Touch sensor and display device including the same

Abstract

The present application relates to a touch sensor and a display device including the touch sensor. The touch sensor includes a touch sensing area, a touch sensing electrode in the touch sensing area, a touch extension wiring extending to the touch sensing electrode, a touch pad located on one end of the touch extension wiring, a flexible printed circuit board overlapping the touch pad, a flexible printed circuit pad located on the flexible printed circuit board and facing the touch pad, and a conductive bonding member located between the touch pad and the flexible printed circuit pad. The conductive bonding member is bonded to each of the touch pad and the flexible printed circuit pad. The touch pad includes a first touch pad layer made of a transparent metal oxide, and a second touch pad layer located on the first touch pad layer. The second touch pad layer is made of a metal material. The conductive bonding member is bonded to the second touch pad layer.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2019-0137995, filed on October 31, 2019, which is hereby incorporated by reference for all purposes as if fully set forth herein. Technical Field

[0003] Some example embodiments generally relate to a touch sensor and a display device including the touch sensor. Background Art

[0004] The display device is a device for displaying an image, and may include a liquid crystal display (LCD), an organic light emitting diode (OLED) display, and the like. The display device may be used in various electronic devices, such as mobile phones, navigation devices, digital cameras, e-books, portable game consoles, various terminals, and the like. The input device for the electronic device may include a touch sensor, which is used for the user to contact the screen with a finger or a pen (or otherwise interact with the screen) to input information. Among the various sensing methods of the touch sensor, a capacitance type is generally used to sense the position of the change in capacitance caused by contact between two electrodes separated from each other. The touch pad of the touch sensor may be connected to a flexible printed circuit pad. It is also recognized that methods and devices for reducing the thickness of the electronic device and the size of the frame are being explored. Therefore, the touch pad is becoming smaller. As the touch pad becomes smaller, defects may occur in the electrical connection with the flexible printed circuit pad.

[0005] The above information disclosed in this section is only for understanding the background of the present inventive concept and therefore it may contain information that does not form the prior art. Summary of the invention

[0006] Some aspects provide a touch sensor capable of allowing electrical connection between a touch pad and a flexible printed circuit pad to be properly performed and more reliable.

[0007] Some aspects provide a display device including a touch sensor capable of allowing electrical connection between a touch pad and a flexible printed circuit pad to be properly performed and more reliably.

[0008] Additional aspects will be set forth in the detailed description which follows, and in part will be obvious from the disclosure, or may be learned by practice of the inventive concepts.

[0009] According to some aspects, the touch sensor includes a touch sensing area, a touch sensing electrode in the touch sensing area, a touch extension wiring extending to the touch sensing electrode, a touch pad located on one end of the touch extension wiring, a flexible printed circuit board overlapping the touch pad, a flexible printed circuit pad located on the flexible printed circuit board and facing the touch pad, and a conductive bonding member located between the touch pad and the flexible printed circuit pad. The conductive bonding member is bonded to each of the touch pad and the flexible printed circuit pad. The touch pad includes a first touch pad layer made of a transparent metal oxide, and a second touch pad layer located on the first touch pad layer. The second touch pad layer is made of a metal material. The conductive bonding member is bonded to the second touch pad layer.

[0010] According to some aspects, a display device includes a substrate, a light emitting device, an encapsulation structure, a touch sensing electrode, a touch extension wiring, a touch pad, a flexible printed circuit board, a flexible printed circuit pad, and a conductive bonding member. The substrate includes a touch sensing area. The light emitting device is located on the substrate. The encapsulation structure is located on the light emitting device. The touch sensing electrode is located on the encapsulation structure in the touch sensing area. The touch extension wiring extends to the touch sensing electrode. The touch pad is located on one end of the touch extension wiring. The flexible printed circuit board overlaps the touch pad. The flexible printed circuit pad is located on the flexible printed circuit board and faces the touch pad. The conductive bonding member is located between the touch pad and the flexible printed circuit pad. The conductive bonding member is bonded to each of the touch pad and the flexible printed circuit pad. The touch pad includes a first touch pad layer made of a transparent metal oxide, and a second touch pad layer located on the first touch pad layer. The second touch pad layer is made of a metal material. The conductive bonding member is bonded to the second touch pad layer.

[0011] According to various exemplary embodiments, the touch pad and the flexible printed circuit pad may be combined with the conductive ball so that the electrical connection between the touch pad and the flexible printed circuit pad may be stably formed / performed. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 A top view of a display device according to some exemplary embodiments is shown.

[0013] Figure 2 According to some exemplary embodiments, Figure 1 Cross-sectional view along section line II-II'.

[0014] Figure 3 An enlarged top view of a predetermined area of ​​a display device according to some example embodiments is shown.

[0015] Figure 4 According to some exemplary embodiments, Figure 3Cross-sectional view along section line IV-IV'.

[0016] Figure 5 According to some exemplary embodiments, Figure 3 Cross-sectional view along section line V-V'.

[0017] Figure 6 An enlarged top view of a predetermined area of ​​a display device according to some example embodiments is shown.

[0018] Figure 7 An enlarged top view of a predetermined area of ​​a display device according to some example embodiments is shown.

[0019] Figure 8 A plan view of an enlarged predetermined area of ​​a display device according to some example embodiments is shown. DETAILED DESCRIPTION

[0020] In the following description, for the purpose of illustration, many specific details are elaborated to provide a thorough understanding of various exemplary embodiments. As used herein, the terms "embodiment" and "implementation" are used interchangeably, and they are non-limiting examples of one or more of the inventive concepts disclosed herein. However, it is apparent that various exemplary embodiments can be put into practice without these specific details or with one or more equivalent arrangements. In other examples, in order to avoid unnecessarily obscuring various exemplary embodiments, known structures and devices are shown in block diagram form. In addition, various exemplary embodiments may be different, but not necessarily exclusive. For example, without departing from the inventive concept, the specific shape, configuration and characteristics of the exemplary embodiment may be used or implemented in another exemplary embodiment.

[0021] Unless otherwise specified, the illustrated exemplary embodiments should be understood as providing exemplary features of different details of some exemplary embodiments. Therefore, unless otherwise specified, the various illustrated features, components, modules, layers, films, panels, regions, aspects, etc. (hereinafter individually or collectively referred to as "elements" or "multiple elements") may be combined, separated, interchanged and / or rearranged without departing from the concept of the present invention.

