Substrate conveying equipment and substrate processing equipment

Abstract

Disclosed is an apparatus for conveying a substrate, comprising: a conveying robot; a linear guide rail unit including a movable plate on which the conveying robot is mounted and a running shaft on which the movable plate travels; and a particle diffusion prevention member that prevents particles from being diffused to the outside by maintaining a pressure difference between the movable plate and the running shaft.

Description

Technical Field

[0001] Embodiments of the inventive concepts described herein relate to a substrate transferring apparatus and a substrate treating apparatus. Background Art

[0002] In order to manufacture semiconductor elements, a desired pattern is formed on a substrate by performing various processes such as photolithography, etching, ashing, ion implantation, thin film deposition, cleaning, etc. In order to perform various processes in sequence, the substrate must be transferred. The substrate is transferred between units by a substrate transfer device.

[0003] Generally, a substrate handling process requires a clean state in which particles such as dust are removed. However, even when the interior of a chamber in which a process is performed is in a clean state, a poor process may be caused by particles generated during the process of transferring a substrate. Particles may be mainly generated from equipment for transferring a substrate. More specifically, a large amount of particles may be generated due to friction between parts in a linear operating axis along which a substrate transfer equipment moves. Summary of the invention

[0004] Embodiments of the inventive concept provide a substrate transferring apparatus and a substrate treating apparatus for minimizing a bad process caused by particles generated in a process of transferring a substrate.

[0005] In addition, embodiments of the inventive concept provide a substrate transfer apparatus and a substrate processing apparatus for minimizing the release of particles generated in a transfer robot to the outside.

[0006] The technical problems to be solved by the inventive concept are not limited to the above problems. Those skilled in the art to which the inventive concept belongs will clearly understand any other technical problems not mentioned herein from the following description.

[0007] According to an exemplary embodiment, a substrate transfer device includes: a transfer robot; a linear guide unit including a movable plate on which the transfer robot is mounted and an operating shaft on which the movable plate travels; and a particle diffusion prevention member, which prevents particles from diffusing to the outside by maintaining a pressure difference between the movable plate and the operating shaft.

[0008] The particle diffusion preventing member includes a gas supply unit that supplies an inert gas into a space between the movable plate and the operating shaft, and an exhaust port that draws air around the operating shaft from below the operating shaft.

[0009] The particle diffusion preventing member may further include a tortuous gas passage provided in a space between the movable plate and the operating shaft to allow the inert gas supplied from the gas supply unit to be released through the exhaust port.

[0010] The particle diffusion prevention member may further include a shield cover member which prevents particles generated in a space between the movable plate and the operating shaft and an inert gas supplied from the gas supply unit from diffusing to the outside.

[0011] The shield member may be installed to have the same length as the running shaft.

[0012] The shield cover member includes a lower cover disposed between the operating shaft and the gas supply unit, and an upper cover installed to surround an outer side of the operating shaft and a top side of the operating shaft.

[0013] The lower cover and the upper cover may provide a tortuous gas passage in a space between the movable plate and the operating shaft so that the inert gas supplied from the gas supply unit is released through the exhaust port.

[0014] The movable plate may include a slot through which the lower cover and the upper cover pass.

[0015] The movable plate may include: a first narrow groove, which is formed in a horizontal direction from a side surface of the movable plate; a second narrow groove, which is formed downward from an end of the first narrow groove; a third narrow groove, which is formed downward from any position of the first narrow groove that is spaced a predetermined distance from the second narrow groove; a fourth narrow groove, which is formed upward from the bottom surface of the movable plate and is located between the second narrow groove and the third narrow groove; and an axial groove, which is formed on the bottom surface of the movable plate and in which the operating shaft is inserted.

[0016] The upper cover may include: a first side plate, which is positioned along the side surface of the operating shaft; a first upper plate, which extends from the upper end of the first side plate in a horizontal direction and is located in the first narrow groove; and a first bent plate and a second bent plate extending downward from the first upper plate, the first bent plate and the second bent plate are respectively located in the second narrow groove and the third narrow groove.

[0017] The lower cover may include a third bent plate and a fourth bent plate vertically located in the fourth slot and the axial slot.

[0018] A gas supply unit may be provided to supply an inert gas between the first bending plate and the third bending plate.

[0019] The exhaust port may be arranged to be located below the operating shaft.

