Carrying device, semiconductor processing equipment, and method for fixing workpiece

Abstract

The present application provides a carrier device, a semiconductor processing device, and a method for fixing a workpiece using a carrier device. The carrier device includes a carrier, a clamping assembly, and a driving member. The carrier includes a carrier and an air path arranged on the carrier, the carrier surface includes a first area and a second area surrounding the first area, and the air path is used to evacuate air to adsorb the workpiece in the first area. The clamping assembly is used to press the workpiece in the second area. The driving member is connected to the clamping assembly and is used to drive the clamping assembly to move relative to the carrier to selectively clamp or release the workpiece. In the carrier device, semiconductor processing equipment, and method for fixing a workpiece using the carrier device of the present application, the carrier can carry and adsorb the workpiece so that the workpiece does not deviate. The clamping assembly can press the workpiece in the second area to make the surface of the workpiece in contact with the carrier surface smoother, so that the workpiece can be smoothly adsorbed on the carrier.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a carrier device, semiconductor processing equipment, and a method for fixing a workpiece using the carrier device. Background Art

[0002] Some semiconductor processing equipment's carriers can carry and absorb workpieces for processing. Currently, some workpieces are thin and prone to warping, making it difficult to attach them to the carriers, making testing difficult. Summary of the Invention

[0003] Embodiments of the present application provide a carrier device, semiconductor processing equipment, and a method for fixing a workpiece using the carrier device.

[0004] The carrier device of the embodiment of the present application includes a carrier, a clamping assembly, and a driving member. The carrier includes a carrier surface, the carrier being provided with an air circuit, the carrier surface including a first area and a second area surrounding the first area, the air circuit being used to evacuate air to adsorb the workpiece in the first area. The clamping assembly is used to clamp the workpiece in the second area. The driving member is connected to the clamping assembly and is used to drive the clamping assembly to move relative to the carrier to selectively clamp or release the workpiece.

[0005] In some embodiments, the pressing assembly includes a pressing ring corresponding to the second area, wherein the pressing ring is connected to the driving member, and the driving member is used to drive the pressing ring to move relative to the supporting member so as to press the workpiece against the second area.

[0006] In some embodiments, the pressing assembly further comprises a pressing block, which is mounted on the first surface of the pressing ring and is used to press the workpiece in the second area.

[0007] In certain embodiments, the compact is annular and corresponds to the second region.

[0008] In certain embodiments, the pressing block comprises a plurality of pressing blocks, and the plurality of pressing blocks are evenly distributed around the center of the pressing ring.

[0009] In some embodiments, the pressure ring is made of a metal material.

[0010] In certain embodiments, the compact is made of a non-metallic material.

[0011] In some embodiments, the pressing assembly further includes a pressing plate, which is mounted on the second surface of the pressing ring and is used to connect the pressing ring and the driving member, wherein the driving member can drive the pressing plate to move relative to the bearing member to drive the pressing ring to move.

[0012] In some embodiments, the pressure plates include a plurality of pressure plates, the driving members include a plurality of pressure plates, each driving member is connected to a corresponding pressure plate, and the pressure plates are symmetrically distributed about the center of the pressure ring.

[0013] In some embodiments, the carrying device further includes a first detector. The first detector is disposed on the pressure ring and is configured to emit a detection signal and output a detection result based on the reflected detection signal, wherein the detection result includes whether the carrying surface carries the workpiece and, if the workpiece is carried on the carrying surface, whether the workpiece is placed in a preset position.

[0014] In some embodiments, the pressure ring is provided with a mounting portion, the second region is provided with a through hole corresponding to the mounting portion, the first detector is installed in the mounting portion, and emits the detection signal toward the through hole.

[0015] In some embodiments, the first detector includes a plurality of detectors, and the plurality of first detectors are evenly distributed around the center of the pressure ring.

[0016] In some embodiments, the air path includes a plurality of grooves provided in the first region and air holes communicating with the grooves, and the air holes are used for ventilation communication with the air extraction unit.

[0017] In some embodiments, the air circuit further includes an air channel provided on a side surface of the supporting member, and the air hole is connected to the air extraction unit through the air channel.

[0018] In some embodiments, the air circuit further includes an air channel arranged on the side of the carrier and a connecting groove arranged in the first area and connected to the groove, the air channel is connected to the air hole, and the air hole is connected to the air extraction unit through the air channel.

[0019] In some embodiments, the carrier is provided with a plurality of first through holes, which are located in the first region and are used to expose a portion of the surface of the workpiece in contact with the carrier surface for processing when the workpiece is placed on the carrier.

[0020] In some embodiments, the first through holes are evenly distributed relative to the center of the supporting member.

[0021] In some embodiments, the bearing member includes a body and a bearing portion. The bearing portion is disposed on a first side of the body, the bearing surface is located on a side of the bearing portion away from the body, the driving member is mounted on the body, and the bearing portion is provided with an opening extending through a sidewall of the bearing portion.

[0022] In some embodiments, the body is provided with a plurality of second through holes, which correspond to the openings and are used to expose a portion of the surface of the workpiece in contact with the carrying surface for processing when the workpiece is placed on the carrier.

[0023] In some embodiments, the first area and the second area each include a plurality of first areas and a plurality of second areas, and the plurality of first areas and the plurality of second areas are alternately arranged to form a plurality of bearing areas radiating from the center of the carrier to each second area, and the plurality of bearing areas can bear workpieces of different sizes.

[0024] In some embodiments, the pressing assembly includes a plurality of pressing assemblies, and each pressing assembly corresponds to one bearing area.

[0025] The semiconductor processing equipment of the embodiment of the present application includes a detector and a carrier device according to any of the above embodiments. The processing device corresponds to the carrier device and is used to process a workpiece carried on the carrier device.

[0026] In some embodiments, the semiconductor processing equipment further includes a second detector and a positioning portion, wherein the positioning portion is disposed on the main body of the carrier, and the second detector cooperates with the positioning portion and is used together to detect whether the opening of the carrier corresponds to the loading device.

