Optical Element Driving Mechanism

Abstract

The present invention discloses an optical element driving mechanism, which includes an upper cover, an upper reed, a magnet group, a carrier, a lower reed, a base, a ball, a bottom circuit board and a base. The upper reed movably connects the carrier to the upper cover, and the lower reed movably connects the carrier to the base. The bottom circuit board is installed on the base and fixedly connected to the base. The base is used to install a chip and is movably connected to the base through a ball. Among them, the carrier is provided with a first set of coils, the bottom circuit board is provided with a second set of coils, and the magnet group is fixedly installed on the upper cover and cooperates with the first set of coils to drive the movement of the carrier and cooperates with the second set of coils to drive the movement of the base. The present invention realizes optical zoom and optical anti-shake through the movement of different components, and solves the problem of photo blurring caused by hand shaking during shooting.

Description

Technical Field

[0001] The present invention relates to the field of optical drive, and particularly to an optical element drive mechanism. Background Art

[0002] With the development of technology, many current electronic devices (such as smart phones or digital cameras) have the functions of taking photos or videos. The use of these electronic devices is becoming more and more common, and they are developing towards a convenient, thin and light design direction to provide users with more choices. However, during the current mobile phone shooting process, sometimes the photos taken are blurry, that is, the captured picture is not clear enough, and even double images or blurring occur. These reasons, in addition to occasional out-of-focus (that is, the camera fails to focus normally), are largely due to slight jitter during the exposure of the photographed scene.

[0003] Generally speaking, this kind of slight jitter phenomenon often occurs under handheld conditions, which will cause the lens of the imaging device to deviate, resulting in deterioration of the image quality captured by the image sensor. Therefore, in recent years, the demand for the development of anti-shake technology functions is relatively large.

[0004] However, most of the existing technologies achieve optical zoom and optical anti-shake functions through the movement of the same component (carrier). The movement range of the carrier is limited by weight, volume, etc., and it is impossible to effectively solve the problem of blurry photos caused by hand jitter during the shooting process. Summary of the Invention

[0005] The object of the present invention is to provide an optical element drive mechanism, so as to realize optical zoom and optical anti-shake through the movement of different components, thereby solving the problem of blurry photos caused by hand jitter during the shooting process.

[0006] To solve the above problems, according to one aspect of the present invention, an optical element drive mechanism is provided. The optical element drive mechanism includes an upper cover, an upper spring piece, a magnet group, a carrier, a lower spring piece, a base, a ball, a bottom circuit board and a base. The upper spring piece movably connects the carrier to the upper cover, the lower spring piece movably connects the carrier to the base, the bottom circuit board is installed on the base and fixedly connected to the base, the base is used for installing a chip and is movably connected to the base through the ball. Among them, the carrier is provided with a first group of coils, the bottom circuit board is provided with a second group of coils, and the magnet group is fixedly installed on the upper cover and cooperates with the first group of coils to drive the movement of the carrier and cooperates with the second group of coils to drive the movement of the base.

[0007] In one embodiment, the upper cover further has an embedded metal sheet. The middle part of the upper cover has a central opening of the upper cover to cooperate with the optical element. A magnet mounting portion is provided around the central opening of the upper cover. The magnet group is mounted on the magnet mounting portion. The embedded metal sheet of the upper cover includes a magnet cooperation portion. The magnet cooperation portion is arranged on the magnet mounting portion and above the magnet group.

[0008] In one embodiment, the embedded metal sheet of the upper cover further includes a sensor connection portion, a circuit introduction portion, and an external circuit connection portion. The external circuit connection portion and the circuit introduction portion are electrically connected to the sensor connection portion.

[0009] In one embodiment, the upper cover has a magnet metal sheet. The magnet metal sheet is fixedly connected to the upper cover. The magnet group is mounted on the side surface of the magnet metal sheet.

[0010] In one embodiment, the upper cover has four magnet metal sheets. The four magnet metal sheets are respectively fixedly mounted on the inner walls of the four side portions of the upper cover. The magnet group includes four magnets and is respectively fixedly mounted on the side surfaces of the four magnet metal sheets.

[0011] In one embodiment, the magnet metal sheet includes a main body plate-shaped portion, a buckle portion extending from the top of the main body plate-shaped portion to one side, and an embedding portion extending from the top of the main body plate-shaped portion to the other side. The embedding portion is embedded into the upper cover to fixedly connect the magnet metal sheet to the upper cover, and the buckle portion is used to clamp the magnet group.

[0012] In one embodiment, the base has an embedded metal sheet of the base and a ball mounting groove. The balls are mounted in the ball mounting groove. The embedded metal sheet of the base is arranged in the base and has a ball combination portion. The ball combination portion is arranged in the ball mounting groove of the base and contacts the balls.

[0013] In one embodiment, the carrier has a damping rubber groove. An avoidance hole is provided inside the ball combination portion of the embedded metal sheet of the base. An upward-extending protruding piece is provided adjacent to the avoidance hole. The protruding piece cooperates with the damping rubber groove at the bottom of the carrier and extends into the damping rubber groove to buffer the movement of the carrier.

[0014] In one embodiment, the embedded metal sheet of the base has four such protruding pieces, and the carrier has four damping rubber grooves. One such protruding piece is arranged in each damping rubber groove.

[0015] In one embodiment, the base integrally forms a rectangular structure and includes a bottom plate and side portions integrally protruding upward from the four peripheries of the bottom plate. A base center hole is formed in the middle of the bottom plate to cooperate with a lens. Protrusions are formed at the four corners of the bottom plate, and the protrusions cooperate with the upper cover. Magnet avoidance holes are provided on the inner sides of the side portions, and the magnet avoidance holes correspond to and cooperate with the second set of coils in the bottom circuit board and the lower surface of the magnet group, so that the lower surface of the magnet group directly faces the second set of coils in the circuit board.

