Method of manufacturing a power module unit, power module unit, power supply component and frequency converter

Abstract

The invention relates to a method for manufacturing a power module unit (1) and to a power module unit (1). The invention also relates to a power supply component and to a frequency converter. For manufacturing a power module unit (1) a substrate (3) is provided which has recesses (9). The substrate is connected with a substrate (4) which carries power semiconductors (5). After the substrate (4) is fixed on the substrate the cooling ribs (7) are introduced into the recesses (9) of the substrate (3) and are fixed in a force- and / or form-fit. With this embodiment the power module unit (1) with cooling ribs (7) can be designed as desired and at the same time the manufacturing of the power module unit (1) is simplified.

Description

Technical Field

[0001] This invention relates to a method for manufacturing a power module unit, and to a power module unit itself. The invention also relates to power supply components and frequency converters. Background Technology

[0002] A power module unit typically includes a substrate with a power semiconductor, such as an IGBT (Insulated Gate Bipolar Transistor), which is fixedly connected on the substrate. The substrate has metal structures on both sides, wherein the metal structures are designed to connect to the power semiconductor on one side and be fixed to the substrate on the other side.

[0003] According to existing technology, the substrate is preferably fitted with a thermally conductive structure and fixed to the cooling body. In order to balance the thermal effect, complex bending of the substrate is necessary so that the substrate remains fixedly connected to the cooling body even at temperatures exceeding 100 degrees Celsius.

[0004] Here, the unit that includes the power module and the cooling element is referred to as the power module unit.

[0005] Another drawback of the existing technology is the material transition. This drawback reduces the heat flow from the power semiconductor through the substrate to the coolant.

[0006] To improve heat transfer from the power semiconductor to the coolant, for example, DE102013207804A1 proposes a substrate with a thermally conductive structure integrally formed on one side. The power semiconductor is fixed on the opposite side of the substrate.

[0007] However, the size of the heat-conducting structure is limited due to manufacturing constraints. Furthermore, the manufacturing process for this type of power module unit is costly and therefore expensive. Summary of the Invention

[0008] Therefore, the purpose of this invention is to simplify the manufacturing method of power module units.

[0009] This objective is achieved by the power module unit according to the invention. This objective is further addressed by the frequency converter or power supply component according to the invention. This objective is also addressed by the method according to the invention.

[0010] This invention is based on the understanding that the material boundary between the substrate and the cooling body is replaced by directly applying a substrate with a power semiconductor onto the substrate. Preferably, soldering is used to fix the substrate to the substrate of the cooling body. The substrate thus serves as a carrier for the substrate on a first side. Additionally, a second side of the substrate is used to fix the cooling fins.

[0011] In the case of conventional coolers with cooling fins that can be several centimeters in length, this method presents difficulties because the entire cooler must be heated, for example, in a furnace at a temperature of approximately 200 to 500 degrees Celsius. However, heating the entire cooler is time-consuming and energy-intensive. Therefore, the present invention is based on the view that it is advantageous to heat only the substrate with the substrate in the furnace and then fix the cooling fins after the substrate is secured in a recess in the substrate. Preferably, the cooling fins are fixed in a manner that prevents the substrate with the substrate from bending. Bending of the substrate can damage it.

[0012] This is exemplarily achieved through the trapezoidal cross-section of the recess. Alternatively, cooling fins can be advantageously introduced into the corresponding recess in a direction tangential to the first side.

[0013] The substrate preferably comprises a ceramic layer, wherein the ceramic layer has at least partially metal layers on its upper and lower sides. The metal layers preferably comprise copper, silver, or zinc. Preferably, the metal layer partially covering the upper side of the substrate is used to fix the power semiconductor. Preferably, the metal layer covering the lower side is used for bonding, pressing, or sintering the substrate to a substrate.

[0014] The power module unit has a substrate with at least one recess on a first side, wherein at least one cooling fin is fixed in the corresponding recess, wherein the corresponding cooling fin is fixed in the corresponding recess of the substrate by a connection implemented at least partially in a form-fit manner, a connection implemented partially in a material-fit manner, and / or a connection implemented partially in a force-fit manner, wherein the substrate has a substrate for power semiconductors on a second side.

[0015] The power module unit may also include a housing that protects the substrate from environmental influences. The substrate serves as the base for power semiconductors, such as IGBTs or thyristors. Multiple power semiconductors may also be mounted on the substrate.

[0016] The recess preferably extends along the first side from one end of the substrate to the other end of the substrate.

