Sensing unit and display device including the same

Abstract

A sensing unit and a display apparatus are disclosed. The sensing unit includes a first group of a plurality of first sensing electrodes disposed in a first direction in a sensing area, and a first sensing line electrically connected to one of the first sensing electrodes of the first group. The first sensing line is disposed in the sensing area and extends in a second direction intersecting the first direction.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2019-0142424, filed on November 8, 2019, with the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] Exemplary embodiments of this disclosure relate to a sensing unit and a display device including the sensing unit. Background Technology

[0004] Electronic devices that provide images to users, such as smartphones, tablet PCs, digital cameras, laptops, navigation devices, and televisions (TVs), include display devices for displaying images. Display devices include display panels configured to generate and display images, as well as various input devices.

[0005] The sensing unit can be one of multiple information input devices and can be provided and used in a display device. The sensing unit can be attached to a surface of the display panel of the display device, or it can be integrally manufactured with the display panel. Users can input information by pressing or touching the sensing unit while viewing an image displayed on the screen of the display device.

[0006] The sensing unit may include a first sensing electrode electrically connected in one direction and a second sensing electrode electrically connected in another direction intersecting the one direction, and may include sensing lines connected to the sensing electrodes. Summary of the Invention

[0007] This disclosure provides a sensing unit that allows for a reduction in the non-display area and a display device that allows for a reduction in the non-display area.

[0008] According to an exemplary embodiment, the sensing unit includes a plurality of first sensing electrodes disposed in a sensing region in a first direction, and a first sensing line electrically connected to one of the first sensing electrodes in the first group. The first sensing line is disposed in the sensing region and extends in a second direction intersecting the first direction.

[0009] According to an exemplary embodiment, the sensing unit includes a plurality of first sensing electrodes in a first group disposed in a sensing region in a first direction, and a plurality of first sensing electrodes in a second group disposed in the first direction, wherein the second group is spaced apart from the first group. The sensing unit also includes a first sensing line electrically connected to one of the first sensing electrodes in the first group. The first sensing line is disposed in the sensing region and overlaps with the first sensing electrodes of the second group in the thickness direction of the first sensing line.

[0010] According to an exemplary embodiment, a display device includes: a substrate including a display area; a light-emitting layer disposed on the substrate; and a sensing unit disposed on the light-emitting layer. The sensing unit includes a plurality of first sensing electrodes and a first sensing line disposed in a sensing area overlapping the display area in a first direction, the first sensing lines being electrically connected to one of the first sensing electrodes in the first group. The first sensing lines are disposed in the sensing area and extend in a second direction intersecting the first direction. Attached Figure Description

[0011] The above and other aspects and features of this disclosure will become clearer from a detailed description of exemplary embodiments thereof with reference to the accompanying drawings.

[0012] Figure 1 This is a perspective view of a display device according to an exemplary embodiment.

[0013] Figure 2 yes Figure 1 A floor plan of the display device.

[0014] Figure 3 and Figure 4 yes Figure 1 A side view of the display device.

[0015] Figure 5 It is along Figure 2 A sectional view taken by line V-V'.

[0016] Figure 6 It is shown that... Figure 5 A floor plan of the components related to the display unit.

[0017] Figure 7 It is shown that... Figure 5 A plan view of the components related to the sensing unit.

[0018] Figure 8 yes Figure 7 A magnified view of region A.

[0019] Figure 9 yes Figure 8 A magnified view of region B.

[0020] Figure 10 yes Figure 8 A magnified view of region C.

[0021] Figure 11 It is along Figure 9 The sectional view taken by line XI-XI'.

[0022] Figure 12 It is along Figure 10 A sectional view taken from line XII-XII'.

[0023] Figure 13 and Figure 14 This is an enlarged view of the sensing layer according to an exemplary embodiment.

[0024] Figure 15 It is along Figure 13 A sectional view taken from line XV-XV'.

[0025] Figure 16 It is along Figure 14 A sectional view taken by line XVI-XVI'.

[0026] Figure 17 This is a plan view illustrating components associated with a sensing unit according to an exemplary embodiment.

[0027] Figure 18 yes Figure 17 A magnified view of region D.

[0028] Figure 19 yes Figure 18 A magnified view of region E.

[0029] Figure 20 yes Figure 18 A magnified view of region F.

[0030] Figure 21 It is along Figure 19 A sectional view taken from line XXI-XXI'.

[0031] Figure 22 It is along Figure 20 A sectional view taken from line XXII-XXII'.

[0032] Figure 23 This is a plan view illustrating components associated with a sensing unit according to an exemplary embodiment. Detailed Implementation

[0033] In the following description, exemplary embodiments of the present disclosure will be described more fully with reference to the accompanying drawings. Throughout the drawings, the same reference numerals may refer to the same elements.

[0034] It should be understood that when a component, such as a membrane, region, layer, or element, is referred to as being "on," "connected to," "attached to," or "adjacent to" another component, it may be directly on, directly connected to, directly attached to, or immediately adjacent to the other component, or there may be intermediary components present. It should also be understood that when a component is referred to as being "between" two components, it may be the only component between the two components, or there may be one or more intermediary components present. Furthermore, it should be understood that when a component is referred to as "covering" another component, it may be the only component covering that other component, or one or more intermediary components may also cover that other component. Other terms used to describe relationships between elements should be interpreted in a similar manner.

[0035] While the terms “first,” “second,” etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Therefore, without departing from the teachings of one or more exemplary embodiments, the first element described below may be referred to as the second element.

[0036] Features of the various exemplary embodiments of this disclosure can be combined in part or in whole. Technically, various interactions and operations are possible. The various exemplary embodiments can be implemented individually or in combination.

[0037] It should be understood that, unless the context clearly indicates otherwise, the description of features or aspects within each exemplary implementation should generally be considered applicable to other similar features or aspects in other exemplary implementations.

[0038] As used in this article, the singular forms “a”, “an”, and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0039] In this document, when two or more elements or values ​​are described as substantially the same or substantially equal to each other, it should be understood that, as those skilled in the art will understand, the elements or values ​​are consistent with each other, indistinguishable from each other, or distinguishable from each other but functionally identical. For example, as those skilled in the art will understand, when two or more elements or values ​​are substantially the same or substantially equal to each other but inconsistent with each other, it should be understood that the two or more elements or values ​​are substantially the same or equal to each other within the measurement error range.

[0040] Figure 1 This is a perspective view of a display device according to an exemplary embodiment. Figure 2 yes Figure 1 A floor plan of the display device. Figure 3 and Figure 4 yes Figure 1 A side view of the display device.

[0041] In this specification, the terms "above," "upper," "top," and "upper surface" refer to the upward direction based on the display panel 100, i.e., the positive Z-axis direction, and the terms "below," "lower," "bottom," and "lower surface" refer to the downward direction based on the display panel 100, i.e., the negative Z-axis direction. Furthermore, the terms "left," "right," "up," and "down" refer to the direction when the display panel 100 is viewed in a plan view. For example, the term "right" refers to the positive X-axis direction, the term "left" refers to the negative X-axis direction, the term "up" refers to the positive Y-axis direction, and the term "down" refers to the negative Y-axis direction.

[0042] refer to Figures 1 to 4 The display device 10 is a device for displaying still or moving images. The display device 10 can be used as a display screen for portable electronic devices such as mobile phones, smartphones, tablet PCs, smartwatches, mobile communication terminals, electronic notebooks, e-books, portable multimedia players (PMPs), navigation devices, and ultra-mobile PCs (UMPCs). The display device 10 can also be used as a display screen for various products such as televisions, laptops, monitors, billboards, and Internet of Things (IoT) devices. The display device 10 can be any of, for example, an organic light-emitting display device, a liquid crystal display device, a plasma display device, a field emission display device, an electrophoretic display device, an electrowetting display device, a quantum dot light-emitting display device, and a micro light-emitting diode (LED) display device. Hereinafter, the display device 10 will primarily be described as an organic light-emitting display device, but this disclosure is not limited thereto.

[0043] The display device 10 according to an exemplary embodiment includes a display panel 100, a display driving circuit 200, a circuit board 300, and a touch driving circuit 400.

[0044] The display panel 100 may include a main area MA and a protruding area PA that protrudes from one side of the main area MA.

[0045] The main region MA can be formed as a rectangular plane having a short side in a first direction (X-axis direction) and a long side in a second direction (Y-axis direction) intersecting the first direction (X-axis direction). The corner where the short side in the first direction (X-axis direction) intersects the long side in the second direction (Y-axis direction) can be rounded to have a certain curvature, or formed at a right angle. The planar shape of the display device 10 is not limited to a quadrilateral shape, but can be formed as another shape, such as, for example, a polygonal shape, a circular shape, or an elliptical shape. The main region MA can be formed as a flat shape, but this disclosure is not limited thereto. The main region MA may include curved portions formed at its left and right ends. In this case, the curved portions may have a constant curvature or a variable curvature.

[0046] The main region MA can include the display region DA and the non-display region NDA, wherein pixels are formed in the display region DA to display the image, and the non-display region NDA is the outer region of the display region DA and no pixels are formed therein.

[0047] In addition to pixels, scan lines, data lines, and power lines connected to the pixels can be set in the display area DA. When the main area MA includes a curved portion, the display area DA can be set on the curved portion. In this case, the image of the display panel 100 can also be observed on the curved portion.

[0048] The non-display area NDA can be defined as the area from the outer edge of the display area DA to the edge of the display panel 100. A scan driver configured to apply a scan signal to a scan line and a link line configured to connect a data line and a display drive circuit 200 can be provided in the non-display area NDA.

[0049] The protruding region PA can protrude from one side of the main region MA. For example, as shown... Figure 2 As shown, the protruding region PA can protrude from the lower side of the main region MA. The length of the protruding region PA in the first direction (X-axis direction) can be less than the length of the main region MA in the first direction (X-axis direction).

[0050] The prominent area PA can include a curved area BA and a pad area PDA. In this case, the pad area PDA can be located on one side of the curved area BA, and the main area MA can be located on the other side of the curved area BA. For example, the pad area PDA can be located on the lower side of the curved area BA, and the main area MA can be located on the upper side of the curved area BA.

[0051] The display panel 100 can be formed to be flexible, so that it can be bent, folded, or rolled. Therefore, the display panel 100 can be bent from the bending region BA in the thickness direction (Z-axis direction). Figure 3As shown, before the display panel 100 is bent, one surface of the pad area of ​​the display panel 100 PDA faces upwards. Figure 4 As shown, after the display panel 100 is bent, one surface of the pad area PDA of the display panel 100 faces downwards. Therefore, the pad area PDA can be disposed on the lower portion of the main area MA, and thus can overlap with the main area MA.

[0052] The pads electrically connected to the display driver circuit 200 and the circuit board 300 can be set in the pad area of ​​the display panel 100 PDA.

[0053] The lower panel cover 101 can be disposed below the display panel 100. The lower panel cover 101 can be attached to the lower surface of the display panel 100 by means of an adhesive component. The adhesive component can be a pressure-sensitive adhesive (PSA).

