Display device and method of manufacturing the same

Abstract

The present disclosure relates to a display device and a method for manufacturing the display device, wherein the display device comprises: a lower substrate including a first area and a second area surrounding the first area; a display layer including a plurality of display elements located at the second area and having a first hole corresponding to the first area; and an upper substrate covering the display layer. The upper substrate comprises a lower surface facing the lower substrate, and the lower surface of the upper substrate has a first groove corresponding to the first area.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2019-0127862 filed on October 15, 2019, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference. Technical Field

[0003] Aspects of one or more example embodiments of the present disclosure relate to a display device and a method of manufacturing the display device. Background Art

[0004] The use of display devices has become more diverse. In addition, as the thickness and weight of display devices have been reduced, the use range of display devices has gradually expanded.

[0005] The area occupied by a display region for outputting an image has increased, and various functions that can be combined with or associated with a display device have gradually been developed.

[0006] The above information disclosed in this Background section is for enhancement of understanding of the background of the present disclosure and therefore the above information may contain information that does not constitute the prior art. Summary of the invention

[0007] One or more example embodiments of the present disclosure may relate to a display device, comprising an area in which components, such as a camera and / or a sensor, are arranged inside the display area (e.g., within the display area), and the area may have a relatively high light transmittance corresponding to the arrangement position of the components for smooth operation of the components (e.g., intended operation, expected operation, enhanced operation, or improved operation).

[0008] According to one or more example embodiments of the present disclosure, a display device includes: a lower substrate including a first area and a second area surrounding the first area; a display layer including a plurality of display elements located at the second area and having a first hole corresponding to the first area; and an upper substrate covering the display layer. The upper substrate includes a lower surface facing the lower substrate, and the lower surface of the upper substrate has a first groove corresponding to the first area.

[0009] In example embodiments, a space may be defined between the lower substrate and the upper substrate at the first region by the first hole and the first groove, and the space may have a height of about 10 μm to about 50 μm.

[0010] In example embodiments, a taper angle at one end of the first groove may be about 5° to about 60°.

[0011] In example embodiments, the first groove may have a depth of about 5 μm to about 45 μm.

[0012] In example embodiments, the plurality of display elements may include a first display element and a second display element that may be adjacent to each other, and the first display element and the second display element may be spaced apart from each other with respect to the first hole.

[0013] In example embodiments, each of the plurality of display elements may include a pixel electrode, an opposing electrode, and an intermediate layer between the pixel electrode and the opposing electrode, and the opposing electrode may be integrally provided as a single body and may have a hole corresponding to the first region.

[0014] In example embodiments, the display device may further include: an input sensing layer on the upper substrate, and the input sensing layer has a second hole corresponding to the first region.

[0015] In example embodiments, the lower substrate may include an upper surface facing the upper substrate, and the upper surface of the lower substrate may have a second groove corresponding to the first region.

[0016] In example embodiments, before forming the display layer, the second groove may be formed by an etching process.

[0017] In example embodiments, a space may be defined between the lower substrate and the upper substrate at the first region by the first groove, the first hole, and the second groove, and the space may have a height of about 10 μm to about 50 μm.

[0018] In example embodiments, each of the lower substrate and the upper substrate may include a glass material including silicon oxide (SiO 2 ), at least one of magnesium oxide (MgO), calcium oxide (CaO) and zinc oxide (ZnO).

[0019] According to one or more example embodiments of the present disclosure, a method for manufacturing a display device includes a first area and a second area surrounding the first area, the method including: forming a groove corresponding to the first area at at least one of a lower substrate and an upper substrate; forming a display layer on the lower substrate, the display layer including a plurality of display elements corresponding to the second area, and the display layer having a first hole corresponding to the first area; arranging the upper substrate on the lower substrate, the display layer being interposed between the lower substrate and the upper substrate; and bonding the upper surface of the lower substrate to the lower surface of the upper substrate by using a sealant.

[0020] In example embodiments, forming the groove may include: attaching an acid-resistant film to the lower surface of the upper substrate; removing a portion of the acid-resistant film corresponding to the first region and attached to the upper substrate; etching the upper substrate to which the acid-resistant film is attached by using an etchant; and removing a remaining portion of the acid-resistant film attached to the upper substrate.

[0021] In example embodiments, the forming the groove may include forming the groove to have a taper angle of about 5° to about 60°.

[0022] In example embodiments, the forming the groove may include forming the groove to have a depth of about 5 μm to about 45 μm.

[0023] In example embodiments, the groove and the first hole may overlap each other to form a space having a height of about 10 μm to about 50 μm.

[0024] In example embodiments, the etchant may include sulfuric acid (H 2 SO 4 ), at least one of hydrofluoric acid (HF) and hydrochloric acid (HCl).

[0025] In example embodiments, the sealant may be between the lower substrate and the upper substrate, and may surround the plurality of display elements.

[0026] According to one or more example embodiments of the present disclosure, a display device includes: a substrate including a first area and a second area surrounding the first area; and an input sensing layer located on a first surface of the substrate, the input sensing layer having a hole corresponding to the first area. The substrate has a groove corresponding to the first area at a second surface opposite to the first surface.

[0027] In example embodiments, the groove has a depth of about 5 μm to about 45 μm.

[0028] According to one or more embodiments, a display device may include: a lower substrate including a first area and a second area surrounding the first area (e.g., around the periphery of the first area); a display layer including a plurality of display elements arranged at the second area (e.g., arranged in the second area or arranged on the second area) and a first hole corresponding to the first area; an upper substrate covering the display layer; and a cavity defined by a space between the lower substrate and the upper substrate located at the first area (e.g., located in the first area or located on the first area). The cavity has a depth of about 10 μm to about 50 μm.