[0016] According to another aspect of the present invention, an upper cover of an optical element driving mechanism is further provided. The optical element driving mechanism includes the upper cover, an upper reed, a magnet group, a carrier, a lower reed, a base, a ball, a bottom circuit board, and a base.

[0017] The upper reed movably connects the carrier to the upper cover, the lower reed movably connects the carrier to the base. The bottom circuit board is mounted on the base and fixedly connected to the base. The base is used to mount a chip and is movably connected to the base through the ball. The carrier is provided with a first set of coils, the bottom circuit board is provided with a second set of coils, and the magnet group is fixedly mounted on the upper cover and cooperates with the first set of coils to drive the movement of the carrier and cooperates with the second set of coils to drive the movement of the base, wherein the upper cover is further provided with an upper cover embedded metal sheet.

[0018] In one embodiment, a center opening of the upper cover is provided in the middle to cooperate with an optical element. A magnet mounting portion is provided around the center opening of the upper cover, and the magnet group is mounted on the magnet mounting portion. The upper cover embedded metal sheet includes a magnet cooperation portion, and the magnet cooperation portion is disposed on the magnet mounting portion and arranged above the magnet group.

[0019] In one embodiment, the upper cover embedded metal sheet further includes a sensor connection portion, a circuit introduction portion, and an external circuit connection portion, and the external circuit connection portion and the circuit introduction portion are electrically connected to the sensor connection portion.

[0020] In one embodiment, the magnet cooperation portion is independent of the sensor connection portion, the circuit introduction portion, and the external circuit connection portion.

[0021] In one embodiment, one end of the circuit introduction portion is electrically connected to the sensor connection portion, and the other end of the circuit introduction portion is electrically connected to the upper reed.

[0022] In one embodiment, the end of the circuit introduction portion connected to the upper reed and the end connected to the sensor connection portion are lower than the middle main body portion of the circuit introduction portion in the height direction.

[0023] In one embodiment, the upper cover embedded with a metal sheet includes four magnet engaging portions, and the magnet group includes four magnets, and the four magnet engaging portions are respectively located above the four magnets.

[0024] In one embodiment, the upper cover embedded with a metal sheet includes two circuit introduction portions, and the two circuit introduction portions are arranged at diagonal positions and are respectively electrically connected to the two circuit access portions of the upper spring piece.

[0025] In one embodiment, the external circuit connection portion is bent 180 degrees to be connected to the sensor connection portion, and one of the magnet engaging portions is arranged within the area surrounded by the bending of the external circuit connection portion.

[0026] In one embodiment, the inner surface of the upper cover is provided with an upper spring piece fixing portion, and the circuit introduction portion of the base embedded with a metal sheet is located within the upper spring piece fixing portion.

[0027] According to another aspect of the present invention, there is also provided an upper cover of an optical element driving mechanism, and the optical element driving mechanism includes the upper cover, an upper spring piece, a magnet group, a carrier, a lower spring piece, a base, a ball, a bottom circuit board, and a base.

[0028] The upper spring piece movably connects the carrier to the upper cover, the lower spring piece movably connects the carrier to the base, the bottom circuit board is mounted on the base and fixedly connected to the base, the base is used for mounting a chip and is movably connected to the base through the ball, the carrier is provided with a first set of coils, the bottom circuit board is provided with a second set of coils, and the magnet group is fixedly mounted on the upper cover and cooperates with the first set of coils to drive the movement of the carrier and cooperates with the second set of coils to drive the movement of the base, wherein

[0029] The upper cover is provided with a magnet metal sheet, the magnet metal sheet is fixedly connected to the upper cover, and the magnet group is mounted on the side surface of the magnet metal sheet.

[0030] In one embodiment, the upper cover is provided with four magnet metal sheets, the four magnet metal sheets are respectively fixedly mounted on the inner walls of the four side portions of the upper cover, and the magnet group includes four magnets and is respectively fixedly mounted on the side surfaces of the four magnet metal sheets.

[0031] In one embodiment, the magnet metal sheet includes a main body plate portion, a buckle portion extending from the top of the main body plate portion to one side, and an embedding portion extending from the top of the main body plate portion to the other side, the embedding portion is embedded into the upper cover to fixedly connect the magnet metal sheet to the upper cover, and the buckle portion is used for clamping the magnet group.

[0032] In one embodiment, two snap portions are integrally formed on the top of the main body plate portion, and the embedding portion extends out from a position between the two snap portions to the other side.

[0033] In one embodiment, the snap portions and the embedding portion first extend upward from the top of the main body plate portion by a certain distance and then extend to both sides respectively, wherein the height that the snap portion protrudes upward is lower than the height that the embedding portion protrudes upward.

[0034] In one embodiment, the embedding portion extends vertically upward by a first distance d1 and then extends in a first direction, and the snap portion extends vertically upward by a second distance d2 and then extends in a second direction, wherein the first distance d1 is greater than the second distance d2, and the first direction is opposite to the second direction.

[0035] In one embodiment, the height of the main body plate portion of the magnet metal sheet is less than the height of the magnet. When the magnet is mounted on the magnet metal sheet, a part of the bottom of the magnet protrudes out of the magnet metal sheet.

[0036] In one embodiment, a center opening of the upper cover is provided in the middle of the upper cover to cooperate with the optical element. A magnet mounting portion is provided around the center opening of the upper cover, and the magnet group is mounted on the magnet mounting portion.

