Display device and manufacturing method, electronic equipment

Abstract

A display device (1), an electronic device (100) and a method for preparing the display device (1). The display device (1) comprises a silicon-based organic light-emitting display panel (10), a heat dissipation film layer (20) and a flexible circuit board (30). The silicon-based organic light-emitting display panel (10) comprises a silicon substrate (11), a first pole (13) of a display device, an organic light-emitting layer (14) and a second pole (15) of the display device which are stacked in sequence; the heat dissipation film layer (20) is arranged on a non-display side of the silicon-based organic light-emitting display panel (10); the flexible circuit board (30) is at least partially arranged on a side of the heat dissipation film layer (20) away from the silicon-based organic light-emitting display panel (10), and is electrically connected to the silicon-based organic light-emitting display panel (10). A gate drive circuit (14), a data drive circuit (142) and a pixel circuit (110) are integrated on the silicon substrate (11); and the flexible circuit board (30) is configured to transmit electrical signals to the gate drive circuit (141), the data drive circuit (142) and the second pole (15) of the display device. The display device (1) can achieve heat dissipation of the silicon-based organic light-emitting display panel (10) by adopting the heat dissipation film layer (20), thereby improving the display quality of the display device (1).

Description

Technical Field

[0001] Embodiments of the present disclosure relate to a display device, an electronic device, and a method for manufacturing the display device. Background Art

[0002] Micro-OLED (Micro Organic Light-Emitting Diode) display is a new type of OLED display with silicon substrate as substrate, also known as silicon-based organic light-emitting diode (silicon-based OLED) display. Silicon-based OLED display has the advantages of small size and high resolution. It is made of mature integrated circuit CMOS process, realizes active addressing of pixels, has TCON (control board or logic board), OCP (operation control panel) and other circuits, and can achieve lightweight. Summary of the invention

[0003] At least one embodiment of the present disclosure provides a display device, including: a silicon-based organic light-emitting display panel, a heat dissipation film layer, and a flexible circuit board. The silicon-based organic light-emitting display panel includes a silicon substrate, a first pole of a display device, an organic light-emitting layer, and a second pole of the display device stacked in sequence; the heat dissipation film layer is arranged on the non-display side of the silicon-based organic light-emitting display panel; the flexible circuit board is at least partially arranged on a side of the heat dissipation film layer away from the silicon-based organic light-emitting display panel, and is electrically connected to the silicon-based organic light-emitting display panel; the gate drive circuit, the data drive circuit, and the pixel circuit are integrated on the silicon substrate, and the flexible circuit board is configured to transmit electrical signals to the gate drive circuit, the data drive circuit, and the second pole of the display device.

[0004] For example, in the display device provided in at least one embodiment of the present disclosure, at least one through hole is provided on the flexible circuit board, and the orthographic projection of the at least one through hole on a plane parallel to the silicon-based organic light-emitting display panel at least partially overlaps with the orthographic projection of the heat dissipation film layer on the plane.

[0005] For example, in the display device provided by at least one embodiment of the present disclosure, the orthographic projection of the at least one through hole on the plane falls within the orthographic projection of the heat dissipation film layer on the plane.

[0006] For example, in the display device provided in at least one embodiment of the present disclosure, the silicon substrate includes a display area and a peripheral area surrounding the display area, and the display device is located in the display area; the flexible circuit board is connected to the peripheral area of ​​the silicon substrate and is bent along the edge of the silicon substrate so that at least a portion of the flexible circuit board is arranged on a side of the heat dissipation film layer away from the silicon-based organic light-emitting display panel.

[0007] For example, in the display device provided in at least one embodiment of the present disclosure, the orthographic projection of the heat dissipation film layer on the plane at least partially overlaps with the orthographic projection of the display area on the plane; the orthographic projection of the heat dissipation film layer on the plane falls within the orthographic projection of the silicon substrate on the plane.

[0008] For example, in the display device provided by at least one embodiment of the present disclosure, the orthographic projection of the heat dissipation film layer on a plane parallel to the silicon-based organic light-emitting display panel falls within the projection of the silicon-based organic light-emitting display panel on the plane.

[0009] For example, in the display device provided in at least one embodiment of the present disclosure, the heat dissipation film layer includes: a first adhesive film layer and a first heat dissipation film layer. The first adhesive film layer is bonded to the flexible circuit board; and the first heat dissipation film layer is disposed between the first adhesive film layer and the silicon substrate.

[0010] For example, in the display device provided by at least one embodiment of the present disclosure, the heat dissipation film layer further includes: a second heat dissipation film layer, which is arranged between the first heat dissipation film layer and the silicon substrate.

[0011] For example, in the display device provided by at least one embodiment of the present disclosure, the material of the second heat dissipation film layer includes graphite or graphene.

[0012] For example, in the display device provided in at least one embodiment of the present disclosure, the heat dissipation film layer further includes: a second adhesive film layer, which is arranged on a side of the first heat dissipation film layer close to the silicon substrate and is bonded to the silicon substrate.

[0013] For example, in the display device provided by at least one embodiment of the present disclosure, the material of the first adhesive film layer and the second adhesive film layer includes an acrylic pressure-sensitive film layer.

[0014] For example, in the display device provided by at least one embodiment of the present disclosure, the material of the first heat dissipation film layer is metal.

[0015] For example, in the display device provided by at least one embodiment of the present disclosure, the metal includes copper, copper alloy, silver, silver alloy, aluminum or aluminum alloy.

[0016] For example, in the display device provided by at least one embodiment of the present disclosure, the silicon-based organic light-emitting display panel further includes: a first thin-film encapsulation layer and a second thin-film encapsulation layer, a color filter layer and a cover plate. The first thin-film encapsulation layer and the second thin-film encapsulation layer are sequentially arranged on a side of the second pole of the display device away from the organic light-emitting layer; the color filter layer is arranged between the first thin-film encapsulation layer and the second thin-film encapsulation layer; and the cover plate is arranged on a side of the second thin-film encapsulation layer away from the color filter layer.

[0017] For example, the display device provided in at least one embodiment of the present disclosure further includes a driving chip. The driving chip is connected to the flexible circuit board and is configured to provide a driving signal to the silicon-based organic light-emitting display panel.

[0018] At least one embodiment of the present disclosure further provides an electronic device, comprising the display device provided by any embodiment of the present disclosure, wherein the electronic device is a virtual reality device or an augmented reality device.

[0019] At least one embodiment of the present disclosure also provides a method for preparing a display device, comprising: providing a silicon-based organic light-emitting display panel; forming a heat dissipation film layer on a non-display side of the silicon-based organic light-emitting display panel; connecting a flexible circuit board to the silicon-based organic light-emitting display panel, and making at least a portion of the flexible circuit board located on a side of the heat dissipation film layer away from the silicon-based organic light-emitting display panel.

[0020] For example, the method for preparing a display device provided in at least one embodiment of the present disclosure further includes: forming at least one through hole on the flexible circuit board, wherein the orthographic projection of the at least one through hole on a plane parallel to the silicon-based organic light-emitting display panel at least partially overlaps with the orthographic projection of the heat dissipation film layer on the plane.