[0017] The recess is advantageously used to accommodate one or more cooling fins. The corresponding cooling fins are preferably introduced into the recess of the substrate after the substrate has been fixed to the second side of the substrate.

[0018] The power module unit preferably also includes a housing, wherein the housing at least partially covers the second side. The housing serves to cover, and thus protect, the substrate or at least one power semiconductor.

[0019] The connection of materials can be understood, by way of example, as a welding, bonding or fusion welding connection.

[0020] The connection between the cooling fins and the substrate is preferably implemented at least locally in a form-fit manner. This form-fit connection creates a good thermal connection between the substrate and the corresponding cooling fins. The form-fit connection then improves the dissipation of waste heat from the power semiconductor through the substrate to the cooling fins.

[0021] The cooling fins are preferably fixed to the substrate by a force-fit connection, such that the cooling fins are inserted into the heated substrate, and the force-fit connection is established as the substrate cools. Optionally or additionally, the cooling fins may also be cooled upon introduction and the force-fit connection is formed by heating to room temperature.

[0022] The present invention discloses the following advantages:

[0023] - By directly connecting the substrate to the base plate and to only one additional thermal resistor connected to the cooling fins, heat can be dissipated from the substrate particularly efficiently via the cooling fins.

[0024] - By variably connecting the substrate and the cooling fins, the parameters of the corresponding cooling fins can be adapted for the application of the power module unit, such as the length, shape, and surface characteristics.

[0025] - By simply fixing the substrate to the base plate, the substrate can be manufactured quickly and energy-efficiently using a furnace.

[0026] In an advantageous embodiment of the invention, the corresponding cooling fins are connected to the substrate by pressing, bonding or welding.

[0027] Optionally or additionally, the corresponding cooling fins can be fixed in the recesses of the substrate by welding or bonding.

[0028] By fixing the corresponding cooling fins to the substrate, the power module unit is designed to be stable against external influences. Furthermore, fixing the corresponding cooling fins to the substrate ensures good and safe heat transfer from the power semiconductors to the cooling fins.

[0029] In another advantageous embodiment of the invention, the substrate has a layer of copper, aluminum, or made of copper and a layer of made of aluminum.

[0030] Copper is preferred as a material for containing substrates because it is suitable for making welds and is a good thermal conductor.

[0031] Aluminum is preferred as a material for substrates because it is a good thermal conductor and its good deformability makes it suitable for the shape-fitting connection between the substrate and the cooling fins.

[0032] A particularly advantageous feature is that the substrate comprises two metal layers stacked and fixedly connected to each other. This substrate has an aluminum layer adjacent to a first side and a copper layer on the upper side. The two metal layers are exemplarily fixedly connected to each other using a gear hobbing method. Alternatively, these layers can also be connected to each other by a soldering method, particularly a high-temperature soldering method.

[0033] This layer has the aforementioned advantages and can be obtained in commercial transactions.

[0034] In another advantageous embodiment of the invention, the corresponding cooling fin has a top cover on at least one side, wherein the top cover contacts a first side of the substrate after the cooling fin is introduced.

[0035] The top cover is used to restrict the cooling fins from entering the recess, so that the bottom side of the recess only contacts the cooling fins.

[0036] Optionally or additionally, the top cover may partially extend into a recess. The recess, exemplarily, has sides at its edges that are angled toward a first side. These sides are designed to accommodate similarly angled sides of the top cover.

[0037] By using the top cover, the load on the substrate can be reduced when the corresponding cooling fins are introduced into the recess. In particular, the bending stress induced by the force perpendicular to the first side of the substrate can be effectively reduced. By reducing the force and thus the bending stress on the substrate, the substrate is connected to the substrate with a reduced load when the cooling fins are introduced into the recess.

[0038] In another advantageous embodiment of the invention, the corresponding cooling fins are made of copper, aluminum, or an alloy.

[0039] The cooling fins are preferably made of materials with good thermal conductivity, especially aluminum, aluminum alloys, copper or copper alloys.

[0040] Using materials with good thermal conductivity can effectively dissipate heat from the substrate.

[0041] In another advantageous embodiment of the invention, cutouts and etched portions are used to reinforce the fixation of the substrate to the corresponding cooling fins.

[0042] At least a portion of the substrate's recesses and / or cooling fins preferably have notches and / or etched portions. When the cooling fins are introduced into the corresponding recesses, the recesses can etch the notches into the cooling fins. The notches are used to form a form-fit connection at least locally.