[0027] An embodiment of the present application also provides a method for fixing a workpiece using a carrying device, the method for fixing the workpiece comprising: driving a clamping assembly to move in a direction away from the carrying member by a driving member, the carrying member comprising a carrying surface and an air path arranged in the carrying member, the carrying surface comprising a first area and a second area surrounding the first area, the air path being used to evacuate air to adsorb the workpiece in the first area; placing the workpiece on the carrying surface; driving the clamping assembly to move in a direction close to the carrying member by the driving member so that the workpiece is pressed in the second area; and evacuating air from the air path to adsorb the workpiece in the first area.

[0028] In some embodiments, the method of fixing a workpiece using a carrying device further includes: confirming, by the first detector, that the workpiece is located at the center of the carrying surface.

[0029] In the carrying device, semiconductor processing equipment, and method for fixing a workpiece using the carrying device of the embodiment of the present application, the carrying member can carry and adsorb the workpiece so that the workpiece does not shift, and the clamping assembly can press the workpiece in the second area to make the surface of the workpiece in contact with the carrying surface smoother to avoid warping, thereby increasing the contact area between the workpiece and the carrying surface, so that the workpiece can be smoothly adsorbed on the carrying member.

[0030] Additional aspects and advantages of the embodiments of the present application will be given in part in the description below, and in part will become obvious from the description below, or will be learned through practice of the embodiments of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0032] Figure 1 is a schematic three-dimensional assembly diagram of a carrying device according to certain embodiments of the present application;

[0033] Figure 2 is a perspective exploded schematic diagram of a carrying device according to certain embodiments of the present application;

[0034] Figure 3 is an enlarged schematic diagram of the air path of the carrier device in certain embodiments of the present application;

[0035] Figure 4 is a schematic diagram of a bearing area of ​​a bearing surface in certain embodiments of the present application;

[0036] Figure 5 is a schematic diagram of a semiconductor processing apparatus according to certain embodiments of the present application;

[0037] Figure 6 This is a flow chart of a method for fixing a workpiece using a carrying device according to certain embodiments of the present application. DETAILED DESCRIPTION

[0038] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be understood as limiting the present application.

[0039] In the description of the present application, it should be understood that the terms "thickness", "upper", "top", "bottom", "inside", "outside", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the present application, "multiple" means two or more, unless otherwise clearly and specifically defined.

[0040] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection or mutual communication; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements.

[0041] The disclosure below provides many different embodiments or examples for realizing different structures of the present application. In order to simplify the disclosure of the present application, the components and settings of specific examples are described below. Of course, they are merely examples and are not intended to limit the present application. In addition, the present application may repeat reference numbers and / or reference letters in different examples, and such repetition is for the purpose of simplicity and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present application provides examples of various specific processes and materials, but those of ordinary skill in the art will appreciate the application of other processes and / or the use of other materials.

[0042] See also Figure 1 and Figure 2 The present application provides a carrying device 100. The carrying device 100 includes a carrying member 10, a clamping assembly 20, and a driving member 30. The carrying member 10 includes a carrying surface 12 and an air path 13 provided on the carrying member 10. The carrying surface 12 includes a first area 121 and a second area 122 surrounding the first area 121. The air path 13 is used to evacuate air to adsorb the workpiece in the first area 121. The clamping assembly 20 is used to clamp the workpiece in the second area 122. The driving member 30 is connected to the clamping assembly 20 and is used to drive the clamping assembly 20 to move relative to the carrying member 10 to selectively clamp or release the workpiece.

[0043] Please combine Figure 6 The present application provides a method for fixing a workpiece using a carrier device 100, the fixing method comprising:

[0044] 01: The pressing assembly 20 is driven by the driving member 30 to move in a direction away from the carrier 10. The carrier 10 includes a carrying surface 12 and an air path 13 disposed within the carrier 10. The carrying surface 12 includes a first area 121 and a second area 122 surrounding the first area 121. The air path 13 is used to evacuate air to adsorb the workpiece in the first area 121.

[0045] 02: Place the workpiece on the carrying surface 12;

[0046] 03: The pressing assembly 20 is driven by the driving member 30 to move toward the carrier 10 so that the workpiece is pressed against the second area 122; and

[0047] 04: The air path 13 is evacuated to adsorb the workpiece in the first area 121 .

[0048] The carrier device 100 can be used to carry various workpieces for subsequent processing, such as display panels, mobile phone front covers, mobile phone back covers, VR glasses, AR glasses, smart watch covers, glass, lenses, wood, iron plates, housings of any device (such as mobile phone cases), and other components for subsequent testing, etching, coating, cutting, etc. The carrier device 100 of the present application can also be used to carry workpieces made of semiconductor materials such as wafers and chips to facilitate subsequent processing such as surface defect detection, optical film thickness detection, surface etching, cutting, coating, etc.

[0049] The clamping assembly 20 is used to clamp the workpiece against the second region 122. Generally speaking, the center of a workpiece placed on the carrier 10 is aligned with the center 15 of the carrier 10. The edge of the workpiece often does not require processing, and contact between the clamping assembly 20 and the non-processed area of ​​the workpiece will not affect the processing of the workpiece. Therefore, when the workpiece is placed at a predetermined position on the carrier 10, the non-processed area of ​​the workpiece edge is located in the second region 122 of the carrier 10. The clamping assembly 20 can clamp the edge of the workpiece against the second region 122 to secure the workpiece.

[0050] Thin workpieces are prone to warping, which reduces the contact area between the workpiece and the support surface 12 and makes it difficult for the supported component 10 to be adsorbed onto the support surface 12. Warping often occurs at the edges of the workpiece. The clamping assembly 20 can flatten the warped area of ​​the workpiece in the second region 122, allowing the workpiece to be smoothly adsorbed onto the support surface 12. Even if warping does not occur at the edges of the workpiece, the clamping assembly 20 can still cause a certain degree of elastic deformation in the workpiece, flattening the workpiece as a whole and increasing the contact area with the support surface 12 relative to before the clamping, thereby allowing the workpiece to be smoothly adsorbed onto the support surface 12.

[0051] When the air path 13 is evacuated and the suction force generated on the support surface 12 is sufficiently strong, the warped workpiece can be flattened to a certain extent through suction. For example, the warped portion of the workpiece that is convex away from the support 10 can be sucked onto the support surface 12, thereby flattening the contact surface between the workpiece and the support surface 12.