[0029] In example embodiments, at least one of the upper substrate and the lower substrate may include a groove overlapping the first hole at a position corresponding to the first region; and the cavity may be defined by the groove and the first hole. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The above and other aspects and features of the present disclosure will become more apparent to those skilled in the art through the following detailed description of example embodiments with reference to the accompanying drawings, in which:

[0031] Figure 1 is a schematic perspective view of a display device according to an embodiment;

[0032] Figure 2 is a cross-sectional view of a display device according to an embodiment;

[0033] Figure 3 is a cross-sectional view of a display device according to an embodiment;

[0034] FIG. 4A to FIG. 4C is a graph showing transmittance characteristics of each band according to the height of the cavity;

[0035] Figure 5 is a detailed cross-sectional view of a display panel according to an embodiment;

[0036] Figure 6 is a schematic diagram of an upper substrate according to an embodiment; and

[0037] 7A to 7E The processes of a method of forming a first groove in an upper substrate according to an embodiment are shown. DETAILED DESCRIPTION

[0038] Hereinafter, example embodiments will be described in more detail with reference to the accompanying drawings, wherein the same reference numerals always represent the same elements. However, the present disclosure can be implemented in various different forms and should not be construed as being limited to the embodiments shown herein. Instead, these embodiments are provided as examples so that the present disclosure will be sufficient and complete, and the aspects and features of the present disclosure will be fully conveyed to those skilled in the art. Therefore, it is not necessary to describe processes, elements and techniques that are not necessary for those of ordinary skill in the art to fully understand the aspects and features of the present disclosure. In addition, when a specific embodiment can be implemented differently, a specific process sequence may be different from the described process sequence. For example, two processes described in succession may be performed simultaneously or substantially simultaneously, or may be performed in an order opposite to the described order. Unless otherwise stated, throughout the drawings and written descriptions, the same reference numerals represent the same elements, and therefore, their descriptions may not be repeated.

[0039] In the accompanying drawings, for the sake of clarity, the relative sizes of elements, layers and regions can be exaggerated and / or simplified. For ease of explanation, spatial relative terms such as "below ... ", "below ... ", "below ... ", "below ... ", "above ... " and "on " can be used in this article to describe the relationship between an element or feature and another element (multiple elements) or feature (multiple features) as shown in the drawings. It will be understood that, in addition to the orientations depicted in the accompanying drawings, spatial relative terms are also intended to cover different orientations of the device in use or operation. For example, if the device is turned over in the accompanying drawings, the element described as "below" or "below" or "below" of other elements or features will then be positioned as "above" other elements or features. Therefore, the example terms "below ... " and "below ... " can cover both above and below. The device can be oriented in addition (for example, rotated 90 degrees or at other orientations), and the spatial relative descriptors used in this article should be interpreted accordingly. In the following examples, the x-axis, y-axis and z-axis are not limited to the three axes of the rectangular coordinate system, and can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis may be perpendicular to one another, or may represent different directions that are not perpendicular to one another.

[0040] It will be understood that, although the terms "first", "second", "third", etc. may be used herein to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the spirit and scope of the present disclosure, the first element, first component, first region, first layer or first part described below may be named as the second element, second component, second region, second layer or second part.

[0041] It will be understood that when an element, layer or component, such as a film, region and / or plate, is referred to as being "on", "connected to" or "coupled to" another element, layer or component, the element, layer or component may be directly on, directly connected to or directly coupled to the other element, layer or component, or there may be one or more intermediate elements, layers or components. In addition, it will be understood that when an element, layer or component is referred to as being "between" two elements, layers or components, the element, layer or component may be the only element, layer or component between the two elements, layers or components, or there may also be one or more intermediate elements, layers or components.

[0042] The terms used herein are for the purpose of describing a particular embodiment, and are not intended to limit the present disclosure. As used herein, unless the context clearly indicates otherwise, the singular forms "one" and "a kind of" are also intended to include plural forms. It will also be understood that when the terms "include", "comprise", "contain" and / or "have" are used in this specification, the features, wholes, steps, operations, elements and / or components stated are explained, but the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or their groups are not excluded. As used herein, the term "and / or" includes any combination and all combinations of one or more related listed items. For example, "A and / or B" refers to A or B or A and B. When a statement such as "at least one (kind) in ..." is before a column of elements, the entire column of elements is modified without modifying the individual elements of the column. For example, the statement "at least one (kind) in a, b and c" can represent only a, only b, only c, both a and b, both a and c, both b and c, all a, b and c or their deformations.

[0043] As used herein, the terms "substantially," "approximately," and similar terms are used as approximate terms rather than as terms of degree, and are intended to account for the inherent deviations of measurements or calculations that would be recognized by one of ordinary skill in the art. In addition, when "may" is used to describe an embodiment of the present disclosure, it refers to "one or more embodiments of the present disclosure." As used herein, the term "use" may be considered synonymous with the term "utilize." In addition, the term "exemplary" means an example or an illustration.

[0044] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present disclosure belongs. It will be further understood that, unless explicitly defined as such herein, terms such as those defined in general dictionaries should be interpreted as having a meaning consistent with their context in the relevant art and / or the meaning in this specification, and should not be interpreted in an idealized or overly formalized sense.

[0045] Figure 1 is a schematic perspective view of a display device 1 according to the embodiment.

[0046] Reference Figure 1 , the display device 1 may include a first area A1, a second area A2 and a third area A3.

[0047] The first area A1 may include an area with relatively high light transmittance corresponding to a component disposed in the display device 1 (e.g., disposed inside the display device 1). For example, the first area A1 may be understood as a transmission area through which light output from the component is transmitted to the outside and / or through which light incident from the outside is transmitted to the component. For example, the first area A1 may be referred to as a component area, a sensor area, or an opening area.

[0048] The second area A2 may be defined as an area at which (e.g., in or on which) a plurality of pixels are arranged. The display device 1 may provide desired image information by using light emitted from a plurality of pixels arranged at (e.g., arranged in or on) the second area A2. For example, the second area A2 may be referred to as a display area.

[0049] The second area A2 may be arranged to at least partially surround the first area A1 (eg, around the periphery of the first area A1). In an embodiment, the second area A2 may completely surround the first area A1. Figure 1 The first area A1 shown in FIG. Figure 1 around the periphery of the first area A1 shown in ).

[0050] The second area A2 may be positioned within the third area A3 (e.g., positioned inside the third area A3). In other words, the third area A3 may surround the second area A2 (e.g., around the periphery of the second area A2). For example, the first area A1 may be surrounded by the second area A2 (e.g., the second area A2 may be around the periphery of the first area A1), and the second area A2 may be surrounded by the third area A3 (e.g., the third area A3 may be around the periphery of the second area A2).

