Connecting device and its conductive method

Abstract

The present application discloses a connection device and its conductive method. The connection device includes a first connection end and a second connection end. The first connection end includes a first connection interface, a first controller, and a first waterproof layer. The first waterproof layer covers the first connection interface. The first connection interface is connected to the first controller. The first controller includes a signal enhancement unit, and the signal enhancement unit is used to receive a signal and enhance the signal so as to output the enhanced signal through the first connection interface. The second connection end includes a second connection interface, a second controller, and a second waterproof layer. The second connection interface is connected to the second controller. The second waterproof layer covers the second connection interface. The first connection interface and the second connection interface are docked with each other. The first waterproof layer and the second waterproof layer are sandwiched between the first connection interface and the second connection interface. The second controller is used to receive, through the second connection interface, the enhanced signal output from the first connection interface and passing through the first waterproof layer and the second waterproof layer.

Description

Technical Field

[0001] This application relates to the field of connection devices, and particularly to a connection device with a waterproof effect and its conductive method. Background Art

[0002] With the progress of technology, various electronic devices have been widely used in daily life. Generally, multiple connection devices are provided inside an electronic device. Among them, the connection interface for connecting to an external device in the connection device needs to be exposed to the external environment, so that when in use, if it comes into contact with liquid or moisture, it is likely to be damaged by moisture or cause a short circuit. Therefore, the waterproof function has become a function that the connection device needs to possess.

[0003] Currently, there are mainly two methods to achieve the waterproof function of the connection device: The first method is to coat a waterproof film or apply a waterproof layer on the surface of all connection ends that need to be connected to each other after the connection device is assembled. The second method is to coat a waterproof film or apply a waterproof layer on the surfaces of all connection ends included in the connection device respectively (the electrical connection parts of any two connection ends need to be shielded to ensure conductivity), then assemble and connect the connection ends with the waterproof film or waterproof layer, and finally apply waterproof glue at the electrical connection parts of any two connection ends for waterproofing.

[0004] However, the above first method has problems of affecting subsequent assembly and increasing design difficulty because all connection ends that need to be connected to each other need to be assembled first. Moreover, when the connection device needs to be repaired, once the connected connection ends are disassembled, the waterproof film or waterproof layer will be damaged, and the subsequent connection device can no longer have the waterproof function. In addition, due to the limited penetration ability of the waterproof glue in the above second method, it cannot penetrate into tiny gaps, resulting in a risk of non-waterproofing; and it is difficult to disassemble the electrical connection parts of any two connection ends after applying glue, presenting a problem of being unable to be repaired.

[0005] In summary, it can be seen that there has long been a problem in the prior art that after disassembling the connected connection ends in the connection device, the connection device no longer has the waterproof function. Therefore, it is necessary to propose improved technical means to solve this problem. Summary of the Invention

[0006] The main purpose of this application is to provide a connection device and its conductive method, which solve the problem that there has long been in the prior art that after disassembling the connected connection ends in the connection device, the connection device no longer has the waterproof function.

[0007] To achieve the above object, this application is implemented as follows:

[0008] An embodiment of the present application provides a connection device, which includes: a first connection end and a second connection end. Among them, the first connection end includes a first connection interface, a first controller, and a first waterproof layer, and the second connection end includes a second connection interface, a second controller, and a second waterproof layer. The first waterproof layer covers the first connection interface, the first connection interface is connected to the first controller, the first controller includes a signal enhancement unit, and the signal enhancement unit is used to receive and enhance a signal so as to output the enhanced signal through the first connection interface; the second connection interface is connected to the second controller, the second waterproof layer covers the second connection interface, the first connection interface and the second connection interface are docked with each other, the first waterproof layer and the second waterproof layer are sandwiched between the first connection interface and the second connection interface, and the second controller is used to receive, through the second connection interface, the enhanced signal output by the first connection interface and passing through the first waterproof layer and the second waterproof layer.

