Water cooling head

By setting a flow guide baffle in the water cooling head and the shell to define the water storage chamber, the problem of insufficient cooling liquid supply when the water cooling head is moved or replaced is solved, and the heat dissipation effect and installation convenience are improved.

CN112714586BActive Publication Date: 2025-05-23ZE HONG GUANGZHOU ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202010581215.2
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2019-10-25
Filing Date
2020-06-23
Publication Date
2025-05-23
Estimated Expiration
2040-06-23

AI Technical Summary

Technical Problem

When the existing water cooling head is moved or replaced, the coolant is insufficient, resulting in a reduced heat dissipation effect.

Method used

By setting a flow guide baffle in the water cooling head and the shell to jointly define the water storage chamber, it ensures that the working medium can still be temporarily stored when it is moved or replaced, and ensures the continuous supply of coolant.

Benefits of technology

It realizes the stable supply of coolant when the water cooling head is moved or replaced, and improves the heat dissipation effect and installation convenience.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention provides a water cooling head, which includes a shell, a guide baffle, a base, a first water inlet channel, a drainage channel and a pump. The guide baffle is arranged on the shell and defines a water storage chamber together with the shell. The water storage chamber is filled with a working medium. The guide baffle includes a connecting opening. The base, the shell and the guide baffle define an action space together, and the guide baffle is located between the base and the shell. The working medium flows into the action space through the connecting opening, and the base is used to absorb heat energy and transfer the heat energy to the working medium. The first water inlet channel is connected to the water storage chamber, and is used to allow the cooled working medium to flow into the water storage chamber. The drainage channel is connected to the action space, and is used to allow the heat-absorbing working medium to be discharged from the action space. The pump is arranged in the shell, and is used to guide the working medium in the action space to the drainage channel.
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Description

Technical Field

[0001] The invention relates to a water cooling head, in particular to a water cooling head with a water storage cavity. Background Art

[0002] With the advancement and popularization of technology, various electronic devices or computer equipment have long become indispensable in people's daily lives, such as laptops, desktop computers, network servers, etc. Generally speaking, the internal electronic components of these products will increase in temperature during operation, and high temperatures can easily cause damage to the components. Therefore, the heat dissipation mechanism is a very important and necessary design for these electronic products. In addition to using fans to provide airflow for convection cooling, or attaching heat dissipation units made of special materials to produce conduction cooling, water cooling is also an effective and common heat dissipation design.

[0003] The principle of water cooling is to use liquid (such as water or coolant) as the heat dissipation medium, and use a continuously running water pump or pump to form a continuous circulation in the system. The liquid flows in closed pipes, and these pipes are distributed to the surface of each electronic component in the system (such as the central processing unit). When the relatively low temperature liquid flows through these relatively high temperature electronic components, it absorbs their heat to slow down the increase in their temperature. Then, the heat is released through the pipe to exchange heat with the outside world or other heat dissipation mechanisms to reduce the temperature of the liquid, and then the liquid is returned to the system for circulation and heat dissipation.

[0004] For example, a water cooling head is a major heat dissipation component in a water-cooled pipeline. Existing water cooling heads are usually made of copper or aluminum, and have structures such as chambers and water channels formed inside them to provide a coolant with a lower temperature to flow in. By making direct contact between the water cooling head and the electronic components, the coolant with a lower temperature can absorb heat in the chamber or water channel and then flow out of the water cooling head, so that the heat generated by the operation of the electronic components can be removed.

[0005] However, most of the existing water cooling heads do not have a water storage chamber design, so when the water cooling head is changed or moved, the cooling liquid supply is often insufficient. Therefore, how to improve the above problem has become the focus of relevant personnel in this field. Summary of the invention

[0006] One of the purposes of the present invention is to provide a water cooling head, which defines a water storage chamber through a guide baffle and a shell. In addition to being able to temporarily store working medium to ensure that the working medium is not interrupted, it can also increase the convenience and flexibility of the water cooling head during installation.