[0043] The etched portion of the cooling fin preferably extends into the cutout of the corresponding recess. Therefore, a particularly strong connection is possible.

[0044] The etched portions in the corresponding recesses are also used to improve the connection between the cooling fins and the substrate.

[0045] In another advantageous embodiment of the invention, the hardness of the substrate material is different from the hardness of the corresponding cooling fin material.

[0046] The substrate material is preferably harder than the cooling fin material. Therefore, the cooling fin material is easily deformed, and a connection is formed between the substrate and the cooling fin, at least locally, with a shape fit.

[0047] In an alternative embodiment described above, when the cooling fins are introduced into the corresponding recesses, the inner side of the recesses in the cooling fins and / or the substrate is advantageously slightly deformed. The etched portion particularly facilitates the deformation of the cooling fins and / or the substrate.

[0048] Alternatively, the material hardness of the cooling fins can also be higher than that of the substrate. This design preferably simplifies the manufacturing of the power module unit.

[0049] In another advantageous design of the invention, the corresponding cooling fins are designed in a U-shape, an O-shape, or a figure-eight shape.

[0050] The cooling fins preferably have openings. These openings are preferably for the passage of a cooling medium, such as airflow. The openings are preferably designed so that the cross-section of the cooling fin is hollow. The corresponding cross-section of the cooling fin is preferably designed to be O-shaped.

[0051] The cooling fins are preferably designed to have a reinforcing section in the middle, especially a material transition section.

[0052] The material transition section results in the figure-eight cross-section of the cooling fins.

[0053] In another advantageous design of the invention, the cross-section of the corresponding recess tapers toward the second side, preferably in the form of a trapezoid.

[0054] To minimize the transfer of bending stress to the substrate when the corresponding cooling fins are introduced, the recesses are designed to taper inwards. The recesses are preferably trapezoidal. Sometimes, an embossed portion is positioned on the side of the inner surface of the corresponding recess. The embossed portion is preferably used to secure the cooling fins within the recess.

[0055] The substrate of the power module unit is protected when the corresponding cooling fins are introduced by using an inwardly tapering recess.

[0056] In another advantageous embodiment of the invention, additional cooling fins are positioned between the cooling fins, wherein the corresponding additional cooling fins overlap the cooling fins only on a partial side.

[0057] The additional cooling fins are preferably connected to the cooling fins in a force-fit manner. The additional cooling fins are preferably overlapped with the cooling fins by a width of 1 cm to 2 cm.

[0058] The sides of the cooling fins are preferably formed in a rib-like structure, at least in the areas where the cooling fin overlaps with other cooling fins. In particular, the rib-like structure is understood to mean that the sides of the respective cooling fins and / or the sides of the respective other cooling fins have embossed portions. The embossed portions may have a triangular cross-section. The embossed portions are preferably oriented parallel to each other. Advantageously, the embossed portions are oriented parallel to the edges of the cooling fins.

[0059] Preferably, cuts are made between the engraved portions. The cuts preferably have a triangular cross-section.

[0060] The etched portion of the cooling fin preferably extends into the cutout of the adjacent cooling fin.

[0061] The cooling performance of power module units can be gradually improved by expanding existing cooling fins and additional cooling fins.

[0062] In another advantageous embodiment of the invention, the cooling fins are at least partially composed of carbon, such as graphite.

[0063] The cooling fins can advantageously be composed of or include carbon nanotubes, at least in a localized manner.

[0064] Graphite or carbon nanotubes, in particular, have exceptionally high thermal conductivity.

[0065] Due to its high thermal conductivity, it can improve the cooling of the substrate.

[0066] In another advantageous design of the invention, the cooling fins are connected to each other.

[0067] The connection of the cooling fins is advantageously accomplished using connecting elements. The connecting elements and cooling fins are preferably formed as a unit. This unit is advantageously introduced as a whole into a recess in the substrate.

[0068] The connecting element is preferably connected in a way that matches the material of the cooling fins.

[0069] The connecting element and cooling fins are preferably implemented as a single piece. The connecting element preferably has an opening. The opening is advantageous for reducing weight. Furthermore, the opening is preferably designed for the passage of the cooling medium, especially the cooling airflow.

[0070] This unit enables a particularly robust and uniform connection between the cooling fins and the substrate. Heat can then be transferred from one cooling fin to another.