[0022] The use of cross hatching and / or shadows in the drawings is generally used to make the boundaries between adjacent elements clear. Therefore, unless specified, the presence or absence of cross hatching or shadows does not represent or indicate any preference or requirement for a specific material, material property, size, ratio, commonality between the illustrated elements and / or any other characteristics, attributes, properties, etc. of the elements. In addition, in the drawings, for the purpose of clarity and / or description, the size and relative size of the elements may be exaggerated. Therefore, the size and relative size of the corresponding elements are not necessarily limited to the size and relative size shown in the drawings. When the exemplary embodiments can be implemented differently, the specific processing sequence can be performed differently from the described sequence. For example, two processes described in succession can be performed substantially simultaneously or in an order opposite to the described order. In addition, the same reference numerals represent the same elements.

[0023] When an element such as a layer is referred to as being "on" another element, "connected to" or "coupled to" another element, it may be directly located on another element, directly connected to or directly coupled to another element, or there may be an intervening element. However, when an element is referred to as being "directly located" on another element, "directly connected to" or "directly coupled to" another element, there is no intervening element. Other terms and / or phrases used to describe the relationship between elements should be interpreted in a similar manner, for example, "between" and "directly located between", "adjacent to" and "directly adjacent to", "on" and "directly located on" etc. In addition, the term "connection" may refer to physical connection, electrical connection and / or fluid connection. For the purposes of this disclosure, "at least one of X, Y and Z" and "at least one selected from the set consisting of X, Y and Z" may be interpreted as any combination of only X, only Y, only Z or two or more of X, Y and Z, such as taking XYZ, XYY, YZ and ZZ as examples. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0024] Although the terms "first", "second", etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another element. Therefore, without departing from the teachings of the present disclosure, the first element discussed below may be referred to as the second element.

[0025] Spatially relative terms such as "beneath," "below," "under," "lower," "above," "upper," "over," "higher," "side" (e.g., as in "sidewall"), and the like may be used herein for descriptive purposes, and thereby to describe the relationship of one element to another element(s) as shown in the accompanying drawings. Spatially relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture in addition to the orientation depicted in the accompanying drawings. For example, if the device in the accompanying drawings is turned over, elements described as being "below" or "beneath" other elements or features would then be oriented to be "above" the other elements or features. Thus, the exemplary term "below" may include both the above and below orientations. Furthermore, the device may be otherwise oriented (e.g., rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein should be interpreted accordingly. In addition, the phrase “on a plane” means viewing an object portion from the top, and the phrase “on a cross section” means observing a cross section obtained by vertically cutting the object portion from the side.

[0026] The terms used herein are for the purpose of describing specific embodiments, rather than being intended to be limiting. Unless the context clearly indicates otherwise, as used herein, the singular forms "a", "an" and "the" are intended to also include plural forms. In addition, when used in this specification, the terms "comprise", "comprising", "including" and / or "including" represent the existence of stated features, integral bodies, steps, operations, elements, parts and / or their collections, but do not exclude the existence or addition of one or more other features, integral bodies, steps, operations, elements, parts and / or their collections. It should also be noted that, as used herein, the terms "substantially", "about" and other similar terms are used as approximate terms and not as degree terms, and are therefore used to allow for the inherent deviations in the measured values, calculated values ​​and / or provided values ​​that will be recognized by those of ordinary skill in the art.

[0027] Various exemplary embodiments are described herein with reference to cross-sectional views, isometric views, stereograms, plan views, and / or exploded illustrations that are schematic diagrams of idealized exemplary embodiments and / or intermediate structures. Therefore, deviations from the illustrated shapes due to, for example, manufacturing techniques and / or tolerances are expected. Therefore, the exemplary embodiments disclosed herein should not be construed as being limited to the specific illustrated regional shapes, but should include deviations in shape caused by, for example, manufacturing. To this end, the regions shown in the drawings may be schematic in nature, and the shapes of these regions may not reflect the actual shapes of the regions of the device, and are therefore not intended to be limiting.

[0028] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present disclosure belongs. Terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and will not be interpreted in an idealized or overly formal sense unless explicitly defined as such herein.

[0029] According to the convention in the art, for functional blocks, units and / or modules, some exemplary embodiments are described and shown in the drawings. It will be understood by those skilled in the art that these blocks, units and / or modules are physically implemented by electronic (or optical) circuits such as logic circuits, discrete components, microprocessors, hard-wired circuits, memory elements, wiring connections, etc., which can be formed using semiconductor-based preparation technology or other manufacturing technology. In the case where the blocks, units and / or modules are implemented by microprocessors or other similar hardware, software (e.g., microcode) can be used to program and control the blocks, units and / or modules to perform the various functions discussed herein, and optionally, they can be driven by firmware and / or software. It is also considered that each block, unit and / or module can be implemented by dedicated hardware, or implemented as a combination of dedicated hardware that performs some functions and processors (e.g., one or more programmed microprocessors and related circuits) that perform other functions. In addition, without departing from the concept of the present invention, each block, unit and / or module of some exemplary embodiments can be physically divided into two or more interactive and discrete blocks, units and / or modules. Furthermore, the blocks, units and / or modules of some exemplary embodiments may be physically combined into more complex blocks, units and / or modules without departing from the inventive concept.

[0030] Hereinafter, various exemplary embodiments will be described in detail with reference to the accompanying drawings.

[0031] Now refer to Figure 1 and Figure 2 A display device according to some exemplary embodiments will be described.

[0032] Figure 1 A top view of a display device according to some exemplary embodiments is shown. Figure 2 According to some exemplary embodiments, Figure 1 Cross-sectional view along section line II-II'.

[0033] like Figure 1 and Figure 2 As shown in , the display device includes a display panel 100 and a touch sensor 200 disposed on the display panel 100 .

[0034] The display device includes a display area DA and a peripheral area PA disposed outside the display area DA. The display area DA refers to an area for displaying an image according to an on / off operation of a plurality of pixels included in the display panel 100. The peripheral area PA refers to an area in which a driving circuit for driving a plurality of pixels of the display area DA is installed or formed. The display device according to an exemplary embodiment may further include a touch sensing area TA. The touch sensing area TA refers to an area for sensing a touch (or a touch interaction) by the touch sensor 200. The touch sensing area TA may correspond to the display area DA. However, this is an example, and the touch sensing area TA may not correspond to the display area DA. For example, the touch sensing area TA may be narrower and / or wider than the display area DA.

