Method for manufacturing a light-emitting device and method for manufacturing a light-emitting module

Abstract

The present invention provides a method for manufacturing a light-emitting device with a narrow light-emitting surface and a method for manufacturing a light-emitting module. The method for manufacturing the light-emitting device (100) includes: preparing a plurality of element structures (15) each having a base substrate (10), a light-emitting element (20), and a light-transmitting component (30) in sequence; placing the plurality of element structures (15) in a manner such that the light-transmitting component (30) faces a sheet component (70); and forming a covering component (40) on the sheet component (70) to cover at least a portion of a side surface of the base substrate (10) in each element structure (15).

Description

Technical Field

[0001] The present disclosure relates to a method for manufacturing a light-emitting device and a method for manufacturing a light-emitting module. Background Art

[0002] Conventionally, light-emitting devices having multiple light-emitting surfaces are known. For example, Patent Document 1 discloses a light-emitting device comprising multiple light-emitting elements, a light-transmitting member covering the upper surfaces of the light-emitting elements, and a light-reflecting member integrally covering the side surfaces of the multiple light-emitting elements.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2016-27620 Summary of the Invention

[0006] Technical problem to be solved by the invention

[0007] Regarding the high-density configuration of multiple light-emitting surfaces, there is room for further improvement in the structure.

[0008] An object of the embodiments of the present disclosure is to provide a method for manufacturing a light-emitting device with a narrow light-emitting surface and a method for manufacturing a light-emitting module.

[0009] Technical solutions to technical problems

[0010] The manufacturing method of the light-emitting device of the embodiment of the present disclosure includes: a process of preparing a plurality of element structures each having a base substrate, a light-emitting element and a light-transmitting component in sequence; a process of placing the plurality of element structures in a manner such that the light-transmitting component is opposite to a sheet component; and a process of forming a covering component on the sheet component that covers at least a portion of the side surface of the base substrate in each of the element structures.

[0011] The method for manufacturing a light-emitting module according to an embodiment of the present disclosure includes: preparing a light-emitting device using the aforementioned method for manufacturing a light-emitting device; and placing the light-emitting device such that the base substrate and the module substrate face each other.

[0012] Effects of the Invention

[0013] The method for manufacturing a light-emitting device according to the embodiment of the present disclosure can manufacture a light-emitting device having a narrow light-emitting surface area.

[0014] The method for manufacturing a light-emitting module according to the embodiment of the present disclosure can manufacture a light-emitting module having a narrow distance between light-emitting surfaces. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1AIt is a perspective view schematically showing the structure of a light-emitting module including a light-emitting device according to an embodiment.

[0016] Figure 1B It is a plan view schematically showing the structure of a light-emitting module including the light-emitting device according to the embodiment.

[0017] Figure 1C yes Figure 1B IC-IC line cross-sectional view.

[0018] Figure 1D yes Figure 1B ID-ID line cross-sectional view.

[0019] Figure 1E It is a cross-sectional view schematically showing the structure of a light emitting device according to an embodiment.

[0020] Figure 1F It is a bottom view schematically showing the structure of the light emitting device according to the embodiment.

[0021] Figure 2 This is a flowchart of a method for manufacturing a light-emitting device according to an embodiment.

[0022] Figure 3 This is a flowchart of a method for manufacturing a light-emitting module according to an embodiment.

[0023] Figure 4A It is a cross-sectional view showing a step of placing a light-emitting element in the first element structure preparation step of the method for manufacturing a light-emitting device according to the embodiment.

[0024] Figure 4B It is a cross-sectional view showing a step of providing a light-transmitting member in the first element structure preparation step of the method for manufacturing a light-emitting device according to the embodiment.

[0025] Figure 4C 4 is a cross-sectional view showing a step of manufacturing a first element structure in a first element structure preparation step of a method for manufacturing a light emitting device according to an embodiment.

[0026] Figure 4D It is a cross-sectional view showing a step of forming a frame body in the method for manufacturing a light emitting device according to the embodiment.

[0027] Figure 4E It is a cross-sectional view showing a step of placing a first element structure in the method for manufacturing a light emitting device according to the embodiment.

[0028] Figure 4F It is a cross-sectional view showing a step of forming a cover member in the method for manufacturing a light emitting device according to the embodiment.

[0029] Figure 4GThis is a cross-sectional view showing a step of removing the sheet member in the method for manufacturing the light emitting device according to the embodiment.

[0030] Figure 4H It is a cross-sectional view showing a step of placing a light-emitting device in the method for manufacturing a light-emitting module according to the embodiment.

[0031] Figure 4I It is a plan view showing a step of placing a first element structure in the method for manufacturing a light emitting device according to the embodiment.

[0032] Figure 4J It is a plan view showing a step of forming a cover member in the method for manufacturing a light emitting device according to the embodiment.

[0033] Figure 4K It is a plan view showing a step of placing a light-emitting device in a method of manufacturing a light-emitting module according to an embodiment.

[0034] Figure 5A This is a cross-sectional view schematically showing the structure of a light-emitting module including the light-emitting device according to another embodiment 1.

[0035] Figure 5B This is a plan view schematically showing the structure of a light-emitting module including a light-emitting device according to another second embodiment.

[0036] Figure 5C This is a plan view schematically showing the structure of a light-emitting module including a light-emitting device according to another third embodiment.

[0037] Figure 5D This is a plan view schematically showing the structure of a light-emitting module including a light-emitting device according to another fourth embodiment.

[0038] Figure 5E This is a plan view schematically showing the structure of a light-emitting module including a light-emitting device according to another fifth embodiment.

[0039] Figure 5F This is a plan view schematically showing the structure of a light-emitting module including a light-emitting device according to another sixth embodiment.

[0040] Figure 5G This is a plan view schematically showing the structure of a light-emitting module including a light-emitting device according to another seventh embodiment.

[0041] Figure 5H This is a plan view schematically showing the structure of a light-emitting module including a light-emitting device according to another eighth embodiment.

[0042] Figure 6A This is a plan view schematically showing the structure of a light-emitting module including a light-emitting device according to another ninth embodiment.