[0071] In another advantageous embodiment of the invention, cooling fins and connecting elements are connected to each other to form a unit. This unit is preferably designed such that it can be connected to other units via plug-in connections, crimping, or bonding.

[0072] The unit preferably has parallel-oriented cooling fins, wherein the cooling fins are connected to each other by connecting elements.

[0073] The cooling fins preferably have structured surfaces, especially rib-shaped surfaces, at both ends. The structured surfaces improve the connection between the cooling fins, wherein the cooling fins are preferably inserted between two corresponding additional cooling fins for connection. The structured surfaces serve to hold the cooling fins together. Connecting elements are used to fasten the cooling fins together.

[0074] One advantageous use of the power module unit described herein is, in particular, for frequency converters or power supply components in industrial applications.

[0075] This inverter is advantageously used in the automotive field, for example, in at least partially electric vehicles. The invention is also advantageously used in electric aircraft. Furthermore, the invention is advantageously used in charging equipment. The invention is preferably used in charging equipment for electric vehicles or aircraft.

[0076] The type, number, shape, and size of the cooling fins can be advantageously selected based on the cooling requirements of the power module unit in the corresponding application.

[0077] In a method for manufacturing a power module unit, the power module unit has a substrate, the substrate having a recess on a first side, and the method includes the following steps:

[0078] a) Position the substrate on the second side opposite to the recess.

[0079] b) Heating the substrate and the substrate to fix the substrate to a first side of the substrate, particularly by welding or sintering.

[0080] c) Introduce and fix at least one cooling fin in the corresponding recess, wherein the fixing is carried out in a material fit and / or force fit manner.

[0081] The optional and advantageous steps in manufacturing the power module unit are as follows:

[0082] - The housing is fixed to the substrate, whereby the housing protects the substrate and the power semiconductor;

[0083] Connecting elements are applied to a metal layer, which is used to secure the power semiconductor. The corresponding connecting elements can be connected to the housing on one side. These connecting elements are advantageously used to connect the power semiconductor to electrical wires.

[0084] - It is preferable to insulate the substrate. Insulation is advantageously achieved by applying a substrate with a non-conductive material to a polymer substrate, especially a silicon substrate.

[0085] Preferably, the substrate with the substrate is heated in a furnace. The substrate and the base plate are heated to a temperature between 200 and 500 degrees Celsius. Heating is used to form a soldering, sintering, or pressing connection between the substrate and the base plate.

[0086] The cooling fins are preferably introduced together into the recesses provided for the cooling fins. In this way, the cooling fins are oriented and the substrate is pressed together.

[0087] In an advantageous design, the recess is introduced into the substrate after the substrate is fixed into the substrate.

[0088] Preferably, the recess is introduced into the substrate through machining. By subsequently introducing the substrate, the substrate without the recess can be heated in a furnace. The rectangular design of the substrate allows for particularly uniform heating of the substrate and creates a particularly stable design with the substrate when pressed together.

[0089] To form a force-fit connection, a substrate material and a corresponding cooling fin material can be selected such that the cross-section of the substrate recess expands when the substrate is heated, and a force-fit and / or form-fit connection is formed around the cooling fins in a portion of the recess at room temperature.

[0090] Optionally or additionally, welding or bonding can also be used to fix the corresponding cooling fins to the substrate.

[0091] Using the method described above for manufacturing power module units, cooling fins can be selected for the appropriate application. Time is also saved when connecting the substrate to the base plate because it is not necessary to reheat the cooling fins. Furthermore, by heating the substrate without cooling fins, a particularly uniform temperature distribution is possible, leading to improved soldering or sintering connections between the base plate and the substrate.

[0092] These features allow for the advantageous design of a particularly low furnace height.

[0093] In another advantageous embodiment of the invention, the substrate having a substrate is heated in a furnace.

[0094] Preferably, the substrate and the substrate on the substrate are heated in a through furnace. The necessary heating of the substrate and the substrate can be well adjusted by simply changing the time it takes for the substrate to pass through the furnace.

[0095] In another advantageous embodiment of the invention, cooling fins are introduced after the substrate has been cooled.

[0096] It is preferable to cool the substrate to room temperature before introducing the cooling fins. Cooling the substrate prevents bending of the etched portion in the recess when the cooling fins are introduced. Furthermore, support can be improved when the cooling fins are bonded to the substrate.

[0097] In another advantageous embodiment of the invention, cooling fins are introduced into the corresponding recess along the recess.