[0051] The third area A3 may include an area at which (e.g., in or on which) a circuit configuration for providing an electrical signal to a pixel arranged at (e.g., arranged in or on) the second area A2 may be located. Figure 1 , the first area A1 and the third area A3 may correspond to non-display areas at which (eg, in or on which) pixels are not arranged.

[0052] although Figure 1 It is shown that the first area A1 is arranged at one side (e.g., the upper left side) of the second area A2 (e.g., arranged in one side (e.g., the upper left side) of the second area A2 or arranged on one side (e.g., the upper left side) of the second area A2), but the present disclosure is not limited to this, and the position and / or number of the first area A1 may be modified differently. For example, the first area A1 may be arranged at the upper central part of the plane (e.g., the xy plane) of the second area A2 (e.g., arranged in the upper central part of the plane (e.g., the xy plane) of the second area A2 or arranged on the upper central part of the plane (e.g., the xy plane) of the second area A2), and / or the first area A1 may be provided as a plurality of first areas A1 at the second area A2 (e.g., in the second area A2, on the second area A2, inside the second area A2, or within the second area A2). In addition, although Figure 1 The second area A2 (e.g., in a plan view) is shown to have a rectangular or substantially rectangular shape, but the present disclosure is not limited thereto. For example, the second area A2 (e.g., in a plan view) may have any other suitable shape, such as a circle, a polygon (e.g., such as a triangle and / or a pentagon, etc.), and / or an ellipse, etc.

[0053] In the following, for the convenience of description, an organic light-emitting display device may be described as an example of a display device 1 according to an embodiment, but the present disclosure is not limited thereto. For example, in other embodiments, the display device 1 may include (e.g., may be) various suitable types of display devices, such as an inorganic light-emitting display (e.g., an inorganic EL display) device and / or a quantum dot light-emitting display device, etc. For example, the emission layer of the display element provided in the display device 1 may include an organic material, an inorganic material, a quantum dot, an organic material and a quantum dot, and / or an inorganic material and a quantum dot, etc.

[0054] The display device 1 may be included in (or may be) various electronic devices, such as a mobile phone, a laptop computer, and / or a smart watch, for example.

[0055] Figure 2 is a cross-sectional view of a display device 1 according to an embodiment. For example, Figure 2 can correspond to along Figure 1 A cross section of the display device 1 taken along line II'.

[0056] Reference Figure 2 The display device 1 may include: a display panel 10; an input sensing layer 40 and / or an optical functional layer 50 arranged on the display panel 10; and a window 60 covering the display panel 10 and the input sensing layer 40 and / or the optical functional layer 50.

[0057] The window 60 may be connected to (eg, attached to or bonded to) an element thereunder, such as the optically functional layer 50 (or the input sensing layer 40 ), via an adhesive layer 70 , such as, for example, an optically clear adhesive (OCA).

[0058] The display device 1 may further include a component 20 located below the display panel 10 .

[0059] The component 20 may include an electronic component that uses light. For example, the component 20 may include a device that uses light of various wavelength bands such as visible light, infrared light, and / or ultraviolet light. For example, the component 20 may include a camera module (e.g., a camera or a camera device) for obtaining image information by using light from the outside (e.g., by using external light).

[0060] The display panel 10 may include: a lower substrate 100; an upper substrate 200 located on the lower substrate 100 (e.g., facing the lower substrate 100); and a display layer 300 interposed between the lower substrate 100 and the upper substrate 200. The display panel 10 may also include a sealant 540 covering the side surface of the display layer 300 interposed between the lower substrate 100 and the upper substrate 200. The sealant 540 may be positioned to surround the plurality of display elements of the display layer 300 (e.g., around the periphery of the plurality of display elements of the display layer 300) to protect the plurality of display elements, and may connect the lower substrate 100 to the upper substrate 200 (e.g., may bond the lower substrate 100 to the upper substrate 200).

[0061] Each of the lower substrate 100 and the upper substrate 200 may include silicon oxide (SiO 2 ), at least one of magnesium oxide (MgO), calcium oxide (CaO), and zinc oxide (ZnO). For example, in an embodiment, each of the lower substrate 100 and the upper substrate 200 may include SiO 2 Glass material as the main component.

[0062] According to another example, each of the lower substrate 100 and the upper substrate 200 may include a polymer resin. For example, in an embodiment, each of the lower substrate 100 and the upper substrate 200 may have a multilayer structure including a layer including a polymer resin and an inorganic layer.

[0063] The display layer 300 may be positioned between the lower substrate 100 and the upper substrate 200 .

[0064] The display layer 300 may include a plurality of pixels. The display layer 300 may include: a display element layer 300A, including a display element provided for each pixel; and a pixel circuit layer 300B, including a pixel circuit electrically connected to each display element in the display element and an insulating layer between the pixel circuits. For example, each display element in the display element of the display element layer 300A may include an organic light emitting diode (OLED). Each display element in the display element may be positioned at the second area A2 (e.g., positioned in or on the second area A2).

[0065] The display layer 300 may include a first hole 350 at a position corresponding to the first area A1. For example, the component 20 positioned below the lower substrate 100 to correspond to the first area A1 may receive light passing through (e.g., transmitted through) the first hole 350, and / or may emit light to the outside through the first hole 350. For example, the first hole 350 may define the first area A1. As an example, in the display device 1, the first area A1 may correspond to an area at which (e.g., in or on which) the first hole 350 of the display layer 300 is formed.

[0066] According to an embodiment, the upper substrate 200 may include a first groove 250 corresponding to the first area A1. For example, the first groove 250 may be positioned on the lower surface of the upper substrate 200, which may be a surface of the upper substrate 200 facing the lower substrate 100. The first groove 250 may be provided to have a concave shape toward the inside of the upper substrate 200 (e.g., extending toward the upper surface) at a position corresponding to the first area A1 on the lower surface of the upper substrate 200. The upper substrate 200 may have a thickness H201 at the first area A1 (e.g., in the first area A1) (e.g., in the Z-axis direction), and the thickness H201 may be smaller (e.g., less than) the thickness of the upper substrate 200 (e.g., in the Z-axis direction) at another area (e.g., in another area), for example, the thickness H202 at the second area A2 (e.g., in the second area A2).

