Processing method of columnar printed circuit board, printed circuit board and electronic equipment

Abstract

The present application discloses a method for processing a columnar printed circuit board, a printed circuit board, and an electronic device. The processing method includes: pre-treating a first core board and a second core board; staggering and bonding the first core board and the second core board to form a printed circuit board; rolling the printed circuit board into a columnar shape using a first mold, and pressing the printed circuit board using a second mold; and baking, curing, and demolding the printed circuit board to form the columnar printed circuit board. The processing method of the present application rolls a laminated printed circuit board into a columnar shape, which can improve the integration of the printed circuit board, and the process is simple and easy to operate.

Description

Technical Field

[0001] The present application relates to the technical field of integrated circuits, and in particular to a method for processing a columnar printed circuit board, a printed circuit board, and an electronic device. Background Art

[0002] Printed circuit boards (PCBs) are essential electronic components and a crucial element in the electronics industry. Virtually every electronic device, from small electronic watches and calculators to large computers, communications equipment, and military weapon systems, that incorporates integrated circuits and other electronic components, relies on PCBs to achieve electrical interconnection. Consequently, PCBs are playing an increasingly important role in the field of circuit technology.

[0003] PCB antenna modules are an application of printed circuit boards. They are the part of the PCB used for wireless reception and transmission. A PCB antenna is a transducer. During transmission, it converts the transmitter's high-frequency current into electromagnetic waves. During reception, it converts electromagnetic waves intercepted from space into high-frequency current and transmits it to the receiver. A well-designed antenna system optimizes communication distance.

[0004] 5G technology places higher demands on antenna system integration. To meet this demand, multiple PCB antennas can be formed into an array antenna. However, this type of PCB manufacturing is complex and only increases the surface area, failing to meet the demand for high integration. Summary of the Invention

[0005] The present application provides a method for processing a columnar printed circuit board, a printed circuit board, and an electronic device to solve the problem of low integration of printed circuit boards in the prior art.

[0006] In order to solve the above technical problems, the present application proposes a processing method for a columnar printed circuit board, including pre-treating a first core board and a second core board; staggeredly bonding the first core board and the second core board to form a printed circuit board; using a first mold to roll the printed circuit board into a column, and using a second mold to press the printed circuit board; baking, curing, and demolding the printed circuit board to form a columnar printed circuit board.

[0007] In order to solve the above technical problems, the present application proposes a cylindrical printed circuit board, wherein the printed circuit board is rolled into a cylindrical shape, and the cylindrical printed circuit board includes a first core board and a second core board that are staggered and bonded.

[0008] In order to solve the above technical problems, the present application proposes an electronic device, which includes the above-mentioned columnar printed circuit board.

[0009] This application discloses a method for processing a columnar printed circuit board. The method includes pre-treating a first core board and a second core board, then bonding the first and second core boards together in a staggered manner to form the printed circuit board. The printed circuit board is then rolled into a columnar shape using a first mold, pressed together using a second mold, and baked, cured, and demolded to form the columnar printed circuit board. The processing method is simple, and the resulting laminated columnar printed circuit board is highly integrated and can accommodate a greater number of electronic components. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0011] Figure 1 This is a structural diagram of an embodiment of a columnar printed circuit board of the present application;

[0012] Figure 2 This is a structural diagram of an embodiment of the first core board and the second core board of the columnar printed circuit board of the present application;

[0013] Figure 3 This is a structural diagram of another embodiment of the first core board and the second core board of the columnar printed circuit board of the present application;

[0014] Figure 4 This is a schematic structural diagram of another embodiment of the columnar printed circuit board of the present application;

[0015] Figure 5 This is a structural diagram of another embodiment of the columnar printed circuit board of the present application;

[0016] Figure 6 This is a flow chart of an embodiment of a method for processing a columnar printed circuit board according to the present application;

[0017] Figure 7 yes Figure 6 Schematic diagram of the steps of the columnar printed circuit board processing method;

[0018] Figure 8 This is a flow chart of another embodiment of a method for processing a columnar printed circuit board according to the present application;

[0019] Figure 9 This is a schematic diagram of a process for pre-processing a first core board according to an embodiment of the present application;

[0020] Figure 10 This is a structural diagram of an embodiment of the antenna module of the present application;

[0021] Figure 11 It is a structural diagram of an embodiment of the electronic device of the present application. DETAILED DESCRIPTION

[0022] To enable those skilled in the art to better understand the technical solution of the present application, the processing method of the columnar printed circuit board, the printed circuit board, and the electronic device provided by the invention are further described in detail below with reference to the accompanying drawings and specific embodiments.

