Mask assembly, apparatus and method for manufacturing display device

Abstract

The present invention provides a mask assembly, an apparatus and a method for manufacturing a display device. According to one or more embodiments, the mask assembly includes: a mask frame including an opening and a portion surrounding the opening, and a mask arranged on the mask frame and including a first area and a second area, and a deposition material can pass through the first area corresponding to the opening, and the second area is around the first area, and the first area includes a deposition opening, and the second area includes a dummy opening, at least some of the dummy openings include a center arranged to deviate from a straight line connecting the centers of the deposition openings, and the width of each of the deposition openings is the same as the width of each of the dummy openings.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2019-0140322 filed on November 5, 2019, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference. Technical Field

[0003] Aspects of embodiments of the present disclosure relate to a mask assembly, an apparatus for manufacturing a display device, and a method for manufacturing a display device. Background Art

[0004] With the development of the information society, the demand for various types of display devices for displaying images has increased. The field of display devices has rapidly changed to thin, light and large-area flat panel display devices (FPDs), which have replaced bulky cathode ray tubes (CRTs). Examples of FPDs include liquid crystal display devices (LCDs), plasma display panels (PDPs), organic light emitting display devices (OLEDs), and electrophoretic display devices (EPDs).

[0005] Among display devices, OLED includes an organic light emitting diode, which includes a counter electrode, a pixel electrode and an emission layer. The electrode and the emission layer can be formed using a variety of methods such as an independent deposition method. In the independent deposition method, a fine metal mask (FMM) is tightened to adhere to a mask frame, and a deposition material is deposited on a deposition surface. Summary of the invention

[0006] According to aspects of one or more embodiments, there are provided a mask assembly that is strong and not easily broken when a fine metal mask is tightened, an apparatus for manufacturing a display device, and a method of manufacturing a display device.

[0007] Additional aspects will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the presented embodiments of the disclosure.

[0008] According to one or more embodiments, a mask assembly includes: a mask frame including an opening and a portion surrounding the opening, and a mask arranged on the mask frame and including a first area and a second area, wherein a deposition material may pass through the first area corresponding to the opening, and the second area is around the first area, wherein the first area includes a deposition opening, and the second area includes a dummy opening, wherein at least some of the dummy openings include a center arranged to deviate from a straight line connecting the centers of the deposition openings, and a width of each of the deposition openings is the same as a width of each of the dummy openings.

[0009] A planar shape of each of the deposition openings and a planar shape of each of the dummy openings may be the same.

[0010] The dummy opening may include a first opening and a second opening, and the first opening may include a center arranged to be deviated from a straight line connecting centers of the deposition openings.

[0011] The second opening may include a center arranged to be deviated from a straight line connecting centers of the first openings, and the first opening and the second opening may be alternately arranged in a first direction from the deposition opening to the dummy opening.

[0012] The second openings may be arranged along the same straight line as the deposition openings.

[0013] The distance at which the second openings are arranged along the same straight line as the deposition openings may be constant.

[0014] A first distance between adjacent ones of the deposition openings may be the same as a second distance between adjacent ones of the dummy openings.

[0015] The width of the mask may be smaller than the width of the opening, and the mask assembly may include a plurality of masks including the above-mentioned mask arranged on a mask frame.

[0016] The second region may be between the first region and the mask frame.

[0017] The second region may surround at least a portion of the first region.

[0018] At least some of the dummy openings may be arranged along the same straight line as the deposition openings.

[0019] According to one or more embodiments, a mask assembly includes: a mask frame including an opening and a portion surrounding the opening, and a mask arranged on the mask frame and including a first area and a second area, wherein a deposition material can pass through the first area, and the second area is around the first area, wherein the first area includes a plurality of first portions configured to shield the deposition material and extending in a first direction, and a first portion among the plurality of first portions is connected to a second portion among a plurality of second portions in the second area extending in a second direction intersecting the first direction, and a width of the first portion among the plurality of first portions is the same as a width of the second portion among the plurality of second portions.

[0020] A first portion among the plurality of first portions may be connected to a third portion among the plurality of third portions extending in a third direction crossing the first direction.

[0021] According to one or more embodiments, an apparatus for manufacturing a display device includes: a chamber in which a substrate can be placed, a deposition source located inside the chamber and configured to supply a deposition material into the chamber, and a mask assembly facing the deposition source and configured to allow the deposition material to flow therethrough toward the substrate, wherein the mask assembly includes: a mask frame including an opening and a portion surrounding the opening, and a mask arranged on the mask frame and including a first area and a second area, wherein the deposition material can pass through the first area corresponding to the opening, and the second area is around the first area, wherein the first area includes a deposition opening, and the second area includes a dummy opening, wherein at least some of the dummy openings include a center arranged to deviate from a straight line connecting the centers of the deposition openings, and a width of each of the deposition openings is the same as a width of each of the dummy openings.

[0022] A planar shape of each of the deposition openings and a planar shape of each of the dummy openings may be the same.

[0023] The dummy opening may include a first opening and a second opening, and the first opening may include a center arranged to be deviated from a straight line connecting centers of the deposition openings.

[0024] The second opening may include a center arranged to be deviated from a straight line connecting centers of the first openings, and the first opening and the second opening may be alternately arranged in a first direction from the deposition opening to the dummy opening.

[0025] The second openings may be arranged along the same straight line as the deposition openings.

[0026] The distance at which the second openings are arranged along the same straight line as the deposition openings may be constant.

[0027] A first distance between adjacent ones of the deposition openings may be the same as a second distance between adjacent ones of the dummy openings.

[0028] At least a portion of the dummy openings may be arranged along the same straight line as the deposition openings.

[0029] According to one or more embodiments, a method for manufacturing a display device includes: placing a substrate in a chamber, supplying a deposition material into the chamber by using a deposition source located inside the chamber, and forming an organic layer on the substrate by using the deposition material passing through a mask assembly facing the deposition source, wherein the mask assembly includes: a mask frame including an opening and a portion surrounding the opening, and a mask arranged on the mask frame and including a first area and a second area, wherein the deposition material passes through the first area corresponding to the opening, and the second area is around the first area, wherein the first area includes a deposition opening, and the second area includes a dummy opening, wherein at least some of the dummy openings include a center arranged to deviate from a straight line connecting the centers of the deposition openings, and a width of each of the deposition openings is the same as a width of each of the dummy openings.

[0030] A planar shape of each of the deposition openings and a planar shape of each of the dummy openings may be the same.

[0031] The dummy opening may include a first opening and a second opening, and the first opening may include a center arranged to be deviated from a straight line connecting centers of the deposition openings.

[0032] The second opening may include a center arranged to be deviated from a straight line connecting centers of the first openings, and the first opening and the second opening may be alternately arranged in a first direction from the deposition opening to the dummy opening.

[0033] The second openings may be arranged along the same straight line as the deposition openings.

[0034] The distance at which the second openings are arranged along the same straight line as the deposition openings may be constant.

[0035] A first distance between adjacent ones of the deposition openings may be the same as a second distance between adjacent ones of the dummy openings.

[0036] The width of the mask may be smaller than the width of the opening, and the mask assembly may include a plurality of masks including the above-mentioned mask arranged on a mask frame.

[0037] The second region may be between the first region and the mask frame.

[0038] The second region may surround at least a portion of the first region.