[0043] Figure 6B yes Figure 6A Cross-sectional view at line VIB-VIB.

[0044] Figure 6C It is schematically represented Figure 6A A bottom view of the structure of a light-emitting device according to another embodiment 9.

[0045] Description of Reference Numerals

[0046] 2 base portion; 3 first wiring portion; 4 internal wiring portion; 5 second wiring portion; 6 substrate portion; 7 third wiring portion; 8 conductive adhesive material; 10 base substrate; 11 assembly substrate; 12 base region; 15 first element structure; 17 second element structure; 17a red element structure; 17b blue element structure; 17c green element structure; 20 light-emitting element; 23 element electrode of light-emitting element; 25 protection element; 27 element electrode of protection element; 30 Light-transmitting component; 40 Covering component; 50, 50A Frame; 51 Rod-shaped component; 52 Resin component; 70 Sheet component; 80 Module substrate; 100, 100A, 100B, 100C, 100D, 100E, 100F, 100G, 100H, 100I Light-emitting device; 200, 200A, 200B, 200C, 200D, 200E, 200F, 200G, 200H, 200I Light-emitting module. DETAILED DESCRIPTION

[0047] Hereinafter, the embodiment will be described with reference to the accompanying drawings. However, the scheme shown below illustrates a method for manufacturing a light-emitting device, a method for manufacturing a light-emitting module, a light-emitting device, and a light-emitting module that embody the technical idea of the present embodiment, and is not limited to the following. Furthermore, the dimensions, materials, shapes, and relative configurations of the constituent components described in the embodiment are merely examples unless otherwise specified, and are not intended to limit the scope of the present invention thereto. It should be noted that the sizes and positional relationships of the components shown in the drawings are exaggerated for clarity of description. Furthermore, the light-emitting elements shown in the drawings are illustrated as a set number as an example to make the structure easier to understand.

[0048] Implementation Methods

[0049] Figure 1A It is a perspective view schematically showing the structure of a light-emitting module including a light-emitting device according to an embodiment. Figure 1B It is a plan view schematically showing the structure of a light-emitting module including the light-emitting device according to the embodiment. Figure 1C yes Figure 1B Cross-sectional view at the IC-IC line. Figure 1D yes Figure 1BCross-sectional view at the ID-ID line. Figure 1E It is a cross-sectional view schematically showing the structure of a light emitting device according to an embodiment. Figure 1F It is a bottom view schematically showing the structure of the light emitting device according to the embodiment.

[0050] The light-emitting module 200 includes a light-emitting device 100 and a module substrate 80 on which the light-emitting device 100 is mounted.

[0051] [Light-emitting device]

[0052] First, the light emitting device 100 will be described.

[0053] The light-emitting device 100 has a plurality of element structures 15 (hereinafter appropriately referred to as first element structures 15 ) each including a base substrate 10 , a light-emitting element 20 and a light-transmitting component 30 in sequence, and has a covering component 40 that covers the side surfaces of each first element structure 15 and holds the plurality of first element structures 15 .

[0054] That is, the light emitting device 100 mainly includes a base substrate 10 , a light emitting element 20 , a protective element 25 , a light transmissive member 30 , a cover member 40 , and a frame 50 .

[0055] Hereinafter, each structure of the light emitting device 100 will be described.

[0056] The base substrate 10 is a component that supports the light-emitting element 20 and the protective element 25. The base substrate 10 is formed, for example, into a substantially rectangular shape when viewed from above. The base substrate 10 includes a base portion 2 and wiring for electrically connecting the light-emitting device 100 to the outside world. Specifically, the base substrate 10 includes a base portion 2, a first wiring portion 3, an internal wiring portion 4, and a second wiring portion 5, which serve as wiring provided on the base portion 2.

[0057] The base 2 is preferably made of an insulating material, and preferably a material that is difficult to transmit light emitted from the light-emitting element 20 and external light. For example, ceramics such as alumina, aluminum nitride, and mullite; thermoplastic resins such as PA (polyamide), PPA (polyphthalamide), PPS (polyphenylene sulfide), or liquid crystal polymers; and resins such as epoxy resins, polysiloxane resins, modified epoxy resins, polyurethane resins, or phenolic resins can be used. Among them, ceramics with good heat dissipation properties are preferably used.

[0058] In the light-emitting device 100, the distance between adjacent base substrates 10 is preferably 0.05 mm to 0.2 mm. Therefore, because the thickness of the cover member 40 disposed between the base substrates 10 is 0.05 mm to 0.2 mm, the adjacent base substrates 10 can be brought into close contact and bonded together. Furthermore, by disposing the cover member 40 between the base substrates 10, the effects of thermal stress caused by differences in thermal expansion coefficients can be suppressed.

[0059] The first wiring portion 3 is provided on the upper surface of the base portion 2 and is electrically connected to the light-emitting element 20 and the protective element 25. The second wiring portion 5 is provided on the lower surface of the base portion 2 and serves as an external electrode of the light-emitting device 100 and is electrically connected to an external power source. The internal wiring portion 4 is a wiring portion provided within the base portion 2, extending through the base portion 2 and electrically connecting the first wiring portion 3 and the second wiring portion 5. It should be noted that the light-emitting device does not necessarily have the protective element 25.

[0060] For example, metals such as Fe, Cu, Ni, Al, Ag, Au, Pt, Ti, W, and Pd, or alloys containing at least one of these metals, can be used as the first wiring portion 3, the internal wiring portion 4, and the second wiring portion 5. The first wiring portion 3, the internal wiring portion 4, and the second wiring portion 5 can be formed, for example, by electroplating, electroless plating, vapor deposition, sputtering, or the like.

[0061] The light emitting element 20 is a semiconductor element that emits light when a voltage is applied. The shape and size of the light emitting element 20 can be selected arbitrarily. As the color of light emitted by the light emitting element 20, any wavelength can be selected according to the application. For example, as a light emitting element 20 of the blue series (light with a wavelength of 430 to 500 nm) or the green series (light with a wavelength of 500 to 570 nm), a nitride-based semiconductor (Indium nitride) can be used. X Al Y Ga 1-X-Y As the red light emitting element 20 (light with a wavelength of 610 to 700 nm), in addition to nitride-based semiconductor elements, GaAlAs, AlInGaP, etc. can be used.

