A preparation method of a chip alloy resistor

Abstract

The present invention discloses a preparation method of a chip alloy resistor. The chip alloy resistor includes: a resistor body; the resistor body includes an upper resistor and a lower resistor; the thickness of the upper resistor is a first preset thickness, the thickness of the lower resistor is a second preset thickness, the lower resistor is connected below the upper resistor, and the width of the upper resistor is greater than the width of the lower resistor; the lower resistor is embedded in a preset hole position of a PCB board. In the embodiment of the present invention, the resistor body includes an upper resistor with a first preset thickness and a lower resistor with a second preset thickness. The lower resistor is embedded in the preset hole position and thus embedded on the PCB board to thicken the resistor body so as to reduce the resistance value of the chip alloy resistor; in the embodiment of the present invention, the resistance value of the resistor can be reduced without increasing the area of the PCB board, which is beneficial to the miniaturization of the whole machine.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic components, and particularly relates to a preparation method of a chip alloy resistor. Background Art

[0002] With the progress of technology and the development of the times, people's requirements for the refined management and safety specifications of the power consumption of electronic products are constantly increasing. Current detection resistors have been widely used in lithium battery charge and discharge circuits and chargers. Especially now, the battery life of smart terminals is limited by the inability to further improve the capacity density of lithium batteries, and instead, the pursuit of fast charging is carried out to improve the battery life. The charging current has increased several times compared with the traditional 1A and has a tendency to increase further. As the current in the circuit increases, the power of the current detection resistor in the circuit also increases by more than ten times or even dozens of times (P = I2R). In order to reduce the power consumption of the current resistor, it is necessary to continuously reduce the resistance value of the resistor. As the resistance value of the resistor approaches zero, the resistivity of various resistor materials has basically converged. Therefore, the existing chip alloy resistors achieve the purpose of reducing the resistance value by increasing the resistor volume. However, the size of the existing chip alloy resistors is too large, which requires a large space on the PCB and is not conducive to the miniaturization of the whole machine. Summary of the Invention

[0003] The present invention provides a preparation method of a chip alloy resistor to solve the technical problem that the existing chip alloy resistor occupies a large space on the PCB and is not conducive to the miniaturization of the whole machine.

[0004] The first embodiment of the present invention provides a chip alloy resistor, including:

[0005] A resistor body; the resistor body includes an upper resistor and a lower resistor;

[0006] The thickness of the upper resistor is a first preset thickness, the thickness of the lower resistor is a second preset thickness, one end of the lower resistor is connected below the upper resistor, and the width of the upper resistor is greater than the width of the lower resistor; the other end of the lower resistor is embedded in a preset hole position of the PCB board.

[0007] Further, a full-coverage protective layer is provided on the upper surface of the upper resistor, and a metal layer is provided at the end of the lower surface of the lower resistor.

[0008] Further, the size of the lower resistor corresponds to the size of the preset hole position.

[0009] Further, the second preset thickness of the lower resistor is not greater than the height of the preset hole position of the PCB board.

[0010] The second embodiment of the present invention provides a method for preparing the above-mentioned chip alloy resistor, including:

[0011] S1. Select an alloy sheet and prepare a patterned protective layer on the back surface of the alloy sheet;

[0012] S2. Prepare a full-coverage protective layer on the front surface of the alloy sheet;

[0013] S3. Prepare a resistance value mark on the front surface of the alloy sheet;

[0014] S4. Remove a preset thickness of the area on the back surface of the alloy sheet that is not covered by the protective layer to obtain the alloy sheet with the remaining thickness after removing the preset thickness;

[0015] S5. Prepare a metal layer on the area on the back surface of the alloy sheet that is not covered by the protective layer, and the metal layer is a composite metal layer from the inside out;

[0016] S6. Cut the alloy sheet into strips along the long side direction of a single product;

[0017] S7. Remove the alloy material in the area on the back surface of the alloy sheet that is covered by the protective layer, and stop removing the alloy material when the target resistance value is reached;

[0018] S8. Cut the alloy sheet into grains along the short side direction of a single product to obtain a chip alloy resistor.