[0020] According to an exemplary embodiment, a substrate processing device includes: a transfer chamber having a substrate transfer space surrounded by a bottom plate and a wall; a transfer robot, which is arranged in the substrate transfer space; a movable plate, on which the transfer robot is mounted; a linear guide, on which the movable plate travels; a gas supply port, which is arranged on the bottom plate and supplies an inert gas to a space between the movable plate and the linear guide; and an exhaust port, which is arranged in the bottom plate and draws air around the linear guide from below the linear guide.

[0021] The linear guide rail may be mounted on a support block disposed on the bottom plate and may be spaced apart from the bottom plate, and the exhaust port may be located below the linear guide rail and spaced apart from the bottom plate.

[0022] The substrate processing apparatus may further include a shield cover member disposed along the linear guide and surrounding the linear guide.

[0023] The shield member may provide a tortuous gas passage in a space between the movable plate and the linear guide rail so that the inert gas supplied from the gas supply port is released through the exhaust port.

[0024] The gas supply port and the exhaust port may be provided at least one or more along the linear guide. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The above and other objects and features will become apparent from the following description with reference to the accompanying drawings, in which like reference numerals refer to like parts throughout the various drawings unless otherwise specified, and in which:

[0026] Figure 1 is a plan view illustrating a substrate processing apparatus according to an embodiment of the inventive concept;

[0027] Figure 2 is a cross-sectional view showing a transfer chamber in which a substrate transfer device is installed;

[0028] Figure 3 is a perspective view showing a substrate transfer apparatus;

[0029] Figure 4A and Figure 4B is a view showing a linear guide unit and a particle diffusion preventing member;

[0030] Figure 5A and Figure 5B is a view showing the flow of inert gas between the movable plate and the operating shaft;

[0031] Figure 6 showing simulation results of the pressure difference between the upper side and the lower side of the running shaft; and

[0032] Figure 7 and Figure 8 is a view showing the positions of a gas supply unit and an exhaust port in a transfer chamber. DETAILED DESCRIPTION

[0033] Hereinafter, embodiments of the inventive concept will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily perform the inventive concept. However, the inventive concept can be implemented in various forms and is not limited to the embodiments described herein. In addition, when describing the embodiments of the inventive concept, detailed descriptions related to known functions or configurations will be omitted when they may make the subject matter of the inventive concept unnecessarily obscure. In addition, throughout the accompanying drawings, components that perform similar functions and operations are provided with the same reference numerals.

[0034] The term "include / comprise" in the specification is an "open" expression, which only means that the corresponding components exist, and unless specifically described to the contrary, additional components are not excluded but may be included. Specifically, it should be understood that the terms "include / comprise" and "having" when used herein specify the presence of the stated features, integers, steps, operations, components and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, components, parts and / or groups thereof.

[0035] Terms such as "first", "second", etc. may be used to describe various components, but the components should not be limited by these terms. The terms may only be used to distinguish one component from another component. For example, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component without departing from the scope of the present invention.

[0036] Unless otherwise specified, terms in the singular form may include plural forms. Furthermore, in the drawings, the shapes and sizes of components may be exaggerated for clear illustration.

[0037] Hereinafter, embodiments of the inventive concept will be described in detail with reference to the accompanying drawings.

[0038] Figure 1 is a plan view illustrating a substrate treating apparatus according to an embodiment of the inventive concept.

[0039] refer to Figure 1 The substrate processing equipment 1 may include an index module 10 , a load lock module 30 , and a process module 20 .

[0040] The index module 10 may include a load port 120 and a transfer frame 140. The load port 120, the transfer frame 140, and the process module 20 may be sequentially arranged in a row.

[0041] Hereinafter, the direction in which the load port 120, the transfer frame 140, the load lock module 30, and the process module 20 are arranged may be referred to as a first direction 12. When viewed from above, a direction perpendicular to the first direction 12 may be referred to as a second direction 14, and a direction perpendicular to a plane including the first direction 12 and the second direction 14 may be referred to as a third direction 16.

[0042] In the present inventive concept, the load lock module 30 and the process module 20 may be collectively referred to as a process module.

[0043] Cassettes 18 , each of which has a plurality of substrates W received therein, may be seated on the load ports 120 . The load ports 120 may be arranged in a row along the second direction 14 . Figure 1 An example is shown in which the index module 10 includes four load ports 120. However, the number of the load ports 120 may be increased or decreased according to conditions such as the processing efficiency and the occupied area of ​​the processing module 20.