[0062] The light emitting element 20 preferably has positive and negative element electrodes 23 on one surface, so that it can be flip-chip mounted on the first wiring portion 3 on the base substrate 10 using a conductive adhesive. Examples of the conductive adhesive include eutectic solder, conductive paste, and bumps.

[0063] The protection element 25 is, for example, a Zener diode and includes positive and negative element electrodes 27 on one surface thereof, and is flip-chip mounted on the first wiring portion 3 on the base substrate 10 using a conductive adhesive.

[0064] The light-transmitting member 30 is a light-transmitting member formed of, for example, resin, glass, or an inorganic material. The light-transmitting member 30 is disposed on the light-emitting element 20. The light-transmitting member 30 preferably has a larger upper surface than the upper surface of the light-emitting element 20.

[0065] In the light-emitting device 100, the distance between adjacent light-transmitting components 30 exposed on the upper surface of the light-emitting device 100 is preferably 0.2 mm or less. When the distance between the light-transmitting components 30 is 0.2 mm or less, for example, when the light-emitting device 100 is applied to the light source of a variable-beam headlamp (Adaptive Driving Beam: ADB) of a vehicle, the light source can be reduced and the size of the headlamp lens can be reduced. Therefore, the main lens can be omitted in the optical system. In addition, the loss of light passing through the headlamp lens can be reduced. From the viewpoint of further reducing the light source, the distance between the light-transmitting components 30 is more preferably 0.1 mm or less, and further preferably 0.05 mm or less. From the viewpoint of ease of manufacturing the light-emitting device 100, the distance between the light-transmitting components 30 is preferably 0.03 mm or more.

[0066] The planar shape of the light-transmitting member 30 may be various shapes such as a circle, an ellipse, a square, or a polygon such as a hexagon. Among them, a rectangle such as a square or a rectangle is preferred, and a shape similar to the planar shape of the light-emitting element 20 is more preferred.

[0067] The light-transmitting component 30 may contain a wavelength conversion component. Examples of the wavelength conversion component include phosphors. Examples of the light-transmitting component 30 containing phosphors include sintered bodies of phosphors and components containing phosphor powder in resin, glass, ceramics, or other inorganic substances. Furthermore, the light-transmitting component 30 may include a resin layer containing phosphors and a glass layer containing phosphors formed on the surface of a molded body such as resin, glass, or ceramics. Furthermore, the light-transmitting component 30 may contain fillers such as diffusion materials depending on the purpose. Furthermore, in the case of containing fillers such as diffusion materials, the light-transmitting component 30 may contain fillers in resin, glass, ceramics, or other inorganic substances, or may form a resin layer containing fillers or a glass layer containing fillers on the surface of a molded body such as resin, glass, or ceramics.

[0068] As the phosphor, a phosphor known in the art can be used. For example, as a phosphor emitting green light, a yttrium aluminum garnet-based phosphor (e.g., Y3(Al,Ga)5O 12 :Ce), lutetium aluminum garnet-based phosphors (such as Lu3(Al,Ga)5O 12 :Ce), terbium aluminum garnet-based phosphors (such as Tb3(Al,Ga)5O 12:Ce), silicate-based phosphors (such as (Ba, Sr) 2SiO 4 :Eu), chlorosilicate-based phosphors (such as Ca8Mg(SiO4)4C l2 :Eu), β-Sialonyl phosphor (such as Si 6-z Al z O z N 8-z :Eu(0<z<4.2)), SGS-based phosphors (such as SrGa2S4:Eu), etc. As phosphors emitting yellow light, α-sialon-based phosphors (such as Mz(Si,Al) 12 (O,N) 16 (where 0<z≤2, and M is Li, Mg, Ca, Y, and lanthanoid elements other than La and Ce), etc. In addition, among the above-mentioned phosphors emitting green light, there are also phosphors emitting yellow light.

[0069] Furthermore, for example, yttrium aluminum garnet-based phosphors can shift the emission peak wavelength to the long wavelength side by replacing a portion of Y with Gd, thereby achieving yellow emission. Moreover, among them, there are also fluorescent substances that can achieve orange emission. As phosphors that emit red light, nitrogen-containing calcium aluminum silicate (CASN or SCASN)-based phosphors (such as (Sr,Ca)AlSiN3:Eu), BSESN-based phosphors (such as (Ba,Sr,Ca)2Si5N8:Eu), etc. can be cited. In addition, manganese-activated fluoride-based phosphors (formulated by the general formula (I)A2[M 1-a Mn a F6] (wherein, in the above general formula (I), A is at least one element selected from the group consisting of K, Li, Na, Rb, Cs and NH4, M is at least one element selected from the group consisting of Group IV elements and Group XIV elements, and a satisfies 0<a<0.2)). A representative example of such a manganese-activated fluoride-based phosphor is a phosphor of manganese-activated potassium fluorosilicate (e.g., K2SiF6:Mn).

[0070] As the diffusion material, a material known in the relevant technical field can be used, for example, barium titanate, titanium dioxide, aluminum oxide, silicon oxide, etc.

[0071] When a resin is used as the light-transmitting component 30 or as a binder between the phosphor and the diffusion material, the resin material may include thermosetting resins such as epoxy resin, modified epoxy resin, polysiloxane resin, and modified silicone resin.

[0072] The covering member 40 is a member provided around the plurality of first element structures 15. The covering member 40 is preferably made of a resin material. The covering member 40 is formed by, for example, using a resin containing a reflective material, i.e., a light-reflective resin, to cover the side surfaces of the first element structures 15. That is, the covering member 40 covers the side surfaces of the base substrate 10, the side surfaces of the light-emitting element 20, and the side surfaces of the light-transmitting member 30. The covering member 40 is also provided between adjacent first element structures 15, and the covering member 40 covers the outer peripheral side surfaces of each of the plurality of first element structures 15. Furthermore, when the light-emitting device 100 includes a frame 50, the covering member 40 is provided within the frame 50, between the frame 50 and the first element structures 15, and between the first element structures 15.

