A high-density multi-channel optical fiber communication system

Abstract

The present invention provides a high-density multi-channel optical fiber communication system, including an optical fiber array composed of a laser wafer and a plurality of optical fibers, wherein the laser wafer is connected to the plurality of optical fibers, wherein the laser wafer includes a laser pad, a laser emitting unit, a laser positive electrode and a laser negative electrode, a plurality of laser emitting units are arranged on the laser pad, the laser positive electrode and the laser negative electrode are electrically connected to the laser emitting unit, and the laser positive electrode and the laser negative electrode are arranged on both sides of the laser pad. The present invention further reduces the area required for the front side of the laser pad by directly placing the laser negative electrode on the back side of the laser pad, that is, using the laser positive electrode and the laser negative electrode in different planes rather than in the form of a coplanar surface, and reduces the originally adjacent laser light channels from the original 250μm to less than 250μm.

Description

Technical Field

[0001] The present invention relates to the field of communication, and in particular to a high-density multi-channel optical fiber communication system. Background Art

[0002] In the optical fiber communication system currently used in the prior art, if there are multiple channels, the minimum spacing between channels is 250 microns. The root cause of this can be traced back to the fact that the diameter of the main core of the multimode optical fiber is 125 microns. In addition to the coating layer, the spacing between two adjacent channels of all common optical fiber arrays is 250 microns. At the same time, the spacing of 250 microns is also the standard spacing between all previous lasers, PDs, and central active area channels. It is mainly to cooperate with the multi-channel transmission of the entire traditional optical communication system. Therefore, all the driver chips, lasers, optical devices, and optical fibers in the previous optical communication systems were designed and used according to the spacing of 250 microns.

[0003] Existing technical solutions, multi-channel optical fiber systems generally adopt the following two methods

[0004] Method 1: Spacing greater than 250 microns: Use a single laser, such as a single VCSEL, or a single TOSA, and the spacing between two adjacent channels is greater than 250 microns.

[0005] Method 2: Interval equal to 250 microns: Use a laser array in conjunction with an optical fiber array to create a multi-channel optical fiber transmission system with adjacent intervals of 250 microns.

[0006] Due to the structural limitations of optical chips, optical fiber arrays, and optical devices, the minimum adjacent spacing of multi-channel optical fiber communication systems is limited to 250 microns. When actual applications require higher density and more optical fiber communication channels need to be accommodated in a unit volume, they are limited to this 250-micron channel spacing. Summary of the invention

[0007] The technical problem to be solved by the embodiments of the present invention is that when the current optical fiber system needs to use a higher density and accommodate more optical fiber communication channels within a unit volume, it is limited by the channel spacing of 250 microns.

[0008] In order to solve the above technical problems, the technical solution adopted by the embodiment of the present invention is:

[0009] An embodiment of the present invention provides a high-density multi-channel fiber optic communication system, including a fiber array consisting of a laser wafer and multiple optical fibers, wherein the laser wafer is connected to the multiple optical fibers, wherein the laser wafer includes a laser welding pad, a laser emitting unit, a laser positive electrode and a laser negative electrode, and multiple laser emitting units are arranged on the laser welding pad, the laser positive electrode and the laser negative electrode are electrically connected to the laser emitting unit, and the laser positive electrode and the laser negative electrode are arranged on both sides of the laser welding pad opposite to each other.

[0010] Furthermore, the laser welding pad has a size of 50 μm-70 μm.

[0011] Furthermore, the laser wafer is made of gallium arsenide material.

[0012] Furthermore, the laser array includes at least two laser emitting units, and the laser array is connected to the optical fiber array.

[0013] Furthermore, the optical fiber array is formed by bonding 125 μm bare optical fibers.

[0014] Furthermore, the optical fiber array uses multi-core optical fibers arranged in a linear manner.