[0023] This application proposes a cylindrical printed circuit board, see Figure 1 and Figure 2 , Figure 1 This is a schematic structural diagram of an embodiment of a columnar printed circuit board of the present application; Figure 2 This is a schematic diagram of the structure of the first and second core boards of a cylindrical printed circuit board according to one embodiment of the present invention. Columnar printed circuit board 100 has a stacked structure. In this embodiment, columnar printed circuit board 100 may include a first core board 11 and a second core board 12 bonded together in an offset manner. First core board 11 and second core board 12 may be bonded together by an adhesive layer 13.

[0024] Specifically, the printed circuit board can be formed into a columnar shape by using a cylindrical mold. For example, the side of the cylindrical mold is attached to the printed circuit board, and the rolling mold drives the printed circuit board to rotate, thereby forming the columnar printed circuit board 100.

[0025] Furthermore, the first core plate 11 and the second core plate 12 are provided with preset patterns, wherein the patterns provided on the first core plate 11 and the second core plate 12 correspond to each other. The patterns can be set according to the needs of the user.

[0026] Both the first core board 11 and the second core board 12 can be used to carry electronic components, thereby improving the integration of the cylindrical printed circuit board 100. In addition, the cylindrical printed circuit board 100 can conform to the external design of some electronic devices, such as antenna modules, and can fully utilize the internal space of the circuit device to place electronic components.

[0027] This embodiment provides a stacked cylindrical printed circuit board (PCB) structure, which is formed by staggered bonding of a first core board and a second core board. This cylindrical PCB can accommodate more electronic components due to its number of layers and shape, significantly improving the integration efficiency of the PCB.

[0028] In other embodiments, the shape and size of the first core board 11 of the columnar printed circuit board 100 may be the same as the shape and size of the second core board 12 .

[0029] See also Figure 3 , Figure 3This is a schematic diagram of the structure of another embodiment of the first and second core substrates of a cylindrical printed circuit board according to the present application. The first core substrate 11 may include a first organic layer 111 and a first metal layer 112; the second core substrate 12 may include a second organic layer 121 and a second metal layer 122. The cylindrical printed circuit board 100 includes a stacked first metal layer 112, a first organic layer 111, a glue layer 13, a second organic layer 121, and a second metal layer 122.

[0030] Among them, the material of the first organic layer 111 and the second organic layer 121 can be flexible plastic, such as polyimide (PI); the first organic layer 111 and the second organic layer 121 can be used to hold electronic components; the thickness of the first organic layer 111 and the second organic layer 121 can be set to less than or equal to 125μm, such as 30-50μm, 65-90μm, 100-120μm, etc.

[0031] The materials of the first metal layer 112 and the second metal layer 122 can be metal conductor foil, such as a copper foil layer, an aluminum foil layer or a copper-beryllium alloy foil layer; the first metal layer 112 and the second metal layer 122 can be used to achieve electrical connection; the thickness of the first metal layer 112 and the second metal layer 122 can be set to be less than or equal to 35μm, such as 5-18μm, 20-32μm, etc.

[0032] The material of the adhesive layer 13 can be an epoxy thermosetting adhesive layer or an acrylic thermosetting adhesive layer; the adhesive layer 13 is used to achieve adhesion between the first organic layer 111 and the second organic layer 121; the thickness of the adhesive layer 13 can be set to less than or equal to 50μm, for example 12-23μm, 30-45μm, etc.

[0033] See also Figure 4 and Figure 5 , Figure 4 This is a schematic structural diagram of another embodiment of the columnar printed circuit board of the present application. Figure 5 The columnar printed circuit board 100 comprises a top portion A and a bottom portion B which are arranged opposite to each other. Figure 3 In the embodiment of the present invention, the cylindrical printed circuit board 100 may be in the shape of a truncated cone, that is, the circumference of the bottom B of the cylindrical printed circuit board 100 is greater than the circumference of the top A. Figure 4 In the embodiment, the columnar printed circuit board 100 may be cylindrical, that is, the circumference of the bottom B of the columnar printed circuit board 100 is greater than the circumference of the top A.

[0034] Furthermore, the first metal layer 112 and the second metal layer 122 of the columnar printed circuit board 100 may be provided with a third metal layer (not shown) and a fourth metal layer (not shown). The third metal layer and the fourth metal layer can be used to ensure good solderability and electrical performance of the columnar printed circuit board 100. The materials of the third metal layer and the fourth metal layer can be nickel, tin, gold, silver, and alloys thereof.

[0035] Based on the above-mentioned columnar printed circuit board, this application also proposes a method for processing the columnar printed circuit board. Figure 6 and Figure 7 , Figure 6 This is a flow chart of an embodiment of a method for processing a columnar printed circuit board according to the present application; Figure 7 yes Figure 6 Schematic diagram of the steps of the columnar printed circuit board processing method. The processing method of the columnar printed circuit board 100 is used to process the columnar printed circuit board 100 disclosed in the above embodiment, and the processing method of the columnar printed circuit board 100 includes the following steps:

[0036] S11: Pre-treating the first core plate and the second core plate.