[0067] Reference Figure 2, the display panel 10 may include a cavity formed by a space between the lower substrate 100 and the upper substrate 200 at the first area A1 (e.g., in or on the first area A1). The cavity may refer to an air gap formed between the lower substrate 100 and the upper substrate 200. The cavity may correspond to a space defined by the first hole 350 of the display layer 300 and the first groove 250 of the upper substrate 200. In other words, in Figure 2 In the embodiment, the cavity may overlap with the first hole 350 and the first groove 250 .

[0068] The first groove 250 (e.g., in the Z-axis direction) of the upper substrate 200 may have a depth of about 5 micrometers (μm) to about 45 μm. In addition, the first hole 350 (e.g., in the Z-axis direction) of the display layer 300 may have a height of about 5 μm. In this case, the cavity (e.g., in the Z-axis direction) overlapping the first groove 250 and the first hole 350 may have a height H10 of about 10 μm to about 50 μm.

[0069] According to an embodiment, in the display panel 10, the cavity formed at the first area A1 corresponding to the position of the component 20 (e.g., formed in or on the first area A1 corresponding to the position of the component 20) may have a height of about 10 μm to about 50 μm, and thus, the change (e.g., deviation) in the transmittance of each band originating from the height variation (e.g., height deviation) of the cavity (e.g., caused by the height variation (e.g., height deviation) of the cavity) may be reduced or the change (e.g., deviation) in the transmittance of each band originating from the height variation (e.g., height deviation) of the cavity (e.g., caused by the height variation (e.g., height deviation) of the cavity may be minimized.

[0070] The input sensing layer 40 may be positioned on the display panel 10. For example, the input sensing layer 40 may be positioned on the upper substrate 200.

[0071] The input sensing layer 40 may obtain coordinate information according to an external input such as a touch event. The input sensing layer 40 may include sensing electrodes and / or touch electrodes and traces connected to the sensing electrodes and / or touch electrodes. The input sensing layer 40 may sense an external input (e.g., a touch event) by using a mutual capacitance (e.g., mutual capacitance) method or a self capacitance (e.g., self capacitance) method.

[0072] In an embodiment, the input sensing layer 40 may be formed separately from the display panel 10, and may be connected to (e.g., attached to or bonded to) the display panel 10 by an adhesive layer such as, for example, an optically transparent adhesive. In another embodiment, the input sensing layer 40 may be formed on the display panel 10 (e.g., directly formed on the display panel 10), for example, may be formed on the upper substrate 200 (e.g., directly formed on the upper substrate 200). For example, after the process of forming the display panel 10, the input sensing layer 40 may be formed (e.g., may be continuously formed) on the display panel 10. In this case, the input sensing layer 40 may be understood as a part of the display panel 10, and the adhesive layer may be omitted from between the input sensing layer 40 and the display panel 10 (e.g., the adhesive layer may not be between the input sensing layer 40 and the display panel 10). Although Figure 2 It is shown that the input sensing layer 40 may be between the display panel 10 and the optical functional layer 50, but the present disclosure is not limited thereto, and in another embodiment, the input sensing layer 40 may be positioned on the optical functional layer 50 (e.g., positioned on the opposite side of the optical functional layer 50). In this case, for example, the optical functional layer 50 may be between the display panel 10 and the input sensing layer 40.

[0073] The optical function layer 50 may include a reflection prevention layer. The reflection prevention layer may reduce reflectivity of light incident from the outside toward the display panel 10 through the window 60. The reflection prevention layer may include a phase retarder and a polarizer.

[0074] The phase retarder may be a film type or a liquid crystal coating type, and may include a λ / 2 (e.g., half-wave) phase retarder and / or a λ / 4 (e.g., quarter-wave) phase retarder. The polarizer may be a film type or a liquid crystal coating type. The film type may include an elongated synthetic resin film, and the liquid crystal coating type may include liquid crystals arranged in a desired or suitable arrangement. The phase retarder and the polarizer may also include a protective film. For example, the protective film or the phase retarder and the polarizer itself may be defined as a base layer of a reflection prevention layer. In another embodiment, the reflection prevention layer may include a black matrix and a color filter. The color filter may be arranged in consideration of the color of the light emitted from each pixel in the pixel of the display panel 10.

[0075] In another embodiment, the reflection prevention layer may include a destructive interference structure. The destructive interference structure may include a first reflection layer and a second reflection layer arranged at different layers from each other (e.g., arranged in different layers from each other or arranged on different layers from each other). The first reflected light and the second reflected light reflected from the first reflection layer and the second reflection layer, respectively, may destructively interfere with each other, and therefore, the reflectivity of the external light may be reduced.

[0076] The optical function layer 50 may include a lens layer. The lens layer may improve the luminous efficiency of the light emitted from the display panel 10, and / or may reduce color variation (e.g., color deviation). The lens layer may include a layer having a concave lens shape or a convex lens shape, and / or may include a plurality of layers having different refractive indices from each other. The optical function layer 50 may include both a reflection prevention layer and a lens layer, or may include any one of the reflection prevention layer and the lens layer as needed or desired.

[0077] In an embodiment, the optical function layer 50 may be formed (e.g., may be continuously formed) after the process of forming the display panel 10 and / or the input sensing layer 40. In this case, a separate adhesive layer may be omitted from between the optical function layer 50, the display panel 10, and / or the input sensing layer 40 (e.g., a separate adhesive layer may not be between the optical function layer 50, the display panel 10, and / or the input sensing layer 40).

[0078] The input sensing layer 40 and / or the optical functional layer 50 may include a hole corresponding to the first area A1. In this regard, in some embodiments, such as Figure 2 As shown in , the input sensing layer 40 and the optical function layer 50 may include a second hole 45 and a third hole 55, respectively, and the second hole 45 and the third hole 55 may overlap each other. For example, the first hole 350 of the display layer 300 and the first groove 250 of the upper substrate 200 may each have a width greater than the width of the component 20 (e.g., in the X-axis direction), and the second hole 45 and the third hole 55 may each have a width greater than the width of the first hole 350 (e.g., in the X-axis direction). In an embodiment, the third hole 55 may have a width greater than the width of the second hole 45.

[0079] In another embodiment, at least one of the input sensing layer 40 and the optical functional layer 50 may not include a hole.

[0080] Figure 3 is a cross-sectional view of a display device 1 according to the embodiment.