[0015] The beneficial effect of the embodiment of the present invention is that the embodiment of the present invention provides a high-density multi-channel optical fiber communication system, including an optical fiber array composed of a laser wafer and a plurality of optical fibers, wherein the laser wafer is connected to the plurality of optical fibers, wherein the laser wafer includes a laser pad, a laser emitting unit, a laser positive electrode and a laser negative electrode, and the laser pad is provided with a plurality of laser emitting units, the laser positive electrode and the laser negative electrode are electrically connected to the laser emitting unit, and the laser positive electrode and the laser negative electrode are arranged on both sides of the laser pad relative to each other. The present invention further reduces the area required for the front side of the laser pad by directly placing the laser negative electrode on the back side of the laser pad, that is, using the laser positive electrode and the laser negative electrode in different planes rather than in the form of a coplanar surface, and reduces the originally adjacent laser light channels from the original 250μm to less than 250μm. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention, not all embodiments. For those of ordinary skill in the art, other drawings can also be obtained based on the provided drawings without creative work.

[0017] Figure 1 A schematic diagram of a laser array according to an embodiment of the present invention;

[0018] Figure 2 is a schematic diagram of an optical fiber array according to Embodiment 1 of the present invention;

[0019] Figure 3 Schematic diagram of an optical fiber array according to Embodiment 2 of the present invention. DETAILED DESCRIPTION

[0020] In order to explain the technical content, structural features, achieved objectives and effects of the present invention in detail, the following is a detailed description in conjunction with the implementation methods and the accompanying drawings.

[0021] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0022] See also Figure 1 An embodiment of the present invention provides a high-density multi-channel optical fiber communication system, including an optical fiber array composed of a laser wafer and a plurality of optical fibers, wherein the laser wafer is connected to the plurality of optical fibers, wherein the laser wafer includes a laser welding pad, a laser emitting unit 1, a laser positive electrode and a laser negative electrode, a plurality of laser emitting units 1 are arranged on the laser welding pad, the laser positive electrode and the laser negative electrode are electrically connected to the laser emitting unit 1, and the laser positive electrode and the laser negative electrode are arranged on both sides of the laser welding pad opposite to each other.

[0023] The present invention further reduces the area required for the front side of the laser welding pad by directly placing the laser cathode on the back side of the laser welding pad, that is, using the laser anode and the laser cathode on different planes instead of taking the form of coplanarity, and reduces the original adjacent laser light channel from the original 250μm to less than 250μm.

[0024] It should be noted that the smaller the distance between two adjacent optical channels, the more conducive it is to high-density photoelectric conversion and optical communication integration. In this embodiment, the distance between two adjacent optical channels is reduced from the original 250μm to a minimum of 125μm. The transmission rate density is doubled, that is, under the same original area, this embodiment can transmit more than twice the signal transmission, which has the advantage of high integration.

[0025] Example 1

[0026] See also Figure 1 and Figure 2 , further, the laser welding pad size is 50μm-70μm.

[0027] Furthermore, the laser wafer is made of gallium arsenide material.

[0028] Furthermore, the laser array includes at least two laser emitting units 1, and the laser array is connected to the optical fiber array.

[0029] Furthermore, the optical fiber array is formed by bonding bare optical fibers 2 of 125 μm.

[0030] In this embodiment, by further reducing the size of the laser pad and adjusting the process of the laser light window, the two adjacent optical channels are made as small as possible. By reducing the diameter of the power metal area, the relative distance between the two adjacent light-emitting quantum wells is reduced from the original 250μm to less than 250μm. By considering both the overall size and the internal structure position, the two adjacent optical channels can be further reduced to less than 250μm.

[0031] In this embodiment, for semiconductor lasers made of III-V materials such as gallium arsenide, the more laser emitting units 1 can be integrated on a 4-inch or 6-inch wafer, the lower the cost of a corresponding single laser emitting unit 1 will be. Since the area of ​​a single laser emitting unit 1 is greatly reduced, the cost of a single laser emitting unit 1 can be reduced to less than 1 / 4 of the original, which has the advantage of low cost.

