A manufacturing process of a COB circuit board in the form of conductor copper cladding

Abstract

The present invention discloses a conductor copper-clad COB circuit board and its manufacturing process, comprising a first insulating film and a first conductor covered on the top of the first insulating film, the first insulating film and the first conductor are bonded by an adhesive, a through hole is opened on the surface of the first conductor, a second insulating film and a second conductor covered on the top of the second insulating film are arranged below the first insulating film, and the present invention relates to the technical field of COB circuit boards. The conductor copper-clad COB circuit board and its manufacturing process, the first conductor and the second conductor are firstly divided into strips, and then covered on the film with the conductor to form the basic circuit of the COB circuit, and then the redundant part of the circuit is removed by a continuous etching process, and the circuit board becomes continuous, so that the subsequent processes (solid crystal, solid resistor, tin melting, glue dispensing, etc.) can be processed continuously, eliminating the limitation that only 500mm can be achieved as a unit, and no tin connection is required. Compared with the existing exposure process plus etching, the cost is lower and the yield rate is higher.

Description

Technical Field

[0001] The invention relates to the technical field of COB circuit boards, and in particular to a manufacturing process of a COB circuit board in the form of a conductor copper clad. Background Art

[0002] The names of circuit boards include: ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, circuit boards, PCB boards, aluminum substrates, high-frequency boards, thick copper boards, impedance boards, PCBs, ultra-thin circuit boards, ultra-thin circuit boards, printed (copper etching technology) circuit boards, etc. Circuit boards make circuits miniaturized and intuitive, and play an important role in the mass production of fixed circuits and the optimization of electrical appliance layouts; circuit boards can be called printed circuit boards or printed circuit boards, FPC circuit boards (FPC circuit boards are also called flexible circuit boards. Flexible circuit boards are made of polyimide or polyester film as a substrate, and are highly reliable and extremely flexible printed circuit boards.

[0003] The existing COB circuit board is made by exposure process plus etching. The exposure form has high cost, low efficiency, high defect rate, large and unstable product precision variation. If excessive current is required, copper plating process is also required, which is more expensive and has poorer product stability. Customers need to use tin for connection, and can only make 500mm as a unit. After the finished product is connected with tin, it is easy to produce cold solder joints and insufficient tensile strength. For this reason, the present invention proposes a manufacturing process of COB circuit boards in the form of conductor copper cladding. Summary of the invention

[0004] In view of the shortcomings of the prior art, the present invention provides a manufacturing process for a COB circuit board in the form of a conductor clad with copper, which solves the problems of the existing COB circuit board, which is high cost, low efficiency, and high defect rate. The unit can be 500 mm, and the finished product is connected with tin, which is prone to cold soldering and insufficient tensile strength.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solutions: a manufacturing process of a conductor copper-clad COB circuit board, comprising a first insulating film and a first conductor covered on top of the first insulating film, the first insulating film and the first conductor are bonded by an adhesive, a through hole is provided on the surface of the first conductor, a second insulating film and a second conductor covered on top of the second insulating film are provided below the first insulating film, the second insulating film and the second conductor are bonded by an adhesive, and the top of the second conductor and the bottom of the first insulating film are bonded by an adhesive, a passage structure of the entire COB circuit board is formed between the first conductor and the second conductor by a plurality of tin points, the top of the first conductor is covered with a third insulating film by an adhesive, and a through groove is provided on the top of the third insulating film.

[0006] Preferably, the first conductor and the second conductor are both copper foil structures, and the first insulating film, the second insulating film and the third insulating film are all any one of PET / PI / ink.

[0007] Preferably, the through holes are formed by removing redundant circuits on the surface of the first conductor through an etching process, and a plurality of through holes are provided.

[0008] Preferably, resistors and lamp beads are adhered to the inner surface of the through groove by adhesive, and the number of resistors and lamp beads is set to be several.

[0009] Preferably, the first insulating film, the second insulating film and the third insulating film are continuous insulating structures, and the first conductor and the second conductor are covered on the first insulating film and the second insulating film in a cut form.

[0010] Preferably, the shape of the through holes includes any one or a combination of circular, rectangular and polygonal shapes, and the through holes are unevenly distributed on the surface of the first conductor.

[0011] Preferably, the adhesive disposed between the first insulating film, the first conductor, the second insulating film, the second conductor and the third insulating film is any one or a combination of red glue, silicone glue or module glue.

[0012] The present invention also discloses a manufacturing process of a conductor copper-clad COB circuit board, which specifically comprises the following steps:

[0013] S1. First, the first conductor and the second conductor are cut into segments by a cutting device, and then the first conductor is covered on the top of the first insulating film by an adhesive, and then according to the design structure of the circuit drawing, the redundant lines on the surface of the first conductor are removed by ordinary etching to form a through hole;

[0014] S2, then covering the second conductor on the top of the second insulating film with an adhesive, and using a punching device to form a tin hole penetrating the first insulating film in the first insulating film, at this time, a plurality of tin points are formed between the first conductor and the second conductor to form a passage structure of the entire COB circuit board, and at the same time, the top of the second conductor is bonded to the bottom of the first insulating film with an adhesive;

[0015] S3. At this time, the third insulating film is covered on the top of the first conductor through an adhesive, and then a through groove is opened on the surface of the third insulating film by using a punching device according to the design structure of the circuit drawing. The blank is subjected to crystal bonding, resistor bonding, tin melting and glue dispensing treatments respectively to obtain a finished COB circuit board.