[0035] The display panel 100 may be flexible, stretchable, foldable, bendable, or rollable, and the embodiment is not limited thereto. For example, the display panel 100 may be bent at a boundary between the display area DA and the peripheral area PA. The peripheral area PA may be bent from the display area DA and may be disposed on the rear side of the display area DA. However, this is an example, and the peripheral area PA may have a variety of modifiable positions.

[0036] The display panel 100 includes a substrate 110 , a light emitting device 120 disposed on the substrate 110 , and an encapsulation substrate 130 disposed on the light emitting device 120 .

[0037] The substrate 110 may be an insulating substrate made of at least one of glass, quartz, ceramic, and plastic, or the substrate 110 may be a metal substrate made of stainless steel.

[0038] A plurality of pixels may be arranged in a formation (e.g., a matrix formation) on the substrate 110, and the pixels may receive image signals and may output images. The light emitting device 120 may be arranged in the display area DA, and the light emitting device 120 may be arranged for each pixel. For example, the display panel 100 may include a plurality of light emitting devices 120. The arrangement (or positioning) of the plurality of pixels may be modified in various ways. In addition, a plurality of signal lines may be further provided on the substrate 110. The signal line may include a plurality of scan lines, a plurality of control lines, a plurality of data lines, and a plurality of drive voltage lines. The signal lines may transmit scan signals, control signals, data signals, and drive voltages, respectively. The plurality of signal lines may be arranged to intersect each other in the row direction or the column direction. The corresponding pixels may include a plurality of transistors and capacitors connected to the plurality of signal lines. The light emitting device 120 may include an organic light emitting diode (OLED), and the light emitting device 120 may be connected to the plurality of signal lines through transistors and capacitors. As described above, the display panel 100 may include an organic light emitting panel, but the type of the display panel 100 is not limited thereto. In other words, the display panel 100 may include a plurality of types of panels. For example, the display panel 100 may include a liquid crystal panel, an electrophoretic display panel, an electrowetting display panel, or the like.

[0039] The encapsulation substrate 130 may be disposed to face the substrate 110, and the encapsulation substrate 130 may have a similar shape to the substrate 110. For example, the encapsulation substrate 130 and the substrate 110 may be substantially formed to have a rectangular (or substantially rectangular) shape. The encapsulation substrate 130 may have a similar size to the substrate 110, or the encapsulation substrate 130 may be smaller than the substrate 110. The encapsulation substrate 130 may be made of at least one of glass and plastic, and the encapsulation substrate 130 may be made of a transparent material.

[0040] A sealing member 150 may be further provided between the substrate 110 and the encapsulation substrate 130. The sealing member 150 may be provided in the peripheral area PA. The sealing member 150 may be formed to surround the display area DA in a plan view. Therefore, the light emitting device 120 provided in the display area DA may be surrounded and sealed by the sealing member 150, the substrate 110, and the encapsulation substrate 130. In this way, the substrate 110 and the encapsulation substrate 130 may be combined together by the sealing member 150. The sealing member 150 may be formed by a process of applying a glass material (such as glass raw material) to an area provided between the substrate 110 and the encapsulation substrate 130 in the peripheral area PA and irradiating ultraviolet (UV) rays thereto to cure the glass material.

[0041] Most areas of the substrate 110 are covered by the encapsulation substrate 130. A predetermined area of ​​the substrate 110 may not be covered by the encapsulation substrate 130, but may be exposed to the outside. A driving circuit chip 170 may be provided on a predetermined area of ​​the substrate 110 that is not covered by the encapsulation substrate 130. The driving circuit chip 170 may be provided at an edge on one side of the substrate 110 (or near an edge on one side of the substrate 110), for example, at the bottom edge of the substrate 110. However, this is an example, and the driving circuit chip 170 may have a variety of modifiable positions. For example, the driving circuit chip 170 may be provided on the top edge of the substrate 110. The driving circuit chip 170 may be connected to a plurality of pixels provided in the display area DA, and may send various signals to the plurality of pixels. For example, the driving circuit chip 170 may provide a scan signal, a control signal, a data signal, and a driving voltage.

[0042] A flexible circuit board may be further provided on an edge on one side of the substrate 110. A circuit for controlling driving of the display panel 100 may be provided on the flexible circuit board, and the circuit for controlling driving of the display panel 100 may be attached to the edge on one side of the substrate 110.

[0043] The touch sensor 200 can sense contact of an external object (such as a hand or a pen) generated in the touch sensing area TA. In addition to the case where the external object directly contacts the touch sensing area TA, the touch sensor 200 can also sense the case where the external object hovers when the external object is provided near the touch sensing area TA or approaches the touch sensing area TA.

[0044] The touch sensor 200 may be disposed on the outer side of the display panel 100 (i.e., on-cell type), or may be disposed on the inner side of the display panel 100 (i.e., in-cell type). In addition, the touch sensor 200 may be disposed on another panel and may be attached to the display panel 100 (i.e., add-on cell type). Now, a case where the touch sensor 200 is disposed on the outer side of the display panel 100 will be described. However, exemplary embodiments are not limited thereto, and the touch sensor 200 may have a variety of changeable positions.

[0045] The touch sensor 200 may be disposed on the package substrate 130. An anti-reflection layer for reducing reflection of external light may be further disposed on the touch sensor 200. The anti-reflection layer may include a polarization layer including a linear polarizer and a retarder. A cover window may be further disposed on the touch sensor 200. The cover window may protect the touch sensor 200 and the display panel 100 disposed under the touch sensor 200.

[0046] The touch sensor 200 includes a touch sensing electrode 240 disposed in the touch sensing area TA, a touch extension wiring 245 extending to the touch sensing electrode 240 , and a touch pad 250 disposed as one end of the touch extension wiring 245 .

[0047] The touch sensing electrodes 240 may include first touch sensing electrodes 241 extending in a first direction X, and second touch sensing electrodes 242 extending in a second direction Y intersecting (or crossing) the first direction X.