[0039] At least some of the dummy openings may be arranged along the same straight line as the deposition openings. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] The above and other aspects, features and advantages of certain embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0041] Figure 1 is a cross-sectional view showing an apparatus for manufacturing a display device according to an embodiment;

[0042] Figure 2 is a perspective view illustrating a mask assembly according to an embodiment;

[0043] Figure 3 is a plan view illustrating a mask according to an embodiment;

[0044] Figure 4 yes Figure 3 An enlarged view of area "A";

[0045] Figure 5 It is along Figure 4 A cross-sectional view of the mask taken along line CC';

[0046] Figure 6 yes Figure 3 An enlarged view of area "B";

[0047] Figure 7 is a plan view illustrating a portion of a mask according to another embodiment;

[0048] Figure 8 is a plan view illustrating a mask assembly according to another embodiment;

[0049] Fig. 9 yes Figure 8 An enlarged view of area "D";

[0050] Fig.10 yes Figure 8 an enlarged view of region “E” of FIG. 1 ; and

[0051] Fig.11 is a cross-sectional view schematically illustrating a display device manufactured by an apparatus for manufacturing a display device according to an embodiment. DETAILED DESCRIPTION

[0052] Now will further refer to embodiment in detail, the example of embodiment is illustrated in the accompanying drawings, wherein the same reference numerals represent the same elements throughout. In this regard, the present embodiment can have different forms and should not be construed as being limited to the description set forth in this article. Accordingly, the following will only describe the embodiment with reference to the accompanying drawings to explain the aspects of this description. As used in this article, the term "and / or" includes any combination and all combinations of one or more of the associated listed items. Throughout this disclosure, the expression "at least one of a, b and c" means only a, only b, only c, both a and b, both a and c, both b and c, all of a, b and c or its variants.

[0053] Herein, embodiments of the present disclosure will be described in further detail below with reference to the accompanying drawings. Those components that are the same or correspond are given the same reference numerals regardless of the figure numbers, and redundant descriptions thereof may be omitted.

[0054] It should be understood that although the terms "first", "second", etc. may be used herein to describe various components, these components should not be limited by these terms. These components are used to distinguish one component from another.

[0055] As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0056] It should be further understood that the terms “include” and / or “comprises” used herein specify the presence of stated features or components, but do not preclude the presence or addition of one or more other features or components.

[0057] It will be understood that when a layer, region or component is referred to as being “formed on” another layer, region or component, it may be directly or indirectly formed on the other layer, region or component. That is, for example, one or more intervening layers, regions or components may be present.

[0058] For convenience of explanation, the size of the elements in the drawings may be exaggerated or reduced. In other words, since the size and thickness of the components in the drawings may be arbitrarily illustrated for convenience of explanation, the following embodiments are not limited thereto.

[0059] When a certain embodiment can be implemented differently, a specific process order can be performed differently from the described order. For example, two processes described successively can be performed substantially simultaneously or in the reverse order of the described order.

[0060] It should be understood that when a layer, region, or component is referred to as being "connected to" another layer, region, or component, it may be directly or indirectly connected to the other layer, region, or component. That is, for example, there may be one or more intermediate layers, regions, or components. For example, it should be understood that when a layer, region, or component is referred to as being "electrically connected to" another layer, region, or component, it may be directly or indirectly electrically connected to the other layer, region, or component. That is, for example, there may be one or more intermediate layers, regions, or components.

[0061] Unless otherwise defined, all terms (including technical and scientific terms) used in this document have the same meaning as those commonly understood by those skilled in the art to which the exemplary embodiments of the inventive concept belong. It should be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and will not be interpreted in an idealized or overly formal sense unless explicitly defined as such in this document.

[0062] Figure 1 is a cross-sectional view illustrating an apparatus 1 for manufacturing a display device according to an embodiment. Figure 2 is a perspective view illustrating a mask assembly 1000 according to an embodiment. Figure 3 is a plan view illustrating a mask 1200 according to an embodiment.

[0063] refer to Figure 1 , the apparatus 1 for manufacturing a display device according to an embodiment may include a chamber 210, a shielding unit 220, a deposition source 230, a substrate supporting unit 240, a mask supporting unit 250, a magnetic force generating unit 260, a pressure control unit 270 and a mask assembly 1000.

[0064] The chamber 210 may have a space formed therein, and one side of the chamber 210 may be opened so that the substrate 101 may be taken out of the chamber 210 through the opened side or accommodated in the chamber 210. In an embodiment, a shielding unit 220 including a gate valve may be located in the opened portion of the chamber 210, and thus may be selectively opened or closed.

[0065] A deposition material for forming an organic layer on the substrate 101 may be contained in the deposition source 230. In embodiments, energy (eg, heat energy, light energy, vibration energy) may be applied to the deposition source 230 so that the deposition material may evaporate or sublime in the deposition source 230.

[0066] The deposition source 230 described above may be replaceable. In this case, when the contained deposition material is exhausted, the deposition source 230 may be replaced with a new deposition source 230 .

[0067] The substrate supporting unit 240 may support the substrate 101. In an embodiment, the substrate 101 may be placed on the substrate supporting unit 240 so that the substrate supporting unit 240 may adsorb or adhere to the surface of the substrate 101, thereby supporting the substrate 101. For example, the substrate supporting unit 240 may include a chamber, a rod, etc. fixed in the chamber 210. In another embodiment, the substrate supporting unit 240 may include a clamp for gripping the substrate 101. In another embodiment, the substrate supporting unit 240 may include an adhesive chuck or an electrostatic chuck. In an embodiment, the substrate supporting unit 240 may be formed integrally with the magnetic force generating unit 260.

[0068] The mask support unit 250 may support the mask assembly 1000. In an embodiment, the mask support unit 250 may be the same as or similar to the substrate support unit 240 described above, and therefore, herein, for ease of explanation, a further detailed description of the mask support unit 250 will be omitted. In addition, herein, a case in which the mask support unit 250 includes a frame fixed in the chamber 210 and the mask assembly 1000 is seated on and supported on the frame will be described in further detail.

[0069] The magnetic force generating unit 260 may be located at the chamber 210, and may adhere the mask frame 1100 to the substrate 101. In an embodiment, the magnetic force generating unit 260 may include an electromagnet.

[0070] The pressure control unit 270 may be connected to the chamber 210 so as to control the pressure inside the chamber 210. In an embodiment, the pressure control unit 270 may include a pipe connected to the chamber 210 and a pump located on the pipe.

[0071] The mask assembly 1000 may include a mask frame 1100 and a mask 1200 .

[0072] refer to Figure 2 and Figure 3 , the mask frame 1100 may include an opening 1150 through which a deposition material may pass, and a plurality of frames or frame portions surrounding the opening 1150 .

[0073] In an embodiment, the mask frame 1100 may include a first frame 1110 and a second frame 1120 facing each other and a third frame 1130 and a fourth frame 1140 facing each other. Figure 2, the first frame 1110 may extend in the y direction and may be spaced apart from the second frame 1120 in the x direction. The third frame 1130 may extend in the x direction and may be spaced apart from the fourth frame 1140 in the y direction. The first frame 1110 may be connected to the third frame 1130 and the fourth frame 1140, and the second frame 1120 may be connected to the third frame 1130 and the fourth frame 1140.

[0074] In an embodiment, the mask frame 1100 may be made of metal having high rigidity, which is a material having small deformation when the mask 1200 is welded.

[0075] In some embodiments, a support rod 1160 or support bar may be provided in the opening 1150. For example, the support rod 1160 may extend in the y direction and may be connected to the Figure 2 The support rods 1160 may prevent or substantially prevent a bending phenomenon due to the weight of the mask 1200 and may support the mask frame 1100.