[0007] Other purposes and advantages of the present invention can be further understood from the technical features disclosed in the present invention.

[0008] In order to achieve one or part or all of the above purposes or other purposes, the present invention provides a water cooling head, including a shell, a guide baffle, a base, a first water inlet channel, a drainage channel and a pump. The guide baffle is arranged on the shell and defines a water storage chamber together with the shell. The water storage chamber is filled with a working medium, and the guide baffle includes a connecting opening. The base, the shell and the guide baffle together define an action space, and the guide baffle is located between the base and the shell. The working medium flows into the action space through the connecting opening, and the base is used to absorb heat energy and transfer the heat energy to the working medium. The first water inlet channel is connected to the water storage chamber, and is used to allow the cooled working medium to flow into the water storage chamber. The drainage channel is connected to the action space, and is used to allow the heat-absorbing working medium to be discharged from the action space. The pump is arranged in the shell, and is used to guide the working medium in the action space to the drainage channel.

[0009] In one embodiment of the present invention, the above-mentioned water cooling head also includes a second water inlet channel, which is connected to the water storage chamber, and the first water inlet channel is located on the first side of the shell, the second water inlet channel is located on the second side opposite to the first side, and the drainage channel is located on the first side of the shell and adjacent to the first water inlet channel.

[0010] In one embodiment of the present invention, the shell includes a water cooling head and an electromechanical chamber and a groove connected to each other, the opening of the electromechanical chamber is located on the top side of the shell, and the opening of the groove is located on the bottom side of the shell opposite to the top side.

[0011] In one embodiment of the present invention, the above-mentioned pump includes a circuit board, a first magnetic element, a fan blade and a second magnetic element. The circuit board and the first magnetic element are arranged in an electromechanical chamber, the circuit board is located above the first magnetic element, and the circuit board is exposed from the opening of the electromechanical chamber, the fan blade and the second magnetic element are arranged in a groove, the second magnetic element is located between the first magnetic element and the fan blade, and the second magnetic element passes through the first magnetic element and is coaxially arranged with the first magnetic element.

[0012] In one embodiment of the present invention, the pump further comprises a fixing member, which is located between the fan blade and the base and is fixed to the housing so that the fan blade and the second magnetic element are fixed in the groove.

[0013] In one embodiment of the present invention, the above-mentioned fan blades include a chassis and a hollow portion, the chassis divides the working space into a heat absorption space and a drainage space, the groove includes the drainage space, part of the heat absorption space is located below the guide baffle, and the working medium in the heat absorption space and the drainage space is liquid-coupled through the hollow portion, the working medium flows into the heat absorption space through the connecting opening, and the fan blades absorb the working medium from the heat absorption space and transfer it to the drainage space through the hollow portion.

[0014] In one embodiment of the present invention, the above-mentioned base includes a top surface and a heat-absorbing bottom surface opposite to each other, the heat-absorbing bottom surface contacts the heat source to absorb heat energy, the top surface is configured with a heat transfer structure, the heat transfer structure is located in the heat-absorbing space, the guide baffle covers the heat transfer structure, and the heat transfer structure is used to conduct the heat energy absorbed by the heat-absorbing surface to the working medium.

[0015] In one embodiment of the present invention, the base further comprises a recessed space, which is recessed in the top surface and located at one side of the heat transfer structure, and the heat absorption space comprises the recessed space.

[0016] In one embodiment of the present invention, the water cooling head further includes an upper cover, the upper cover covers the shell, the shell is located between the upper cover and the base, and the pump is exposed from the upper cover.

[0017] The water cooling head of the embodiment of the present invention defines a water storage chamber between the guide baffle and the shell, and this water storage chamber can be connected to two water inlet channels (i.e., the first water inlet channel and the second water inlet channel). In addition to being able to temporarily store the working medium to ensure that the working medium is not interrupted, it can also increase the convenience and flexibility of the water cooling head during installation.

[0018] In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below with reference to the accompanying drawings for detailed description as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 The figure is a schematic diagram of the appearance structure of a water cooling head according to an embodiment of the present invention.