[0037] In one embodiment, the upper cover further includes an inlaid metal sheet of the upper cover. The inlaid metal sheet of the upper cover includes a magnet mating portion, and the magnet mating portion is disposed on the magnet mounting portion and arranged above the magnet group.

[0038] In one embodiment, a fixing portion for the upper spring piece is provided on the inner surface of the upper cover. The inlaid metal sheet of the upper cover includes a circuit introducing portion, and the circuit introducing portion is disposed in the fixing portion for the upper spring piece.

[0039] According to another aspect of the present invention, a base of an optical element driving mechanism is further provided. The optical element driving mechanism includes an upper cover, an upper spring piece, a magnet group, a carrier, a lower spring piece, the base, a ball, a bottom circuit board, and a base.

[0040] The upper spring piece movably connects the carrier to the upper cover, the lower spring piece movably connects the carrier to the base. The bottom circuit board is mounted on the base and fixedly connected to the base. The base is used to mount a chip and is movably connected to the base through the ball. The carrier is provided with a first set of coils, the bottom circuit board is provided with a second set of coils, and the magnet group is fixedly mounted on the upper cover and cooperates with the first set of coils to drive the movement of the carrier and cooperates with the second set of coils to drive the movement of the base, wherein

[0041] The base is provided with an embedded metal sheet in the base and a ball mounting groove. The balls are mounted in the ball mounting groove. The embedded metal sheet in the base is arranged in the base and is provided with a ball engaging portion. The ball engaging portion is arranged in the ball mounting groove of the base and contacts the balls.

[0042] In one embodiment, each corner of the lower surface of the base is provided with a ball mounting groove, and the embedded metal sheet in the base is provided with a ball engaging portion at a position corresponding to each ball mounting groove.

[0043] In one embodiment, an avoidance hole is provided inside the ball engaging portion of the embedded metal sheet in the base, and a protruding piece extending upward is provided adjacent to the avoidance hole. The protruding piece cooperates with the damping rubber groove at the bottom of the carrier and extends into the damping rubber groove to buffer the movement of the carrier.

[0044] In one embodiment, the embedded metal sheet in the base is provided with four protruding pieces, and the carrier is provided with four damping rubber grooves, and one protruding piece is arranged in each damping rubber groove.

[0045] In one embodiment, the ball engaging portion is arranged as a rectangular thin sheet, and the length and width of the rectangular thin sheet are equal to or greater than the diameter of the ball.

[0046] In one embodiment, the ball engaging portion is arranged as a circular thin sheet, and the diameter of the circular thin sheet is equal to or greater than the diameter of the ball.

[0047] In one embodiment, the base integrally forms a rectangular structure and includes a bottom plate and side portions integrally extending upward from the four sides of the bottom plate. A base center hole is formed in the middle of the bottom plate to cooperate with the lens, and convex portions are formed at the four corners of the bottom plate. The convex portions cooperate with the upper cover.

[0048] In one embodiment, a lower spring fixing post integrally extending upward from the bottom plate is provided inside the convex portion, and the lower spring fixing post is fixedly connected to the lower spring.

[0049] In one embodiment, a magnet avoidance hole is provided inside the side portion, and the magnet avoidance hole corresponds to and cooperates with the second set of coils in the bottom circuit board and the lower surface of the magnet group, so that the lower surface of the magnet group directly faces the second set of coils in the circuit board.

[0050] In one embodiment, the magnet group includes four magnets, and the base is provided with four magnet avoidance holes around the base center hole.

[0051] According to another aspect of the present invention, a carrier of an optical element driving mechanism is further provided. The optical element driving mechanism includes an upper cover, an upper reed, a magnet group, the carrier, a lower reed, a base, balls, a bottom circuit board, and a base

[0052] The upper reed movably connects the carrier to the upper cover, the lower reed movably connects the carrier to the base, the bottom circuit board is mounted on the base and fixedly connected to the base, the base is used for mounting a chip and is movably connected to the base through the balls. The carrier is provided with a first set of coils, the bottom circuit board is provided with a second set of coils, and the magnet group is fixedly installed on the upper cover and cooperates with the first set of coils to drive the movement of the carrier and cooperates with the second set of coils to drive the movement of the base, wherein

[0053] The base is provided with a base-embedded metal sheet, and the carrier is provided with a damping glue groove. The base-embedded metal sheet is provided with a protruding piece, and the protruding piece is installed in the damping glue groove.

[0054] In one embodiment, a plurality of carrier damping glue grooves are arranged at the bottom of the carrier, and the plurality of carrier damping glue grooves are uniformly arranged around the opening of the center of the carrier.

[0055] In one embodiment, the carrier is provided with a lens mounting hole for mounting a lens. Four carrier side parts and four carrier corner parts are formed around the lens mounting hole. The upper surface of the carrier is movably connected to the upper cover through an upper reed, and the lower surface of the carrier is movably connected to the base through the lower reed.

[0056] In one embodiment, the upper surface of the carrier is provided with an upper reed connection column, and the upper reed carrier fixing part of the upper reed is fixedly connected to the upper reed connection column.

[0057] In one embodiment, a coil mounting groove is arranged around the carrier, and a first set of coils is arranged in the coil mounting groove. The first set of coils corresponds to and cooperates with the magnet group to drive the carrier to move along the optical axis direction when the first set of coils is energized.

[0058] In one embodiment, the upper surface of the carrier is further provided with a carrier upper limit part that extends upward integrally to prevent the upper surface of the carrier from directly colliding with the upper cover during movement.