[0021] For example, in the preparation method of the display device provided in at least one embodiment of the present disclosure, the flexible circuit board is connected to the silicon-based organic light-emitting display panel, and at least a portion of the flexible circuit board is formed on a side of the heat dissipation film layer away from the silicon-based organic light-emitting display panel, including: connecting the flexible circuit board to the display side of the silicon-based organic light-emitting display panel, and bending the flexible circuit board along the edge of the silicon-based organic light-emitting display panel so that at least a portion of the flexible circuit board is arranged on a side of the heat dissipation film layer away from the silicon-based organic light-emitting display panel.

[0022] For example, in the preparation method of the display device provided in at least one embodiment of the present disclosure, a heat dissipation film layer is formed on the non-display side of the silicon-based organic light-emitting display panel, including: forming a first adhesive film layer; forming a first heat dissipation film layer on the first adhesive film layer by an evaporation process; and forming a second heat dissipation film layer on the first heat dissipation film layer by an evaporation process. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings of the embodiments will be briefly introduced below. Obviously, the drawings in the following description only relate to some embodiments of the present disclosure, but are not intended to limit the present disclosure.

[0024] Figure 1 A cross-sectional schematic diagram of a display device provided by at least one embodiment of the present disclosure;

[0025] Figure 2 A heat dissipation schematic diagram of a display device provided by at least one embodiment of the present disclosure;

[0026] Figure 3 A schematic diagram of a through hole of a flexible circuit board provided in at least one embodiment of the present disclosure;

[0027] Figure 4 A schematic diagram of another through hole of a flexible circuit board provided in at least one embodiment of the present disclosure;

[0028] Figure 5 A schematic cross-sectional view of the structure of a heat dissipation film layer provided by at least one embodiment of the present disclosure;

[0029] Fig. 6A A schematic diagram of a silicon-based organic light-emitting display panel provided in at least one embodiment of the present disclosure;

[0030] Figure 6B A partial cross-sectional schematic diagram of a silicon-based organic light-emitting display panel provided by at least one embodiment of the present disclosure;

[0031] Figure 6C A schematic diagram of a circuit principle of a silicon-based organic light-emitting display panel provided in at least one embodiment of the present disclosure;

[0032] Fig.6D A circuit diagram of a specific implementation example of a voltage control circuit and a pixel circuit of a silicon-based organic light-emitting display panel provided by at least one embodiment of the present disclosure;

[0033] Fig. 6E A schematic diagram of a silicon substrate provided for at least one embodiment of the present disclosure;

[0034] Figure 7 A cross-sectional schematic diagram of another display device provided by at least one embodiment of the present disclosure;

[0035] Figure 8 A schematic diagram of an electronic device provided for at least one embodiment of the present disclosure; and

[0036] Fig. 9 A flowchart of a method for preparing a display device provided in at least one embodiment of the present disclosure. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0038] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, similar words such as "one", "one" or "the" do not indicate quantity restrictions, but indicate that there is at least one. Similar words such as "include" or "comprise" mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Similar words such as "connect" or "connected" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0039] At present, silicon-based OLED display devices are widely used in near-eye display fields such as virtual reality (VR) or augmented reality (AR), especially in AR / VR head-mounted display devices. When silicon-based OLED display devices are used in near-eye display devices, the temperature of the display device directly determines the user experience, so the heat dissipation of the display device is very important.

[0040] On the one hand, the current silicon-based OLED display devices do not have a specific heat dissipation design solution, and only achieve heat dissipation by setting a thermal conductive interface and connecting it to the whole machine. However, this heat dissipation solution is only used for the heat dissipation of the head-mounted display machine, and is not suitable for the heat dissipation of a separate display device. On the other hand, silicon-based OLED display devices will generate a lot of heat when running for a long time, that is, the light-emitting layer of the silicon-based OLED display device will generate a lot of heat during the light-emitting process, which will increase the temperature of the silicon-based OLED display device. The change in the temperature of the silicon-based OLED display device will cause its display brightness to change, which will cause the display device to have problems such as uneven display and life attenuation, affecting its display quality.

[0041] In response to the above problems, at least one embodiment of the present disclosure provides a display device, which includes a silicon-based organic light-emitting display panel, a heat dissipation film layer and a flexible circuit board; the silicon-based organic light-emitting display panel includes a silicon substrate, a first electrode of a display device, an organic light-emitting layer and a second electrode of the display device which are stacked in sequence; the heat dissipation film layer is arranged on a non-display side of the silicon-based organic light-emitting display panel; the flexible circuit board is at least partially arranged on a side of the heat dissipation film layer away from the silicon-based organic light-emitting display panel, and is electrically connected to the silicon-based organic light-emitting display panel; a gate drive circuit, a data drive circuit and a pixel circuit are integrated on the silicon substrate, and the flexible circuit board is configured to transmit electrical signals to the gate drive circuit, the data drive circuit and the second electrode of the display device.

[0042] Some embodiments of the present disclosure also provide an electronic device corresponding to the above-mentioned display device and a method for preparing the display device.

[0043] The display device provided by the above-mentioned embodiments of the present disclosure, on the one hand, can achieve heat dissipation of the silicon-based organic light-emitting display panel by adopting a heat dissipation film layer, thereby avoiding the influence of the temperature change of the silicon-based organic light-emitting diodes in the silicon-based organic light-emitting display panel due to the heat dissipation problem on the display brightness and display life of the display device, thereby improving the display quality of the display device and extending the service life of the display device; on the other hand, the display device integrates the heat dissipation film layer with the silicon-based OLED display substrate, has a simple manufacturing process, improves the compactness of the display device, and greatly reduces the manufacturing cost of the display device.

[0044] The embodiments and examples of the present disclosure are described in detail below with reference to the accompanying drawings.

[0045] At least one embodiment of the present disclosure provides a display device. For example, the display device is a silicon-based OLED display device, which can be used in a virtual reality device or an augmented display device. Of course, it can also be other types of display devices, and the embodiments of the present disclosure are not limited to this.

[0046] Figure 1 is a cross-sectional schematic diagram of a display device provided by at least one embodiment of the present disclosure, Figure 2 A heat dissipation schematic diagram of a display device provided by at least one embodiment of the present disclosure. Figure 1 and Figure 2 A display device provided by at least one embodiment of the present disclosure is introduced in detail.

[0047] like Figure 1 As shown, the display device 1 includes: a silicon-based organic light-emitting display panel 10, a heat dissipation film layer 20 and a flexible printed circuit (FPC) 30. For example, the heat dissipation film layer 20 is arranged on the non-display side ( Figure 1 At least a portion of the flexible circuit board 30 is disposed on a side of the heat dissipation film layer 20 away from the silicon-based organic light-emitting display panel 10 ( Figure 1 The heat dissipation film layer 20 shown in FIG. 1 is disposed on the lower side of the heat dissipation film layer 20 and is electrically connected to the silicon-based organic light-emitting display panel 10 to provide a driving signal to the silicon-based organic light-emitting display panel 10 to drive the silicon-based organic light-emitting display panel to emit light. For example, the driving signal here may include at least one of a data signal and a power signal.