[0098] To protect the substrate when introducing the cooling fins into the recess, forces that could cause the substrate to bend should be avoided. Since the substrate is more stable along the tangential direction, introducing at least one cooling fin tangentially results in slight deformation of the substrate and a slight load on it.

[0099] In another advantageous embodiment of the invention, the corresponding cooling fin includes an opening into which a pressing tool is inserted and pressed into a recess by means of the pressing tool.

[0100] Depending on the shape of the extrusion tool and the cross-section of the cooling fins, the extrusion tool helps to form a form-fit connection. Preferably, the extrusion tool deforms the corresponding ends of the cooling fins such that the material of the cooling fins at least partially fills the recesses.

[0101] A rod can be used as a pressing tool. The pressing tool is preferably guided through the opening of the cooling fin and leads the cooling fin into the recess. By using a pressing tool acting on the cooling fin within the recess, bending of the cooling fin can be effectively prevented.

[0102] In another advantageous embodiment of the invention, the substrate has a layer made of copper, aluminum, or a layer made of aluminum, and / or the corresponding cooling fins are made of copper, aluminum, or an alloy.

[0103] In another advantageous embodiment of the invention, the heating of the substrate having a substrate is carried out in a furnace, and / or cooling fins are introduced into the recess after the substrate has cooled.

[0104] In another advantageous embodiment of the invention, cooling ribs for introduction into the substrate recesses are introduced into the recesses respectively provided for the cooling ribs in one step.

[0105] In another advantageous embodiment of the invention, at least one cooling fin is introduced tangentially to a first side of the substrate, wherein the recess has a cross-section, in particular, designed as trapezoidal. All cooling fins are preferably introduced into the substrate in this manner.

[0106] In another advantageous embodiment of the invention, when at least one cooling rib is introduced tangentially into the substrate, the at least one cooling rib is introduced into the recess orthogonal to the cross-section of the recess, such that the substrate is deformed only to a minimum. All cooling ribs are preferably introduced into the substrate in this manner.

[0107] In another advantageous embodiment of the invention, at least one cooling fin is introduced, in particular slid into or pulled into a recess via a side of the substrate orthogonal to the side orientation.

[0108] At least one cooling rib is then slid or pulled into the recess from the side of the substrate, such that the recess is gradually covered with at least one cooling rib, taking into account the first side of the substrate, during the introduction of the at least one cooling rib into the recess. All cooling ribs are preferably slid or pulled into the substrate in this manner. Attached Figure Description

[0109] The present invention will now be described and illustrated in detail with reference to the accompanying drawings. The embodiments shown in the drawings are merely exemplary and do not limit the invention. Features of the exemplary embodiments can be combined with other embodiments of the invention. The drawings show:

[0110] Figure 1 An exemplary power module unit is shown.

[0111] Figure 2 A cross-section of an exemplary power module unit is shown.

[0112] Figure 3 An exemplary method is shown.

[0113] Figure 4 The possible cross-section of the recess is shown.

[0114] Figure 5 Another exemplary power module unit is shown.

[0115] Figure 6 The cross-section of the power module unit is shown.

[0116] Figure 7 The cross-section of the power module unit is shown, and

[0117] Figure 8 The connection between the cooling fins and other cooling fins is shown. Detailed Implementation

[0118] Figure 1 An exemplary power module unit 1 is shown. The power module unit 1 includes a substrate 3, wherein the substrate 3 has a recess 9 on a first side. The recess 9 is used to receive at least one cooling fin 7. A substrate 4 is provided on a second side 3b of the substrate. The substrate 4 serves as a support for a power semiconductor 5. The substrate is preferably made of ceramic, wherein the substrate has a copper coating on both sides. The copper coating serves, in particular, as the basis for a solder joint 11 to secure the substrate 4 to the substrate 3. The power semiconductor 5 is preferably also connected to the substrate 4 by the solder joint 11.

[0119] The substrate 3 is preferably made of a copper alloy or an aluminum alloy. Particularly advantageously, the lower region of the substrate 3 adjacent to the first side 3a is made of aluminum, and the upper region adjacent to the second side 3b is made of copper. The substrate 3 is based on a layered material. Possible layered structures are shown by dashed lines in the substrate 3.

[0120] The corresponding cooling fins are fixed to the corresponding recesses 9 of the substrate 3 by form fit and / or force fit, and are fixed to the substrate 3.