[0048] The first touch sensing electrode 241 may include a plurality of first sensing units 241a arranged in the first direction X, and a plurality of first connectors 241b extending in the first direction X and connecting the first sensing units 241a. The first touch sensing electrode 241 may represent a transmitter (Tx) touch sensing electrode for receiving a first touch signal for sensing a coordinate value of the second direction Y. The first sensing unit 241a may have a substantially rhombus shape. However, this is an example, and the first sensing unit 241a may have a variety of modifiable shapes. For example, the first sensing unit 241a may be formed into a polygon such as a hexagon or a circular or elliptical shape. The first sensing unit 241a may be formed to have a grid shape. For example, the first sensing unit 241a may be formed into a grid shape as a plurality of conductive thin lines that may be arranged to cross each other. In addition, the first sensing unit 241a may have a variety of shapes such as a protrusion to improve the sensitivity of the touch sensor 200.

[0049] The second touch sensing electrode 242 may include a plurality of second sensing units 242a arranged in the second direction Y and a plurality of second connectors 242b extending in the second direction Y and connecting the plurality of second sensing units 242a to each other. The second touch sensing electrode 242 may represent a receiver (Rx) touch sensing electrode for receiving a second touch signal for sensing the coordinate value of the first direction X. The second sensing unit 242a may have a substantially rhombus shape. However, this is an example, and the second sensing unit 242a may have a variety of modifiable shapes. For example, the second sensing unit 242a may be formed into a polygon such as a hexagon, a circle, or an ellipse. The second sensing unit 242a may be formed to have a grid shape. For example, the second sensing unit 242a may form a grid shape as a plurality of conductive thin lines intersecting each other. In addition, the second sensing unit 242a may have a variety of shapes such as a protrusion to improve the sensitivity of the touch sensor 200.

[0050] The first touch sensing electrode 241 and the second touch sensing electrode 242 may be arranged on different layers. In a plan view, the first sensing unit 241a and the second sensing unit 242a may be adjacent to each other, and the first connector 241b and the second connector 242b may overlap each other and may be insulated from each other by an insulating layer. For example, an insulating layer may be provided between the first touch sensing electrode 241 and the second touch sensing electrode 242. However, this is an example, and at least a portion of the first touch sensing electrode 241 and the second touch sensing electrode 242 may be provided on the same layer. For example, the first sensing unit 241a and the second sensing unit 242a may be provided on the same layer. In this case, one of the first connector 241b and the second connector 242b may be provided on the same layer as the first sensing unit 241a and the second sensing unit 242a, and the other may be provided on a different layer from the first sensing unit 241a and the second sensing unit 242a. For example, the first connector 241b may be disposed on the same layer as the first sensing unit 241a and the second sensing unit 242a, and the second connector 242b may be disposed on a different layer from the first connector 241b. An insulating layer may be disposed between the second connector 242b and the second sensing unit 242a, and the second connector 242b may be connected to the second sensing unit 242a through a contact hole formed in the insulating layer.

[0051] The touch sensing electrode 240 may include a low resistance metal (such as at least one of silver (Ag), aluminum (Al), copper (Cu), chromium (Cr), and nickel (Ni)), and / or the touch sensing electrode 240 may include a conductive nanomaterial (such as at least one of silver nanowires and carbon nanotubes). In addition, the touch sensing electrode 240 may include a transparent metal oxide, such as at least one of indium tin oxide (ITO) and indium zinc oxide (IZO). In addition, the touch sensing electrode 240 may be formed into a multilayer structure, such as a structure including titanium (Ti) / aluminum (Al) / titanium (Ti). The touch sensing electrode 240 has a low resistance to reduce resistance-capacitance (RC) delay, and the touch sensing electrode 240 has excellent flexibility, so that the touch sensing electrode 240 is not easily broken due to repeated deformation (such as bending).

[0052] The first touch sensing electrode 241 and the second touch sensing electrode 242 adjacent to each other may form a mutual capacitance used as a touch sensor. The mutual capacitance may receive a driving signal through one of the first touch sensing electrode 241 and the second touch sensing electrode 242, and may output a change in the amount of charge caused by the touch of an external object through the other touch sensing electrode of the first touch sensing electrode 241 and the second touch sensing electrode 242 as an output signal. Different from this, a plurality of first touch sensing electrodes 241 may be separated from each other, and a plurality of second touch sensing electrodes 242 may be separated from each other to form independent touch sensing electrodes. In this case, the corresponding touch sensing electrodes may form a self-capacitance as a touch sensor. The self-capacitance may receive a driving signal and may store a predetermined amount of charge, and when a touch is generated, the amount of charge stored changes, and the self-capacitance may output an output signal different from the input driving signal.

[0053] The touch extension wiring 245 extends to one end of the touch sensing electrode 240. The touch sensing electrode 240 disposed near the peripheral area PA may extend to the touch extension wiring 245. One end on the first side of the touch extension wiring 245 may extend to the touch sensing electrode 240 and may be disposed in the touch sensing area TA, but the embodiment is not limited thereto. Most of the touch extension wiring 245 may be disposed in the peripheral area PA. One end on the second side of the touch extension wiring 245 extends to the touch pad 250.

[0054] The touch pad 250 may be disposed on one end of the touch extension wiring 245. The touch pad 250 may be disposed in the peripheral area PA. The touch pad 250 may be disposed on the right bottom end of the display panel 100. However, the position of the touch pad 250 is an example, and the position of the touch pad 250 may be modified in a variety of ways. For example, the touch pad 250 may be disposed on the central bottom end or the right top end of the display panel 100, or may be divided into different parts of the display panel 100. The touch sensor 200 may include a plurality of touch pads 250. The number of touch pads 250 may be substantially equal to the number of touch extension wirings 245.

[0055] The touch sensor 200 may further include a flexible printed circuit board 310 disposed on the package substrate 130. The flexible printed circuit board 310 may be disposed in the peripheral area PA and may overlap the touch pad 250. The flexible printed circuit board 310 includes a circuit for receiving a touch signal from the touch sensing electrode 240 through the touch extension wiring 245 and the touch pad 250, and may sense whether a touch is generated.

[0056] Now refer to Figures 3 to 5 A touch sensor of a display device according to some example embodiments is described.

[0057] Figure 3 An enlarged top view of a predetermined area of ​​a display device according to some example embodiments is shown. Figure 4 According to some exemplary embodiments, Figure 3 Cross-sectional view along section line IV-IV'. Figure 5 According to some exemplary embodiments, Figure 3 Thus, Figures 3 to 5 A touch pad and a peripheral side thereof of a touch sensor of a display device according to some example embodiments are illustrated.

[0058] like Figures 3 to 5 As shown in , a touch sensor 200 of a display device according to some exemplary embodiments includes a touch pad 250, a flexible printed circuit board 310 overlapping the touch pad 250, and a conductive bonding member (or conductive bonding structure) 500 disposed between the touch pad 250 and the flexible printed circuit board 310.