[0020] Figure 2 for Figure 1 A schematic diagram of the appearance structure of the water cooling head from another perspective is shown.

[0021] Figure 3 for Figure 1 Schematic diagram of the components of the water cooling head shown.

[0022] Figure 4 for Figure 3 A schematic diagram of the assembly of the guide baffle and the shell from another perspective is shown.

[0023] Figure 5 for Figure 3 A schematic diagram of the assembly of the pump and the casing from another perspective is shown.

[0024] Figure 6 For along Figure 1 A schematic cross-sectional view of the AA line segment is shown.

[0025] Figure 7 For along Figure 2 A schematic cross-sectional view of line segment BB is shown.

[0026] Figure 8 For along Figure 1 Schematic cross-sectional view of the CC line segment shown.

[0027] Fig. 9 for Figure 3 Schematic diagram of the assembly of the pump blades and base.

[0028] Fig.10 for Figure 3 A schematic diagram of the appearance structure of the pump blades shown in one perspective.

[0029] Fig.11 for Fig.10 The schematic diagram of the appearance structure of the pump blades shown in another perspective.

[0030] The reference numerals are as follows:

[0031] 1: Water cooling head

[0032] 11: Shell

[0033] 12: Guide baffle

[0034] 13: Base

[0035] 14: First water inlet channel

[0036] 15: Second water inlet channel

[0037] 16: Drainage channel

[0038] 17: Pump

[0039] 18: Upper cover

[0040] 110: Embedded groove

[0041] 111: Electromechanical Chamber

[0042] 112: Groove

[0043] 120: Connecting opening

[0044] 131: Heat absorbing bottom surface

[0045] 132: Top

[0046] 133: Heat transfer structure

[0047] 134: Sunken Space

[0048] 171: Circuit Board

[0049] 172: First magnetic element

[0050] 173: Fan Blade

[0051] 174: Second magnetic element

[0052] 1731: Fixings

[0053] 1732: Hollow part

[0054] 1733: Top wall

[0055] 1734: Chassis

[0056] 1735: Partition Wall

[0057] 1736: Bushing

[0058] 1737: Shaft rod

[0059] 1738: Ribs

[0060] 1739: Drainage Chamber

[0061] A, B, C, D, F: Arrows

[0062] O1, O2: Open

[0063] S1: First side

[0064] S2: Second side

[0065] SC: water storage chamber

[0066] WS: Action Space

[0067] WS1: Heat absorbing space

[0068] WS2: Drainage space. DETAILED DESCRIPTION

[0069] The water cooling head provided by the present invention can be installed in a computer host or server. After being filled with a working medium, the water cooling head can absorb the heat energy generated by a heat source such as a chip or a memory, and transmit the heated working medium to a condensing device for cooling. Finally, the cooled working medium will be transmitted back to the water cooling head for the next heat absorption and circulation flow.

[0070] See also Figures 1 to 8 , Figure 1 The figure is a schematic diagram of the appearance structure of a water cooling head according to an embodiment of the present invention. Figure 2 for Figure 1 A schematic diagram of the appearance structure of the water cooling head from another perspective is shown. Figure 3 for Figure 1 Schematic diagram of the components of the water cooling head shown. Figure 4 for Figure 3 A schematic diagram of the assembly of the guide baffle and the shell from another perspective is shown. Figure 5 for Figure 3 A schematic diagram of the assembly of the pump and the casing from another perspective is shown. Figure 6For along Figure 1 A schematic cross-sectional view of the AA line segment is shown. Figure 7 For along Figure 2 A schematic cross-sectional view of line segment BB is shown. Figure 8 For along Figure 1 Schematic cross-sectional view of the CC line segment shown.