[0052] The driver 30 can be either an electric driver or a pneumatic driver, without limitation. The driver 30 can drive the pressing assembly 20 to move away from the carrier 10 to make room for loading the workpiece onto the carrier 10. The driver 30 can also drive the pressing assembly 20 to move toward the carrier 10 to press the workpiece against the carrier 10.

[0053] When no workpiece is placed, the driver 30 can drive the clamping assembly 20 to move away from the carrier 10 to make room for the workpiece to be placed on the carrier surface 12. After the workpiece is placed on the carrier surface 12, the driver 30 can drive the clamping assembly 20 to move closer to the carrier 10 so that the clamping assembly 20 can clamp the workpiece, specifically, the workpiece in the second area 122. After the workpiece is clamped by the clamping assembly 20, the air circuit 13 can be evacuated to attract the workpiece to the first area 121, thereby preventing warping of the uncompressed workpiece surface that could prevent the workpiece from being smoothly attracted to the first area 121.

[0054] In the carrier device 100 and the use thereof to secure a workpiece according to the embodiment of the present application, the carrier 10 can support and absorb the workpiece to prevent it from shifting. The clamping assembly 20 can compress the workpiece against the second region 122 to flatten the surface of the workpiece in contact with the carrier surface 12. For example, it can flatten a warped surface of the workpiece, thereby increasing the contact area between the workpiece and the carrier surface 12, allowing the workpiece to be smoothly absorbed on the carrier 10 and preventing warping.

[0055] The following is further explained with reference to the accompanying drawings.

[0056] The carrier 10 includes a carrying surface 12 for carrying a workpiece. The carrying surface 12 can be any shape, such as circular, elliptical, rectangular, polygonal, etc., which are not listed here. Carrying surfaces 12 of different shapes can adapt to and absorb workpieces of different shapes. For example, if the workpiece is a wafer, which is typically processed into a circular shape, the carrying surface 12 can be configured to be circular to better support and absorb the wafer.

[0057] The carrier 10 is provided with an air passage 13 for extracting air to adsorb the workpiece in the first area 121. Figure 2 and Figure 3In some embodiments, the air path 13 includes a plurality of grooves 131 provided in the first region 121 and air holes 132 connected to the grooves 131. The air holes 132 are used to communicate with an air extraction unit (not shown). The air extraction unit is used to extract air from the air holes 132 so that the carrier 10 can adsorb the workpiece. Specifically, the air holes 132 are connected to the grooves 131 and the air extraction unit. When the air extraction unit extracts air from the air holes 132, an adsorption force is generated at the air holes 132 and the grooves 131, which can adsorb the workpiece at the air holes 132 and the grooves 131 in the first region 121.

[0058] Specifically, the grooves 131 can be a plurality of concentric rings distributed in the first region 121 and surrounding the center of the support surface 12, with the distance between the rings being uniform, so that the grooves 131 are evenly distributed in the first region 121, thereby generating a uniform adsorption force in the first region 121. The denser the distribution of the concentric ring-shaped grooves 131, the more parts of the workpiece can be adsorbed, the greater the adsorption force, and the more conducive it is to evenly fix the workpiece on the support 10.

[0059] In other embodiments, the air circuit 13 may further include an air passage 133 disposed on the side of the carrier 10, and the air hole 132 is connected to the air extraction unit through the air passage 133. Providing the air passage 133 on the side of the carrier 10 allows the air extraction unit to be positioned on the side of the carrier 10 and communicate with the air passage 133, thereby avoiding the situation where the air extraction unit is disposed above or below the carrier 10, thereby obstructing the workpiece and affecting the processing of the workpiece.

[0060] In some further embodiments, the air path 13 may further include an air channel 133 provided on the side of the carrier 10 and a connecting groove 134 provided in the first region 121 and connected to the groove 131. The air channel 133 is connected to the air hole 132, and the air hole 132 is connected to the air extraction unit through the air channel 133. For example, Figure 3 As shown, the connecting groove 134 passes through and intersects with the plurality of grooves 131. A plurality of air holes 132 are sequentially arranged along the connecting groove 134 at the bottom thereof to ventilate and connect the connecting groove 134 with the grooves 131. When the air extraction unit extracts air from the air holes 132, negative pressure is generated in both the connecting groove 134 and the grooves 131, which are in ventilated communication with the air holes 132, further improving the ability of the carrier 10 to adsorb workpieces.

[0061] See also Figure 2 In some embodiments, the carrier 10 may be provided with a plurality of first through holes 16, which are located in the first region 121 and are used to expose a portion of the surface of the workpiece that is in contact with the carrier surface 12 when the workpiece is placed on the carrier 10 for processing. Specifically, both the front and back sides of the workpiece placed on the carrier 10 can be processed. The portion of the workpiece facing the pressure ring 21 (the front side of the workpiece) that is not blocked by the pressure ring 21 can be directly processed by the processing device 500 ( Figure 5 The side of the workpiece facing the carrier 10 (the back side of the workpiece) is shielded by the carrier 10. Therefore, a plurality of first through holes 16 can be provided on the carrier 10 to enable the processing device 500 to process the portion of the back side of the workpiece exposed through the first through holes 16.

[0062] In some embodiments, the first through holes 16 are evenly distributed relative to the center 15 of the carrier 10, so that the processing device 500 can process the exposed portion of the back side of the workpiece that is evenly distributed relative to the center 15 of the carrier 10. When the processing device 500 is a detector and performs inspection on the workpiece, it is not necessary to inspect the entire back side of the workpiece (the surface to be inspected) for efficiency reasons, but rather to perform sampling inspection on a partial area of ​​the back side so as to reflect the inspection status of the entire back side of the workpiece based on the inspection results of the partial area of ​​the workpiece. Generally, the area on the back side for sampling inspection is evenly distributed relative to the center of the back side so that the inspection results of the sampling inspection area can reflect the inspection status of the entire back side. Therefore, a plurality of first through holes 16 that are evenly distributed relative to the center 15 of the carrier 10 are correspondingly provided on the carrier 10, so that when the center of the workpiece coincides with the center 15 of the carrier 10, the position of the first through holes 16 can correspond to the area for sampling inspection on the back side, so that the detector can detect the area for sampling inspection on the back side exposed from the first through holes 16.

