DMD packaging structure installation component and electronic equipment

Abstract

The present invention provides a DMD packaging structure mounting assembly and an electronic device. The DMD packaging structure mounting assembly includes a heat dissipation structure and a pressing structure. The heat dissipation structure includes a connected heat dissipation part and a heat transfer part. The heat transfer part contacts the DMD packaging structure through a thermal pad. The pressing structure is used to press the circuit board to the DMD packaging structure, and press the DMD packaging structure to the base through the circuit board. It also includes a fixing seat, which is arranged between the heat dissipation part and the pressing structure. The heat transfer part passes through the fixing seat, the pressing structure and the circuit board in sequence. The heat dissipation structure and the pressing structure are both fixed to the fixing seat to form a heat dissipation pressing component. The fixing seat is fixed to the base through a first fastener. The area on the heat dissipation part corresponding to the first fastener is provided with an avoidance structure to avoid the installation space of the first fastener. The DMD packaging structure mounting assembly provided by the present invention disassembles and installs the heat dissipation structure, the pressing structure and the fixing seat as a whole, thereby improving assembly efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of DMD installation, and in particular to a DMD packaging structure installation component and electronic equipment. Background Art

[0002] DMD (Digital Micromirror Device) is the core component of digital light processing technology (DLP), which mainly realizes the projection image by adjusting the reflected light. Currently, most DMDs on the mainstream market use LGA packaging (Land Grid Array) technology. Since the connection between the DMD packaging structure and the FPCB (flexible printed circuit board) is a multi-contact connection, the FPCB needs to be pressed and fitted to the corresponding contacts of the DMD packaging structure during installation to achieve contact and conduction between the two. Since the positioning and fitting surfaces on the optical machine housing that cooperate with the DMD packaging structure have flatness tolerances, the DMD packaging structure will not be fitted accurately enough, resulting in the optical machine projection resolution using the DMD packaging structure failing to achieve the ideal effect. In the case where the flatness cannot be changed, in order to achieve a more ideal display effect, the installation structure of the DMD packaging structure needs to be disassembled and adjusted multiple times.

[0003] The existing DMD package structure assembly solution has a large number of structures, which makes the assembly and disassembly process complicated and time-consuming when multiple disassembly and assembly are performed, thus affecting assembly efficiency. Summary of the Invention

[0004] Based on the above situation, the main purpose of the present invention is to provide a DMD packaging structure mounting assembly and an electronic device to solve the above problems existing in the assembly solutions of the existing DMD packaging structure.

[0005] To achieve the above object, the technical solution adopted by the present invention is as follows:

[0006] A first aspect of the present invention provides a DMD packaging structure mounting assembly for mounting a DMD packaging structure and a circuit board on a base, comprising a heat dissipation structure and a pressing structure, wherein the heat dissipation structure comprises a connected heat dissipation portion and a heat transfer portion, wherein the heat transfer portion contacts the DMD packaging structure through a thermal pad, and the pressing structure is used to press the circuit board to the DMD packaging structure, and to press the DMD packaging structure to the base through the circuit board, and further comprises a fixing seat, wherein the fixing seat is arranged between the heat dissipation portion and the pressing structure, the heat transfer portion passes through the fixing seat, the pressing structure and the circuit board in sequence, and the portion of the heat transfer portion exposed from the circuit board contacts the DMD packaging structure through the thermal pad, the heat dissipation structure and the pressing structure are both fixed to the fixing seat to form a heat dissipation pressing component, the fixing seat is fixed to the base through a first fastener, and an avoidance structure is provided in the area of ​​the heat dissipation portion corresponding to the first fastener to avoid the installation space of the first fastener.

[0007] Preferably, the fixing seat is an elongated plate-shaped structure, comprising a first side surface and a second side surface opposite to each other, and the pressing structure cooperates with a middle structure in the extension direction of the fixing seat.

[0008] Preferably, the second side surface is provided with a groove, the groove is formed by the inward concavity of the second side surface, and a part of the structure of the compression structure is located in the groove.

[0009] Preferably, the clamping structure includes a connecting plate and a pressing plate connected to the connecting plate, the connecting plate is arranged to fit the bottom of the groove and is connected to the fixing seat through a second fastener, and at least part of the structure of the pressing plate extends out of the groove.