[0009] An embodiment of the present application provides a conductive method for a connection device, which includes the following steps: providing a first connection end and a second connection end, where the first connection end includes a first connection interface and a first waterproof layer, the first waterproof layer covers the first connection interface, the second connection end includes a second connection interface and a second waterproof layer, and the second waterproof layer covers the second connection interface; docking the first connection interface and the second connection interface so that the first waterproof layer and the second waterproof layer are sandwiched between the first connection interface and the second connection interface; receiving a signal through the first connection end and enhancing the signal; outputting the enhanced signal through the first connection interface; receiving, through the second connection interface, the enhanced signal penetrating the first waterproof layer and the second waterproof layer.

[0010] In the embodiment of the present application, through the design that the enhanced signal can penetrate the first waterproof layer and the second waterproof layer for signal transmission, it is not necessary to particularly shield the electrical connection points when forming the waterproof layers on the surfaces of the first connection end and the second connection end respectively; after splitting the mutually connected first connection end and second connection end, the connection device still has a waterproof function; and for an electronic device applying the connection device, there will be no interference or influence in assembly and maintenance. Description of the Drawings

[0011] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The schematic embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation to the present application. In the drawings:

[0012] Figure 1 is a schematic structural diagram of an embodiment of the connection device of the present application;

[0013] Figure 2 is along Figure 1 the cross-sectional schematic diagram of the A-A line segment of

[0014] Figure 3It is a schematic structural diagram of an embodiment in which the first connection interface of the present application is combined with the second connection interface;

[0015] Figure 4 It is a schematic structural diagram of an embodiment of the signal enhancement unit of the present application;

[0016] Figure 5 It is a schematic structural diagram of an embodiment of the signal attenuation unit of the present application;

[0017] Figure 6 It is a flowchart of an example method of the conductive method of the connection device of the present application. Specific embodiments

[0018] The embodiments of the present invention will be described below in conjunction with the relevant drawings. In these drawings, the same reference numerals denote the same or similar components or method flows.

[0019] It must be understood that the words "comprising", "including", etc. used in this specification are used to indicate the presence of specific technical features, numerical values, method steps, operations, components, and / or components, but do not exclude the addition of more technical features, numerical values, method steps, operations, components, components, or any combination of the above.

[0020] The words such as "first", "second", "third", etc. used in the present invention are used to modify the components in the claims, and are not used to indicate a priority order, a precedence relationship, or that one component precedes another component, or the time sequence when performing method steps, but only to distinguish components with the same name.

[0021] It must be understood that when a component is described as "connected" or "coupled" to another component, it may be directly connected or coupled to other components, and intermediate components may occur. On the contrary, when a component is described as "directly connected" or "directly coupled" to another component, there are no intermediate components.

[0022] Please refer to Figure 1 and Figure 2 , Figure 1 It is a schematic structural diagram of an embodiment of the connection device of the present application, Figure 2 is along Figure 1Schematic cross-sectional view of line segment A-A. As shown in the figure, the connection device 100 includes: a first connection end 110 and a second connection end 120. The first connection end 110 includes a first connection interface 112, a first controller 114, and a first waterproof layer 116. The first waterproof layer 116 covers the first connection interface 112, and the first connection interface 112 is connected to the first controller 114. The second connection end 120 includes a second connection interface 122, a second controller 124, and a second waterproof layer 126. The second waterproof layer 126 covers the second connection interface 122, and the second connection interface 122 is connected to the second controller 124.

[0023] In this embodiment, the first connection interface 112 is a spring-type first connection interface or a thimble-type first connection interface, and the second connection interface 122 is a gold finger. However, this embodiment is not intended to limit the present application. In one embodiment, the first connection interface 112 is a connection terminal, and the second connection interface 122 is a gold finger. In another embodiment, both the first connection interface 112 and the second connection interface 122 are connection terminals. In yet another embodiment, both the first connection interface 112 and the second connection interface 122 are gold fingers.