[0048] For example, in some examples, the orthographic projection of the heat dissipation film layer 20 on a plane parallel to the silicon-based organic light-emitting display panel 10 falls within the projection of the silicon-based organic light-emitting display panel 10 on the plane. For example, the position of the heat dissipation film layer 20 corresponds to the silicon-based organic light-emitting display panel 10, and is integrated or attached thereunder, thereby achieving effective heat dissipation of the silicon-based OLED display panel 10. For example, the size of the heat dissipation film layer 20 is slightly smaller than the size of the silicon-based OLED display panel 10, thereby avoiding the influence of the larger size of the heat dissipation film layer 20 on the size of the display device 1, thereby limiting its application scenario. In the embodiments of the present disclosure, the heat dissipation film layer 20 is small in size and has good heat dissipation effect, which can extend the service life of the silicon-based OLED display device and achieve the optical characteristics of high-quality display.

[0049] For example, in some examples, the silicon-based OLED display panel 10 includes a silicon substrate (eg, Fig. 6A The silicon substrate 11 shown, as Fig. 6E As shown, the silicon substrate 11 includes a display area 130 and a peripheral area 140 surrounding the display area. The display area 130 includes a plurality of display devices for display. For example, the flexible circuit board 30 is connected to the display side (for example, Figure 1 The upper side of the silicon-based organic light-emitting display panel 10 shown in FIG. Fig. 6A The upper side of the silicon substrate 11 shown, that is, the peripheral area 140 of the silicon substrate, is connected and along the edge of the silicon-based organic light-emitting display panel 10 (for example, Figure 1 The left edge of the silicon-based organic light-emitting display panel 10 shown in FIG. 1 is bent, for example, as required, it can be bent by 180 0 , so that at least a portion of the flexible circuit board 30 is arranged on a side of the heat dissipation film layer 20 away from the silicon-based organic light-emitting display panel 10, thereby reducing the size of the display device to meet the size requirements when applied to, for example, a virtual reality device or an augmented reality device, so that the terminal matching characteristics are better.

[0050] For example, in some examples, the orthographic projection of the heat dissipation film layer 20 on the plane falls within the orthographic projection of the silicon substrate in the silicon-based organic light-emitting display panel 10 on the plane; the orthographic projection of the heat dissipation film layer 20 on the plane at least partially overlaps with the orthographic projection of the display area on the plane. It should be noted that the display device and the silicon substrate can refer to the following Fig. 6A and Figure 6B The detailed introduction of silicon-based organic light-emitting display panels in will not be repeated here.

[0051] For example, the portion of the flexible circuit board disposed on the side of the heat dissipation film layer 20 away from the silicon-based organic light-emitting display panel 10 may be wider than the silicon-based organic light-emitting display panel 10, or narrower than the silicon-based organic light-emitting display panel 10, or the two may have the same width, which may be set according to actual needs, and the embodiments of the present disclosure do not limit this. For example, the width here refers to the dimension in the direction parallel to the plane where the silicon-based organic light-emitting display panel is located.

[0052] For example, in some examples, such as Figure 3 or Figure 4 As shown, at least one through hole 31 may also be provided on the flexible circuit board 30. For example, the orthographic projection of the at least one through hole on a plane parallel to the silicon-based organic light-emitting display panel 10 at least partially overlaps with the orthographic projection of the heat dissipation film layer on the plane, that is, the orthographic projection of the at least one through hole 31 on the plane falls within the orthographic projection of the heat dissipation film layer 20 on the plane, so that the heat dissipation film layer can be exposed through the through hole 31 to avoid the flexible circuit board 30 located under the heat dissipation film layer 20 from blocking the heat dissipation, so that the heat generated by the silicon-based organic light-emitting display panel 10 during the light-emitting process can be dissipated through the heat dissipation film layer 20 and the through hole 31 on the flexible circuit board 30, for example, through Figure 2 The heat is dissipated along the path D shown, thereby achieving effective heat transfer of the silicon-based OLED display device, reducing the temperature of the silicon-based OLED display device, extending the service life of the silicon-based OLED display device, and improving the display quality of the display device.

[0053] For example, in some examples, such as Figure 3 As shown, the through hole 31 may include a relatively large through hole corresponding to the position of the heat dissipation film layer 20 and the silicon-based OLED display panel 10. For example, in the case where the through hole 31 is a relatively large through hole, a portion of the flexible circuit board around the through hole 31 may be connected to the heat dissipation film layer 30. For example, in other examples, such as Figure 4 As shown, the through hole 31 may also include a plurality of through holes, and the embodiment of the present disclosure does not limit the number of through holes. Figure 3 The through hole form is still Figure 4In the form of a through hole, the orthographic projection of the through hole 31 on a plane parallel to the silicon-based organic light-emitting display panel falls within the orthographic projection of the heat dissipation film layer on the plane, thereby further improving the heat dissipation effect.

[0054] For example, in some examples, the display device 1 further includes a sealant 12, which is disposed on the sides of the cover plate 19 and connects the cover plate 19 and the silicon substrate 11. The sides of the cover plate 19 and the silicon substrate 11 are sealed by the sealant 12 to block the intrusion of water and oxygen in the outside air.

[0055] It should be noted that the shape of the through hole 31 can be a regular shape such as a rectangle, an ellipse, a circle, a diamond or other irregular shapes, as long as effective heat transfer can be achieved, and the embodiments of the present disclosure are not limited to this.

[0056] Figure 5 A cross-sectional schematic diagram of a heat dissipation film layer structure provided by at least one embodiment of the present disclosure. Figure 5 As shown, for example, in some examples, the heat dissipation film layer 20 can be directly formed on the silicon-based organic light-emitting display panel 10. For example, in this example, the heat dissipation film layer 20 includes a first adhesive film layer 24 and a first heat dissipation film layer 23. For example, the first adhesive film layer 24 is bonded to the flexible circuit board 30; the first heat dissipation film layer is disposed between the first adhesive film layer 24 and the silicon-based organic light-emitting display panel 10.

[0057] For example, in this example, the first heat dissipation film layer 23 can be directly made on the silicon-based organic light-emitting display panel 10 by using an evaporation process, and then the first adhesive film layer 24 is covered on the first heat dissipation film layer 23, so that the heat dissipation film layer 20 is bonded to the flexible circuit board 30 through the first adhesive film layer 24, thereby ensuring the stability of the display device 1. For example, the material of the first adhesive film layer 24 can be an acrylic pressure-sensitive film layer or an organic material with adhesiveness including resin, etc., which is not specifically limited in the embodiments of the present disclosure.

[0058] In the embodiment of the present disclosure, the first heat dissipation film layer 23 is manufactured by an evaporation process, which can reduce the manufacturing cost of the heat dissipation film layer, and the manufacturing process is simple, thereby reducing the complexity of the manufacturing process of the display device.

[0059] For example, the material of the first heat dissipation film layer 23 can be metal. For example, the metal includes copper, copper alloy, silver, silver alloy, aluminum or aluminum alloy, etc., which is not limited in the embodiments of the present disclosure. For example, in one example, the first heat dissipation film layer 23 can be made of copper foil.

[0060] For example, in other examples, before evaporating the first heat dissipation film layer 23 on the silicon-based organic light-emitting display panel 10, the second heat dissipation film layer 22 can be formed on the silicon-based organic light-emitting display panel 10 by electroforming. For example, the material of the second heat dissipation film layer 22 includes graphite or graphene, etc., which can achieve a heat-averaging effect and help to effectively dissipate heat. For example, in some examples, the second heat dissipation film layer 22 can be made by a polymer graphitization method, and the embodiments of the present disclosure are not limited to this.