[0054] The lower cover 101 of the panel may include a light-absorbing component, a buffer component, and a heat-dissipating component. The light-absorbing component is configured to absorb light incident from the outside, the buffer component is configured to absorb external impacts, and the heat-dissipating component is configured to effectively dissipate heat from the display panel 100.

[0055] A light-absorbing component may be disposed below the display panel 100. The light-absorbing component blocks the transmission of light to prevent components disposed below the light-absorbing component (i.e., circuit board 300, etc.) from being seen from above the display panel 100. The light-absorbing component may include a light-absorbing material, such as black pigment or black dye.

[0056] A buffer member may be disposed below the light-absorbing member. The buffer member absorbs external impacts to prevent damage to the display panel 100. The buffer member may comprise a single layer or multiple layers. For example, the buffer member may be made of a polymer resin (such as, for example, polyurethane, polycarbonate, polypropylene, or polyethylene), or it may be made of an elastic material (such as a sponge formed from foamed rubber, a urethane-based material, or an acrylic-based material). The buffer member may be a buffer layer.

[0057] The heat dissipation component may be disposed below the buffer component. The heat dissipation component may include a first heat dissipation layer containing graphite or carbon nanotubes and a second heat dissipation layer formed as a thin film of metal (such as, for example, copper, nickel, ferrite or silver), the second heat dissipation layer being capable of shielding electromagnetic waves and having high thermal conductivity.

[0058] like Figure 3As shown, to facilitate bending of the display panel 100, in an exemplary embodiment, the lower panel cover 101 is not disposed in the bending region BA of the display panel 100. Since the display panel 100 bends in the bending region BA and the pad region PDA is disposed below the main region MA, the pad region PDA can overlap with the main region MA. Therefore, the lower panel cover 101 disposed in the main region MA of the display panel 100 and the lower panel cover 101 disposed in the pad region PDA of the display panel 100 can be attached by an adhesive member 102. The adhesive member 102 can be a PSA (Power Supplemental Assembly).

[0059] The display driver circuit 200 outputs signals and voltages for driving the display panel 100. For example, the display driver circuit 200 can provide data voltages to data lines. Furthermore, the display driver circuit 200 can provide power supply voltages to power lines and scan control signals to the scan driver. The display driver circuit 200 can be formed as an integrated circuit (IC) and can be mounted on the display panel 100 in the pad area of ​​the PDA using methods such as chip-on-glass (COG), chip-on-plastic (COP), or ultrasonic bonding, but this disclosure is not limited thereto. For example, the display driver circuit 200 can be mounted on a circuit board 300.

[0060] The pads may include display pads electrically connected to the display driver circuit 200 and sensing pads electrically connected to the sensing lines.

[0061] The circuit board 300 can be attached to pads using an anisotropic conductive film. Therefore, the leads of the circuit board 300 can be electrically connected to the pads. The circuit board 300 can be a flexible printed circuit board, a printed circuit board, or a flexible film such as a chip-on-film.

[0062] The touch driving circuit 400 can be connected to the sensing layer TSL of the display panel 100 (see...). Figure 5 The touch driving circuit 400 applies a driving signal to the sensing electrodes of the sensing layer TSL and measures the mutual capacitance value of the sensing electrodes. The driving signal can be a signal with multiple driving pulses. The touch driving circuit 400 can determine whether a user touch is input and whether the user is near the display device 10 based on the mutual capacitance value. A user touch means that an object such as a user's finger or pen directly touches a surface of the display device 10 disposed on the sensing layer TSL. A user proximity means that an object such as a user's finger or pen hovers over the surface of the display device 10 without touching the surface of the display device 10.

[0063] The touch driver circuit 400 can be disposed on the circuit board 300. The touch driver circuit 400 can be formed as an IC and mounted on the circuit board 300.

[0064] Figure 5 It is along Figure 2 A sectional view taken by line V-V'.

[0065] Reference Figure 5 The display panel 100 may include a display unit DU and a sensing unit TDU. The display unit DU includes a substrate SUB and a thin film transistor layer TFTL, a light-emitting element layer EML, and a thin film encapsulation layer TFEL disposed on the substrate SUB. The sensing unit TDU includes a sensing layer TSL.

[0066] The substrate SUB can be made of an insulating material, such as glass, quartz, or a polymer resin. Examples of polymer resins may be selected from polyethersulfone (PES), polyacrylate (PA), polyarylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyimide (PI), polycarbonate (PC), cellulose triacetate (CAT), cellulose acetate propionate (CAP), and combinations thereof. Alternatively, the substrate SUB may comprise a metallic material.

[0067] The substrate SUB can be a rigid substrate or a flexible substrate that is bendable, foldable, or rollable. When the substrate SUB is a flexible substrate, it can be made of PI, but this disclosure is not limited thereto.

[0068] A thin-film transistor layer (TFTL) can be disposed on a substrate (SUB). In addition to the thin-film transistors in each pixel, scan lines, data lines, power lines, scan control lines, and wiring connecting pads and data lines can be formed in the TFTL. Each thin-film transistor may include a gate electrode, a semiconductor layer, a source electrode, and a drain electrode. When... Figure 6 When the scan driver SD is formed in the non-display area NDA of the display panel 100, the scan driver SD may include a thin-film transistor.

[0069] Thin-film transistor (TFTL) layers can be disposed in the display area (DA) and the non-display area (NDA). For example, the thin-film transistors, scan lines, data lines, and power lines of each pixel in the TFTL can be disposed in the display area (DA). The scan control lines and link lines of the TFTL can be disposed in the non-display area (NDA). The following will refer to... Figure 11 and Figure 12 Describe the thin-film transistor layer (TFTL) in detail.

[0070] A light-emitting element layer (EML) can be disposed on a thin-film transistor layer (TFTL). The EML may include pixels and pixel-defining layers defining the pixels, wherein each pixel includes a first electrode, a light-emitting layer, and a second electrode. The light-emitting layer may be an organic light-emitting layer comprising organic materials. In this case, the light-emitting layer may include a hole transport layer, an organic light-emitting layer, and an electron transport layer. When a specific voltage is applied to the first electrode through the thin-film transistor of the TFTL and a cathode voltage is applied to the second electrode, holes and electrons move through the hole transport layer and the electron transport layer to the organic light-emitting layer and recombine with each other in the organic light-emitting layer to emit light. The pixels of the EML can be disposed in the display area (DA). References will follow below. Figure 11 and Figure 12 Describe the light-emitting element layer (EML) in detail.

[0071] A thin-film encapsulation layer (TFEL) can be disposed on the light-emitting element layer (EML). The TFEL serves to prevent oxygen or moisture from penetrating into the EML. For this purpose, the TFEL may include at least one inorganic layer. The inorganic layer may be, for example, a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer, but is not limited thereto. Furthermore, the TFEL protects the EML from foreign matter such as dust. For this purpose, the TFEL may include at least one organic layer. The organic layer may be made of, for example, acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, etc., but this disclosure is not limited thereto.

[0072] The thin-film encapsulation layer TFEL can be disposed in both the display area DA and the non-display area NDA. For example, the thin-film encapsulation layer TFEL can be configured to cover the thin-film transistor layer TFTL in both the display area DA and the non-display area NDA, and to cover the light-emitting element layer EML in the display area DA. References will follow below. Figure 11 and Figure 12 Describe the thin-film encapsulation layer TFEL in detail.

[0073] The sensing layer TSL can be disposed on the thin-film encapsulation layer TFEL. Since the sensing layer TSL is disposed directly on the thin-film encapsulation layer TFEL, the thickness of the display device 10 can be reduced compared to the case where a separate touch panel including the sensing layer TSL is attached to the thin-film encapsulation layer TFEL.

[0074] The sensing layer TSL may include multiple sensing electrodes for sensing a user's touch using a mutual capacitance method, and sensing lines connecting the pads and the sensing electrodes. For example... Figure 7 As shown, the sensing electrodes of the sensing layer TSL can be disposed in the sensing region TSA, which overlaps with the display region DA. Figure 7As shown, the sensing lines of the sensing layer TSL can be configured to partially overlap with the sensing area TSA. Therefore, the non-display area NDA of the display device 10 can be reduced, as will be described below.

[0075] A polarizing film can be disposed on the sensing layer TSL. The polarizing film may include a linear polarizer and a phase retardation film such as a quarter-wave plate. In this case, the phase retardation film can be disposed on the sensing layer TSL, and the linear polarizer can be disposed on the phase retardation film. Furthermore, a cover window can be disposed on the polarizing film. The cover window can be attached to the polarizing film using a transparent adhesive member such as an optically transparent adhesive (OCA) film.

[0076] Figure 6 It is shown that... Figure 5 A plan view of the components related to the display unit DU.

[0077] For ease of description, Figure 6 The image only shows the pixel P of the display unit DU, the scan line SL, the data line DL, the scan control line SCL, the fan-out line DLL, the scan driver SD, the display driver circuit 200, and the display pad DP.

[0078] Reference Figure 6 The scan line SL, data line DL, and pixel P are set in the display area DA. The scan line SL can be formed to extend in a first direction (X-axis direction), and the data line DL can be formed to extend in a second direction (Y-axis direction) intersecting the first direction (X-axis direction).

[0079] Each of the pixels P can be connected to at least one of the scan lines SL and one of the data lines DL. Each of the pixels P may include a thin-film transistor having a driving transistor and at least one switching transistor, a light-emitting element, and a capacitor. When a scan signal is applied from the scan line SL, each of the pixels P can receive a data voltage from the data line DL and can provide a driving current to the light-emitting element to emit light in response to the data voltage applied to the gate electrode. The light-emitting element has been mainly described as an organic light-emitting element including an anode, an organic light-emitting layer, and a cathode, but this disclosure is not limited thereto. The light-emitting element can be implemented as, for example: a quantum dot light-emitting element including an anode, a quantum dot light-emitting layer, and a cathode; an inorganic light-emitting element including an anode, an inorganic light-emitting layer having an inorganic semiconductor, and a cathode; or a micro light-emitting element including a micro light-emitting diode.

[0080] The scan driver SD is connected to the display driver circuit 200 via multiple scan control lines SCL. Therefore, the scan driver SD can receive scan control signals from the display driver circuit 200. In response to the scan control signals, the scan driver SD generates scan signals and provides the scan signals to the scan lines SL.

[0081] exist Figure 6 In this illustration, the scan driver SD is shown as being formed in a non-display area NDA outside the left side of the display area DA, but this disclosure is not limited thereto. For example, the scan driver SD may be formed in non-display areas NDA outside the left and right sides of the display area DA.

[0082] The display driver circuit 200 is connected to the display pad DP and receives digital video data and timing signals. The display driver circuit 200 converts the digital video data into analog positive / negative data voltages and provides these analog positive / negative data voltages to the data line DL via the fan-out line DLL. Furthermore, the display driver circuit 200 generates a scan control signal for controlling the scan driver SD and provides this scan control signal via multiple scan control lines SCL. The scan signal from the scan driver SD selects the pixel P to which the data voltage is provided, and the data voltage is provided to the selected pixel P. The display driver circuit 200 can be formed as an IC and can be attached to the substrate SUB by, for example, a chip-on-glass (COG) method, a chip-on-plastic (COP) method, or an ultrasonic bonding method. However, this disclosure is not limited thereto. For example, the display driver circuit 200 can be mounted on a circuit board 300.