[0059] In one embodiment, a side sensor magnet mounting groove is further arranged on the side part of the carrier. The side sensor magnet mounting groove is used for mounting a side sensor magnet and cooperating with a side sensor to detect the displacement of the carrier in the optical axis direction.

[0060] In one embodiment, a wire winding post is further provided on the side of the carrier, and the end of the first group of coils is arranged on the wire winding post.

[0061] In one embodiment, the carrier damping rubber groove is arranged at the bottom of the carrier and extends upward for a certain distance, and the width of the carrier damping rubber groove is greater than the width of the protruding piece of the metal sheet embedded in the base.

[0062] In one embodiment, a carrier lower limit portion extending integrally downward is further provided on the lower surface of the carrier to prevent the lower surface of the carrier from directly colliding with the base during movement.

[0063] The optical element driving mechanism of the present application realizes optical anti-shake by driving the chip through the base, and creatively utilizes the ball in the moving chip solution. Since the base and the base are connected by the ball, the strength of the entire component can be strengthened, and by arranging the metal sheet and the gasket in the ball mounting groove and the ball mounting portion for mounting the ball, the ball does not directly contact the base and the base, but contacts the metal sheet and the gasket, reducing the wear of the base and the base and extending the service life of the mechanism. Description of the Drawings

[0064] Figure 1 is a perspective view of the optical element driving mechanism according to an embodiment of the present invention.

[0065] Figure 2 is Figure 1 a perspective view of the base of

[0066] Figure 3 is Figure 1 a bottom view of the base of

[0067] Figure 4 is Figure 1 a perspective view of the metal sheet embedded in the base of

[0068] Figure 5 is Figure 1 a bottom view of the circuit board of

[0069] Figure 6 is Figure 1 a perspective view of the base of

[0070] Figure 7 is Figure 1 a top view of the component formed by mounting the circuit board on the base of

[0071] Figure 8 is Figure 1 a perspective view of the carrier of

[0072] Figure 9 is a top view of the component formed by mounting the upper spring piece on the carrier.

[0073] Figure 10A It is a bottom view of the upper cover with a metal sheet embedded in the upper cover.

[0074] Figure 10B It is a perspective view of the metal sheet with a magnet embedded in the upper cover.

[0075] Figure 11 It is a bottom view of the lens driving mechanism according to an embodiment of the present invention, wherein the base, the pedestal and the circuit board are not installed.

[0076] Figure 12 It is a top view of the lens driving mechanism according to an embodiment of the present invention.

[0077] Figure 13 It is Figure 12 A cross-sectional view of the lens driving mechanism taken along line A-A.

[0078] Figure 14 It is Figure 12 A cross-sectional view of the lens driving mechanism taken along line C-C.

[0079] Figure 15 It is Figure 1 A top view of the carrier in cooperation with the pedestal.

[0080] Figure 16 It is Figure 15 A cross-sectional view of the component taken along line B-B.

[0081] Figure 17 - 18 It is a perspective view of the metal sheet with a magnet installed according to an embodiment of the present invention from different perspectives.

[0082] Figure 19 It is a perspective view of the metal sheet without a magnet installed according to an embodiment of the present invention.. Detailed Description of the Embodiment

[0083] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings so as to more clearly understand the purpose, features and advantages of the present invention. It should be understood that the embodiments shown in the drawings are not limitations on the scope of the present invention, but are only for illustrating the essential spirit of the technical solution of the present invention.

[0084] In the following description, certain specific details are set forth in order to provide a thorough understanding of various disclosed embodiments. However, one or more of these specific details may be omitted by those skilled in the relevant art. In other instances, well-known devices, structures and techniques associated with the present application may not be shown or described in detail so as to avoid unnecessarily obscuring the description of the embodiments.

[0085] References to "one embodiment" or "an embodiment" in the course of this specification mean that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Additionally, the particular features, structures, or characteristics may be combined in any manner in one or more embodiments.

[0086] In the following description, for the purpose of clearly showing the structure and working mode of the present invention, many directional terms will be used for description. However, terms such as "front", "rear", "left", "right", "outer", "inner", "outward", "inward", "up", "down", etc. should be understood as convenient terms and not as limiting terms.

[0087] This application generally relates to an optical element driving mechanism, which can be used in terminal products such as mobile phones and tablet computers to cooperate with a lens to achieve functions such as taking pictures and videos. The optical element driving mechanism may include an upper cover, an upper spring piece, a magnet group, a carrier, a lower spring piece, a base, a ball, a bottom circuit board, and a base. The upper spring piece movably connects the carrier to the upper cover, and the lower spring piece movably connects the carrier to the base. The bottom circuit board is installed on the base and fixedly connected to the base. The base is used to install a chip and is movably connected to the base through a ball. The carrier is provided with a first set of coils, and the bottom circuit board is provided with a second set of coils. The magnet group is fixedly installed on the upper cover and cooperates with the first set of coils to drive the movement of the carrier, for example, moving along the optical axis direction to achieve the optical zoom function, and cooperating with the second set of coils to drive the movement of the base, for example, moving on a plane perpendicular to the optical axis direction or rotating around two mutually perpendicular axes perpendicular to the optical axis to achieve the optical image stabilization function. Some embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be understood that these embodiments are exemplary and are intended to facilitate the understanding of the present invention.