[0121] Figure 2 A cross-section of an exemplary power module unit 1 is shown. A substrate 3 with multiple cooling fins 7 is shown. The cooling fins 7 are respectively introduced into one of the recesses 9 of the substrate 3. Each of the shown cooling fins 7 has two openings 7a. The openings 8 are separated from each other by the boundary of the middle part of the cooling fin 7. This forms an 8-shaped profile of the cooling fin. The airflow can cool the cooling fins particularly effectively using this 8-shaped profile.

[0122] At the corresponding end 7b of the cooling fin 7, the cooling fin 7 is reinforced. This reinforcement can be achieved by increasing the wall thickness of the cooling fin 7 in the region of its corresponding end 7a. Due to the reinforcement of the cooling fin 7 at its corresponding end 7a, a particularly stable connection between the corresponding cooling fin 7 and the substrate 3 is possible.

[0123] Figure 3 An exemplary method is shown. The method includes a first step a, a second step b, an optional third step c, and a fourth step d.

[0124] In the first step a, the corresponding recess 9 is introduced into the substrate 3. The recess is then stamped into the substrate by a rolling process or cutting method, such as milling or forging.

[0125] In step b, substrate 4 is positioned on the second side 3b of substrate 3. The substrate with substrate is placed in a furnace and heated to a temperature of 200 to 500 degrees Celsius to fix substrate 4 on the second side 3b of substrate 3. In step b, substrate 4 is fixedly connected to the second side 3b of substrate 3 using welding or sintering.

[0126] In an optional third step c, the substrate with the substrate is cooled back to room temperature. The cooling may be rapid or slow, depending on the type of attachment of the substrate 4 to the substrate 3.

[0127] In step d, the cooling fin 7 is introduced into the corresponding recess 9 of the substrate and fixed. The cooling fin is introduced from one side, that is, tangentially to the first side 3a of the substrate 3 or perpendicular to it. When the cooling fin 7 is introduced tangentially into the substrate, the cooling fin 7 is moved into the recess orthogonal to the cross section 9a of the recess 9. This introduction advantageously minimizes the deformation of the substrate.

[0128] When the corresponding cooling fins 7 are vertically introduced into the recess 9, care should be taken to ensure that the force applied to the substrate 3 does not cause deformation of the substrate 3, otherwise the substrate 4 will be damaged.

[0129] Figure 4A possible cross-section 9a of the recess 9 is shown. The recess 9 of the substrate 3 tapers inward. The recess 9 has an embossed portion 10 on its inner side 9b to better hold the cooling fin 7. The embossed portion 10 is advantageously used to form a local shape fit connection between the substrate 3 (shown in cross-section here) and the cooling fin 7.

[0130] The trapezoidal cross-section 9a of the recess 9 serves to reduce the force acting perpendicular to the first side 3a or the second side 3b of the substrate 3 when the cooling fin 7 is vertically introduced into the recess 9. Furthermore, this force is deflected in a direction tangential to the corresponding sides 3a and 3b of the substrate 3. This is indicated by arrows emanating from the recess.

[0131] For this purpose, an extrusion tool 11 is shown in the accompanying drawings. The extrusion tool 11 is used to insert the cooling fin 7 into the recess 9. The extrusion tool 11 is preferably implemented as a rod that passes through the opening 7a of the cooling fin and can extrude the cooling fin 7 into the recess 9 of the substrate 3. Depending on the shape of the extrusion tool 11 and the cross-section of the cooling fin 7, the extrusion tool 11 facilitates the formation of a form-fitting connection. The extrusion tool 11 preferably deforms the corresponding ends 7a of the cooling fin 7 such that the material of the cooling fin 7 at least partially fills the recess 9.

[0132] Figure 5 Another exemplary power module unit 1 is shown. Power module unit 1 has the same... Figure 1 The structure is similar to that of power module unit 1 shown. Figure 1 The difference is that the power module unit 1 shown here includes cooling fins 7 connected to each other. Connecting elements 17 connect the cooling fins. Here, the connecting elements 17 and the cooling fins 7 form a fixed unit. The unit consisting of the connecting elements 17 and the cooling fins 7 is introduced into the recess 9 of the substrate 3, and here it is connected to the substrate at least partially by form fit and / or force fit.

[0133] Figure 6 A cross-section of the power module unit 1 is shown. A cross-section of the substrate 3 having a recess 9 is shown, in which a cooling fin 7 is introduced into the recess 9. The cooling fin 7 includes a top cover 25, which is positioned on a corresponding side of the cooling fin 7 such that a cavity 23 is formed in the recess after the cooling fin 7 is introduced into the recess 9. The cavity 23 is arranged between one side of the cooling fin 7 and the bottom side of the recess 9. The cavity 23 is formed because the cooling fin is not fully introduced into the recess 9. To form the cavity 23, the corresponding top cover 25 is positioned on the side of the cooling fin 7 such that the top cover 25 contacts or is fixed thereto on the first side 31 after the cooling fin 7 is introduced into the recess 9.