[0061] For example, in other examples, the heat dissipation film layer 20 may be manufactured separately, and then the heat dissipation film layer 20 may be bonded to the silicon-based organic light-emitting display panel 10. For example, in this example, the heat dissipation film layer 20 further includes a second adhesive film layer 21, which is disposed on a side of the first heat dissipation film layer 24 close to the silicon-based organic light-emitting display panel 10 and is bonded to the silicon-based organic light-emitting display panel 10. For example, the second adhesive film layer 21 may be made of the same material as or different from the first adhesive film layer 24, for example, it may be an acrylic pressure-sensitive film layer or an organic material having adhesiveness such as a resin, which is not specifically limited in the embodiments of the present disclosure.

[0062] Fig. 6A A schematic diagram of a silicon-based organic light-emitting display panel provided by at least one embodiment of the present disclosure. Fig. 6A As shown, the silicon-based organic light-emitting display panel includes: a silicon substrate 11, a first electrode 13 of a display device, an organic light-emitting layer 14 and a second electrode 15 of the display device.

[0063] For example, Fig. 6E As shown, a gate drive circuit 141, a data drive circuit 142 and a pixel circuit 110 are integrated on the silicon substrate 11, and the flexible circuit board 30 is configured to transmit electrical signals to the gate drive circuit 140, the data drive circuit 142 and the second pole of the display device. For example, the gate drive circuit 141 is used to generate a gate drive signal, and the data drive circuit 142 is used to generate a data signal. The gate drive circuit 141 and the data drive circuit 142 can adopt a conventional circuit structure in the art, and the embodiments of the present disclosure are not limited to this. For example, the gate drive circuit 141 and the data drive circuit 142 are located in the peripheral area 140 of the silicon substrate, and the pixel circuit 110 is located in the display area 130 of the silicon substrate and is connected to the display device on the silicon substrate.

[0064] For example, Fig. 6A As shown, the first electrode 13 of the display device is arranged on a silicon substrate 11 (not shown in the figure) and is connected to a pixel circuit (not shown in the figure) integrated on the silicon substrate 11; the organic light-emitting layer 14 is arranged on a side of the first electrode 13 of the display device away from the silicon substrate 11; the second electrode 15 of the display device is arranged on a side of the organic light-emitting layer 14 away from the first electrode 13 of the display device.

[0065] For example, the pixel circuit (not shown in the figure) is used to provide a driving current to the first electrode 13 of the display device under the control of a driving signal such as a gate scanning signal, a data signal, and a voltage signal, so that the organic light-emitting layer 14 of the display device emits light under the action of the electric field between the first electrode 13 of the display device and the second electrode 15 of the display device. The specific introduction of the pixel circuit can be referred to below Fig.6D The introduction in will not be repeated here. It should be noted that Fig.6D The pixel circuit shown in is only for illustration, and the embodiments of the present disclosure are not limited thereto. For example, the pixel circuit may also adopt a pixel circuit including a circuit structure of 4T1C, 4T2C, 7T1C, 8T2C, etc. in the art, and its driving method may adopt a conventional method in the art, which will not be described in detail here. For example, the pixel circuit may be manufactured on the silicon substrate 11 using a CMOS process, and the embodiments of the present disclosure are not limited thereto.

[0066] For example, the display device is an OLED display device. For example, the first electrode 13 of the display device is an anode, and the second electrode 15 of the display device is a cathode, such as grounded. For example, the first electrode 13 of the display device can be made of a material including a transparent metal oxide such as indium tin oxide (ITO) or indium zinc oxide (IZO), which has a high light transmittance. For example, the material of the second electrode 15 of the display device is a metal, for example, the metal can be made of materials such as magnesium, magnesium alloy, aluminum or aluminum alloy.

[0067] For example, the organic light-emitting layer 14 may be made of an organic material, and emit light by utilizing the light-emitting characteristics of the organic material after being powered on.

[0068] For example, the silicon-based organic light-emitting display panel 10 further includes: a first thin film encapsulation layer 16, a second thin film encapsulation layer 18, a color filter layer 17 and a cover plate 19. For example, the first thin film encapsulation layer 16 and the second thin film encapsulation layer 18 are sequentially arranged on a side of the second electrode 15 of the display device away from the organic light-emitting layer 14; the color filter layer 17 is arranged between the first thin film encapsulation layer 16 and the second thin film encapsulation layer 18; and the cover plate is arranged on a side of the second thin film encapsulation layer 18 away from the color filter layer 17.

[0069] For example, the first thin film encapsulation layer 16 and the second thin film encapsulation layer 18 can realize effective encapsulation of the display device, realize effective blocking of water vapor, oxygen, etc., and achieve the purpose of protecting the display device and extending the service life of the display device. For example, the color filter layer 17 includes RGB color filter layers, and they are matched with the organic light-emitting layer 14 respectively. The color filter layer 17 is arranged on the first thin film encapsulation layer 16 and corresponds to the organic light-emitting layer 14, so that the color display of the emitted light can be realized.

[0070] For example, the second thin film encapsulation layer 18 and the cover plate 19 are sequentially arranged on the color filter layer 17 to realize the function of protecting the color filter layer 17. For example, the second thin film encapsulation layer 18 is made of one or more organic materials or inorganic materials with good sealing properties to achieve a good sealing effect and protect the silicon-based OLED display device. For example, the cover plate 19 can be made of a transparent material, such as an inorganic material such as glass or an organic material such as polyimide. For example, in the embodiment of the present disclosure, plain glass with high transmittance can be used, and the embodiment of the present disclosure is not limited to this.

[0071] Figure 6B A partial cross-sectional schematic diagram of a silicon-based organic light-emitting display panel provided in some embodiments of the present disclosure. In addition to showing the structure of the silicon-based organic light-emitting display panel 10 in more detail and showing multiple sub-pixels, the silicon-based organic light-emitting display panel of this embodiment is similar to Fig. 6A It should be understood that the silicon-based organic light-emitting display panel 10 in this embodiment can be substantially the same as the silicon-based organic light-emitting display panel 10 shown in FIG. Fig. 6A The silicon-based organic light-emitting display panel 10 shown in the figure is identical or substantially identical and is not shown in the figure for the sake of brevity. Fig. 6A The detailed structure of the silicon-based organic light-emitting display panel 10 is shown in FIG. Of course, the silicon-based organic light-emitting display panel 10 in this embodiment can also be Fig. 6A The silicon-based organic light-emitting display panel 10 shown is different, as long as it can achieve the corresponding function. It should be understood that Fig. 6A The silicon-based organic light-emitting display panel shown in the figure also includes a plurality of sub-pixels, which are not shown in the figure for the sake of simplicity. Fig. 6A Sub-pixels are shown in FIG.

[0072] In this embodiment, if Figure 6B As shown, the silicon-based organic light-emitting display panel 10 includes a silicon substrate 11 and a display device 410 (i.e., a light-emitting element). For example, the silicon substrate 11 includes a base substrate 420, a pixel circuit 110, a light-reflecting layer 440, and an insulating layer 450, which are sequentially stacked. The display device 410 includes an anode layer 13 (i.e., a first pole of the display device), an organic light-emitting layer 14, and a cathode layer 15 (i.e., a second pole of the display device) sequentially stacked on the insulating layer 450. The anode layer 13 is a transparent electrode layer. For example, the insulating layer 450 is light-transmissive so that the light emitted by the organic light-emitting layer 14 penetrates therethrough and reaches the light-reflecting layer 440 to be reflected by the light-reflecting layer 440.