[0024] In this embodiment, the materials of the first waterproof layer 116 and the second waterproof layer 126 are non-conductive materials. In one embodiment, the materials of the first waterproof layer 116 and the second waterproof layer 126 are selected from one or a combination of the following groups: insulators, semiconductors, polymer materials, pastes, conductive particles, organic substances, inorganic substances, and nano materials.

[0025] In one embodiment, the first connection end 110 may further include a main board 117 and a connector 118. The connector 118 is disposed on the main board 117. The first connection interface 112 is disposed on the connector 118. The first waterproof layer 116 covers the connector 118. The connection line between the first connection interface 112 and the first controller 114 is hidden inside the main board 117. The second connection end 120 may further include a small board 127 and a flexible cable 128. The flexible cable 128 is connected to the small board 127. The second connection interface 122 is disposed on the flexible cable 128. The second waterproof layer 126 covers the flexible cable 128. The connection line between the second connection interface 122 and the second controller 124 is hidden inside the small board 127 and the flexible cable 128.

[0026] In one embodiment, in order to strengthen the waterproof function of the first connection end 110 and the second connection end 120, the first waterproof layer 116 completely covers the first connection end 110, and the second waterproof layer 126 completely covers the second connection end 120.

[0027] Please refer to Figure 3, which is a schematic structural diagram of an embodiment in which the first connection interface of the present application is combined with the second connection interface. As shown in the figure, when assembling the first connection end 110 and the second connection end 120, the first connection interface 112 and the second connection interface 122 are docked with each other, so that the first waterproof layer 116 and the second waterproof layer 126 are sandwiched between the first connection interface 112 and the second connection interface 122. Since the materials of the first waterproof layer 116 and the second waterproof layer 126 are non-conductive materials, the energy of the signal transmitted between the first connection interface 112 and the second connection interface 122 needs to be large enough to enable the signal to pass through the first waterproof layer 116 and the second waterproof layer 126, thereby realizing effective signal transmission. For example, a signal with a small voltage cannot be transmitted between the first connection interface 112 and the second connection interface 122 through the first waterproof layer 116 and the second waterproof layer 126, but a signal with a large voltage (this voltage is greater than a specific threshold) can utilize the quantum tunneling effect to be transmitted between the first connection interface 112 and the second connection interface 122 through the first waterproof layer 116 and the second waterproof layer 126.

[0028] In some embodiments, such as Figure 2 and Figure 3 shown, the first connection interface 112 forms a slot-like shape, and the second connection interface 122 forms a plug-like shape, but the shapes of the first connection interface 112 and the second connection interface 122 are not limited to this. For example, the first connection interface 112 is a contact provided on the main board 117, and the second connection interface 122 is an elastic terminal (such as a pogo pin) provided on the small board 127. The small board 127 and the main board 117 can be fixed to each other through a snap structure, and the second connection interface 122 is pressed against the first connection interface 112.

[0029] Therefore, please refer to Figure 1 , in this embodiment, the first controller 114 includes a signal enhancement unit 1142, and the signal enhancement unit 1142 is used to receive and enhance a signal to output the enhanced signal through the first connection interface 112; the second controller 124 is used to receive the enhanced signal output by the first connection interface 112 and passing through the first waterproof layer 116 and the second waterproof layer 126 through the second connection interface 122.

[0030] In one embodiment, the signal enhancement unit 1142 is used to increase the initial voltage of the signal it receives to a first voltage to output an enhanced signal, where the first voltage is greater than the initial voltage, and when the voltage of the enhanced signal is the first voltage, its energy can enable the enhanced signal to cross the energy gap of the materials of the first waterproof layer 116 and the second waterproof layer 126, and then pass through the first waterproof layer 116 and the second waterproof layer 126. For example, the initial voltage can be 1.5 volts (V), and the first voltage can be 3V. In some embodiments, the magnitude of the first voltage is determined according to the voltage threshold at which the signal can pass through the first connection interface 112 and the second connection interface 122.