[0016] The invention provides a manufacturing process of a COB circuit board in the form of a conductor copper clad. Compared with the prior art, the invention has the following beneficial effects: the conductor copper-clad COB circuit board and its manufacturing process are provided by a first insulating film and a first conductor covered on the top of the first insulating film, the first insulating film and the first conductor are bonded by an adhesive, a through hole is provided on the surface of the first conductor, a second insulating film and a second conductor covered on the top of the second insulating film are provided below the first insulating film, the second insulating film and the second conductor are bonded by an adhesive, and the top of the second conductor and the bottom of the first insulating film are bonded by an adhesive, a passage structure of the entire COB circuit board is formed between the first conductor and the second conductor by a plurality of tin points, the top of the first conductor is covered with a third insulating film by an adhesive, and a through groove is provided on the top of the third insulating film, the first conductor and the second conductor are firstly stripped by the conductor, and then covered on the film by the conductor to form the basic circuit of the COB circuit, and then the redundant part of the circuit is removed by a continuous etching process, so that the subsequent processes (solid crystal, solid resistor, tin melting, glue dispensing, etc.) can be processed continuously, and the limitation that only 500mm can be achieved as a unit is eliminated, and tin connection is no longer required. Compared with the existing exposure process plus etching, the cost is lower and the yield rate is higher. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0018] Figure 2 is a schematic structural diagram of a first insulating film and a first conductor of the present invention;

[0019] Figure 3 It is a schematic structural diagram of the first insulating film, the first conductor and the third insulating film of the present invention.

[0020] In the figure, 1-first insulating film, 2-first conductor, 3-through hole, 4-second insulating film, 5-second conductor, 6-tin dot, 7-third insulating film, 8-through groove. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] See also Figure 1-3The embodiment of the present invention provides a technical solution: a manufacturing process of a conductor copper-clad COB circuit board, comprising a first insulating film 1 and a first conductor 2 covered on the top of the first insulating film 1, the first insulating film 1 and the first conductor 2 are bonded by an adhesive, a through hole 3 is opened on the surface of the first conductor 2, the shape of the through hole 3 includes any one or a combination of a circle, a rectangle and a polygon, and the through holes 3 are unevenly distributed on the surface of the first conductor 2, the through holes 3 are formed by removing the redundant lines on the surface of the first conductor 2 by an etching process, and the number of through holes 3 is set to be several, a second insulating film 4 and a second conductor 5 covered on the top of the second insulating film 4 are arranged below the first insulating film 1, if an excessive current is required, the first conductor 2 and the second conductor 5 can be covered with a wire on the back for conduction, the first conductor 2 and the second conductor 5 are both copper foil structures, and the first insulating film 1, the second insulating film 4 and the third insulating film 7 are all P Any one of ET / PI / ink, the second insulating film 4 and the second conductor 5 are bonded by an adhesive, and the top of the second conductor 5 is bonded to the bottom of the first insulating film 1 by an adhesive, a plurality of tin points 6 are formed between the first conductor 2 and the second conductor 5 to form a passage structure of the entire COB circuit board, the top of the first conductor 2 is covered with a third insulating film 7 by an adhesive, the adhesive arranged between the first insulating film 1, the first conductor 2, the second insulating film 4, the second conductor 5 and the third insulating film 7 is any one or a combination of red glue, silicone or module glue, the first insulating film 1, the second insulating film 4 and the third insulating film 7 are a continuous insulating structure, and the first conductor 2 and the second conductor 5 are covered on the first insulating film 1 and the second insulating film 4 in the form of cutting, and a through groove 8 is opened on the top of the third insulating film 7, and the inner surface of the through groove 8 is pasted with resistors and lamp beads by an adhesive, and the number of resistors and lamp beads is set to be several.

[0023] The present invention also discloses a manufacturing process of a conductor copper-clad COB circuit board, which specifically comprises the following steps:

[0024] S1. First, the first conductor 2 and the second conductor 5 are cut into segments by a cutting device, and then the first conductor 2 is covered on the top of the first insulating film 1 by an adhesive, and then according to the design structure of the circuit drawing, the redundant circuit on the surface of the first conductor 2 is removed by ordinary etching to form a through hole 3;

[0025] S2, then the second conductor 5 is covered on the top of the second insulating film 4 by means of an adhesive, and a tin hole penetrating the first insulating film 1 is formed in the first insulating film 1 by means of a punching device, at which time a passage structure of the entire COB circuit board is formed between the first conductor 2 and the second conductor 5 by means of a plurality of tin points 6, and at the same time, the top of the second conductor 5 is bonded to the bottom of the first insulating film 1 by means of an adhesive;

[0026] S3. At this time, the third insulating film 7 is covered on the top of the first conductor 2 through an adhesive, and then a through groove 8 is opened on the surface of the third insulating film 7 by a punching device according to the design structure of the circuit drawing. The blank is subjected to crystal bonding, resistor bonding, tin melting and glue dispensing treatments respectively to obtain a finished COB circuit board.