[0059] The touch pad 250 may include a first touch pad layer 260 and a second touch pad layer 270 disposed on the first touch pad layer 260 .

[0060] The first touch pad layer 260 may be disposed on the encapsulation substrate 130 of the display panel 100. The first touch pad layer 260 may be disposed on the encapsulation substrate 130, and another layer may be further disposed between the first touch pad layer 260 and the encapsulation substrate 130. The first touch pad layer 260 may be made of a transparent metal oxide. For example, the first touch pad layer 260 may be made of a transparent metal oxide such as at least one of indium tin oxide (ITO) and indium zinc oxide (IZO). The first touch pad layer 260 may be formed to have a rectangular (or substantially rectangular) form extending substantially in the second direction Y in a plan view. The first touch pad layer 260 may be formed to have a rectangular (or substantially rectangular shape) shape including two short sides parallel to the first direction X and two long sides parallel to the second direction Y. However, this is an example, and the first touch pad layer 260 may have a variety of planar shapes.

[0061] A passivation layer 280 may be provided on the first touch pad layer 260 and the package substrate 130. The passivation layer 280 may be made of an organic insulating material or an inorganic insulating material, and the passivation layer 280 may be formed in a single layer or a multilayer structure. A contact hole 285 overlapping at least a portion of the first touch pad layer 260 is formed in the passivation layer 280. At least a portion of the upper side of the first touch pad layer 260 may be exposed through the contact hole 285.

[0062] The second touch pad layer 270 may be disposed on the first touch pad layer 260 and the passivation layer 280. The second touch pad layer 270 may be disposed on the first touch pad layer 260. Therefore, the second touch pad layer 270 may contact the first touch pad layer 260, and the second touch pad layer 270 may be electrically connected to the first touch pad layer 260. The second touch pad layer 270 may be made of a variety of metal materials (such as at least one of molybdenum (Mo), silver (Ag), titanium (Ti), copper (Cu), and aluminum (Al)), and may include a single layer or a multilayer structure (such as a multilayer structure of molybdenum / aluminum / molybdenum (Mo / Al / Mo)). In a plan view, the second touch pad layer 270 may extend substantially in the second direction Y. For example, the second touch pad layer 270 may extend parallel to the first touch pad layer 260.

[0063] The second touch pad layer 270 includes a first portion 271 and a second portion 272 separated from each other in a plan view, and an extension portion 273 for extending to the first portion 271 and the second portion 272. The first portion 271 and the second portion 272 can be formed to have a quadrilateral (or substantially quadrilateral) shape, and the first portion 271 and the second portion 272 can have similar planar shapes. However, this is an example, and the first portion 271 and the second portion 272 can have a variety of modifiable shapes. In addition, the first portion 271 and the second portion 272 can have different shapes. The extension portion 273 can be formed to have a strip (or substantially strip) shape extending in the second direction Y. The second touch pad layer 270 may include a plurality of extension portions 273. For example, as Figure 3 and Figure 4 As shown in , the second touch pad layer 270 may include two extensions 273. In this case, the two extensions 273 may extend parallel to each other. For example, the two extensions 273 may extend in the second direction Y. The extension 273 may be narrower than the first portion 271 and the second portion 272 (for example, in the first direction X). In addition, the extension 273 may be narrower than the first touch pad layer 260. The extension 273 may also include a protrusion 275 that protrudes in the first direction X.

[0064] As described above, a sealing member 150 may be provided between the substrate 110 and the encapsulation substrate 130. The sealing member 150 and the touch pad 250 are provided in the peripheral area PA. The sealing member 150 and the touch pad 250 may overlap each other in the peripheral area PA. In this case, the sealing member 150 may be provided below the encapsulation substrate 130, and the touch pad 250 may be provided above the encapsulation substrate 130. The sealing member 150 may be provided between the substrate 110 and the encapsulation substrate 130 to seal the light emitting device 120 between the substrate 110 and the encapsulation substrate 130, and a curing process may be performed by irradiating UV light. In this case, when the touch pad 250 is formed of an opaque metal material, the portion where the sealing member 150 and the touch pad 250 overlap each other may not be properly cured. According to some exemplary embodiments, since the second touch pad layer 270 of the touch pad 250 is made of a metal material and the first touch pad layer 260 is made of a transparent metal oxide, a process for curing the sealing member 150 may be appropriately performed. In some exemplary embodiments, the extension portion 273 of the second touch pad layer 270 is formed narrower than the first portion 271 and the second portion 272, and the extension portion 273 of the second touch pad layer 270 may be formed narrower than the first touch pad layer 260. The sealing member 150 overlaps the extension portion 273 of the second touch pad layer 270, and the sealing member 150 does not overlap the first portion 271 and the second portion 272, so that the process for curing the sealing member 150 can be appropriately performed.

[0065] When the touch pad 250 is entirely formed narrow in order to perform a curing process, the resistance of the touch pad 250 may be increased. In some exemplary embodiments, the touch pad 250 includes a first touch pad layer 260 made of a transparent metal oxide and a second touch pad layer 270 made of a metal material. To this end, the first touch pad layer 260 is formed to be relatively wide, and the extension 273 of the second touch pad layer 270 is formed to be relatively narrow, thereby preventing the resistance of the touch pad 250 from increasing. In addition, the extension 273 of the second touch pad layer 270 is allowed to partially include the protrusion 275, thereby preventing the increase in resistance.

[0066] The flexible printed circuit board 310 may overlap the touch pad 250. A flexible printed circuit pad 320 may be provided on the flexible printed circuit board 310. The flexible printed circuit pad 320 may overlap the touch pad 250. The flexible printed circuit pad 320 may overlap the first touch pad layer 260 of the touch pad 250, and may overlap the second touch pad layer 270. The flexible printed circuit pad 320 may be arranged to face the touch pad 250. The flexible printed circuit pad 320 may be arranged to face the second touch pad layer 270 of the touch pad 250. The flexible printed circuit pad 320 is connected to a predetermined circuit provided in the flexible printed circuit board 310. The flexible printed circuit pad 320 may be formed of a metal material. The flexible printed circuit pad 320 may be formed into a rectangle (or a substantially rectangular shape) extending substantially in the second direction Y in a plan view. The flexible printed circuit pad 320 may extend parallel to the extension 273 of the first touch pad layer 260 and the second touch pad layer 270. The flexible printed circuit pad 320 may be formed in a rectangular shape including two short sides parallel to the first direction X and two long sides parallel to the second direction Y. The planar shape of the flexible printed circuit pad 320 may be similar to the planar shape of the first touch pad layer 260. However, this is an example, and the flexible printed circuit pad 320 may have various planar shapes.