[0071] like Figures 1 to 8 As shown, the water cooling head 1 of this embodiment includes a shell 11, a guide baffle 12, a base 13, a first water inlet channel 14, a second water inlet channel 15, a drainage channel 16 and a pump 17. The guide baffle 12 is disposed on the shell 11 and defines a water storage chamber SC together with the shell 11. That is, when the guide baffle 12 and the shell 11 are assembled with each other, the guide baffle 12 will separate a chamber in the shell 11 for temporarily storing the working medium. The guide baffle 12 is located between the shell 11 and the base 13, and the guide baffle 12 includes a connecting opening 120. The base 13, the shell 11 and the guide baffle 12 define an action space WS together. The first water inlet channel 14 and the second water inlet channel 15 are respectively connected to the water storage chamber SC, and the first water inlet channel 14 and the second water inlet channel 15 are used to allow the cooled working medium to flow into the water storage chamber SC respectively. After the working medium flows into the water storage chamber SC from the first water inlet channel 14 and the second water inlet channel 15, the working medium will flow into the working space WS through the connecting opening 120 of the guide baffle 12 and pass through the base 13. The base 13 is used to absorb heat energy from the heat source and then transfer the heat energy to the working medium. The drainage channel 16 is connected to the working space WS, and the drainage channel 16 is used to discharge the heat-absorbing working medium from the working space WS to the outside of the water-cooling head 1. The pump 17 is arranged in the housing 11, and the pump 17 is used to guide the working medium in the working space WS to the drainage channel 16.

[0072] The following further describes the detailed structure of the water cooling head 1 according to the embodiment of the present invention.

[0073] like Figures 1 to 3As shown, the first water inlet channel 14 of this embodiment is located at the first side S1 of the housing 11, the second water inlet channel 15 is located at the second side S2 opposite to the first side S1, and the drainage channel 16 is located at the first side S1 of the housing 11 and adjacent to the first water inlet channel 14. In order to ensure that the supply of the working medium in the water-cooling head 1 is not interrupted, a water storage chamber SC is specially planned in the water-cooling head 1 in this embodiment, and both the first water inlet channel 14 and the second water inlet channel 15 are connected to the water storage chamber SC. In the water-cooling head 1 provided in the present embodiment, the first water inlet channel 14 and the second water inlet channel 15 are arranged on different sides of the water storage chamber SC, that is, the first water inlet channel 14 is arranged on the first side S1 of the shell 11, and the second water inlet channel 15 is arranged on the second side S2 of the shell bottom 11. Therefore, in the water-cooling head 1 disclosed in the present case, the working medium can be supplied to the water storage chamber SC through the first water inlet channel 14 and the second water inlet channel 15 arranged on different sides and different positions of the water storage chamber SC. However, the above disclosed structure is only one embodiment of the present invention. In other embodiments, the first water inlet channel 14 and the second water inlet channel 15 can also be respectively arranged at other positions of the water storage chamber SC, for example, on adjacent two sides of the water storage chamber SC. In the design in which the first water inlet channel 14 and the second water inlet channel 15 are respectively arranged on different sides of the water-cooling head 1, the installation flexibility of the user can be increased, and the user can select an appropriate water inlet channel to supply the working medium according to the design requirements of the product structure.

[0074] It should be particularly noted that in the present embodiment, the water cooling head 1 has a first water inlet channel 14 and a second water inlet channel 15 respectively connected to the water storage chamber SC, but the present invention does not limit the number of water inlet channels, which can be increased or decreased according to actual needs, for example, only one water inlet channel or more than two water inlet channels.

[0075] The housing 11 of the water-cooling head 1 can be covered by the upper cover 18. For example, the upper cover 18 can be screwed to the screw holes of the housing 11. After the upper cover 18 covers the housing 11, the pump 17 will be exposed from the upper cover 18, so that the pump 17 can be connected to the external power supply. In other embodiments, the upper cover 18 and the housing 11 can be sealed by heating or other bonding means, which is not limited by the present invention. In addition, the upper cover 18 can also be a transparent or light-transmitting cover to help the user observe the supply of the working medium.

