Substrate processing apparatus, substrate processing device, and substrate processing method

Abstract

The present specification relates to a substrate processing apparatus, a substrate processing device, and a substrate processing method. The substrate processing apparatus includes a rotation unit that supports a substrate and rotates the substrate, a chemical liquid ejecting unit that ejects a chemical liquid toward the rotation unit, a chemical liquid recovering unit that is disposed adjacent to the rotation unit and recovers the chemical liquid scattered from the rotation unit, a lifting unit that is combined with the chemical liquid recovering unit and enables the chemical liquid recovering unit to move in a vertical direction with respect to the rotation unit, and one or more position correcting members that enable the chemical liquid recovering unit to be elastically supported with respect to the lifting unit and enable a relative position of the chemical liquid recovering unit with respect to the lifting unit to be changed.

Description

TECHNICAL FIELD

[0001] The present application relates to a substrate processing apparatus, and more particularly to a substrate processing apparatus, a substrate processing device, and a substrate processing method which can be used for manufacturing a semiconductor. BACKGROUND

[0002] As semiconductor devices are rapidly miniaturized in circuit patterns with high density, high integration, and high performance, contaminants such as particles, organic contaminants, and metal contaminants remaining on the surface of a substrate have a great influence on the characteristics and yield of the devices. Therefore, a cleaning process for removing various contaminants adhering to the surface of the substrate is increasingly important in a semiconductor manufacturing process, and is performed before and after each unit process in the manufacturing of a semiconductor.

[0003] A cleaning method used in a semiconductor manufacturing process can be classified into a dry cleaning and a wet cleaning. The wet cleaning can be classified into a bath type in which a substrate is immersed in a chemical solution to remove contaminants by chemical dissolution, and a spin type in which a chemical solution is supplied to the surface of the substrate while the substrate is rotated on a spin chuck to remove contaminants.

[0004] On the other hand, the spin type is a method in which, after a substrate is fixed to a chuck member capable of processing one substrate, a chemical solution or deionized water is supplied to the substrate through a nozzle while the substrate is rotated, the chemical solution or deionized water is diffused to the entire surface of the substrate by centrifugal force, and the substrate is cleaned, and the substrate is dried with dry gas after the cleaning of the substrate.

[0005] In a substrate processing apparatus in which a substrate is thus subjected to chemical solution processing, a chemical solution is generally recovered and reused by a recovery apparatus. The recovery apparatus includes various spaces into which chemical solutions of different kinds flow. A device that is raised and lowered in the vertical direction can be provided in the recovery apparatus to allow the chemical solutions to flow into the various spaces of the recovery apparatus.

[0006] Such a raising and lowering device can be composed of an air cylinder, which is generally composed of a cylinder and a piston. Such an air cylinder can be provided in the recovery apparatus, and a height difference between the portions supporting the recovery apparatus can occur due to a difference in compressed air in the cylinder in the atmospheric state before the operation is started.

[0007] Therefore, the recovery apparatus is inclined, and a lateral load can be applied to the cylinder. In this case, a seal ring provided on the circumference of the piston is abraded, and air in the lower portion of the cylinder can flow out. Thus, the raising and lowering device can not operate smoothly.

[0008] Moreover, when the recovery device is excessively tilted, liquid medicine does not flow into a space targeted by the recovery device of the liquid medicine but flows into other spaces, and the liquid medicine mixes and can be difficult to reuse.

[0009] (Prior Art Document)

[0010] (Patent Document)

[0011] Patent Document 0001: Korean Patent Publication No. 2014-0067892 SUMMARY

[0012] An object of the present application is to provide a substrate processing apparatus, a substrate processing device, and a substrate processing method capable of preventing breakage and improving work reliability.

[0013] The substrate processing apparatus of one aspect of the present application includes a rotation unit that supports a substrate and rotates the substrate, a liquid medicine ejection unit that ejects liquid medicine toward the rotation unit, a liquid medicine recovery unit that is disposed adjacent to the rotation unit and recovers liquid medicine scattered from the rotation unit, a lift unit that is combined with the liquid medicine recovery unit and enables the liquid medicine recovery unit to move in a vertical direction with respect to the rotation unit, and one or more position correction members that enable the liquid medicine recovery unit to be elastically supported with respect to the lift unit and enable the relative position of the liquid medicine recovery unit with respect to the lift unit to be changed.

[0014] In another aspect, the liquid medicine recovery unit can include a main body portion that recovers liquid medicine, and a bracket portion that protrudes outward from the main body portion.

[0015] In another aspect, the lift unit can include a moving member that is configured in a bar shape, penetrates the bracket portion, and supports the position correction member, a power generation member that lifts and lowers the moving member, and an anti-disengagement member that is combined to a distal end portion of the moving member in a state in which the moving member penetrates the bracket portion.

