circuit board 500 (operation S40).

[0101] In the operation of irradiating a second side surface of the target panel 1 opposite to the first side surface of the target panel 1 (ie, a side surface of the target panel 1 facing the light source part 450 ) with light from the first lighting device, the light source part 450 may include the first lighting device.

[0102] As described above, the light source part 450 may be embedded in the stage 400, and more specifically, may be disposed in the stopper 430 of the stage 400. Therefore, the first lighting device may be disposed in the stopper 430.

[0103] The second lighting device 600 may irradiate illumination light toward the printed circuit board 500 on the first side surface of the target panel 1 .

[0104] Reference Fig.10 and Fig.11 In the operation of irradiating illumination light toward the printed circuit board 500 on the first side surface of the target panel 1 through the second illumination device 600, the second illumination device 600 may be disposed on a first main surface of the printed circuit board 500 opposite to a second main surface of the printed circuit board 500 facing the target panel 1. The second illumination device 600 may include the same light emitting unit as the first illumination device, but the present invention is not limited thereto.

[0105] like Fig.11 As shown in , the second lighting device 600 may irradiate the illumination light obliquely with respect to the extension direction of the second main surface of the printed circuit board 500 (ie, the second direction DR2 ).

[0106] In addition, light from the first lighting device of the light source part 450 may be irradiated toward the first side surface of the target panel 1 .

[0107] The operation S40 of checking the alignment of the printed circuit board 500 may include an operation of checking the alignment between the side surface pads SPAD disposed on the first side surface of the target panel 1 and the leads LE of the printed circuit board 500 .

[0108] Furthermore, the operation S40 of inspecting the alignment of the printed circuit board 500 may include an operation of inspecting an indentation caused by a conductive ball of the anisotropic conductive film AM disposed between the side surface pads SPAD and the leads LE.

[0109] As described above, the method of manufacturing a display device according to an exemplary embodiment may include an operation of attaching a printed circuit board 500 to a first side surface of a target panel 1. In the operation of determining whether the alignment between the attached printed circuit board 500 and the side surface pad SPAD of the target panel 1 is faulty, if only the second lighting device 600 is used, the amount of light used to determine whether the alignment between the side surface pad SPAD and the lead LE is faulty may be insufficient. In addition, since the illumination light irradiated from the second lighting device 600 to the first side surface of the target panel 1 is reflected by the lead LE, the side surface pad SPAD, and the side surface of the base substrate of the target panel 1, it may not be easy to check the alignment of the printed circuit board 500 by contrasting the brightness. Therefore, it may be difficult to determine whether the alignment between the lead LE and the side surface pad SPAD is faulty.

[0110] However, in the method of manufacturing a display device according to an exemplary embodiment, when determining whether the printed circuit board 500 is well aligned, since the illumination light provided from the above-mentioned light source part 450 of the stand 400 travels toward the printed circuit board 500 on the first side surface of the target panel 1, the insufficient amount of light using only the second lighting device 600 can be compensated by the additional light from the light source part 450.

[0111] Hereinafter, another exemplary embodiment will be described. In the following exemplary embodiment, the same components as those in the above-described exemplary embodiment will be denoted by the same reference numerals, and description of the components will be omitted or simplified.

[0112] Fig.12 According to another exemplary embodiment, Fig.10 A cross-sectional view taken along line III-III'.

[0113] Reference Fig.12 , a method of manufacturing a display device according to an exemplary embodiment and Figure 1 The difference in the method of manufacturing a display device is that the operation of checking the alignment of the printed circuit board 500 by irradiating light from the first lighting device onto the second side surface of the target panel 1 opposite to the first side surface of the target panel 1 includes: an operation of reflecting the light irradiated from the first lighting device to check the alignment of the printed circuit board 500 by a reflective layer 440 arranged between the target panel 1 and the substrate placement and adsorption component 410 of the stand 400_1.

[0114] More specifically, in the method of manufacturing a display device according to an exemplary embodiment, the operation of checking the alignment of the printed circuit board 500 by irradiating light from a first lighting device onto a second side surface of the target panel 1 opposite to the first side surface of the target panel 1 may include: an operation of reflecting the light irradiated from the first lighting device to check the alignment of the printed circuit board 500 by a reflective layer 440 provided between the target panel 1 and the base mounting and adsorption component 410 of the stand 400_1.

[0115] That is, the stage 400_1 according to the exemplary embodiment may further include a reflective layer 440 provided on the main surface of the substrate seating and adsorption part 410 facing the target panel 1. As described above, the reflective layer 440 may be used to reflect the light traveling to the substrate seating and adsorption part 410 among the illumination light provided from the first illumination device, so that the reflected light may travel again in the direction opposite to the direction toward the substrate seating and adsorption part 410. Therefore, the amount of light provided from the light source part 450 toward the first side surface of the target panel 1 and the printed circuit board 500 may be increased.

