An electrical connector and an integrated device including the same

Abstract

The present invention discloses an electrical connector, which includes an insulator. A first conductor and a second conductor are respectively provided on two side surfaces of the insulator, and a solder layer is provided on the surface of the first conductor and / or the second conductor. By clamping the electrical connector between a chip module and a circuit board and welding the conductors to pins and pads, electrical conduction and fixed connection between the chip module and the circuit board can be achieved. Since the solder layer is provided on the conductor, there is no need to brush solder paste on the pins, reducing the packaging process of integrated devices and the packaging difficulty of integrated devices. Also, since the electrical connector participates in the packaging as a whole, when packaging, only by placing the electrical connector between the chip module and the circuit board, the conductors can be accurately aligned with the pins and pads, thereby reducing the requirements for equipment and personnel. In addition, the present invention also provides two kinds of integrated devices, both of which have the advantages of high precision, low cost, and easy fabrication.

Description

Technical Field

[0001] The present invention relates to the technical field of electrical connectors, and in particular to an electrical connector and an integrated device comprising the same. Background Art

[0002] As the number and density of I / O pin counts within integrated devices continue to increase, the process of connecting chip modules to circuit boards has become very challenging.

[0003] In the past, BGA (Ball Grid Array) was usually used to achieve electrical connection between chip modules and circuit boards. Specifically, solder paste is first applied to the signal input / output pins of the chip module or the pads of the circuit board, and then the two are pasted together, and finally a stable connection is achieved through the reflow process. However, in order to prevent short circuits, solder paste can only be applied to the pins, not between the pins. Since the number and density of signal input / output pins of the chip module are relatively high, the above-mentioned electrical connection form is not only complex in structure, difficult to operate, and requires high precision, but also requires more sophisticated equipment to complete, which is costly. Summary of the invention

[0004] The object of the present invention is to provide an electrical connector and an integrated device including the same which has a simple manufacturing process, low cost, is easy to use and has low operating difficulty.

[0005] In order to achieve the above-mentioned purpose, the present invention provides an electrical connector, which includes an insulator, a plurality of first conductors are provided on one side surface of the insulator, a plurality of second conductors are provided on the other side surface of the insulator, a conductive medium connecting the first conductors and the second conductors is also provided on the insulator, and a solder layer is provided on the surface of the first conductor and / or the second conductor.

[0006] As a preferred solution, the surface of the first conductor and / or the second conductor is a flat surface.

[0007] As a preferred solution, a protrusion is provided on the surface of the first conductor and / or the second conductor.

[0008] As a preferred solution, the protrusion is formed by the first conductor and / or the second conductor protruding toward a side away from the insulator.

[0009] As a preferred embodiment, the shape of the protrusion is columnar, block-shaped, pointed, inverted cone-shaped, tree-branch-shaped, spherical or arc-shaped.

[0010] As a preferred solution, two or more of the raised portions are provided on the surface of the first conductor and / or the second conductor. The shapes of the raised portions are the same or different, the sizes of the raised portions are the same or different, and two or more of the raised portions are distributed continuously or discontinuously on the surface of the first conductor and / or the second conductor.

[0011] As a preferred solution, a connection hole connecting the first conductor and the second conductor is provided on the insulator, and the conductive medium is disposed in the connection hole.

[0012] As a preferred solution, the connection hole is filled with the conductive medium, or the conductive medium adheres to the hole wall of the connection hole to form a conductive hole.

[0013] As a preferred solution, two or more of the first conductors are provided, and each of the first conductors is independent of each other. Two or more of the second conductors are provided, and each of the second conductors is independent of each other.

[0014] As a preferred solution, the number of the second conductors is equal to the number of the first conductors, and each of the first conductors is respectively connected to each of the second conductors in one-to-one correspondence through the conductive medium in different connection holes.

[0015] As a preferred solution, the number of the first conductors is more than the number of the second conductors. At least two of the first conductors are respectively connected to the same second conductor through the conductive medium in different connection holes, and the remaining first conductors are respectively connected to the remaining second conductors in one-to-one correspondence through the conductive medium in different connection holes.

[0016] As a preferred solution, the number of the first conductors is less than the number of the second conductors. At least two of the second conductors are respectively connected to the same first conductor through the conductive medium in different connection holes, and the remaining second conductors are respectively connected to the remaining first conductors in one-to-one correspondence through the conductive medium in different connection holes.