[0044] Each of the cassettes 18 may have a slot (not shown) formed therein to support an edge of the substrate W. The slots may be arranged in the third direction 16, and the substrates W may be arranged in the cassette 18 along the third direction 16 in a manner of stacking one substrate on top of another with a spacing gap between each substrate. A front opening unified wafer pod (FOUP) may be used as the cassette 18.

[0045] In the loading port 120 and the transfer frame 140, the loading port 120 and the transfer frame 140 can be arranged along the first direction 12, wherein the box 18 is placed on the loading port, and the transfer frame includes an indexing robot 144, which is used to transfer the substrate W between the box 18 placed on the loading port 120 and the processing module.

[0046] The transfer frame 140 transfers the substrate W between the box 18 placed on the load port 120 and the load lock module 30. The indexing guide rail 142 and the indexing robot 144 may be provided in the transfer frame 140. The indexing guide rail 142 may be provided so that its length direction is parallel to the second direction 14. The indexing robot 144 may be provided on the indexing guide rail 142 and move linearly in the second direction 14 along the indexing guide rail 142. The indexing robot 144 may include a base 144a, a main body 144b, an indexing arm 144c and a hand 144d. The base 144a is capable of moving along the indexing guide rail 142. The main body 144b may be coupled to the base 144a. The main body 144b is capable of moving on the base 144a along the third direction 16. In addition, the main body 144b is capable of rotating on the base 144a. The indexing arm 144c may be coupled to the main body 144b and is capable of moving forward and backward relative to the main body 144b. The index arms 144c may be driven individually. The index arms 144c may be arranged in a manner of stacking one index arm on top of another index arm along the third direction 16, with a spacing gap between each index arm. Some of the index arms 144c may be used to transfer the substrate W from the process module 20 to the box 18, and other index arms 144c may be used to transfer the substrate W from the box 18 to the process module 20. Therefore, in the process of the index robot 144 transferring the substrate W between the box 18 and the process module 20, particles generated from the substrate W to be processed may be prevented from adhering to the processed substrate W.

[0047] The load lock module 30 may be disposed between the transfer frame 140 and the transfer unit 240. The load lock module 30 may replace the atmospheric atmosphere of the index module 10 with the vacuum atmosphere of the process module 20 for the substrate W to be transferred to the process module 20, or may replace the vacuum atmosphere of the process module 20 with the atmospheric atmosphere of the index module 10 for the substrate W to be transferred to the index module 10. The load lock module 30 may provide a space where the substrate W stays before being transferred between the transfer unit 240 and the transfer frame 140. The load lock module 30 may include a load lock chamber 32 and an unload lock chamber 34.

[0048] The load lock chamber 32 may provide a space where a substrate W to be transferred from the index module 10 to the process module 20 is temporarily placed. In a standby state, the load lock chamber 32 may maintain an atmospheric atmosphere and may be closed to the process module 20, but may be open to the index module 10. When the substrate W is placed in the load lock chamber 32, the inner space of the load lock chamber 32 may be sealed to the index module 10 and the process module 20. Thereafter, the atmospheric atmosphere in the load lock chamber 32 may be replaced with a vacuum atmosphere, and the load lock chamber 32 may be open to the process module 20 in a state of being closed to the index module 10.

[0049] The unloading lock chamber 34 may provide a space where the substrate W to be transferred from the processing module 20 to the index module 10 is temporarily placed. In a standby state, the unloading lock chamber 34 may maintain a vacuum atmosphere and may be closed to the index module 10, but may be open to the processing module 20. When the substrate W is placed in the unloading lock chamber 34, the inner space of the unloading lock chamber 34 may be sealed to the index module 10 and the processing module 20. Thereafter, the vacuum atmosphere in the unloading lock chamber 34 may be replaced with an atmospheric atmosphere, and the unloading lock chamber 34 may be open to the index module 10 in a state of being closed to the processing module 20.

[0050] The process module 20 may include a transfer unit 240 and a plurality of process chambers 260 .

[0051] The processing chamber 260 may perform a process of processing the substrate W using plasma. According to one embodiment, the substrate processing process may be an etching process. Alternatively, the process performed in the processing chamber 260 may be a process of processing the substrate W using a gas other than plasma.

[0052] The transfer unit 240 may transfer the substrate W between the load lock chamber 32 , the unload lock chamber 34 , and the plurality of process chambers 260 . The transfer unit 240 may include a transfer chamber 242 and a substrate transfer apparatus 300 .

[0053] The transfer chamber 242 may have a rectangular shape. Alternatively, the transfer chamber 242 may have various shapes. A plurality of processing chambers 260 may be located on opposite sides of the transfer chamber 242. A transfer space 244 for transferring the substrate W may be provided in the transfer chamber 242. The transfer space 244 may be implemented in a vacuum environment.