[0016] In another aspect, the position correction member can be disposed around the moving member and between the power generation member and the bracket portion.

[0017] In another aspect, the substrate processing apparatus can further include a stress prevention member that is disposed to be penetrated by the moving member and is interposed between the anti-disengagement member and the bracket portion.

[0018] In another aspect, the stress prevention member can be in a sphere shape.

[0019] In another aspect, the position correcting member can be two, either of which is disposed around the moving member between the power generating member and the support portion, and the remaining one is disposed between the detachment preventing member and the support portion.

[0020] In another aspect, the position correcting member can be a compression spring.

[0021] In another aspect, the power generating member can include a cylinder including an internal space, a piston disposed in the internal space of the cylinder and coupled to the moving member and moving in a length direction of the cylinder, and a pressure regulator connected to the cylinder and adjusting a pressure of the internal space of the cylinder.

[0022] A substrate processing apparatus according to another aspect of the present application includes a load port in which a carrier in which a substrate is accommodated is installed, an indexing chamber in which an indexing robot is provided inside, the indexing robot transporting the substrate from the carrier installed in the load port, and a process processing portion in which a substrate processing device that performs a liquid processing process on the substrate is provided. The substrate processing device includes a rotating unit that supports the substrate and rotates the substrate, a chemical liquid spraying unit that sprays a chemical liquid to the rotating unit, a chemical liquid recovery unit that is disposed adjacent to the rotating unit and recovers the chemical liquid scattered from the rotating unit, a lifting unit that is coupled to the chemical liquid recovery unit and enables the chemical liquid recovery unit to move in an up-and-down direction with respect to the rotating unit, and one or more position correcting members that enable the chemical liquid recovery unit to be elastically supported with respect to the lifting unit and enable a relative position of the chemical liquid recovery unit with respect to the lifting unit to be changed.

[0023] A substrate processing method according to another aspect of the present application includes a step of rotating a substrate supported by a rotating unit, a step of spraying a chemical liquid onto the substrate by a chemical liquid spraying unit, and a step of lifting a chemical liquid recovery unit disposed adjacent to the rotating unit by a lifting unit to thereby recover the chemical liquid. In this case, the chemical liquid recovery unit can be elastically supported with respect to the lifting unit by a position correcting member.

[0024] A substrate processing device according to an embodiment of the present application includes a position correcting member. The position correcting member is disposed between a lifting unit and a chemical liquid recovery unit. Also, the lifting unit can be disposed on left and right sides of the chemical liquid recovery unit, respectively. Even if a height difference is generated in a moving member due to a pressure difference in a cylinder, the chemical liquid recovery unit can maintain a substantially horizontal state by the position correcting member.

[0025] Therefore, it is possible to prevent the cylinder or the piston included in the power generating member from being damaged. For example, when the cylinder is an air pressure type, it is possible to prevent air from leaking from the cylinder, and thus it is possible to prevent the piston from not reaching a target position.

[0026] Further, in the substrate processing apparatus of the present application, the chemical liquid recovery unit is always kept horizontal, and thus it is possible to flow into the flow inlet of the chemical liquid recovery apparatus as a target for various kinds of chemical liquids. Therefore, it is possible to prevent various kinds of chemical liquids from mixing and to recover and reuse the chemical liquid. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 is a perspective view showing a substrate processing apparatus of a first embodiment of the present application.

[0028] Figure 2 is a cross-sectional view taken along line II-II' of the substrate processing apparatus of Figure 1

[0029] Figure 3 is a graph showing the respective heights of the left and right of the chemical liquid recovery unit measured during operation of the substrate processing apparatus of the comparative example.

[0030] Figure 4 is a graph showing the respective heights of the left and right of the chemical liquid recovery unit measured during operation of the substrate processing apparatus of the embodiment.

[0031] Figure 5 is a graph showing the maximum lateral load generated in the cylinder according to displacement deviation of the chemical liquid recovery unit measured in the substrate processing apparatus of the comparative example.

[0032] Figure 6 is a graph showing the maximum lateral load generated in the cylinder according to displacement deviation of the chemical liquid recovery unit measured in the substrate processing apparatus of the embodiment.

[0033] Figure 7 is a view showing a substrate processing apparatus of a second embodiment of the present application.

[0034] Figure 8 is a view showing a substrate processing apparatus of a third embodiment of the present application.

[0035] Figure 9 is a view showing the process of the chemical liquid recovery unit rising in the substrate processing apparatus of Figure 8

[0036] Figure 10 is a plan view schematically showing a substrate processing apparatus of the embodiment of the present application.