[0134] Advantageously, the top cover 25 of the cooling fin 7 is located on the first side 3a of the substrate 3. Advantageously, the top cover 25 being located on the first side 3a improves the flat connection between the cooling fin 7 and the substrate. The flat connection is used for heat transfer from the substrate 3 to the cooling fin.

[0135] The height of cavity 23 can be designed to be small enough that the lower side of recess 9 makes point contact with cooling fin 7.

[0136] Figure 7 The cross-section of power module unit 1 is shown. (Compared to...) Figure 6 Similar to the cross-section shown, the cooling fin 7 also has a top cover 25. The top cover 25 is designed with an inclined support surface, which is located on the corresponding inclined surface of the recess 9. The corresponding force is indicated by arrows when the cooling fin 7 is introduced into the recess 9. The force (indicated by arrows) has a force component in a direction parallel to the first side of the substrate 3, depending on the orientation of the inclined support surface.

[0137] Due to the inclined orientation of the support surface, less force is applied to the substrate 3 to create bending stress when the cooling fins 7 are introduced, thus reducing the load on the substrate 4. Furthermore, the surface area between the cooling fins 7 and the substrate 3 is enlarged. This enlarged surface area allows heat to be dissipated from the substrate 3 to the cooling fins.

[0138] To improve the connection between the cooling fin 7 and the substrate, the inner side 9a of the recess 9 and / or the cooling fin 7 has an etched portion 10 on one side. The etched portion preferably extends into a cut, wherein the cut is respectively introduced into the side contacting the etched portion. This etched portion 10 preferably helps to improve the stability of the connection between the substrate 3 and the cooling fin 7.

[0139] Figure 8 The connection 21 between cooling fin 7 and additional cooling fin 7' is shown. The connection 21 between cooling fin 7 and additional cooling fin 7' can be formed by clamping or force-fitting. To improve engagement, cooling fin 7 and / or additional cooling fin 7' have rib-like structures in the region of connection 21. Cooling fin 7 and / or additional cooling fin 7' preferably have locally parallel-extending embossed portions on their respective sides, these embossed portions having triangular cross-sections. These embossed portions may also extend into cutouts, wherein these cutouts have triangular cross-sections and are positioned between the embossed portions in cooling fin 7 and / or additional cooling fin 7'. This connection 21 is shown in an enlarged view. The rib-like structure serves for a stable connection between cooling fin 7 and corresponding additional cooling fin 7'.

[0140] The connecting element 17 is shown, wherein the connecting element 17 discloses the possibility of connection with the cooling fin 7 (and...). Figure 5 The implementation method shown is similar.

[0141] Additional cooling fins 7' are introduced into the intermediate space of the cooling fins 7 that are respectively oriented in parallel to each other to further improve the cooling of the cooling fins 7 that are respectively formed in parallel, thereby improving the cooling of the substrate 4 on the substrate 3.

[0142] In summary, the present invention relates to a method for manufacturing a power module unit 1 and the power module unit 1 itself. The invention also relates to power supply components and frequency converters. A substrate 3 having recesses 9 is provided for manufacturing the power module unit 1. The substrate is connected to a substrate 4 carrying a power semiconductor 5. After the substrate 4 is fixed to the substrate, cooling fins 7 are inserted into the recesses 9 of the substrate 3 and fixed by force and / or form fit. Through this embodiment, the power module unit 1 with cooling fins 7 can be designed as needed, while simultaneously simplifying the manufacturing of the power module unit 1.