[0031] Please refer to Figure 4 , which is a schematic structural diagram of an embodiment of the signal enhancement unit of the present application. As shown in the figure, the signal enhancement unit 1142 may include a boost integrated circuit (IC) 31, a first inductor 32, a diode 33, a first resistor 34, and a second resistor 35. The input pin VIN1 and the enable pin EN1 of the boost IC 31 are connected; both ends of the first inductor 32 are respectively connected to the input pin VIN1 and the switch pin SW1 of the boost IC 31; both ends of the diode 33 are respectively connected to the switch pin SW1 of the boost IC 31 and one end of the first resistor 34 to conduct electricity from the switch pin SW1 to the first resistor 34; the other end of the first resistor 34 is connected to the feedback voltage pin FB1 of the boost IC 31 and one end of the second resistor 35, and the other end of the second resistor 35 is connected to the ground pin GND1 and the input pin VIN1 of the boost IC 31. The input pin VIN1 is used to receive the signal, and the ground pin GND1 is used for grounding. The enhanced signal is output from the connection between the diode 33 and the first resistor 34. Among them, the diode 33 is used to isolate and protect the boost IC 31; the first inductor 32 is used to store energy; the first resistor 34 and the second resistor 35 are used to feedback the voltage to the boost IC 31 to control the voltage of the signal output by the signal enhancement unit 1142 to output the required enhanced voltage.

[0032] In one embodiment, the signal enhancement unit 1142 may further include a first capacitor 36 and a second capacitor 37. Both ends of the first capacitor 36 are respectively connected to the input pin VIN1 and the ground pin GND1. One end of the second capacitor 37 is grounded, and the other end of the second capacitor 37 is connected to the output of the enhanced signal. The first capacitor 36 and the second capacitor 37 are used for filtering and / or energy storage to improve the stability of the voltage of the enhanced signal output by the signal enhancement unit 1142.

[0033] In one embodiment, the signal enhancement unit 1142 may further include a third capacitor 38, and the third capacitor 38 is connected in parallel with the first resistor 34 to achieve a feed-forward compensation function.

[0034] Since the energy of the enhanced signal output from the first connection interface 112 and passing through the first waterproof layer 116 and the second waterproof layer 126 may be too large to be directly used by the second connection end 120, it is necessary to weaken the energy of the enhanced signal passing through the first waterproof layer 116 and the second waterproof layer 126. Therefore, in one embodiment, the second controller 124 may include a signal weakening unit 1242, and the signal weakening unit 1242 is configured to receive, through the second connection interface 122, the enhanced signal output from the first connection interface 112 and passing through the first waterproof layer 116 and the second waterproof layer 126, and weaken the enhanced signal.

[0035] In one embodiment, the signal weakening unit 1242 is configured to weaken the voltage of the signal it receives. For example, the voltage of the enhanced signal passing through the first waterproof layer 116 and the second waterproof layer 126 is a first voltage, and the signal weakening unit 1242 may reduce the voltage of the enhanced signal passing through the first waterproof layer 116 and the second waterproof layer 126 from the first voltage to a second voltage (i.e., a standard voltage suitable for use by the second connection end 120) for subsequent signal use, where the first voltage is greater than the second voltage, and the second voltage may be greater than or equal to the initial voltage of the signal received by the signal enhancement unit 1142. For example, the second voltage may be 2V, the first voltage may be 3V, and the initial voltage of the signal received by the signal enhancement unit 1142 may be 1.5V. In some embodiments, when the standard voltage used by the second connection end 120 is equal to the first voltage, the second connection end 120 may omit the procedure of weakening the signal. For example, the initial voltage of the signal received by the signal enhancement unit 1142 is 1.5V, the first voltage is 3V, and the standard voltage used by the second connection end 120 is 3V. Then the signal enhancement unit 1142 enhances the initial voltage of the signal to 3V, and the second controller 124 can receive a signal with a voltage of 3V passing through the first connection interface 112 and the second connection interface 122 and can directly use the signal.