[0037] (LEGEND OF REFERENCE NUMERALS)

[0038] ​​100, 200, 300: substrate processing apparatus

[0039] 110: rotating unit

[0040] 120: chemical liquid ejecting unit

[0041] 130: chemical liquid recovering unit

[0042] 131: main body portion

[0043] 132: support portion

[0044] 140: position correcting member

[0045] 150: elevating unit

[0046] 151: moving member

[0047] 152: power generating member

[0048] 153: cylinder

[0049] 154: piston

[0050] 155: pressure regulator

[0051] 156: anti-disengagement member

[0052] 360: stress preventing member DETAILED DESCRIPTION

[0053] Embodiments of the present application will be described in detail below with reference to the attached drawings. The present application can be implemented in various different forms and is not limited to the embodiments described herein.

[0054] In order to clearly explain the present application, parts irrelevant to the explanation are omitted and the same reference numerals are assigned to the same or similar constituent elements throughout the entire description.

[0055] In addition, in each embodiment, the same reference numerals are used for the constituent elements having the same structure and only representative embodiments are explained and in the remaining other embodiments, only the structure different from the representative embodiments is explained.

[0056] In the entire description, when it is said that a certain part is "connected" to another part, it includes not only the case of "directly connected" but also the case of "indirectly connected" with other parts interposed therebetween. In addition, when it is said that a certain part "includes" a certain constituent element, it does not exclude other constituent elements but means that other constituent elements can be further included unless specifically noted to the contrary.

[0057] All the terms used herein including technical or scientific terms have the same meaning as commonly understood by one of ordinary skill in the art to which the present application pertains, unless otherwise defined differently. Terms defined in a generally used dictionary should be interpreted in the meaning consistent with the context of the associated technology, not in an ideally or excessively formal meaning, unless otherwise explicitly defined in the present application.

[0058] Referring to Figure 1 and Figure 2 The substrate processing apparatus 100 of the first embodiment of the present application includes a rotation unit 110, a chemical liquid ejection unit 120, a chemical liquid recovery unit 130, a lifting unit 150, and a position correction member 140.

[0059] The rotation unit 110 supports a substrate (not shown) and rotates the substrate. The rotation unit 110 can include a support plate 111 and a rotation motor 112, for example.

[0060] The support plate 111 can support the substrate. The support plate 111 can be relatively larger in size than the substrate. For example, in the case where the substrate is a circular wafer, the support plate 111 can be a circular disk formed of a diameter larger than the diameter of the wafer.

[0061] The rotation motor 112 can be located below the support plate 111. The rotation motor 112 can rotate the support plate 111.

[0062] If the substrate is placed on the support plate 111 and the support plate 111 is rotated, the substrate can also be rotated. At this time, if a chemical liquid is ejected at the center of the substrate, the chemical liquid can spread to the periphery of the substrate under centrifugal force.

[0063] The chemical liquid ejection unit 120 can eject a chemical liquid toward the rotation unit 110. The chemical liquid ejection unit 120 can eject a chemical liquid stored in a tank (not shown) to the substrate by pumping.

[0064] The chemical liquid can be used for various purposes, and as an example of the chemical liquid, at least any one selected from the group consisting of hydrofluoric acid (HF), sulfuric acid (H3SO4), nitric acid (HNO3), phosphoric acid (H3PO4), and SC-1 solution (a mixture of ammonium hydroxide (NH4OH), hydrogen peroxide (H2O2), and water (H2O)), etc. can be used.

[0065] Further, a chemical liquid used for cleaning can use deionized water (DIW), and a gas used for drying can use nitrogen (N2), isopropyl alcohol (IPA: IsoPropyl Aalcohol), etc.

[0066] The chemical liquid recovery unit 130 is located adjacent to the rotation unit 110 and recovers the chemical liquid scattered from the rotation unit 110. In more detail, the chemical liquid recovery unit 130 can be provided to surround the entire circumference of the rotation unit 110 and recover the chemical liquid scattered from the rotation unit 110.

[0067] Such a chemical liquid recovery unit 130 can include a main body part 131 and a bracket part 132, as an example.

[0068] The main body part 131 can recover the chemical liquid. The outer shape of the main body part 131 can be a block shape with a portion of the upper side opened, as an example. The upper side of the main body part 131, which is opened, can serve as an entrance and exit for loading and unloading the substrate.

[0069] The bracket part 132 can protrude outward from the main body part 131. The bracket part 132 can be separated from the left side and the right side of the main body part 131 and can be distanced in a distanced direction.