[0010] Preferably, the connecting piece is in the shape of a straight long strip, the pressing piece is in the shape of a long arch, and two connecting pieces and two pressing pieces are arranged opposite to each other and connected end to end to form a square.

[0011] Preferably, the DMD package structure is an LGA package, comprising a DMD device and an LGA connector, the LGA connector comprising two rows of contacts, and the two pressing sheets respectively correspond to the positions of the two rows of contacts.

[0012] Preferably, the heat dissipation portion includes a connecting plate and a plurality of heat sinks arranged on the main surface of the connecting plate, the connecting plate is arranged in contact with the first side surface, the connecting plate and the fixing seat are fixedly connected by a third fastener, the connecting plate is provided with a plurality of first mounting holes for cooperating with the third fastener, and the fixing seat is correspondingly provided with a plurality of second mounting holes for cooperating with the third fastener, and the plurality of second mounting holes are symmetrically distributed on both sides of the middle structure.

[0013] Preferably, an elastic member is provided between the third fastener and the connecting plate.

[0014] Preferably, third mounting holes cooperating with the first fasteners are provided at the four corners of the fixing seat.

[0015] Preferably, four corners of the first side surface are provided with notched grooves, and the third mounting hole is provided at the notched grooves.

[0016] Preferably, a positioning structure is provided on the fixing seat for positioning the fixing seat on the base.

[0017] Preferably, the positioning structure includes a positioning hole and / or a positioning groove.

[0018] Preferably, the DMD packaging structure mounting assembly further includes a sealing structure for sealing the circuit board.

[0019] Preferably, the sealing structure includes a sealing sheet and a sealing ring, the sealing sheet is arranged between the clamping structure and the circuit board, the sealing ring includes a side ring portion and a bottom ring portion, the side ring portion is arranged around the outer edge of the circuit board, and the bottom ring portion is located between the circuit board and the base.

[0020] A second aspect of the present invention provides an electronic device, comprising a substrate and a DMD packaging structure, wherein the DMD packaging structure is mounted on the substrate via the DMD packaging structure mounting assembly as described above.

[0021] Preferably, the electronic device is a projector or a 3D printer.

[0022] A fixing seat is provided in the DMD packaging structure installation assembly provided by the present invention, and the heat dissipation structure and the clamping structure are fixed on the fixing seat to form an integral structure, namely the heat dissipation and clamping component, and this integral structure is fixedly connected to the base through the fixing seat. In this way, when disassembly and adjustment are required, the heat dissipation structure, the clamping structure and the fixing seat can be disassembled and installed as a whole, which greatly improves the assembly efficiency. In addition, since the heat dissipation structure and the clamping structure will not be disassembled after being assembled with the fixing seat, their positions relative to each other are determined, and installation errors will no longer accumulate, thereby ensuring installation accuracy and reducing the number of disassembly and assembly times. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings.

[0024] Figure 1 One of the three-dimensional views of the DMD packaging structure installation assembly provided in a specific embodiment of the present invention;

[0025] Figure 2A second perspective view of a DMD packaging structure installation assembly provided in accordance with a specific embodiment of the present invention;

[0026] Figure 3 A cross-sectional view of the assembled DMD package structure mounting assembly, DMD package structure, circuit board, and substrate provided in a specific embodiment of the present invention;

[0027] Figure 4 An exploded view of a DMD package structure mounting assembly, a DMD package structure, and a circuit board provided in a specific embodiment of the present invention;

[0028] Figure 5 A cross-sectional view of an exploded view of a DMD package structure mounting assembly, a DMD package structure, a circuit board, and a substrate provided in a specific embodiment of the present invention;

[0029] Figure 6 This is a structural diagram of the fixing seat and the pressing structure in the DMD packaging structure installation assembly provided by an embodiment of the present invention.

[0030] In the picture:

[0031] 1. Heat dissipation structure; 11. Heat dissipation part; 111. Connecting plate; 1111. First mounting hole; 112. Heat sink; 12. Heat transfer part; 13. Coil spring; 2. Pressing structure; 21. Connecting plate; 22. Pressing plate; 221. Pressing strip; 222. Connecting strip; 3. Thermal pad; 4. DMD packaging structure; 41. DMD device; 42. LGA connector; 5. Circuit board; 6. Fixing seat; 61. First side surface; 62. Second side surface; 63. Groove; 64. Second mounting hole; 65. Third mounting hole; 66. Notched groove; 67. Positioning hole; 68. Positioning slot; 71. First fastener; 72. Second fastener; 73. Third fastener; 8. Optical housing; 81. Positioning column; 82. Groove; 9. Sealing structure; 91. Sealing plate; 92. Sealing ring. DETAILED DESCRIPTION

[0032] The present invention is described below based on the following embodiments, but the present invention is not limited to these embodiments. In the following detailed description of the present invention, some specific details are described in detail. In order to avoid obscuring the essence of the present invention, well-known methods, processes, procedures, and components are not described in detail.