[0037] According to the preset size, the large sheet material is cut into small production panels. Then, the first core board 11 and the second core board 12 are pre-processed according to the steps of pattern transfer, inspection, surface coating, punching, etc.

[0038] S12: Stagger and bond the first core board and the second core board to form a printed circuit board.

[0039] The first core plate 11 and the second core plate 12 are staggered and bonded to form a partially overlapping printed circuit board. The first core plate 11 and the second core plate 12 may have the same shape and size. In the bonded printed circuit board, the first core plate 11 and the second core plate 12 overlap in some areas and do not overlap in other areas. Figure 7 Step S12 in .

[0040] S13: using a first mold to roll the printed circuit board into a cylindrical shape, and using a second mold to press the printed circuit board.

[0041] Place the first mold on the printed circuit board, fit the first mold and the printed circuit board together, roll the first mold to bend the printed circuit board so that the non-overlapping parts of the printed circuit board overlap after bending, so as to achieve the bonding of the first core board 11 and the second core board 12. Figure 7 Step S13 in .

[0042] The printed circuit board is pressed using the second mold so that the printed circuit board is completely fitted to the first mold and the first core board 11 is completely fitted to the second core board 12 .

[0043] S14: baking, curing, and demoulding the printed circuit board to form a columnar printed circuit board.

[0044] The printed circuit board is baked and cured to shape the glue layer 13 between the first core board 11 and the second core board 12. The first mold and the second mold of the printed circuit board after the shaping are removed, and finally a columnar printed circuit board 100 can be obtained. Figure 7 Step S14 in .

[0045] This embodiment provides a method for processing a columnar printed circuit board. After the pre-treated first core board and the second core board are bonded together, the first mold and the second mold are used to roll the columnar printed circuit board. The processing method is simple and easy to operate.

[0046] See also Figure 8 , Figure 8 This is a flow chart illustrating another embodiment of a method for fabricating a cylindrical printed circuit board according to the present application. The first core substrate 11 is provided with a first bonding area and a second bonding area, while the second core substrate 12 is provided with a third bonding area and a fourth bonding area. The steps of this embodiment are as follows. Steps in this embodiment that are identical to those in the previous embodiment will not be repeated here; please refer to the previous embodiment for details.

[0047] S21: Pre-treating the first core plate and the second core plate.

[0048] S22: Bonding the first bonding area of ​​the first core plate and the third bonding area of ​​the second core plate so that the first core plate and the second core plate partially overlap.

[0049] The first bonding area of ​​the first core plate 11 and the third bonding area of ​​the second core plate 12 are bonded, and the second bonding area of ​​the first core plate 11 is not bonded to the fourth bonding area of ​​the second core plate 12, so that the area of ​​the first core plate 11 and the area of ​​the second core plate 12 partially overlap and partially do not overlap.

[0050] S23: using the first mold to roll the printed circuit board into a cylindrical shape, and using the second mold to press the printed circuit board.

[0051] The printed circuit board is rolled into a cylindrical shape using a first mold, and the printed circuit board is pressed together using a second mold. The first mold may be cylindrical, and the second mold may be a hollow cylinder with an inner diameter larger than an outer diameter of the first mold.

[0052] Specifically, the printed circuit board is placed on the cylindrical side of the first mold, and the first mold is rolled to bend the printed circuit board so that the second bonding area of ​​the first core board 11 overlaps with the fourth bonding area of ​​the second core board 12, thereby completely bonding the first core board 11 and the second core board 12. Finally, the first mold and the printed circuit board are inserted into the second mold so that the printed circuit board is located between the first and second molds. The first and second molds are pressed together to maintain the cylindrical shape of the printed circuit board.

[0053] S24: baking, curing, and demoulding the printed circuit board to form a columnar printed circuit board.

[0054] See also Figure 9 , Figure 9 This is a flow chart of an embodiment of pre-processing the first core board according to the present application. This embodiment specifically includes the following steps:

[0055] S31: Transferring the preset pattern to the first core board.

[0056] A predetermined pattern is set on film, which is then placed on the first core board 11. Light is then applied to the film and first core board 11, and exposure and development are performed according to the pattern on the first core board 11. The uncovered portions of the film undergo photopolymerization, while the covered portions remain unreacted. During development, the photopolymerized portions remain undissolved and remain on the first core board 11.

[0057] S32: Check whether the pattern on the first core board is correct.

[0058] After completing the pattern transfer, it is necessary to detect whether the pattern on the first core board 11 is the same as the preset pattern. If so, the pattern on the first core board 11 is judged to be correct and the next step S33 is executed; if not, the pattern on the first core board 11 is judged to be wrong and the first core board 11 is remade.

[0059] S33: performing a coating process on the first surface of the first core board.