[0027] In summary, the basic circuit of the COB circuit is formed by first dividing the first conductor and the second conductor into strips, and then covering the film with the conductor, and then removing the redundant part of the circuit by continuous etching process, so that the circuit board becomes continuous, so that the subsequent processes (solid crystal, solid resistor, tin melting, glue dispensing, etc.) can be processed continuously, and the limitation of only 500mm as a unit is lifted. There is no need to use tin for connection. Compared with the existing exposure process plus etching, it has lower cost and higher yield rate.

[0028] Meanwhile, the contents not described in detail in this specification belong to the prior art known to those skilled in the art.

[0029] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0030] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A process for manufacturing a conductor copper-clad COB circuit board, characterized in that: The COB circuit board comprises a first insulating film (1) and a first conductor (2) covered on the top of the first insulating film (1); the first insulating film (1) and the first conductor (2) are bonded by an adhesive; a through hole (3) penetrating the first conductor (2) is provided in the first conductor (2); a second insulating film (4) and a second conductor (5) covered on the top of the second insulating film (4) are provided below the first insulating film (1); the second insulating film (4) and the second conductor (5) are bonded by an adhesive; the top of the second conductor (5) and the bottom of the first insulating film (1) are bonded by an adhesive; a passage structure of the entire COB circuit board is formed between the first conductor (2) and the second conductor (5) by a plurality of tin dots (6); the top of the first conductor (2) is covered by an adhesive with a third insulating film (7); a through groove (8) penetrating the third insulating film (7) is provided in the third insulating film (7); The manufacturing process comprises the following steps: S1. First, the first conductor (2) and the second conductor (5) are cut into segments by a cutting device, and then the first conductor (2) is coated on the top of the first insulating film (1) by an adhesive, and then according to the design structure of the circuit drawing, the redundant lines on the surface of the first conductor (2) are removed by ordinary etching to form a through hole (3) penetrating the first conductor (2); S2, then covering the second conductor (5) on the top of the second insulating film (4) with an adhesive, and using a punching device to form a tin hole penetrating the first insulating film (1) in the first insulating film (1), at this time, a plurality of tin points (6) are formed between the first conductor (2) and the second conductor (5) to form a passage structure of the entire COB circuit board, and at the same time, the top of the second conductor (5) is bonded to the bottom of the first insulating film (1) with an adhesive; S3. At this time, the third insulating film (7) is covered on the top of the first conductor (2) through an adhesive, and then a through groove (8) penetrating the third insulating film (7) is opened in the third insulating film (7) by using a punching device according to the design structure of the circuit drawing. The blank is subjected to crystal bonding, resistor bonding, tin melting and glue dispensing treatment respectively, and a finished COB circuit board can be obtained.

2. The manufacturing process of a conductor copper-clad COB circuit board according to claim 1, characterized in that: The first conductor (2) and the second conductor (5) are both copper foil structures, and the first insulating film (1), the second insulating film (4) and the third insulating film (7) are all any one of PET / PI / ink.

3. The manufacturing process of a conductor copper-clad COB circuit board according to claim 1, characterized in that: The through hole (3) is formed by removing redundant lines on the surface of the first conductor (2) through an etching process, and a plurality of through holes (3) are provided.

4. The manufacturing process of a conductor copper-clad COB circuit board according to claim 1, characterized in that: The inner surface of the through groove (8) is adhered with a resistor and a lamp bead by means of an adhesive, and the number of the resistor and the lamp bead is set to be a plurality.

5. The manufacturing process of a conductor copper-clad COB circuit board according to claim 1, characterized in that: The first insulating film (1), the second insulating film (4) and the third insulating film (7) are continuous insulating structures, and the first conductor (2) and the second conductor (5) are covered on the first insulating film (1) and the second insulating film (4) in a cut form.

6. The manufacturing process of a conductor copper-clad COB circuit board according to claim 1, characterized in that: The shape of the through holes (3) includes any one of a circle, a rectangle and a polygon or a combination thereof, and the through holes (3) are unevenly distributed on the surface of the first conductor (2).

7. The manufacturing process of a conductor copper-clad COB circuit board according to claim 1, characterized in that: The adhesive provided between the first insulating film (1), the first conductor (2), the second insulating film (4), the second conductor (5) and the third insulating film (7) is any one or a combination of red glue, silicone glue or module glue.

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