[0070] The lift unit 150, which will be described later, penetrates the bracket part 132 in the up-and-down direction. If the upper side of the lift unit 150 is raised or lowered, the bracket part 132 can be raised or lowered by the lift unit 150. However, the bracket part 132 can be moved by the position correction member 140 not exactly the same distance as the movement of the lift unit 150, and a detailed description thereof will be described later.

[0071] Such a chemical liquid recovery unit 130 separates and recovers chemical liquids different from each other among chemical liquids used in a process. To this end, the main body part 131 of the chemical liquid recovery unit 130 can include a plurality of flow inlets 131a for various kinds of chemical liquids to flow in, respectively.

[0072] The plurality of flow inlets 131a can each be arranged in a line in the up-and-down direction. That is, each of the flow inlets 131a can be located at a different height from each other.

[0073] In the process of processing the substrate, various kinds of chemical liquids can each flow in and be stored in a specific space of the chemical liquid recovery unit 130. For example, the chemical liquid flowing into each of the flow inlets 131a can be provided to an external chemical liquid regenerating part (not shown) through a non-illustrated recovery line to be reused. The chemical liquid regenerating part can be a device that regenerates the chemical liquid to be reused by performing concentration adjustment and temperature adjustment, and filtration of contaminant substances, etc. on the chemical liquid used.

[0074] Due to particles, etc. generated in the process of processing the substrate, a contaminant substance can be generated in the chemical liquid recovery unit 130, or a contaminant substance such as fume can be generated from the residual chemical liquid. Such a contaminant substance is regenerated by the chemical liquid regenerating part, thereby being able to prevent the substrate from being contaminated by the chemical liquid contaminated in the subsequent process.

[0075] The chemical liquid recovery unit 130 and the aforementioned chemical liquid ejection unit 120 can be units included in a general substrate processing apparatus, and thus detailed descriptions thereof will be omitted.

[0076] The lifting unit 150 is combined with the chemical liquid recovery unit 130. The lifting unit 150 enables the chemical liquid recovery unit 130 to move in the up-and-down direction with respect to the rotating unit 110. The lifting unit 150 can be provided at the left side and the right side of the chemical liquid recovery unit 130, respectively.

[0077] The lifting unit 150 can include a moving member 151, a power generating member 152, and an anti-disengagement member 156, as an example.

[0078] The moving member 151 can be formed in a bar shape. The moving member 151 can pass through the bracket portion 132. That is, the bracket portion 132 can be moved freely with respect to the moving member 151.

[0079] The moving member 151 can support the position correction member 140. To this end, a clamping table 151a can be present around the moving member 151.

[0080] The clamping table 151a can be in close contact with the lower end of the position correction member 140, based on the direction shown in the drawing. The clamping table 151a can be formed in a strip shape and can be provided along the circumferential surface of the moving member 151.

[0081] Unlike this, although not shown in the drawing, the lower end of the position correction member 140 can be fixedly combined to the moving member 151, so that the moving member 151 can support the position correction member 140.

[0082] The power generating member 152 can lift and lower the moving member 151. The power generating member 152 can be any of an oil pressure type, an air pressure type, etc., as long as it can lift and lower the moving member 151.

[0083] The power generating member 152 can include a cylinder 153, a piston 154, and a pressure regulator 155, as an example.

[0084] The cylinder 153 can include an internal space in which the piston 154 to be described later can move.

[0085] The piston 154 can be located inside the cylinder 153 and can be combined to the moving member 151. The piston 154 can move in the length direction of the cylinder 153.

[0086] The pressure regulator 155 can be connected to the cylinder 153 and can regulate the pressure of the internal space of the cylinder 153.

[0087] In more detail, the pressure regulator 155 can add or subtract compressed air to the lower portion of the cylinder 153. Here, the lower portion of the cylinder 153 can be a space lower than the piston 154.

[0088] If the pressure regulator 155 supplies compressed air to the lower portion of the cylinder 153, the piston 154 can rise. In contrast, if the pressure regulator 155 removes compressed air from the lower portion of the cylinder 153, the piston 154 can descend.

[0089] The anti-disengagement member 156 can be coupled to the end portion of the moving member 151 in a state in which the moving member 151 penetrates the bracket portion 132. The anti-disengagement member 156 can be positioned above the bracket portion 132 with reference to the direction shown in the drawing. The anti-disengagement member 156 can prevent the moving member 151 from being disengaged from the bracket portion 132.

[0090] If the power generation member 152 causes the moving member 151 to rise, the position correction member 140 can also rise. As described above, the bracket portion 132 of the liquid recovery unit 130 is elastically supported by the position correction member 140, and thus the liquid recovery unit 130 can also rise together with the position correction member 140. In contrast, if the power generation member 152 causes the moving member 151 to descend, the liquid recovery unit 130 can also descend.