[0073] For example, the insulating layer 450 includes a via 452 filled with a metal member 451, and the light reflecting layer 440 is electrically connected to the anode layer 13 through the metal member 451. In this way, by forming a conductive path between the light reflecting layer 440 and the anode layer 13 in the insulating layer 450, it is beneficial to transmit the electrical signal provided by the pixel circuit 110 in the silicon substrate 11 to the anode layer 13 through the light reflecting layer 440. In this way, it is not only beneficial to realize the control of the display device 410 by the pixel circuit 110, but also to make the structure of the silicon-based organic light-emitting display panel more compact, which is beneficial to the miniaturization of the device. Further, for example, the metal member 451 is made of a metal material, such as tungsten metal, and the via filled with tungsten metal is also called a tungsten via (W-via). For example, in the case where the thickness of the insulating layer 450 is large, forming a tungsten via in the insulating layer 450 can ensure the stability of the conductive path, and since the process of making the tungsten via is mature, the surface flatness of the obtained insulating layer 450 is good, which is beneficial to reduce the contact resistance between the insulating layer 450 and the anode layer 13. It can be understood that the tungsten via is not only suitable for realizing the electrical connection between the insulating layer 450 and the anode layer 13, but also suitable for the electrical connection between the light reflection layer 440 and the pixel circuit 110, and the electrical connection between other wiring layers.

[0074] For example, the silicon substrate 11 includes a pixel circuit 110, and the pixel circuit 110 is electrically connected to the light reflecting layer 440, and the pixel circuit 110 is used to drive the display device 410 to emit light. The pixel circuit 110 includes at least a driving transistor M0 and a switching transistor (not shown in the figure), and the driving transistor M0 is electrically connected to the light reflecting layer 440. Thus, the electrical signal driving the display device 410 can be transmitted to the anode layer 13 through the light reflecting layer 440, thereby controlling the display device 410 to emit light. For example, the driving transistor M0 includes a gate electrode G, a source electrode S, and a drain electrode D. The source electrode S of the driving transistor M0 is electrically connected to the light reflecting layer 440. When the driving transistor M0 is in an on state, the electrical signal provided by the power line can be transmitted to the anode layer 13 through the source electrode S of the driving transistor M0 and the light reflecting layer 440. Due to the voltage difference formed between the anode layer 13 and the cathode layer 15, an electric field is formed between the two, and the organic light-emitting layer 14 emits light under the action of the electric field. It can be understood that, in the driving transistor M0 , the positions of the source electrode S and the drain electrode D can be interchanged, and therefore, one of the source electrode S and the drain electrode D and the light reflection layer 440 only needs to be electrically connected to each other.

[0075] For example, the silicon-based organic light-emitting display panel 10 includes a plurality of sub-pixels (or pixel units). Figure 6Bexemplarily shows three sub-pixels, namely, a red sub-pixel SP1, a green sub-pixel SP2 and a blue sub-pixel SP3. Each sub-pixel corresponds to a sub-pixel region of the silicon-based organic light-emitting display panel 10. That is, each sub-pixel is provided with an independent display device 410 and a driving transistor M0.

[0076] For example, the insulating layers 450 in the three sub-pixels are formed as one piece to facilitate manufacturing. Figure 6B As shown, the insulating layer 450 also includes an opening 454 exposing the pad 453. The opening 454 is provided to facilitate electrical connection and signal communication between the pad 453 and an external circuit. For example, the opening 454 of the pad 453 is located in the peripheral area 140. The color of the sub-pixel in the silicon-based organic light-emitting display panel 10 is only illustrative, and may also include other colors such as yellow, white, etc.

[0077] For example, Figure 6B As shown, the silicon-based organic light-emitting display panel 10 further includes a first thin-film encapsulation layer 16, a color filter layer 17, and a second thin-film encapsulation layer 18 sequentially arranged on the cathode layer 15. The silicon-based organic light-emitting display panel 10 further includes a cover plate 19, which is arranged on the second thin-film encapsulation layer 18. For example, the first thin-film encapsulation layer 16 is located on the side of the cathode layer 15 away from the base substrate 420. The color filter layer 17 is located on the side of the first thin-film encapsulation layer 16 away from the base substrate 420, and includes a red filter unit R, a green filter unit G, and a blue filter unit B. The second thin-film encapsulation layer 18 and the cover plate 19 are located on the side of the color filter layer 17 away from the base substrate 420. The specific materials of the first thin-film encapsulation layer 16, the color filter layer 17, the second thin-film encapsulation layer 18, and the cover plate 19 can be conventional materials in the art, which will not be described in detail here.

[0078] For example, in the silicon-based organic light-emitting display panel 10 provided in the embodiment of the present disclosure, the display device 410 including the anode layer 13, the organic light-emitting layer 14 and the cathode layer 15, the first thin film encapsulation layer 16, the color filter layer 17, the second thin film encapsulation layer 18 and the cover plate 19 are all manufactured in the panel factory. In addition, the insulating layer 450 above the pad 453 is also etched in the panel factory to expose the pad 453 and bond it to the flexible printed circuit board (FPC bonding) or wire bonding. Therefore, in the embodiment of the present disclosure, the silicon substrate 11 including the light reflection layer 440 and the insulating layer 450 and suitable for forming the display device 430 can be manufactured by the wafer factory, which not only reduces the manufacturing difficulty of the light reflection layer 440, but also facilitates the subsequent process of the panel factory.

[0079] Figure 6CA schematic diagram of the circuit principle of a silicon-based organic light-emitting display panel provided for some embodiments of the present disclosure. The silicon-based organic light-emitting display panel includes a plurality of display devices L located in a display area 130 (AA area) and a pixel circuit 110 coupled to each display device L in a one-to-one correspondence, and the pixel circuit 110 includes a driving transistor. In addition, the silicon-based organic light-emitting display panel may also include a plurality of voltage control circuits 120 located in a non-display area of ​​the silicon-based organic light-emitting display panel (an area other than the display area 130 in the silicon-based organic light-emitting display panel). For example, at least two pixel circuits 110 in a row share a voltage control circuit 120, and the first electrode of the driving transistor in a row of pixel circuits 110 is coupled to the shared voltage control circuit 120, and the second electrode of each driving transistor is coupled to the corresponding display device L. The voltage control circuit 120 is configured to output an initialization signal Vinit to the first electrode of the driving transistor in response to a reset control signal RE to control the corresponding display device L to reset; and to output a first power supply signal VDD to the first electrode of the driving transistor in response to a light-emitting control signal EM to drive the display device L to emit light. By sharing the voltage control circuit 120, the structure of each pixel circuit in the display area 130 can be simplified, and the occupied area of ​​the pixel circuit in the display area 130 can be reduced, so that more pixel circuits and display devices can be set in the display area 130, and a high PPI organic light-emitting display panel can be realized. In addition, under the control of the reset control signal RE, the voltage control circuit 120 outputs the initialization signal Vinit to the first electrode of the driving transistor to control the corresponding display device to reset, so as to avoid the influence of the voltage loaded on the display device when the previous frame is illuminated on the next frame of light emission, thereby improving the afterimage phenomenon.