[0073] Here, the cover member 40 covers the side surfaces of the light-transmitting member 30 to the side surfaces of the base portion 2 of the base substrate 10, and the side surfaces and lower surface of the second wiring portion 5 are exposed from the cover member 40. Therefore, the lower surface of the base portion 2 (that is, the surface opposite to the surface on which the light-emitting element 20 is placed), the side surfaces of the second wiring portion 5, and the lower surface of the second wiring portion 5 are exposed from the cover member 40. However, the cover member 40 may also cover the side surfaces of the second wiring portion 5 while leaving the lower surface of the second wiring portion 5 exposed.

[0074] It should be noted that the cover member 40 only needs to cover at least a portion of the side surface of the base substrate 10 of each first element structure 15. However, from the perspective of light reflection, the cover member 40 preferably covers at least half of the height of the base substrate 10, and preferably covers the entire side surface of the base substrate 10. Here, as an example, the cover member 40 covers substantially the entire side surface of the base substrate 10, and is formed so that the surface is inclined between the frame 50 and the base substrate 10.

[0075] Examples of the resin material used for the cover member 40 include the materials exemplified as the resin material used for the light-transmitting member 30. Examples of the reflective material contained in the resin used for the cover member 40 include titanium dioxide, silicon dioxide, silicon oxide, aluminum oxide, zirconium oxide, magnesium oxide, potassium titanate, zinc oxide, silicon nitride, and boron nitride. Among these, titanium dioxide, which has a relatively high refractive index, is preferably used from the viewpoint of light reflection.

[0076] The frame 50 surrounds the plurality of first element structures 15 and supports the cover member 40. The frame 50 is, for example, rectangular in plan view and is disposed around the plurality of first element structures 15. The rectangular shape herein refers to a rectangular frame, or in other words, a rectangular ring. The frame 50 extends from the light-emitting surface of the light-emitting device 100 to approximately the center of the base portion 2 of the base substrate 10.

[0077] The frame 50 can be formed using a frame-shaped member made of metal, alloy, or ceramic. Examples of metals include Fe, Cu, Ni, Al, Ag, Au, Pt, Ti, W, and Pd. Examples of alloys include alloys containing at least one of Fe, Cu, Ni, Al, Ag, Au, Pt, Ti, W, and Pd.

[0078] Furthermore, a resin material may be used as the frame. In this case, the metal, alloy or ceramic component may be embedded in the frame formed of the resin material, or a portion of the frame may be formed of the resin material and the remaining portion may be formed of the metal, alloy or ceramic component.

[0079] The light emitting device 100 includes a plurality of first element structures 15. Here, the light emitting device 100 is shown as a row, with eleven first element structures 15 supported by the cover member 40. However, the light emitting device may include ten or fewer first element structures 15, or twelve or more.

[0080] [Light-emitting module]

[0081] Next, the light emitting module 200 will be described.

[0082] The light-emitting module 200 includes the aforementioned light-emitting device 100 and a module substrate 80 .

[0083] When the light emitting device 100 does not include the protection element 25 , it is preferable to include the protection element 25 on the module substrate 80 . Furthermore, the module substrate 80 may include electronic components other than the protection element 25 .

[0084] The light emitting device 100 has the structure as described above.

[0085] The module substrate 80 is a component on which the light emitting device 100 is mounted and electrically connects the light emitting device 100 to the outside. The module substrate 80 is formed into a substantially rectangular shape in a plan view, for example. The module substrate 80 includes a substrate portion 6 and a third wiring portion 7 .

[0086] Examples of the material of the substrate portion 6 include the materials exemplified as the materials used in the base portion 2 of the base substrate 10. Examples of the material of the third wiring portion 7 include the materials exemplified as the materials used in the first wiring portion 3 of the base substrate 10.

[0087] The light-emitting device 100 is mounted on the upper surface of the module substrate 80, and the second wiring portion 5 and the third wiring portion 7 are bonded via a conductive adhesive material 8. As the conductive adhesive material 8, for example, eutectic solder, conductive paste, bumps, etc. can be used. In the light-emitting module 200, the frame 50 is formed in a range of height from the light-emitting surface of the light-emitting device 100 to the center of the base portion 2 of the base substrate 10. In addition, in the light-emitting module 200, the cover member 40 is formed so that the surface is inclined between the frame 50 and the base substrate 10. Therefore, in the light-emitting module 200, a predetermined space is formed between the module substrate 80 and the module substrate 80 and the frame 50, and between the module substrate 80, the frame 50 and the base substrate 10.

[0088] [Lighting module action]

[0089] When the light-emitting module 200 is driven, current is supplied from an external power source to the light-emitting element 20 via the third wiring portion 7, the second wiring portion 5, the internal wiring portion 4, and the first wiring portion 3, causing the light-emitting element 20 to emit light. Of the light emitted by the light-emitting element 20, light traveling upward is output to the outside above the light-emitting device 100 via the light-transmitting member 30. Furthermore, light traveling downward is reflected by the cover member 40 and the base substrate 10 and output to the outside of the light-emitting device 100 via the light-transmitting member 30. Furthermore, light traveling between the light-emitting element 20 and the housing 50 is reflected by the cover member 40 and the housing 50 and output to the outside of the light-emitting device 100 via the light-transmitting member 30. Furthermore, light traveling between the light-emitting elements 20 is reflected by the cover member 40 and the housing 50 and output to the outside of the light-emitting device 100 via the light-transmitting member 30. In this case, by narrowing the distance between the light-transmitting members 30 (for example, to 0.2 mm or less), the structure of the optical system can be simplified and miniaturized when the light-emitting module 200 is applied to a light source of a vehicle headlamp.