[0017] As a preferred solution, at least two of the first conductors are respectively connected to the same second conductor through the conductive medium in different connection holes, and at least two of the second conductors are respectively connected to the same first conductor through the conductive medium in different connection holes.

[0018] As a preferred solution, at least two of the first conductors are respectively connected to the same second conductor through the conductive media in different connection holes, at least two of the second conductors are respectively connected to the same first conductor through the conductive media in different connection holes, and the remaining first conductors are respectively connected to the remaining second conductors in one-to-one correspondence through the conductive media in different connection holes.

[0019] As a preferred solution, the insulator is one or a combination of polyimide, thermoplastic polyimide, modified epoxy resin, modified acrylic resin, polyethylene terephthalate, polybutylene terephthalate, polyethylene, polyethylene naphthalate, polystyrene, polyvinyl chloride, polysulfone, polyphenylene sulfide, polyether ether ketone, polyphenylene ether, polytetrafluoroethylene, liquid crystal polymer, polyoxalyl urea.

[0020] As a preferred solution, the solder layer is tin or a tin alloy.

[0021] As a preferred solution, the insulator is provided with a first receiving hole or a first receiving groove.

[0022] Another object of the present invention is to provide an integrated device, which includes a first circuit board, a second circuit board, and the above-mentioned electrical connector. The electrical connector is disposed between the first circuit board and the second circuit board. A first pad is provided on the surface of the first circuit board facing the electrical connector, and the first pad is connected to the first conductor. A second pad is provided on the surface of the second circuit board facing the electrical connector, and the second pad is connected to the second conductor;

[0023] Wherein, the first pad and the first conductor are welded through the solder layer; and / or

[0024] The second pad and the second conductor are welded through the solder layer.

[0025] As a preferred solution, the number of the first pads is equal to that of the first conductors and they are connected in one-to-one correspondence; and / or

[0026] The number of the second pads is equal to that of the second conductors and they are connected in one-to-one correspondence.

[0027] Yet another object of the present invention is to provide another integrated device, which includes a first circuit board, a second circuit board, and an adapter board disposed between the two, and the above-mentioned electrical connectors are provided between the first circuit board and the adapter board, and between the second circuit board and the adapter board;

[0028] The two electrical connectors are respectively denoted as a first electrical connector and a second electrical connector. A first pad is provided on the surface of the first circuit board facing the first electrical connector, and the first pad is connected to a first conductor of the first electrical connector. A second pad is provided on the surface of the second circuit board facing the second electrical connector, and the second pad is connected to a first conductor of the second electrical connector;

[0029] A third pad is provided on the surface of the adapter board facing the first electrical connector, and the third pad is connected to a second conductor of the first electrical connector. A fourth pad connected to the third pad is provided on the surface of the adapter board facing the second electrical connector, and the fourth pad is connected to a second conductor of the second electrical connector;

[0030] Wherein, the first pad and the first conductor of the first electrical connector are welded through the solder layer; and / or

[0031] The second pad and the first conductor of the second electrical connector are welded through the solder layer; and / or

[0032] The third pad and the second conductor of the first electrical connector are welded through the solder layer; and / or

[0033] The fourth pad and the second conductor of the second electrical connector are welded through the solder layer.

[0034] As a preferred solution, the number of the first pads is equal to that of the first conductors of the first electrical connector and they are connected in a one-to-one correspondence; and / or

[0035] The number of the second pads is equal to that of the first conductors of the second electrical connector and they are connected in a one-to-one correspondence; and / or

[0036] The number of the third pads is equal to that of the second conductors of the first electrical connector and they are connected in a one-to-one correspondence; and / or

[0037] The number of the fourth pads is equal to that of the second conductors of the second electrical connector and they are connected in a one-to-one correspondence.

[0038] As a preferred solution, the adapter board is provided with a second receiving hole or a second receiving groove.