[0081] Reference Figure 3 , the display panel 10 included in the display device 1 may include a lower substrate 100 , an upper substrate 200 , and a display layer 300 interposed between the lower substrate 100 and the upper substrate 200 .

[0082] The display layer 300 may include a first hole 350 corresponding to the first area A1, and the lower substrate 100 may include a second groove 150 corresponding to the first area A1. The second groove 150 may be formed at the upper surface of the lower substrate 100 facing the upper substrate 200 (e.g., formed in the upper surface of the lower substrate 100 facing the upper substrate 200 or formed on the upper surface of the lower substrate 100 facing the upper substrate 200). Since the lower substrate 100 includes the second groove 150, the lower substrate 100 may have a thickness H101 at the first area A1 (e.g., in the first area A1) (e.g., in the Z-axis direction), and the thickness H101 may be less than (e.g., less than) the thickness of the lower substrate 100 at another area (e.g., in another area), for example, the thickness H102 at the second area A2 (e.g., in or on the second area A2) (e.g., in the Z-axis direction).

[0083] At the first area A1 (eg, in or on the first area A1), a cavity may be formed between the upper surface of the lower substrate 100 and the lower surface of the upper substrate 200 as a space formed by the first hole 350 and the second groove 150. In other words, Figure 3 As shown in , the cavity may overlap with the first hole 350 and the second groove 150 .

[0084] The second groove 150 (e.g., in the Z-axis direction) of the lower substrate 100 may have a depth of about 5 μm to about 45 μm, and the first hole 350 of the display layer 300 may have a depth of about 5 μm. The height H10 of the cavity (e.g., in the Z-axis direction) formed by the second groove 150 and the first hole 350 may be about 10 μm to about 50 μm.

[0085] In the embodiment, since the lower substrate 100 of the display panel 10 includes Figure 3 Therefore, the upper substrate 200 of the display panel 10 may not include the second groove 150 shown in FIG. Figure 2 The first groove 250 is shown in FIG. 1 , but the present disclosure is not limited thereto.

[0086] For example, in another embodiment, the display panel 10 may include a first groove 250 (eg, see FIG. 1 ) at (eg, in) the upper substrate 200. Figure 2 ) and a second groove 150 at (eg, in) the lower substrate 100 (eg, see Figure 3In this case, the cavity formed by the space between the lower substrate 100 and the upper substrate 200 at (eg, in or on) the first area A1 may overlap the first groove 250 , the first hole 350 , and the second groove 150 .

[0087] Before the display layer 300 is disposed, the second groove 150 of the lower substrate 100 may be formed through an etching process.

[0088] because Figure 3 The other elements of the display device 1 shown in FIG. Figure 2 The corresponding elements of the present invention are the same or substantially the same, and thus a redundant description thereof may not be repeated.

[0089] FIG. 4A to FIG. 4C is a graph showing transmittance characteristics of each wavelength band according to the height of the cavity.

[0090] A cavity may refer to an air gap formed between two substrates of transparent material. Figure 2 or Figure 3 As shown in , the cavity may refer to an air gap defined by a space between the lower substrate 100 and the upper substrate 200 at the first area A1 (eg, in or on the first area A1). Figure 2 As described above, the display layer 300 of the display device 1 may include the first hole 350 so that the light transmittance may be relatively high at (e.g., in) the first area A1 corresponding to the component 20. A space such as a cavity as an example may be defined between the lower substrate 100 and the upper substrate 200 by the first hole 350.

[0091] Figure 4A , Figure 4B and Figure 4C Graphs showing transmittance in the visible light band when the height of the cavity is about 2 μm, when the height of the cavity is about 4 μm, and when the height of the cavity is about 10 μm, respectively.

[0092] Reference FIG. 4A to FIG. 4C , a transmittance value of light passing through a region in which the cavity is formed may have a waveform having a period (eg, a specific period) and an amplitude (eg, a specific amplitude) according to a wavelength band.

[0093] like FIG. 4A to FIG. 4CAs shown in , the transmittance value of light passing through the region in which the cavity is formed may have a relatively shorter period as the height of the cavity (e.g., the height of the air gap) increases. In this case, the possibility of causing destructive interference between light rays having different transmittance spectra increases according to the height distribution of the cavity. Therefore, the variation (e.g., deviation) of the transmittance of each wavelength band of light passing through the region in which the cavity is formed may be reduced.

[0094] According to one or more embodiments, the display device 1 includes a cavity, which may be formed in the first area A1 (eg, see Figure 2 ) (eg, formed in the first area A1 (eg, see Figure 2 ) or formed in the first area A1 (for example, see Figure 2 ) on), the cavity has a height of about 10 μm to about 50 μm, and thus, the component 20 (for example, see Figure 2 ) or may cause the component 20 (see, for example, Figure 2 ) minimizes distortion of the optical characteristics of the display device 1. For example, the display device 1 may be on the upper substrate 200 (eg, see Figure 2 ) at (eg, at the upper substrate 200 (eg, see Figure 2 ) or in the upper substrate 200 (see, for example, Figure 2 ) includes a first groove 250, and / or may be formed on the lower substrate 100 (eg, see Figure 3 ) (e.g., at the lower substrate 100 (e.g., see Figure 3 ) or in the lower substrate 100 (see, for example, Figure 3 ) includes a second groove 150 to form a cavity having a height of about 10 μm to about 50 μm.

[0095] Figure 5 is a detailed cross-sectional view of the display panel 10 according to the embodiment.

[0096] Reference Figure 5 , the display panel 10 may include a lower substrate 100 , an upper substrate 200 , and a display layer 300 interposed between the lower substrate 100 and the upper substrate 200 .

[0097] The display layer 300 may include a plurality of pixels, including a first pixel P1 and a second pixel P2. Each of the first pixel P1 and the second pixel P2 may include a pixel circuit PC and a display element (e.g., OLED) electrically connected to the pixel circuit PC. Each pixel circuit PC may include a thin film transistor TFT. The first pixel P1 and the second pixel P2 may be positioned at the second area A2 (e.g., positioned in the second area A2 or positioned on the second area A2).

[0098] The thin film transistor TFT may include a semiconductor layer A, a gate electrode G, a source electrode S, and a drain electrode D. The semiconductor layer A may include amorphous silicon, polycrystalline silicon, and / or an organic semiconductor material, and the like.

