Conductive connection device for a circuit board

Abstract

The invention relates to a contact connection device (10) between a first circuit board (12) and a second circuit board (14), characterized in that the first circuit board (12) comprises a connecting pin (18) in the region of the contact connection device (10) and the second circuit board (14) comprises a through-plug (16) in the region of the contact connection device (10), wherein the connecting pin (18) of the first circuit board (12) is plugged through the through-plug (16) of the second circuit board (14), wherein the connecting pin (18) is deformed in a section (24) that protrudes beyond the second circuit board (14) through the through-plug (16) of the second circuit board (14) by a deformation process, in particular a bending process or a riveting process, such that a form-fit connection between the first circuit board (12) and the second circuit board (14) is formed.

Description

TECHNICAL FIELD

[0001] The invention relates to an electrically conductive contact connection between a first circuit board and a second circuit board.

[0002] The invention also relates to a method for establishing an electrically conductive contact connection between a first circuit board and a second circuit board. BACKGROUND

[0003] From the prior art, electrically conductive contact connections between components, for example circuit boards, are known. It is known, for example from DE 41 32 995 Al, to solder contacts of a rigid circuit board to contacts of a flexible circuit board. It is also known, for example, for two circuit boards, in particular a rigid circuit board and a flexible circuit board, to be connected to one another via so-called plug-in connection strips and circuit board sockets, connection strips or socket boards mounted on the circuit boards. SUMMARY

[0004] It is an object of the invention to provide an electrically conductive contact connection and a method for establishing an electrically conductive contact connection which are more cost-effective and can be established with less effort compared to the prior art.

[0005] According to the invention, it is proposed that the first circuit board comprises a connection pin in the region of the contact connection and the second circuit board comprises a through-going receptacle in the region of the contact connection. In which the connection pin of the first circuit board is at least partially formed from an electrically conductive material and is plugged through the through-going receptacle of the second circuit board, in which the connection pin is deformed (umgeformt) on a section which protrudes beyond the second circuit board through the through-going receptacle of the second circuit board by a deformation process, in particular a bending process or a riveting process, such that a form-fit connection is formed between the first circuit board and the second circuit board.

[0006] The contact connection according to the invention can be established without a further soldering process. The contact connection according to the invention requires less material consumption compared to plug-in connections.

[0007] The connection pin in particular comprises a cylindrical shape and is plastically deformable at least in the section which protrudes beyond the second circuit board through the through-going receptacle of the second circuit board.

[0008] The connection pin is made, for example, from metal and / or an alloy and / or partially from plastic in combination with an electrically conductive material.

[0009] The connection pin is deformed in the section which protrudes beyond the second circuit board through the through-going receptacle of the second circuit board by means of a suitable tool under the action of force, the deformed section keeping the second circuit board partially protruding on the first circuit board.

[0010] Advantageously, the inner wall of the through-hole of the second circuit board comprises an electrically conductive material. The connecting pin of the first circuit board, which is plugged through the through-hole of the second circuit board, at least partially, preferably over the entire circumference, contacts said inner wall, thereby forming an electrically conductive connection.

[0011] According to a preferred embodiment, the connecting pin is connected to the first circuit board by means of a through-hole metallization, in particular a pin-in-paste soldering method. The connecting pin is guided through an opening, a so-called mounting hole, in the first circuit board and is soldered to the first circuit board. For example, the connecting pin is soldered to the first circuit board on the rear side of the first circuit board or, in the case of a pin-in-paste soldering method, in the opening. In the pin-in-paste soldering method, solder paste is pressed into the opening and the connecting pin is then plugged in. Upon melting of the solder paste, the liquid solder flows back into the opening and forms a soldered connection. It is also conceivable that the connecting pin comprises a preformed rivet head in the section that protrudes beyond the first circuit board on the rear side of the first circuit board, so that the riveted connection is completed by deformation of the section that protrudes beyond the second circuit board.

[0012] According to another preferred embodiment, the connecting pin is connected to the first circuit board by means of a surface mounting, in particular a SMT (Surface-Mounting-Technologie) soldering method. The connecting pin is then directly soldered to the first circuit board by means of a solderable connection surface.