[0088] Figure 1 is a perspective view of an optical element driving mechanism 100 according to an embodiment of the present invention. As Figure 1As shown in the figure, the optical element driving mechanism 100 includes an upper cover 10, a metal sheet embedded in the upper cover 11, an upper reed 20, a magnet group 30, an electronic component 31, a carrier 40, a lower reed 50, a base 60, a metal sheet embedded in the base 61, a ball 70, a gasket 71, a circuit board 80, and a base 90. The metal sheet embedded in the upper cover 11 is disposed within the upper cover 10, the metal sheet embedded in the base 61 is disposed within the base 60, the electronic component 31 is disposed on the inner surface of the upper cover 10 and is electrically connected to the metal sheet embedded in the upper cover 11. The carrier 40 is used to carry an optical element such as a camera and is movably mounted on the base 60. The circuit board is fixedly mounted on the base 90. The carrier 40 is provided with a first set of coils, the circuit board 80 is provided with a second set of coils, the base 90 is used to mount an imaging chip and is movably connected to the base 60 through the ball 70, the base 90 and the carrier 40 are movably connected through the lower reed 50, the upper cover 10 and the carrier 40 are movably connected through the upper reed 20. The magnet group 30 is disposed on the base 60 and cooperates with the first set of coils to drive the carrier 40 to move along the optical axis direction to achieve functions such as autofocus, and cooperates with the second set of coils to drive the base 90 to move in a plane perpendicular to the optical axis or rotate around two mutually perpendicular axes perpendicular to the optical axis, so as to achieve the optical image stabilization function.

[0089] The movement mode of the optical element driving device of the present application is different from that of the conventional optical element driving device. The conventional optical element driving device realizes optical zoom by driving the carrier to move along the optical axis direction, and realizes optical image stabilization by driving the carrier to move in a plane perpendicular to the optical axis. While the present application realizes optical zoom by driving the carrier to move along the optical axis direction, and realizes optical image stabilization by driving the base to drive the chip on the base to move in a plane perpendicular to the optical axis. The chip here mainly refers to the imaging chip. Since the moving parts for zooming and the moving parts for optical image stabilization are different, a larger range of movement can be achieved, and better zooming and image stabilization effects can be obtained, thereby obtaining better imaging quality.

[0090] In addition, the base and the base of the present application are connected by balls. In other words, the base is supported on the base by balls. Therefore, the base can move relative to the base and the carrier connected to the base in a larger range, realizing a better image stabilization function. In addition, by connecting the base and the base and the carrier connected to the base with balls, the phenomenon of hysteresis can be avoided, and it has the advantages of stable imaging and fast imaging time. Among them, the balls can be made of, for example, ceramics or rigid materials.

[0091] Figure 2 Yes Figure 1 is a perspective view of the base 60 of Figure 3 Yes Figure 1 is a bottom view of the base 60 of Figure 2 - 3As shown, the base 60 integrally forms a rectangular structure and includes a bottom plate 62 and side portions 63 that integrally project upward from the four peripheries of the bottom plate 62. A base center hole 621 is formed in the middle of the bottom plate 62 to cooperate with the lens. Base protrusions 622 are formed at the four corners of the bottom plate 62. Lower spring fixing posts 623 that integrally project upward from the bottom plate 62 are provided inside the base protrusions 622. The lower spring fixing posts 623 are used for fixedly connecting with the lower spring. Magnet avoidance holes 631 are provided inside the side portions 63. The magnet avoidance holes 631 correspond and cooperate with the lower surface of the second set of coils and the magnet group 50 inside the circuit board 80, such that the lower surface of the magnet group 50 directly faces the second set of coils inside the circuit board to provide a greater anti-shake driving force.

[0092] Referring to Figure 3 , a ball mounting groove 632 is provided at each corner of the lower surface of the base 60. The balls 70 are mounted in the ball mounting grooves 632. As Figure 1 - 3 shown, in this embodiment, the magnet group 50 altogether includes four magnets. Correspondingly, the base 60 is provided with four magnet avoidance holes 631 around the base center hole 621. However, those skilled in the art can understand that in other embodiments, the magnet group 50 can include two magnets, three magnets, etc. Correspondingly, three or four magnet avoidance holes can also be provided on the base 60. That is to say, the number of magnets included in the magnet group 50 and the number of magnet avoidance holes are not limited herein, and appropriate numbers of magnets and magnet avoidance holes can be selected according to specific situations.

[0093] Figure 4 is a perspective view of the base embedded metal sheet 61 in an embodiment of the present application. As Figure 4 shown, the base embedded metal sheet 61 is disposed inside the base 60 and is provided with ball combining portions 611 at the four corners. The ball combining portions 611 are arranged in the ball mounting grooves 632 of the base 60 and are in contact with the balls 70. Optionally, the ball combining portions 611 are set to be rectangular, and the length and width of this rectangular thin sheet are approximately equal to or slightly larger than the diameter of the balls, or the ball combining portions 611 are set to be circular thin sheets, and the diameter of this circular thin sheet is approximately equal to or larger than the diameter of the balls. A material reduction hole 612 is provided inside the ball combining portions 611. An outstanding piece 613 that extends upward is provided adjacent to the material reduction hole 612. The outstanding piece 613 cooperates with the damping glue groove at the bottom of the carrier 40 and extends into the damping glue groove, playing a role in buffering the movement of the carrier 40.

[0094] Figure 5It is a bottom view of the circuit board 80. The circuit board 80 is installed on the base 90 and integrally forms a rectangular structure. Four corners of the rectangular structure form notches 83 to avoid the ball mounting parts of the base 60. A circuit board center hole 81 is provided in the middle of the circuit board 80. The circuit board center hole 81 cooperates with the base center hole 621 of the base 60 and is provided with a plurality of circuit conduction parts 82 along the circumference. One or more electronic components 31 (see Figure 1 ) can also be provided on one surface of the circuit board 80. The electronic components 31 can be electrically connected to the circuit conduction parts 82, for example. The circuit board 80 is also provided with a base positioning hole 85, and the base positioning hole 85 cooperates with the circuit board positioning posts on the base 90, so as to fix the circuit board 80 to the upper surface of the base 90.