[0091] The position correction member 140 enables the liquid recovery unit 130 to be elastically supported by the lifting unit 150. The position correction member 140 enables the relative position of the liquid recovery unit 130 with respect to the lifting unit 150 to be changed. The position correction member 140 can be one or more. The case in which the position correction member 140 is plural is described later.

[0092] Such a position correction member 140 can be disposed to surround the moving member 151 and to be interposed between the power generation member 152 and the bracket portion 132. The position correction member 140 for this purpose can be a compression spring. One end of the compression spring can be in close contact with the bracket portion 132.

[0093] On the other hand, the state of the cylinder 153 inside the power generation member 152 of each of the lifting units 150 can be different. At this time, if the lifting unit 150 starts to operate, a height difference can occur in the moving member 151 of each power generation member 152. The position correction member 140 corrects such a height difference and can prevent the liquid recovery unit 130 from tilting.

[0094] On the other hand, a controller for executing a substrate processing method by the substrate processing apparatus of the embodiment of the present application can be provided to the substrate processing apparatus. The substrate processing method of the embodiment of the present application includes a step of rotating a substrate supported by the rotating unit 110, a step of ejecting a chemical liquid onto the substrate by the chemical liquid ejecting unit 120, and a step of elevating and lowering the chemical liquid recovery unit 130 disposed adjacent to the rotating unit 110 by the elevating unit 150 to recover the chemical liquid. Here, the chemical liquid recovery unit 130 is elastically supported by the position correcting member 140 with the elevating unit 150.

[0095] It can be confirmed from the following experimental results that the substrate processing apparatus of the embodiment of the present application can prevent the chemical liquid recovery unit from tilting during operation.

[0096] The displacement difference of the support portions on the left and right sides of the main body portion and the lateral load applied to the cylinder were measured during operation of the substrate processing apparatus of the embodiment and the substrate processing apparatus of the comparative example, respectively.

[0097] The substrate processing apparatus of the embodiment is Figure 2 On the contrary, the substrate processing apparatus of the comparative example is a conventional substrate processing apparatus without the position correcting member.

[0098] The substrate processing apparatus of the embodiment and the substrate processing apparatus of the comparative example were operated in such a manner that the chemical liquid recovery unit was gradually elevated to a certain height and then lowered.

[0099] Referring to Figure 3 In the substrate processing apparatus of the comparative example, the displacement difference of the left and right support portions of the chemical liquid recovery unit slightly occurred in the interval between 1.6 seconds and 2.0 seconds during which the chemical liquid recovery unit was lowered. However, the displacement difference of the left and right support portions of the chemical liquid recovery unit greatly occurred (about 5.33 mm) in the interval between 1.18 seconds and 0.8 seconds during which the chemical liquid recovery unit was elevated.

[0100] Referring to Figure 4 It can be confirmed that in the substrate processing apparatus of the embodiment, the displacement difference of the left and right support portions of the chemical liquid recovery unit hardly occurred in all intervals.

[0101] Referring to Figure 5 In the substrate processing apparatus of the comparative example, the lateral load of the cylinder was 131 N when the displacement difference of the left and right support portions of the chemical liquid recovery unit was 1.3 mm. Also, the lateral load of the cylinder was 137 N when the displacement difference was 2.5 mm, and 143 N when the displacement difference was 3.4 mm. That is, in the substrate processing apparatus of the comparative example, the lateral load of the cylinder greatly varied depending on the displacement difference.

[0102] Referring toFigure 6 In the substrate processing apparatus of the embodiment, when the displacement difference of each of the left and right support portions of the chemical liquid recovery unit is 1.3 mm, it is 103 N. Also, when the displacement difference is 2.5 mm, it is 106 N, and when the displacement difference is 3.4 mm, it is 108 N. That is, it is confirmed that the lateral load generated by the cylinder is significantly reduced in the substrate processing apparatus of the embodiment as compared with the substrate processing apparatus of the comparative example.

[0103] It is confirmed from such an experimental result that the substrate processing apparatus of an embodiment of the present application does not tilt and almost maintains a horizontal state during the operation of the chemical liquid recovery unit.

[0104] Returning to Figure 2 As described above, the substrate processing apparatus 100 of the present application includes the position correction member 140. Also, the lifting units 150A, 150B can be provided on the left and right sides of the chemical liquid recovery unit 130, respectively. In addition, the position correction member 140 is provided between the lifting units 150 and the chemical liquid recovery unit 130. Therefore, even if a height difference is generated in the moving member 151 included in each of the lifting units 150A, 150B, the chemical liquid recovery unit 130 can maintain a state almost horizontal by the position correction member 140.

