A high-temperature resistant, high-power, quick-plug SMP load
By adding a dense resistive film layer on the beryllium oxide dielectric substrate and combining components such as SMP-type fast plug female connectors, a high-temperature and high-power fast plug-in SMP load is designed, which solves the problem that the existing technology is difficult to provide high-temperature and high-power fast plug-in SMP load, and achieves performance both high power and high temperature.
Patent Information
- Application Number
- CN202011628843.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2020-12-31
- Publication Date
- 2025-04-15
- Estimated Expiration
- 2040-12-31
AI Technical Summary
When the existing technology is used in commercial use of 5G technology, it is difficult to provide high-temperature and high-power fast plug-in SMP loads, and cannot meet the needs of fast plug-in and unplugging and high-temperature and high-power devices.
A high-temperature and high-power fast plug-in SMP load is designed. By adding a dense resistive film layer to the beryllium oxide dielectric substrate, combined with the SMP type fast plug-in female connector, inner core cavity, cover plate and grounding clip, high-power and high-temperature resistance performance are achieved.
The load impedance reaches 50Ω, the power can reach 10W, and the high temperature resistance can reach 250 degrees Celsius, meeting the high power requirements in fast plug-in and unplugging and high temperature environments.
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Figure CN112670686B_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of electronic components, and in particular to a high-temperature resistant high-power quick-plug SMP load. Background Art
[0002] Coaxial fixed load is a type of microwave component, which is widely used in microwave communication, radar and other equipment. At present, China is vigorously building 5G network. 5G adopts the networking coverage mode of "medium and low frequency macro base station + high frequency small base station". Among them, small base stations will be deployed in an ultra-dense networking mode, and the demand for fast plug-in, high temperature and high power loads will increase significantly. In particular, in order to provide ubiquitous and integrated networks, 5G adopts a number of new key technologies, and the requirements and dependence on fast plug-in, high temperature and high power devices are further improved. However, there is a significant gap between the localization level of China's 5G high frequency devices and that of foreign countries. With the in-depth layout of 5G technology in the key period of commercial use, the importance of fast plug-in, high temperature and high power devices has become increasingly prominent.
[0003] It can be seen that with the deepening of 5G technology, there is an urgent need to provide a high-temperature resistant, high-power, fast-plug SMP load. Summary of the invention
[0004] In view of the technical problems of low power and poor temperature resistance in the prior art, the purpose of this solution is to provide a high-temperature resistant and high-power quick-plug SMP load, which has the characteristics of high power and high temperature resistance, and well solves the above technical problems.
[0005] In order to achieve the above-mentioned purpose, the high-temperature resistant high-power quick-plug SMP load provided by the present invention comprises an SMP-type quick-plug female connector, an inner core cavity and a cover plate; the SMP-type quick-plug female connector, the inner core cavity and the cover plate are fixedly connected in sequence; and also comprises a load sheet and a grounding clamp; the load sheet is fixed in the inner core cavity through the grounding clamp and is connected to the SMP-type quick-plug female connector.
[0006] Furthermore, the load sheet is a beryllium oxide dielectric substrate; a dense resistance film layer is additionally provided on the surface of the beryllium oxide dielectric substrate.
[0007] Furthermore, the inner core cavity is provided with a placement groove for placing the load sheet; one end of the inner core cavity is provided with a first connecting end and is interference-connected with the SMP type quick-plug female connector; the other end is provided with a second connecting end and is interference-connected with the cover plate; the first connecting end and the second connecting end limit the SMP type quick-plug female connector and the cover plate through interference assembly.
[0008] Furthermore, the width of the placement groove is greater than the width of the load sheet.
[0009] Furthermore, the outer surface of the inner core cavity is provided with a plurality of through holes for fixing the quick-insert SMP load.
[0010] Furthermore, the load sheet has four connection ends, two ends of which are the microstrip transmission line input end and the microstrip transmission line output end and are respectively connected to the SMP type quick-plug female connector and the cover plate; the other two ends of the load sheet are respectively fastened in the placement groove of the inner core cavity through grounding clamps.