[0076] like Figure 3 and Figure 5As shown, the housing 11 of this embodiment includes an electromechanical chamber 111 and a groove 112 that are connected to each other. The opening O1 of the electromechanical chamber 111 is located on the top side of the housing 11, and the opening O2 of the groove 112 is located on the bottom side of the housing 11 relative to the top side. The pump 17 of this embodiment includes a circuit board 171, a first magnetic element 172, a fan blade 173 and a second magnetic element 174. The circuit board 171 and the first magnetic element 172 of the pump 17 are arranged in the electromechanical chamber 111 of the housing 11, the circuit board 171 is located above the first magnetic element 172, and the circuit board 171 is exposed from the opening O1 of the electromechanical chamber 111. The fan blade 173 and the second magnetic element 174 of the pump 17 are arranged in the groove 112 of the housing 11, the second magnetic element 174 is located between the first magnetic element 172 and the fan blade 173, and the second magnetic element 174 passes through the first magnetic element 172 and is coaxially arranged with the first magnetic element 172.

[0077] In addition, the water cooling head 1 provided in this embodiment also has a thin design, which separates the electromechanical chamber 111 and the groove 112 used to install the pump 17 from the water storage chamber SC so as to be respectively arranged at different horizontal positions relative to the shell 11, so as not to overlap in the vertical direction, thereby reducing the height of the water cooling head 1.

[0078] In this embodiment, the circuit board 171 of the pump 17 is further connected to a power source (not shown), including a wired connection method using electric wires, or other wireless connection methods such as electromagnetic induction, to provide the power required for the operation of the pump 17. The electromechanical chamber 111 of the housing 11 is a space isolated from water, so that the circuit board 171 and the first magnetic element 172 or the electric wire and other energized elements can be protected from short circuits. In addition, the fan blades 173 and the second magnetic element 174 of the pump 17 are arranged in the groove 112 of the housing 11, that is, they are located on the path through which the working medium flows. Therefore, when the pump 17 is running and the fan blades 173 are rotated, the working medium can be guided by the fan blades 173 and the housing 11 to generate flow.

[0079] In this embodiment, the first magnetic element 172 and the second magnetic element 174 are coaxially arranged with each other, and are independently separated by the housing 11. The first magnetic element 172 and the second magnetic element 174 can be selected from magnets or other materials that can be driven or attracted by a magnetic field. In addition, the second magnetic element 174 is combined with the fan blade 173. When the pump 17 is powered on, under the joint action of the circuit board 171, the first magnetic element 172 and the second magnetic element 174, the fan blade 173 connected with the second magnetic element 174 can be driven to rotate.

[0080] like Figures 1 to 3As shown, the base 13 of this embodiment is mainly responsible for absorbing heat energy, so the material can be selected from metal or other materials with good thermal conductivity. The base 13 can be a one-piece structure or a composite structure composed of multiple layers or multiple components. The present invention does not limit the composition structure of the base 13. The outer side of the base 13, that is, the other side relative to the shell 11, has a heat-absorbing bottom surface 131, and the top surface 132 of the base 13, that is, the side facing the shell 11, is formed or configured with a heat transfer structure 133, and the above-mentioned guide baffle 12 covers the heat transfer structure 133 of the base 13 (such as Figure 6 As shown). When the heat-absorbing bottom surface 131 of the base 13 makes direct or indirect thermal contact with the heat source, the heat-absorbing bottom surface 131 will absorb its heat energy and transfer it to the heat transfer structure 133 above, and the heat transfer structure 133 will then transfer the heat energy to the working medium through contact with the working medium (not shown in the figure). The heat transfer structure 133 of the base 13 can be selected from skived fins, or other columnar, sheet-like, or even irregularly shaped fins. The gaps between adjacent fins allow the working medium to pass through, and by increasing the contact area with the working medium (for example, increasing the density of the arrangement), the heat energy can be transferred to the working medium faster. In addition, in order to avoid direct contact between the guide baffle 12 and the heat transfer structure 133 and cause wear between them, a sponge (not shown in the figure) can be selectively arranged between the guide baffle 12 and the heat transfer structure 133.