[0083] like Figure 6 As shown, the display panel 100 may include a display pad DP electrically connected to the display driving circuit 200 and sensing pads TP1 and TP2 electrically connected to sensing lines. The display pad region DPA, where the display pad DP is located, may be positioned between a first sensing pad region TPA1, where a first sensing pad TP1 is located, and a second sensing pad region TPA2, where a second sensing pad TP2 is located. Figure 6 As shown, the display pad area DPA can be located at the center of one end of the protruding area PA, the first sensing pad area TPA1 can be located on the left side of one end of the protruding area PA, and the second sensing pad area TPA2 can be located on the right side of one end of the protruding area PA. The first sensing pad area TPA1 and the second sensing pad area TPA2 can be part of the sensing peripheral area TPA, which will be described below.

[0084] The circuit board 300 can be attached to the display pad DP and the sensing pads TP1 and TP2 using an anisotropic conductive film. Therefore, the leads of the circuit board 300 can be electrically connected to the display pad DP and the sensing pads TP1 and TP2. The circuit board 300 can be, for example, a flexible printed circuit board (FPCB), a printed circuit board (PCB), or a flexible film such as chip on film (COF).

[0085] The touch driving circuit 400 can be connected to the sensing electrodes of the sensing unit TDU of the display panel 100. The touch driving circuit 400 applies a driving signal to the sensing electrodes and measures the mutual electrostatic capacitance (hereinafter referred to as "mutual capacitance") of the sensing electrodes. The driving signal can be a signal with multiple driving pulses. The touch driving circuit 400 can calculate the touch coordinates at the input touch point based on the mutual capacitance.

[0086] The touch driver circuit 400 can be disposed on the circuit board 300. The touch driver circuit 400 can be formed as an IC and mounted on the circuit board 300.

[0087] Figure 7 It is shown that... Figure 5 A plan view of the components related to the sensing unit (TDU).

[0088] For ease of description, Figure 7 Only the sensing electrodes RE and TE, the conductive pattern DE, the sensing lines RL and TL, and the sensing pads TP1 and TP2 are shown.

[0089] Reference Figure 7 The sensing unit TDU includes a sensing area TSA for sensing a user's touch and a sensing peripheral area TPA disposed around the sensing area TSA. The sensing area TSA may overlap with the display area DA of the display unit DU, and the sensing peripheral area TPA may overlap with the non-display area NDA of the display unit DU.

[0090] Sensing electrodes RE and TE can be disposed within the sensing region TSA. The sensing electrodes RE and TE may include a first sensing electrode RE and a second sensing electrode TE. Figure 7 In the exemplary embodiment shown, the first sensing electrode RE is described as a sensing electrode and the second sensing electrode TE is a driving electrode.

[0091] The first sensing electrode RE can be disposed in multiple rows located in a first direction (X-axis direction) and can be electrically connected to each other. The second sensing electrode TE can be disposed in multiple columns located in a second direction (Y-axis direction) intersecting the first direction (X-axis direction) and can be electrically connected to each other. Figure 7 In the diagram, each of the first sensing electrode RE and the second sensing electrode TE is shown to have a rhomboid planar shape, but the planar shape of each of the first sensing electrode RE and the second sensing electrode TE is not limited to this.

[0092] The first sensing electrode RE and the second sensing electrode TE can be electrically isolated from each other. The first sensing electrode RE and the second sensing electrode TE can be spaced apart from each other.

[0093] The dimensions of each of the first sensing electrodes RE and each of the second sensing electrodes TE can be substantially the same.

[0094] The conductive pattern DE can be electrically isolated from the first sensing electrode RE and the second sensing electrode TE. That is, the conductive pattern DE can be spaced apart from the first sensing electrode RE and the second sensing electrode TE. The conductive pattern DE can be surrounded by each of the first sensing electrode RE and the second sensing electrode TE.

[0095] The parasitic capacitance between the second electrode of the light-emitting element layer EML and either the first sensing electrode RE or the second sensing electrode TE can be reduced due to the conductive pattern DE. When the parasitic capacitance is reduced, the charging speed at which the mutual capacitance between the first sensing electrode RE and the second sensing electrode TE is charged can be increased.

[0096] Sensing lines RL and TL can extend from the sensing peripheral region TPA and can be disposed within the sensing region TSA. Sensing lines RL and TL can include a first sensing line RL connected to a first sensing electrode RE and a second sensing line TL connected to a second sensing electrode TE. Figure 7 In the exemplary embodiment shown, the first sensing line RL is described as a sensing line and the second sensing line TL is a driving line.

[0097] The first end portion of the first sensing line RL can be electrically connected to the first sensing electrode RE, and the second end portion of the first sensing line RL can be connected to the first sensing pad TP1.

[0098] A first sensing line RL can extend from a sensing peripheral region TPA in which a first sensing pad TP1 is disposed, and can be disposed in a sensing region TSA. The first sensing line RL can be electrically connected to a first sensing electrode RE in the sensing region TSA. The first sensing line RL can extend in a second direction (Y-axis direction) in the sensing region TSA.

[0099] The first sensing line RL can be electrically connected to one of the first sensing electrodes RE disposed in each row. For example, as Figure 7 As shown, the first sensing line RL can be electrically connected to the first sensing electrode RE disposed in the first column of the first row and the first sensing electrode RE disposed in the second column of the second row.

[0100] The first end portion of the second sensing line TL can be electrically connected to the second sensing electrode TE, and the second end portion of the second sensing line TL can be connected to the second sensing pad TP2.

[0101] The second sensing line TL can extend from the sensing peripheral region TPA, where the second sensing pad TP2 is disposed, to the edge of the sensing region TSA. The second sensing line TL can be electrically connected to the second sensing electrode TE at the edge of the sensing region TSA.

[0102] The second sensing line TL can be electrically connected to one of the second sensing electrodes TE disposed in each column. For example, as Figure 7 As shown, the second sensing line TL can be electrically connected to the second sensing electrode TE located at the lower end of the second sensing electrode TE that is electrically connected in the second direction (Y-axis direction).

[0103] The first sensing line RL can intersect with the second sensing line TL and overlap with the second sensing line TL in its thickness direction (Z-axis direction).

[0104] according to Figure 7 In the exemplary embodiment shown, the first sensing line RL can be disposed in the sensing region TSA that overlaps with the display region DA. Therefore, since no space is needed in the sensing peripheral region TPA for arranging the first sensing line RL, the non-display region NDA of the display device 10 can be reduced.

[0105] Figure 8 yes Figure 7 A magnified view of region A.

[0106] Reference Figure 8 In order to electrically isolate the first sensing electrode RE and the second sensing electrode TE from each other in their intersection region, the first sensing electrodes RE that are adjacent to each other in the first direction (X-axis direction) can be connected by the first connecting portion BE1, and the second sensing electrodes TE that are adjacent to each other in the second direction (Y-axis direction) can be connected by the second connecting portion BE2.

[0107] The first connection portion BE1 may have a shape extending from the first sensing electrode RE. The first connection portion BE1 may be disposed on the same layer as the first sensing electrode RE.

[0108] The second connection portion BE2 can be connected to the second sensing electrode TE through the first contact hole CNT1. The first contact hole CNT1 includes a first contact hole CNT1-1 and a first contact hole CNT1-2 (see...). Figure 9 The second connecting portion BE2 may have a shape that is bent at least once. Figure 8In the diagram, the second connecting portion BE2 is shown bent into a shape such as "<" or ">", but the shape of the second connecting portion BE2 is not limited to this. Furthermore, since the second sensing electrodes TE adjacent to each other in the second direction (Y-axis direction) are connected by multiple second connecting portions BE2, even if one of the second connecting portions BE2 is disconnected, the second sensing electrodes TE adjacent to each other in the second direction (Y-axis direction) can still be stably connected. Figure 8 In the diagram, adjacent second sensing electrodes TE are shown connected by two second connection portions BE2, but the number of second connection portions BE2 used to achieve this connection is not limited to two. In an exemplary embodiment, the second connection portions BE2 may be disposed on the same layer as the first sensing line RL. For example, in an exemplary embodiment, the second connection portions BE2 and the first sensing line RL may be disposed on a thin-film encapsulation layer TFEL (see [link to documentation]). Figure 11 and Figure 12 ).

[0109] The conductive pattern DE can be electrically isolated from the first sensing electrode RE and the second sensing electrode TE. Each of the conductive patterns DE can be surrounded by each of the first sensing electrode RE and the second sensing electrode TE. An opening OP can be formed between the conductive pattern DE and the first sensing electrode RE and between the conductive pattern DE and the second sensing electrode TE. In this case, each of the conductive patterns DE can be surrounded by the opening OP, and each of the first sensing electrode RE and the second sensing electrode TE can be configured to surround the opening OP.

[0110] The size of each of the conductive patterns DE can be smaller than the size of each of the first sensing electrode RE and the second sensing electrode TE. The conductive pattern DE can overlap with the first sensing line RL in its thickness direction (Z-axis direction). Figure 8 In the diagram, each of the first sensing electrode RE, the second sensing electrode TE, and the conductive pattern DE is shown to have a rhomboid planar shape, but the planar shape of each of the first sensing electrode RE, the second sensing electrode TE, and the conductive pattern DE is not limited thereto.

[0111] according to Figure 8 In the exemplary embodiment shown, first sensing electrodes RE adjacent to each other in the first direction (X-axis direction) can be connected via a first connection portion BE1, and second sensing electrodes TE adjacent to each other in the second direction (Y-axis direction) can be connected via a second connection portion BE2. Therefore, the first sensing electrodes RE and the second sensing electrodes TE can be electrically isolated from each other in their intersection region, the first sensing electrodes RE can be electrically connected in the first direction (X-axis direction), and the second sensing electrodes TE can be electrically connected in the second direction (Y-axis direction).

[0112] Figure 9 yes Figure 8 A magnified view of region B.

[0113] Reference Figure 9 The first sensing electrode RE, the second sensing electrode TE, the first connecting portion BE1, and the second connecting portion BE2 can have a grid shape or a network shape. The conductive pattern DE can also have a grid shape or a network shape.

[0114] When Figure 5 When the sensing layer TSL, including the first sensing electrode RE and the second sensing electrode TE, is directly disposed on the thin-film encapsulation layer TFEL, the distance between the second electrode of the light-emitting element layer EML and each of the first sensing electrodes RE and TE of the sensing layer TSL can be small. Therefore, a very high parasitic capacitance can be formed between the second electrode of the light-emitting element layer EML and each of the first sensing electrodes RE and TE of the sensing layer TSL. The parasitic capacitance is proportional to the overlap area between the second electrode of the light-emitting element layer EML and each of the first sensing electrodes RE and TE of the sensing layer TSL. Therefore, to reduce the parasitic capacitance, each of the first sensing electrodes RE and TE can have a grid shape or a network shape.