[0063] See also Figure 2 In some embodiments, the carrier 10 may include a body 18 and a carrier portion 11. The carrier portion 11 is disposed on a first side of the body 18, and the carrier surface 12 is located on a side of the carrier portion 11 away from the body 18. A plurality of first through-holes 16 penetrate the body 18 and the carrier portion 11. The carrier portion 11 is provided with an opening 171 that penetrates the sidewall 17 of the carrier portion 11. The center 123 of the carrier surface 12 corresponds to the center 15 of the carrier 10.

[0064] When placing a workpiece on the support surface 12, a loading device (not shown) such as a manipulator or a mechanical clamp can be used to clamp the workpiece and insert it from the side of the support portion 11, so that the center of the workpiece gradually approaches the center 123 of the support surface 12, until the center of the workpiece coincides with the center 123 of the support surface 12, and then the workpiece is lowered and the loading device is withdrawn from the side of the support portion 11. The support portion 11 is provided with an opening 171 that passes through the side wall 17 of the support portion 11, so that the loading device can extend into the opening 171 to clamp the workpiece and insert it from the side of the support surface 12, so that the center of the workpiece coincides with the center 123 of the support surface 12, and the loading device can be withdrawn from the support portion 11 through the opening 171. If the opening 171 is not provided through the side wall 17 of the support portion 11, the loading device is likely to interfere with the support portion 11 during the process of clamping the workpiece and placing it on the support surface 12, causing scratches. At the same time, it is difficult to ensure that the workpiece is placed in place, that is, it is difficult to ensure that the center of the workpiece coincides with the center 123 of the support surface 12.

[0065] Furthermore, in one embodiment, the opening 171 can extend from the side wall 17 to the center 123 of the bearing surface 12. At this time, the loading device has a larger extension stroke, which can further ensure that the loading device can place the workpiece in place, that is, ensure that the center of the workpiece coincides with the center 123 of the bearing surface 12.

[0066] See also Figure 2 In some embodiments, the body 18 is provided with a plurality of second through holes 131, which correspond to the opening 171 and are used to expose the back surface of the workpiece in contact with the carrying surface 12 when the workpiece is placed on the carrier 10 for the processing device 500 ( Figure 5 shown) processing.

[0067] Please also refer to Figure 2 and Figure 4, the number of the first area 121 and the second area 122 is the same, and can be 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, etc., which are not listed here one by one. When the first area 121 and the second area 122 are both 1, the bearing surface 12 is only used to carry workpieces of one size for processing. When the first area 121 and the second area 122 are both multiple (greater than or equal to 2), multiple first areas 121 and multiple second areas 122 are alternately arranged, and multiple bearing areas 124 can be formed by radiating from the center 15 of the carrier 10 to each second area 122. The multiple bearing areas 124 can carry workpieces of different sizes, and each bearing area 124 corresponds to carrying a workpiece of one size. At this time, the number of bearing areas 124 is the same as the number of the first area 121 or the second area 122. The carrier 10 is provided with an air path 13 at a position corresponding to each first area 121 , so that different carrying areas 124 can adsorb the workpiece to the first area 121 of the corresponding carrying area 124 .

[0068] In the embodiment of this application, Figure 2 and Figure 4 As shown, there are two first regions 121 and two second regions 122. Radiating outward from the center 15 of the carrier 10, the first first region 121, the first second region 122, the second first region 121, and the second second region 122 are alternately arranged. Air passages 13 are provided at corresponding positions of the first first region 121 and the second first region 121. The first first region 121 and the first second region 122 together form a load-bearing region 124a, which is used to carry workpieces of a first size. The first first region 121, the first second region 122, the second first region 121, and the second second region 122 together form a load-bearing region 124b, which is used to carry workpieces of a first size and a second size. The second size is larger than the first size, for example, the first size is 8 inches and the second size is 12 inches.

[0069] See also Figure 1 and Figure 2 In some embodiments, the pressing assembly 20 includes a pressing ring 21 corresponding to the second region 122 , and the pressing ring 21 is connected to a driving member 30 . The driving member 30 is used to drive the pressing ring 21 to move relative to the carrier 10 so as to press the workpiece against the second region 122 .

[0070] The pressure ring 21 corresponds to the second area 122. For example, if the second area 122 is a circular ring, the pressure ring 21 is a circular ring corresponding to the second area 122. The second area 122 can also be an elliptical ring, a polygonal ring, a racetrack-shaped ring, etc. Correspondingly, the pressure ring 21 is an elliptical ring, a polygonal ring, a racetrack-shaped ring, etc. corresponding to the second area 122, which is not limited here. When the driving member 30 drives the pressure ring 21 to move relative to the carrier 10 toward the carrier 10 to press the workpiece, the pressure applied by the pressure ring 21 to the workpiece can be evenly distributed relative to the center of the pressure ring 21 to prevent stress concentration at a certain point when the workpiece is pressed, resulting in damage to the workpiece. The pressure evenly distributed relative to the center of the pressure ring 21 applied by the driving member 30 to the workpiece also helps to press the surface of the workpiece to a flat surface, thereby increasing the contact area between the workpiece and the bearing surface 12, and avoiding the uneven distribution of pressure applied by the driving member 30 to the workpiece relative to the center of the pressure ring 21, which causes one side of the workpiece to tilt.

[0071] In one embodiment, the pressure ring 21 can be made of a metal material. The metal pressure ring 21 has a certain strength and is not easily deformed or damaged by the drive member 30, thus having a long service life. The metal pressure ring 21 also has a certain weight. When the pressure ring 21 is pressed against a workpiece, the weight of the metal pressure ring 21 can exert pressure on the workpiece, allowing the drive member 30 to compress the workpiece without applying excessive driving force to the pressure ring 21.

[0072] In another embodiment, the pressure ring 21 may be made of a non-metallic material. Non-metallic pressure rings 21 are less susceptible to static electricity, thus preventing static electricity from damaging the workpiece. For example, if the workpiece is a wafer, the wafer surface may be provided with circuits. If static electricity is generated on the pressure ring 21, it may easily damage the wafer when the pressure ring 21 contacts the wafer. Furthermore, the non-metallic pressure ring 21 is relatively lightweight, making it easier for the driver 30 to drive the pressure ring 21 relative to the carrier 10.

[0073] See also Figure 1 and Figure 2 In some embodiments, the pressing assembly 20 may further include a pressing block 23 , which is mounted on the first surface 213 of the pressing ring 21 to press the workpiece in the second area 122 .