[0081] like Figures 6 to 8 See also Figures 1 to 3In the present embodiment, the base 13 of the water cooling head 1 is combined with the shell 11 from the bottom of the shell 11 by locking or other fixing methods. After the shell 11 and the base 13 of the water cooling head 1 are combined, they can define an action space WS for the working medium to flow together with the guide baffle 12. The action space WS can be roughly divided into a heat absorption space WS1 and a drainage space WS2 by the fan blades 173 of the pump 17. The groove 112 of the shell 11 includes the drainage space WS2, and part of the heat absorption space WS1 is located below the guide baffle 12, without relying on other partitions or compartments, so that the internal structure of the water cooling head 1 can be simplified, and the heat transfer structure 133 configured on the top surface 132 of the base 13 is located in the heat absorption space WS1. In addition, the base 13 of the present embodiment also includes a recessed space 134, which is recessed in the top surface 132 of the base 13 and located on one side of the heat transfer structure 133, and the recessed space 134 is also located in the heat absorption space WS1. In the water-cooled head 1 provided in the present embodiment, the connecting opening 120 of the guide baffle 12 is structurally connected to the water storage chamber SC and the heat absorption space WS1 from top to bottom, so as to allow the working medium to flow from the water storage chamber SC into the heat absorption space WS1. It should be particularly noted that in the present embodiment, the connecting opening 120 of the guide baffle 12 is opened at a position adjacent to the second water inlet channel 15, but the present invention is not limited thereto, and the connecting opening 120 of the guide baffle 12 can be adjusted according to the different configuration positions of the water inlet channel. The detailed flow path of the working medium in the water-cooled head 1 is described in the following paragraph.

[0082] like Figures 6 to 8 As shown, in this embodiment, the working medium entering the water-cooled head 1 can choose to flow into the water storage chamber SC from the first water inlet channel 14 along the direction of arrow A, or flow into the water storage chamber SC from the second water inlet channel 15 along the direction of arrow B; then the working medium will turn at the connecting opening 120 of the guide baffle 12 and enter the heat absorption space WS1 along the direction of arrow C; then the working medium will pass through the inside of the heat transfer structure 133 located in the heat absorption space WS1 along the direction of arrow D to absorb the heat energy absorbed by the working medium through the heat transfer structure 133; then the fan blades 173 will absorb the working medium directly from the heat absorption space WS1 to the drainage space WS2 in the direction of arrow E, and finally, the working medium will be discharged from the outside of the water-cooled head 1 along the direction of arrow F via the drainage channel 16 connected to the drainage space WS2 and the working medium will be cooled after absorbing heat.

[0083] In addition, it should be particularly noted that the first water inlet channel 14, the second water inlet channel 15 and the drainage channel 16 can be further extended outward or connected to a joint, and the joint is further connected to a condensing device such as a water cooling radiator through a pipeline (not shown).

[0084] See also Figures 9 to 11 , Fig. 9for Figure 3 Schematic diagram of the assembly of the pump blades and base. Fig.10 for Figure 3 A schematic diagram of the appearance structure of the pump blades shown in one perspective. Fig.11 for Fig.10 The pump blades are shown in another perspective. Fig. 9 and Fig.11 As shown, in the heat absorption space WS1 of the water cooling head 1, the fan blade 173 and the fixing member 1731 are installed above the recessed space 134 of the base 13, that is, the fixing member 1731 is located between the fan blade 173 and the base 13, which is to ensure that the working medium can be directly adsorbed by the hollow portion 1732 of the fan blade 173 after absorbing the heat energy of the heat transfer structure 133, and the working medium will only be slightly blocked by the fixing member 1731 before entering the fan blade 173, and no other partition walls, compartments or covers are provided in the shell 11 to guide the working medium, thereby simplifying the internal structure of the water cooling head 1. In addition, the fan blade 173 and the second magnetic element 174 are not only fixed to the base 13 by the fixing member 1731, but also arranged in the groove 112 of the shell 11.