Claims

1. A power module unit (1) for a frequency converter, the power module unit having a substrate (3) with at least one recess (9) on a first side (3a), wherein In the respective recess (9) at least one cooling fin (7) is fixed, wherein the respective cooling fin (7) is fixed in the respective recess (9) of the base plate (3) by a connection which is implemented at least locally in a form-fit, a connection which is implemented locally in a material-fit and / or a connection which is implemented locally in a force-fit, wherein the base plate (3) has on a second side (3b) a substrate (4) for a power semiconductor (5), the respective cooling fin (7) has on at least one side a top cover (25), wherein the top cover (25) contacts the first side (3a) of the base plate (3) after the introduction of the cooling fin (7), the top cover (25) has an inclined bearing surface which lies on a respective inclined surface of the recess (9), and the inside of the recess (9) and / or the cooling fin (7) has on one side a cutout and / or an inscription (10), wherein the fixing of the base plate (3) to the respective cooling fin (7) is strengthened by the cutout and the inscription, the cross section (9a) of the respective recess (9) tapers towards the second side (3b) and is designed as a trapezium, wherein the top cover (25) is positioned on a respective side of the cooling fin (7) such that after the introduction of the cooling fin (7) into the recess (9) a cavity (23) is formed in the recess (9), which cavity (23) is arranged between one side of the cooling fin (7) and the bottom side of the recess (9).

2. The power module unit (1) according to claim 1, wherein The respective cooling fin (7) is connected to the base plate (3) by crimping, gluing or soldering.

3. The power module unit (1) according to claim 1 or 2, wherein The base plate (3) has a layer of copper, a layer of aluminium or is made of copper and of aluminium; and / or the respective cooling fin (7) has copper, aluminium or an alloy.

4. The power module unit (1) according to claim 1 or 2, wherein The hardness of the material of the base plate (3) differs from the hardness of the material of the respective cooling fin (7).

5. The power module unit (1) according to claim 1 or 2, wherein The respective cooling fin (7) is designed as a U, as an O or as an 8.

6. The power module unit (1) according to claim 1 or 2, wherein Further cooling fins (7') are positioned between the cooling fins (7), wherein the respective further cooling fin (7') overlaps the cooling fins (7) only locally laterally.

7. A frequency converter or power supply component for industrial applications, having a power module unit (1) according to the preceding claim.

8. A method for manufacturing a power module unit (1), wherein The power module unit (1) has a base plate (3) which has on a first side (3a) a recess (9), the method comprising the following steps: a) positioning a substrate (4) on a second side (3b) opposite the recess; b) heating the base plate (3) and the substrate (4) in order to fix the substrate on the first side (3a) of the base plate (3) by a soldering or sintering connection (11); c) introducing and fixing at least one cooling fin (7) in the respective recess (9), wherein the fixing is effected in a material-fit manner and / or in a force-fit manner, the respective cooling fin (7) having a top cover (25) on at least one side, wherein the top cover (25) contacts the first side (3a) of the base plate (3) after the introduction of the cooling fin (7), the top cover (25) having an inclined bearing surface which lies on a respective inclined surface of the recess (9), and the inner side of the recess (9) and / or the cooling fin (7) having a cutout and / or an engraved portion (10) on one side, wherein the fixing of the base plate (3) to the respective cooling fin (7) is strengthened by the cutout and the engraved portion, the cross section (9a) of the respective recess (9) tapering towards the second side (3b) and being designed as a trapezium, wherein the top cover (25) is positioned on a respective side of the cooling fin (7) such that, after the introduction of the cooling fin (7) into the recess (9), a cavity (23) is formed in the recess (9), the cavity (23) being arranged between one side of the cooling fin (7) and the bottom side of the recess (9).

9. The method of claim 8, wherein, heating the base plate (3) having the substrate (4) in a furnace, and / or introducing the cooling fin (7) into the recess (9) after cooling the base plate (3).

10. The method of claim 8 or 9, wherein, introducing the cooling fin (7) into the respective recess (9) along the recess (9).

11. The method of claim 8 or 9, wherein, in one step, introducing the cooling fin (7) provided for introduction into the recess (9) of the base plate (3) into the recess (9) provided for the cooling fin (7), respectively.

12. The method of claim 8 or 9, wherein, introducing at least one cooling fin (7) tangentially with respect to the first side (3a) of the base plate (3).

13. The method of claim 12, wherein, when introducing at least one cooling fin (7) tangentially into the base plate (3), orthogonally displacing at least one cooling fin (7) with respect to the cross section (9a) of the recess (9) into the recess (9), thereby deforming the base plate (3) only minimally.

14. The method of claim 8 or 9, wherein, introducing at least one cooling fin (7) into the recess (9) via a side of the base plate (3) which is oriented orthogonally to the side (3a).

15. The method of claim 8 or 9, wherein, the respective cooling fin (7) comprises an opening (7a), wherein an extrusion tool is introduced into the opening (7a) of the cooling fin (7), and the cooling fin (7) is extruded into the recess (9) by means of the extrusion tool.

Images