[0036] Please refer to Figure 5, which is a schematic structural diagram of an embodiment of the signal attenuation unit of the present application. As shown in the figure, the signal attenuation unit 1242 may include a buck IC 51, a second inductor 52, a pull-up resistor 53, a third resistor 54, and a fourth resistor 55. The input pin VIN2 and the enable pin EN2 of the buck IC 51 are connected. Two ends of the second inductor 52 are respectively connected to the switch pin SW2 of the buck IC 51 and one end of the third resistor 54; the other end of the third resistor 54 is connected to the feedback voltage pin FB2 of the buck IC 51 and one end of the fourth resistor 55, and the other end of the fourth resistor 55 is grounded. Two ends of the pull-up resistor 53 are respectively connected to the input pin VIN2 and the status indication pin PG of the buck IC 51. The input pin VIN2 of the buck IC 51 is used to receive the enhanced signal that penetrates the first waterproof layer 116 and the second waterproof layer 126. The ground pin GND2 of the buck IC 51 is used for grounding, and the attenuated signal is output from the connection between the second inductor 52 and the third resistor 54. Among them, the second inductor 52 is used for storing energy; the third resistor 54 and the fourth resistor 55 are used for feeding back the voltage to the buck IC 51 to control the voltage of the signal output by the signal attenuation unit 1242; the pull-up resistor 53 is used to ensure that the input pin VIN2 is in a logic high state (i.e., high level), prevent the logic state of the input pin VIN2 from being floating (i.e., play a pull-up role), and at the same time limit the current flowing into the input pin VIN2.

[0037] In one embodiment, the signal attenuation unit 1242 may further include a fourth capacitor 56 and a fifth capacitor 57. One end of the fourth capacitor 56 is grounded, and the other end of the fourth capacitor 56 is connected to the connection between the second inductor 52 and the third resistor 54; one end of the fifth capacitor 57 is grounded, and the other end of the fifth capacitor 57 is connected to the input pin VIN2 of the buck IC 51. The fourth capacitor 56 and the fifth capacitor 57 are used for filtering and / or energy storage to improve the stability of the voltage of the signal output by the signal attenuation unit 1242.

[0038] In one embodiment, the signal attenuation unit 1242 may further include a sixth capacitor 58, and the sixth capacitor 58 is connected in parallel with the third resistor 54 to achieve a feedforward compensation function.

[0039] In one embodiment, when the materials of the first waterproof layer 116 and the second waterproof layer 126 are quantum tunneling materials, the contact force generated by docking the first connection interface 112 and the second connection interface 122 (for example: when the first connection interface 112 is a leaf spring type first connection interface or a thimble type first connection interface, and the second connection interface 122 is a gold finger, docking the first connection interface 112 and the second connection interface 122 can generate a contact force) can exert pressure on the first waterproof layer 116 and the second waterproof layer 126, making the energy gap of the first waterproof layer 116 and the second waterproof layer 126 smaller (that is, the voltage threshold capable of generating the quantum tunneling effect will be correspondingly reduced), which helps the enhanced signal to pass through the first waterproof layer 116 and the second waterproof layer 126. In other words, when the first waterproof layer 116 and the second waterproof layer 126 between the first connection interface 112 and the second connection interface 122 are compressed under a certain pressure, the energy added by the signal enhancement unit 1142 to the signal it receives can be reduced. For example, when the first waterproof layer 116 and the second waterproof layer 126 between the first connection interface 112 and the second connection interface 122 are not under pressure or the pressure applied is too small to affect the energy gap, the signal enhancement unit 1142 needs to increase the initial voltage of the signal it receives to the first voltage in order to make the enhanced signal pass through the first waterproof layer 116 and the second waterproof layer 126; when the first waterproof layer 116 and the second waterproof layer 126 between the first connection interface 112 and the second connection interface 122 are under sufficient pressure, the signal enhancement unit 1142 only needs to increase the initial voltage of the signal it receives to the third voltage, and the third voltage is less than the first voltage, to make the enhanced signal pass through the first waterproof layer 116 and the second waterproof layer 126.