[0011] Furthermore, the microstrip transmission line input end, the microstrip transmission line output end and the SMP type quick-insert female connector are arranged as coaxial axes.
[0012] The invention provides a high-temperature resistant and high-power quick-plug SMP load, which can achieve high-power and high-temperature resistant performance by adding a dense resistance film layer on the load sheet. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] The present invention is further described below in conjunction with the accompanying drawings and specific embodiments.
[0014] Figure 1 This is a schematic diagram of the structure of the quick-plug SMP load;
[0015] Figure 2 This is a schematic diagram of the structure of the load sheet in this quick-plug SMP load. DETAILED DESCRIPTION
[0016] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below with reference to specific diagrams.
[0017] The present solution provides a high-temperature resistant high-power quick-plug SMP load, which includes an SMP type quick-plug female connector 100, a grounding clamp 200, a load sheet 300, an inner core cavity 400 and a cover plate 500.
[0018] Among them, the SMP type quick-plug female connector 100 is a quick-plug connector, which is used for quick plugging and unplugging when connecting external devices, saving testing time.
[0019] The SMP new quick-insert female connector 100 is fixedly arranged at one end of the inner core cavity 400. An elastic contact cap is arranged at one end of the SMP new quick-insert female connector 100, which is located inside the inner core cavity 400 and is used to realize signal communication between the load sheet 300 and the SMP type quick-insert female connector 100.
[0020] A placement groove is provided inside the inner core cavity 400 for mounting the load sheet 300 , wherein the width of the placement groove is slightly wider than that of the load sheet 300 .
[0021] A first connection end is provided at one end of the inner core cavity 400, and a second connection end is provided at the other end. The first connection end is connected to the SMP novel quick-plug female connector 100 by interference fit; and the second connection end is connected to the cover plate 500 by interference fit.
[0022] Here, the structure of the first connection end and the second connection end is not limited, and they can be light holes. In specific applications, it can be determined according to actual conditions.
[0023] Secondly, the outer surface of the inner core cavity 400 is provided with a plurality of through holes 600 for fixing the quick-insert SMP load as a whole at a desired location.
[0024] The cover plate 500 is located in the inner core cavity 400 and is fixedly connected to the second connection end of the inner core cavity 400. The cover plate 500 and the inner core cavity 400 are supported by the inner core cavity 400 through interference fit, thereby achieving grounding and ensuring the safety of the entire device.
[0025] The SMP type quick-plug female connector 100, the inner core cavity 400 and the cover plate 500 are fixedly connected in sequence to form an overall structure; the first connecting end and the second connecting end of the inner core cavity 400 limit the SMP type quick-plug female connector 100 and the cover plate 500 by means of interference fit, which is helpful to resist the dislocation caused by external vibration and shaking, and ensure the stability of the indicators.
[0026] The load sheet 300 is installed in the placement groove of the inner core cavity 400 .
[0027] The load sheet 300 is a beryllium oxide dielectric substrate 310. In this solution, a dense resistor film layer 320 is provided on the upper surface of the beryllium oxide dielectric substrate 310. The dense resistor film layer 320 can be directly high-frequency sputtered on the beryllium oxide dielectric substrate 310 through a thick film process.
[0028] By adding a dense resistance film layer 320 on the upper surface of the beryllium oxide dielectric substrate 310, the load sheet 300 designed and constructed in this way can achieve a load impedance of 50Ω, a power of 10W, and a high temperature resistance of 250 degrees Celsius.
[0029] There are four connection ends on the load sheet 300, wherein a microstrip transmission line input end and a microstrip transmission line output end are provided at both ends of the load sheet 300, and the microstrip transmission line input end and the microstrip transmission line output end form a transmission conductor. The microstrip transmission line input end and the microstrip transmission line output end are respectively connected to the SMP type quick plug female connector 100 and the cover plate 500.