[0105] Therefore, it is possible to prevent damage to the cylinder 153 or the piston 154. For example, in the case of the cylinder 153 of an air pressure type, it is possible to prevent air from leaking from the cylinder 153, and thus it is possible to prevent the piston 154 from not reaching a target position.

[0106] Also, the substrate processing apparatus 100 of the present application maintains the chemical liquid recovery unit 130 always horizontal, and thus it is possible to flow into the flow inlet 131a of the chemical liquid recovery apparatus of various kinds of chemical liquids as a target. Thereby, it is possible to prevent various kinds of chemical liquids from being mixed and to recover and reuse the chemical liquid.

[0107] Referring to Figure 7 The substrate processing apparatus 200 of the second embodiment of the present application can include two position correction members 140A, 140B.

[0108] Either one of the two position correction members 140, the position correction member 140A, can be provided around the moving member 151 and can be located between the power generation member 152 and the support portion 132. Also, the remaining one of the two position correction members 140, the position correction member 140B, can be located between the anti-disengagement member 156 and the support portion 132.

[0109] Thus, in the substrate processing apparatus 200 of the second embodiment of the present application, both the upper side and the lower side of the support portion 132 can be elastically supported by the position correction member 140. Therefore, compared with the substrate processing apparatus 100 (refer to Figure 2 ) of the aforementioned embodiment, the chemical liquid recovery unit 130 can be more flexibly moved in the up-and-down direction. Thus, the chemical liquid recovery unit 130 can more stably maintain the horizontal state.

[0110] With reference to Figure 8 and Figure 9 , the substrate processing apparatus 300 of the third embodiment of the present application can further include a stress prevention member 360.

[0111] The stress prevention member 360 can be provided so as to be penetrated by the moving member 151. The stress prevention member 360 can be interposed between the detachment prevention member 156 and the support portion 132.

[0112] The stress prevention member 360 can be, for example, a sphere shape. Thus, the stress prevention member 360 can be in spot contact with the detachment prevention member 156, and can also be in spot contact with the support portion 132.

[0113] When the chemical liquid recovery unit 130 is excessively inclined to one side due to an external force or breakage, the stress prevention member 360 can prevent the support portion 132 and the detachment prevention member 156 from being pressed by sharp portions such as edges of each other and being damaged, by making the support portion 132 and the detachment prevention member 156 not contact each other.

[0114] Figure 10 is a plan view schematically showing a substrate processing apparatus of an embodiment of the present application. With reference to Figure 10 , the substrate processing apparatus 10 includes an indexing section 1000 and a process processing section 2000.

[0115] The indexing section 1000 can include a load port 1200 and an indexing chamber 1400. The load port 1200, the indexing chamber 1400, and the process processing section 2000 can be arranged in a line in this order. Hereinafter, the direction in which the load port 1200, the indexing chamber 1400, and the process processing section 2000 are arranged is referred to as a first direction 12. Also, when viewed from above, a direction perpendicular to the first direction 12 is referred to as a second direction 14, and a direction perpendicular to a plane including the first direction 12 and the second direction 14 is referred to as a third direction 16.

[0116] A carrier C in which a substrate W is accommodated is installed in the load port 1200. The load port 1200 can be provided a plurality of and arranged in a line in the second direction 14. In Figure 10As shown in FIG. 1, four load ports 1200 are provided. However, the number of load ports 1200 can be increased or decreased depending on the process efficiency of the process chamber 2000 and the conditions such as the foot print. The carrier C can use a front opening unified pod (FOUP).

[0117] An index chamber 1400 can be located between the load port 1200 and the process chamber 2000. The index chamber 1400 has a shape of a regular hexahedron having a front plate, a rear plate, and two side plates, and an index robot 1440 for transporting the substrate W between the carrier C installed in the load port 1200 and the load lock chamber 2200 is provided inside thereof. Although not shown, in order to prevent particles from flowing into the internal space, the index chamber 1400 can include a controlled air flow system such as a vent, a laminar flow system.

[0118] The process chamber 2000 can include a load lock chamber 2200, a transfer chamber 2400, and a liquid treatment chamber 2600. The transfer chamber 2400 can be configured such that the length direction thereof is parallel to the first direction 12. The liquid treatment chambers 2600 can be disposed on one side and the other side of the transfer chamber 2400 in the second direction 14, respectively.

[0119] Some of the liquid treatment chambers 2600 can be disposed in the length direction of the transfer chamber 2400. In addition, some of the liquid treatment chambers 2600 can be disposed to be stacked on each other.