[0115] In other words, the first sensing electrode RE, the second sensing electrode TE, and the conductive pattern DE can be spaced apart from each other. Gaps can exist between the first sensing electrode RE and the second sensing electrode TE, between the first sensing electrode RE and the conductive pattern DE, between the second sensing electrode TE and the conductive pattern DE, and between the second sensing electrode TE and the first connecting portion BE1. Figure 9 In the diagram, for ease of description, the boundaries between the first sensing electrode RE and the second sensing electrode TE, the boundary between the second sensing electrode TE and the first connecting portion BE1, and the boundary between the first sensing electrode RE and the first connecting portion BE1 are shown by dashed lines.

[0116] The first connection portion BE1 can be disposed between the first sensing electrodes RE. The first connection portion BE1 can extend from each of the first sensing electrodes RE. Therefore, the first connection portion BE1 can be connected to the first sensing electrodes RE without a separate contact hole.

[0117] The second connection portion BE2 can be connected to each of the second sensing electrodes TE through the first contact hole CNT1. One end of the second connection portion BE2 can be connected to one of the second sensing electrodes TE that are adjacent to each other in the second direction (Y-axis direction) through the first contact hole CNT1-1. The other end of the second connection portion BE2 can be connected to the other of the second sensing electrodes TE that are adjacent to each other in the second direction (Y-axis direction) through the first contact hole CNT1-2.

[0118] The second connection portion BE2 may overlap with either the first sensing electrode RE or the second sensing electrode TE. Alternatively, the second connection portion BE2 may overlap with the first connection portion BE1 instead of the first sensing electrode RE. Alternatively, the second connection portion BE2 may overlap with both the first sensing electrode RE and the first connection portion BE1. The second connection portion BE2 may be disposed on a different layer than the first connection portion BE1. Therefore, according to the exemplary embodiment, even when the second connection portion BE2 overlaps with the first connection portion BE1, the second connection portion BE2 is not short-circuited with the first connection portion BE1.

[0119] The first sensing electrode RE, the second sensing electrode TE, the first connecting portion BE1, and the second connecting portion BE2 can be configured such that they do not overlap with each of the sub-pixels R, G, and B. That is, the first sensing electrode RE, the second sensing electrode TE, the first connecting portion BE1, and the second connecting portion BE2 can be disposed along the edge of each of the sub-pixels R, G, and B. Specifically, the first sensing electrode RE, the second sensing electrode TE, the first connecting portion BE1, and the second connecting portion BE2 can be configured to overlap with the pixel defining layer configured to define each of the sub-pixels R, G, and B.

[0120] Subpixels R, G, and B may include a first subpixel R that emits light of a first color, a second subpixel G that emits light of a second color, and a third subpixel B that emits light of a third color. Figure 9 The illustration shows that the first sub-pixel R is a red sub-pixel, the second sub-pixel G is a green sub-pixel, and the third sub-pixel B is a blue sub-pixel, but this disclosure is not limited thereto. Figure 9 In the diagram, the first sub-pixel R, the second sub-pixel G, and the third sub-pixel B are shown to have hexagonal planar shapes, but this disclosure is not limited thereto. The first sub-pixel R, the second sub-pixel G, and the third sub-pixel B may have shapes other than hexagonal, such as, for example, polygonal planar shapes, circular planar shapes, or elliptical planar shapes. Furthermore, in Figure 9In the diagram, the dimensions of the first sub-pixel R, the second sub-pixel G, and the third sub-pixel B are shown to be substantially the same, but the dimensions of sub-pixels R, G, and B are not limited to this. For example, the size of the third sub-pixel B can be the largest, and the size of the second sub-pixel G can be the smallest. Alternatively, the dimensions of the first sub-pixel R and the third sub-pixel B can be substantially the same, and the size of the second sub-pixel G can be smaller than each of the dimensions of the first sub-pixel R and the third sub-pixel B.

[0121] A pixel P refers to a sub-pixel group capable of representing grayscale levels. Figure 9 In the diagram, pixel P is shown as comprising a first sub-pixel R, two second sub-pixels G, and a third sub-pixel B, but this disclosure is not limited thereto. For example, pixel P may include a first sub-pixel R, a second sub-pixel G, and a third sub-pixel B.

[0122] according to Figure 9 In the exemplary embodiment shown, because the first sensing electrode RE, the second sensing electrode TE, the first connecting portion BE1, and the second connecting portion BE2 have a grid or network shape, the sub-pixels R, G, and B do not overlap with the first sensing electrode RE, the second sensing electrode TE, the first connecting portion BE1, and the second connecting portion BE2. Therefore, the light output from the sub-pixels R, G, and B is not blocked by the first sensing electrode RE, the second sensing electrode TE, the first connecting portion BE1, and the second connecting portion BE2, thereby preventing a reduction in light brightness.

[0123] Figure 10 yes Figure 8 A magnified view of region C.

[0124] Reference Figure 10 The first sensing electrode RE may include a first layer electrode RE1 and a second layer electrode RE2. The second layer electrode RE2 may be disposed on the first layer electrode RE1.

[0125] The first layer electrode RE1 of the first sensing electrode RE can be disposed in a portion of multiple rows, and the second layer electrode RE2 can be disposed in all of the multiple rows.

[0126] For example, such as Figures 8 to 10As shown, the first sensing electrode RE disposed in the first row is defined as the first group G1, and the first sensing electrode RE disposed in the second row can be defined as the second group G2. The first group G1 and the second group G2 can be spaced apart from each other. The first layer electrode RE1 of the first group G1 can be disposed in a portion of the first column. That is, the first layer electrode RE1 of the first group G1 can be disposed to overlap with the second layer electrode RE2 disposed in the first column in its thickness direction (Z-axis direction). Furthermore, the first layer electrode RE1 of the first group G1 can be disposed such that it does not overlap with the second layer electrode RE2 disposed in the remaining columns other than the first column of the first group G1. Furthermore, the first layer electrode RE1 of the first group G1 can be disposed such that it does not overlap with the second layer electrode RE2 of the second group G2.

[0127] Figure 10 The illustration shows a case where the first layer electrode RE1 of the first group G1 completely overlaps with the second layer electrode RE2 disposed in the first column, but this disclosure is not limited thereto. That is, the first layer electrode RE1 of the first group G1 can be configured to overlap with the second layer electrode RE2 disposed in another column (such as the second column).

[0128] The first layer electrode RE1 can be connected to the aforementioned first sensing line RL. Therefore, one of the first sensing electrodes RE in the first group G1 can be electrically connected to the first sensing line RL. The first sensing line RL can have a shape extending from one end of the first layer electrode RE1. The first sensing line RL can extend from the first layer electrode RE1 to the first sensing pad TP1 disposed in the sensing peripheral region TPA. In this case, the first sensing line RL can partially overlap with the first sensing electrode RE or the second sensing electrode TE disposed in the sensing region TSA. For example, as... Figure 10 As shown, the first sensing line RL connected to the first layer electrode RE1 of the first group G1 can overlap with the first sensing electrode RE of the second group G2 in its thickness direction (Z-axis direction). That is, the first sensing line RL connected to the first layer electrode RE1 of the first group G1 can overlap with the second layer electrode RE2 of the second group G2.

[0129] The first layer electrode RE1 of each group can be electrically connected to the second layer electrode RE2 of each group through the second contact hole CNT2. That is, the first layer electrode RE1 can be used to connect the first sensing line RL and the first sensing electrode RE of each group. For example, the first layer electrode RE1 of the first group G1 can be connected to the first sensing line RL and the first sensing electrode RE of the first group G1. In addition, the first layer electrode RE1 of the second group G2 can be connected to the first sensing line RL and the first sensing electrode RE of the second group G2. Figure 10The illustration shows a second contact hole CNT2 partially formed on one side (i.e., the lower side) of the first layer electrode RE1, but the disclosure is not limited thereto. That is, the second contact hole CNT2 can be formed in the entire area where the first layer electrode RE1 and the second layer electrode RE2 overlap each other.

[0130] The first electrode RE1 can be disposed on the same layer as the first sensing line RL. For example, in an exemplary embodiment, the first electrode RE1 and the first sensing line RL can be directly disposed on the thin-film encapsulation layer TFEL (see [link to documentation]). Figure 12 The first layer electrode RE1 and the first sensing line RL can be made of the same material. For example, the first layer electrode RE1 can be made of... Figure 12 The first sensing conductive layer 171 shown is formed. Figure 10 The illustration shows a case where the first sensing line RL is connected to the second layer electrode RE2 via a first layer electrode RE1, but this disclosure is not limited thereto. That is, the first layer electrode RE1 of the first sensing electrode RE can be omitted, and the first sensing line RL can be directly connected to the second layer electrode RE2. In this case, the second layer electrode RE2 can be directly connected to the first sensing line RL through a contact hole passing through the insulating layer disposed beneath it.

[0131] The first layer electrode RE1 can have a grid shape or a network shape. In an exemplary embodiment, because the first layer electrode RE1 has a grid shape or a network shape, the sub-pixels R, G, and B do not overlap with the first layer electrode RE1. Therefore, as described above, the light output from the sub-pixels R, G, and B can be unblocked by the first layer electrode RE1, thereby preventing a reduction in light brightness.

[0132] Figure 11 It is along Figure 9 The sectional view taken by line XI-XI'. Figure 12 It is along Figure 10 A sectional view taken from line XII-XII'.

[0133] Along Figure 9 Line XI-XI' illustrates the connection structure between the second sensing electrode TE and the second connection portion BE2. Along... Figure 10 Line XII-XII' illustrates the connection structure between the first layer electrode RE1 of the first sensing electrode RE, the second layer electrode RE2 of the first sensing electrode RE, and / or the first sensing line RL.

[0134] refer to Figure 11 and Figure 12A thin-film transistor layer (TFTL) is disposed on a substrate (SUB). The TFTL includes a buffer layer (BF), a semiconductor layer (ACT), a first insulating layer (IL1), a first conductive layer (IL10), a second insulating layer (IL2), a second conductive layer (IL20), and a third insulating layer (IL3). Each of these layers can be formed as a single layer, or it can be formed as a stacked layer comprising multiple layers. Other layers may also be disposed between the layers.

[0135] A buffer layer BF may be formed on one surface of the substrate SUB. The buffer layer BF is formed on one surface of the substrate SUB to protect the light-emitting layer 152 of the thin-film transistor and light-emitting element layer EML from moisture penetrating through the moisture-sensitive substrate SUB. The buffer layer BF may comprise multiple inorganic layers stacked alternately. For example, the buffer layer BF may be formed as a multilayer in which one or more inorganic layers, such as silicon nitride, silicon oxynitride, silicon oxide, titanium oxide, and aluminum oxide, are stacked alternately. In an exemplary embodiment, the buffer layer BF may be omitted.

[0136] A semiconductor layer ACT is disposed on the buffer layer BF. The semiconductor layer ACT forms the channels of multiple transistors in the pixel. The semiconductor layer ACT may include polycrystalline silicon. Polycrystalline silicon can be formed by crystallizing amorphous silicon.

[0137] When the semiconductor layer ACT is made of polycrystalline silicon and doped with ions, the ion-doped semiconductor layer ACT can be conductive. Therefore, the semiconductor layer ACT can include not only the channel regions of multiple transistors, but also source and drain regions. The source and drain regions can be connected to both sides of each channel region.