[0076] The mask 1200 may be mounted on the mask frame 1100. In an embodiment, the mask 1200 may be made of any one of stainless steel, invar, nickel (Ni), cobalt (Co), a nickel alloy, and a nickel-cobalt alloy.

[0077] In an embodiment, the width of the mask 1200 may be smaller than the width of the opening 1150. For example, referring to Figure 2 , the width of the mask 1200 in the y direction may be smaller than the width of the opening 1150 in the y direction. Therefore, a plurality of masks 1200 may be mounted on the mask frame 1100 to prevent or substantially prevent the mask frame 1100 from sinking due to the weight of the mask 1200. In another embodiment, the width of the mask 1200 may be greater than the width of the opening 1150. In an embodiment, for example, the width of the mask 1200 in the y direction may be greater than the width of the opening 1150 in the y direction. Therefore, the mask 1200 may be integrally mounted on the mask frame 1100. Herein, for ease of explanation, the case where the width of the mask 1200 is smaller than the width of the opening 1150 will be described in further detail.

[0078] The mask 1200 may be continuously disposed between the third frame 1130 and the fourth frame 1140. In an embodiment, both ends of the mask 1200 may be welded and fixed to the first frame 1110 and the second frame 1120. The mask 1200 may cover the opening 1150.

[0079] The mask 1200 may include a welding region 1210 , a first region 1220 , and a second region 1230 .

[0080] The welding region 1210 may be at both ends of the mask 1200. The welding region 1210 may be a region connected to the mask frame 1100. For example, the welding region 1210 may be a region welded, fixed, and connected to the first frame 1110 or the second frame 1120.

[0081] The first region 1220 may be a region corresponding to the opening 1150. A plurality of deposition openings may be provided in each of the plurality of first regions 1220, and the deposition material may pass through the mask 1200 through the plurality of deposition openings. In an embodiment, the first regions 1220 may be spaced apart from each other by a certain distance. For example, the first regions 1220 may be spaced apart from each other in the x direction. In another embodiment, the first regions 1220 may be provided continuously to correspond to the opening 1150. Herein, the case where the first regions 1220 are spaced apart from each other by a certain distance will be described in further detail.

[0082] The second region 1230 may be around the first region 1220. In an embodiment, the second region 1230 may surround at least a portion of the first region 1220. For example, when the first regions 1220 are spaced a certain distance from each other, each of the second regions 1230 may surround at least a portion of each of the first regions 1220. In addition, the second region 1230 may be between the first region 1220 and the welding region 1210. In an embodiment, a region other than the first region 1220 and the welding region 1210 in the mask 1200 may be the second region 1230.

[0083] In an embodiment, each of the second regions 1230 may include a dummy opening, and at least some of the dummy openings may include a center arranged to deviate from an imaginary straight line connecting the centers of the deposition openings. Figure 4 A further detailed description thereof is provided.

[0084] Figure 4 yes Figure 3 A magnified view of area "A". Figure 4 In, with Figure 3 The same reference numerals denote the same elements, and thus repeated descriptions thereof will be omitted.

[0085] refer to Figure 4 , the first region 1220 may include a deposition opening AOP. In an embodiment, a plurality of deposition openings AOP may be spaced apart from each other in the first direction or the second direction. For example, a plurality of deposition openings AOP may be spaced apart from each other in the x direction or the y direction. Figure 4, the centers of the plurality of deposition openings AOP may be spaced apart from each other by a certain distance along a first straight line L1 extending in a first direction (eg, x direction). In an embodiment, the plurality of adjacent deposition openings AOP may be arranged at regular intervals. The first direction may be a direction in which the mask 1200 is tightened.

[0086] In an embodiment, the width DM of multiple deposition openings AOP may be the same. In addition, in an embodiment, the shapes of multiple deposition openings AOP may be the same. The shape of the deposition opening AOP may be any of various shapes including a rectangular shape or a polygonal shape. In some embodiments, the widths of multiple deposition openings AOP may be different from each other, or the shapes of multiple deposition openings AOP may be different from each other. However, for ease of explanation, the case where the shapes of multiple deposition openings AOP are the same will be further described in detail.

[0087] The second area 1230 may include a first dummy area DA1 and a second dummy area DA2. The first dummy area DA1 may include a plurality of adjacent openings DOP1, and the second dummy area DA2 may include a first opening DOP2-1 and a second opening DOP2-2.

[0088] The adjacent opening DOP1 may be arranged in the same line as the deposition opening AOP. That is, the adjacent opening DOP1 may be arranged in the first dummy area DA1 in the first direction. For example, the centers of the deposition openings AOP in the first area 1220 may be spaced apart from each other by a certain distance along the first straight line L1. The centers of the adjacent openings DOP1 may be spaced apart from each other by a certain distance along the first straight line L1, just like in the center of the deposition opening AOP. In this case, the adjacent openings DOP1 may be spaced apart from each other by a certain distance.

[0089] The second dummy area DA2 may include: an opening including a center arranged to deviate from an imaginary straight line connecting the center of the deposition opening AOP. In further detail, the first opening DOP2-1 may include a center arranged to deviate from an imaginary straight line connecting the center of the deposition opening AOP. In addition, the first opening DOP2-1 may be arranged not to align with the adjacent opening DOP1. For example, the centers of a portion of the plurality of deposition openings AOP may be spaced apart from each other by a certain distance along the first straight line L1, and the centers of a portion of the first opening DOP2-1 may be spaced apart from each other by a certain distance along the second straight line L2 extending in the first direction. Here, the second straight line L2 may be parallel to the first straight line L1 and spaced apart from the first straight line L1 by a certain distance. In addition, the centers of another portion of the plurality of deposition openings AOP may be spaced apart from each other by a certain distance along the third straight line L3 extending in the first direction. In this case, the second straight line L2 may be located between the first straight line L1 and the third straight line L3. In other words, the center of a portion of the first opening DOP2-1 may be located between the first straight line L1 and the third straight line L3. In an embodiment, the distance between the first straight line L1 and the second straight line L2 may be the same as the distance between the second straight line L2 and the third straight line L3. The arrangement of the deposition opening AOP and the first opening DOP2-1 may be repeated in a direction perpendicular to the first straight line L1 (e.g., y direction). Therefore, the first opening DOP2-1 may be arranged not to be aligned with the deposition opening AOP.

[0090] In the present embodiment, the second opening DOP2-2 may be arranged in the same line as the deposition opening AOP. For example, the centers of a portion of the plurality of second openings DOP2-2 may be spaced a certain distance apart from each other along the first straight line L1 or the third straight line L3. In further detail, the center of a portion of the second opening DOP2-2 may overlap with the first straight line L1 or the third straight line L3. The arrangement of the deposition opening AOP and the second opening DOP2-2 may be repeated in a direction perpendicular to the first straight line L1 or the third straight line L3 (e.g., the y direction). Therefore, the second opening DOP2-2 may include a center arranged to deviate from an imaginary straight line connecting the centers of the first openings DOP2-1.

[0091] The first opening DOP2-1 and the second opening DOP2-2 described above may be alternately arranged in the first direction (e.g., -x direction). In further detail, for example, the centers of the first opening DOP2-1 may be spaced a certain distance from each other on the fourth straight line L4 in the y direction, and the centers of the second opening DOP2-2 may be spaced a certain distance from each other on the fifth straight line L5 in the y direction. The arrangement of the first opening DOP2-1 and the second opening DOP2-2 may be repeated in the first direction.