[0033] Furthermore, persons of ordinary skill in the art will appreciate that the figures provided herein are for illustration purposes only and are not necessarily drawn to scale.

[0034] Unless the context clearly requires otherwise, throughout the specification and claims, the words "include," "comprising," and similar words should be construed in an inclusive sense rather than an exclusive or exhaustive sense; that is, in the sense of "including but not limited to."

[0035] In the description of the present invention, it should be understood that the terms "first", "second", etc. are used for descriptive purposes only and should not be understood to indicate or imply relative importance. In addition, in the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0036] like Figure 1 and Figure 2 As shown, this application provides a DMD packaging structure installation component, referring to Figures 3 to 6 , used to install the DMD package structure 4 and the circuit board 5 on the substrate, for example, Figure 3 The optical housing 8 shown. The DMD packaging structure 4 is a structure obtained by packaging the DMD device using packaging technology, such as a structure obtained by packaging using LGA packaging technology. The mounting assembly includes a heat dissipation structure 1 and a pressing structure 2, wherein the heat dissipation structure 1 includes a connected heat dissipation portion 11 and a heat transfer portion 12. In order to achieve a better heat dissipation effect, the heat dissipation portion 11 needs to be arranged on the outside. Therefore, the heat of the DMD packaging structure 4 on the inside needs to be transferred to the heat dissipation portion 11 through the heat transfer portion 12 for heat dissipation. Specifically, one end of the heat transfer portion 12 is connected to the heat dissipation portion 11, and the other end is in contact with the DMD packaging structure 4 through the thermal pad 3. In this way, the heat of the DMD packaging structure 4 can be transferred to the heat dissipation portion 11 in sequence through the thermal pad 3 and the heat transfer portion 12 for heat dissipation. The pressing structure 2 is used to press the circuit board 5 against the DMD packaging structure 4, and to press the DMD packaging structure 4 against the substrate through the circuit board 5. That is, the pressing structure 2, the circuit board 5, and the DMD packaging structure 4 are arranged in sequence, so that the pressing structure 2 presses the circuit board 5 and the DMD packaging structure 4 in sequence. In order to facilitate structural arrangement, preferably, the circuit board 5 is a flexible circuit board.

[0037] In the prior art, the heat dissipation structure and the pressing structure are fixed in series on the base through a fastener. Both disassembly and installation require the heat dissipation structure and the pressing structure to be aligned separately. The disassembly and assembly process is complicated, which affects the assembly efficiency. To address this problem, in the present application, the DMD packaging structure installation component also includes a fixing seat 6, which is arranged between the heat dissipation part 11 and the pressing structure 2, that is, from away from the base to close to the base, the heat dissipation part 11, the fixing seat 6, and the pressing structure 2 are arranged in sequence, and the heat transfer part 12 passes through the fixing seat 6, the pressing structure 2 and the circuit board 5 in sequence. The part of the heat transfer part 12 exposed to the circuit board 5 contacts the DMD packaging structure 4 through the thermal pad 3, that is, the heat transfer part 12 and the DMD packaging structure 4 are respectively in contact with the two opposite surfaces of the thermal pad 3. In this way, the heat of the DMD packaging structure 4 can be transferred to the heat dissipation part 11 through the thermal pad 3 and the heat transfer part 12 for dissipation. The heat dissipation structure 1 and the clamping structure 2 are both fixed to the fixing seat 6 to form a heat dissipation clamping component, so that the heat dissipation structure 1, the clamping structure 2, and the fixing seat 6 form a whole, and the three structures are disassembled and installed as a whole. Specifically, the fixing seat 6 is fixed to the base by the first fastener 71, so that the whole formed by the heat dissipation structure 1, the clamping structure 2 and the fixing seat 6 is fixed to the base. When adjusting the alignment of the circuit board and the DMD packaging structure, the three structures are adjusted as a whole, namely the heat dissipation clamping component, which greatly improves the assembly efficiency. In addition, since the heat dissipation structure 1 and the clamping structure 2 are no longer disassembled after being assembled with the fixing seat 6, the positions between each other are determined, and the installation errors will no longer accumulate, thereby ensuring the installation accuracy and reducing the number of disassembly and assembly. Since the fixing seat 6 is arranged between the heat dissipation part 11 and the clamping structure 2, the heat dissipation part 11 is located at the outermost side. In order to ensure the disassembly and assembly of the first fastener 71, the area corresponding to the first fastener 71 on the heat dissipation part 11 is provided with an avoidance structure to avoid the installation space of the first fastener 71.