[0085] like Fig.10 and Fig.11As shown, as mentioned above, in the water-cooled head 1 provided in this embodiment, the working space WS is generally separated into the heat absorption space WS1 and the drainage space WS2 by the fan blades 173 of the pump 17, so the fan blades 173 themselves have the dual functions of absorbing the working medium and discharging the working medium. In order to achieve the above functions, the fan blades 173 provided by the present invention are arranged in the working space WS and adjacent to the drainage channel 16, so as to directly absorb the working medium from the heat absorption space WS1 to the drainage space WS2 and then discharge it from the water-cooled head 1. In addition to the hollow portion 1732, the structure of the fan blade 173 also includes a top wall 1733, a bottom plate 1734, a partition wall 1735, a shaft sleeve 1736 and a shaft rod 1737, wherein a hollow portion 1732 is formed at the junction of the bottom plate 1734 and the shaft sleeve 1736, and the bottom plate 1734 and the shaft sleeve 1736 are connected by ribs 1738 between adjacent hollow portions 1732. The chassis 1734 is a structure in the fan blade 173 that is mainly responsible for dividing the working space WS into the heat absorption space WS1 and the drainage space WS2, and the heat absorption space WS1 and the drainage space WS2 are fluidly coupled through the hollow portion 1732, that is, the working medium can enter the drainage space WS2 from the heat absorption space WS1 through the hollow portion 1732. The top wall 1733 and the chassis 1734 are arranged at intervals, and a plurality of partition walls 1735 are connected between the two, so that a plurality of drainage chambers 1739 can be separated. When the working medium is transferred upward from the heat absorption space WS1 through the hollow portion 1732 to the drainage space WS2, the working medium will touch the top wall 1733 and turn, and then flow to each drainage chamber 1739, and then the working medium in each drainage chamber 1739 will be thrown into the drainage channel 16 and discharged from the water cooling head 1 through the action of centrifugal force. The top wall 1733 of the fan blade 173 not only has a guiding function of changing the flow direction, but also prevents the partition wall 1735 from directly touching the shell 11, thereby reducing the chance of wear.

[0086] In addition, the fan blades 173 of the pump 17 provided in this embodiment are driven by the electromagnetic induction between the first magnetic element 172 and the second magnetic element 174, and are not driven by the shaft rod 1737. Therefore, there is no linkage between the fan blades 173 and the shaft rod 1737. However, in order to maintain the durability and stability of the fan blades 173 and prevent them from deviating from the axis or touching the housing 11 and causing wear during rotation, the fan blades 173 provided in this embodiment are particularly provided with a hollow structured shaft sleeve 1736 inside, and the shaft sleeve 1736 is sleeved on the shaft rod 1737. In addition, in order to fix the shaft rod 1737, a fixing member 1731 is also provided in the water cooling head 1 to accommodate one end of the shaft rod 1737. The fixing member 1731 has a blind hole for the shaft rod 1737 to be mounted. In addition, the fixing member 1731 can be received and fixed in the embedding groove 110 on the bottom surface of the housing 11 facing the working space WS, or the fixing member 1731 can be installed in the recessed space 134 of the base 132, and the present invention is not limited thereto.

[0087] In summary, the water cooling head of the embodiment of the present invention defines a water storage chamber between the guide baffle and the shell, and this water storage chamber can be connected to two water inlet channels (i.e., the first water inlet channel and the second water inlet channel). In addition to being able to temporarily store the working medium to ensure that the working medium is not interrupted, it can also increase the convenience and flexibility of the water cooling head during installation.

[0088] The above contents are only preferred embodiments of the present invention, and should not be used to limit the scope of the present invention. That is, any simple equivalent changes and modifications made according to the claims and description of the present invention are still within the scope of the present invention. In addition, any embodiment or claim of the present invention does not have to achieve all the purposes, advantages or features disclosed in the present invention. In addition, the abstract and title are only used to assist in searching patent documents, and are not used to limit the scope of rights of the present invention. In addition, the terms "first", "second", etc. mentioned in this specification or claims are only used to name the name of the element or distinguish different embodiments or scopes, and are not used to limit the upper or lower limit of the number of elements.