[0090] Manufacturing method of embodiment

[0091] Figure 2 This is a flowchart of a method for manufacturing a light-emitting device according to an embodiment. Figure 3 This is a flowchart of a method for manufacturing a light-emitting module according to an embodiment.

[0092] [Method for manufacturing a light-emitting device]

[0093] First, an example of a method for manufacturing the light emitting device 100 will be described.

[0094] The manufacturing method of the light-emitting device 100 includes: a first element structure preparation step S101, which is a step of preparing a plurality of first element structures 15 that sequentially include a base substrate 10, a light-emitting element 20 and a light-transmitting component 30; a frame forming step S102, which is a step of forming a frame that surrounds the plurality of first element structures 15 on a sheet component 70; a first element structure placement step S103, which is a step of placing the plurality of first element structures 15 in a manner such that the light-transmitting component 30 is opposite to the sheet component 70; a covering component forming step S104, which is a step of forming a covering component 40 that covers at least a portion of the side surface of the base substrate 10 in each first element structure 15 on the sheet component 70; and a sheet component removal step S105, which is a step of removing the sheet component 70.

[0095] The first element structure preparation process S101 includes: an aggregate substrate preparation process S101a, which is a process of preparing an aggregate substrate 11 including a plurality of base regions 12 which become base substrates 10 after the aggregate substrate 11 is divided; a light-emitting element placement process S101b, which is a process of placing light-emitting elements 20 on a plurality of base regions 12; a light-transmitting component setting process S101c, which is a process of setting a light-transmitting component 30 on each light-emitting element 20; and a first element structure production process S101d, which is a process of producing a plurality of first element structures 15 by dividing the aggregate substrate 11 for each base region 12.

[0096] It should be noted that the materials and arrangements of the various components are the same as those described in the aforementioned description of the light emitting device 100 , and therefore their descriptions are appropriately omitted here.

[0097] (First Element Structure Preparation Step)

[0098] The first element structure preparation step S101 is a step of preparing a plurality of first element structures 15 including a base substrate 10 , a light emitting element 20 , and a light transmissive member 30 in this order.

[0099] This step S101 includes an aggregate substrate preparation step S101a, a light emitting element placement step S101b, a light transmissive member installation step S101c, and a first element structure fabrication step S101d.

[0100] 〈Assembly substrate preparation process〉

[0101] The collective substrate preparation step S101 a is a step of preparing the collective substrate 11 including a plurality of base regions 12 that will become base substrates 10 after the collective substrate 11 is divided.

[0102] The collective substrate 11 is a single substrate including a plurality of base regions 12 on which the light emitting elements 20 are mounted. Figure 4A In the figure, for convenience, the collective substrate 11 including four base regions 12 is shown, but the number of base regions 12 can be adjusted appropriately.

[0103] <Light-emitting element placement process>

[0104] The light emitting element placement step S101 b is a step of placing the light emitting elements 20 on the plurality of base regions 12 .

[0105] like Figure 4A As shown, in step S101b, each of the plurality of light emitting elements 20 is placed on each of the plurality of base regions 12. The light emitting element 20 is flip-chip mounted on the first wiring arranged in the base region 12 using a conductive adhesive with the electrode forming surface as the mounting surface.

[0106] Note that, at this time, each of the plurality of protection elements 25 is placed on each of the plurality of base regions 12 .

[0107] <Light-transmitting member installation step>

[0108] The light-transmitting member installation step S101 c is a step of installing the light-transmitting member 30 on each light-emitting element 20 .

[0109] like Figure 4B As shown, in step S101c, for example, a light-transmitting member 30 of a predetermined shape is bonded to the upper surface (i.e., the main light output surface) of the light-emitting element 20 opposite to the electrode-forming surface. When the light-emitting element 20 is bonded to the light-transmitting member 30, the bonding can be performed by direct bonding or via a light-transmitting bonding member.

[0110] <First Element Structure Manufacturing Process>

[0111] The first element structure fabrication step S101 d is a step of dividing the collective substrate 11 for each base region 12 to fabricate a plurality of first element structures 15 .

[0112] like Figure 4C As shown, in this step S101 d , the first element structure 15 is divided at predetermined positions of the collective substrate 11 to separate the first element structures 15 into a plurality of first element structures 15 .

[0113] The method for manufacturing the light-emitting device 100 combines a plurality of singulated first element structures 15. Specifically, since the screening process can be performed after each first element structure 15 is singulated, structures having light-emitting characteristics within a predetermined range can be selected from the singulated first element structures 15, allowing the light-emitting device 100 to be formed using a desired combination. This allows the light-emitting device 100 to be obtained with minimal color variation and a desired light-emitting color.

[0114] Furthermore, if a problem occurs in a portion of the first element structure 15 during the manufacturing process, only the problematic first element structure 15 can be discarded before the first element structure 15 is placed on the sheet member 70. In a light-emitting device in which multiple light-emitting elements are mounted on a single base substrate, if a problem occurs in a portion of the components, the entire light-emitting device must be discarded. Therefore, the light-emitting device manufacturing method of this embodiment can reduce the number of components discarded when a problem occurs during the manufacturing process.

[0115] (Frame Forming Process)

[0116] like Figure 4D As shown, the frame forming step S102 is a step of forming a frame surrounding the plurality of first element structures 15 on the sheet member 70 .

[0117] The frame body 50 can be formed by placing a frame-shaped member formed of metal, alloy, or ceramics at a desired position on the sheet member 70 , for example.

[0118] Using metal, alloy, or ceramic for the frame 50 can suppress warping of the cover 40 and provide a flat mounting surface for the light-emitting device 100. While using a resin material for the cover 40 might cause warping in the light-emitting device 100 due to shrinkage during curing, using a non-flexible material for the frame 50 can suppress this warping. This improves the mounting performance of the light-emitting device 100 on the module substrate 80.

[0119] Furthermore, by forming the frame 50 before the first element structure placement step S103, the first element structure 15 can be placed on the sheet member 70 with reference to the frame 50. Thus, the first element structure 15 can be placed with high accuracy even on a sheet member 70 that does not have alignment marks for placing the first element structure 15.