[0013] According to another preferred embodiment, the first circuit board is a rigid circuit board and / or the second circuit board is a flexible circuit board. The first circuit board comprises, for example, a glass-fiber mat impregnated with epoxy resin as a non-conductive carrier material, which is also known as material designation FR4. The second circuit board is, for example, a thin circuit board based on a polyimide film. Such a circuit board can be used, for example, in a lighting device, advantageously saving space, in particular by folding to the tightest structure, and / or for connecting two rigid circuit boards, for example, in a lighting device.

[0014] Further advantageous embodiments relate to a method for establishing an electrically conductive contact connection between a first circuit board and a second circuit board, wherein the first circuit board comprises a connecting pin in the region of the contact connection and the second circuit board comprises a through-hole in the region of the contact connection, wherein the connecting pin of the first circuit board is formed at least partially from an electrically conductive material, characterized in that the connecting pin of the first circuit board is plugged through the through-hole of the second circuit board and a section of the connecting pin that protrudes beyond the second circuit board through the through-hole of the second circuit board is deformed in a deformation process, in particular a bending process or a riveting process, so that a form-fit connection is formed between the first circuit board and the second circuit board.

[0015] In the process of deformation, the connecting pin is deformed by means of a suitable tool under force in the section that protrudes beyond the second circuit board through the through-hole of the second circuit board, the deformed section then keeping the second circuit board partially protruding on the first circuit board.

[0016] The deformation comprises, for example: a so-called flattening of the connecting pin; and / or, a pre-forming of the rivet head, in particular by cyclic impact with a ball peen hammer; and / or, a final forming of the shape of the rivet head, in particular by means of a rivet head swager.

[0017] According to a preferred embodiment, in a previous step, the connecting pin is connected with the first circuit board by means of a through-hole metallization, in particular a through-hole reflow soldering method.

[0018] According to a preferred embodiment, in a previous step, the connecting pin is connected with the first circuit board by means of a surface mounting, in particular a SMT (Surface Mount Technology) soldering method. BRIEF DESCRIPTION OF DRAWINGS

[0019] Embodiments of the application are shown in the drawings and are explained in detail in the following description. Herein, the same reference signs in different drawings respectively denote the same elements or at least functionally identical elements. Therein, respectively in schematic form:

[0020] Figure 1 A conductive contact connection device according to the application is shown according to a first preferred embodiment;

[0021] Figure 2 A conductive contact connection device according to the application is shown according to another preferred embodiment;

[0022] Figure 3 Circuit boards connected with each other by means of a contact connection device according to the application are shown. DETAILED DESCRIPTION

[0023] Figure 1 A cross-sectional view of a conductive contact connection device according to the application is shown according to a first preferred embodiment, the contact connection device as a whole being denoted by reference sign 10. The contact connection device 10 connects a first circuit board 12 with a second circuit board 14. The second circuit board 14 comprises a through-hole 16 and the first circuit board 12 comprises a connecting pin 18 that is plugged through the through-hole 16 of the second circuit board 14.

[0024] The connecting pin 18 is formed at least partially from an electrically conductive material.

[0025] According to Figure 1The connecting pin 18 is mounted on the surface 20 of the first circuit board 12 in the embodiment shown. The connecting pin 18 is connected to the surface 20 of the first circuit board 12, for example, by means of an SMT (surface mount technology) soldering method.

[0026] The inner wall 22 of the through-hole 16 of the second circuit board 14 comprises an electrically conductive material. The connecting pin 18 contacts the inner wall 22 at least partially, preferably over the entire circumference, thereby forming an electrically conductive connection device, which is formed between the first circuit board 12 and the second circuit board 14.

[0027] The connecting pin 18 is deformed in the section 24, which projects beyond the second circuit board 14, by a deformation process, in particular a bending process or a riveting process, such that a form-fit connection is formed between the first circuit board 12 and the second circuit board 14. The deformed section 24 keeps the second circuit board 14 partially protruding on the first circuit board 12.

[0028] The deformation is carried out under force by means of suitable tools. The deformation comprises, for example, a so-called flattening of the connecting pin 18 and / or a pre-forming of the section 24, in particular by cyclic impacts with a ball peen hammer, into the form of a rivet head and / or a final forming of the section 24, in particular by means of a rivet head swager, into the shape of a rivet head.

[0029] Figure 2 A sectional view of a contact connection device 10 according to a further embodiment is shown. The connecting pin 18 of the first circuit board is connected to the first circuit board 12 by means of a through-hole metallization.