[0054] Figure 2 is a cross-sectional view showing a transfer chamber in which a substrate transfer apparatus is installed. Figure 3 is a perspective view showing a substrate transfer apparatus. Figure 4A and Figure 4B 2 is a view showing a linear guide unit and a particle diffusion preventing member.

[0055] refer to Figures 2 to 4B , the substrate transfer apparatus 300 may include a transfer robot 310, a linear guide unit 320, and a particle diffusion prevention member 370. Here, the linear guide unit 320 may correspond to a linear movement mechanism that allows the transfer robot 310 to linearly move along the length direction of the transfer space 244. For example, the linear guide unit 320 may be a linear motor device including a stator and a movable element.

[0056] The transfer robot 310 can transfer the substrate W in the transfer space 244. The transfer robot 310 can be positioned to be movable along the length direction of the transfer chamber 242. The transfer robot 310 can have a plurality of hands 312, which can move in the horizontal direction and the vertical direction, and can move forward or backward or rotate in the horizontal plane. Each hand 312 can be driven independently, and the substrate W can be placed on the hand 312 in a horizontal state. The hand 312 can be set in various shapes. In an embodiment, the hand 312 can be provided in a "Y" shape to facilitate the transfer of the substrate W and other components in and out of other components. In this embodiment, the hand 312 has been exemplified as having a "Y" shape. However, the hand 312 can be provided in various shapes, such as an "I" shape.

[0057] The linear guide unit 320 may include a movable plate 330 on which the transfer robot 310 is mounted, and a running shaft 340 corresponding to the linear guide on which the movable plate 330 travels. The linear guide unit 320 may be arranged parallel to the first direction 12 corresponding to the length direction of the transfer chamber 242.

[0058] The particle diffusion prevention member 370 may prevent particles from being diffused to the outside by maintaining a pressure difference between the movable plate 330 and the operating shaft 340 .

[0059] The particle diffusion preventing member 370 may include a gas supply unit 372 , an exhaust port 380 , and a shield cover member 400 .

[0060] The gas supply unit 372 may include a gas supply hole 374 for supplying an inert gas into the space between the movable plate 330 and the operating shaft 340, and a gas supply line 376 connected to the gas supply hole 374. The gas supply lines 376 may each be provided with a regulator 377 and a valve 378 for adjusting the pressure. The regulator 377 and the valve 378 may adjust the flow rate of the inert gas supplied into the space between the movable plate 330 and the operating shaft 340 and the pressure in the transfer space 244.

[0061] An exhaust port 380 may be provided to draw air around the operating shaft 340 from below the operating shaft 340. A predetermined exhaust pressure may be provided in the exhaust port 380. The exhaust port 380 may be disposed adjacent to the gas supply hole 374. The operating shaft 340 may be mounted on a support block 247 disposed on a bottom plate 246 of the transfer chamber 242 and may be positioned to be spaced apart from the bottom plate 246, and the exhaust port 380 may be located below the operating shaft 340 and spaced apart from the bottom plate 246. During movement of the substrate transfer apparatus 300, the largest amount of particles is generated from the bottom of the operating shaft, and thus the exhaust port 380 may be positioned adjacent to the bottom of the operating shaft 340, thereby minimizing contamination of the transfer chamber 242 by particles.

[0062] like Figure 5A and Figure 5B As shown, the shield member 400 of the particle diffusion prevention member 370 may provide a tortuous gas passage in the space between the movable plate 330 and the operating shaft 340 so that the inert gas supplied from the gas supply hole 374 is released through the exhaust port 380. The shield member 400 may prevent particles generated from the space between the movable plate 330 and the operating shaft 340 and the inert gas supplied from the gas supply unit 372 from diffusing to the outside.

[0063] The shield cover member 400 may have the same length as the operating shaft 340. According to one embodiment, each shield cover member 400 may include a lower cover 410 and an upper cover 420. The lower cover 410 may be disposed between the operating shaft 340 and the gas supply hole 374, and the upper cover 420 may be disposed to surround the outer side of the operating shaft 340 and the top side of the operating shaft 340.

[0064] The upper cover 420 may include a first side plate 422 positioned along a side surface of the operating shaft 340, a first upper plate 423 extending in a horizontal direction from an upper end of the first side plate 422, and a first bent plate 424 and a second bent plate 425 extending downward from the first upper plate 423. The first bent plate 424 and the second bent plate 425 may be spaced apart from each other by a predetermined distance.