[0040] Please refer to Figure 6 , which is a flowchart of a method of an embodiment of the conductive method of the connection device of the present application. As shown in the figure, the conductive method of the connection device includes the following steps: providing a first connection end and a second connection end, where the first connection end includes a first connection interface and a first waterproof layer, the first waterproof layer covers the first connection interface, the second connection end includes a second connection interface and a second waterproof layer, and the second waterproof layer covers the second connection interface (step 310); docking the first connection interface and the second connection interface so that the first waterproof layer and the second waterproof layer are sandwiched between the first connection interface and the second connection interface (step 320); receiving a signal through the first connection end and enhancing the signal (step 330); outputting the enhanced signal through the first connection interface (step 340); receiving the enhanced signal that penetrates the first waterproof layer and the second waterproof layer through the second connection interface (step 350).

[0041] In one embodiment, enhancing the signal in step 330 includes: increasing the initial voltage of the signal to a first voltage. Wherein, the first voltage is greater than the initial voltage.

[0042] Since the energy of the enhanced signal passing through the first waterproof layer and the second waterproof layer may be too large, which is not conducive to the subsequent use of the signal. Therefore, in one embodiment, after step 350, the conductive method of the connection device may further include the following steps: weakening the enhanced signal received through the second connection interface. In one embodiment, weakening the enhanced signal received through the second connection interface further includes: weakening the first voltage of the enhanced signal received through the second connection interface to a second voltage. Wherein, the first voltage may be greater than the second voltage, and the second voltage may be greater than or equal to the above-mentioned initial voltage.

[0043] In one embodiment, docking the first connection interface and the second connection interface in step 320 further includes: applying pressure to the first waterproof layer and the second waterproof layer through the first connection interface and the second connection interface. The detailed description has been illustrated in the foregoing, and will not be repeated here.

[0044] In one embodiment, before step 310, the conductive method of the connection device may further include the following steps: depositing a first waterproof layer on the first connection interface by plasma enhanced chemical vapor deposition (PECVD) to cover the first connection interface with the first waterproof layer; and depositing a second waterproof layer on the second connection interface by plasma enhanced chemical vapor deposition to cover the second connection interface with the second waterproof layer. However, this embodiment is not intended to limit the present application, and the manner of covering the first connection interface with the first waterproof layer and covering the second connection interface with the second waterproof layer can be adjusted according to actual requirements such as the materials of the first waterproof layer and the second waterproof layer.

[0045] Please refer to Table 1 and Table 2. Table 1 is a corresponding table between the different contact force magnitudes generated by docking the first connection interface and the second connection interface and the voltage magnitudes of the signals that can penetrate the first waterproof layer and the second waterproof layer when the total thickness of the first waterproof layer and the second waterproof layer of the connection device of the present application is 500 nanometers (nm); Table 2 is a corresponding table between the different contact force magnitudes generated by docking the first connection interface and the second connection interface and the voltage magnitudes of the signals that can penetrate the first waterproof layer and the second waterproof layer when the total thickness of the first waterproof layer and the second waterproof layer of the connection device of the present application is 1000 nm. Wherein, the total thickness is the value obtained by adding the thickness of the first waterproof layer between the first connection interface and the second connection interface and the thickness of the second waterproof layer. Wherein, Table 1 and Table 2 list the contact forces between the four elastic terminals of the first connection interface and the four contacts corresponding to the four terminals of the second connection interface.

[0046] Table 1

[0047]

[0048] Table 2

[0049]

[0050] In Table 1 and Table 2, the unit of the contact force generated by docking the first connection interface and the second connection interface is Newton (N), and the unit of the voltage of the signal that can penetrate the first waterproof layer and the second waterproof layer is Volt (V).