[0019] Further, the preparation method of the patterned protective layer includes but is not limited to local spraying, roll coating, glue coating, exposure and development, and thick film printing.

[0020] Further, the preparation method of the full-coverage protective layer includes but is not limited to spraying, roll coating, glue coating, exposure and development, and thick film printing.

[0021] Further, the preparation method of the resistance value mark includes but is not limited to local spraying, roll coating, glue coating, exposure and development, laser marking, and thick film printing.

[0022] Further, the removal method of the preset thickness includes but is not limited to chemical etching and milling cutter removal.

[0023] The third embodiment of the present invention provides a method for preparing the above-mentioned chip alloy resistor, including:

[0024] S21. Select an alloy sheet and prepare full-coverage protective layers on both the front and back surfaces of the alloy sheet;

[0025] S22. Prepare a resistance value mark on the front surface of the alloy sheet;

[0026] S23. Use a milling cutter to remove a preset thickness from a preset area on the back of the alloy sheet to obtain the alloy sheet with the remaining thickness after removing the preset thickness;

[0027] S24. Prepare a metal layer in the area on the back of the alloy sheet that is not covered by the protective layer. The metal layer is a composite metal layer from the inside out;

[0028] S25. Cut the alloy sheet into strips along the long side direction of a single product;

[0029] S26. Remove the alloy material in the area on the back of the alloy sheet that is covered by the protective layer, and stop removing the alloy material when the target resistance value is reached;

[0030] S27. Cut the alloy sheet into granules along the short side direction of a single product to obtain a chip alloy resistor.

[0031] The resistor body of the embodiment of the present invention includes an upper resistor with a first preset thickness and a lower resistor with a second preset thickness. The lower resistor is embedded in a preset hole position and thus embedded into the PCB board to thicken the resistor body and reduce the resistance value of the chip alloy resistor; the embodiment of the present invention can reduce the resistance value of the resistor without increasing the area of the PCB board, which is beneficial to the miniaturization of the whole machine. Description of the Drawings

[0032] Figure 1 is a schematic structural diagram of a chip alloy resistor provided by the first embodiment of the present invention;

[0033] Figure 2 is another schematic structural diagram of a chip alloy resistor provided by the first embodiment of the present invention;

[0034] Figure 3 is a schematic connection structure diagram of a chip alloy resistor provided by the first embodiment of the present invention and a PCB board;

[0035] Figure 4 is a rear view of a chip alloy resistor provided by the first embodiment of the present invention arranged on a PCB board;

[0036] Figure 5 is a front view of a chip alloy resistor provided by the first embodiment of the present invention arranged on a PCB board;

[0037] Figure 6 is a schematic diagram of preparing a patterned protective layer on the back of an alloy sheet provided by the second embodiment of the present invention;

[0038] Figure 7 is a schematic diagram of preparing a full-coverage protective layer on the front of an alloy sheet provided by the second embodiment of the present invention;

[0039] Figure 8 It is a schematic diagram of preparing a resistance value mark on the front side of an alloy sheet provided by the second embodiment of the present invention;

[0040] Figure 9 It is a schematic diagram of preparing a metal layer on the back side of an alloy sheet provided by the second embodiment of the present invention;

[0041] Figure 10 It is a schematic diagram of the front side of an alloy sheet after cutting the alloy sheet into strips along the long side direction of a single product provided by the second embodiment of the present invention;

[0042] Figure 11 It is a schematic diagram of the back side of an alloy sheet after cutting the alloy sheet into strips along the long side direction of a single product provided by the second embodiment of the present invention;

[0043] Figure 12 It is a schematic diagram of the back side of an alloy sheet after removing the alloy material provided by the second embodiment of the present invention;

[0044] Figure 13 It is a schematic diagram of the front side of an alloy sheet after cutting the alloy sheet into grains along the short side direction of a single product provided by the second embodiment of the present invention;

[0045] Figure 14 It is a schematic diagram of the back side of an alloy sheet after cutting the alloy sheet into grains along the short side direction of a single product provided by the second embodiment of the present invention;

[0046] Figure 15 It is a schematic diagram of the first cut surface of an alloy sheet provided by the second embodiment of the present invention;