[0120] That is, on one side of the transfer chamber 2400, the liquid treatment chambers 2600 can be disposed in an arrangement of A x B (A and B are each a natural number of 1 or more). Here, A is the number of liquid treatment chambers 2600 provided in a row in the first direction 12, and B is the number of liquid treatment chambers 2600 provided in a row in the third direction 16.

[0121] The load lock chamber 2200 is disposed between the index chamber 1400 and the transfer chamber 2400. The load lock chamber 2200 provides a space for temporarily holding the substrate W before the substrate W is transported between the transfer chamber 2400 and the index chamber 1400. The load lock chamber 2200 provides a slot (not shown) for placing the substrate W inside thereof, and the slots (not shown) are provided in a plurality of slots spaced apart from each other in the third direction 16. The load lock chamber 2200 can be provided in a form in which the face facing the index chamber 1400 and the face facing the transfer chamber 2400 are each open.

[0122] The transfer chamber 2400 can transport the substrate W between the load lock chamber 2200 and the liquid processing chamber 2600. A guide rail 2420 and a main robot 2440 can be provided in the transfer chamber 2400. The guide rail 2420 is configured such that the length direction thereof is parallel to the first direction 12. The main robot 2440 is disposed on the guide rail 2420 and is configured to be able to move linearly on the guide rail 2420 in the first direction 12.

[0123] Hereinafter, a structure that transports the substrate W is defined as a transfer unit. As an example, the transfer unit can include the transfer chamber 2400 and the indexing chamber 1400. In addition, the transfer unit can include the main robot 2440 provided in the transfer chamber 2400 and the indexing robot 1440.

[0124] A substrate processing apparatus that performs a liquid processing process, such as a cleaning process, on the substrate W can be provided in the liquid processing chamber 2600. For example, the cleaning process can be a process of cleaning, stripping, or removing organic residue from the substrate W using a processing liquid containing an alcohol component. The substrate processing apparatus provided in each of the liquid processing chambers 2600 can have a different structure depending on the type of cleaning process performed. Alternatively, the substrate processing apparatus in each of the liquid processing chambers 2600 can have the same structure. Alternatively, the liquid processing chambers 2600 can be classified into a plurality of groups, the substrate processing apparatus provided in the liquid processing chambers 2600 belonging to the same group can have the same structure, and the substrate processing apparatus provided in the liquid processing chambers 2600 belonging to different groups can have different structures from each other. Reference Figures 1 to 9 The substrate processing apparatus described with reference to FIG. 1 can be provided in the liquid processing chamber 2600.

[0125] Another aspect of the substrate processing apparatus of the present application includes a load port 1200 in which a carrier C in which a substrate W is mounted is received, an indexing chamber 1400 in which an indexing robot 1440 that transports the substrate W from the carrier C mounted in the load port 1200 is provided, and a process processing section 2000 in which a substrate processing apparatus 100 that performs a liquid processing process on the substrate W is provided. The substrate processing apparatus 100 includes a rotation unit 110 that supports and rotates the substrate, a chemical liquid ejection unit 120 that ejects a chemical liquid toward the rotation unit 110, a chemical liquid recovery unit 130 that is disposed adjacent to the rotation unit 110 and recovers the chemical liquid scattered from the rotation unit 110, a lifting unit 150 that is combined with the chemical liquid recovery unit 130 and enables the chemical liquid recovery unit 130 to move in the up-down direction with respect to the rotation unit 110, and one or more position correction members 140 that enable the chemical liquid recovery unit 130 to be elastically supported with respect to the lifting unit 150 and enable the relative position of the chemical liquid recovery unit with respect to the lifting unit 150 to be changed.

[0126] The above-described various embodiments of the present application, the drawings referred to thus far and the detailed description of the application recorded are only exemplary of the present application, and are used only for the purpose of explaining the present application, and are not used in order to limit or restrict the scope of the present application recorded in the claims. Therefore, it can be understood by those skilled in the art that various modifications and other embodiments equivalent thereto can be implemented therefrom. Therefore, the true technical scope of the present application should be determined by the technical concept of the appended claims.

Claims

1. A substrate processing apparatus comprising: a rotation unit that supports a substrate and rotates the substrate; a chemical liquid ejecting unit that ejects a chemical liquid toward the rotation unit; a chemical liquid recovering unit that is disposed adjacent to the rotation unit and recovers the chemical liquid scattered from the rotation unit; a plurality of lifting units that each combine with the chemical liquid recovering unit and enable the chemical liquid recovering unit to move in a vertical direction with respect to the rotation unit; and a plurality of position correcting members that are each disposed between one of the plurality of lifting units and the chemical liquid recovering unit and each enable the chemical liquid recovering unit to be elastically supported with respect to the lifting unit and enable a relative position of the chemical liquid recovering unit with respect to the lifting unit to be changed, the position correcting member is a compression spring.