[0039] An embodiment of the present invention provides an electrical connector. Compared with the prior art, its beneficial effects are as follows:

[0040] The electrical connector provided by the embodiment of the present invention is clamped between a chip module and a circuit board, and the first conductor is welded to the signal input / output pins of the chip module, and the second conductor is welded to the pads of the circuit board, so as to realize the electrical conduction and fixed connection between the chip module and the circuit board. Since solder layers are provided on the first conductor and the second conductor, there is no need to apply solder paste on the signal input / output pins of the chip module, which not only reduces the packaging process of integrated devices, but also greatly reduces the packaging difficulty of integrated devices; and because the first conductor, the second conductor and the insulator are packaged as a whole, when packaging, only need to place the electrical connector between the chip module and the circuit board, and the first conductor and the pins, the second conductor and the pads can be accurately aligned, thereby reducing the requirements for equipment and personnel, and improving the packaging accuracy of integrated devices at the same time.

[0041] In addition, the present invention also provides two kinds of integrated devices. Since both of them adopt the above-mentioned electrical connector, they have the advantages of high precision, low cost, easy fabrication, etc. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Figure 1 is a cross-sectional structural schematic diagram of the electrical connector (the surfaces of the first conductor and the second conductor are flat surfaces) in the first embodiment of the present invention;

[0043] Figure 2 is a cross-sectional structural schematic diagram of the electrical connector (the surfaces of the first conductor and the second conductor are uneven surfaces) in the first embodiment of the present invention;

[0044] Figure 3 is a cross-sectional structural schematic diagram when the connection holes in the first embodiment of the present invention are filled with a conductive medium;

[0045] Figure 4 is a cross-sectional structural schematic diagram of the electrical connector when the first conductor and the second conductor in the first embodiment of the present invention adopt the second electrical connection form;

[0046] Figure 5 is a cross-sectional structural schematic diagram of the electrical connector when the first conductor and the second conductor in the first embodiment of the present invention adopt the third electrical connection form;

[0047] Figure 6 is a cross-sectional structural schematic diagram of the electrical connector when the first conductor and the second conductor in the first embodiment of the present invention adopt the fourth electrical connection form;

[0048] Figure 7 is a cross-sectional structural schematic diagram of the electrical connector when the first conductor and the second conductor in the first embodiment of the present invention adopt the fifth electrical connection form;

[0049] Figure 8 It is a schematic diagram of the split structure of the integrated device according to the second embodiment of the present invention;

[0050] Figure 9 It is a schematic cross-sectional structure diagram of the integrated device according to the second embodiment of the present invention;

[0051] Figure 10 It is a schematic diagram of the split structure of the integrated device according to the third embodiment of the present invention;

[0052] Figure 11 It is a schematic cross-sectional structure diagram of the integrated device according to the third embodiment of the present invention.

[0053] In the figure: 1. Electrical connector; 1a. First electrical connector; 1b. Second electrical connector; 11. Insulator; 12. First conductor; 13. Second conductor; 14. Conductive medium; 15. Solder layer; 16. Protrusion; 17. Conductive hole; 18. First receiving hole; 2. First circuit board; 21. First pad; 3. Second circuit board; 31. Second pad; 4. Adapter board; 41. Third pad; 42. Fourth pad; 43. Second receiving hole. Detailed implementation manners

[0054] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present invention.

[0055] It should be understood that the terms "first", "second", etc. are used in the present invention to describe various information, but these information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present invention, the "first" information may also be referred to as the "second" information, and similarly, the "second" information may also be referred to as the "first" information.

[0056] Embodiment 1

[0057] As Figure 1As shown in the figure, an embodiment of the present invention provides an electrical connector 1, which includes an insulator 11. A plurality of first conductors 12 are provided on one side surface of the insulator 11, and a plurality of second conductors 13 are provided on the other side surface of the insulator 11. A conductive medium 14 connecting the first conductor 12 and the second conductor 13 is also provided on the insulator 11. Solder layers 15 are provided on the surfaces of the first conductor 12 and the second conductor 13. Based on the above structure, the electrical connector 1 is clamped between a chip module and a circuit board, and the first conductor 12 is welded to the signal input / output pins of the chip module, and the second conductor 13 is welded to the pads of the circuit board, so as to achieve electrical conduction and fixed connection between the chip module and the circuit board.

[0058] Compared with the prior art, since the solder layers 15 are provided on the first conductor 12 and the second conductor 13, thus, there is no need to brush solder paste on the signal input / output pins of the chip module, which not only reduces the packaging process of the integrated device, but also greatly reduces the packaging difficulty of the integrated device; and since the first conductor 12, the second conductor 13 and the insulator 11 are packaged as a whole, therefore, when packaging, only the electrical connector 1 needs to be placed between the chip module and the circuit board, and the first conductor 12 and the pins, and the second conductor 13 and the pads can achieve precise alignment, thereby reducing the requirements for equipment and personnel, and at the same time improving the packaging accuracy of the integrated device.