[0080] For example, the silicon-based organic light-emitting display panel may also include a plurality of pixel units PX located in the display area 130, each pixel unit PX includes a plurality of sub-pixels; each sub-pixel includes a display device L and a pixel circuit 110. Further, the pixel unit PX may include three sub-pixels of different colors. The three sub-pixels may be red sub-pixels, green sub-pixels, and blue sub-pixels, respectively. Of course, the pixel unit PX may also include four, five or more sub-pixels, which needs to be designed and determined according to the actual application environment and is not limited here.

[0081] For example, the pixel circuits 110 in at least two adjacent sub-pixels in the same row may share a voltage control circuit 120. Figure 6CAs shown, all pixel circuits 110 in the same row can share a voltage control circuit 120. Alternatively, in other examples, pixel circuits 110 in two, three or more adjacent sub-pixels in the same row can also share a voltage control circuit 120, which is not limited here. In this way, the occupied area of ​​the pixel circuits in the display area 130 can be reduced by sharing the voltage control circuit 120.

[0082] Fig.6D A circuit diagram of a specific implementation example of a voltage control circuit and a pixel circuit of a silicon-based organic light-emitting display panel provided in some embodiments of the present disclosure. For example, the driving transistor M0 in the pixel circuit 110 can be an N-type transistor, and when the current flows from its first terminal S to the second terminal D, the first terminal S can be used as its source and the second terminal D can be used as its drain. When the current flows from its second terminal D to the first terminal S, the second terminal D can be used as its source and the first terminal S can be used as its drain. In addition, the display device L can include an OLED. In this way, the positive electrode of the OLED is electrically connected to the second terminal D of the driving transistor M0, and the negative electrode of the OLED is electrically connected to the second power supply terminal VSS. The voltage of the second power supply terminal VSS is generally a negative voltage or a ground voltage VGND (generally 0V), and the voltage of the initialization signal Vinit can also be set to the ground voltage VGND, which is not limited here. For example, the OLED can be set to Micro-OLED or Mini-OLED, which is further conducive to realizing an organic light-emitting display panel with a high PPI.

[0083] For example, taking two pixel circuits 110 included in a row as an example, the voltage control circuit 120 may include a first switch transistor M1 and a second switch transistor M2. The gate of the first switch transistor M1 is used to receive the reset control signal RE, the first electrode of the first switch transistor M1 is used to receive the initialization signal Vinit, and the second electrode of the first switch transistor M1 is coupled to the first electrode S of the corresponding drive transistor M0. The gate of the second switch transistor M2 is used to receive the light emitting control signal EM, the first electrode of the second switch transistor M2 is used to receive the first power supply signal VDD, and the second electrode of the second switch transistor M2 is coupled to the first electrode S of the corresponding drive transistor M0.

[0084] For example, the first switch transistor M1 and the second switch transistor M2 may be of different types. For example, the first switch transistor M1 is an N-type transistor, and the second switch transistor M2 is a P-type transistor. Alternatively, the first switch transistor M1 is a P-type transistor, and the second switch transistor M2 is an N-type transistor. Of course, the first switch transistor M1 and the second switch transistor M2 may be of the same type. In practical applications, the types of the first switch transistor M1 and the second switch transistor M2 need to be designed according to the actual application environment, which is not limited here.

[0085] For example, the pixel circuit 110 may further include a third switch transistor M3 and a storage capacitor Cst. For example, the gate of the third switch transistor M3 is used to receive the first gate scan signal S1, the first electrode of the third switch transistor M3 is used to receive the data signal DA, and the second electrode of the third switch transistor M3 is coupled to the gate G of the driving transistor M0. The first end of the storage capacitor Cst is coupled to the gate G of the driving transistor M0, and the second end of the storage capacitor Cst is coupled to the ground terminal GND.

[0086] For example, the pixel circuit 110 may further include a fourth switch transistor M4. For example, the gate of the fourth switch transistor M4 is used to receive the second gate scan signal S2, the first electrode of the fourth switch transistor M4 is used to receive the data signal DA, and the second electrode of the fourth switch transistor M4 is coupled to the gate G of the driving transistor M0. In addition, the fourth switch transistor M4 is of a different type from the third switch transistor M3. For example, the third switch transistor M3 is an N-type transistor, and the fourth switch transistor M4 is a P-type transistor; or, the third switch transistor M3 is a P-type transistor, and the fourth switch transistor M4 is an N-type transistor.

[0087] It should be noted that when the voltage of the data signal DA is a voltage corresponding to a high gray scale, the voltage of the data signal DA can be prevented from being affected by the threshold voltage of the third N-type switch transistor M3, for example, by turning on the fourth P-type switch transistor M4 to transmit the data signal DA to the gate G of the drive transistor M0. When the voltage of the data signal DA is a voltage corresponding to a low gray scale, the voltage of the data signal DA can be prevented from being affected by the threshold voltage of the fourth P-type switch transistor M4, for example, by turning on the third N-type switch transistor M3 to transmit the data signal DA to the gate G of the drive transistor M0. In this way, the voltage range input to the gate G of the drive transistor M0 can be increased.

[0088] Figure 7 A cross-sectional schematic diagram of another display device provided by at least one embodiment of the present disclosure. Figure 7 As shown, in Figure 1 On the basis of the example shown, the display device 1 further includes a driving chip 40. For example, the driving chip 40 is connected to the flexible circuit board 30 and is configured to provide a driving signal to the silicon-based organic light-emitting display panel 10. For example, the driving chip 40 is located in the binding area of ​​the display device 1, and is connected to the flexible circuit board 30 through a signal line 41, so as to provide a driving signal (for example, a clock signal, an initialization signal Vinit, a first power signal VDD, a second power signal VSS, image data, etc.) to the gate driving circuit, the data driving circuit and the pixel circuit in the silicon-based OLED display substrate through the flexible circuit board 30.

[0089] It should be noted that, for the sake of clarity and simplicity, the embodiments of the present disclosure do not provide all the components of the display device. To achieve the basic functions of the display device, those skilled in the art may provide and set other structures not shown according to specific needs, and the embodiments of the present disclosure do not limit this.

[0090] The display device provided by the above-mentioned embodiments of the present disclosure, on the one hand, can achieve heat dissipation of the silicon-based organic light-emitting display panel by adopting a heat dissipation film layer, thereby avoiding the influence of the temperature change of the silicon-based organic light-emitting diodes in the silicon-based organic light-emitting display panel due to the heat dissipation problem on the display brightness and display life of the display device, thereby improving the display quality of the display device and extending the service life of the display device; on the other hand, the display device integrates the heat dissipation film layer with the silicon-based OLED display substrate, has a simple manufacturing process, improves the compactness of the display device, and greatly reduces the manufacturing cost of the display device.

[0091] At least one embodiment of the present disclosure further provides an electronic device. Figure 8 A schematic diagram of an electronic device provided by at least one embodiment of the present disclosure. Figure 8 As shown, the electronic device 100 includes a display device 1 provided by any embodiment of the present disclosure, for example, Figure 1 or Figure 7 The display device 1 shown in FIG. 1 . For example, the electronic device 100 may be a virtual reality device or an augmented reality device.