[0065] The lower cover 410 may include a third bent plate 412 and a fourth bent plate 413 extending vertically upward from opposite ends of the fixing plate 411 fixed to the bottom plate 246. The fourth bent plate 413 may be located adjacent to the inner side of the operating shaft 340.

[0066] The movable plate 330 may include slots through which the lower cover 410 and the upper cover 420 pass when the movable plate 330 moves along the operating shaft 340. The movable plate 330 may include a first slot 331 formed in a horizontal direction from a side surface of the movable plate 330, a second slot 332 formed downward from an end of the first slot 331, a third slot 333 formed downward from any position of the first slot 331 spaced apart from the second slot 332 by a predetermined distance, a fourth slot 334 formed upward from the bottom surface of the movable plate 330 and located between the second slot 332 and the third slot 333, and an axial groove 335 formed on the bottom surface of the movable plate 330 and into which the operating shaft 340 is inserted.

[0067] The third bent plate 412 of the lower cover 410 may be located in the fourth slot 334, and the fourth bent plate 413 may be located in the axial groove 335. The first upper plate 423 of the upper cover 420 may be located in the first slot 331, the first bent plate 424 may be located in the second slot 332, and the second bent plate 425 may be located in the third slot 333.

[0068] Figure 5A and Figure 5B is a view showing the flow of the inert gas between the movable plate 330 and the operating shaft 340 .

[0069] like Figure 5A As shown, in a state where the movable plate 330 is located above the gas supply unit 372 and the exhaust port 380, the inert gas can move into the space between the movable plate 330 and the operating shaft 340 through the gap between the bottom surface of the movable plate 330 and the lower cover 410, and can be released to the exhaust port 380.

[0070] like Figure 5B As shown, in a state where the movable plate 330 deviates from above the gas supply unit 372 and the exhaust port 380 , the inert gas may pass through a tortuous gas passage provided by the upper cover 420 and the lower cover 410 and may be released to the exhaust port 380 located below the operating shaft 340 .

[0071] As described above, particles may be smoothly released from the left / right side of the operating shaft 340, and a predetermined pressure difference may be maintained. Therefore, diffusion of particles may be prevented.

[0072] Figure 6 Simulation results showing the pressure difference between the upper and lower sides of the running shaft.

[0073] It can be seen that a pressure difference of 1.9 Torr is formed between the upper side and the lower side of the operating shaft 340 by the particle diffusion preventing member 370. Figure 6 shown.

[0074] As described above, particles around the operating shaft 340 may be released to the exhaust port 380 together with the inert gas supplied through the gas supply hole 374. In addition, the shielding structure formed by the upper cover 420 and the lower cover 410 may separate the space where the operating shaft 340 is located from the transfer space 244, thereby preventing particles from diffusing into the transfer space 244.

[0075] Figure 7 and Figure 8 is a view showing the positions of a gas supply unit and an exhaust port in a transfer chamber.

[0076] like Figure 7As shown, the gas supply unit 372 and the exhaust port 380 may be disposed below the central portion of the linear guide unit 320. Alternatively, as shown in FIG. Figure 8 As shown, the gas supply unit 372 and the exhaust port 380 may be disposed at opposite ends and below a central portion of the linear guide unit 320 .

[0077] As described above, the gas supply unit 372 and the exhaust port 380 may be disposed at one or more locations along the linear guide unit 320 as desired.

[0078] As described above, according to the embodiments, the inventive concept can minimize a bad process caused by particles generated in the process of transferring a substrate.

[0079] In addition, the present inventive concept can minimize the release of particles generated in the transfer robot to the outside.

[0080] The effects of the inventive concept are not limited to the above-mentioned effects. Any other effects not mentioned herein can be clearly understood by those skilled in the art to which the inventive concept belongs from the present specification and the accompanying drawings.

[0081] Although the embodiments of the inventive concept have been described above, it should be understood that these embodiments are provided to help understand the inventive concept and are not intended to limit the scope of the inventive concept, and various modifications and equivalent embodiments may be made without departing from the spirit and scope of the inventive concept. The drawings provided in the inventive concept are only drawings of the best embodiments of the inventive concept. The scope of the inventive concept should be determined by the technical idea of ​​the claims, and it should be understood that the scope of the inventive concept is not limited to the literal description of the claims, but actually extends to the category of equivalents of technical value.