[0051] As can be seen from Table 1 and Table 2, when the total thickness of the first waterproof layer and the second waterproof layer is 500 nm, the voltage of the signal that can penetrate the first waterproof layer and the second waterproof layer is 3 V (in other words, a signal voltage of 3 V can penetrate the first waterproof layer and the second waterproof layer), which can be applied to connection devices with relatively low waterproof requirements (for example: IPX7); when the total thickness of the first waterproof layer and the second waterproof layer is 1000 nm, the voltage of the signal that can penetrate the first waterproof layer and the second waterproof layer is 5 - 24 V (in other words, a signal voltage of 5 - 24 V can penetrate the first waterproof layer and the second waterproof layer), which can be applied to connection devices with relatively high waterproof requirements (for example: IPX8). In addition, it can also be known from Table 1 and Table 2 that increasing the voltage of the signal can enable the signal to penetrate a greater total thickness of the first waterproof layer and the second waterproof layer.

[0052] In summary, the present application provides a connection device and its conductive method. Through the design that the enhanced signal can penetrate the first waterproof layer and the second waterproof layer for signal transmission, when forming the first waterproof layer and the second waterproof layer on the surfaces of the first connection end and the second connection end respectively, there is no need to specially shield the electrical connection part, which can ensure the waterproof effect of the first connection end and the second connection end; after splitting the mutually connected first connection end and second connection end, the first waterproof layer and the second waterproof layer still remain on the first connection end and the second connection end, and the connection device still has the waterproof function; and for the electronic device applying the connection device, there will be no interference or influence during assembly and maintenance.

[0053] Although the above-described components are included in the drawings of the present application, it does not exclude using more other additional components without violating the spirit of the invention to achieve better technical effects. In addition, although the flowcharts of the present application are executed in a specified order, those skilled in the art can modify the order between these steps on the premise of achieving the same effect without violating the spirit of the invention. Therefore, the present invention is not limited to only using the order as described above. In addition, those skilled in the art can also integrate several steps into one step, or in addition to these steps, execute more steps sequentially or in parallel, and the present invention is not limited thereby either.

[0054] Although the present invention is described by using the above embodiments, it should be noted that these descriptions are not intended to limit the present invention. On the contrary, this invention covers modifications and similar arrangements that are obvious to those skilled in the art. Therefore, the scope of the claims should be interpreted in the broadest way to include all obvious modifications and similar arrangements.

Claims

1. A connecting device, characterized in that, Comprising: A first connection end, including a first connection interface, a first controller, and a first waterproof layer. The first waterproof layer covers the first connection interface. The first connection interface is connected to the first controller. The first controller includes a signal enhancement unit for receiving a signal and enhancing the signal to output the enhanced signal through the first connection interface. A second connection end, including a second connection interface, a second controller, and a second waterproof layer. The second connection interface is connected to the second controller. The second waterproof layer covers the second connection interface. The first connection interface and the second connection interface are docked with each other. The first waterproof layer and the second waterproof layer are sandwiched between the first connection interface and the second connection interface. The materials of the first waterproof layer and the second waterproof layer are non-conductive materials. The second controller is used to receive, through the second connection interface, the enhanced signal output by the first connection interface and passing through the first waterproof layer and the second waterproof layer by using the quantum tunneling effect. Wherein, the second controller includes a signal attenuation unit for receiving, through the second connection interface, the enhanced signal output by the first connection interface and passing through the first waterproof layer and the second waterproof layer by using the quantum tunneling effect, and attenuating the enhanced signal.

2. The connecting device according to claim 1, characterized in that, The signal attenuation unit includes a step-down IC, a second inductor, a pull-up resistor, a third resistor, and a fourth resistor. The input pin and the enable pin of the step-down IC are connected. Two ends of the second inductor are respectively connected to the switch pin of the step-down IC and one end of the third resistor. The other end of the third resistor is connected to the feedback voltage pin of the step-down IC and one end of the fourth resistor. The other end of the fourth resistor is grounded. Two ends of the pull-up resistor are respectively connected to the input pin and the status indication pin of the step-down IC. The input pin of the step-down IC is used to receive the enhanced signal penetrating the first waterproof layer and the second waterproof layer. The ground pin of the step-down IC is grounded. The attenuated signal is output from the connection point of the second inductor and the third resistor.