[0095] Figure 6 It is a perspective view of the base 90 of an embodiment of the present application. As Figure 6 shown, the base 90 integrally forms a rectangular structure and is provided with a chip mounting hole 91 in the middle to mount a chip. The chip mainly refers to an imaging chip. The light entering through the optical element generates an image on the chip. Four corners of the base 90 are provided with ball mounting parts 92. The ball mounting parts 92 cooperate with the ball mounting grooves 632 on the base 60 to mount the balls 70. The balls 70 are arranged in the ball mounting grooves 632 and the ball mounting parts 92. It should be noted that the ball mounting parts 92 here are only terms used for convenient description, and it can specifically be in the form of grooves, sinking parts, round holes, etc. A gasket 71 is arranged in each ball mounting part 92. The gasket 71 can be made of the same material as the embedded metal sheet 61 of the base, for example.

[0096] Figure 7 It is a top view of the assembly formed by installing the circuit board 80 on the base 90. As Figure 7 shown, the four notches 83 of the circuit board 80 avoid the ball mounting parts 92 of the base 90. The positioning holes 85 of the circuit board 80 cooperate with the positioning posts 93 on the base 90, so as to fixedly install the circuit board 80 on the base 90.

[0097] Figure 8 It is a perspective view of the carrier 40. As Figure 8 shown, the carrier 40 is provided with a lens mounting hole 41 to mount a lens. Four carrier side parts and four carrier corner parts are formed around the lens mounting hole 41. Define the surface of the carrier 40 facing the housing as the upper surface and the surface facing the base as the lower surface. Then the upper surface of the carrier 40 is movably connected to the upper cover 10 through the upper spring piece 20, and the lower surface of the carrier 40 is movably connected to the base 60 through the lower spring piece 50. Specifically, the upper surface of the carrier 40 is provided with an upper spring piece connection post 42, and the upper spring piece carrier fixing part 22 of the upper spring piece 20 is fixedly connected to the upper spring piece connection post 42.

[0098] The surrounding carrier 40 is provided with a coil mounting groove 47 (refer to Figure 16 ), and a first group of coils 46 are arranged in the coil mounting groove 47 (refer to Figure 13 ). The first group of coils 46 are correspondingly matched with the magnet group 50 to drive the carrier 40 to move along the optical axis direction when the first group of coils 46 are energized. The upper surface of the carrier 40 is also provided with a carrier upper limit portion 43 that extends upward integrally. The carrier upper limit portion 43 is used to prevent the carrier 40 from directly colliding with the upper cover 10 during the movement. The side portion of the carrier 40 is also provided with a side sensor magnet mounting groove 44. The sensor magnet mounting groove 44 is used to mount the side sensor magnet and cooperate with the side sensor to detect the displacement of the carrier 40 in the optical axis direction. The lower surface of the carrier 40 is also provided with a damping rubber groove 45 that opens towards the base and extends upward along the optical axis direction. Damping rubber is installed in the damping rubber groove 45 and houses the protruding piece 613 on the base embedded metal piece 61. Creatively, in this application, the protruding piece 613 of the base embedded metal piece 61 cooperates with the damping rubber groove 45, which can play a very good buffering role in the movement of the carrier.

[0099] Figure 9 is a top view of the assembly formed by the upper spring piece 20 mounted on the carrier 40. As Figure 9 shown, the upper spring piece 20 is provided with an upper cover fixing portion 21 and an upper spring piece carrier fixing portion 22. The upper cover fixing portion 21 and the upper spring piece carrier fixing portion 22 are movably connected through the upper spring piece elastic portion 23. The upper cover fixing portion 21 is fixedly connected to the upper cover 10, and the upper spring piece carrier fixing portion 22 is fixedly connected to the upper spring piece connection column 42 of the carrier 40. The upper spring piece 20 is also provided with a coil connection portion 24. The coil connection portion 24 is electrically connected to the first group of coils on the carrier 40, and the upper cover connection portion 21 is electrically connected to the upper cover embedded metal piece 20. Thus, the current of the upper cover embedded metal piece is introduced into the first group of coils on the carrier through the upper spring piece 20 to drive the carrier 40 to move along the optical axis direction.

[0100] Figure 10A is a bottom view of the upper cover 10 installed with the upper cover embedded metal piece 11. As Figure 10A shown, the upper cover embedded metal piece 11 is arranged in the upper cover 10. The four corners of the upper cover 10 are provided with upper spring piece fixing portions 13. The upper cover fixing portion 21 of the upper spring piece 20 is fixed on the upper spring piece fixing portion 13. The upper cover embedded metal piece 11 is provided with a circuit introduction portion 111. The circuit introduction portion 111 is arranged in the upper spring piece fixing portion 13 of the upper cover 10 and is electrically connected to the upper spring piece 20, thereby introducing the current of the upper cover embedded metal piece 11 into the upper spring piece 20. The upper cover embedded metal piece 11 is also provided with an external circuit connection portion 112. The external circuit connection portion 112 extends out of the outer periphery of the upper cover 11 and is used to connect the external circuit. The external circuit connection portion 112 is electrically connected to the circuit introduction portion 111, thereby introducing the external current into the upper spring piece 20 through the upper cover embedded metal piece 11.