[0092] In this embodiment, the distances between adjacent openings may be the same. In further detail, the distance d between the deposition openings AOP may be the same (equal or substantially equal) as the distance d1 between the adjacent openings DOP1. In addition, the distance d1 between the adjacent openings DOP1 may be the same as the distance d2-1 between the first openings DOP2-1, and may be the same as the distance d2-2 between the second openings DOP2-2. Here, the distance between the openings is the distance between the centers of the adjacent openings.

[0093] In this embodiment, the shapes of the plurality of dummy openings DOP may be the same. In further detail, in an embodiment, the shapes of the adjacent openings DOP1, the first opening DOP2-1, and the second opening DOP2-2 may be the same. In an embodiment, the planar shapes of the plurality of dummy openings DOP may be the same polygonal shape, such as a rectangular shape, a diamond shape, or a hexagonal shape.

[0094] In an embodiment, the widths of the plurality of dummy openings DOP may be the same. In further detail, in an embodiment, the width DM1 of the adjacent opening DOP1, the width DM2-1 of the first opening DOP2-1, and the width DM2-2 of the second opening DOP2-2 may be the same. Figure 4 The width of the opening is shown as the distance between the protrusions inside the opening (see Figure 5 ).

[0095] From a different perspective, the mask 1200 may include first, second, and third portions PR1, PR2, and PR3. One of the first portions PR1 may be connected to the second portion PR2 extending in the second direction, and may be connected to the third portion PR3 extending in the third direction.

[0096] The first region 1220 may include a plurality of first portions PR1 that shield the deposition material and extend in the first direction. Here, the first portion PR1 may be a region that passes between adjacent deposition openings AOP in the first direction among the portions of the mask 1200. For example, the first portion PR1 may be a region that passes between adjacent deposition openings AOP in the -x direction among the portions of the mask 1200. The first portion PR1 may extend from the first region 1220 into the first dummy area DA1.

[0097] The first portion PR1 among the first portions PR1 may be connected to a second portion PR2 among a plurality of second portions PR2 extending in a second direction intersecting the first direction in the second region 1230. Here, the second portion PR2 may be defined as a region passing between the adjacent opening DOP1 and the first opening DOP2-1 in the second direction among the portions of the mask 1200. The second portion PR2 may extend in a direction intersecting the -x direction. Figure 4 , the second portion PR2 may extend in the y direction.

[0098] The first portion PR1 among the first portions PR1 may be connected to a third portion PR3 among a plurality of third portions PR3 extending in a third direction intersecting the first direction. Here, the third portion PR3 may be defined as a region passing between the adjacent opening DOP1 and the first opening DOP2-1 in the third direction among the portions of the mask 1200. The third portion PR3 may extend in a direction intersecting the -x direction. Figure 4 , the third portion PR3 may extend in the -y direction.

[0099] In an embodiment, the width W1 of the first portion PR1, the width W2 of the second portion PR2, and the width W3 of the third portion PR3 may be the same (equal or substantially equal). Here, each of the widths W1 of the first portion PR1 may be a vertical distance between adjacent deposition openings AOP. Each of the widths W2 of the second portion PR2 and each of the widths W3 of the third portion PR3 may be a horizontal distance between an adjacent opening DOP1 and a first opening DOP2-1.

[0100] Figure 5 It is along Figure 4 A cross-sectional view of the mask 1200 taken along line CC'. Figure 5 In, with Figure 4 The same reference numerals denote the same elements, and thus repeated descriptions thereof will be omitted.

[0101] refer to Figure 5 In an embodiment, the opening may be formed using chemical etching. For example, after the first surface S1 is etched to a certain depth, the second surface S2 may be etched to a certain depth, and thus the opening may be formed. In another embodiment, the opening may be formed by irradiating laser. In this article, the case where the opening is formed using chemical etching will be further described in detail.

[0102] In an embodiment, the width DM of the deposition opening AOP may be the same (equal or substantially equal) to the width DM1 of the adjacent opening DOP1 and the width DM2 of the second opening DOP2-2. Figure 5 Although not shown in the figure, the width of the first opening DOP2-1 may be the same as the width DM of the deposition opening AOP. Here, the width of the opening is the distance between the protrusions inside the opening.

[0103] In an embodiment, the widths of the openings formed in the first surface S1 may be the same. The widths of the openings formed in the second surface S2 opposite to the first surface S1 may be the same.

[0104] The shape of the deposition opening AOP in the first region 1220 and the shapes of the adjacent opening DOP1 and the second opening DOP2-2 in the second region 1230 may be the same. Figure 5 Although not shown in the figure, in an embodiment, the shape of the first opening DOP2-1 and the shape of the second opening DOP2-2 may be the same.

[0105] In an embodiment, the shape of the deposition opening AOP being the same as the shape of the adjacent opening DOP1, the first opening DOP2-1 and the second opening DOP2-2 means that the planar shape and the cross-sectional shape of the opening are the same. That is, the three-dimensional shapes of the openings may be the same.

[0106] Figure 6 yes Figure 3 A magnified view of area "B". Figure 6 In, with Figure 3 The same reference numerals denote the same elements, and thus repeated descriptions thereof will be omitted.

[0107] refer to Figure 6 , the first regions 1220 may be spaced apart from each other by a certain distance. For example, the first regions 1220 may be spaced apart from each other in the x direction.

[0108] The second region 1230 may be around the first region 1220. In an embodiment, the second region 1230 may be between the first regions 1220 that are spaced apart from each other. In this case, the second region 1230 may include dummy openings DOP, and at least some of the dummy openings DOP may include centers that are arranged to deviate from an imaginary straight line connecting the centers of the deposition openings AOP. In another embodiment, the second region 1230 may not be arranged between the first regions 1220 that are spaced apart from each other. Herein, for ease of explanation, the case where the second region 1230 is between the first regions 1220 that are spaced apart from each other will be described in further detail.

[0109] The first region 1220 may include a deposition opening AOP, and the second region 1230 may include a dummy opening DOP. The dummy opening DOP may include an adjacent opening DOP1 (eg, Figure 4 ), the first opening DOP2-1 and the second opening DOP2-2. In some embodiments, the adjacent opening DOP1 may be omitted, and Figure 6 It is illustrated that the adjacent opening DOP1 is omitted.

[0110] The first opening DOP2-1 may include a center arranged to deviate from an imaginary straight line connecting the centers of the deposition openings AOP, and the second opening DOP2-2 may include a center arranged to deviate from an imaginary straight line connecting the centers of the first openings DOP2-1. In an embodiment, the second opening DOP2-2 and the deposition openings AOP may be arranged on the same line.

[0111] Due to the arrangement of the openings in this embodiment, the mask 1200 can be strong and not easy to break. When manufacturing an organic light-emitting display device, a fine metal mask is tightened to adhere to the mask frame 1100, and a material such as an organic layer is deposited on the surface of the substrate 101 to form an organic layer with a specific pattern. In this case, generally, a large stress can be generated in the second area 1230 among the regions of the mask 1200. In this embodiment, the second opening DOP2-2 included in the second area 1230 can be arranged to deviate from an imaginary straight line connecting the center of the first opening DOP2-1, so that the tension can be dispersed in the direction in which the mask 1200 is tightened. Therefore, a strong and not easy to break mask 1200 can be manufactured.

[0112] Furthermore, deformation of the mask 1200 due to stress may be minimized or reduced, so that the positions of the substrate 101 and the mask assembly 1000 may be prevented or substantially prevented from being mismatched.