[0074] In one embodiment, there is one pressing block 23 in an annular shape, corresponding to the second region 122. For example, if the second region 122 is a circular ring, the pressing block 23 is a circular ring corresponding to the second region 122. If the second region 122 is an elliptical ring, a polygonal ring, a racetrack ring, etc., the pressing block 23 is also an elliptical ring, a polygonal ring, a racetrack ring, etc. corresponding to the second region 122, without limitation. The pressure applied by the annular pressing block 23 to the workpiece can be evenly distributed relative to the center of the pressure ring 21, thereby preventing stress concentration when the workpiece is pressed, which could lead to damage to the workpiece.

[0075] In another embodiment, the pressing block 23 includes a plurality of pressing blocks 23, and the plurality of pressing blocks 23 are evenly spaced around the center of the pressure ring 21 to prevent stress concentration effects when the workpiece is pressed, resulting in damage to the workpiece. The number of the plurality of pressing blocks 23 can be 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, etc., which are not listed here one by one. Compared with a single pressing block 23 in the shape of a ring, a plurality of pressing blocks 23 can save some materials. For example, the number of pressing blocks 23 is 2, and the angle between the two connecting lines from the two pressing blocks 23 to the center of the pressure ring 21 is 180°. Compared with a pressing block 23 in the shape of a complete ring, the size of each pressing block 23 in the two pressing blocks 23 can be made into a quarter of a complete ring, a fifth of a complete ring, a twelfth of a complete ring, a twenty-fourth of a complete ring, etc., which are not listed here one by one, so as to save materials. Compared with a single pressure block 23 in a complete ring shape, multiple pressure blocks 23 can also reduce the contact area with the workpiece, so that when the area to be processed of the workpiece is close to the second area 122 of the supporting surface 12, the placement of the workpiece can be adjusted so that the pressure block 23 avoids the area to be processed of the workpiece, thereby preventing the pressure block 23 from damaging the area to be processed of the workpiece.

[0076] In certain embodiments, the pressing blocks 23 can be detachably mounted on the pressing ring 21 by means of threaded connections, snap connections, hinge connections, etc., so that a certain number of pressing blocks 23 can be installed on the first surface 213 of the pressing ring 21 as needed. For example, if there is a warp on each of two opposing sides of the workpiece, two pressing blocks 23 can be installed on the first surface 213 of the pressing ring 21 at positions corresponding to each warp, for a total of four pressing blocks 23 installed on the first surface 213 of the pressing ring 21 to flatten the warped areas.

[0077] In some embodiments, the pressing block 23 can be non-detachably mounted on the pressing ring 21 by welding, bonding, riveting, or the like, so that the pressing block 23 is securely mounted on the pressing ring 21 and is not likely to fall off. Furthermore, the pressing block 23 non-detachably mounted on the pressing ring 21 is not likely to shift or wobble relative to the pressing ring 21, thereby preventing the warped portion of the workpiece from being flattened due to the pressing block 23 shifting or wobble relative to the pressing ring 21.

[0078] In one embodiment, the pressing block 23 can be made of a metal material. Metal pressing blocks 23 have a certain strength and are less susceptible to deformation or damage when driven by the driver 30, resulting in a long service life. Metal pressing blocks 23 also have a certain weight. When pressing a workpiece, the weight of the metal pressing block 23 exerts pressure on the workpiece, enabling the driver 30 to compress the workpiece without applying excessive driving force to the pressing block 23.

[0079] In another embodiment, the pressing block 23 may be made of a non-metallic material. Non-metallic pressing blocks 23 are less susceptible to static electricity, thus preventing static electricity from damaging the workpiece. For example, if the workpiece is a wafer, the wafer surface may be equipped with circuits. If static electricity is generated on the pressing block 23, it may easily damage the wafer when the pressing block 23 contacts the wafer. Furthermore, the non-metallic pressing block 23 is relatively lightweight, making it easier for the driver 30 to drive the pressing block 23 relative to the carrier 10.

[0080] See also Figure 1 and Figure 2 In some embodiments, the pressing assembly 20 may further include a pressing plate 25. The pressing plate 25 is mounted on the second surface 215 of the pressing ring 21 and is used to connect the pressing ring 21 with the driving member 30. The driving member 30 can drive the pressing plate 25 to move relative to the supporting member 10 to drive the pressing ring 21 to move.

[0081] The pressure plate 25 connects the pressure ring 21 and the driving member 30, which can make the position setting of the driving member 30 more flexible. For example, when the pressure plate 25 is not set, the driving member 30 is directly connected to the pressure ring 21. The driving force direction of the driving member 30 needs to be consistent with the direction of movement of the pressure ring 21 relative to the supporting member 10 in order to drive the pressure ring 21 to move relative to the supporting member 10. This requires that the driving member 30 needs to be set in the following position: Figure 1 Above or below the pressure ring 21 shown. Since the workpiece is placed below the pressure ring 21, the position where the driving member 30 can be set is limited to above the pressure ring 21. The position setting is very inflexible and is likely to block the workpiece, making it difficult for the processing device 500 to perform processing on the front of the workpiece. The pressure plate 25 connects the pressure ring 21 and the driving member 30, so that the driving force of the driving member 30 does not need to be consistent with the direction in which the pressure ring 21 moves relative to the carrier 10 to drive the pressure ring 21 to move relative to the carrier 10, so that the position of the driving member 30 can be flexibly set, for example, the driving member 30 is set at a position away from the workpiece on the main body 18 to avoid the driving member 30 blocking the workpiece, making it difficult for the processing device 500 to perform processing on the front and back of the workpiece.

[0082] In some embodiments, the pressure plate 25 can be detachably mounted on the pressure ring 21 by means of threaded connection, snap connection, hinge connection, etc., so as to facilitate the removal of the pressure ring 21 or the pressure plate 25 for maintenance or replacement.

[0083] In some embodiments, the pressing plate 25 can be non-detachably mounted on the pressing ring 21 by welding, bonding, riveting, or the like, so that the pressing plate 25 is securely mounted on the pressing ring 21 and is not likely to fall off. Furthermore, the pressing plate 25 non-detachably mounted on the pressing ring 21 is not likely to shift or wobble relative to the pressing ring 21, thereby preventing the pressing plate 25 from shifting or wobble relative to the pressing ring 21 and causing the warped portion of the workpiece to be flattened.