[0067] The conductive bonding member 500 is disposed between the touch pad 250 and the flexible printed circuit board 310. The conductive bonding member 500 is disposed between the second touch pad layer 270 of the touch pad 250 and the flexible printed circuit pad 320. In a plan view, the conductive bonding member 500 may overlap the touch pad 250 and the flexible printed circuit pad 320. The conductive bonding member 500 is bonded to the second touch pad layer 270 of the touch pad 250, and the conductive bonding member 500 may be bonded to the flexible printed circuit pad 320. One touch pad 250 may overlap with a plurality of conductive bonding members 500. Therefore, the second touch pad layer 270 and the flexible printed circuit pad 320 may be electrically connected to each other through a plurality of conductive bonding members 500.

[0068] The conductive bonding member 500 may be melt-bonded to the second touch pad layer 270 and the flexible printed circuit pad 320. The melt bonding method will now be described. A touch pad 250 including a first touch pad layer 260 and a second touch pad layer 270 is formed on the package substrate 130, and a flexible printed circuit pad 320 is formed on the flexible printed circuit board 310. A resin including at least one conductive bonding member 500 is applied to the touch pad 250 and the package substrate 130. The flexible printed circuit board 310 is arranged to overlap the conductive bonding member 500 and the touch pad 250. In this case, the conductive bonding member 500 may contact the second touch pad layer 270, and the conductive bonding member 500 may contact the flexible printed circuit pad 320. When heat of 150 degrees Celsius to 170 degrees Celsius is applied to the conductive bonding member 500 and its surroundings, the conductive bonding member 500 may melt and may be bonded to the second touch pad layer 270 disposed below the conductive bonding member 500. Meanwhile, the conductive bonding member 500 may be bonded to the flexible printed circuit pad 320 disposed on the conductive bonding member 500. For example, the conductive bonding member 500 may be bonded to the second touch pad layer 270 and the flexible printed circuit pad 320 by applying heat and melting the conductive bonding member 500.

[0069] The fusion bonding method is an example, and the conductive bonding member 500 can be bonded to the second touch pad layer 270 and the flexible printed circuit pad 320 according to other or additional methods. For example, the conductive bonding member 500 can be ultrasonically bonded to the second touch pad layer 270 and the flexible printed circuit pad 320. The ultrasonic bonding method will now be described. A touch pad 250 including a first touch pad layer 260 and a second touch pad layer 270 is formed on the package substrate 130, and a flexible printed circuit pad 320 is formed on the flexible printed circuit board 310. A resin including at least one conductive bonding member 500 is applied to the touch pad 250 and the package substrate 130. The flexible printed circuit board 310 is arranged to overlap with the conductive bonding member 500 and the touch pad 250. In this case, the conductive bonding member 500 can contact the second touch pad layer 270 and can contact the flexible printed circuit pad 320. Ultrasonic vibration is applied to the conductive bonding member 500 and the surrounding area thereof, thereby causing molecular movement on the contact side between the conductive bonding member 500 and the second touch pad layer 270 and between the conductive bonding member 500 and the flexible printed circuit pad 320. Thus, heat is generated on the contact side between the conductive bonding member 500 and the second touch pad layer 270, so that the conductive bonding member 500 can be bonded to the second touch pad layer 270. Simultaneously, heat can be generated on the contact side between the conductive bonding member 500 and the flexible printed circuit pad 320, so that the conductive bonding member 500 can be bonded to the flexible printed circuit pad 320. In addition, the conductive bonding member 500 can be bonded to the second touch pad layer 270 and the flexible printed circuit pad 320 by various metal bonding methods.

[0070] The conductive bonding member 500 may be circular in a plan view. However, this is an example, and the conductive bonding member 500 may have a variety of modifiable planar shapes. The conductive bonding member 500 may be made of a metal material. For example, the conductive bonding member 500 may be formed of a variety of metal materials (such as at least one of tin (Sn), tin bismuth (Sn-Bi), tin silver (Sn-Ag), tin indium (Sn-In), and indium bismuth (In-Bi)). The conductive bonding member 500 may be made of a metal material that melts at a predetermined temperature. When a fusion bonding method is used, heat corresponding to the melting point of the conductive bonding member 500 is applied, so that the conductive bonding member 500 can be bonded to the second touch pad layer 270 and the flexible printed circuit pad 320. In this case, the temperature of the heat applied to the conductive bonding member 500 is variable according to the material of the conductive bonding member 500.

[0071] According to some embodiments, the resin comprising the conductive bonding member 500 can be configured to reduce the thermal stress and strain caused by the difference in thermal expansion coefficients between the surrounding components (such as the conductive bonding member 500, the flexible printed circuit pad 320, the flexible printed circuit board 310, the extension 273 and the first touch pad layer 260). The resin can also be used to reduce mechanical, impact and vibration stress and strain to further increase the reliability of the electrical connection between the flexible printed circuit board 310 and the first touch pad layer 260. In addition, the resin can be configured to improve the distribution of multiple conductive bonding members 500 between the flexible printed circuit pad 320 and the first touch pad layer 260. In some embodiments, the bottom filling between the conductive bonding members 500 can be additionally (or optionally) utilized.

[0072] When an anisotropic conductive film (ACF) is used instead of a metal material as the conductive bonding member 500, the adhesion may be low and the resistance may also be low. The anisotropic conductive film may be formed by a conductive ball produced by coating a metal film on the surface of a polymer ball. However, as the area of ​​the display area DA increases, the area of ​​the peripheral area PA is relatively reduced, and the size of the touch pad 250 is correspondingly reduced. When an anisotropic conductive film is provided between the touch pad 250 and the flexible printed circuit pad 320 and a compression process is performed, pressure is applied to the conductive ball. When the size of the touch pad 250 is reduced, the pressure applied to the conductive ball may increase, and the conductive ball may be damaged. When the conductive ball is damaged, the conductive ball loses its restoring force and reduces the reliability of the conductive ball.