[0113] From a different perspective, the second portion PR2 and the third portion PR3 may be provided in a direction different from the direction in which the first portion PR1 is provided. Therefore, the tension applied to the first portion PR1 may be dispersed into the second portion PR2 and the third portion PR3. Therefore, in an embodiment of the present disclosure, stress concentration in a portion of the second region 1230 may be prevented or substantially prevented, and a strong and unbreakable mask 1200 may be manufactured.

[0114] In an embodiment, since the shapes of the dummy openings DOP and the deposition openings AOP are the same, the magnetic force generated by the magnetic force generating unit 260 may be uniformly or substantially uniformly formed throughout the mask 1200 .

[0115] Figure 7 1 is a plan view illustrating a portion of a mask 1200 according to another embodiment. Figure 7 In, with Figure 4 The same reference numerals denote the same elements, and therefore, further detailed description thereof will be omitted.

[0116] refer to Figure 7, the first area 1220 may include a deposition opening AOP. The second area 1230 may include a first dummy area DA1 and a second dummy area DA2. The first dummy area DA1 may include an adjacent opening DOP1, and the second dummy area DA2 may include a first opening DOP2-1 and a second opening DOP2-2.

[0117] In an embodiment, the deposition opening AOP and the dummy opening DOP may have the same shape. For example, the deposition opening AOP and the dummy opening DOP may be circular in a plane. Figure 7 , the deposition openings AOP and the dummy openings DOP are shown as circular in a plane. However, there may be various modifications, in which, for example, the deposition openings AOP and the dummy openings DOP may be elliptical in a plane.

[0118] The mask 1200 may include a first portion PR1, a second portion PR2, and a third portion PR3. The first portion PR1 among the first portions PR1 may be connected to the second portion PR2 extending in the second direction and the third portion PR3 extending in the third direction.

[0119] The first region 1220 may include a plurality of first portions PR1 that shield the deposition material and extend in the first direction. Here, the first portion PR1 may be a region that passes between adjacent deposition openings AOP in the first direction among the portions of the mask 1200. The first portion PR1 may extend from the first region 1220 to the first dummy area DA1. For example, the first portion PR1 may extend in the -x direction.

[0120] The first portion PR1 among the first portions PR1 may be connected to a second portion PR2 among a plurality of second portions PR2 extending in a second direction intersecting the first direction in the second region 1230. Here, the second portion PR2 may be defined as a region passing between the adjacent opening DOP1 and the first opening DOP2-1 in the second direction among portions of the mask 1200. Figure 7 , the second portion PR2 may extend in a direction crossing the -x direction.

[0121] The first portion PR1 among the first portions PR1 may be connected to a third portion PR3 among a plurality of third portions PR3 extending in a third direction intersecting the first direction. Here, the third portion PR3 may be defined as a region passing between the adjacent opening DOP1 and the first opening DOP2-1 in the third direction among the portions of the mask 1200. Figure 7 , the third portion PR3 may extend in a direction intersecting the -x direction. In this case, the direction in which the third portion PR3 extends may be different from the direction in which the second portion PR2 extends.

[0122] The width W1 of the first portion PR1, the width W2 of the second portion PR2, and the width W3 of the third portion PR3 may be the same (equal or substantially equal). Here, each of the widths W1 of the first portion PR1 may be the shortest distance between adjacent deposition openings AOP. Each of the widths W2 of the second portion PR2 and each of the widths W3 of the third portion PR3 may be the shortest distance between the adjacent opening DOP1 and the first opening DOP2-1.

[0123] The mask 1200 may be tensioned in a first direction (e.g., x direction). In an embodiment, when the dummy openings DOP and the deposition openings AOP are arranged in the welding region 1210 of the mask 1200 to be parallel to each other, the first portion PR1 may extend into the welding region 1210. In this case, the entire tension may be applied to the first portion PR1 in the first direction, so that the stress may not be dispersed.

[0124] In the present embodiment, the second portion PR2 and the third portion PR3 are provided in a direction different from the direction in which the first portion PR1 is provided. Therefore, the tension applied to the first portion PR1 can be dispersed into the second portion PR2 and the third portion PR3. Therefore, in the present embodiment, stress concentration in a portion of the second region 1230 can be prevented or substantially prevented, and a strong and unbreakable mask 1200 can be manufactured.

[0125] Figure 8 is a plan view illustrating a mask assembly 2000 according to another embodiment; Fig. 9 yes Figure 8 an enlarged view of area "D"; and Fig.10 yes Figure 8 Magnified view of area "E".

[0126] refer to Figure 8 , the mask assembly 2000 may include a mask frame 2100 and a mask 2200. The mask frame 2100 may include an opening 2150 through which a deposition material may pass, and a plurality of frames or frame portions surrounding the opening 2150. Figure 8 The mask frame 2100 and the opening 2150 are Figure 2 The mask frame 1100 and the opening 1150 are similar. Therefore, further detailed description thereof will be omitted.

[0127] In an embodiment, the mask 2200 may be mounted on the mask frame 2100. In an embodiment, the width of the mask 2200 may be greater than the width of the opening 2150. For example, the width of the mask 2200 in the x-direction or the y-direction may be greater than the width of the opening 2150 in the x-direction or the y-direction. Therefore, in an embodiment, the mask 2200 may be integrally mounted on the mask frame 2100.

[0128] In an embodiment, the mask 2200 may be tensioned in the x-direction or the y-direction and thus may be mounted on the mask frame 2100. Therefore, stress may be generated in the mask 2200 in the x-direction and the y-direction.

[0129] The mask 2200 may include a welding region 2210 , a first region 2220 , and a second region 2230 . Figure 8 The welding area 2210, the first area 2220 and the second area 2230 are Figure 3 The welding region 1210, the first region 1220, and the second region 1230 are identical or similar. Therefore, further detailed description thereof will be omitted.

[0130] In the present embodiment, the second region 2230 may surround the first region 2220. For example, when the first regions 2220 may be spaced apart from each other by a certain distance, the second regions 2230 may respectively surround the first regions 2220. In addition, the second region 2230 may be between the first region 2220 and the welding region 2210.

[0131] The second region 2230 may include dummy openings, wherein at least some of the dummy openings may include centers arranged to deviate from an imaginary straight line connecting centers of the deposition openings. Therefore, in an embodiment, the dummy openings may surround the first region 2220 , respectively.

[0132] refer to Fig. 9 and Fig.10 , the first area 2220 may include a deposition opening AOP'. The second area 2230 may include a first dummy area DA1' and a second dummy area DA2'. The first dummy area DA1' may include an adjacent opening DOP1', and the second dummy area DA2' may include a first opening DOP2-1' and a second opening DOP2-2'.

[0133] Fig. 9 The first dummy area DA1', the second dummy area DA2', the deposition opening AOP', the adjacent opening DOP1', the first opening DOP2-1' and the second opening DOP2-2' may be connected to Figure 4The first dummy area DA1, the second dummy area DA2, the deposition opening AOP, the adjacent opening DOP1, the first opening DOP2-1, and the second opening DOP2-2 are the same or similar. Therefore, further detailed description thereof will be omitted.

[0134] Fig.10 The first straight line L1 ′, the second straight line L2 ′, and the third straight line L3 ′ may be straight lines extending in the y direction and spaced apart from each other.

[0135] In an embodiment, the adjacent opening DOP1' may be arranged in the same line as the deposition opening AOP'. That is, the adjacent opening DOP1' may be arranged in the first dummy area DA1' in the first direction. For example, the centers of the deposition opening AOP' may be arranged to be spaced a certain distance from each other along the first straight line L1' in the y direction. The centers of the adjacent openings DOP1' may be arranged to be spaced a certain distance from each other along the first straight line L1', as in the center of the deposition opening AOP'. In this case, the adjacent openings DOP1' may be arranged to be spaced a certain distance from each other.