[0084] In certain embodiments, the pressure plates 25 may include multiple components, and correspondingly, the driving members 30 may include multiple components, with each driving member 30 connected to a corresponding pressure plate 25, and the pressure plates 25 are symmetrically distributed about the center of the pressure ring 21. For example, the number of pressure plates 25 may be 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, etc., which are not listed here. Correspondingly, the number of driving members 30 may be 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, etc., as long as the number of driving members 30 is the same as the number of pressure plates 25, which are not listed here.

[0085] The pressure plate 25 symmetrically distributed about the center of the pressure ring 21 can drive the pressure ring 21 to move symmetrically in all directions relative to the carrier 10, that is, it can drive the pressure ring 21 to keep itself level when approaching or moving away from the carrier 10, so as to avoid the pressure ring 21 being unlevel when moving relative to the carrier 10 and being unable to flatten the surface of the workpiece.

[0086] In some embodiments, the clamping assembly 20 may include 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, etc., which are not listed here one by one. The number of the clamping assemblies 20 corresponds to the number of the bearing areas 124. When the number of the clamping assemblies 20 is multiple, each clamping assembly 20 corresponds to a bearing area 124. In the embodiment of the present application, Figure 2 and Figure 4 As shown, there are two pressing assemblies 20, one of which corresponds to the load-bearing area 124a. The size of the pressing ring 21 in the pressing assembly 20 corresponds to the size of the first second area 122, so as to press the workpiece placed on the load-bearing area 124a against the second area 122 in the load-bearing area 124a. The other pressing assembly 20 corresponds to the load-bearing area 124b. The size of the pressing ring 21 in the pressing assembly 20 corresponds to the size of the second second area 122, so as to press the workpiece placed on the load-bearing area 124b against the second area 122 in the load-bearing area 124b.

[0087] See also Figure 1 and Figure 2In some embodiments, the carrying device 100 may further include a first detector 40. The first detector 40 is provided on the pressure ring 21. The first detector 40 is used to emit a detection signal and output a detection result based on the reflected detection signal. The detection result includes whether the carrying surface 12 carries a workpiece, and when the carrying surface 12 carries a workpiece, whether the workpiece is placed at a preset position. Based on the number of first detectors 40 that detect that the workpiece is placed at the preset position, it can be confirmed that the workpiece is located at the center 123 of the carrying surface 12. The first detector 40 may be an optical signal detector, an acoustic wave signal detector, or the like. For example, the first detector 40 may be used to emit at least one of a detection signal such as an optical signal or an acoustic wave signal, and may be capable of detecting a detection signal such as a reflected optical signal or an acoustic wave signal.

[0088] In some embodiments, the method of securing a workpiece using a carrier device further includes:

[0089] 05: Confirm that the workpiece is located at the center 123 of the carrying surface 12 through the first detector 40 .

[0090] Specifically, before executing step 03: driving the clamping assembly 20 to move toward the direction close to the carrier 10 through the driving member 30 so that the workpiece is pressed in the second area 122, step 05 can be executed first: confirming that the workpiece is located at the center 123 of the carrier surface 12 through the first detector 40 to ensure that subsequent inspection or processing of the workpiece is performed based on the workpiece being located at the center 123 of the carrier surface 12, so that the inspection results of the workpiece are accurate and effective and the processing position of the workpiece is accurate.

[0091] In some embodiments, the pressure ring 21 may be provided with a mounting portion 211, and the second area 122 may be provided with a through hole 14 corresponding to the mounting portion 211. The first detector 40 is installed in the mounting portion 211 and sends a detection signal toward the through hole 14, and outputs a detection result based on the reflected detection signal.

[0092] In some embodiments, the number of first detectors 40 can be one, and correspondingly, the number of mounting portions 211 and through-holes 14 is also one. At this time, the first detector 40 sends a detection signal. If the first detector 40 is able to detect the reflected detection signal and the detected reflected detection signal is greater than a first threshold, it indicates that the support surface 12 is carrying a workpiece and the reflected detection signal is reflected back by the workpiece. If the first detector 40 is unable to detect the reflected detection signal or the detected reflected detection signal is less than the first threshold (the signal directly passes through the through-hole 14 or only a small amount is reflected back by the sidewall of the through-hole 14), it indicates that the support surface 12 is not carrying a workpiece. When the first detector 40 detects the reflected detection signal and the intensity of the detection signal exceeds a second threshold, it indicates that the workpiece is placed at a preset position on the support surface 12. For example, at the preset position, the center of the workpiece coincides with the center 15 of the support 10. When the first detector 40 detects the reflected detection signal, but the intensity of the detection signal is less than the second threshold and greater than the first threshold, it indicates that the workpiece has not been placed at the preset position on the support surface 12.

[0093] In some embodiments, the first detector 40 may include a plurality of first detectors, for example, the number of the first detectors 40 may be 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, etc., which are not listed here one by one. The plurality of first detectors 40 are evenly distributed around the center of the pressure ring 21. Correspondingly, there are also multiple mounting portions 211, and the plurality of mounting portions 211 can be evenly distributed around the center of the pressure ring 21, so that the first detectors 40 installed in the mounting portion 211 can be evenly distributed around the center of the pressure ring 21. At the same time, the second area 122 is also provided with a plurality of through holes 14, each through hole 14 corresponds to a first detector 40 and a mounting portion 211. At this time, the plurality of first detectors 40 all send out detection signals. If any one of the first detectors 40 can detect the reflected detection signal and the detected reflected detection signal is greater than the first threshold value, it indicates that the bearing surface 12 carries a workpiece, and the reflected detection signal is reflected back through the workpiece. If all the first detectors 40 are unable to detect the reflected detection signal or the detected reflected detection signal is less than the first threshold value (the signal passes directly from the through hole 14 or only a small amount is reflected back by the side wall of the through hole 14), it indicates that the bearing surface 12 does not carry a workpiece. When a preset first number (including all numbers) of first detectors 40 detect the reflected detection signal, and the intensity of the detection signals corresponding to the first number exceeds the second threshold value, it can be indicated that the workpiece is placed at the preset position on the bearing surface 12, for example, at the preset position, the center of the workpiece coincides with the center 15 of the carrier 10. When any one of the first detectors 40 detects the reflected detection signal, and the intensity of the detection signal is greater than the first threshold value but less than the second threshold value, it can be indicated that the workpiece is not placed at the preset position on the bearing surface 12, that is, the center of the workpiece does not coincide with the center 15 of the carrier 10. Arranging a plurality of first detectors 40 evenly distributed around the center of the pressure ring 21 can detect whether the center of the workpiece coincides with the center 15 of the carrier 10, so that the detection result of the workpiece is accurate and reliable. The more first detectors 40 evenly distributed around the center of the pressure ring 21 , the more preset positions that can be detected, and the more accurate the detection result of whether the center of the workpiece coincides with the center 15 of the carrier 10 .