[0138] In an exemplary embodiment, the semiconductor layer ACT may include, for example, monocrystalline silicon, low-temperature polycrystalline silicon, amorphous silicon, or oxide semiconductors. For example, an oxide semiconductor may include a binary compound (AB). x ), ternary compounds (AB) x C y ) or quaternary compounds (AB) x C y D z These include, for example, indium, zinc, gallium, tin, titanium, aluminum, hafnium (Hf), zirconium (Zr), magnesium (Mg), etc. In an exemplary embodiment, the semiconductor layer ACT may include ITZO (an oxide comprising indium, tin, and zinc) or IGZO (an oxide comprising indium, gallium, and zinc).

[0139] A first insulating layer IL1 is disposed on the semiconductor layer ACT. The first insulating layer IL1 can be disposed substantially on the entire surface of the substrate SUB. The first insulating layer IL1 can be a gate insulating film with gate insulation function. The first insulating layer IL1 can include, for example, silicon compounds, metal oxides, etc. For example, the first insulating layer IL1 can include silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, tantalum oxide, hafnium oxide, zirconium oxide, titanium oxide, etc. The first insulating layer IL1 can be a single layer or can be a multilayer comprising stacked films made of different materials.

[0140] A first conductive layer 110 is disposed on a first insulating layer IL1. The first conductive layer 110 may include at least one metal selected from, for example, molybdenum (Mo), aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta), tungsten (W), and copper (Cu). The first conductive layer 110 may be a single layer or multiple layers. The first conductive layer 110 may include the gate electrode of a transistor and the first electrode of a storage capacitor.

[0141] A second insulating layer IL2 is disposed on the first conductive layer 110. The second insulating layer IL2 may be disposed substantially on the entire surface of the substrate SUB. The second insulating layer IL2 is used to insulate the first conductive layer 110 from the second conductive layer 120.

[0142] The second insulating layer IL2 may be an interlayer insulating layer. The second insulating layer IL2 may include the same material as the first insulating layer IL1 described above, or may include at least one material selected from the materials exemplified as constituent materials of the first insulating layer IL1.

[0143] A second conductive layer 120 is disposed on a second insulating layer IL2. The second conductive layer 120 may include at least one metal selected from, for example, aluminum (Al), molybdenum (Mo), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta), tungsten (W), and copper (Cu). The second conductive layer 120 may be a single layer or multiple layers. For example, the second conductive layer 120 may be formed as a stacked structure having Ti / Al / Ti, Mo / Al / Mo, Mo / Al / germanium (Ge) / Mo, Ti / Cu, etc. The second conductive layer 120 may include the aforementioned data line, source electrode 121, and drain electrode 122. The source electrode 121 and drain electrode 122 may be connected to the source and drain regions of the semiconductor layer ACT, respectively, through contact holes passing through the second insulating layer IL2 and the first insulating layer IL1.

[0144] The third insulating layer IL3 covers the second conductive layer 120. The third insulating layer IL3 may be a via layer. The third insulating layer IL3 may include organic insulating materials, such as, for example, polyacrylate-based resins, epoxy resins, phenolic resins, polyamide-based resins, polyimide-based resins, unsaturated polyester-based resins, polyphenylene ether-based resins, polyphenylene sulfide-based resins, or benzocyclobutene (BCB).

[0145] The light-emitting element layer (EML) is disposed on the thin-film transistor layer (TFTL). The light-emitting element layer (EML) may include a first electrode layer 151, a light-emitting layer 152, a second electrode layer 153, and a pixel defining layer 140.

[0146] Each of sub-pixels R, G, and B represents a region in which the first electrode layer 151, the light-emitting layer 152, and the second electrode layer 153 are sequentially stacked, and holes generated from the first electrode layer 151 and electrons generated from the second electrode layer 153 recombine with each other in the light-emitting layer 152 to emit light. The second sub-pixel G and the third sub-pixel B may have the same characteristics as... Figure 11 The first sub-pixel R shown has essentially the same configuration.

[0147] The first electrode layer 151 may be disposed on the third insulating layer IL3. The first electrode layer 151 may have, but is not limited to, a stacked layer structure formed by stacking a material layer with a high work function and a reflective material layer, wherein the material layer with the high work function is made of at least one selected from, for example, indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), and indium oxide (In2O3), and the reflective material layer is made of one selected from silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), lead (Pb), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), and mixtures thereof. The material layer with the high work function may be disposed on the reflective material layer and may be disposed close to the light-emitting layer 152. The first electrode layer 151 may have, for example, a multilayer structure of ITO / Mg, ITO / MgF2, ITO / Ag, or ITO / Ag / ITO, but this disclosure is not limited thereto. The anodes of sub-pixels R, G, and B may be formed by the first electrode layer 151. Figure 11 The diagram illustrates a case where the anode is connected to the drain electrode 122 via a contact hole passing through the third insulating layer IL3, but this disclosure is not limited thereto. That is, the anode can also be connected to the source electrode 121 via a contact hole passing through the third insulating layer IL3.

[0148] A pixel defining layer 140 may be disposed on the first electrode layer 151. For defining sub-pixels R, G, and B, the pixel defining layer 140 may be formed to separate the first electrode layer 151 on the third insulating layer IL3. The pixel defining layer 140 may include openings exposing the first electrode layer 151. That is, the pixel defining layer 140 may be formed to cover the edge of the first electrode layer 151. The openings may define the emission region of each of the sub-pixels R, G, and B.

[0149] The pixel defining layer 140 may include inorganic insulating materials (such as, for example, silicon oxide, silicon nitride, silicon oxynitride, hafnium oxide, aluminum oxide, titanium oxide, tantalum oxide, or zinc oxide) or organic insulating materials (such as, for example, polyacrylate-based resins, epoxy resins, phenolic resins, polyamide-based resins, polyimide-based resins, unsaturated polyester-based resins, polyphenylene ether-based resins, polyphenylene sulfide-based resins, or BCB). The pixel defining layer 140 may be a single layer or a multilayer comprising stacked layers made of different materials.

[0150] A light-emitting layer 152 is disposed in an opening in the pixel-defining layer 140. The light-emitting layer 152 may include organic materials to emit light of a specific color. For example, the light-emitting layer 152 may include a hole transport layer, an organic material layer, and an electron transport layer. In this case, the light-emitting layer 152 of the first sub-pixel R may emit red light, the light-emitting layer 152 of the second sub-pixel G may emit green light, and the light-emitting layer 152 of the third sub-pixel B may emit blue light.

[0151] Alternatively, the light-emitting layer 152 of sub-pixels R, G, and B can be formed as a single layer to emit white light, ultraviolet light, or blue light. In this case, the first sub-pixel R can overlap with a red color filter layer that transmits red light, the second sub-pixel G can overlap with a green color filter layer that transmits green light, and the third sub-pixel B can overlap with a blue color filter layer that transmits blue light. The red, green, and blue color filter layers can be disposed on the thin-film encapsulation layer TFEL. Furthermore, the first sub-pixel R can overlap with a red wavelength conversion layer that converts ultraviolet or blue light into red light, the second sub-pixel G can overlap with a green wavelength conversion layer that converts ultraviolet or blue light into green light, and the third sub-pixel B can overlap with a blue wavelength conversion layer that converts ultraviolet or blue light into blue light. The red, green, and blue wavelength conversion layers can be disposed on the thin-film encapsulation layer TFEL. For example, a red wavelength conversion layer can be disposed between the thin-film encapsulation layer TFEL and the red color filter layer, a green wavelength conversion layer can be disposed between the thin-film encapsulation layer TFEL and the green color filter layer, and a blue wavelength conversion layer can be disposed between the thin-film encapsulation layer TFEL and the blue color filter layer.

[0152] A second electrode layer 153 is disposed on the light-emitting layer 152 and the pixel defining layer 140. A cathode may be formed from the second electrode layer 153. The cathode may be disposed over the entire display area DA. The second electrode layer 153 may include a material layer having a low work function, such as, for example, Li, Ca, LiF / Ca, LiF / Al, Al, Mg, Ag, Pt, Pd, Ni, Au, Nd, Ir, Cr, BaF2, Ba, or compounds or mixtures thereof (e.g., a mixture of Ag and Mg). The second electrode layer 153 may also include a transparent metal oxide layer disposed on the material layer having a low work function. A capping layer may be formed on the second electrode layer 153.

[0153] A thin-film encapsulation layer TFEL can be disposed on the light-emitting element layer EML. The thin-film encapsulation layer TFEL is disposed on the second electrode layer 153. The thin-film encapsulation layer TFEL may include at least one inorganic layer to prevent oxygen or moisture from penetrating into the light-emitting layer 152 and the second electrode layer 153. Furthermore, the thin-film encapsulation layer TFEL may include at least one organic layer to protect the light-emitting element layer EML from foreign matter such as dust. For example, the thin-film encapsulation layer TFEL may include a first inorganic layer disposed on the second electrode layer 153, an organic layer disposed on the first inorganic layer, and a second inorganic layer disposed on the organic layer. The first and second inorganic layers may be formed from, for example, a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer, but this disclosure is not limited thereto. The organic layer may be made from, for example, acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, etc., but this disclosure is not limited thereto.

[0154] The sensing layer TSL can be disposed on the thin-film encapsulation layer TFEL. A buffer layer can also be formed between the thin-film encapsulation layer TFEL and the sensing layer TSL.

[0155] The sensing layer TSL may include a first sensing conductive layer 171, a first sensing insulating layer TIL1, a second sensing conductive layer 172, and a second sensing insulating layer TIL2.

[0156] Each of the above layers can be formed as a single layer, or as a stacked layer comprising multiple layers. Other layers can also be placed between the layers.

[0157] The first sensing conductive layer 171 may include, for example, a material selected from molybdenum, titanium, copper, aluminum, and alloys thereof. The first sensing conductive layer 171 may include, as described above, a first layer electrode RE1 of the first sensing electrode RE, a first sensing line RL, and a second connection portion BE2.

[0158] The first sensing insulating layer TIL1 can be disposed on the first sensing conductive layer 171.

[0159] The first sensing insulating layer TIL1 insulates the first sensing conductive layer 171 from the second sensing conductive layer 172. The first sensing insulating layer TIL1 may include an organic layer and / or an inorganic layer. For example, the organic layer may include at least one selected from acrylic resins, methacrylate resins, polyisoprene, vinyl resins, epoxy resins, urethane resins, cellulose resins, siloxane resins, polyimide resins, polyamide resins, and dinaphthalene-based phenyl resins. For example, the inorganic layer may include at least one selected from alumina, titanium dioxide, silicon dioxide, silicon oxynitride, zirconium oxide, and hafnium oxide.

[0160] The second sensing conductive layer 172 may be disposed on the first sensing insulating layer TIL1. The second sensing conductive layer 172 may include the same material as the first sensing conductive layer 171 described above, or may include at least one material selected from the materials exemplified as constituent materials of the first sensing conductive layer 171. The second sensing conductive layer 172 may include the second layer electrode RE2 of the first sensing electrode RE, the second sensing electrode TE, and the first connection portion BE1 as described above.