[0047] Figure 16 It is a schematic diagram of the second cut surface of an alloy sheet provided by the second embodiment of the present invention;

[0048] Figure 17 It is a schematic diagram of the third cut surface of an alloy sheet provided by the second embodiment of the present invention;

[0049] Figure 18 It is a schematic diagram of the fourth cut surface of an alloy sheet provided by the second embodiment of the present invention;

[0050] Figure 19 It is a schematic diagram of preparing a full-coverage protective layer on the back side of an alloy sheet provided by the third embodiment of the present invention;

[0051] Figure 20 It is a schematic diagram of preparing a full-coverage protective layer on the front side of an alloy sheet provided by the third embodiment of the present invention;

[0052] Figure 21 It is a schematic diagram of preparing a resistance value mark on the front side of an alloy sheet provided by the third embodiment of the present invention;

[0053] Figure 22 It is a schematic diagram of the back side of the alloy sheet after removing the alloy material provided by the third embodiment of the present invention;

[0054] Figure 23 It is a schematic diagram of preparing a metal layer on the back side of the alloy sheet provided by the third embodiment of the present invention;

[0055] Figure 24 It is a schematic diagram of the front side of the alloy sheet after cutting the alloy sheet into strips along the long side direction of a single product provided by the third embodiment of the present invention;

[0056] Figure 25 It is a schematic diagram of the back side of the alloy sheet after cutting the alloy sheet into strips along the long side direction of a single product provided by the third embodiment of the present invention;

[0057] Figure 26 It is a schematic diagram of the back side of the alloy sheet after removing the alloy material provided by the third embodiment of the present invention;

[0058] Figure 27 It is a schematic diagram of the front side of the alloy sheet after cutting the alloy sheet into granules along the short side direction of a single product provided by the third embodiment of the present invention;

[0059] Figure 28 It is a schematic diagram of the back side of the alloy sheet after cutting the alloy sheet into granules along the short side direction of a single product provided by the third embodiment of the present invention;

[0060] Figure 29 It is a schematic diagram of the first cross-section of the alloy sheet provided by the third embodiment of the present invention;

[0061] Figure 30 It is a schematic diagram of the second cross-section of the alloy sheet provided by the third embodiment of the present invention;

[0062] Figure 31 It is a schematic diagram of the third cross-section of the alloy sheet provided by the third embodiment of the present invention;

[0063] Figure 32 It is a schematic diagram of the fourth cross-section of the alloy sheet provided by the third embodiment of the present invention.

[0064] Among them, the reference numerals in the accompanying drawings of the specification are as follows:

[0065] 1. Upper resistor; 2. Lower resistor; 3. Resistor body; 4. Full-coverage protective layer; 5. Metal layer; 6. Resistor end plating; 7. PCB board; 8. PCB pad copper foil; 9. PCB board glass fiber layer. Detailed implementation manners

[0066] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0067] In the description of the present application, it should be understood that the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, unless otherwise stated, the meaning of "plurality" is two or more.

[0068] In the description of the present application, it should be noted that unless otherwise clearly defined and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0069] Please refer to Figures 1-5 , in the first embodiment of the present invention, the first embodiment of the present invention provides a chip alloy resistor, including:

[0070] A resistor body 3; the resistor body 3 includes an upper resistor 1 and a lower resistor 2;

[0071] The thickness of the upper resistor 1 is a first preset thickness, the thickness of the lower resistor 2 is a second preset thickness, the lower resistor 2 is connected below the upper resistor 1, and the width of the upper resistor 1 is greater than the width of the lower resistor 2; the lower resistor 2 is embedded in a preset hole position of the PCB board 7.

[0072] In the embodiment of the present invention, preset hole positions matching the chip alloy resistor are provided on the PCB board 7. The resistor body 3 is embedded in the PCB board 7 by embedding the lower resistor 2 into the preset hole positions, and a resistor terminal plating layer 6 is further provided on the side surface of the resistor body 3. The PCB board 7 includes a PCB board glass fiber layer 9 and a PCB board 7 pad copper foil, and the PCB pad copper foil 8 is provided on the PCB board glass fiber layer 9.