[0101] Figure 10B It is a perspective view of the upper cover with the embedded metal sheet 11. As Figure 10B shown, the embedded metal sheet 11 in the upper cover is embedded in the upper cover 10 to generally increase the strength of the upper cover 10. The embedded metal sheet 11 in the upper cover generally includes a magnet matching portion 113, a sensor connection portion 114, a circuit introduction portion 111, and an external circuit connection portion 112. The four magnet matching portions 113 are arranged above the magnet group 30 and are independent of the sensor connection portion 114, the circuit introduction portion 111, and the external circuit connection portion 112. The sensor connection portion 114 is electrically connected to the sensor, and the external circuit connection portion 112 and the circuit introduction portion 111 are electrically connected to the sensor connection portion 114. Among them, one end of the circuit introduction portion 111 is connected to the sensor connection portion 114, and the other end is electrically connected to the upper spring piece 20. Preferably, one end of the circuit introduction portion 111 connected to the upper spring piece 20 and one end connected to the sensor connection portion 114 are lower than the middle main body portion of the circuit introduction portion 111 in the height direction, that is, both ends of the circuit introduction portion 111 sink relative to the entire embedded metal sheet 11 in the upper cover to be electrically connected to the upper spring piece 20 and the sensor connection portion 114.

[0102] Figure 11 It is a bottom view of the lens driving mechanism according to an embodiment of the present invention, where the base, the base seat, and the circuit board are not installed. As Figure 11 shown, the lower spring piece 50 is provided with a base fixing portion 51 and a lower spring piece carrier fixing portion 52. The base fixing portion 51 and the lower spring piece carrier fixing portion 52 are movably connected through the lower spring piece elastic portion 53. Among them, the base fixing portion 51 is fixedly connected to the base 60, and the lower spring piece carrier fixing portion 52 is fixedly connected to the lower surface of the carrier 40, so that the carrier 40 and the base 60 are movably connected through the lower spring piece 50. From Figure 11 it can be clearly seen that the lower surface of the carrier 40 is provided with a damping rubber groove 45 extending along the optical axis direction. The damping rubber groove 45 is used for installing damping rubber and cooperating with the protruding piece 613 of the embedded metal sheet 61 in the base, that is, the protruding piece 613 of the embedded metal sheet 61 in the base extends into the damping rubber groove 45. The size of the protruding piece 613 is preferably set to be smaller than the size of the damping rubber groove 45, so that the protruding piece 613 can move in the damping rubber groove 45.

[0103] Figure 12 It is a top view of the lens driving mechanism 100 according to an embodiment of the present invention. Figure 13 It is Figure 12 a cross-sectional view of the lens driving mechanism taken along line A-A, Figure 14 It is Figure 12 a cross-sectional view of the lens driving mechanism taken along line C-C, Figure 15 It is a top view of the cooperation between the carrier and the base seat, Figure 16 It is Figure 15 a cross-sectional view of the component taken along line B-B. AsFigure 12 - 16 As shown, a first set of coils 46 is provided on the carrier 40, and the magnet group 30 is fixedly installed in the upper cover 10 and arranged opposite to the first set of coils 46. The upper surface of the carrier 40 is movably connected to the upper cover 10 through the upper spring piece 20, and the lower surface of the carrier 40 is movably connected to the base 60 through the lower spring piece 50. The circuit board 80 is fixedly installed on the base 90 and is internally provided with a second set of coils 86. The second set of coils 86 is arranged below the magnet group 30 and cooperates with the magnet group 30 to drive the base 90 and thus drive the chip to move when energized, for example, move in a plane perpendicular to the optical axis or rotate around mutually perpendicular axes in a plane perpendicular to the optical axis, thereby realizing the optical image stabilization function. A bottom sensor 92 is also provided on the base 90, and the bottom sensor 92 is located below the second set of coils and the magnet group 50 to detect the displacement of the assembly composed of the carrier, the upper cover, and the base in the direction perpendicular to the optical axis.

[0104] Refer to Figure 14 , the base 60 and the base 90 are connected by balls 70. Specifically, the balls 70 are installed in the ball mounting portion 92 of the base 90 and the ball mounting groove 632 of the base 60. The space size formed by the cooperation of the ball mounting groove 632 and the ball mounting portion 92 is larger than the size of the balls 70, and the balls 70 can freely roll in the ball mounting groove 632 and the ball mounting portion 92. The balls 70 are respectively in contact with the ball joint portion 611 of the base-embedded metal sheet 61 in the ball mounting groove 632 and the gasket 71 of the ball mounting portion 92. When the second set of coils 86 in the circuit board 80 is energized, electromagnetic induction is formed with the magnet group 50, and the base 90 is driven to drive the chip (not shown in the figure) to move. Since the base 90 and the base 60 are connected by the balls 70, relative movement occurs between the base 60 and the carrier 40 connected thereto and the base 90 through the movement of the balls 70, thereby realizing the optical image stabilization function.

[0105] Refer to Figure 13 and in combination with Figure 16 , when the first set of coils 46 is energized, it cooperates with the magnet group 50 and drives the carrier 40 to move along the optical axis direction relative to the base 60 through the action of the Ampere force, realizing the optical zoom function. Since the protruding piece 63 of the base-embedded metal sheet extends into the damping rubber groove 45 and is surrounded by damping rubber (not shown in the figure), it can play a better buffering role for the movement of the carrier.

[0106] The optical element driving mechanism of the present application realizes optical anti-shake by driving the chip through the base, and creatively applies the ball to the moving chip solution. Since the base and the base are connected by the ball, the strength of the entire component can be enhanced. And by arranging metal sheets and gaskets in the ball mounting grooves and ball mounting parts for mounting the balls, the balls do not directly contact the base and the base, but contact the metal sheets and gaskets, reducing the wear of the base and the base and extending the service life of the mechanism.