[0099] In an embodiment, the semiconductor layer A may include amorphous silicon. In another embodiment, the semiconductor layer A may include an oxide semiconductor, which includes, for example, indium (In), gallium (Ga), tin (Sn), zirconium (Zr), vanadium (V), hafnium (Hf), cadmium (Cd), germanium (Ge), chromium (Cr), titanium (Ti) and / or zinc (Zn). For example, in an embodiment, the semiconductor layer A may include an oxide semiconductor such as indium gallium zinc oxide (IGZO), zinc tin oxide (ZTO) and / or zinc indium oxide (ZIO).

[0100] The gate electrode G may be positioned above the semiconductor layer A, with the gate insulating layer 310 interposed between the gate electrode G and the semiconductor layer A. The gate electrode G may be formed of a single layer or multiple layers including one or more of molybdenum (Mo), aluminum (Al), copper (Cu), and / or titanium (Ti), etc. For example, in an embodiment, the gate electrode G may have a single-layer structure formed of Mo.

[0101] The gate insulating layer 310 may include, for example, silicon oxide (SiO 2 ), Silicon Nitride (SiN x ), silicon oxynitride (SiON), aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), Tantalum Oxide (Ta 2 O 5 ), hafnium oxide (HfO 2 ) and / or zinc oxide (ZnO 2 ).

[0102] The source electrode S and / or the drain electrode D may be positioned above the gate electrode G, with an interlayer insulating layer 320 interposed between the source electrode S and / or the drain electrode D and the gate electrode G. The source electrode S and / or the drain electrode D may be formed of a single layer or multiple layers including one or more of Mo, Al, Cu, and / or Ti, etc. For example, in an embodiment, the source electrode S and / or the drain electrode D may have a multilayer structure formed of Ti / Al / Ti.

[0103] The planarization layer 330 may cover the upper surface of the source electrode S and / or the drain electrode D, and may have a flat or substantially flat (e.g., planarized) upper surface, so that a flat or substantially flat pixel electrode 380 may be formed on the planarization layer 330. The planarization layer 330 may be formed of a single layer or multiple layers including, for example, an organic material. The planarization layer 330 may include: a general polymer such as benzocyclobutene (BCB), polyimide, hexamethyldisiloxane (HMDSO), polymethylmethacrylate (PMMA) or polystyrene (PS), a polymer derivative having, for example, a phenolic group, an acrylic polymer, an imide polymer, an aryl ether polymer, an amide polymer, a fluorine polymer, a paraxylene polymer or a vinyl alcohol polymer and / or a combination thereof (e.g., a mixture thereof). The planarization layer 330 may include, for example, an inorganic material. The planarization layer 330 may include SiO 2 、SiN x 、SiON、Al 2 O 3 、TiO 2 、 2 O 5 , HfO 2 or ZnO 2 When the planarization layer 330 is formed of an inorganic material, chemical planarization polishing may be performed in some cases. The planarization layer 330 may include both an organic material and an inorganic material.

[0104] The pixel electrode 380 may include a (semi) transmissive electrode or a reflective electrode. In some embodiments, the pixel electrode 380 may include a reflective layer formed of, for example, Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, or a combination thereof (e.g., a compound thereof), and may include a transparent or semi-transparent electrode layer formed on the reflective layer. The transparent or semi-transparent electrode layer may include indium tin oxide (ITO), indium zinc oxide (IZO), ZnO, indium oxide (In 2 O 3 ), at least one of indium gallium oxide (IGO) and aluminum zinc oxide (AZO). In some embodiments, the pixel electrode 380 may have a stack structure of, for example, ITO / Ag / ITO.

[0105] A pixel defining layer 340 may be positioned on the planarization layer 330. The pixel defining layer 340 may define an emission area of ​​each pixel by having an opening corresponding to a central portion (e.g., a central region) of the pixel electrode 380. In addition, the pixel defining layer 340 may prevent or substantially prevent arcing, etc., from being generated at the edge of the pixel electrode 380 by increasing a distance between the edge of the pixel electrode 380 and the opposing electrode 370 located at an upper portion of the pixel electrode 380. The pixel defining layer 340 may include an organic insulating material such as polyimide, polyamide, acrylic resin, BCB, HMDSO, and / or phenolic resin, and may be formed by using spin coating, etc.

[0106] The intermediate layer 360 of the display element OLED may include an organic emission layer. The organic emission layer may include an organic material, which includes, for example, a fluorescent or phosphorescent material for emitting red light, green light, blue light or white light. The organic emission layer may include a low molecular weight organic material or a high molecular weight organic material, and a functional layer such as a hole transport layer (HTL), a hole injection layer (HIL), an electron transport layer (ETL) and / or an electron injection layer (EIL) may be selectively arranged on the organic emission layer and / or arranged below the organic emission layer. The intermediate layer 360 may be arranged (for example, may be arranged separately) to correspond to each of the plurality of pixel electrodes 380. However, the present disclosure is not limited thereto. For example, the intermediate layer 360 may be implemented in various suitable forms including, for example, as an integral layer formed above the plurality of pixel electrodes 380.

[0107] The opposing electrode 370 may include a light-transmitting electrode or a reflective electrode. In some embodiments, the opposing electrode 370 may include a transparent or semi-transparent electrode and may include a metal film having a small work function and containing, for example, lithium (Li), calcium (Ca), lithium fluoride (LiF) / Ca, LiF / Al, Al, silver (Ag), magnesium (Mg) and / or a mixture thereof (e.g., a compound thereof). In addition, a substrate such as ITO, IZO, ZnO and / or In 2 O 3 A transparent conductive oxide (TCO) film, for example, may be further arranged on the metal film. An opposing electrode 370 may be positioned on the upper portion of the intermediate layer 360 and the pixel defining layer 340. The opposing electrode 370 may be integrally formed to cover a plurality of display elements OLED, and may include a hole (eg, opening) 370H corresponding to the first area A1.