[0116] As described above, the method of manufacturing a display device according to an exemplary embodiment may further include an operation of attaching the printed circuit board 500 to the first side surface of the target panel 1. In the operation of determining whether the alignment between the attached printed circuit board 500 and the side surface pad SPAD of the target panel 1 is faulty, if only the second lighting device 600 is used, the amount of light used to determine whether the alignment between the side surface pad SPAD and the lead LE is faulty may be insufficient. In addition, since the illumination light irradiated from the second lighting device 600 to the first side surface of the target panel 1 is reflected by the lead LE, the side surface pad SPAD, and the side surface of the base substrate of the target panel 1, it may not be easy to check the alignment of the printed circuit board 500 by contrasting the brightness. Therefore, it may be difficult to determine whether the alignment between the lead LE and the side surface pad SPAD is faulty.

[0117] However, in the method of manufacturing a display device according to an exemplary embodiment, when determining whether the printed circuit board 500 is aligned, since the light provided from the above-mentioned light source part 450 of the stand 400_1 travels toward the printed circuit board 500 on the first side surface of the target panel 1, the insufficient amount of light using only the second lighting device 600 can be compensated by the light provided from the above-mentioned light source part 450.

[0118] Fig.13 is a block diagram of an apparatus for manufacturing a display device according to an exemplary embodiment.

[0119] Reference Fig.13, an apparatus 700 for manufacturing a display device according to an exemplary embodiment may include a substrate seating and adsorption part 710 , a stopper 720 , a reversing part 730 , and a light source part 740 .

[0120] The apparatus 700 for manufacturing a display device according to an exemplary embodiment may have Figure 4 . More specifically, the substrate placement and adsorption member 710 of the apparatus 700 for manufacturing a display device may have a rectangular shape in a plan view. The substrate placement and adsorption member 710 may have a shape substantially the same as the plan shape of the target panel 1 described above. The size of the substrate placement and adsorption member 710 in a plan view may be larger than the size of the target panel 1 in a plan view, and thus sufficient space on which the target panel 1 is placed may be provided on the substrate placement and adsorption member 710.

[0121] and Figure 4 Likewise, the substrate seating and adsorption member 710 may define a plurality of vacuum holes VH penetrating the substrate seating and adsorption member 710 from a surface thereof in a thickness direction.

[0122] Since the substrate seating and adsorption member 710 defines a plurality of vacuum holes VH, when the target panel 1 is seated on the substrate seating and adsorption member 710 , the substrate seating and adsorption member 710 may be used to stably support the target panel 1 by adsorbing the seated target panel 1 through suction in the vacuum holes VH.

[0123] The stopper 720 may be provided at one side of the substrate seating and adsorption part 710 in one direction. The stopper 720 may be provided on the substrate seating and adsorption part 710. However, the present disclosure is not limited thereto, and the stopper 720 may be configured in a state of not being provided on the substrate seating and adsorption part 710 and being attached or connected to a side surface of the substrate seating and adsorption part 710.

[0124] As will be described later, when the target panel 1 is flipped in the direction of gravity (i.e., the direction opposite to the third direction DR3), the stopper 720 supports the target panel 1 so as to allow the target panel 1 to stand before the printed circuit board 500 is attached to the first side surface of the target panel 1, and the stopper 720 can be used to support the second side surface of the target panel 1 opposite to the first side surface of the target panel 1.

[0125] The turning member 730 may be used to turn over the target panel 1 in the gravity direction (ie, the direction opposite to the third direction DR3 ).

[0126] The light source part 740 may include a plurality of lighting devices. For example, the light source part 740 may include a first lighting device.

[0127] The light source part 740 may be used to check whether there is a fault in alignment between the target panel 1 and the printed circuit board 500 attached to the first side surface of the target panel 1 by irradiating light toward the first side surface of the target panel 1 .

[0128] The light source part 740 may be disposed in the stopper 720. The light source part 740 may be disposed to be aligned with an inner side surface of the stopper 720.

[0129] Fig.14 , Fig.16 and Fig.17 is a perspective view of a process operation of a method of manufacturing a display device according to another exemplary embodiment, and Fig.15 It is along Fig.14 A cross-sectional view taken along line IV-IV'.

[0130] Reference Figures 14 to 17 The method of manufacturing a display device according to the exemplary embodiment is different from the method of manufacturing a display device according to the previous exemplary embodiment in that a liquid crystal display panel is applied as the target panel 2 .

[0131] The target panel 2 may include: a first substrate 100_1 including a first base substrate 101, a second substrate 200_1 facing the first substrate 100_1, and a plurality of connection lines 110 disposed between the first base substrate 101 and the second substrate 200. A liquid crystal layer 300 may be further disposed between the first substrate 100_1 and the second substrate 200_1. A sealing member SEAL may be disposed outside the liquid crystal layer 300. The liquid crystal layer 300 may be in direct contact with the sealing member SEAL, but the present invention is not limited thereto.

[0132] The first substrate 100_1 may further include various elements disposed on the first base substrate 101 , and the second substrate 200_1 may further include a second base substrate and various elements disposed on the second base substrate.

[0133] Various elements of the first substrate 100_1 may include a plurality of insulating layers, a plurality of conductive layers, and at least one thin film transistor.

[0134] That is, the first substrate 100_1 may be a thin film transistor substrate or a backplane substrate including at least one thin film transistor.