[0094] In an embodiment of the present application, there are three mounting portions 211, and the three mounting portions 211 are evenly distributed around the center of the pressure ring 21, that is, two adjacent mounting portions 211 are spaced 120° apart around the center of the pressure ring 21. Correspondingly, there are three first detectors 40, and each mounting portion 211 is equipped with one first detector 40. The second area 122 is provided with three through holes 14 corresponding to the three mounting portions 211 respectively. The three first detectors 40 can respectively send detection signals to the through holes 14. When at least one first detector 40 can detect the reflected detection signal and the detected reflected detection signal is greater than the first threshold value, it indicates that a workpiece is placed on the carrier 10. If the three first detectors 40 are unable to detect the reflected detection signal or the detected reflected detection signal is less than the first threshold value, it indicates that the bearing surface 12 does not carry a workpiece. When a preset first number (for example, 3) of first detectors 40 detect the reflected detection signal, and the intensity of the detection signals corresponding to the first number exceeds the second threshold, it can be indicated that the workpiece is placed at the preset position on the bearing surface 12, that is, the center of the workpiece coincides with the center 15 of the bearing member 10. When any one of the three first detectors 40 detects the reflected detection signal, and the intensity of the detection signal is greater than the first threshold but less than the second threshold, it can be indicated that the workpiece is not placed at the preset position on the bearing surface 12, that is, the center of the workpiece does not coincide with the center 15 of the bearing member 10. The clamping assembly 20 may include 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, etc., which are not listed here one by one. The number of clamping assemblies 20 corresponds to the number of bearing areas 124. When the number of clamping assemblies 20 is multiple, each clamping assembly 20 corresponds to a bearing area 124. In the embodiment of the present application, if Figure 2 and Figure 4 As shown, there are two pressing assemblies 20, one of which corresponds to the load-bearing area 124a. The size of the pressing ring 21 in the pressing assembly 20 corresponds to the size of the first second area 122, so as to press the workpiece placed on the load-bearing area 124a against the second area 122 in the load-bearing area 124a. The other pressing assembly 20 corresponds to the load-bearing area 124b. The size of the pressing ring 21 in the pressing assembly 20 corresponds to the size of the second second area 122, so as to press the workpiece placed on the load-bearing area 124b against the second area 122 in the load-bearing area 124b.

[0095] Please combine Figure 1 and Figure 2 In some embodiments, the carrying device 100 may further include a position checking portion 60, which is disposed on the body 18 of the carrying member 10. Figure 5In the semiconductor processing equipment 1000 shown, the position detecting portion 60 can be used to cooperate with the second detector 50 of the semiconductor processing equipment 1000 and together detect whether the opening 171 of the carrier 10 corresponds to the loading device.

[0096] Specifically, the relative position of the second detector 50 and the carrier 100 is fixed. The position detection portion 60 is disposed on the body 18 of the carrier 10 and offset from the center 15 of the carrier 10. When the carrier 10 rotates relative to the center 15 of the carrier 10, the position detection portion 60 rotates with the carrier 10 until the position detection portion 60 and the second detector 50 mate, indicating that the opening 171 of the carrier 10 has been rotated to correspond with the loading device.

[0097] The second detector 50 can be an optical signal detector, an acoustic signal detector, etc. For example, the second detector 50 can be used to emit at least one of the detection signals such as optical signals or acoustic signals, and can determine whether the second detector 50 cooperates with the detection part 60 based on the reflected detection signal.

[0098] Specifically, the second detector 50 includes a transmitter 53 and a receiver 54. The second detector 50 is provided with a mating slot 55 between the transmitter 53 and the receiver 54. The transmitter 53 is used to transmit a light signal toward the receiver 54, and the receiver 54 is used to detect the light signal. When the second detector 50 is mated with the position detection portion 60, the position detection portion 60 is located in the mating slot 55 and blocks the transmitter 53, so that the receiver 54 cannot detect the light signal emitted by the transmitter 53. In this way, whether the second detector 50 is mated with the position detection portion 60 can be determined based on whether the receiver 54 can detect the light signal emitted by the transmitter 53, so as to reflect whether the opening 171 of the carrier 10 corresponds to the loading device.

[0099] See also Figure 5 The present application further provides a semiconductor processing apparatus 1000, comprising a processing device 500 and the carrier device 100 of any of the aforementioned embodiments. The semiconductor processing apparatus 1000 may further comprise a second detector 50 of any of the aforementioned embodiments, configured to cooperate with the position detection portion 60 of the carrier device 100 to detect whether the opening 171 of the carrier 10 corresponds to the loading device.

[0100] The processing device 500 corresponds to the carrier device 100 and is used to process the workpiece carried on the carrier device 100. In one embodiment, the processing device 500 may be a detector, which can be used to detect defects in the workpiece carried on the carrier device 100. In one embodiment, the processing device 500 may be an etching device, which can be used to etch the workpiece carried on the carrier device 100. In another embodiment, the processing device 500 may also be a coating device, which can be used to perform vapor deposition, sputtering, etc. on the workpiece carried on the carrier device 100. In another embodiment, the processing device 500 may also be a cutting device, which can be used to cut, etc. the workpiece carried on the carrier device 100. The processing device 500 may also be of other types, all of which fall within the scope of protection of the present application and are not listed here one by one.

[0101] For example, the processing device 500 may be disposed below the carrier 100 to process the portion of the workpiece exposed from the first through hole 16 and the second through hole 131 of the carrier 10 .

[0102] Throughout this specification, reference to the terms "certain embodiments," "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0103] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Thus, a feature specified as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, "plurality" means at least two, for example, two or three, unless otherwise specifically defined.