[0108] Still refer to Figure 5, the pixel circuit PC and / or the display element OLED may not be positioned at the first area A1 (e.g., not positioned in the first area A1 or not positioned on the first area A1). The pixel circuit PC of the first pixel P1 and the pixel circuit PC of the second pixel P2 adjacent to the first area A1 may be spaced apart from each other relative to the first hole 350 corresponding to the first area A1. In addition, the display element OLED of the first pixel P1 and the display element OLED of the second pixel P2 may be spaced apart from each other relative to the first hole 350 corresponding to the first area A1.

[0109] The first hole 350 may be formed through a plurality of layers disposed at the display layer 300 (e.g., disposed in the display layer 300 or disposed on the display layer 300). In an embodiment, the first hole 350 may penetrate the stack of the gate insulating layer 310, the interlayer insulating layer 320, the planarizing layer 330, the pixel defining layer 340, and the opposite electrode 370. For example, the first hole 350 may be formed by (e.g., extending through) respective holes (e.g., respective openings) of the gate insulating layer 310, the interlayer insulating layer 320, the planarizing layer 330, the pixel defining layer 340, and the opposite electrode 370 that overlap with each other.

[0110] The width W350 of the first hole 350 (e.g., in the X-axis direction) may be defined by the width of a hole (e.g., opening) having a minimum size (e.g., in the X-axis direction) among the holes (e.g., openings) disposed in (e.g., extending through) the gate insulating layer 310, the interlayer insulating layer 320, the planarizing layer 330, the pixel defining layer 340, and the opposite electrode 370. In this regard, although Figure 5 It is shown that the width of the gate insulation layer 310 limits the width W350 of the first hole 350, but in another embodiment, the planarization layer 330 can cover the side surfaces of the layers therebelow (e.g., the gate insulation layer 310 and the interlayer insulation layer 320) so that the first hole 350 can be defined by the width of a hole (e.g., an opening) set in the planarization layer 330.

[0111] The upper substrate 200 may include a first groove 250 corresponding to the first area A1. A width W250 of the first groove 250 (e.g., in the X-axis direction) may be greater than a width W0 of the component 20 (e.g., in the X-axis direction) positioned below the display panel 10. The width W0 of the component 20 may be smaller than each of the width W250 of the first groove 250 and the width W350 of the first hole 350.

[0112] The first hole 350 and the first groove 250 may form a cavity between the lower substrate 100 and the upper substrate 200. The height H10 of the cavity (e.g., in the Z-axis direction) may correspond to the sum of the height H350 of the first hole 350 (e.g., in the Z-axis direction) and the depth H250 of the first groove 250 (e.g., in the Z-axis direction). For example, the height H350 of the first hole 350 may be about 5 μm, and the depth H250 of the first groove 250 may be about 5 μm to about 45 μm. In this case, the height H10 of the cavity formed by the first hole 350 and the first groove 250 may be about 10 μm to about 50 μm.

[0113] Figure 6 is a schematic diagram of an upper substrate 200 according to an embodiment. For example, Figure 6 yes Figure 5 FIG. 2 is an enlarged view of a portion of the upper substrate 200 at which (eg, in or on which) the first groove 250 is formed.

[0114] As reference Figure 5 As described above, the first groove 250 may be positioned at (eg, positioned in or on) the lower surface of the upper substrate 200 to form a cavity together with the first hole 350 of the display layer 300 .

[0115] Reference Figure 6 , since the upper substrate 200 includes the first groove 250, the thickness H201 of a portion of the upper substrate 200 in which the first groove 250 is formed may be smaller than the thickness H202 of another portion of the upper substrate 200 in which the first groove 250 is not formed. For example, due to the depth H250 of the first groove 250, the thickness H201 of the portion in which the first groove 250 is formed may be smaller than the thickness H202 of another portion. As an example, the thickness H202 of another portion in which the first groove 250 is not formed may be about 150 μm to about 250 μm, and the first groove 250 may have a depth of about 5 μm to about 45 μm.

[0116] The first groove 250 may be formed by an etching process. Therefore, the first groove 250 may include an inclined surface having a taper angle θ of about 5° to about 60°.

[0117] 7A to 7E Processes of a method of forming the first groove 250 at (eg, in or on) the upper substrate 200 according to an embodiment are shown.

[0118] According to one or more embodiments, a display device may be formed by forming a display layer on an upper surface of a lower substrate, forming a first groove at a lower surface of an upper substrate (e.g., in or on the lower surface of the upper substrate), and connecting (e.g., attaching or bonding) the upper surface of the lower substrate to the lower surface of the upper substrate. 7A to 7E The method of forming the first groove is described in more detail.

[0119] Reference Fig. 7A , the acid-resistant film 700 may be attached to one surface of the upper substrate 200 at which (e.g., in or on which) the first groove is to be formed, for example, may be attached to the lower surface of the upper substrate 200, and when connected to each other (e.g., attached to each other or engaged with each other), the one surface faces the lower substrate. In an embodiment, the acid-resistant film 700 may be further attached to the upper surface of the upper substrate 200 and the lower surface of the upper substrate 200. In an embodiment, the acid-resistant film 700 may be attached to the upper substrate 200 by using an acrylic adhesive.

[0120] Reference Figure 7B , a hole (e.g., an opening) 750 may be formed in the acid-resistant film 700 attached to the lower surface of the upper substrate 200, such that the hole 750 corresponds to a position where the first groove is to be formed. For example, the hole 750 of the acid-resistant film 700 may be formed by cutting the acid-resistant film 700 along a peripheral portion of a region of the upper substrate 200 where the first groove is to be formed, and then removing a portion of the acid-resistant film 700 located within (e.g., located inside) the cut portion. The position where the first groove is to be formed may correspond to the first area A1 (e.g., Figure 2 ).

[0121] Reference Figure 7C , the etching process may be performed by applying an etchant to the upper substrate 200 to which the acid-resistant film 700 is attached.

[0122] The etchant may be a material capable of etching, for example, SiO 2 The etchant may include a glass material as a main component, and in this case, the etchant may include sulfuric acid (H 2 SO 4 ), at least one of hydrofluoric acid (HF) and hydrochloric acid (HCl).

[0123] According to the etching process, such as Fig.7D As shown in FIG. 1 , the first groove 250 corresponding to the area of ​​the hole 750 of the acid-resistant film 700 may be formed at (eg, formed in or on) the upper substrate 200 .