[0161] The second layer electrode RE2 of the first sensing electrode RE can be connected to the first layer electrode RE1 of the first sensing electrode RE through the second contact hole CNT2 passing through the first sensing insulating layer TIL1. Therefore, the second layer electrode RE2 of the first sensing electrode RE can be connected to the first sensing line RL through the first layer electrode RE1.

[0162] The second sensing electrode TE can be connected to the second connection portion BE2 through the first sensing insulating layer TIL1's 1-1 contact hole CNT1-1. Therefore, the second sensing electrodes TE that are adjacent to each other in the second direction (Y-axis direction) can be connected through the second connection portion BE2.

[0163] The second sensing insulating layer TIL2 may be disposed on the second sensing conductive layer 172. The second sensing insulating layer TIL2 may be used to planarize the stepped portions formed by the first sensing conductive layer 171 and the second sensing conductive layer 172. The second sensing insulating layer TIL2 may include the same material as the first sensing insulating layer TIL1 described above, or may include at least one material selected from the materials exemplified as constituent materials of the first sensing insulating layer TIL1.

[0164] according to Figures 1 to 12In the exemplary embodiment shown, the first sensing line RL can be connected to the first sensing electrode RE disposed in each group via the first layer electrode RE1. In this case, the first sensing line RL can extend from one end of the first layer electrode RE1 and be disposed in the sensing area TSA. Therefore, since no space is needed in the sensing peripheral area TPA for arranging the first sensing line RL, the non-display area NDA of the display device 10 can be reduced.

[0165] In the exemplary embodiments described below, the same components as those described above will be indicated by the same reference numerals, and their repeated descriptions will be omitted or simplified.

[0166] Figure 13 and Figure 14 This is an enlarged view of the sensing layer according to an exemplary embodiment. Figure 15 It is along Figure 13 A sectional view taken from line XV-XV'. Figure 16 It is along Figure 14 A sectional view taken by line XVI-XVI'.

[0167] Figure 13 Is with Figure 8 An enlarged view of the region that is basically the same as region B, and Figure 14 Is with Figure 8 An enlarged view of the region that is basically the same as region C.

[0168] refer to Figures 13 to 16 Interlayer components constituting the sensing layer in an exemplary embodiment and Figures 1 to 12 The inter-layer components differ from those in the exemplary implementation.

[0169] For example, the second layer electrode RE2_1 of the first sensing electrode RE_1 and the second sensing electrode TE_1 can be formed by the first sensing conductive layer 171.

[0170] The first sensing electrode RE_1 can be disposed in multiple rows located in the first direction (X-axis direction) and electrically connected through the first connecting portion BE1_1. The first connecting portion BE1_1 can be disposed on the same layer as the second layer electrode RE2_1 of the first sensing electrode RE_1. That is, the first connecting portion BE1_1 can be formed by the first sensing conductive layer 171. The first connecting portion BE1_1 can have a shape extending from the second layer electrode RE2_1 of the first sensing electrode RE_1.

[0171] The second sensing electrode TE_1 can be disposed in multiple columns located in the second direction (Y-axis direction) and electrically connected through the second connecting portion BE2_1. The second connecting portion BE2_1 can be disposed on a different layer than the second sensing electrode TE_1. The second connecting portion BE2_1 can be connected to the second sensing electrode TE_1 through the first-1 contact hole CNT1-1. For example, the second connecting portion BE2_1 can be formed by the second sensing conductive layer 172 and can be connected to the second sensing electrode TE_1 formed by the first sensing conductive layer 171 through the first sensing insulating layer TIL1 via the first-1 contact hole CNT1-1.

[0172] One end of the second connection portion BE2_1 can be connected via the first contact hole CNT1-1 to one of the second sensing electrodes TE_1 that are adjacent to each other in the second direction (Y-axis direction). The other end of the second connection portion BE2_1 can be connected via the first contact hole CNT1-2 to the other of the second sensing electrodes TE_1 that are adjacent to each other in the second direction (Y-axis direction).

[0173] The first sensing line RL_1 can be formed by the second sensing conductive layer 172. The first sensing line RL_1 can be connected to the first layer electrode RE1_1 of the first sensing electrode RE_1. The first sensing line RL_1 can have a shape extending from one end of the first layer electrode RE1_1. The first sensing line RL_1 can extend from the first layer electrode RE1_1 to the first sensing pad TP1 disposed in the sensing peripheral region TPA.

[0174] The first layer electrode RE1_1 can be disposed on the same layer as the first sensing line RL_1. The first layer electrode RE1_1 can be electrically connected to the second layer electrode RE2_1 through the second contact hole CNT2. For example, the first layer electrode RE1_1 can be formed by the second sensing conductive layer 172, and can be connected to the second layer electrode RE2_1 through the second contact hole CNT2 passing through the first sensing insulating layer TIL1. Therefore, the first layer electrode RE1_1 can be used to connect the first sensing line RL_1 and the first sensing electrode RE_1 disposed in each row.

[0175] Since it has already been referenced Figures 1 to 12 Further detailed descriptions of the first sensing electrode RE_1, the second sensing electrode TE_1, the first connection portion BE1_1, the second connection portion BE2_1, and the first sensing line RL_1 are provided, therefore repeated descriptions will be omitted.

[0176] according to Figures 13 to 16In the exemplary embodiment shown, the first sensing line RL_1 can be connected to the first sensing electrode RE_1 disposed in each row via the first layer electrode RE1_1. The first sensing line RL_1 can extend from one end of the first layer electrode RE1_1 and be disposed in the sensing area TSA. Therefore, since no space is needed in the sensing peripheral area TPA for arranging the first sensing line RL_1, the non-display area NDA of the display device 10 can be reduced.

[0177] Figure 17 This is a plan view illustrating components associated with a sensing unit according to an exemplary embodiment.

[0178] Reference Figure 17 Exemplary implementation methods and Figures 1 to 12 The difference of the exemplary implementation is that, in the sensing unit TDU_2 according to the exemplary implementation, the first sensing electrode RE_2 is disposed in the second direction (Y-axis direction), and the second sensing electrode TE_2 is disposed in the first direction (X-axis direction).

[0179] For ease of description, Figure 17 Only the sensing electrodes RE_2 and TE_2, the conductive pattern DE, the sensing lines RL_2 and TL_2, and the sensing pads TP1 and TP2 are shown.

[0180] Reference Figure 17 The first sensing electrode RE_2 can be disposed in multiple columns in a second direction (Y-axis direction) intersecting the first direction (X-axis direction), and can be electrically connected to each other. The second sensing electrode TE_2 can be disposed in multiple rows in the first direction (X-axis direction), and can be electrically connected to each other.

[0181] The first sensing electrode RE_2 and the second sensing electrode TE_2 can be electrically isolated from each other. The first sensing electrode RE_2 and the second sensing electrode TE_2 can be spaced apart from each other.

[0182] To electrically isolate the first sensing electrode RE_2 and the second sensing electrode TE_2 in their intersection region, the second sensing electrodes TE_2, which are adjacent to each other in the first direction (X-axis direction), are connected by a second connection portion BE2_2 (see...). Figure 18 The first sensing electrodes RE_2, which are adjacent to each other in the second direction (Y-axis direction), can be connected via the first connecting portion BE1_2 (see...). Figure 18 )connect.

[0183] The conductive pattern DE can be electrically isolated from the first sensing electrode RE_2 and the second sensing electrode TE_2. An opening OP can be formed between the conductive pattern DE and the first sensing electrode RE_2, and between the conductive pattern DE and the second sensing electrode TE_2 (see [reference]). Figure 18 The first sensing electrode RE_2, the second sensing electrode TE_2, and the conductive pattern DE can be spaced apart from each other. Each of the conductive patterns DE can be surrounded by an opening OP, and each of the first sensing electrode RE_2 and the second sensing electrode TE_2 can be configured to surround the opening OP (see [link to documentation]). Figure 18 ).

[0184] The parasitic capacitance between the second electrode of the light-emitting element layer EML and the first sensing electrode RE_2 or the second sensing electrode TE_2 can be reduced due to the conductive pattern DE. As described above, when the parasitic capacitance is reduced, the charging rate at which the mutual capacitance between the first sensing electrode RE_2 and the second sensing electrode TE_2 is charged can be increased.

[0185] Sensing lines RL_2 and TL_2 can extend from the sensing peripheral region TPA and be disposed within the sensing region TSA. Sensing lines RL_2 and TL_2 may include a first sensing line RL_2 connected to the first sensing electrode RE_2 and a second sensing line TL_2 connected to the second sensing electrode TE_2. Figure 17 In the exemplary embodiment shown, it will be mainly described that the first sensing line RL_2 is a sensing line and the second sensing line TL_2 is a driving line.

[0186] The first end portion of the first sensing line RL_2 can be electrically connected to the first sensing electrode RE_2, and the second end portion of the first sensing line RL_2 can be connected to the first sensing pad TP1.

[0187] The first sensing line RL_2 can extend from the sensing peripheral region TPA, where the first sensing pad TP1 is disposed, to the edge of the sensing region TSA. The first sensing line RL_2 can be electrically connected to the first sensing electrode RE_2 at the edge of the sensing region TSA.

[0188] The first sensing line RL_2 can be electrically connected to one of the first sensing electrodes RE_2 disposed in each column. For example, as Figure 17 As shown, the first sensing line RL_2 can be connected to the first sensing electrode RE_2 located at the lower end of the first sensing electrode RE_2 electrically connected in the second direction (Y-axis direction).

[0189] The first end portion of the second sensing line TL_2 can be electrically connected to the second sensing electrode TE_2, and the second end portion of the second sensing line TL_2 can be connected to the second sensing pad TP2.

[0190] The second sensing line TL_2 can extend from the sensing peripheral region TPA, where the second sensing pad TP2 is disposed, and can be disposed in the sensing region TSA. The second sensing line TL_2 can be electrically connected to the second sensing electrode TE_2 in the sensing region TSA. The second sensing line TL_2 can extend in the sensing region TSA in a second direction (Y-axis direction).

[0191] The second sensing line TL_2 can be electrically connected to one of the second sensing electrodes TE_2 disposed in each row. For example, as Figure 17 As shown, the second sensing line TL_2 can be electrically connected to the second sensing electrode TE_2 disposed in the first column of the first row and the second sensing electrode TE_2 disposed in the second column of the second row.

[0192] according to Figure 17 In the exemplary embodiment shown, the second sensing line TL_2 can be disposed in the sensing region TSA that overlaps with the display region DA. Therefore, since no space is needed in the sensing peripheral region TPA for arranging the second sensing line TL_2, the non-display region NDA of the display device 10 can be reduced.

[0193] Figure 18 yes Figure 17 A magnified view of region D.

[0194] Reference Figure 18 The first sensing electrode RE_2 can be disposed in the second direction (Y-axis direction) and electrically connected through the first connecting portion BE1_2.

[0195] The second sensing electrode TE_2 can be disposed in the first direction (X-axis direction) and electrically connected through the second connecting part BE2_2.