[0107] The following refers to Figure 17 - 19 introduce the magnet metal sheet 32 of the upper cover 10 of an embodiment of the present application. Figure 17 - 18 The perspective views of different perspectives of the magnet metal sheet 32 with the magnet installed are shown, Figure 19 is the perspective view of the magnet metal sheet 32 without the magnet installed. As Figure 17 - 19 shown, the magnet metal sheet 32 is arranged outside the magnet 30, the magnet metal sheet 32 is fixedly installed on the inner walls of the four sides of the upper cover 10, and the magnet 30 is fixedly installed on the inner surface of the magnet metal sheet 32. Specifically, the magnet metal sheet 32 includes a main body plate-like part 321, a buckle part 322 extending from the top of the main body plate-like part 321 to one side, and an embedding part 323 extending from the top to the other side. The embedding part 323 is embedded into the upper cover 10, and the buckle part 322 clamps the magnet 30. Among them, two buckle parts 322 are integrally formed on the top of the main body plate-like part 321, and the embedding part 323 extends out from the position between the two buckle parts 322 to the other side. The height that the buckle part 322 protrudes upward is lower than the height that the embedding part 323 protrudes upward. That is to say, the embedding part 323 extends vertically upward by a first distance d1 and then extends in a first direction, and the buckle part 322 extends vertically upward by a second distance d2 and then extends in a second direction, where the first distance d1 is greater than the second distance d2, and the first direction is opposite to the second direction. By using the magnet metal sheet 32, on the one hand, it plays a role in regularizing the magnetic field. On the other hand, since the present application creatively fixes the magnet to the upper cover instead of mounting the magnet on the base in the conventional way, therefore, by setting the magnet metal sheet 32, the magnet 30 can be better fixed to the upper cover 10.

[0108] The preferred embodiments of the present invention have been described in detail above. However, it should be understood that after reading the above teachings of the present invention, those skilled in the art can make various changes or modifications to the present invention. These equivalent forms also fall within the scope defined by the appended claims of the present application.

Claims

1. An optical element driving mechanism, characterized in that, The optical element driving mechanism includes an upper cover, an upper reed, a magnet group, a carrier, a lower reed, a base, balls, a bottom circuit board, and a base. The upper reed movably connects the carrier to the upper cover, and the lower reed movably connects the carrier to the base. The bottom circuit board is installed on the base and fixedly connected to the base. The base is used to install a chip and is movably connected to the base through the balls. Among them, the carrier is provided with a first set of coils, the bottom circuit board is provided with a second set of coils, and the magnet group is fixedly installed on the upper cover and cooperates with the first set of coils to drive the movement of the carrier and cooperates with the second set of coils to drive the movement of the base; The upper cover is further provided with an upper cover embedded metal sheet. The middle of the upper cover is provided with an upper cover central opening to cooperate with the optical element. A magnet mounting part is provided around the upper cover central opening. The magnet group is installed on the magnet mounting part. The upper cover embedded metal sheet includes a magnet cooperation part, and the magnet cooperation part is arranged on the magnet mounting part and above the magnet group; The upper cover is provided with a magnet metal sheet. The magnet metal sheet is fixedly connected to the upper cover, and the magnet group is installed on the side of the magnet metal sheet.

2. The optical element driving mechanism according to claim 1, characterized in that, The upper cover embedded metal sheet further includes a sensor connection part, a circuit introduction part, and an external circuit connection part. The external circuit connection part and the circuit introduction part are electrically connected to the sensor connection part.

3. The optical element driving mechanism according to claim 1, wherein, The upper cover is provided with four magnet metal sheets, and the four magnet metal sheets are respectively fixedly installed on the inner walls of the four side parts of the upper cover. The magnet group includes four magnets and is respectively fixedly installed on the sides of the four magnet metal sheets.

4. The optical element driving mechanism according to claim 3, characterized in that, The magnet metal sheet includes a main body plate-like part, a buckle part extending from the top of the main body plate-like part to one side, and an embedding part extending from the top of the main body plate-like part to the other side. The embedding part is embedded into the upper cover to fixedly connect the magnet metal sheet to the upper cover, and the buckle part is used to clamp the magnet group.

5. The optical element driving mechanism according to claim 1, wherein, The base is provided with a base embedded metal sheet and a ball mounting groove. The balls are installed in the ball mounting groove. The base embedded metal sheet is arranged in the base and is provided with a ball combination part. The ball combination part is arranged in the ball mounting groove of the base and contacts the balls.

6. The optical element driving mechanism according to claim 5, wherein, The carrier is provided with a damping rubber groove. An avoidance hole is provided inside the ball combination part of the base embedded metal sheet. An upward extending protruding piece is provided adjacent to the avoidance hole. The protruding piece cooperates with the damping rubber groove at the bottom of the carrier and extends into the damping rubber groove to buffer the movement of the carrier.

7. The optical element driving mechanism according to claim 6, wherein, The base embedded metal sheet is provided with four of the protruding pieces, and the carrier is provided with four damping rubber grooves. One of the protruding pieces is arranged in each damping rubber groove.

8. The optical element driving mechanism according to claim 1, wherein The base as a whole forms a rectangular structure and includes a bottom plate and side portions integrally protruding upward from the four peripheries of the bottom plate. A base center hole is formed in the middle of the bottom plate to cooperate with the lens. Convex portions are formed at the four corners of the bottom plate, and the convex portions cooperate with the upper cover. Magnet avoidance holes are provided on the inner side of the side portions, and the magnet avoidance holes correspond to and cooperate with the second set of coils in the bottom circuit board and the lower surface of the magnet group, so that the lower surface of the magnet group directly faces the second set of coils in the circuit board.

Images