[0059] Optionally, as Figure 1 and Figure 2 shown, as a specific implementation manner of an electrical connector 1 provided by the present invention, the surfaces of the first conductor 12 and the second conductor 13 can be flat surfaces, or can be uneven surfaces provided with protrusions 16. And the surfaces of the first conductor 12 and the second conductor 13 can be different. For example, the surface of the first conductor 12 is a flat surface, and the surface of the second conductor 13 is an uneven surface.

[0060] Specifically, as Figure 2 shown, the protrusion 16 provided on the surface of the first conductor 12 protrudes from the first conductor 12 towards the side away from the insulator 11. Similarly, the protrusion 16 provided on the surface of the second conductor 13 protrudes from the second conductor 13 towards the side away from the insulator 11. The protrusion 16 is in a regular or irregular three-dimensional geometric shape, such as columnar, block-shaped, sharp-cornered, inverted cone-shaped, dendritic, spherical, arc-shaped, etc. Based on this, as Figure 2As shown, two or more protrusions 16 are provided on the surfaces of the first conductor 12 and the second conductor 13. The shapes of each protrusion 16 can be the same or different, and the sizes of each protrusion 16 can also be the same or different. Moreover, the two or more protrusions 16 are distributed continuously or discontinuously on the surfaces of the first conductor 12 and the second conductor 13. For example, when the shapes of the two or more protrusions 16 are sharp-angled and continuously distributed, a regular and periodic tooth-like three-dimensional pattern or an irregular and disordered tooth-like three-dimensional pattern can be formed. Of course, only one case is listed here, and other combinations of the above shapes are also within the protection scope of this application, which will not be listed one by one here. It should be noted that according to different actual application situations, protrusions 16 can also be provided only on the surface of the first conductor 12 or the second conductor 13. Since the technical effects generated at this time can be reasonably inferred, they will not be elaborated here.

[0061] Further, as Figure 1 shown, a connection hole for connecting the first conductor 12 and the second conductor 13 is provided on the insulator 11, and the conductive medium 14 adheres to the hole wall of the connection hole to form a conductive hole 17. The conductive hole 17 can be a through hole, or a buried hole or a blind hole. Of course, as Figure 3 shown, during the formation process of the conductive medium 14, the operator can also choose to fill the entire connection hole with the conductive medium 14, that is, not to form the conductive hole 17. The purpose of doing this is to prevent the etching solution from entering the conductive hole 17 and protect the conductive medium 14 from being etched.

[0062] In the embodiment of the present invention, two or more first conductors 12 are provided, and each first conductor 12 is independent of each other. Similarly, two or more second conductors 13 are provided, and each second conductor 13 is independent of each other. Moreover, there are the following multiple connection forms between the first conductor 12 and the second conductor 13:

[0063] The first type - as Figure 1 shown, the number of the second conductors 13 is equal to the number of the first conductors 12, and each first conductor 12 is respectively connected to each second conductor 13 in one-to-one correspondence through the conductive medium 14 in different connection holes;

[0064] The second type - as Figure 4 shown, the number of the first conductors 12 is more than the number of the second conductors 13. At least two first conductors 12 are respectively connected to the same second conductor 13 through the conductive medium 14 in different connection holes, and the remaining first conductors 12 are respectively connected to the remaining second conductors 13 in one-to-one correspondence through the conductive medium 14 in different connection holes;

[0065] The third type - as Figure 5As shown in the figure, the number of the first conductors 12 is less than that of the second conductors 13. At least two second conductors 13 are respectively connected to the same first conductor 12 through the conductive media 14 in different connection holes, and the remaining second conductors 13 are respectively connected to the remaining first conductors 12 in one-to-one correspondence through the conductive media 14 in different connection holes;

[0066] The fourth type - as Figure 6 shown in the figure, at least two first conductors 12 are respectively connected to the same second conductor 13 through the conductive media 14 in different connection holes, and at least two second conductors 13 are respectively connected to the same first conductor 12 through the conductive media 14 in different connection holes;

[0067] The fifth type - as Figure 7 shown in the figure, at least two first conductors 12 are respectively connected to the same second conductor 13 through the conductive media 14 in different connection holes, and at least two second conductors 13 are respectively connected to the same first conductor 12 through the conductive media 14 in different connection holes. The remaining first conductors 12 are respectively connected to the remaining second conductors 13 in one-to-one correspondence through the conductive media 14 in different connection holes.