[0120] (First Element Structure Placing Step)

[0121] The first element structure placement step S103 is a step of placing the plurality of first element structures 15 so that the light-transmitting member 30 faces the sheet member 70. Specifically, the plurality of first element structures 15 are placed on the sheet member 70 so that the upper surface of the light-transmitting member 30 (i.e., the surface opposite to the surface on which the light-emitting elements 20 are placed) faces the upper surface of the sheet member 70. Since the singulated first element structures 15 are arranged on the sheet member 70, for example, when a blade is used for singulation, the first element structures 15 can be arranged at a distance shorter than the width of the blade. This allows for a light-emitting device 100 with a narrower distance between the light-emitting surfaces.

[0122] like Figure 4E and Figure 4I As shown, in step S103, a plurality of first element structures 15 are placed on the upper surface of the sheet member 70. The first element structures 15 are placed on the upper surface of the sheet member 70 with the upper surface of the light-transmitting member 30 as the mounting surface.

[0123] As the sheet member 70 , for example, a material well known in the technical field, such as a heat-resistant resin sheet, can be cited.

[0124] Here, by placing the plurality of first element structures 15 so that the upper surfaces of the light-transmitting members 30 face the sheet member 70 , the heights of the plurality of light-emitting surfaces included in the light-emitting device 100 can be made uniform.

[0125] (Covering Member Forming Step)

[0126] The covering member forming step S104 is a step of forming the covering member 40 on the sheet member 70 so as to cover at least a portion of the side surface of the base substrate 10 in each first element structure 15 .

[0127] like Figure 4F and Figure 4J As shown, in step S104 , the cover member 40 is formed in the frame 50 , and at least a portion of the side surface of the base substrate 10 in the first element structure 15 is covered with the cover member 40 .

[0128] In step S104 , uncured resin material forming the covering member 40 is placed between the frame 50 and the first element structure 15 and between adjacent first element structures 15 by, for example, potting or spraying.

[0129] In step S104, the cover member 40 is provided so as to cover the side surfaces of the first element structure 15 (i.e., the side surfaces of the base substrate 10, the side surfaces of the light-emitting element 20, and the side surfaces of the light-transmitting member 30) while exposing the upper surface of the base substrate 10. It should be noted that, here, the side surfaces of the second wiring portion 5 are not covered by the cover member 40. Furthermore, after the cover member 40 is provided to cover the upper surface of the base substrate 10, a portion of the cover member 40 may be removed by lapping, grinding, cutting, or the like, thereby exposing the upper surface of the base substrate 10, i.e., the upper surface of the second wiring portion 5.

[0130] Here, by forming the covering member 40 with the plurality of first element structures 15 placed so that the upper surfaces of the light-transmitting members 30 are opposite to the sheet member 70, the upper surfaces of the covering member 40 between the plurality of light-emitting surfaces of the light-emitting device 100 can be made roughly flush.

[0131] (Sheet member removal process)

[0132] The sheet member removing step S105 is a step of removing the sheet member 70 .

[0133] like Figure 4G As shown, in this step S105 , the sheet member 70 on which the first element structure 15 and the like are placed is peeled off to form the light emitting device 100 .

[0134] The light emitting device 100 obtained as described above has a narrow distance between light emitting surfaces and a substantially uniform height of the light emitting surfaces, and thus it is easy to adjust the light distribution of the optical system such as the lens.

[0135] [Method for manufacturing a light-emitting module]

[0136] Next, an example of a method for manufacturing the light emitting module 200 will be described.

[0137] The manufacturing method of the light-emitting module 200 includes: a light-emitting device preparation step S11, which is a step of preparing the light-emitting device 100 using the manufacturing method of the light-emitting device 100; and a light-emitting device placement step S12, which is a step of placing the light-emitting device 100 in a manner such that the base substrate 10 and the module substrate 80 face each other.

[0138] It should be noted that the materials and configurations of the various components are as described in the aforementioned description of the light emitting module 200 , and therefore their descriptions are appropriately omitted here.

[0139] (Light-emitting device preparation process)

[0140] The light emitting device preparation step S11 is a step of preparing the light emitting device 100 using the aforementioned method for manufacturing the light emitting device 100 .

[0141] In step S11 , the light emitting device 100 is manufactured by performing steps S101 to S105 .

[0142] (Light-emitting device mounting step)

[0143] The light emitting device placement step S12 is a step of placing the light emitting device 100 so that the base substrate 10 and the module substrate 80 face each other.

[0144] like Figure 4H and Figure 4K As shown, in step S12, the light emitting device 100 is placed on the upper surface of the module substrate 80. The light emitting device 100 is mounted on the upper surface of the module substrate 80 using the conductive adhesive 8 with the base substrate 10 side as the mounting surface.

[0145] Here, the frame 50 is formed to have a height ranging from the light-emitting surface of the light-emitting device 100 to approximately the center of the base portion 2 of the base substrate 10. Therefore, when the light-emitting device 100 is mounted on the module substrate 80, there is no need to consider height adjustment of the conductive adhesive material 8 when the frame 50 abuts against the upper surface of the module substrate 80. Consequently, the light-emitting device 100 can be easily mounted on the upper surface of the module substrate 80.

[0146] While the above specifically describes the method for manufacturing a light-emitting device, the method for manufacturing a light-emitting module, the light-emitting device, and the light-emitting module through embodiments of the present invention, the subject matter of the present invention is not limited to the foregoing description and should be interpreted broadly based on the claims. Furthermore, various modifications and improvements based on the foregoing description are also encompassed within the subject matter of the present invention.

[0147] Other Implementation Methods

[0148] like Figure 5A As shown, in the light emitting module 200A and the light emitting device 100A, the frame 50A is made of a resin containing a reflective material.

[0149] Examples of the resin material used for the frame body 50A include the materials exemplified as the resin material used for the light-transmitting member 30. Examples of the reflective material contained in the resin used for the frame body 50A include the materials exemplified as the reflective material contained in the resin used for the cover member 40.