[0032] In this embodiment, the optical fiber array can be directly bonded with bare optical fibers 2 with a spacing of 125 microns. Compared with the existing multi-channel optical fiber communication system, which is limited to a minimum adjacent spacing of 250μm due to structural limitations of optical chips, optical fiber arrays and optical devices, this embodiment can reduce the optical channel spacing to less than 250μm, and the minimum to 125μm.

[0033] Example 2

[0034] See also Figure 1 and Figure 3 , further, the laser welding pad size is 50μm-70μm.

[0035] Furthermore, the laser wafer is made of gallium arsenide material.

[0036] Furthermore, the laser array includes at least two laser emitting units 1, and the laser array is connected to the optical fiber array.

[0037] Furthermore, the optical fiber array uses multi-core optical fibers 3 arranged in a straight line.

[0038] In this embodiment, by further reducing the size of the laser pad and adjusting the process of the laser light window, the two adjacent optical channels are made as small as possible. By reducing the diameter of the power metal area, the relative distance between the two adjacent light-emitting quantum wells is reduced from the original 250μm to less than 250μm. By considering both the overall size and the internal structure position, the two adjacent optical channels can be further reduced to less than 250μm.

[0039] In this embodiment, for semiconductor lasers made of III-V materials such as gallium arsenide, the more laser emitting units 1 can be integrated on a 4-inch or 6-inch wafer, the lower the cost of a corresponding single laser emitting unit 1 will be. Since the area of ​​a single laser emitting unit 1 is greatly reduced, the cost of a single laser emitting unit 1 can be reduced to less than 1 / 4 of the original, which has the advantage of low cost.

[0040] In this embodiment, the optical fiber array can be assembled with multi-core optical fibers 3 arranged in straight lines with a spacing of 125 microns. Compared with the existing multi-channel optical fiber communication system, which is limited to a minimum adjacent spacing of 250μm due to structural limitations of optical chips, optical fiber arrays and optical devices, this embodiment can reduce the optical channel spacing to less than 250μm, and the minimum to 125μm.

[0041] In summary, the high-density multi-channel optical fiber communication system provided by the present invention reduces the distance between two adjacent optical channels from the original 250μm to a minimum of 125μm. The transmission rate density is doubled, that is, under the same original area, the present implementation can transmit more than double the signal transmission, with the advantage of high integration. Since the area of ​​a single laser is greatly reduced, the cost of a single laser can be reduced to less than 1 / 4 of the original, with the advantage of low cost.

[0042] It should also be noted that, in the context of the present invention, relational terms such as first and second, etc., are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0043] The above description of the disclosed embodiments enables professionals and technicians in the field to implement or use the present invention. Various modifications to these embodiments will be apparent to professionals and technicians in the field, and the general principles defined in the present invention can be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to these embodiments shown in the present invention, but will conform to the widest range consistent with the principles and novel features disclosed in the present invention.

Claims

1. A high-density multi-channel optical fiber communication system, characterized in that: The invention comprises a fiber array composed of a laser wafer and a plurality of optical fibers, wherein the laser wafer is connected to the plurality of optical fibers, wherein the laser wafer comprises a laser welding pad, a laser emitting unit, a laser positive electrode and a laser negative electrode, a plurality of laser emitting units are arranged on the laser welding pad, the laser positive electrode and the laser negative electrode are electrically connected to the laser emitting units, the laser positive electrode and the laser negative electrode are arranged on both sides of the laser welding pad opposite to each other, the laser negative electrode is on the back side of the laser welding pad, and the laser positive electrode and the laser negative electrode are on different planes; the size of the laser welding pad is 50μm-70μm; the laser wafer comprises at least two laser emitting units, and the laser wafer is connected to the fiber array; the fiber array is formed by bonding 125μm bare optical fibers.

2. The high-density multi-channel optical fiber communication system according to claim 1, characterized in that: The laser wafer is made of gallium arsenide material.

3. The high-density multi-channel optical fiber communication system according to claim 1, characterized in that: The optical fiber array uses multi-core optical fibers arranged in a straight line.

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