[0068] Optionally, no matter which of the above electrical connection forms is adopted between the first conductor 12 and the second conductor 13, two or more connection holes can be provided between the first conductor 12 and the second conductor 13 connected thereto, and a conductive medium 14 is provided in each connection hole to further improve the conductive performance of the electrical connector 1.

[0069] Optionally, as Figure 8 and Figure 10 shown in the figure, as a specific embodiment of an electrical connector 1 provided by the present invention, in order to avoid damaging the components on the circuit board, the insulator 11 is provided with a first accommodation hole 18 or a first accommodation groove for accommodating the components.

[0070] Optionally, as a specific embodiment of an electrical connector 1 provided by the present invention, the material of the insulator 11 is one or a combination of more than one of polyimide, thermoplastic polyimide, modified epoxy resin, modified acrylic resin, polyethylene terephthalate, polybutylene terephthalate, polyethylene, polyethylene naphthalate, polystyrene, polyvinyl chloride, polysulfone, polyphenylene sulfide, polyether ether ketone, polyphenylene ether, polytetrafluoroethylene, liquid crystal polymer, polyoxalyl urea. Specifically, the insulator 11 can be a single component, that is, one of the above various insulating materials, or can be composed of any combination of the above insulating materials. Based on this, the insulator 11 has a certain amount of deformation, which can ensure a reliable electrical connection between the conductor and the pin and the pad.

[0071] Optionally, as a specific embodiment of the electrical connector 1 provided by the present invention, the first conductor 12 and the second conductor 13 are preferably made of copper. Of course, other materials with good electrical conductivity can also be selected, such as nickel, lead, chromium, molybdenum, zinc, tin, gold, silver, etc. Moreover, the first conductor 12 and the second conductor 13 can be made of different materials respectively.

[0072] Optionally, as a specific embodiment of the electrical connector 1 provided by the present invention, the conductive medium 14 is preferably made of copper. Of course, other materials with good electrical conductivity can also be selected, such as tin, silver, gold, graphite, copper paste, silver paste, solder paste, carbon nanotubes, etc.

[0073] Optionally, as a specific embodiment of the electrical connector 1 provided by the present invention, the solder layer 15 is preferably made of tin or a tin alloy, which has the advantages of low melting point and firm connection.

[0074] It should be noted that in the embodiments of the present invention, according to different actual application situations, the solder layer 15 may be provided only on the surface of the first conductor 12 or the second conductor 13. Since the technical effects generated at this time can be reasonably inferred, they will not be elaborated here.

[0075] Embodiment 2

[0076] As Figures 8 to 9 shown, the embodiment of the present invention provides an integrated device, which includes a first circuit board 2, a second circuit board 3, and the electrical connector 1 provided in Embodiment 1. The electrical connector 1 is disposed between the first circuit board 2 and the second circuit board 3; a first pad 21 is provided on the surface of the first circuit board 2 facing the electrical connector 1, and the first pad 21 is welded to the first conductor 12 through the solder layer 15; a second pad 31 is provided on the surface of the second circuit board 3 facing the electrical connector 1, and the second pad 31 is welded to the second conductor 13 through the solder layer 15. It should be noted that if the solder layer 15 is provided only on the surface of the first conductor 12 or the second conductor 13, then the first conductor 12 is welded to the first pad 21 through the solder layer 15, and the second conductor 13 is in contact connection with the second pad 31, or the first conductor 12 is in contact connection with the first pad 21, and the second conductor 13 is welded to the second pad 31 through the solder layer 15.

[0077] Furthermore, as Figures 8 to 9 shown, the number of the first pads 21 is equal to that of the first conductors 12 and they are connected in one-to-one correspondence. Similarly, the number of the second pads 31 is equal to that of the second conductors 13 and they are connected in one-to-one correspondence. Of course, in other embodiments, the number of the first pads 21 and the first conductors 12, as well as the number of the second pads 31 and the second conductors 13, may not be equal and not connected in one-to-one correspondence. For example, two first pads 21 are connected to the same first conductor 12, and one second pad 31 is connected to three second conductors 13 at the same time, and so on.