[0196] The first connection portion BE1_2 can be connected to the first sensing electrode RE_2 through the third contact hole CNT3. The third contact hole CNT3 includes the 3-1 contact hole CNT3-1 and the 3-2 contact hole CNT3-2 (see...). Figure 19 The first connecting portion BE1_2 may have a shape that is bent at least once. Figure 18 In the diagram, the first connecting portion BE1_2 is shown bent into a shape such as "<" or ">", but the shape of the first connecting portion BE1_2 is not limited to this. Furthermore, since the first sensing electrodes RE_2 adjacent to each other in the second direction (Y-axis direction) are connected through multiple first connecting portions BE1_2, even if one of the first connecting portions BE1_2 is disconnected, the first sensing electrodes RE_2 adjacent to each other in the second direction (Y-axis direction) can still be stably connected. Figure 18In the diagram, the first sensing electrodes RE_2 that are adjacent to each other are shown to be connected by two first connection portions BE1_2, but the number of first connection portions BE1_2 is not limited to two.

[0197] The second connection portion BE2_2 may have a shape that extends from the second sensing electrode TE_2.

[0198] according to Figure 18 In the exemplary embodiment shown, the first sensing electrodes RE_2 adjacent to each other in the second direction (Y-axis direction) can be connected via a first connecting portion BE1_2, and the second sensing electrodes TE_2 adjacent to each other in the first direction (X-axis direction) can be connected via a second connecting portion BE2_2. Therefore, the first sensing electrodes RE_2 and the second sensing electrodes TE_2 can be electrically isolated from each other in their intersection region, the first sensing electrodes RE_2 can be electrically connected in the second direction (Y-axis direction), and the second sensing electrodes TE_2 can be electrically connected in the first direction (X-axis direction).

[0199] Figure 19 yes Figure 18 A magnified view of region E.

[0200] Reference Figure 19 The first sensing electrode RE_2, the second sensing electrode TE_2, the first connecting portion BE1_2, and the second connecting portion BE2_2 can have a grid shape or a network shape. The conductive pattern DE can also have a grid shape or a network shape.

[0201] When the sensing layer TSL, including the first sensing electrode RE_2 and the second sensing electrode TE_2, is directly disposed on the thin-film encapsulation layer TFEL, the distance between the second electrode of the light-emitting element layer EML and each of the first sensing electrodes RE_2 and TE_2 of the sensing layer TSL can be small. That is, the second electrode of the light-emitting element layer EML and each of the first sensing electrodes RE_2 and TE_2 of the sensing layer TSL can be close to each other. Therefore, a very high parasitic capacitance can be formed between the second electrode of the light-emitting element layer EML and each of the first sensing electrodes RE_2 and TE_2 of the sensing layer TSL. The parasitic capacitance is proportional to the overlap area between the second electrode of the light-emitting element layer EML and each of the first sensing electrodes RE_2 and TE_2 of the sensing layer TSL. Therefore, to reduce the parasitic capacitance, each of the first sensing electrodes RE_2 and TE_2 can have a grid shape or a network shape.

[0202] The first sensing electrode RE_2, the second sensing electrode TE_2, and the conductive pattern DE can be spaced apart from each other. Gaps may exist between the first sensing electrode RE_2 and the second sensing electrode TE_2, between the first sensing electrode RE_2 and the conductive pattern DE, between the second sensing electrode TE_2 and the conductive pattern DE, and between the first sensing electrode RE_2 and the second connecting portion BE2_2. Figure 19 In the diagram, for ease of description, the boundaries between the first sensing electrode RE_2 and the second sensing electrode TE_2, the boundaries between the first sensing electrode RE_2 and the second connecting portion BE2_2, and the boundaries between the second sensing electrode TE_2 and the second connecting portion BE2_2 are shown by dashed lines.

[0203] The first connecting portion BE1_2 can be connected to each of the first sensing electrodes RE_2 via the third contact hole CNT3. For example, one end of the first connecting portion BE1_2 can be connected to one of the first sensing electrodes RE_2 that are adjacent to each other in the second direction (Y-axis direction) via the third-1 contact hole CNT3-1. The other end of the first connecting portion BE1_2 can be connected to the other first sensing electrode RE_2 that is adjacent to each other in the second direction (Y-axis direction) via the third-2 contact hole CNT3-2.

[0204] The first connection portion BE1_2 may overlap with either the first sensing electrode RE_2 or the second sensing electrode TE_2. Alternatively, the first connection portion BE1_2 may overlap with the second connection portion BE2_2 instead of the second sensing electrode TE_2. Alternatively, the first connection portion BE1_2 may overlap with both the second sensing electrode TE_2 and the second connection portion BE2_2. The first connection portion BE1_2 may be disposed on a different layer than the second sensing electrode TE_2 and the second connection portion BE2_2. Therefore, in the exemplary embodiment, even when the first connection portion BE1_2 overlaps with either the second sensing electrode TE_2 or the second connection portion BE2_2, the first connection portion BE1_2 is not short-circuited with either the second sensing electrode TE_2 or the second connection portion BE2_2.

[0205] The first sensing electrode RE_2, the second sensing electrode TE_2, the first connecting portion BE1_2, and the second connecting portion BE2_2 can be configured such that they do not overlap with each of the sub-pixels R, G, and B. That is, the first sensing electrode RE_2, the second sensing electrode TE_2, the first connecting portion BE1_2, and the second connecting portion BE2_2 can be disposed along the edge of each of the sub-pixels R, G, and B. That is, the first sensing electrode RE_2, the second sensing electrode TE_2, the first connecting portion BE1_2, and the second connecting portion BE2_2 can be configured to overlap with the pixel defining layer configured to define each of the sub-pixels R, G, and B. Since reference has been made... Figure 9 Subpixels R, G, and B are described, so their repeated descriptions will be omitted.

[0206] Because the first sensing electrode RE_2, the second sensing electrode TE_2, the first connecting portion BE1_2, and the second connecting portion BE2_2 have a grid or network shape, sub-pixels R, G, and B do not overlap with these components. Therefore, as described above, the light output from sub-pixels R, G, and B is not blocked by these components, thus preventing a reduction in light brightness.

[0207] Figure 20 yes Figure 18 A magnified view of region F.

[0208] Reference Figure 20 The second sensing electrode TE_2 may include a first layer electrode TE1 and a second layer electrode TE2.

[0209] The first layer electrode TE1 of the second sensing electrode TE_2 can be set in a portion of multiple rows, and the second layer electrode TE2 of the second sensing electrode TE_2 can be set in all of the multiple rows.

[0210] For example, such as Figures 18 to 20As shown, the second sensing electrode TE_2 disposed in the first row can be defined as the first group G1', and the second sensing electrode TE_2 disposed in the second row can be defined as the second group G2'. The first group G1' and the second group G2' can be spaced apart from each other. The first layer electrode TE1 of the first group G1' can be disposed in a portion of the first column. That is, the first layer electrode TE1 of the first group G1' can be disposed such that it overlaps with the second layer electrode TE2 disposed in the first column in its thickness direction (Z-axis direction). Furthermore, the first layer electrode TE1 of the first group G1' can be disposed such that it does not overlap with the second layer electrode TE2 disposed in the remaining columns other than the first column of the first group G1'. Furthermore, the first layer electrode TE1 of the first group G1' can be disposed such that it does not overlap with the second layer electrode TE2 of the second group G2'.

[0211] Figure 20 The illustration shows a case where the first layer electrode TE1 of the first group G1' completely overlaps with the second layer electrode TE2 disposed in the first column, but this disclosure is not limited thereto. That is, the first layer electrode TE1 of the first group G1' can be configured to overlap with the second layer electrode TE2 disposed in another column (such as the second column).

[0212] The first layer electrode TE1 can be connected to the second sensing line TL_2. The second sensing line TL_2 can have a shape extending from one end of the first layer electrode TE1. The second sensing line TL_2 can extend from the first layer electrode TE1 to the second sensing pad TP2 disposed in the sensing peripheral region TPA. In this case, the second sensing line TL_2 can partially overlap with the first sensing electrode RE_2 or the second sensing electrode TE_2 disposed in the sensing region TSA. For example, as Figure 20 As shown, the second sensing line TL_2 connected to the first layer electrode TE1 of the first group G1' can overlap with the second sensing electrode TE_2 of the second group G2' in its thickness direction (Z-axis direction). That is, the second sensing line TL_2 connected to the first layer electrode TE1 of the first group G1' can overlap with the second layer electrode TE2 of the second group G2'.

[0213] The first layer electrode TE1 of each group can be electrically connected to the second layer electrode TE2 of each group through the fourth contact hole CNT4. That is, the first layer electrode TE1 can be used to connect the second sensing line TL_2 and the second sensing electrode TE_2 disposed in each row. For example, the first layer electrode TE1 of the first group G1' can be connected to the second sensing line TL_2 and the second sensing electrode TE_2 of the first group G1'. In addition, the first layer electrode TE1 of the second group G2' can be connected to the second sensing line TL_2 and the second sensing electrode TE_2 of the second group G2'. Figure 20The illustration shows a fourth contact hole CNT4 partially formed on one side (i.e., the lower side) of the first layer electrode TE1, but this disclosure is not limited thereto. That is, the fourth contact hole CNT4 can be formed in the entire area where the first layer electrode TE1 and the second layer electrode TE2 overlap.

[0214] The first electrode TE1 can be disposed on the same layer as the second sensing line TL_2. The first electrode TE1 and the second sensing line TL_2 can be made of the same material. For example, the first electrode TE1 can be made of... Figure 22 The first sensing conductive layer 171 shown is formed. Figure 20 The illustration shows a scenario where the second sensing line TL_2 is connected to the second layer electrode TE2 via the first layer electrode TE1, but this disclosure is not limited thereto. That is, the first layer electrode TE1 of the second sensing electrode TE_2 can be omitted, and the second sensing line TL_2 can be directly connected to the second layer electrode TE2. In this case, the second layer electrode TE2 can be directly connected to the second sensing line TL_2 through a contact hole passing through the insulating layer disposed beneath it.

[0215] The first layer electrode TE1 can have a grid shape or a network shape. Because the first layer electrode TE1 has a grid shape or a network shape, the sub-pixels R, G, and B do not overlap with the first layer electrode TE1. Therefore, as described above, the light output from the sub-pixels R, G, and B can be unblocked by the first layer electrode TE1, thereby preventing a reduction in light brightness.

[0216] Figure 21 It is along Figure 19 A sectional view taken from line XXI-XXI'. Figure 22 It is along Figure 20 A sectional view taken from line XXII-XXII'.

[0217] Along Figure 19 Lines XXI-XXI' illustrate the connection structure between the first sensing electrode RE_2 and the first connection portion BE1_2. Along... Figure 20 Lines XXII-XXII' show the connection structure between the first layer electrode TE1 of the second sensing electrode TE_2, the second layer electrode TE2 of the second sensing electrode TE_2, and / or the second sensing line TL_2.

[0218] refer to Figure 21 and Figure 22 A thin-film transistor layer (TFTL) is disposed on a substrate SUB. The TFTL includes a buffer layer BF, a semiconductor layer ACT, a first insulating layer IL1, a first conductive layer 110, a second insulating layer IL2, a second conductive layer 120, and a third insulating layer IL3. (Note: The last sentence appears to be incomplete and possibly refers to a reference to a specific layer or layer.) Figure 11 and Figure 12The thin-film transistor layer (TFTL) has been described, so its repeated description will be omitted.