3. The connecting device according to claim 2, characterized in that, The signal attenuation unit further includes a fourth capacitor and a fifth capacitor. One end of the fourth capacitor is grounded, and the other end of the fourth capacitor is connected to the connection point of the second inductor and the third resistor. One end of the fifth capacitor is grounded, and the other end of the fifth capacitor is connected to the input pin of the step-down IC.

4. The connecting device according to claim 2, wherein, The signal attenuation unit further includes a sixth capacitor, and the sixth capacitor is in parallel with the third resistor.

5. The connecting device according to claim 1, characterized in that, The first connection end further includes a main board and a connector. The connector is arranged on the main board. The first connection interface is arranged on the connector. The first waterproof layer covers the connector. The second connection end further includes a small board and a cable. The cable is connected to the small board. The second connection interface is arranged on the cable. The second waterproof layer covers the cable.

6. The connecting device according to claim 1, characterized in that, The first connection interface is a leaf spring type first connection interface or a pin type first connection interface; the second connection interface is a gold finger.

7. The connecting device according to claim 1, characterized in that, The signal enhancement unit includes a boost IC, a first inductor, a diode, a first resistor, and a second resistor. The input pin and the enable pin of the boost IC are connected; both ends of the first inductor are respectively connected to the input pin and the switch pin of the boost IC; both ends of the diode are respectively connected to the switch pin of the boost IC and one end of the first resistor to conduct electricity from the switch pin to the direction of the first resistor; the other end of the first resistor is connected to the feedback voltage pin and one end of the second resistor of the boost IC, and the other end of the second resistor is connected to the ground pin and the input pin of the boost IC. The input pin is used to receive the signal, and the ground pin is used for grounding. The enhanced signal is output from the connection point of the diode and the first resistor.

8. The connecting device according to claim 7, characterized in that The signal enhancement unit further includes a first capacitor and a second capacitor. Both ends of the first capacitor are respectively connected to the input pin and the ground pin, one end of the second capacitor is grounded, and the other end of the second capacitor is connected to the output of the enhanced signal.

9. The connecting device according to claim 7, wherein The signal enhancement unit further includes a third capacitor, and the third capacitor is connected in parallel with the first resistor.

10. A conductive method for a connecting device, characterized in that, Including the following steps: Provide a first connection end and a second connection end. Among them, the first connection end includes a first connection interface and a first waterproof layer, and the first waterproof layer covers the first connection interface. The second connection end includes a second connection interface and a second waterproof layer, and the second waterproof layer covers the second connection interface. Dock the first connection interface and the second connection interface so that the first waterproof layer and the second waterproof layer are sandwiched between the first connection interface and the second connection interface. The materials of the first waterproof layer and the second waterproof layer are non-conductive materials. Receive a signal through the first connection end and enhance the signal. Output the enhanced signal through the first connection interface. Receive the enhanced signal that penetrates the first waterproof layer and the second waterproof layer by using the quantum tunneling effect through the second connection interface. Weaken the enhanced signal received through the second connection interface.

11. The conductive method of the connecting device according to claim 10, characterized in that, The weakening of the enhanced signal received through the second connection interface further includes: Weakening the first voltage of the enhanced signal received through the second connection interface to a second voltage.

12. The conductive method of the connecting device according to claim 10, characterized in that, It further includes: Deposit the first waterproof layer on the first connection interface by plasma enhanced chemical vapor deposition method so that the first waterproof layer covers the first connection interface. Deposit the second waterproof layer on the second connection interface by the plasma enhanced chemical vapor deposition method so that the second waterproof layer covers the second connection interface.

13. The conductive method of the connecting device according to claim 10, characterized in that, The receiving and enhancing the signal through the first connection end further includes: increasing the initial voltage of the signal to a first voltage.

14. The conductive method of the connecting device according to claim 10, characterized in that, The docking of the first connection interface and the second connection interface further includes: Press on the first waterproof layer and the second waterproof layer through the first connection interface and the second connection interface.

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