2. The substrate processing apparatus according to claim 1, wherein the chemical liquid recovering unit includes: a main body portion that recovers a chemical liquid; and a bracket portion that protrudes outward from the main body portion.

3. The substrate processing apparatus according to claim 2, wherein the lifting unit includes: a moving member that is configured in a bar shape, penetrates the bracket portion, and supports the position correcting member; a power generating member that lifts and lowers the moving member; and an anti-disengagement member that combines with a tip portion of the moving member in a state in which the moving member penetrates the bracket portion.

4. The substrate processing apparatus according to claim 3, wherein the position correcting member is disposed around the moving member and between the power generating member and the bracket portion.

5. The substrate processing apparatus according to claim 3, wherein the substrate processing apparatus further includes: a stress preventing member that is disposed to be penetrated by the moving member and is interposed between the anti-disengagement member and the bracket portion.

6. The substrate processing apparatus according to claim 5, wherein the stress preventing member is a spherical shape.

7. The substrate processing apparatus according to claim 3, wherein the position correcting member includes a first position correcting member that is disposed around the moving member and between the power generating member and the bracket portion, and a second position correcting member that is between the anti-disengagement member and the bracket portion.

8. The substrate processing apparatus according to claim 3, wherein the power generating member includes: a cylinder that includes an internal space; a piston that is located in the internal space of the cylinder, combines with the moving member, and moves in a length direction of the cylinder; and a pressure regulator that is connected to the cylinder and adjusts a pressure of the internal space of the cylinder.

9. A substrate processing apparatus comprising: a load port in which a carrier that accommodates a substrate is installed; an indexing chamber in which an indexing robot is provided, the indexing robot transporting the substrate from the carrier installed in the load port; and a process processing portion that provides a substrate processing apparatus that performs a liquid processing process on the substrate, wherein the substrate processing apparatus includes: a rotation unit that supports the substrate and rotates the substrate; ​ A chemical liquid ejecting unit that ejects a chemical liquid toward the rotating unit; A chemical liquid recovering unit that is disposed adjacent to the rotating unit and recovers the chemical liquid scattered from the rotating unit; A plurality of lifting units that each combine with the chemical liquid recovering unit and enable the chemical liquid recovering unit to move in the up-and-down direction with respect to the rotating unit; and A plurality of position correcting members that are each disposed between one of the plurality of lifting units and the chemical liquid recovering unit and each enable the chemical liquid recovering unit to be elastically supported with respect to the lifting unit and enables the relative position of the chemical liquid recovering unit with respect to the lifting unit to be changed, The position correcting member is a compression spring.

10. The substrate processing apparatus according to claim 9, wherein The chemical liquid recovering unit includes: a main body portion that recovers the chemical liquid; and a support portion that protrudes outward from the main body portion.

11. The substrate processing apparatus according to claim 10, wherein The lifting unit includes: a moving member that is configured in a bar shape, penetrates the support portion, and supports the position correcting member; a power generating member that lifts and lowers the moving member; and an anti-disengagement member that is combined to a tip portion of the moving member in a state in which the moving member penetrates the support portion.

12. The substrate processing apparatus according to claim 11, wherein The position correcting member is disposed around the moving member and between the power generating member and the support portion.

13. The substrate processing apparatus according to claim 11, wherein The substrate processing apparatus further includes: an anti-stress member that is disposed to be penetrated by the moving member and is interposed between the anti-disengagement member and the support portion.

14. The substrate processing apparatus according to claim 13, wherein The anti-stress member is a spherical shape.

15. The substrate processing apparatus according to claim 11, wherein The position correcting member includes a first position correcting member that is disposed around the moving member and between the power generating member and the support portion, and a second position correcting member that is between the anti-disengagement member and the support portion.

16. The substrate processing apparatus according to claim 11, wherein The power generating member includes: a cylinder that includes an internal space; a piston that is located in the internal space of the cylinder, is combined to the moving member, and moves in the length direction of the cylinder; and a pressure regulator that is connected to the cylinder and adjusts the pressure of the internal space of the cylinder.

17. A substrate processing method that is performed by the substrate processing apparatus according to any one of claims 1 to 8 or the substrate processing apparatus according to any one of claims 9 to 16 and includes: a step of rotating a substrate that is supported by a rotating unit; a step of ejecting a chemical liquid onto the substrate by a chemical liquid ejecting unit; and a step of recovering the chemical liquid by lifting and lowering a chemical liquid recovering unit that is disposed adjacent to the rotating unit by a lifting unit.

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