[0030] To this end, the first circuit board 12 comprises an opening 26, a so-called mounting hole. The connecting pin 18 is guided through the opening 26 of the first circuit board 12 and is soldered to the first circuit board 12. According to the embodiment shown, the connecting pin 18 is soldered in the opening 26 to the first circuit board 12 by means of a through-hole reflow soldering method. To this end, a solder paste is first pressed into the opening 26 and the connecting pin 18 is then inserted. Upon melting of the solder paste, the liquid solder flows back into the opening 26 and forms a soldered connection 28. According to an embodiment not shown, it is also conceivable that the connecting pin 18 is soldered on the rear side 30 of the first circuit board 12. It is also conceivable that the connecting pin comprises a preformed rivet head in the section that projects beyond the first circuit board 12 on the rear side 30, such that the riveted connection is completed by the deformation of the section 24 that projects beyond the second circuit board 14.

[0031] Figure 3A side view of a plurality of circuit boards 12, 14 connected to each other by means of a contact connection device 10 according to the application is shown. The first circuit board 12 is a rigid circuit board and the second circuit board 14 is a flexible circuit board. A further rigid circuit board 12' is also provided. The first circuit board 12 comprises a glass-fiber mat impregnated with epoxy resin, for example, as a non-conductive carrier material, which is also known as material designation FR4. The second circuit board 14 is a thin circuit board, for example, based on a polyimide film. According to the embodiment shown, the second circuit board 14 is used to connect two rigid circuit boards 12, 12'. Such an application can be envisaged, for example, in a lighting device, in particular for connecting LED circuit boards. Here, the LED circuit boards comprise one or more LEDs, wherein a plurality of circuit boards is used, in particular in lighting devices with a multi-cavity reflector or / and with a plurality of feed-in points.

Claims

1. A conductive contact connection device (10) between a first circuit board (12) and a second circuit board (14), comprising the first circuit board (12), the second circuit board (14), and a connecting pin (18), wherein the first circuit board (12) is a rigid circuit board and the second circuit board (14) is a flexible circuit board, wherein the first circuit board (12) includes the connecting pin (18) in a region of the contact connection device (10) and the second circuit board (14) includes a through-hole (16) in a region of the contact connection device (10), wherein, The connecting pin (18) of the first circuit board (12) is at least partially formed of a conductive material and is inserted through a through-hole (16) of the second circuit board (14), wherein the connecting pin (18) is deformed by a deformation process in a section (24) extending out of the through-hole (16) of the second circuit board (14) to the outside of the second circuit board (14), such that a form-fit connection is formed between the first circuit board (12) and the second circuit board (14), and wherein the connecting pin (18) is connected to the first circuit board (12) by means of a through-hole reflow soldering method or by means of a surface mount technology (SMT) soldering method.

2. The contact connection device (10) according to claim 1, characterized in that, The inner wall (22) of the through-hole (16) of the second circuit board (14) includes a conductive material.

3. The contact connection device (10) according to claim 1, characterized in that, The deformation process is either a bending process or a riveting process.

4. A method for establishing a conductive contact connection device (10) between a first circuit board (12) and a second circuit board (14), wherein the contact connection device (10) includes the first circuit board (12), the second circuit board (14), and a connecting pin (18), wherein the first circuit board (12) is a rigid circuit board and the second circuit board (14) is a flexible circuit board, wherein, The first circuit board (12) includes the connecting pin (18) in the region of the contact connection device (10) and the second circuit board (14) includes a through-hole (16) in the region of the contact connection device (10), wherein the connecting pin (18) of the first circuit board (12) is at least partially formed of a conductive material, characterized in that the connecting pin (18) of the first circuit board (12) is inserted through the through-hole (16) of the second circuit board (14), and then the section (24) of the connecting pin (18) extending through the through-hole (16) of the second circuit board (14) to the outside of the second circuit board (14) is deformed during deformation, such that a form-fit connection is formed between the first circuit board (12) and the second circuit board (14), and wherein the connecting pin (18) is connected to the first circuit board (12) in the previous step by means of a through-hole reflow soldering method or the connecting pin (18) is connected to the first circuit board (12) in the previous step by means of a surface mount technology (SMT) soldering method.

5. The method according to claim 4, characterized in that, The deformation process is either a bending process or a riveting process.

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