[0150] The frame body 50A can be formed at a desired position on the sheet member 70 using, for example, a discharging device (resin discharging device) that can continuously discharge liquid resin using air pressure (see Japanese Patent Application Laid-Open No. 2009-182307).

[0151] Furthermore, as the frame body 50A, a resin molded body processed into a frame shape in advance may be prepared and arranged at a desired position on the sheet member 70 .

[0152] like Figure 5B As shown, in the light-emitting module 200B and the light-emitting device 100B, the frame 50B is generally rectangular in plan view and is formed from multiple different components. The two long sides of the rectangle of the frame 50B are rod-shaped members 51 formed from a material with higher rigidity than the cover member 40, while the two short sides of the rectangle are resin members 52 formed from a resin containing a reflective material. Specifically, the rod-shaped member 51 can be made of metal, alloy, or ceramic.

[0153] The frame 50B can be formed by placing the rod-shaped member 51 on the long side of the rectangle and providing the resin member 52 on the short side of the rectangle. Note that the rod-shaped member 51 may be provided on only one of the long sides of the rectangle.

[0154] like Figure 5C As shown, in the light-emitting module 200C and the light-emitting device 100C, the frame 50C has a generally rectangular shape when viewed from above, with two of the long sides of the rectangle made of metal, alloy, or ceramic. A rod-shaped member 51 made of a material with higher rigidity than the cover member 40 is placed on the long sides of the rectangle. To cover the rod-shaped member 51, a resin member 52 formed into a rectangular shape from a resin containing a reflective material is provided.

[0155] like Figure 5D As shown, in the light emitting module 200D and the light emitting device 100D, the frame 50D has the rod-shaped member 51 placed only on one of the long sides of the rectangle. Other than that, the light emitting module 200C and the light emitting device 100C are the same.

[0156] The light emitting device uses the rod-shaped member 51 as a part of the frame, thereby being able to suppress the warping of the covering member 40 when the covering member 40 is cured.

[0157] like Figure 5E As shown, in the light emitting module 200E and the light emitting device 100E, a plurality of first element structures 15 are arranged in a matrix. Here, the first element structures 15 are arranged in three rows, with seven first element structures 15 in the first row, nine first element structures 15 in the second row, and eleven first element structures 15 in the third row, for a total of twenty-seven first element structures 15.

[0158] like Figure 5FAs shown, in the light-emitting module 200F and the light-emitting device 100F, a plurality of first element structures 15 are arranged in a matrix of two rows and eleven columns. The first element structures 15 at both ends of each row are arranged so that the distance between the first element structures 15 adjacent to the row is longer than the distance between the first element structures 15 and the other first element structures 15 in the row.

[0159] like Figure 5G As shown, the light-emitting module 200G and the light-emitting device 100G combine first element structures 15 with different sizes of light-emitting surfaces. Here, the first element structures 15 with smaller light-emitting surfaces are arranged in a matrix of two rows and six columns in the central part of the light-emitting device 100G. In addition, three first element structures 15 with larger light-emitting surfaces are arranged side by side in the row direction on both sides of the row direction of the collection of first element structures 15 with smaller light-emitting surfaces. By arranging the first element structures 15 with smaller light-emitting surfaces in the central part, the light-emitting module 200G and the light-emitting device 100G can densely arrange a large number of first element structures 15 in the central part, compared with the case of arranging the first element structures 15 with larger light-emitting surfaces. By densely arranging the first element structures 15 in the central part, the light-emitting module 200G and the light-emitting device 100G can illuminate the central part (mainly the road) with higher precision, for example, when the light-emitting module 200G is applied to the light source of a vehicle headlamp.

[0160] like Figure 5H As shown, the light-emitting module 200H and the light-emitting device 100H arrange the first element structures 15 in two rows in a staggered pattern. To ensure that the gap in the row direction between the first element structures 15 in the first row and the first element structures 15 in the second row is zero or less, the first element structures 15 in the first row and the first element structures 15 in the second row are staggered in the row direction. Because the light-emitting module 200H and the light-emitting device 100H can maintain the gap in the row direction at zero or less, for example, when the light-emitting module 200H is used as a light source for a vehicle headlamp, it can provide more precise illumination in the width direction.

[0161] Thus, there is no limit to the number of rows and columns of light-emitting modules and light-emitting devices. The number of first element structures 15 in each row and column can be appropriately adjusted according to the desired light distribution pattern. Furthermore, the light-emitting modules and light-emitting devices can also appropriately adjust the combination of first element structures 15 with different light-emitting surface sizes and the arrangement of the first element structures 15 according to the light distribution pattern.

[0162] like Figure 6A As shown, the light emitting module 200I includes a light emitting device 100I and a module substrate 80 .

[0163] The light emitting device 100I includes a plurality of second element structures 17 including a base substrate 10, a light emitting element 20, and a light transmissive member 30 in this order, and a cover member 40 that covers the side surfaces of each second element structure 17 and holds the plurality of second element structures 17. Each of the plurality of second element structures 17 includes a protective element 25.

[0164] That is, the light-emitting device 100I mainly includes a base substrate 10 , a light-emitting element 20 , a protective element 25 , a light-transmitting member 30 , and a cover member 40 .

[0165] The second element structure 17 includes a red element structure 17a that emits red light, a blue element structure 17b that emits blue light, and a green element structure 17c that emits green light. The second element structure 17 is arranged in two rows and two columns, with the two red element structures 17a positioned diagonally, and the blue element structures 17b and green element structures 17c positioned diagonally.

[0166] The second element structure 17 is arranged so that the protection elements 25 are located on the outside. This allows the four light-transmitting members 30 to be arranged in a matrix at narrower intervals.

[0167] Examples of the red element structure 17a include a structure comprising a blue light-emitting element 20 and a light-transmitting member 30 containing a red phosphor. Examples of the blue element structure 17b include a structure comprising a blue light-emitting element 20 and a light-transmitting member 30 containing a diffusing material. Examples of the green element structure 17c include a structure comprising a green light-emitting element 20 and a light-transmitting member 30 containing a diffusing material. Alternatively, examples of the green element structure 17c include a structure comprising a blue light-emitting element 20 and a light-transmitting member 30 containing a green phosphor.