[0073] In the embodiment of the present invention, assuming the resistor length is l, width is w, thickness is t, and the resistivity of the resistor material is ρo, the resistance value of the resistor film layer can be determined by the following formula: R = ρo ●(l / s) = ρo ● (l / (t ● w)), in the embodiment of the present invention, the thickness t is the sum of the first preset thickness t1 and the second preset thickness t2. Without changing the resistance length l (l = l1 + l2 + l3), width w, and using the same resistivity ρo of the resistive material, substituting into the above formula, the resistance value of the resistive film layer is calculated as R = ρo ● (l / (t ● w)) = ρo ● (l1 / (t1 ● w)) + ρo ● (l2 / ((t1 + t2) ● w)) + ρo ● (l3 / (t1 ● w)), where t2 can be set according to the thickness of the PCB board 7, that is, the ratio of the thickness that the resistive film can be embedded to t1. Usually, according to the thickness of the 6-layer PCB board 7 of 1.6 mm, the thickness of t2 is usually 3 to 4 times the thickness of the conventional alloy resistor body 3t1, and the ratio of l2 / l is calculated as 0.6. The embodiment of the present invention can reduce the resistance value by more than 50% compared with the existing ordinary alloy resistor, and thus can effectively reduce the occupied space of the PCB, which is beneficial to improving the miniaturization of the whole machine.

[0074] Please refer to Figure 3 , a full-coverage protective layer 4 is provided on the upper surface of the upper resistor 1, and a metal layer 5 is provided at the end of the lower surface of the lower resistor 2.

[0075] As a specific implementation manner, the metal layer 5 is a composite metal layer 5 from the inside out, including: a copper / tin structure composite layer, a nickel / tin structure composite metal layer 5. In the embodiment of the present invention, a copper / nickel / tin structure composite metal layer 5 is selected.

[0076] As a specific implementation manner of the present invention, the size of the lower resistor 2 corresponds to the size of the preset hole position.

[0077] As a specific implementation manner of the embodiment of the present invention, the second preset thickness of the lower resistor 2 is not greater than the height of the preset hole position of the PCB board 7.

[0078] In the embodiment of the present invention, the second preset thickness of the lower resistor 2 is not greater than the height of the preset hole position on the PCB board 7, so that when the resistor body 3 is semi-embedded in the PCB board 7 through the lower resistor 2, the upper resistor 1 in the resistor body 3 can contact the PCB board 7, thereby making the components on the PCB board 7 more compact, which is beneficial to the miniaturization of the whole machine.

[0079] Implementing the embodiment of the present invention has the following beneficial effects:

[0080] In the embodiment of the present invention, the resistor body 3 is realized by setting an upper resistor 1 with a first preset thickness and a lower resistor 2 with a second preset thickness. The lower resistor 2 is embedded into the preset hole position and then embedded into the PCB board 7 to thicken the resistor body 3 so as to reduce the resistance value of the chip alloy resistor. In the embodiment of the present invention, the resistance value of the resistor can be reduced without increasing the area of the PCB board 7, which is beneficial to the miniaturization of the whole machine.

[0081] Please refer to Figures 6-18 , the second embodiment of the present invention provides a preparation method for the above chip alloy resistor, including:

[0082] S11. Select an alloy sheet and prepare a patterned protective layer on the back of the alloy sheet;

[0083] S12. Prepare a full-coverage protective layer on the front of the alloy sheet;

[0084] S13. Prepare a resistance value mark on the front of the alloy sheet;

[0085] S14. Remove a preset thickness of the area on the back of the alloy sheet that is not covered by the protective layer to obtain an alloy sheet with the remaining thickness after removing the preset thickness;

[0086] S15. Prepare a metal layer on the area on the back of the alloy sheet that is not covered by the protective layer. The metal layer is a composite metal layer from the inside out;

[0087] S16. Cut the alloy sheet into strips along the long side direction of a single product;

[0088] S17. Remove the alloy material in the area on the back of the alloy sheet that is covered by the protective layer, and stop removing the alloy material when the target resistance value is reached;

[0089] S18. Cut the alloy sheet into grains along the short side direction of a single product to obtain a chip alloy resistor.