[0136] The second dummy area DA2' may include: an opening including a center arranged to deviate from an imaginary straight line connecting the centers of the deposition openings AOP'. In further detail, the first opening DOP2-1' may be arranged not to be aligned with the deposition opening AOP'. In addition, the first opening DOP2-1' may be arranged not to be aligned with the adjacent opening DOP1'. For example, the centers of some of the plurality of deposition openings AOP' may be arranged to be spaced a certain distance from each other along the first straight line L1', and the centers of a portion of the first opening DOP2-1' may be arranged to be spaced a certain distance from each other along the second straight line L2' extending in the first direction. Here, the second straight line L2' may be a straight line parallel to the first straight line L1' and spaced a certain distance from the first straight line L1'. In addition, the centers of other deposition openings AOP' in the plurality of deposition openings AOP' may be arranged to be spaced a certain distance from each other along the third straight line L3' extending in the first direction. In this case, the second straight line L2' may be between the first straight line L1' and the third straight line L3'. In other words, the centers of some of the first openings DOP2-1' may be located between the first straight line L1' and the third straight line L3'. In an embodiment, the distance between the first straight line L1' and the second straight line L2' may be the same as the distance between the second straight line L2' and the third straight line L3'. The arrangement of the deposition openings AOP' and the first openings DOP2-1' may be repeated in a direction perpendicular to the first straight line L1' (e.g., the x direction). Therefore, the first openings DOP2-1' may be arranged not to be aligned with the deposition openings AOP'.

[0137] In the present embodiment, the second openings DOP2-2' may be arranged in the same line as the deposition openings AOP'. For example, the centers of some of the plurality of second openings DOP2-2' may be arranged to be spaced a certain distance apart from each other along the first straight line L1' or the third straight line L3'. In further detail, the centers of some of the second openings DOP2-2' may overlap with the first straight line L1' or the third straight line L3'. The arrangement of the deposition openings AOP' and the second openings DOP2-2' may be repeated in a direction perpendicular to the first straight line L1' or the third straight line L3' (e.g., the x direction). Therefore, the second openings DOP2-2' may include a center arranged to deviate from an imaginary straight line connecting the centers of the first openings DOP2-1'.

[0138] The first openings DOP2 - 1 ′ and the second openings DOP2 - 2 ′ may be alternately arranged in the first direction (eg, y direction).

[0139] The arrangement of the openings is performed as in the present embodiment, so that the mask 2200 can be strong and not easy to break. In the present embodiment, the mask 2200 can be stretched in the x-direction and the y-direction, and stress can be generated in the x-direction and the y-direction. In this case, the second opening DOP2-2' arranged in the second area 2230 adjacent to the welding area 2210 can be arranged to deviate from the imaginary straight line connecting the center of the first opening DOP2-1', so that the tension can be dispersed in the direction in which the mask 2200 is stretched. Therefore, a strong and not easy to break mask 2200 can be manufactured.

[0140] Furthermore, deformation of the mask 2200 due to stress may be minimized or reduced, so that the positions of the substrate 101 and the mask assembly 2000 may be prevented or substantially prevented from being incommensurate.

[0141] In an embodiment, since the shape of the dummy opening and the shape of the deposition opening AOP′ are the same, the magnetic force generated by the magnetic force generating unit 260 may be uniformly or substantially uniformly formed throughout the mask 2200 .

[0142] Return to reference Figure 1 , the organic layer may be deposited on the substrate 101 using the apparatus 1 for manufacturing a display device described above.

[0143] First, the substrate 101 may be disposed in the chamber 210 . In further detail, the substrate 101 may be mounted on the substrate supporting unit 240 .

[0144] Next, the deposition material may be supplied into the chamber 210 using the deposition source 230 located inside the chamber 210 .

[0145] Next, a deposition material passing through the mask assembly 1000 facing the deposition source 230 in the z direction may be deposited onto the substrate 101 , and an organic layer may be formed.

[0146] Herein, a display device 100 that can be manufactured using the apparatus 1 for manufacturing a display device described above will be described.

[0147] The display device 100 as a device for displaying an image can be used in a portable mobile device such as a game console, a multimedia device, or a personal computer (PC) (e.g., a mini PC). Examples of the display device 100 may include a liquid crystal display device, an electrophoretic display device, an organic light-emitting display device, an inorganic electroluminescent (EL) display device, a field emission display device, a surface conduction electron emitter display device, a quantum dot display device, a plasma display device, and a cathode ray display device. In this article, an organic light-emitting display device will be described as an example of a display device 100 according to an embodiment. However, according to an embodiment, any of the various types of display devices described above may be used.

[0148] Fig.11 is a cross-sectional view schematically illustrating a display device 100 manufactured by the apparatus 1 for manufacturing a display device according to an embodiment.

[0149] refer to Fig.11 , the display layer DL and the thin film encapsulation layer TFE may be located on the substrate 101. The display layer DL may include a pixel circuit layer PCL and a display element layer DEL.

[0150] The substrate 101 may include glass or a polymer resin such as any one of polyethersulfone, polyarylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyimide, polycarbonate, and cellulose acetate propionate.

[0151] A barrier layer (not shown) may be further included between the display layer DL and the substrate 101. The barrier layer (not shown) is a barrier layer for preventing or substantially preventing penetration of external foreign matter and may have a material including silicon nitride (SiN x , where x>0) or silicon oxide (SiO x , where x>0) is a single-layer structure or a multi-layer structure of an inorganic material.

[0152] The pixel circuit layer PCL is located on the substrate 101 . Fig.11 It is illustrated that the pixel circuit layer PCL includes a thin film transistor TFT, a buffer layer 111 located under or on components of the thin film transistor TFT, a first gate insulating layer 113 a , a second gate insulating layer 113 b , an interlayer insulating layer 115 , and a planarization insulating layer 117 .

[0153] In an embodiment, the buffer layer 111 may include an inorganic insulating material such as silicon nitride, silicon oxynitride, and silicon oxide, and may have a single-layer structure or a multi-layer structure including any one of the above-described inorganic insulating materials.

[0154] The thin film transistor TFT may include a semiconductor layer 112, and in an embodiment, the semiconductor layer 112 may include polycrystalline silicon. In an embodiment, the semiconductor layer 112 may include amorphous silicon, an oxide semiconductor, or an organic semiconductor. The semiconductor layer 112 may include a channel region 112c and a drain region 112a and a source region 112b located on both sides of the channel region 112c. The gate electrode 114 may overlap the channel region 112c.

[0155] The gate electrode 114 may include any one of low resistance metal materials. The gate electrode 114 may include any one of conductive materials including molybdenum (Mo), aluminum (Al), copper (Cu), and titanium (Ti), and may have a multilayer structure or a single layer structure including any one of the materials described above.

[0156] The first gate insulating layer 113a between the semiconductor layer 112 and the gate electrode 114 may include silicon oxide (SiO 2 ), Silicon Nitride (SiN x ), silicon oxynitride (SiON), aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), Tantalum Oxide (Ta 2 O 5 ), hafnium oxide (HfO 2 ) or zinc oxide (ZnO 2 ) any one of the inorganic insulating materials.