[0073] According to some exemplary embodiments, reliability is improved by electrically connecting the touch pad 250 and the flexible printed circuit pad 320 via the conductive bonding member 500 made of a metal material. The conductive bonding member 500 and the touch pad 250 are not simply in contact with each other, but the conductive bonding member 500 and the touch pad 250 are bonded to each other by a method such as fusion bonding or ultrasonic bonding, so the adhesion between the conductive bonding member 500 and the touch pad 250 can be increased and the resistance can be reduced. For the above-mentioned bonding, the second touch pad layer 270 in contact with the conductive bonding member 500 can be made of a metal material among the first touch pad layer 260 and the second touch pad layer 270 constituting the touch pad 250. In a similar manner, the conductive bonding member 500 and the flexible printed circuit pad 320 are not simply in contact with each other, but the conductive bonding member 500 and the flexible printed circuit pad 320 are bonded to each other by a method such as fusion bonding or ultrasonic bonding, so the adhesion between the conductive bonding member 500 and the flexible printed circuit pad 320 can be increased and the resistance can be reduced.

[0074] According to various exemplary embodiments, the display panel 100 of the display device may include a substrate 110 and an encapsulation substrate 130 facing the substrate 110, a sealing member 150 may be provided between the substrate 110 and the encapsulation substrate 130 to seal the light emitting device 120 between the substrate 110 and the encapsulation substrate 130, and the touch sensor 200 may be provided on the encapsulation substrate 130, but the embodiment is not limited thereto. Instead of the encapsulation substrate 130 and the sealing member 150, a thin film encapsulation layer may be provided on the substrate 110. In this case, the light emitting device 120 may be provided between the substrate 110 and the thin film encapsulation layer, and the touch sensor 200 may be provided on the thin film encapsulation layer. The thin film encapsulation layer may seal the light emitting device 120 to prevent external moisture and oxygen from penetrating. The thin film encapsulation layer may have a multilayer structure. For example, the thin film encapsulation layer may have a structure in which at least one inorganic film and at least one organic film are stacked.

[0075] Now refer to Figure 6 Display devices according to some exemplary embodiments are described.

[0076] Combination Figure 6 The display device according to some exemplary embodiments described mostly corresponds to the combination of Figures 1 to 5 The display device described herein is different from the touch pad 250 and thus a repeated portion will not be described. A touch pad 250_1 described hereinafter is different from the touch pad 250.

[0077] Figure 6 An enlarged top view of a predetermined area of ​​a display device according to some example embodiments is shown. Figure 6 A touch pad 250_1 and a peripheral side thereof of a touch sensor of a display device according to an exemplary embodiment are illustrated.

[0078] In a similar manner to the exemplary embodiments described above, a display device according to some exemplary embodiments may include a display panel and a touch sensor. Figure 6 As shown in FIG. 1 , the touch sensor includes a touch pad 250_1 , and the touch pad 250_1 includes a first touch pad layer 260 and a second touch pad layer 270_1 . The touch pad 250_1 overlaps the sealing member 150 , the conductive bonding member 500 , and the flexible printed circuit pad 320 .

[0079] In the foregoing exemplary embodiment, the extension portion 273 of the second touch pad layer 270 and the first touch pad layer 260 may extend in parallel. In addition, the second touch pad layer 270 may extend in parallel to the flexible printed circuit pad 320. Figure 6As can be seen in the figure, the extension portion 273_1 of the second touch pad layer 270_1 may extend in an oblique manner relative to the length direction of the first touch pad layer 260. In addition, the extension portion 273_1 of the second touch pad layer 270_1 may extend in an oblique manner relative to the length direction of the flexible printed circuit pad 320. The first touch pad layer 260 and the flexible printed circuit pad 320 may each be formed into a rectangle extending substantially in the second direction Y in a plan view. The extension portion 273_1 of the second touch pad layer 270_1 may be formed to have a strip shape extending in an oblique manner relative to the second direction Y. The second touch pad layer 270_1 may include a plurality of extension portions 273_1. In this case, the plurality of extension portions 273_1 may extend parallel to each other.

[0080] When the extension portion 273_1 of the second touch pad layer 270_1 extends in an oblique manner relative to the first touch pad layer 260, the contact area between the first touch pad layer 260 and the second touch pad layer 270_1 is increased, thereby reducing the resistance, compared with the case where the extension portion 273_1 extends parallel to the first touch pad layer 260. In a similar manner, when the extension portion 273_1 of the second touch pad layer 270_1 extends in an oblique manner relative to the flexible printed circuit pad 320, the bonding area between the second touch pad layer 270_1 and the conductive bonding member 500 can be increased, compared with the case where the extension portion 273_1 extends parallel to the flexible printed circuit pad 320. Therefore, the resistance between the second touch pad layer 270_1 and the flexible printed circuit pad 320 can be reduced.

[0081] Now refer to Figure 7 Display devices according to some exemplary embodiments are described.

[0082] Combination Figure 7 The display device according to some exemplary embodiments described mostly corresponds to the combination of Figures 1 to 5 The display device described above is described in detail, and thus a repeated part will not be described. A touch pad 250_2 described below has a different shape from the touch pad 250.

[0083] Figure 7 An enlarged top view of a predetermined area of ​​a display device according to some example embodiments is shown. Figure 7 A touch pad 250_2 and a peripheral side thereof of a touch sensor of a display device according to an exemplary embodiment are illustrated.

[0084] In a similar manner to the previous exemplary embodiments, a display device according to some exemplary embodiments may include a display panel and a touch sensor. Figure 7As shown in FIG. 1 , the touch sensor includes a touch pad 250_2 , and the touch pad 250_2 includes a first touch pad layer 260 and a second touch pad layer 270_2 . The touch pad 250_2 overlaps the sealing member 150 , the conductive bonding member 500 , and the flexible printed circuit pad 320 .