[0219] The sensing layer TSL can be disposed on the thin-film encapsulation layer TFEL. A buffer layer can also be formed between the thin-film encapsulation layer TFEL and the sensing layer TSL.

[0220] The sensing layer TSL may include a first sensing conductive layer 171, a first sensing insulating layer TIL1, a second sensing conductive layer 172, and a second sensing insulating layer TIL2.

[0221] Each of the above layers can be formed as a single layer, or as a stacked layer comprising multiple layers. Other layers can also be placed between the layers.

[0222] The first sensing conductive layer 171 may include, for example, a material selected from molybdenum, titanium, copper, aluminum, and their alloys. The first sensing conductive layer 171 may include the first layer electrode TE1 of the second sensing electrode TE_2 as described above, the second sensing line TL_2, and the first connection portion BE1_2.

[0223] The first sensing insulating layer TIL1 can be disposed on the first sensing conductive layer 171.

[0224] The first sensing insulating layer TIL1 insulates the first sensing conductive layer 171 from the second sensing conductive layer 172. The first sensing insulating layer TIL1 may include an organic layer and / or an inorganic layer. For example, the organic layer may include at least one selected from acrylic resins, methacrylate resins, polyisoprene, vinyl resins, epoxy resins, urethane resins, cellulose resins, siloxane resins, polyimide resins, polyamide resins, and dinaphthalene-containing phenyl resins. For example, the inorganic layer may include at least one selected from alumina, titanium dioxide, silicon dioxide, silicon oxynitride, zirconium oxide, and hafnium oxide. The first sensing insulating layer TIL1 may be disposed between the first electrode TE1 and the second electrode TE2.

[0225] The second sensing conductive layer 172 may be disposed on the first sensing insulating layer TIL1. The second sensing conductive layer 172 may include the same material as the first sensing conductive layer 171 described above, or may include at least one material selected from the materials exemplified as constituent materials of the first sensing conductive layer 171. The second sensing conductive layer 172 may include the second layer electrode TE2 of the first sensing electrode RE_2 and the second connection portion BE2_2 as described above.

[0226] The first sensing electrode RE_2 can be connected to the first connection portion BE1_2 through the 3-1 contact hole CNT3-1 passing through the first sensing insulating layer TIL1. Therefore, the first sensing electrodes RE_2 that are adjacent to each other in the second direction (Y-axis direction) can be connected through the first connection portion BE1_2.

[0227] The second layer electrode TE2 of the second sensing electrode TE_2 can be connected to the first layer electrode TE1 of the second sensing electrode TE_2 through the fourth contact hole CNT4 passing through the first sensing insulating layer TIL1. Therefore, the second layer electrode TE2 of the second sensing electrode TE_2 can be connected to the second sensing line TL_2 through the first layer electrode TE1.

[0228] The second sensing insulating layer TIL2 may be disposed on the second sensing conductive layer 172. The second sensing insulating layer TIL2 may be used to planarize the stepped portions formed by the first sensing conductive layer 171 and the second sensing conductive layer 172. The second sensing insulating layer TIL2 may include the same material as the first sensing insulating layer TIL1 described above, or may include at least one material selected from the materials exemplified as constituent materials of the first sensing insulating layer TIL1.

[0229] according to Figures 17 to 22 In the exemplary embodiment shown, the second sensing line TL_2 can be connected to the second sensing electrode TE_2 disposed in each group via the first layer electrode TE1. In this case, the second sensing line TL_2 can extend from one end of the first layer electrode TE1 and be disposed in the sensing area TSA. Therefore, as described above, since no space is needed in the sensing peripheral area TPA for arranging the second sensing line TL_2, the non-display area NDA of the display device 10 can be reduced.

[0230] Figure 23 This is a plan view illustrating components associated with a sensing unit according to an exemplary embodiment.

[0231] Reference Figure 23 Exemplary implementation methods and Figures 1 to 12 The difference in the exemplary implementation is that, in the sensing unit TDU_3 according to the exemplary implementation, the first sensing pad TP1' and the second sensing pad TP2' are arranged alternately.

[0232] For example, the first sensing pad TP1' and the second sensing pad TP2' can be located on one side of the sensing peripheral area TPA. For example, as Figure 23 As shown, the first sensing pad TP1' and the second sensing pad TP2' can be disposed in the sensing peripheral area TPA located on the lower side relative to the sensing area TSA.

[0233] The first sensing pad TP1' and the second sensing pad TP2' can be arranged alternately in the first direction (X-axis direction).

[0234] The first sensing pad TP1' can be connected to one end of the first sensing line RL_3. The other end of the first sensing line RL_3 can be connected to the first sensing electrode RE. That is, the first sensing pad TP1' can be connected to the first sensing electrode RE through the first sensing line RL_3.

[0235] The second sensing pad TP2' can be connected to one end of the second sensing line TL_3. The other end of the second sensing line TL_3 can be connected to the second sensing electrode TE. That is, the second sensing pad TP2' can be connected to the second sensing electrode TE through the second sensing line TL_3.

[0236] The first sensing line RL_3 and the second sensing line TL_3 can be arranged alternately in a first direction (X-axis direction). The first sensing line RL_3 and the second sensing line TL_3 can be spaced apart from each other. That is, in an exemplary embodiment, the first sensing line RL_3 does not overlap with the second sensing line TL_3 in its thickness direction (Z-axis direction).

[0237] The first sensing line RL_3 can extend from the first sensing pad TP1' and be disposed in the sensing area TSA. Therefore, since no space is needed in the sensing peripheral area TPA for arranging the first sensing line RL_3, the non-display area NDA of the display device 10 can be reduced.

[0238] In the sensing unit and display device according to the exemplary embodiments, the sensing line is disposed in the sensing area that overlaps with the display area, thereby reducing the non-display area of ​​the display device.

[0239] While this disclosure has been specifically shown and described with reference to exemplary embodiments thereof, those skilled in the art will understand that various changes in form and detail may be made in this disclosure without departing from the spirit and scope of the disclosure as defined by the appended claims.

Claims

1. A sensing unit, comprising: a plurality of first sensing electrodes of a first group, disposed in a first direction in a sensing region; and a first sensing line electrically connected to one of the first sensing electrodes of the first group, wherein the first sensing electrodes of the first group include first layer electrodes and second layer electrodes overlapping the first layer electrodes, wherein the first sensing line is disposed in the sensing region and extends in a second direction intersecting the first direction.

2. The sensing unit of claim 1, wherein, the second layer electrodes are disposed on the first layer electrodes, and one of the first layer electrodes is connected to one end of the first sensing line.

3. The sensing unit of claim 2, wherein, the first layer electrodes and the first sensing line are disposed on the same layer. 4.The sensing unit according to claim 3, further comprising: a first sensing insulating layer disposed between the one of the first layer electrodes and one of the second layer electrodes, wherein the one of the second layer electrodes contacts the one of the first layer electrodes through a contact hole passing through the first sensing insulating layer. 5.The sensing unit according to claim 1, further comprising: a plurality of conductive patterns electrically isolated from the first sensing electrodes.

6. The sensing unit of claim 5, wherein, the conductive patterns are surrounded by one of the first sensing electrodes.

7. The sensing unit of claim 5, wherein, one of the conductive patterns overlaps the first sensing line in a thickness direction thereof. 8.The sensing unit according to claim 7, further comprising: a plurality of second sensing electrodes disposed in the second direction and electrically isolated from the first sensing electrodes. 9.The sensing unit according to claim 8, further comprising: a connection portion connecting the second sensing electrodes adjacent to each other in the second direction, wherein the first sensing line and the connection portion are disposed on the same layer. 10.The sensing unit according to claim 9, further comprising: a first sensing insulating layer disposed between one of the second sensing electrodes and the connection portion, wherein the one of the second sensing electrodes contacts the connection portion through a contact hole passing through the first sensing insulating layer. 11.The sensing unit according to claim 8, further comprising: a second sensing line electrically connected to one of the second sensing electrodes, wherein the first sensing line and the second sensing line are alternately arranged in the first direction.

12. The sensing unit of claim 11, wherein, the first sensing line and the second sensing line are spaced apart from each other and do not overlap in a thickness direction of the first sensing line and the second sensing line. 13.The sensing unit according to claim 11, further comprising: a first sensing pad region positioned outside the sensing region; and a second sensing pad region spaced apart from the first sensing pad region, wherein the first sensing pad region includes a first sensing pad connected to the first sensing line, and the second sensing pad region includes a second sensing pad connected to the second sensing line.

14. The sensing unit of claim 13, wherein, the first sensing line overlaps the second sensing line in a thickness direction thereof. 15.A sensing unit, comprising: a plurality of first sensing electrodes of a first group, disposed in a first direction in a sensing region; a plurality of first sensing electrodes of a second group disposed in the first direction, wherein the second group is spaced apart from the first group; and a first sensing line electrically connected to one of the first sensing electrodes of the first group, wherein each of the first sensing electrodes of the first group and the first sensing electrodes of the second group includes a first layer electrode and a second layer electrode overlapping the first layer electrode, wherein the first sensing line is disposed in the sensing region and overlaps the first sensing electrodes of the second group in a thickness direction of the first sensing line.

16. The sensing unit of claim 15, wherein, the first sensing line extends in the sensing region in a second direction intersecting the first direction.

17. The sensing unit of claim 15, wherein, the second layer electrode is disposed on the first layer electrode, wherein the first layer electrode is disposed on the same layer as the first sensing line.

18. The sensing unit of claim 17, wherein, one end of the first sensing line is connected to the first layer electrode of the one of the first sensing electrodes of the first group.

19. The sensing unit of claim 17, wherein, the first sensing line overlaps the second layer electrode of one of the first sensing electrodes of the second group in a thickness direction thereof.

20. The sensing unit of claim 17, further comprising: a first sensing insulating layer disposed between the first layer electrode and the second layer electrode, wherein the second layer electrode of the one of the first sensing electrodes of the first group is in contact with the first layer electrode through a contact hole passing through the first sensing insulating layer.

21. A display device, comprising: a substrate including a display region; a light emitting layer disposed on the substrate; and a sensing unit disposed on the light emitting layer and including a first group of a plurality of first sensing electrodes disposed in a first direction in a sensing region overlapping the display region and a first sensing line electrically connected to one of the first sensing electrodes of the first group, wherein the first sensing electrodes of the first group include a first layer electrode and a second layer electrode overlapping the first layer electrode, wherein the first sensing line is disposed in the sensing region and extends in a second direction intersecting the first direction.

22. The display device of claim 21, further comprising: pixels disposed in the display region; and a pixel defining layer disposed between the substrate and the light emitting layer and defining an emission region of the pixels, wherein the first sensing electrodes overlap the pixel defining layer in a thickness direction thereof.

23. The display device of claim 22, further comprising: a plurality of second sensing electrodes disposed in the second direction and electrically isolated from the first sensing electrodes.

24. The display device of claim 23, further comprising: connection portions connecting the second sensing electrodes adjacent to each other in the second direction, wherein the first sensing line is disposed on the same layer as the connection portions. ​ ​

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