[0092] For example, the display device 1 may be a silicon-based OLED display device, which is not limited in the embodiments of the present disclosure.

[0093] It should be noted that, for the sake of clarity and simplicity, the embodiments of the present disclosure do not provide all the components of the electronic device 100. To implement the basic functions of the electronic device 100, those skilled in the art may provide and set other structures not shown according to specific needs, and the embodiments of the present disclosure are not limited thereto.

[0094] The technical effects of the electronic device 100 provided in the above embodiment may refer to the technical effects of the display device provided in the embodiment of the present disclosure, which will not be described in detail here.

[0095] At least one embodiment of the present disclosure further provides a method for preparing a display device. Fig. 9 The flowchart of a method for preparing a display device provided by at least one embodiment of the present disclosure is shown. For example, the method can be used to prepare a display device provided by any embodiment of the present disclosure. For example, the method can be used to prepare Figure 1 The display substrate shown in FIG. Fig. 9 As shown, the method for preparing the display device includes steps S110 to S130.

[0096] Step S110: providing a silicon-based organic light-emitting display panel.

[0097] Step S120: forming a heat dissipation film layer on the non-display side of the silicon-based organic light-emitting display panel.

[0098] Step S130: connecting the flexible circuit board to the silicon-based organic light-emitting display panel, and making at least a portion of the flexible circuit board located on a side of the heat dissipation film layer away from the silicon-based organic light-emitting display panel.

[0099] It should be noted that providing a silicon-based organic light-emitting display panel in step S110 refers to forming an organic light-emitting device or other necessary display element for display on one side of a silicon substrate. However, the order of forming an organic light-emitting diode or other necessary display element for display and forming a heat dissipation film layer in step 120 is not particularly limited. It can be selected according to actual conditions to first form an organic light-emitting diode or other necessary display element for display, and then form a heat dissipation film layer; or first form a heat dissipation film layer on a silicon substrate, and then form an organic light-emitting diode or other necessary display element for display.

[0100] For step S110, for example, the silicon-based organic light-emitting display panel 10 may be Fig. 6A The structure shown can be formed by conventional methods in the art, which will not be described in detail herein. The embodiments of the present disclosure are not limited thereto.

[0101] For step S120, for example, in one example, the heat dissipation film layer 20 can be directly formed on the non-display side of the silicon-based organic light-emitting display panel 10 according to a specific process. In other examples, the heat dissipation film layer 20 can be formed separately first, and then bonded to the non-display side of the silicon-based organic light-emitting display panel 10. By arranging the heat dissipation film layer 20 on the non-display side of the silicon-based organic light-emitting display panel, the heat can be effectively conducted outward, thereby achieving effective heat transfer.

[0102] For example, in some examples, the orthographic projection of the heat dissipation film layer 20 on the plane of the silicon-based organic light-emitting display panel 10 falls within the projection of the silicon-based organic light-emitting display panel 10 on the plane. For example, the position of the heat dissipation film layer 20 corresponds to the silicon-based organic light-emitting display panel 10, and is integrated or attached thereunder, thereby achieving effective heat dissipation of the silicon-based OLED display panel 10. For example, the size of the heat dissipation film layer 20 is slightly smaller than the size of the silicon-based OLED display panel 10, thereby avoiding the influence of the larger size of the heat dissipation film layer 20 on the size of the display device 1, so as to limit its application. In the embodiment of the present disclosure, the heat dissipation film layer 20 is small in size and has good heat dissipation effect, which can extend the service life of the silicon-based OLED display device and achieve the optical characteristics of high-quality display.

[0103] For example, in some examples, step S120 includes: forming a second heat dissipation film layer 22 on the non-display side of the silicon-based organic light-emitting display panel 10 by an electroforming method; forming a first heat dissipation film layer 23 on the second heat dissipation film layer 22 by an evaporation process; and forming a first adhesive film layer 24 on the first heat dissipation film layer 23.

[0104] In the embodiment of the present disclosure, the first heat dissipation film layer 23 is manufactured by an evaporation process and the second heat dissipation film layer 22 is formed by an electroforming method, which can reduce the manufacturing cost of the heat dissipation film layer and simplify the manufacturing process, thereby reducing the complexity of the manufacturing process of the display device.

[0105] For example, in some other examples, when the heat dissipation film layer 20 is formed separately, step S120 may also include: before forming the second heat dissipation film layer 20 , forming a second adhesive film layer 21 to adhere to the non-display side of the silicon-based organic light-emitting display panel 10 .

[0106] For example, the first adhesive film layer is bonded to the flexible circuit board 30. For example, the material of the first adhesive film layer 24 may be an acrylic pressure-sensitive film layer or an organic material having adhesiveness such as a resin, and the embodiments of the present disclosure do not specifically limit this. For example, the material of the second adhesive film layer 21 may be the same as or different from that of the first adhesive film layer 24, for example, it may be an acrylic pressure-sensitive film layer or an organic material having adhesiveness such as a resin, and the embodiments of the present disclosure do not specifically limit this.

[0107] For example, the material of the first heat dissipation film layer 23 may be metal. For example, the metal includes copper, copper alloy, silver, silver alloy, aluminum or aluminum alloy, etc., and the embodiments of the present disclosure are not limited to this. For example, in one example, the first heat dissipation film layer 23 may be made of copper foil. For example, the material of the second heat dissipation film layer 22 includes graphite or graphene, etc., which can achieve a heat-averaging effect and help to effectively dissipate heat.

[0108] For step S130, for example, the flexible circuit board 30 is connected to the display side of the silicon-based organic light-emitting display panel 10 (for example, connected to the pixel circuit in the silicon-based organic light-emitting display panel 10), and the flexible circuit board 30 is connected along the edge of the silicon-based organic light-emitting display panel 10 (for example, Figure 1 The flexible circuit board 30 is bent at the left edge of the silicon-based organic light-emitting display panel 10 shown in the figure, so that at least part of the flexible circuit board 30 is arranged on the side of the heat dissipation film layer 20 away from the silicon-based organic light-emitting display panel. For example, the flexible circuit board 30 can be bent 180 degrees as needed. 0 , so as to reduce the size of the display device.

[0109] For example, the preparation method may further include forming at least one through hole on the flexible circuit board 30. Figure 3 or Figure 4For example, the orthographic projection of the at least one through hole on a plane parallel to the silicon-based organic light-emitting display panel 10 at least partially overlaps with the orthographic projection of the heat dissipation film layer on a plane parallel to the silicon-based organic light-emitting display panel, so that the heat dissipation film layer can be exposed through the through hole 31 to avoid the flexible circuit board 30 located under the heat dissipation film layer 20 from blocking the heat dissipation, so that the heat generated by the silicon-based organic light-emitting display panel 10 during the light-emitting process can be dissipated through the heat dissipation film layer 20 and the through hole 31 on the flexible circuit board 30, for example, through Figure 2 The heat is dissipated along the path D shown, thereby achieving effective heat transfer of the silicon-based OLED display device, reducing the temperature of the silicon-based OLED display device, extending the service life of the silicon-based OLED display device, and improving the display quality of the display device.