[0157] The second gate insulating layer 113b may cover the gate electrode 114. The second gate insulating layer 113b may include, for example, silicon oxide (SiO 2 ), Silicon Nitride (SiN x ), silicon oxynitride (SiON), aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), Tantalum Oxide (Ta 2 O 5 ), hafnium oxide (HfO 2 ) or zinc oxide (ZnO 2 ) as in the first gate insulating layer 113a.

[0158] The upper electrode Cst2 of the storage capacitor Cst may be located on the second gate insulating layer 113b. The upper electrode Cst2 may overlap the gate electrode 114 thereunder. In an embodiment, the gate electrode 114 and the upper electrode Cst2 overlapping each other with the second gate insulating layer 113b therebetween may form a storage capacitor Cst. That is, the gate electrode 114 may serve as the lower electrode Cst1 of the storage capacitor Cst.

[0159] In this manner, the storage capacitor Cst and the thin film transistor TFT may overlap each other. In some embodiments, the storage capacitor Cst may not overlap the thin film transistor TFT.

[0160] The upper electrode Cst2 may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W) and / or copper (Cu).

[0161] The interlayer insulating layer 115 may cover the upper electrode Cst2. The interlayer insulating layer 115 may include silicon oxide (SiO 2 ), Silicon Nitride (SiN x ), silicon oxynitride (SiON), aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), Tantalum Oxide (Ta 2 O 5 ), hafnium oxide (HfO 2 ) or zinc oxide (ZnO 2 ). The interlayer insulating layer 115 may have a single-layer structure or a multi-layer structure including any one of the above-described inorganic insulating materials.

[0162] Each of the drain electrode 116a and the source electrode 116b may be located on the interlayer insulating layer 115. The drain electrode 116a and the source electrode 116b may include any one of materials having good conductivity. The drain electrode 116a and the source electrode 116b may include any one of conductive materials including Mo, Al, Cu, and Ti, and may have a multilayer structure or a single layer structure including the materials described above. In an embodiment, the drain electrode 116a and the source electrode 116b may have a multilayer structure of Ti / Al / Ti.

[0163] The planarization insulating layer 117 may include an organic insulating layer. The planarization insulating layer 117 may include any one of a general polymer such as polymethyl methacrylate (PMMA) or polystyrene (PS), a polymer derivative having a phenolic group, an acrylic polymer, an aryl ether polymer, an amide polymer, a fluorine polymer, a paraxylene polymer, and a vinyl alcohol polymer, and an organic insulating material such as a mixture thereof.

[0164] The display element layer DEL is located on the pixel circuit layer PCL having the structure described above. The display element layer DEL may include an organic light emitting diode OLED, and a pixel electrode 121 of the organic light emitting diode OLED may be electrically connected to the thin film transistor TFT via a contact hole of the planarization insulating layer 117 .

[0165] The pixel P may include an organic light emitting diode OLED and a thin film transistor TFT. Each pixel P may emit, for example, red light, green light, or blue light, or red light, green light, blue light, or white light via the organic light emitting diode OLED.

[0166] In an embodiment, the pixel electrode 121 may include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In 2 O 3 ), indium gallium oxide (IGO) or aluminum zinc oxide (AZO). In another embodiment, the pixel electrode 121 may include a reflective layer containing silver (Ag), magnesium (Mg), Al, Pt, Pd, Au, Ni, Nd, Ir, Cr or a compound thereof. In another embodiment, the pixel electrode 121 may further include a reflective layer containing ITO, IZO, ZnO or In on / under the reflective layer described above. 2 O 3 layer.

[0167] A pixel defining layer 119 having an opening 119OP for exposing the center of the pixel electrode 121 is located on the pixel electrode 121. The pixel defining layer 119 may include an organic insulating material and / or an inorganic insulating material. The opening 119OP may be configured to define an emission area EA of light emitted from the organic light emitting diode OLED. For example, the width of the opening 119OP may correspond to the width of the emission area EA.

[0168] The emission layer 122 may be located in the opening 119OP of the pixel defining layer 119. The emission layer 122 may include a polymer or a small molecular weight organic material that emits light having a specific color. The emission layer 122 described above may be formed using the apparatus 1 for manufacturing the display device 100.

[0169] Although not shown, in an embodiment, the first functional layer and the second functional layer may be located under and on the emission layer 122, respectively. The first functional layer may include a hole transport layer (HTL) or a hole injection layer (HIL). The second functional layer, which is an element located on the emission layer 122, is optional. The second functional layer may include an electron transport layer (ETL) and / or an electron injection layer (EIL). In an embodiment, the first functional layer and / or the second functional layer may be a common layer for completely covering the substrate 101, as in the common electrode 123 described below.

[0170] The common electrode 123 may include a conductive material having a small work function. For example, the common electrode 123 may include a (semi) transparent layer including Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, lithium (Li), Ca, or an alloy thereof. In an embodiment, the common electrode 123 may further include ITO, IZO, ZnO, or In on the (semi) transparent layer including the materials described above. 2 O 3 .

[0171] In an embodiment, the thin film encapsulation layer TFE may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. Fig.11 It is illustrated that the thin film encapsulation layer TFE includes a first inorganic encapsulation layer 131 , an organic encapsulation layer 132 , and a second inorganic encapsulation layer 133 which are sequentially stacked.

[0172] The first inorganic encapsulation layer 131 and the second inorganic encapsulation layer 133 may include one or more inorganic materials among aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride and silicon oxynitride. The organic encapsulation layer 132 may include any one of polymer materials. The polymer material may include any one of acrylic resin, epoxy resin, polyimide and polyethylene. In an embodiment, the organic encapsulation layer 132 may include acrylate.

[0173] In another embodiment, the thin film encapsulation layer TFE may have a structure in which the substrate 101 and the upper substrate which is a transparent member are connected to each other via a sealing member, and therefore, the internal space between the substrate 101 and the upper substrate is sealed. In this case, a hygroscopic agent or a filling material may be deposited in the internal space. The sealing member may be a sealant. In an embodiment, the sealing member may include a material cured by a laser. For example, the sealing member may be a glass frit. In an embodiment, the sealing member may include a polyurethane resin, an epoxy resin, or an acrylic resin which is an organic sealant, or silicon which is an inorganic sealant. For example, polyurethane acrylate may be used as a polyurethane resin. For example, butyl acrylate or ethylhexyl acrylate may be used as an acrylic resin. In an embodiment, the sealing member may include a material cured by heat.

[0174] In an embodiment, a touch electrode layer (not shown) including a touch electrode may be located on the thin film encapsulation layer TFE, and an optical function layer (not shown) may be located on the touch electrode layer. The touch electrode layer may obtain coordinate information due to external input such as a touch event. The optical function layer may reduce the reflectivity of light (external light) incident on the display device 100 from the outside and / or may improve the color purity of light emitted from the display device 100. In an embodiment, the optical function layer may include a retarder and a polarizer. The retarder may be a film type or a liquid crystal coating type, and may include a λ / 2 retarder and / or a λ / 4 retarder. The polarizer may also be a film type or a liquid crystal coating type. The film type may include an elongated synthetic resin film, and the liquid crystal coating type may include liquid crystals arranged in a specific arrangement (e.g., a predetermined arrangement). In an embodiment, the retarder and the polarizer may further include a protective film.

[0175] In another embodiment, the optical functional layer may include a black matrix and a color filter. The color filter may be arranged in consideration of the color of the light emitted from each of the pixels P of the display device 100. Each of the color filters may include a red, green or blue pigment or dye. In an embodiment, in addition to the pigment or dye described above, each of the color filters may further include quantum dots. In another embodiment, a portion of the color filter may not include the pigment or dye described above, and may include scattering particles such as titanium oxide.