[0085] In the foregoing exemplary embodiment, the second touch pad layer 270 may include a plurality of extensions 273, and the plurality of extensions 273 may extend parallel to each other. Figure 7 As can be seen in FIG. 2 , the second touch pad layer 270_2 may include a plurality of extensions 273_2, and the plurality of extensions 273_2 may extend in different directions. The second touch pad layer 270_2 may include a plurality of extensions 273_2. As the extension 273_2 becomes farther from the second portion 272, the distance between the plurality of extensions 273_2 may become larger. However, this is an example, and as the extension 273_2 becomes farther from the second portion 272, the distance between the plurality of extensions 273_2 may decrease. In another example, as the extension 273_2 approaches the middle area between the first portion 271 and the second portion 272, the distance between the plurality of extensions 273_2 may become larger, and as the extension 273_2 approaches the first portion 271 and the second portion 272, the distance between the plurality of extensions 273_2 may become smaller. The plurality of extensions 273_2 may extend in an inclined manner relative to the first touch pad layer 260. However, this is an example, and some of the plurality of extensions 273_2 may extend in parallel with the first touch pad layer 260, and other of the plurality of extensions 273_2 may extend in an inclined manner relative to the first touch pad layer 260. In addition, the plurality of extensions 273_2 may extend in an inclined manner relative to the flexible printed circuit pad 320. However, this is an example, and some of the plurality of extensions 273_2 may extend in parallel with the flexible printed circuit pad 320, and other of the plurality of extensions 273_2 may extend in an inclined manner relative to the flexible printed circuit pad 320.

[0086] Now refer to Figure 8 Display devices according to some exemplary embodiments are described.

[0087] Combination Figure 8 The display device according to some exemplary embodiments described mostly corresponds to the combination of Figures 1 to 5 The display device described above is described in detail, and thus a repeated part will not be described. A touch pad 250_3 described below has a different shape from the touch pad 250.

[0088] Figure 8 An enlarged top view of a predetermined area of ​​a display device according to some example embodiments is shown. Figure 8 A touch pad 250_3 and a peripheral side thereof of a touch sensor of a display device according to an exemplary embodiment are illustrated.

[0089] In a similar manner to the previous exemplary embodiments, a display device according to some exemplary embodiments includes a display panel and a touch sensor. Figure 8 As shown in FIG. 1 , the touch sensor includes a touch pad 250_3 , and the touch pad 250_3 includes a first touch pad layer 260 and a second touch pad layer 270_3 . The touch pad 250_3 overlaps the sealing member 150 , the conductive bonding member 500 , and the flexible printed circuit pad 320 .

[0090] In the foregoing exemplary embodiment, the second touch pad layer 270 may include two extensions 273. Figure 8 As can be seen in FIG. 1 , the second touch pad layer 270_3 may include three extensions 273_3. Since the second touch pad layer 270_3 includes three extensions 273_3, the resistance may be reduced by increasing the contact area between the first touch pad layer 260 and the second touch pad layer 270_3, compared with the case where the touch pad 250 includes two extensions 273. In a similar manner, since the second touch pad layer 270_3 includes three extensions 273_3, the bonding area between the second touch pad layer 270_3 and the conductive bonding member 500 may be increased, compared with the case where the second touch pad layer 270 includes two extensions 273. Thus, the resistance between the second touch pad layer 270_3 and the flexible printed circuit pad 320 may be reduced.

[0091] In a manner similar to the previous exemplary embodiment, the plurality of extensions 273_3 of the second touch pad layer 270_3 may extend in parallel to the first touch pad layer 260 and the flexible printed circuit pad 320, and / or the extensions 273_3 may extend in an oblique direction. In addition, some of the plurality of extensions 273_3 of the second touch pad layer 270_3 may extend in an oblique manner relative to the first touch pad layer 260 and the flexible printed circuit pad 320. In addition, the extensions (such as at least one of the extensions 273_1, 273_2, and 273_3) of the second touch pad layer (such as at least one of the second touch pad layers 270_1, 270_2, and 270_3) may include a protrusion.

[0092] Although specific exemplary embodiments and implementations have been described herein, other embodiments and modifications will be apparent from this description. Therefore, the inventive concept is not limited to such embodiments, but is limited to the broader scope of the appended claims and various modifications and equivalent arrangements as will be apparent to those of ordinary skill in the art.

Claims

1. Touch sensor, including: touch sensing area; A touch sensing electrode, located in the touch sensing area; A touch extension wiring extending to the touch sensing electrode; A touch pad, located on one end of the touch extension wiring; A flexible printed circuit board, overlapping the touch pad; A flexible printed circuit pad, located on the flexible printed circuit board and facing the touch pad; as well as a conductive bonding member located between the touch pad and the flexible printed circuit pad, the conductive bonding member being bonded to each of the touch pad and the flexible printed circuit pad, Wherein, the touch pad comprises: A first touch pad layer made of transparent metal oxide; and a second touch pad layer, located on the first touch pad layer, the second touch pad layer being made of a metal material, and Wherein, the conductive bonding member is bonded to the second touch pad layer.

2. The touch sensor according to claim 1, wherein: The conductive bonding member is made of a metal material; and The conductive bonding member is melt-bonded or ultrasonically bonded to each of the touch pad and the flexible printed circuit pad.

3. The touch sensor according to claim 1, wherein: The second touch pad layer comprises: a first portion and a second portion, the first portion and the second portion being separate from each other; and An extension portion extends to the first portion and the second portion.

4. The touch sensor according to claim 3, wherein: The extending portion of the second touch pad layer is narrower than the first touch pad layer.

5. The touch sensor according to claim 4, wherein: The extending portion of the second touch pad layer and the flexible printed circuit pad extend parallel to each other.

6. The touch sensor according to claim 4, wherein: The extending portion of the second touch pad layer extends in a direction inclined with respect to a length direction of the flexible printed circuit pad.

7. The touch sensor according to claim 4, wherein: The second touch pad layer includes a plurality of extension portions, and the extension portion is one of the plurality of extension portions.

8. The touch sensor according to claim 7, wherein: The plurality of extensions extend parallel to each other.

9. The touch sensor according to claim 7, wherein: At least one of the plurality of extensions extends in a different direction from another one of the plurality of extensions.

10. A display device comprising: a substrate including a touch sensing area; A light emitting device, located on the substrate; A packaging structure, located on the light-emitting device; A touch sensing electrode located on the packaging structure in the touch sensing area; A touch extension wiring extending to the touch sensing electrode; A touch pad, located on one end of the touch extension wiring; A flexible printed circuit board, overlapping the touch pad; A flexible printed circuit pad, located on the flexible printed circuit board and facing the touch pad; as well as a conductive bonding member located between the touch pad and the flexible printed circuit pad, the conductive bonding member being bonded to each of the touch pad and the flexible printed circuit pad, Wherein, the touch pad comprises: A first touch pad layer made of transparent metal oxide; and a second touch pad layer, located on the first touch pad layer, the second touch pad layer being made of a metal material, and Wherein, the conductive bonding member is bonded to the second touch pad layer.

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