[0090] As a specific implementation manner of the embodiment of the present invention, the preparation method of the patterned protective layer includes but is not limited to local spraying, roll coating, coating, exposure and development, and thick film printing.

[0091] As a specific implementation manner of the embodiment of the present invention, the preparation method of the full-coverage protective layer includes but is not limited to spraying, roll coating, coating, exposure and development, and thick film printing.

[0092] As a specific implementation manner of the embodiment of the present invention, the preparation method of the resistance value mark includes but is not limited to local spraying, roll coating, coating, exposure and development, laser marking, and thick film printing.

[0093] As a specific implementation manner of the embodiment of the present invention, the removal method of the preset thickness includes but is not limited to chemical etching and milling cutter removal.

[0094] As a specific implementation manner of an embodiment of the present invention, the preparation method of the metal layer includes, but is not limited to, chemical deposition, sputtering, and spraying.

[0095] As a specific implementation manner of an embodiment of the present invention, the removal method of the alloy material includes, but is not limited to, laser engraving, dotting, mechanical grinding, and mechanical lapping.

[0096] Implementing the embodiments of the present invention has the following beneficial effects:

[0097] In the embodiment of the present invention, a patterned protective layer is prepared on the back of the alloy sheet, and a full-coverage protective layer is prepared on the front of the alloy sheet and the resistance value is marked. After removing a preset thickness of the alloy sheet, a composite metal layer is prepared on the back of the alloy sheet, the alloy material in the area covered by the protective layer on the back of the alloy sheet is removed, and the removal of the alloy material is stopped when the target resistance value is reached, so as to achieve the purpose of precisely adjusting the resistance value of the chip alloy resistor. Finally, by cutting the alloy sheet, a complete chip alloy resistor is obtained.

[0098] For the chip alloy resistor obtained in the embodiment of the present invention, by setting preset holes corresponding to the lower part of the resistor body 3 on the PCB, the chip alloy resistor can be semi-embedded into the PCB board 7, so as to thicken the resistor body 3 to reduce the resistance value of the chip alloy resistor; in the embodiment of the present invention, the resistance value of the resistor can be reduced without increasing the area of the PCB board 7, which is beneficial to the miniaturization of the whole machine.

[0099] Please refer to Figures 19-32 , the third embodiment of the present invention provides a preparation method of a chip alloy resistor, including:

[0100] S21. Select an alloy sheet, and prepare a full-coverage protective layer on both the front and back of the alloy sheet;

[0101] S22. Prepare a resistance value mark on the front of the alloy sheet;

[0102] S23. Use a milling cutter to remove a preset thickness of a preset area on the back of the alloy sheet to obtain an alloy sheet with a remaining thickness after removing the preset thickness;

[0103] S24. Prepare a metal layer in the area not covered by the protective layer on the back of the alloy sheet, and the metal layer is a composite metal layer from the inside to the outside;

[0104] S25. Cut the alloy sheet into strips along the long side direction of a single product;

[0105] S26. Remove the alloy material in the area covered by the protective layer on the back of the alloy sheet, and stop removing the alloy material when the target resistance value is reached;

[0106] S27. Cut the alloy sheet into granular form along the short side direction of a single product to obtain a chip alloy resistor.

[0107] In the embodiment of the present invention, a full-coverage protective layer is prepared on both the front and back surfaces of the alloy sheet, a resistance value mark is prepared on the front surface of the alloy sheet. After removing a preset thickness of the alloy sheet, a composite metal layer is prepared on the back of the alloy sheet, the alloy material in the area of the back surface covering protective layer of the alloy sheet is removed, and the removal of the alloy material is stopped when the target resistance value is reached to achieve the purpose of precisely adjusting the resistance value of the chip alloy resistor. Finally, the alloy sheet is cut to obtain a complete chip alloy resistor.

[0108] For the chip alloy resistor obtained in the embodiment of the present invention, by setting preset hole positions corresponding to the lower part of the resistor body 3 on the PCB, the chip alloy resistor can be semi-embedded into the PCB board 7, so as to thicken the resistor body 3 to reduce the resistance value of the chip alloy resistor; the embodiment of the present invention can reduce the resistance value of the resistor without increasing the area of the PCB board 7, which is beneficial to the miniaturization of the whole machine.