[0078] Further, components (not shown in the figure) are provided on the surface of the first circuit board 2 facing the electrical connector 1 and / or the surface of the second circuit board 3 facing the electrical connector 1, and the components extend into the first receiving hole 18 or the first receiving groove of the electrical connector 1.

[0079] Furthermore, the first circuit board 2 and the second circuit board 3 are also detachably connected by fasteners, such as bolt connection, snap connection, etc., to improve the firmness of the integrated device.

[0080] Embodiment III

[0081] As Figures 10 to 11 shown, an integrated device provided by an embodiment of the present invention includes a first circuit board 2, a second circuit board 3, and an adapter board 4 disposed therebetween. Moreover, electrical connectors 1 provided in Embodiment I are disposed between the first circuit board 2 and the adapter board 4, and between the second circuit board 3 and the adapter board 4; the two electrical connectors 1 are respectively denoted as a first electrical connector 1a and a second electrical connector 1b. A first pad 21 is provided on the surface of the first circuit board 2 facing the first electrical connector 1a, and the first pad 21 is soldered to the first conductor 12 of the first electrical connector 1a through a solder layer 15. A second pad 31 is provided on the surface of the second circuit board 3 facing the second electrical connector 1b, and the second pad 31 is soldered to the first conductor 12 of the second electrical connector 1b through a solder layer 15; a third pad 41 is provided on the surface of the adapter board 4 facing the first electrical connector 1a, and the third pad 41 is soldered to the second conductor 13 of the first electrical connector 1a through a solder layer 15. A fourth pad 42 connected to the third pad 41 is provided on the surface of the adapter board 4 facing the second electrical connector 1b, and the fourth pad 42 is soldered to the second conductor 13 of the second electrical connector 1b through a solder layer 15.

[0082] It should be noted that the first electrical connector 1a and the second electrical connector 1b have no relation to the consistency of the structure. That is to say, their structures can be exactly the same or not completely the same. For example: only the surface of the first conductor 12 of the first electrical connector 1a is provided with a solder layer 15, and only the surface of the second conductor 13 of the second electrical connector 1b is provided with a solder layer 15. At this time, the first conductor 12 of the first electrical connector 1a is welded to the first pad 21 through the solder layer 15, the second conductor 13 of the first electrical connector 1a is attached to the third pad 41, the first conductor 12 of the second electrical connector 1b is attached to the second pad 31, and the second conductor 13 of the second electrical connector 1b is welded to the fourth pad 42 through the solder layer 15; the surface of the first conductor 12 of the first electrical connector 1a is a flat surface, the surface of the second conductor 13 is an uneven surface, and the surfaces of both the first conductor 12 and the second conductor 13 of the second electrical connector 1b are uneven surfaces; the material of the insulator 11 of the first electrical connector 1a is polyimide, and the material of the insulator 11 of the second electrical connector 1b is thermoplastic polyimide and so on.

[0083] Further, as Figures 10 to 11 shown, the number of the first pads 21 is equal to and is connected to the first conductors 12 of the first electrical connector 1a one by one, and the number of the second pads 31 is equal to and is connected to the first conductors 12 of the second electrical connector 1b one by one; similarly, the number of the third pads 41 is equal to and is connected to the second conductors 13 of the first electrical connector 1a one by one, and the number of the fourth pads 42 is equal to and is connected to the second conductors 13 of the second electrical connector 1b one by one. Of course, in other embodiments, the number of the first pads 21 and the first conductors 12 of the first electrical connector 1a, the number of the second pads 31 and the first conductors 12 of the second electrical connector 1b, the number of the third pads 41 and the second conductors 13 of the first electrical connector 1a, and the number of the fourth pads 42 and the second conductors 13 of the second electrical connector 1b can all be unequal and not connected one by one. For example, two first pads 21 are connected to the same first conductor 12 of the first electrical connector 1a, and one fourth pad 42 is simultaneously connected to three second conductors 13 of the second electrical connector 1b and so on.