[0104] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are illustrative and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application. The scope of the present application is defined by the claims and their equivalents.

Claims

1. A carrying device, characterized in that: include: A carrier, the carrier comprising a carrier surface, the carrier being provided with an air path, the carrier surface comprising a first area and a second area surrounding the first area, the air path being used to extract air to adsorb the workpiece in the first area, wherein the air path comprises a plurality of grooves provided in the first area and air holes communicating with the grooves, the air holes being used to communicate with an air extraction unit, wherein the grooves may be a plurality of concentric rings distributed in the first area and surrounding the center of the carrier surface, and the distances between the rings are the same; a pressing assembly, the pressing assembly being used to press the workpiece in the second area; and a driving member connected to the pressing assembly and configured to drive the pressing assembly to move relative to the carrier to selectively press or release the workpiece; Wherein, in the case where the carrier is provided with a first through hole, there are a plurality of first through holes, and the first through holes are located in the first area and are used to expose a portion of the surface of the workpiece in contact with the carrying surface for inspection when the workpiece is placed on the carrier; In the case where the carrier is provided with a first through hole and a second through hole, the carrier includes: a main body and a carrying part, the carrying part is provided on a first side of the main body, the carrying surface is located on a side of the carrying part away from the main body, and the driving member is installed on the main body; a plurality of the first through holes are located in the first area, and a plurality of the first through holes pass through the main body and the carrying part; the carrying part is provided with an opening passing through the side wall of the carrying part; the main body is provided with a plurality of second through holes, the second through holes corresponding to the openings, and the first through holes and the second through holes are used to expose a portion of the surface of the workpiece that is in contact with the carrying surface for detection when the workpiece is placed on the carrier.

2. The carrying device according to claim 1, characterized in that: The pressing assembly comprises: A pressure ring corresponding to the second area is connected to the driving member, and the driving member is used to drive the pressure ring to move relative to the supporting member so as to press the workpiece against the second area.

3. The carrying device according to claim 2, characterized in that: The compression assembly further comprises: a pressing block, the pressing block being mounted on the first surface of the pressing ring and being used to press the workpiece tightly against the second area; The pressing block is annular and corresponds to the second area; or The pressure blocks include a plurality of pressure blocks, and the plurality of pressure blocks are evenly distributed around the center of the pressure ring.

4. The carrying device according to claim 3, characterized in that: The pressing ring is made of a metal material; and / or the pressing block is made of a non-metallic material.

5. The carrying device according to claim 2, characterized in that: The compression assembly further comprises: A pressure plate is installed on the second surface of the pressure ring and is used to connect the pressure ring and the driving member. The driving member can drive the pressure plate to move relative to the bearing member to drive the pressure ring to move.

6. The carrying device according to claim 5, characterized in that: The pressure plates include a plurality of pressure plates, the driving members include a plurality of pressure plates, each of the driving members is connected to a corresponding pressure plate, and the pressure plates are symmetrically distributed about the center of the pressure ring.

7. The carrying device according to claim 2, characterized in that: The carrying device further includes: A first detector is arranged on the pressure ring, and the first detector is used to send a detection signal and output a detection result based on the reflected detection signal. The detection result includes whether the bearing surface carries the workpiece, and when the bearing surface carries the workpiece, whether the workpiece is placed in a preset position.

8. The carrying device according to claim 7, characterized in that: The pressure ring is provided with a mounting portion, the second area is provided with a through hole corresponding to the mounting portion, the first detector is installed in the mounting portion, and sends the detection signal toward the through hole.

9. The carrying device according to claim 7, characterized in that: The first detectors include a plurality of first detectors, and the plurality of first detectors are evenly distributed around the center of the pressure ring.

10. The carrying device according to claim 1, characterized in that: The gas circuit further includes an air passage provided on a side surface of the carrier, and the air hole is connected to the air extraction unit through the air passage; or The air path further includes an air channel provided on a side surface of the carrier and a connecting groove provided in the first area and connected to the groove, the air channel is connected to the air hole, and the air hole is connected to the air extraction unit through the air channel.

11. The carrying device according to claim 1, characterized in that: The first through holes are evenly distributed relative to the center of the supporting component.

12. The carrying device according to any one of claims 1 to 11, characterized in that: The first area and the second area each include a plurality of first areas and a plurality of second areas, which are alternately arranged to radiate from the center of the carrier to each second area to form a plurality of bearing areas, and the plurality of bearing areas can bear workpieces of different sizes.

13. The carrying device according to claim 12, characterized in that: The clamping assembly includes a plurality of components, and each of the clamping components corresponds to one of the bearing areas.

14. A semiconductor processing device, characterized in that: include: processing device; and The carrying device according to any one of claims 1 to 13, wherein the processing device corresponds to the carrying device and is used to process the workpiece carried on the carrying device.

15. The semiconductor processing equipment according to claim 14, wherein: The semiconductor processing equipment further includes a position detection portion, which is disposed on the body of the carrier. The position detection portion is used to cooperate with the second detector and to detect whether the opening of the carrier corresponds to the loading device.

16. A method for fixing a workpiece using the carrying device according to any one of claims 1 to 13, characterized in that: include: The pressing assembly is driven by a driving member to move in a direction away from a carrier, wherein the carrier includes a carrier surface and an air path provided in the carrier, wherein the carrier surface includes a first area and a second area surrounding the first area, and the air path is used to pump air to adsorb the workpiece to the first area; placing the workpiece on the carrying surface; The pressing assembly is driven by the driving member to move in a direction close to the carrier, so that the workpiece is pressed in the second area; and The gas path is evacuated to adsorb the workpiece in the first area.

17. The method for fixing a workpiece using a carrier device according to claim 16, wherein: The pressing assembly includes a pressing ring corresponding to the second area, the pressing ring is connected to the driving member, and the driving member is used to drive the pressing ring to move relative to the supporting member so as to press the workpiece against the second area; the supporting device also includes a first detector, which is arranged on the pressing ring, and is used to send a detection signal and output a detection result based on the reflected detection signal, wherein the detection result includes whether the supporting surface carries the workpiece and whether the workpiece is placed in a preset position when the supporting surface carries the workpiece; the method further includes: The first detector confirms that the workpiece is located at the center of the carrying surface.

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