[0168] As the light-transmitting member 30 containing a red or green phosphor, a member having a phosphor-containing resin layer or a phosphor-containing glass layer formed on the surface of a glass plate can be used. Furthermore, as the light-transmitting member 30 containing a diffusing material, a member having a diffusing material-containing resin layer or a diffusing material-containing glass layer formed on the surface of a glass plate can be used.

[0169] When a plurality of element structures emitting different luminescent colors are combined as the second element structure 17, by making the heights of the element structures approximately the same, it is possible to suppress the cover member 40 from climbing up the upper surface of the base substrate 10. In the case where the amount of phosphor required to obtain the desired luminescent color varies in each element structure, and the difference in resin layer thickness caused by the presence or absence of phosphors can be adjusted by adjusting the thickness of the glass plate supporting the resin layer.

[0170] The light-emitting module 200I is a module in which the light-emitting device 100I is mounted on a module substrate 80 .

[0171] Other matters are the same as those of the light emitting device 100 and the light emitting module 200 of the embodiment.

[0172] In addition, the light-emitting device may include one red element structure 17a, one blue element structure 17b, and one green element structure 17c. Furthermore, the red element structures 17a, blue element structures 17b, and green element structures 17c may be arranged alternately in a row or in a matrix. Furthermore, the light-emitting device may include element structures that emit white light and element structures that emit ochre light. Furthermore, the light-emitting device can use element structures that emit light of various colors by adjusting the wavelength of the light-emitting element 20 used and the type and ratio of the phosphor contained in the light-transmitting component 30. Furthermore, the above-mentioned element structures can be arranged in any desired combination.

[0173] Furthermore, the light-emitting device and light-emitting module as described above may or may not have a frame. Furthermore, in the case of having a frame, the frame may be intermittently arranged along the periphery of the light-emitting device. Furthermore, the frame may be formed from the light-emitting surface of the light-emitting device to the height of the second wiring portion of the base substrate 10. In this case, the frame of the light-emitting module may be bonded to the module substrate via a conductive adhesive material. According to such a structure, the heat generated by the light-emitting device is dissipated to the module substrate via the frame. Therefore, the heat dissipation of the light-emitting module is more excellent. It should be noted that the frame may be bonded to the module substrate via a non-conductive adhesive material, or may be simply arranged on the module substrate without an adhesive material.

[0174] Furthermore, the base substrate and the module substrate may be substantially square in plan view, and the frame may be substantially square in plan view. The base substrate, the module substrate, and the frame may also be in other shapes.

[0175] Furthermore, the method for manufacturing a light-emitting device and a light-emitting module may include other steps between or before or after the aforementioned steps, as long as they do not affect the aforementioned steps. For example, an impurity removal step may be included to remove impurities introduced during the manufacturing process.

[0176] In the first element structure preparation step, after a plurality of light-emitting elements 20 are placed on the base substrate 10, the light-transmitting member 30 is provided on each light-emitting element 20. However, the light-transmitting member 30 may be provided on the light-emitting element 20 before being placed on the base substrate 10. Alternatively, the light-emitting element 20 and the light-transmitting member 30 may be provided on the base substrate 10 after the assembly substrate 11 is divided.

[0177] Furthermore, in the method for manufacturing a light-emitting device and the method for manufacturing a light-emitting module, the order of some processes is not limited, and the order can be changed. For example, in the aforementioned method for manufacturing a light-emitting device, the frame forming process is performed before the first element structure placement process. However, the frame forming process can also be performed after the first element structure placement process and before the cover component forming process. Furthermore, the frame forming process can also be performed after the second element structure placement process and before the cover component forming process or before the second cover component forming process. Furthermore, the frame forming process can be performed before the first element structure preparation process.

[0178] Industrial Applicability

[0179] The light-emitting devices and modules disclosed herein can be used as variable-beam headlamp light sources. Furthermore, they can be used in backlight sources for liquid crystal displays, various lighting fixtures, large displays, various display devices such as advertisements and destination guides, as well as image readers such as digital cameras, fax machines, copiers, and scanners, and projection devices.

Claims

1. A method for manufacturing a light emitting device, characterized in that: Include: a step of preparing a plurality of element structures each including a base substrate, a light-emitting element, and a light-transmitting member in this order; a step of placing a plurality of the element structures so that the light-transmitting member and the sheet member face each other; forming a covering member on the sheet member to cover at least a portion of a side surface of the base substrate in each of the element structures; Before the process of forming the covering component on the sheet component, the process includes forming a frame body surrounding the plurality of the element structures on the sheet component, forming the covering component within the frame, and using the covering component to cover at least a portion of the side surface of the base substrate in the element structure.

2. The method for manufacturing a light emitting device according to claim 1, wherein: The frame is rectangular in a plan view, and one or two long sides of the rectangle are made of metal, alloy or ceramic.

3. The method for manufacturing a light emitting device according to claim 1, wherein: The frame is made of metal, alloy or ceramic.

4. The method for manufacturing a light-emitting device according to any one of claims 1 to 3, wherein: The step of preparing a plurality of the element structures includes: preparing the collective substrate including a plurality of base regions that will become the base substrates after the collective substrate is divided; a step of placing the light-emitting elements on a plurality of the base regions; a step of providing a light-transmitting member on each of the light-emitting elements; The step of dividing the collective substrate for each of the base regions to produce a plurality of the device structures.

5. The method for manufacturing a light-emitting device according to any one of claims 1 to 3, wherein: The method further includes the step of removing the sheet member.

6. The method for manufacturing a light-emitting device according to any one of claims 1 to 3, wherein: The covering member is made of light-reflective resin.

7. A method for manufacturing a light emitting module, characterized in that: Include: A step of preparing a light-emitting device using the method for manufacturing a light-emitting device according to any one of claims 1 to 6; The step of placing the light emitting device so that the base substrate and the module substrate face each other.

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