[0084] Still further, components (not shown in the figure) are provided on the surface of the first circuit board 2 facing the first electrical connector 1a and / or on the surface of the second circuit board 3 facing the second electrical connector 1b, and the components extend into the first receiving holes 18 or the first receiving grooves of the first electrical connector 1a and / or into the first receiving holes 18 or the first receiving grooves of the second electrical connector 1b. If the volume of the components is too large, the insulator 11 of the first electrical connector 1a and / or the second electrical connector 1b is provided with first receiving holes 18. Correspondingly, the adapter board 4 is provided with second receiving holes 43 or second receiving grooves to ensure that larger components can be accommodated.

[0085] Furthermore, the first circuit board 2 and the second circuit board 3 are also detachably connected by fasteners, such as bolt connection, snap connection, etc., to improve the firmness of the integrated device.

[0086] In summary, the present invention provides an electrical connector 1, including an insulator 11. A plurality of first conductors 12 are provided on one side surface of the insulator 11, a plurality of second conductors 13 are provided on the other side surface of the insulator 11, a conductive medium 14 connecting the first conductors 12 and the second conductors 13 is further provided on the insulator 11, and a solder layer 15 is provided on the surface of the first conductor 12 and / or the second conductor 13. Compared with the prior art, the manufacturing process of the electrical connector 1 is simple, the cost is low, and it is convenient to use and the operation difficulty is low.

[0087] In addition, the present invention also provides two kinds of integrated devices. Since both of them adopt the above-mentioned electrical connector 1, they have the advantages of high precision, low cost, easy to manufacture, etc.

[0088] The above are only the preferred embodiments of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the technical principle of the present invention, several improvements and replacements can be made, and these improvements and replacements should also be regarded as the protection scope of the present invention.

Claims

1. An electrical connector, characterized in that, Comprising an insulator, on one side surface of the insulator there are provided a plurality of first conductors, on the other side surface of the insulator there are provided a plurality of second conductors, on the insulator there is also provided a conductive medium connecting the first conductors and the second conductors, and on the insulator there is provided a connection hole connecting the first conductors and the second conductors, the conductive medium is disposed in the connection hole, and the insulator is provided with a first accommodation hole or a first accommodation groove; And, In the case where the electrical connector is clamped between a chip module and a circuit board, solder layers are provided on the surfaces of the first conductors and the second conductors, and the solder layers are disposed on the sides of the first conductors away from the insulator, and the solder layers are disposed on the sides of the second conductors away from the insulator; the first conductors are welded to the signal input / output pins of the chip module, and the second conductors are welded to the pads of the circuit board; In the case where the electrical connector is disposed between two circuit boards, solder layers are provided on the surfaces of the first conductors and / or the second conductors, and the solder layers are disposed on the sides of the first conductors away from the insulator, and / or the solder layers are disposed on the sides of the second conductors away from the insulator, and the first conductors and / or the second conductors provided with solder layers are welded to the pads of the corresponding circuit boards.

2. The electrical connector according to claim 1, wherein The surfaces of the first conductors and / or the second conductors are flat surfaces.

3. The electrical connector according to claim 1, characterized in that, The surfaces of the first conductors and / or the second conductors are provided with protruding portions.

4. The electrical connector according to claim 3, wherein, The protruding portions are formed by the first conductors and / or the second conductors protruding towards the sides away from the insulator.

5. The electrical connector according to claim 3, characterized in that, The shapes of the protruding portions are columnar, block-shaped, sharp-cornered, inverted cone-shaped, dendritic, spherical or arc-shaped.

6. The electrical connector according to claim 3, wherein There are provided two or more of the protruding portions on the surfaces of the first conductors and / or the second conductors, the shapes of the respective protruding portions are the same or different, the sizes of the respective protruding portions are the same or different, and the two or more protruding portions are continuously or discontinuously distributed on the surfaces of the first conductors and / or the second conductors.

7. The electrical connector according to claim 1, wherein The conductive medium fills the connection hole, or the conductive medium adheres to the hole wall of the connection hole and forms a conductive hole.

8. The electrical connector according to claim 1, wherein The first conductors are provided as two or more, and each of the first conductors is independent of each other, the second conductors are provided as two or more, and each of the second conductors is independent of each other.

9. The electrical connector according to claim 8, characterized in that, The number of the second conductors is equal to the number of the first conductors, and each of the first conductors is respectively connected to each of the second conductors in one-to-one correspondence through the conductive medium in different connection holes.