Claims

1. A water cooling head, It is characterized in that include: a housing; a guide baffle, disposed on the shell and defining a water storage chamber together with the shell, the water storage chamber can be filled with a working medium, the guide baffle includes a communication opening; A base, the base, the shell, and the guide baffle together define an action space, and the guide baffle is located between the base and the shell, the working medium flows into the action space through the communication opening, and the base is used to absorb heat energy and transfer the heat energy to the working medium; a first water inlet channel connected to the water storage chamber, the first water inlet channel being used to allow the cooled working medium to flow into the water storage chamber; a drainage channel connected to the working space, the drainage channel being used for discharging the heat-absorbing working medium from the working space; as well as a pump, disposed in the housing, for guiding the working medium in the action space to the drainage channel to discharge the working medium from the action space; The pump includes a fan blade, which has a plurality of hollow parts, a top wall, a bottom plate, a plurality of partition walls, a shaft sleeve and a plurality of ribs. The plurality of hollow parts are formed at the junction of the chassis and the sleeve, and the chassis and the sleeve are connected by the plurality of ribs between the adjacent plurality of hollow parts. The top wall is spaced apart from the bottom plate, and the top wall and the bottom plate are connected with the plurality of partition walls. The chassis divides the working space into a heat absorption space and a drainage space.

2. The water cooling head according to claim 1, It is characterized in that The water cooling head also includes a second water inlet channel, which is connected to the water storage chamber, and the first water inlet channel is located on a first side of the shell, the second water inlet channel is located on a second side opposite to the first side, and the drainage channel is located on the first side of the shell and adjacent to the first water inlet channel.

3. The water cooling head according to claim 1, It is characterized in that The shell includes an electromechanical chamber and a groove. The opening of the electromechanical chamber is located on the top side of the shell, and the opening of the groove is located on the bottom side of the shell relative to the top side.

4. The water cooling head according to claim 3, It is characterized in that The pump includes a circuit board, a first magnetic element and a second magnetic element. The circuit board and the first magnetic element are arranged in the electromechanical chamber, the circuit board is located above the first magnetic element, and the circuit board is exposed from the opening of the electromechanical chamber, the fan blade and the second magnetic element are arranged in the groove, the second magnetic element is located between the first magnetic element and the fan blade, and the second magnetic element passes through the first magnetic element and is coaxially arranged with the first magnetic element.

5. The water cooling head according to claim 4, It is characterized in that The pump further comprises a fixing member, which is located between the fan blade and the base and is fixed on the shell so that the fan blade and the second magnetic element are fixed in the groove.

6. The water cooling head according to claim 4, It is characterized in that The groove includes the drainage space, and part of the heat absorption space is located below the guide baffle, and the heat absorption space and the working medium in the drainage space are liquid-coupled through the hollow portion, and the working medium flows into the heat absorption space through the connecting opening, and the fan blade absorbs the working medium from the heat absorption space and transfers it to the drainage space through the hollow portion.

7. The water cooling head according to claim 6, It is characterized in that The base includes a top surface and a heat-absorbing bottom surface opposite to each other. The heat-absorbing bottom surface contacts a heat source to absorb heat energy. The top surface is provided with a heat transfer structure. The heat transfer structure is located in the heat-absorbing space. The guide baffle covers the heat transfer structure. The heat transfer structure is used to conduct the heat energy absorbed by the heat-absorbing surface to the working medium.

8. The water cooling head according to claim 7, It is characterized in that The base also includes a recessed space, which is recessed in the top surface and located at one side of the heat transfer structure, and the heat absorption space includes the recessed space.

9. The water cooling head according to claim 1, It is characterized in that The water cooling head further comprises an upper cover, which covers the shell. The shell is located between the upper cover and the base, and the pump is exposed from the upper cover.

Citation Information

Patent Citations

  • Fluid cooling device

    CN109696008A

  • Water cooling head

    CN212183977U

  • Liquid cooling heat sink structure and cooling circulation system thereof

    US20180340744A1