[0135] The second substrate 200_1 may face the first substrate 100_1 and may be disposed on the first substrate 100_1. The second substrate 200_1 may be a color filter substrate including a color filter layer.

[0136] The method of manufacturing the display device according to the present exemplary embodiment may not include operation S20 of allowing the target panel 2 to stand by turning over the stage 400 between operation S10 of disposing the target panel 2 on the stage 400 and operation S30 of attaching the printed circuit board 500 to the first side surface of the target panel 2 .

[0137] In operation S30 of attaching the printed circuit board 500 to the first side surface of the target panel 2 , the printed circuit board 500 may be attached to the first side surface of the target panel 2 in a state in which the target panel 2 lies flat.

[0138] As described above, the method for manufacturing a display device according to an exemplary embodiment may further include an operation of attaching the printed circuit board 500 to the first side surface of the target panel 2. In the operation of determining whether the alignment between the attached printed circuit board 500 and the side surface pad SPAD of the target panel 2 is faulty, if only the second lighting device 600 is used, the amount of light used to determine whether the alignment between the side surface pad SPAD and the lead LE is faulty may be insufficient. In addition, since the illumination light irradiated from the second lighting device 600 to the first side surface of the target panel 2 is reflected by the lead LE, the side surface pad SPAD, and the side surface of the base substrate of the target panel 2 (similar to the reference 600), the illumination light irradiated from the second lighting device 600 to the first side surface of the target panel 2 is reflected by the side surface of the base substrate of the target panel 2. Fig.12 ), therefore, it may not be easy to check the alignment of the printed circuit board 500 by contrast of brightness. Therefore, it may be difficult to determine whether the alignment between the lead LE and the side surface pad SPAD is faulty.

[0139] However, in the method of manufacturing a display device according to an exemplary embodiment, when determining whether the printed circuit board 500 is aligned, since the light provided from the light source part 450 of the above-mentioned stand 400 travels toward the printed circuit board 500 on the first side surface of the target panel 2, the insufficient amount of light using only the second lighting device 600 can be compensated by the light provided from the light source part 450.

[0140] In the method of manufacturing a display device and the device for manufacturing a display device according to an exemplary embodiment of the present disclosure, alignment between a side surface pad bonded at a side surface of a display panel and a lead may be checked.

[0141] The effects according to the present disclosure are not limited to the above effects, and more various effects are included in this specification.

[0142] As described above, although the exemplary embodiments of the present disclosure are mainly described, the above are only examples and are not intended to limit the present disclosure, and those skilled in the art may make modifications and applications not described above within the scope of the essential features of the present disclosure. For example, the elements specifically shown in the exemplary embodiments of the present disclosure may be modified. In addition, differences related to modifications and applications should be included within the scope of the present disclosure as defined in the claims.

Claims

1. A method for manufacturing a display device, wherein: The method comprises: The operation of fixing the display panel to the stand; an operation of attaching a printed circuit board to a first side surface of a first end portion of the fixed display panel; and An operation of inspecting alignment of the printed circuit board is performed by illuminating the first side surface of the first end of the display panel with light from a first lighting device, and illuminating the second side surface of the second end of the display panel opposite to the first side surface of the first end of the display panel with light from a second lighting device and causing the light from the second lighting device to travel toward the printed circuit board so that the light from the second lighting device is irradiated to the first side surface.

2. The method according to claim 1, wherein: In the operation of fixing the display panel to the stage, the display panel is fixed by suctioning air in a vacuum hole of the stage.

3. The method according to claim 2, wherein: Between the operation of fixing the display panel and the operation of attaching the printed circuit board, the method further includes an operation of flipping the stage to allow the display panel to stand.

4. The method according to claim 3, wherein: In the operation of flipping the stage to allow the display panel to stand, the stage keeps the display panel fixed.

5. The method according to claim 4, wherein: In the operation of turning over the stage to allow the display panel to stand, a stopper of the stage fixes the second side surface of the display panel.

6. The method according to claim 5, wherein: In the operation of attaching the printed circuit board to the first side surface of the fixed display panel, the printed circuit board is attached to the first side surface of the display panel in a state in which the display panel is standing.

7. The method according to claim 5, wherein: In the operation of irradiating the second side surface of the display panel opposite to the first side surface of the display panel with the light from the second lighting device, the second lighting device is embedded in the stage.

8. The method according to claim 7, wherein: The second lighting device is disposed in the stopper of the stand.

9. An apparatus for manufacturing a display device, wherein: The device comprises: a substrate placement and fixing member, which places the display panel thereon and fixes the display panel; a stopper connected to the substrate seating and fixing member and disposed on a second side surface of a second end portion of the display panel; and A light source component is connected to the stopper and illuminates the second side surface of the second end of the display panel with illumination light and causes the illumination light to travel toward a printed circuit board attached to the first side surface of the first end of the display panel so that the illumination light is illuminated to the first side surface to check the alignment of the printed circuit board.

10. The device according to claim 9, wherein: The substrate seating and fixing member defines a plurality of vacuum holes passing through a surface thereof in a thickness direction.

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