[0082] Although the inventive concept has been described with reference to exemplary embodiments, it will be apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the inventive concept. Therefore, it should be understood that the above embodiments are not restrictive but illustrative.

Claims

1. A substrate conveying device, comprising: Teleporting robots; a linear guide unit including a movable plate on which the transfer robot is mounted and a running shaft on which the movable plate travels; and a particle diffusion prevention member configured to prevent particles from being diffused to the outside by maintaining a pressure difference between the movable plate and the operating shaft, Wherein, the particle diffusion prevention component comprises: a gas supply unit configured to supply an inert gas into a space between the movable plate and the operating shaft; an exhaust port configured to draw air around the operating shaft from below the operating shaft; and a shield cover member including a lower cover and an upper cover, the lower cover and the upper cover providing a tortuous gas passage in the space between the movable plate and the operating shaft so that the inert gas supplied from the gas supply unit is released through the exhaust port, Wherein, the movable plate has a slot for the lower cover and the upper cover to pass through, and the slot includes: a first slot formed in a horizontal direction from a side surface of the movable plate; a second slot formed downwardly from an end of the first slot; a third slot formed downward from any position of the first slot spaced apart from the second slot by a predetermined distance; a fourth slot formed upward from the bottom surface of the movable plate and located between the second slot and the third slot; and An axial slot is formed on the bottom surface of the movable plate, and the operating shaft is inserted into the axial slot. 2 . The substrate transfer apparatus according to claim 1 , wherein the shield cover member is configured to prevent particles generated in the space between the movable plate and the operating shaft and the inert gas supplied from the gas supply unit from diffusing to the outside. 3 . The substrate transfer apparatus according to claim 2 , wherein the shield cover member is installed with the same length as the operating shaft. 4 . The substrate transfer apparatus of claim 3 , wherein the lower cover is disposed between the operating shaft and the gas supply unit, and the upper cover is configured to surround an outer side of the operating shaft and a top side of the operating shaft.

5. The substrate transfer apparatus according to claim 4, wherein the upper cover comprises: a first side plate positioned along a side surface of the operating shaft; a first upper plate, the first upper plate extending from an upper end of the first side plate along the horizontal direction, the first upper plate being located in the first slot; as well as A first bent plate and a second bent plate extend downwardly from the first upper plate, and the first bent plate and the second bent plate are respectively located in the second narrow slot and the third narrow slot. 6 . The substrate transfer apparatus of claim 5 , wherein the lower cover comprises a third bent plate and a fourth bent plate vertically located in the fourth slot and the axial slot. 7 . The substrate transfer apparatus according to claim 6 , wherein the gas supply unit is provided to supply the inert gas between the first bending plate and the third bending plate. 8 . The substrate transfer apparatus according to claim 1 , wherein the exhaust port is disposed below the operating shaft.

9. A substrate processing device, comprising: a transfer chamber having a substrate transfer space surrounded by a bottom plate and a wall; a conveying robot, the conveying robot being arranged in the substrate conveying space; a movable plate on which the transfer robot is mounted; a linear guide rail, the linear guide rail comprising the movable plate and an operating shaft, the movable plate traveling on the operating shaft; a gas supply port provided in the base plate and configured to supply an inert gas into a space between the movable plate and the linear guide; an exhaust port disposed in the base plate and configured to draw air around the linear guide from below the linear guide; as well as a shield cover member including a lower cover and an upper cover, the lower cover and the upper cover providing a tortuous gas passage in the space between the movable plate and the operating shaft so that the inert gas supplied from the gas supply port is released through the exhaust port, Wherein, the movable plate has a slot for the lower cover and the upper cover to pass through, and the slot includes: a first slot formed in a horizontal direction from a side surface of the movable plate; a second slot formed downwardly from an end of the first slot; a third slot formed downward from any position of the first slot spaced apart from the second slot by a predetermined distance; a fourth slot formed upward from the bottom surface of the movable plate and located between the second slot and the third slot; and An axial slot is formed on the bottom surface of the movable plate, and the operating shaft is inserted into the axial slot.

10. The substrate processing apparatus according to claim 9, wherein the linear guide rail is mounted on a support block provided on the base plate and is spaced apart from the base plate, and The exhaust port is located below the linear guide rail.

11. The substrate processing apparatus according to claim 10, in, The shield cover member is disposed along the linear guide and is configured to surround the linear guide. 12 . The substrate processing apparatus according to claim 9 , wherein the gas supply port and the exhaust port are provided at least one or more along the linear guide.

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