[0110] For example, in some examples, such as Figure 3 As shown, the through hole 31 may include a relatively large through hole corresponding to the position of the heat dissipation film layer 20 and the silicon-based OLED display panel 10. For example, in the case where the through hole 31 is a relatively large through hole, a portion of the flexible circuit board around the through hole 31 may be connected to the heat dissipation film layer 30. For example, in other examples, such as Figure 4 As shown, the through hole 31 may also include a plurality of through holes, and the embodiment of the present disclosure does not limit the number of through holes. Figure 3 The through hole form is still Figure 4 In the form of a through hole, the orthographic projection of the through hole 31 on a plane parallel to the silicon-based organic light-emitting display panel falls within the orthographic projection of the heat dissipation film layer on the plane, thereby further improving the heat dissipation effect.

[0111] It should be noted that the shape of the through hole 31 can be a regular shape such as a rectangle, an ellipse, a circle, a diamond or other irregular shapes, as long as effective heat transfer can be achieved, and the embodiments of the present disclosure are not limited to this.

[0112] It should be noted that in multiple embodiments of the present disclosure, the process of the method for preparing the display device may include more or fewer operations, and these operations may be performed sequentially or in parallel. Although the process of the preparation method described above includes multiple operations that appear in a specific order, it should be clearly understood that the order of the multiple operations is not limited. The preparation method described above can be performed once or multiple times according to predetermined conditions.

[0113] The technical effects of the method for preparing the display device provided in the above embodiment can be referred to the technical effects of the display device provided in the embodiment of the present disclosure, which will not be repeated here.

[0114] There are a few points to note:

[0115] (1) The drawings of the embodiments of the present disclosure only relate to the structures related to the embodiments of the present disclosure, and other structures may refer to the general design.

[0116] (2) In the absence of conflict, the embodiments of the present disclosure and the features therein may be combined with each other to obtain new embodiments.

[0117] The above description is merely an exemplary embodiment of the present disclosure and is not intended to limit the protection scope of the present disclosure. The protection scope of the present disclosure is determined by the appended claims.

Claims

1. A display device, comprising: A silicon-based organic light-emitting display panel comprises a silicon substrate, a first electrode of a display device, an organic light-emitting layer and a second electrode of the display device which are stacked in sequence; A heat dissipation film layer, arranged on the non-display side of the silicon-based organic light-emitting display panel; A flexible circuit board, at least partially disposed on a side of the heat dissipation film layer away from the silicon-based organic light-emitting display panel, and electrically connected to the silicon-based organic light-emitting display panel; Wherein, a gate driving circuit, a data driving circuit and a pixel circuit are integrated on the silicon substrate, and the flexible circuit board is configured to transmit electrical signals to the gate driving circuit, the data driving circuit and the second electrode of the display device; Wherein, at least one through hole is provided on the flexible circuit board, and the orthographic projection of the at least one through hole on a plane parallel to the silicon-based organic light-emitting display panel at least partially overlaps with the orthographic projection of the heat dissipation film layer on the plane.

2. The display device according to claim 1, wherein: The orthographic projection of the at least one through hole on the plane falls within the orthographic projection of the heat dissipation film layer on the plane.

3. The display device according to claim 1 or 2, wherein: The silicon substrate comprises a display area and a peripheral area surrounding the display area, and the display device is located in the display area; The flexible circuit board is connected to the peripheral area of ​​the silicon substrate and is bent along the edge of the silicon substrate, so that at least a part of the flexible circuit board is arranged on a side of the heat dissipation film layer away from the silicon-based organic light-emitting display panel.

4. The display device according to claim 3, wherein: The orthographic projection of the heat dissipation film layer on the plane at least partially overlaps with the orthographic projection of the display area on the plane; The orthographic projection of the heat dissipation film layer on the plane falls within the orthographic projection of the silicon substrate on the plane.

5. The display device according to claim 1 or 2, wherein: The orthographic projection of the heat dissipation film layer on a plane parallel to the silicon-based organic light-emitting display panel falls within the projection of the silicon-based organic light-emitting display panel on the plane.

6. The display device according to claim 1 or 2, wherein: The heat dissipation film layer comprises: A first adhesive film layer, bonded to the flexible circuit board; The first heat dissipation film layer is arranged between the first adhesive film layer and the silicon substrate.

7. The display device according to claim 6, wherein: The heat dissipation film layer further includes: a second heat dissipation film layer, which is arranged between the first heat dissipation film layer and the silicon substrate.

8. The display device according to claim 7, wherein: The material of the second heat dissipation film layer includes graphite or graphene.

9. The display device according to claim 6, wherein: The heat dissipation film layer further includes: a second adhesive film layer, which is arranged on a side of the first heat dissipation film layer close to the silicon-based panel and is bonded to the silicon substrate.

10. The display device according to claim 9, wherein: The materials of the first adhesive film layer and the second adhesive film layer include acrylic pressure-sensitive film layers.

11. The display device according to claim 6, wherein: The material of the first heat dissipation film layer is metal.

12. The display device according to claim 11, wherein: The metal includes copper, copper alloy, silver, silver alloy, aluminum or aluminum alloy.

13. The display device according to claim 1 or 2, wherein: The silicon-based organic light-emitting display panel further includes: A first thin film encapsulation layer and a second thin film encapsulation layer are sequentially arranged on a side of the second electrode of the display device away from the organic light emitting layer; A color film layer, disposed between the first thin film encapsulation layer and the second thin film encapsulation layer; A cover plate is arranged on a side of the second thin film encapsulation layer away from the color filter layer.

14. The display device according to claim 1 or 2, further comprising: A driving chip, wherein the driving chip is connected to the flexible circuit board and is configured to provide a driving signal to the silicon-based organic light-emitting display panel.

15. An electronic device, comprising the display device according to any one of claims 1 to 14, wherein: The electronic device is a virtual reality device or an augmented reality device.

16. A method for preparing a display device according to any one of claims 1 to 14, comprising: Providing the silicon-based organic light-emitting display panel; forming the heat dissipation film layer on the non-display side of the silicon-based organic light-emitting display panel; Connecting the flexible circuit board to the silicon-based organic light-emitting display panel, and making at least a portion of the flexible circuit board located on a side of the heat dissipation film layer away from the silicon-based organic light-emitting display panel; At least one through hole is formed on the flexible circuit board, wherein an orthographic projection of the at least one through hole on a plane parallel to the silicon-based organic light-emitting display panel at least partially overlaps with an orthographic projection of the heat dissipation film layer on the plane.

17. The method for manufacturing a display device according to claim 16, wherein: The flexible circuit board is connected to the silicon-based organic light-emitting display panel, and at least a portion of the flexible circuit board is formed on a side of the heat dissipation film layer away from the silicon-based organic light-emitting display panel, comprising: The flexible circuit board is connected to the display side of the silicon-based organic light-emitting display panel, and the flexible circuit board is bent along the edge of the silicon-based organic light-emitting display panel so that at least a portion of the flexible circuit board is arranged on a side of the heat dissipation film layer away from the silicon-based organic light-emitting display panel.

18. The method for manufacturing a display device according to claim 16, wherein: A heat dissipation film layer is formed on the non-display side of the silicon-based organic light-emitting display panel, comprising: forming a first adhesive film layer; forming a first heat dissipation film layer on the first adhesive film layer by using an evaporation process; A second heat dissipation film layer is formed on the first heat dissipation film layer by using an evaporation process.

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