[0124] The acid-resistant film 700 may be formed of a material that does not react with an etchant, and thus, may protect or substantially protect a portion of the upper substrate 200 where the first groove 250 is not formed (eg, a portion other than a portion where the first groove 250 is formed) from being etched.

[0125] Reference Fig. 7E , the remaining portion of the acid-resistant film 700 attached to the upper substrate 200 (e.g., all remaining portions of the acid-resistant film 700 attached to the upper substrate 200 or all remaining portions of the acid-resistant film 700 attached to the upper substrate 200) can be removed to form (e.g., obtain) an upper substrate 200 in which a first groove 250 is formed.

[0126] The first groove 250 formed according to the above method may be etched to have a taper angle of about 5° to about 60° and a depth of about 5 μm to about 45 μm.

[0127] Similarly, a method similar to the one described above can be used at (eg, in or on) the lower substrate 100. 7A to 7E The second groove 150 is formed by the same or substantially the same method as shown in Figure 3 In this case, in an embodiment, the second groove 150 may be formed before forming the display layer 300 on the lower substrate 100 (eg, see Figure 3 ), but the present disclosure is not limited thereto.

[0128] After forming the first groove 250 at the lower surface of the upper substrate 200 (eg, in or on the lower surface of the upper substrate 200), the input sensing layer 40 may be formed on the upper surface of the upper substrate 200 (eg, see Figure 2 ).like Figure 2 As shown in , the input sensing layer 40 may include a second hole 45 corresponding to the first area A1.

[0129] According to one or more embodiments, a display device having improved optical characteristics without deteriorating functions of components (eg, without reducing functions of components or without substantially reducing functions of components) and a method of manufacturing the same may be provided.

[0130] Although some example embodiments have been described, it will be readily appreciated by those skilled in the art that various modifications may be made in the example embodiments without departing from the spirit and scope of the present disclosure. It will be understood that, unless otherwise described, the description of features or aspects within each embodiment should generally be considered applicable to other similar features or aspects in other embodiments. Therefore, it will be understood that the foregoing is illustrative of various example embodiments and is not to be construed as being limited to the specific example embodiments disclosed herein, and that various modifications to the disclosed example embodiments and other example embodiments are intended to be included within the spirit and scope of the present disclosure as defined in the appended claims and their equivalents.

Claims

1. A display device, wherein: The display device comprises: a lower substrate including a first region and a second region surrounding the first region; a display layer including a plurality of display elements located at the second area, and having a first hole corresponding to the first area; and an upper substrate covering the display layer, wherein the upper substrate comprises a lower surface facing the lower substrate, and the lower surface of the upper substrate has a first groove corresponding to the first area, and A space is defined between the lower substrate and the upper substrate at the first region by the first hole and the first groove, the space defines a cavity as an air gap, and the space has a height of 10 μm to 50 μm.

2. The display device according to claim 1, wherein: A taper angle at one end of the first groove is 5° to 60°.

3. The display device according to claim 1, wherein: The first groove has a depth of 5 μm to 45 μm.

4. The display device according to claim 1, wherein: The plurality of display elements include a first display element and a second display element adjacent to each other, and the first display element and the second display element are spaced apart from each other with respect to the first hole.

5. The display device according to claim 1, wherein: Each of the plurality of display elements includes a pixel electrode, an opposing electrode, and an intermediate layer between the pixel electrode and the opposing electrode, and the opposing electrode is integrally provided as a single body and has a hole corresponding to the first region.

6. The display device according to claim 1, wherein: The display device further includes an input sensing layer located on the upper substrate, and the input sensing layer has a second hole corresponding to the first area.

7. The display device according to claim 1, wherein: The lower substrate includes an upper surface facing the upper substrate, and the upper surface of the lower substrate has a second groove corresponding to the first region.

8. The display device according to claim 7, wherein: Before forming the display layer, the second groove is formed by an etching process.

9. The display device according to claim 7, wherein: The space is defined between the lower substrate and the upper substrate at the first region by the first groove, the first hole, and the second groove.

10. The display device according to claim 1, wherein: Each of the lower substrate and the upper substrate includes a glass material containing at least one of silicon oxide, magnesium oxide, calcium oxide, and zinc oxide.

11. A method for manufacturing a display device, the display device comprising a first area and a second area surrounding the first area, wherein: The method comprises: forming a groove corresponding to the first area at at least one of the lower substrate and the upper substrate; forming a display layer on the lower substrate, the display layer comprising a plurality of display elements corresponding to the second area, and the display layer having a first hole corresponding to the first area; disposing the upper substrate on the lower substrate, with the display layer interposed between the lower substrate and the upper substrate; and by bonding the upper surface of the lower substrate to the lower surface of the upper substrate using a sealant, A space is defined between the lower substrate and the upper substrate at the first region by the first hole and the groove, the space defines a cavity as an air gap, and the space has a height of 10 μm to 50 μm.

12. The method according to claim 11, wherein: The forming of the groove comprises: attaching an acid-resistant film to the lower surface of the upper substrate; removing a portion of the acid-resistant film corresponding to the first area and attached to the upper substrate; etching the upper substrate to which the acid-resistant film is attached by using an etchant; and A remaining portion of the acid-resistant film attached to the upper substrate is removed.

13. The method according to claim 11, wherein: The forming the groove includes forming the groove to have a taper angle of 5° to 60°.

14. The method according to claim 11, wherein: The forming the groove includes forming the groove to have a depth of 5 μm to 45 μm.

15. The method according to claim 12, wherein: The etchant includes at least one of sulfuric acid, hydrofluoric acid and hydrochloric acid.

16. The method according to claim 11, wherein: The sealant is between the lower substrate and the upper substrate, and surrounds the plurality of display elements.

17. A display device, wherein: The display device comprises: a lower substrate including a first region and a second region surrounding the first region; a display layer including a plurality of display elements arranged at the second area and a first hole corresponding to the first area; an upper substrate covering the display layer; and a cavity defined by a space between the lower substrate and the upper substrate at the first region; Wherein, the cavity has a depth of 10 μm to 50 μm.

18. The display device according to claim 17, wherein: At least one of the upper substrate and the lower substrate includes a groove overlapping the first hole at a position corresponding to the first region, and the cavity is defined by the groove and the first hole.

19. The display device according to claim 18, wherein: The groove has a depth of 5 μm to 45 μm.

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