[0030] At the same time, the microstrip transmission line input end, the microstrip transmission line output end and the SMP type quick-plug female connector 100 are arranged as coaxial axes, so that the external signal can be input through the SMP type quick-plug female connector 100 and can absorb all the power through the load sheet 300.
[0031] The grounding clip 200 is used to fix the other two ends of the load sheet 300 .
[0032] The grounding clip 200 is an elastic element, and the interface is in a bell-mouth shape. The other two connection ends of the load sheet are fixed in the placement groove of the inner core cavity 400 through the grounding clip 200. The two connection ends of the load sheet are respectively inserted into the placement groove of the inner core cavity 400 through the grounding clip 200, so that the load sheet 300 and the inner core cavity 400 can form an integral structure, which is more conducive to heat dissipation.
[0033] The quick-plug SMP load formed by the above scheme is fixedly connected in sequence by the SMP type quick-plug female connector 100, the inner core cavity 400 and the cover plate 500 to form an overall fixed structure; the SMP type quick-plug female connector 100 and the cover plate 500 are limited by interference fit at both ends of the inner core cavity 400, which is helpful to resist the dislocation caused by external vibration and shaking, and ensure the stability of the indicators.
[0034] The load sheet 300 installed in the inner core cavity 400 through the grounding clamp 200 can achieve high power and high temperature resistance performance by coating a dense resistance film layer 320 on the beryllium oxide dielectric substrate 310.
[0035] The structure of this solution is very convenient to assemble, and quick plugging and unplugging can be achieved through the SMP type quick plug female connector 100.
[0036] The above shows and describes the basic principles, main features and advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments, and the above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention to be protected. The scope of protection of the present invention is defined by the attached claims and their equivalents.
Claims
1. A high-temperature resistant high-power quick-plug SMP load, characterized in that: It includes an SMP type quick-insert female connector, an inner core cavity, a cover plate, a load sheet and a grounding clamp; the SMP type quick-insert female connector, the inner core cavity and the cover plate are fixedly connected in sequence; The two ends of the inner core cavity are limited by the SMP type quick-plug female connector and the cover plate by interference fit; The two connecting ends of the load sheet are respectively fixed in the inner core cavity through grounding clamps, so that the load sheet and the inner core cavity form an integral structure; The load sheet is also provided with four connection terminals; wherein, a microstrip transmission line input terminal and a microstrip transmission line output terminal are provided at both ends of the load sheet, the microstrip transmission line input terminal and the microstrip transmission line output terminal form a transmission conductor, the microstrip transmission line input terminal and the microstrip transmission line output terminal are respectively connected and conducted with an SMP type quick-plug female connector and a cover plate, an external signal is input through the SMP type quick-plug female connector, and all power can be absorbed by the load sheet; the load sheet is a beryllium oxide dielectric substrate; a dense resistance film layer capable of achieving high power and high temperature resistance is added to the surface of the beryllium oxide dielectric substrate through a thick film process.
2. A high temperature resistant high power quick plug-in SMP load according to claim 1, characterized in that: The inner core cavity is provided with a placement groove for placing the load sheet; one end of the inner core cavity is provided with a first connecting end and is interference-connected with the SMP type quick-plug female connector; the other end is provided with a second connecting end and is interference-connected with the cover plate; the first connecting end and the second connecting end limit the SMP type quick-plug female connector and the cover plate through interference assembly.
3. A high temperature resistant high power quick plug-in SMP load according to claim 2, characterized in that: The width of the placement groove is greater than the width of the load sheet.
4. The high temperature resistant high power quick plug-in SMP load according to claim 1, characterized in that: The outer surface of the inner core cavity is provided with a plurality of through holes for fixing the quick-insertion SMP load.
5. The high temperature resistant high power quick plug-in SMP load according to claim 2, characterized in that: The other two ends of the load sheet are respectively fastened in the placement grooves of the inner core cavity through grounding clamps.
6. A high temperature resistant high power quick plug-in SMP load according to claim 5, characterized in that: The microstrip transmission line input end, the microstrip transmission line output end and the SMP type quick-insert female connector are arranged as coaxial axes.
Citation Information
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