[0060] Because the first surface of the first core board 11 is a metal layer, such as a copper layer, the unprotected copper layer may oxidize and damage, directly affecting subsequent soldering. Therefore, the first surface of the first core board 11 needs to be coated to form a thin, uniform protective film on the copper layer. This protective film can be made of nickel, tin, gold, silver, or alloys thereof, and can have a thickness of 0.1-3 μm. For example, a silver film can be 0.1-0.6 μm, and a tin film can be 0.8-1.2 μm.

[0061] S34: Cutting the first core board according to a preset size.

[0062] After completing the above steps, the first core plate 11 can be cut to a preset size. For example, the first core plate 11 can be punched to obtain the first core plate 11 in the shape of a cylindrical unfolded shape. Furthermore, before cutting the first core plate 11 to the preset size, through holes or blind holes can be made in the first core plate 11. For example, the first core plate 11 can be provided with through holes for alignment with the second core plate 12, and the second core 12 and the adhesive layer 13 can also be provided with through holes for alignment.

[0063] The pretreatment process of the second core plate 12 is the same as that of the first core plate 11, and will not be repeated here. It should be noted that it is also necessary to apply adhesive backing to the second surface of the second core plate 12. The adhesive backing treatment can be completed before the second core plate 12 is cut to a preset size, and the adhesive layer 13 is also cut to a preset size when the second core plate 12 is cut; the adhesive backing treatment can also be completed before the second core plate 12 is cut to a preset size, and the adhesive layer 13 of a preset size is applied to the second surface of the second core plate 12 of the preset size.

[0064] Based on the above-mentioned cylindrical printed circuit board, this application also proposes an antenna module. Figure 10 , Figure 10 FIG1 is a schematic structural diagram of an embodiment of an antenna module of the present application. The antenna module 1000 includes the columnar printed circuit board 100 described above.

[0065] Based on the above-mentioned columnar printed circuit board, this application also proposes an electronic device. Figure 11 , Figure 11 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application. The electronic device 1100 includes the columnar printed circuit board 100 described above.

[0066] It should be understood that the specific embodiments described herein are intended only to explain the present application and are not intended to limit the present application. Furthermore, for ease of description, the accompanying drawings only illustrate portions, rather than all, of the structures relevant to the present application. All other embodiments derived by persons of ordinary skill in the art based on the embodiments in this application without inventive effort are intended to fall within the scope of protection of this application.

[0067] The terms "first," "second," and the like in this application are used to distinguish between different objects, not to describe a particular order. Furthermore, the terms "including," "having," and any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or apparatus comprising a series of steps or elements is not limited to the listed steps or elements, but may optionally include steps or elements not listed, or may optionally include other steps or elements inherent to the process, method, product, or apparatus.

[0068] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0069] The above description is only an implementation method of the present application and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the description and drawings of this application, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A method for processing a columnar printed circuit board, characterized in that: The processing method comprises: pre-treating the first core plate and the second core plate; Staggering and bonding the first core board and the second core board to form a printed circuit board; Rolling the printed circuit board into a cylindrical shape using a first mold, and pressing the printed circuit board using a second mold; baking, curing, and demoulding the printed circuit board to form a columnar printed circuit board; Wherein, the first core plate is provided with a first bonding area and a second bonding area, and the second core plate is provided with a third bonding area and a fourth bonding area; The step of staggered bonding of the first core board and the second core board to form a printed circuit board includes: bonding the first bonding area of ​​the first core plate and the third bonding area of ​​the second core plate so that the first core plate and the second core plate partially overlap; The first mold is cylindrical; The step of rolling the printed circuit board into a cylindrical shape using a first mold includes: Laminating the printed circuit board to the cylindrical side of the first mold; Rolling the first mold to bend the printed circuit board so that the second bonding area of ​​the first core board and the fourth bonding area of ​​the second core board overlap, thereby completing the complete bonding of the first core board and the second core board; The second mold is a hollow cylinder with an inner diameter larger than the outer diameter of the first mold. The step of pressing the printed circuit board using the second mold includes: The first mold and the printed circuit board are inserted into the second mold so that the printed circuit board is located between the first mold and the second mold.

2. The processing method according to claim 1, characterized in that: The step of pre-treating the first core plate and the second core plate comprises: transferring a preset pattern to the first core board; Checking whether the pattern on the first core board is correct; If it is determined that the pattern on the first core board is correct, coating the first surface of the first core board; The first core plate is cut into a preset size.

3. The processing method according to claim 1, wherein the characteristic value is: The step of pre-treating the first core plate and the second core plate comprises: transferring the preset pattern to the second core board; Checking whether the pattern on the second core board is correct; If the pattern on the second core board is found to be correct, coating the first surface of the second core board and applying adhesive backing to the second surface of the second core board; The second core plate is cut into a preset size.

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