[0109] The above are the preferred embodiments of the present invention. It should be noted that for those of ordinary skill in the art in this technical field, without departing from the principle of the present invention, several improvements and retouches can be made, and these improvements and retouches are also regarded as the protection scope of the present invention.

Claims

1. A preparation method of a chip alloy resistor, characterized in that, the chip alloy resistor includes: a resistor body; the resistor body includes an upper resistor and a lower resistor; the upper resistor has a thickness of a first preset thickness, the lower resistor has a thickness of a second preset thickness, the lower resistor is connected below the upper resistor, and the width of the upper resistor is greater than the width of the lower resistor; the lower resistor is embedded in a preset hole position of the PCB board; the preparation method of the chip alloy resistor includes: S11. Select an alloy sheet and prepare a patterned protective layer on the back of the alloy sheet; S12. Prepare a full-coverage protective layer on the front of the alloy sheet; S13. Prepare a resistance value mark on the front of the alloy sheet; S14. Remove a preset thickness of the area on the back of the alloy sheet that is not covered by the protective layer to obtain the alloy sheet with the remaining thickness after removing the preset thickness; S15. Prepare a metal layer on the area on the back of the alloy sheet that is not covered by the protective layer, and the metal layer is a composite metal layer from the inside out; S16. Cut the alloy sheet into strips along the long side direction of a single product; S17. Remove the alloy material in the area on the back of the alloy sheet that is covered by the protective layer, and stop removing the alloy material when the target resistance value is reached; S18. Cut the alloy sheet into grains along the short side direction of a single product to obtain a chip alloy resistor.

2. The preparation method of the chip alloy resistor according to claim 1, characterized in that, the preparation method of the patterned protective layer includes local spraying, roll coating, glue coating, exposure and development, and thick film printing.

3. The preparation method of the chip alloy resistor according to claim 1, characterized in that, the preparation method of the full-coverage protective layer includes spraying, roll coating, glue coating, exposure and development, and thick film printing.

4. The preparation method of the chip alloy resistor according to claim 1, characterized in that, the preparation method of the resistance value mark includes local spraying, roll coating, glue coating, exposure and development, laser marking, and thick film printing.

5. The preparation method of the chip alloy resistor according to claim 1, characterized in that, the removal method of the preset thickness includes chemical etching and milling cutter removal.

6. The preparation method of the chip alloy resistor according to claim 1, characterized in that, a full-coverage protective layer is provided on the upper surface of the upper resistor, and a metal layer is provided at the end of the lower surface of the lower resistor.

7. The preparation method of the chip alloy resistor according to claim 1, characterized in that, the size of the lower resistor corresponds to the size of the preset hole position.

8. The preparation method of the chip alloy resistor according to claim 1, characterized in that, the second preset thickness of the lower resistor is not greater than the height of the preset hole position of the PCB board.

9. A preparation method of a chip alloy resistor, characterized in that, the chip alloy resistor includes: a resistor body; the resistor body includes an upper resistor and a lower resistor; The thickness of the upper resistor is a first preset thickness, the thickness of the lower resistor is a second preset thickness, the lower resistor is connected below the upper resistor, and the width of the upper resistor is greater than the width of the lower resistor; the lower resistor is embedded in a preset hole position of the PCB board; The preparation method of the chip alloy resistor includes: S21. Select an alloy sheet, and prepare a full-coverage protective layer on both the front and back of the alloy sheet; S22. Prepare a resistance value mark on the front of the alloy sheet; S23. Use a milling cutter to remove a preset thickness of a preset area on the back of the alloy sheet to obtain the alloy sheet with the remaining thickness after removing the preset thickness; S24. Prepare a metal layer in the area where the protective layer is not covered on the back of the alloy sheet, and the metal layer is a composite metal layer from the inside out; S25. Cut the alloy sheet into strips along the long side direction of a single product; S26. Remove the alloy material in the area where the protective layer is covered on the back of the alloy sheet, and stop removing the alloy material when the target resistance value is reached; S27. Cut the alloy sheet into grains along the short side direction of a single product to obtain a chip alloy resistor.

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