[0176] In another embodiment, the optical function layer may include a destructive interference structure. The destructive interference structure may include a first reflective layer and a second reflective layer located on different layers. The first reflected light and the second reflected light reflected from the first reflective layer and the second reflective layer, respectively, may destructively interfere. Therefore, the reflectivity of the external light may be reduced.

[0177] In an embodiment, the adhesive member may be located between the touch electrode layer and the optical function layer. A general adhesive member known in the art may be used as the adhesive member without limitation. In an embodiment, the adhesive member may be a pressure sensitive adhesive (PSA).

[0178] As described above, in one or more embodiments, at least a portion of the dummy opening includes a center arranged to deviate from an imaginary straight line connecting the centers of the deposition openings, so that a sturdy and non-breakable mask assembly, an apparatus for manufacturing a display device, and a method for manufacturing a display device can be provided.

[0179] It should be understood that the embodiments described herein should be considered illustrative rather than for limiting purposes. The description of features or aspects in each embodiment should generally be considered applicable to other similar features or aspects in other embodiments. Although some embodiments have been described with reference to the accompanying drawings, it will be understood by those of ordinary skill in the art that various changes in form and detail may be made thereto without departing from the spirit and scope set forth in the appended claims.

Claims

1. A mask assembly, include: a mask frame including an opening and a portion surrounding the opening; as well as a mask, arranged on the mask frame, stretched in a first direction, and comprising a first region and a second region, wherein a deposition material may pass through the first region corresponding to the opening, and the second region is around the first region, wherein the first region includes a deposition opening, and The second region includes dummy openings, wherein at least some of the dummy openings include centers arranged to deviate from a straight line extending in the first direction connecting centers of the deposition openings, and at least some of the dummy openings are arranged along the same straight line as the deposition openings, and A width of each of the deposition openings is the same as a width of each of the dummy openings.

2. The mask assembly according to claim 1, in, A planar shape of each of the deposition openings is the same as a planar shape of each of the dummy openings.

3. The mask assembly according to claim 1, in, The dummy opening includes a first opening and a second opening, and The first opening includes a center arranged to be deviated from the straight line connecting the centers of the deposition openings.

4. The mask assembly according to claim 3, in, The second opening includes a center arranged to be offset from a straight line connecting the centers of the first openings, and The first openings and the second openings are alternately arranged in the first direction from the deposition opening to the dummy opening.

5. The mask assembly according to claim 3, in, The second opening is arranged along the same straight line as the deposition opening.

6. The mask assembly according to claim 5, in, The distance at which the second openings are arranged along the same straight line as the deposition openings is constant.

7. The mask assembly according to claim 1, in, A first distance between adjacent deposition openings among the deposition openings is the same as a second distance between adjacent dummy openings among the dummy openings.

8. The mask assembly according to claim 1, in, The width of the mask is smaller than the width of the opening, and The mask assembly includes a plurality of masks including the mask arranged on the mask frame.

9. The mask assembly according to claim 1, in, The second region is between the first region and the mask frame.

10. The mask assembly according to claim 1, in, The second region surrounds at least a portion of the first region.

11. A mask assembly, include: a mask frame including an opening and a portion surrounding the opening; as well as a mask, arranged on the mask frame, stretched in a first direction, and comprising a first region through which a deposition material can pass and a second region around the first region, wherein the first region includes a plurality of first portions configured to shield the deposition material and extending in the first direction, and A first portion among the plurality of first portions extends from the first region to the second region, extends in the second region, and is connected to a second portion among a plurality of second portions in the second region extending in a second direction intersecting the first direction, and A width of a first portion among the plurality of first portions is the same as a width of a second portion among the plurality of second portions.

12. The mask assembly according to claim 11, in, A first portion among the plurality of first portions is connected to a third portion among a plurality of third portions extending in a third direction intersecting the first direction.

13. An apparatus for manufacturing a display device, the apparatus include: a chamber in which a substrate may be placed; a deposition source located inside the chamber and configured to supply a deposition material into the chamber; as well as a mask assembly facing the deposition source and configured to allow the deposition material to flow through the mask assembly toward the substrate; Wherein, the mask assembly comprises: a mask frame including an opening and a portion surrounding the opening; and a mask, arranged on the mask frame, stretched in a first direction, and comprising a first region and a second region, wherein the deposition material can pass through the first region corresponding to the opening, and the second region is around the first region, wherein the first region includes a deposition opening, and The second region includes dummy openings, wherein at least some of the dummy openings include centers arranged to deviate from a straight line extending in the first direction connecting centers of the deposition openings, and at least some of the dummy openings are arranged along the same straight line as the deposition openings, and A width of each of the deposition openings is the same as a width of each of the dummy openings.

14. The device according to claim 13, in, A planar shape of each of the deposition openings is the same as a planar shape of each of the dummy openings.

15. The device according to claim 13, in, The dummy opening includes a first opening and a second opening, and The first opening includes a center arranged to be deviated from the straight line connecting the centers of the deposition openings.

16. The device according to claim 15, in, The second opening includes a center arranged to be offset from a straight line connecting the centers of the first openings, and The first openings and the second openings are alternately arranged in the first direction from the deposition opening to the dummy opening.

17. The device according to claim 15, in, The second opening is arranged along the same straight line as the deposition opening.

18. The device according to claim 17, in, A distance between the second openings arranged along the same straight line as the deposition openings is constant.

19. The device according to claim 13, in, A first distance between adjacent deposition openings among the deposition openings is the same as a second distance between adjacent dummy openings among the dummy openings.

20. A method for manufacturing a display device, the method include: placing a substrate in a chamber; supplying a deposition material into the chamber by using a deposition source located inside the chamber; and forming an organic layer on the substrate by using the deposition material passing through a mask assembly facing the deposition source, Wherein, the mask assembly comprises: a mask frame including an opening and a portion surrounding the opening; and a mask arranged on the mask frame, stretched in a first direction, and comprising a first region and a second region, wherein the deposition material passes through the first region corresponding to the opening, and the second region is around the first region, and The first region includes a deposition opening, and The second region includes dummy openings, wherein at least some of the dummy openings include centers arranged to deviate from a straight line extending in the first direction connecting centers of the deposition openings, and at least some of the dummy openings are arranged along the same straight line as the deposition openings, and A width of each of the deposition openings is the same as a width of each of the dummy openings.

21. The method according to claim 20, in, A planar shape of each of the deposition openings is the same as a planar shape of each of the dummy openings.

22. The method according to claim 20, in, The dummy opening includes a first opening and a second opening, and The first opening includes a center arranged to be deviated from the straight line connecting the centers of the deposition openings.

23. The method according to claim 22, in, The second opening includes a center arranged to be offset from a straight line connecting the centers of the first openings, and The first openings and the second openings are alternately arranged in the first direction from the deposition opening to the dummy opening.

24. The method according to claim 22, in, The second opening is arranged along the same straight line as the deposition opening.

25. The method according to claim 24, in, The distance at which the second openings are arranged along the same straight line as the deposition openings is constant.

26. The method according to claim 20, in, A first distance between adjacent deposition openings among the deposition openings is the same as a second distance between adjacent dummy openings among the dummy openings.

27. The method according to claim 20, in, The width of the mask is smaller than the width of the opening, and The mask assembly includes a plurality of masks including the mask arranged on the mask frame.

28. The method according to claim 20, in, The second region is between the first region and the mask frame.

29. The method according to claim 20, in, The second region surrounds at least a portion of the first region.

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