10. The electrical connector according to claim 8, wherein, The number of the first conductors is more than the number of the second conductors, at least two of the first conductors are respectively connected to the same second conductor through the conductive medium in different connection holes, and the remaining first conductors are respectively connected to the remaining second conductors in one-to-one correspondence through the conductive medium in different connection holes.

11. The electrical connector according to claim 8, wherein, The number of the first conductors is less than that of the second conductors. At least two of the second conductors are respectively connected to the same first conductor through the conductive media in different connection holes, and the remaining second conductors are respectively connected to the remaining first conductors in one-to-one correspondence through the conductive media in different connection holes.

12. The electrical connector according to claim 8, wherein At least two of the first conductors are respectively connected to the same second conductor through the conductive media in different connection holes, and at least two of the second conductors are respectively connected to the same first conductor through the conductive media in different connection holes.

13. The electrical connector according to claim 8, characterized in that, At least two of the first conductors are respectively connected to the same second conductor through the conductive media in different connection holes, and at least two of the second conductors are respectively connected to the same first conductor through the conductive media in different connection holes. The remaining first conductors are respectively connected to the remaining second conductors in one-to-one correspondence through the conductive media in different connection holes.

14. The electrical connector according to claim 1, wherein The insulator is one or a combination of more than one of polyimide, thermoplastic polyimide, modified epoxy resin, modified acrylic resin, polyethylene terephthalate, polybutylene terephthalate, polyethylene, polyethylene naphthalate, polystyrene, polyvinyl chloride, polysulfone, polyphenylene sulfide, polyether ether ketone, polyphenylene ether, polytetrafluoroethylene, liquid crystal polymer, polyoxalyl urea.

15. The electrical connector according to claim 1, wherein The solder layer is tin or a tin alloy.

16. An integrated device, characterized in that, It includes a first circuit board, a second circuit board, and an electrical connector as described in any one of claims 1-15. The electrical connector is disposed between the first circuit board and the second circuit board. A first pad is provided on the surface of the first circuit board facing the electrical connector, and the first pad is connected to the first conductor. A second pad is provided on the surface of the second circuit board facing the electrical connector, and the second pad is connected to the second conductor. Wherein, the first pad and the first conductor are welded through the solder layer; and / or The second pad and the second conductor are welded through the solder layer.

17. The integrated device according to claim 16, wherein, The number of the first pads is equal to that of the first conductors and they are connected in one-to-one correspondence; and / or The number of the second pads is equal to that of the second conductors and they are connected in one-to-one correspondence.

18. An integrated device, characterized in that, It includes a first circuit board, a second circuit board, and an adapter board disposed between the two. And electrical connectors as described in any one of claims 1-15 are provided between the first circuit board and the adapter board, and between the second circuit board and the adapter board. The two electrical connectors are respectively denoted as a first electrical connector and a second electrical connector. A first pad is provided on the surface of the first circuit board facing the first electrical connector, and the first pad is connected to the first conductor of the first electrical connector. A second pad is provided on the surface of the second circuit board facing the second electrical connector, and the second pad is connected to the first conductor of the second electrical connector. The surface of the adapter board facing the first electrical connector is provided with a third pad, the third pad is connected to the second conductor of the first electrical connector, the surface of the adapter board facing the second electrical connector is provided with a fourth pad connected to the third pad, and the fourth pad is connected to the second conductor of the second electrical connector; Wherein, the first pad and the first conductor of the first electrical connector are soldered through the solder layer; and / or The second pad and the first conductor of the second electrical connector are soldered through the solder layer; and / or The third pad and the second conductor of the first electrical connector are soldered through the solder layer; and / or The fourth pad and the second conductor of the second electrical connector are soldered through the solder layer.

19. The integrated device according to claim 18, wherein, The number of the first pads is equal to that of the first conductors of the first electrical connector and they are connected in a one-to-one correspondence; and / or The number of the second pads is equal to that of the first conductors of the second electrical connector and they are connected in a one-to-one correspondence; and / or The number of the third pads is equal to that of the second conductors of the first electrical connector and they are connected in a one-to-one correspondence; and / or The number of the fourth pads is equal to that of the second conductors of the second electrical connector and they are connected in a one-to-one correspondence.

20. The integrated device according to claim 19, characterized in that, The adapter board is provided with a second receiving hole or a second receiving groove.

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