[0038] The fixing seat 6 can be set to any structure that can achieve the above functions, such as a block structure or an irregular shell structure, etc. In order to make the structure more compact, preferably, as shown in FIG. Figures 3 to 6 As shown, the fixing base 6 is an elongated plate-like structure, with the two opposite surfaces of the elongated plate-like structure having the largest areas defined as a first side surface 61 and a second side surface 62, respectively. The first side surface 61 contacts the heat dissipation portion 11, and the second side surface 62 contacts the clamping structure 2. The clamping structure 2 cooperates with the central structure of the fixing base 6 in the extension direction, while the structures on both sides of the fixing base 6 cooperate with the base and the heat dissipation portion 11. This arrangement is more structurally sound, more convenient to assemble, and the overall structure after assembly is more reliable.

[0039] Furthermore, a groove 63 is provided on the second side 62, and the groove 63 is formed by the inward concave portion of the second side 62. Part of the structure of the clamping structure 2 is located in the groove 63. By providing the groove 63, more elastic space can be provided for the clamping structure 2, thereby improving the clamping effect on the circuit board 5 and the DMD packaging structure 4.

[0040] The compression structure 2 can be a structure such as a compression block or a compression plate that can achieve a compression effect, but the compression effect of these structures is not ideal. In order to facilitate installation and improve the compression effect, it is preferred that Figure 6 As shown, the clamping structure 2 includes a connecting piece 21 and a pressing piece 22 connected to the connecting piece 21. The pressing piece 22 is preferably an elastic member, so that the clamping effect can be improved. The connecting piece 21 is fitted with the bottom of the groove 63 and is connected to the fixing seat 6 through a second fastener 72. At least part of the structure of the pressing piece 22 extends out of the groove 63 so as to be pressed against the circuit board 5. There is no limit to the number of connecting pieces 21 and pressing pieces 22. One pressing piece 22 can be set on one connecting piece 21, or more than two pressing pieces 22 can be set on one connecting piece 21, or one pressing piece 22 can be connected to more than two connecting pieces 21. In order to facilitate installation and ensure the reliability of the structure, Figure 6 In the embodiment shown, the connecting piece 21 is in the shape of a straight long strip, and the pressing piece 22 is in the shape of a long arch. It can be understood that the arch here refers to a shape formed by a roughly protruding middle portion with both ends bent or curved toward the connecting piece 21. For example, it can be an arc shape, an isosceles trapezoid, etc. Setting the pressing piece 22 to a long arch shape can reduce the force-bearing area and increase the pressure when the force remains unchanged, thereby making the circuit board 5 and the DMD packaging structure 4 fit more closely.

[0041] Further preferably, the pressing piece 22 includes a pressure strip 221 in the middle and connecting strips 222 connected to the two ends of the pressure strip 221 respectively. The pressure strip 221 has a straight structure, which is convenient for matching with the circuit board 5. The connecting strip 222 has a curved structure and is smoothly connected to the pressure strip 221. This structure can enable the pressing piece 22 to better press the circuit board 5 to the DMD packaging structure 4 on the one hand, and can also ensure structural strength and extend service life on the other hand, thereby improving the reliability of the overall structure. The two connecting pieces 21 and the two pressing pieces 22 are alternately connected end to end to form a square, that is, the two connecting pieces 21 are arranged opposite to each other, and the two ends of the two connecting pieces 21 are respectively connected to the two ends of the two pressing pieces 22. During assembly, it is only necessary to install the square structure into the groove 63 and tighten it with the second fastener 72. Further preferably, the two connecting pieces 21 and the two pressing pieces 22 form an integrated structure, which is convenient for processing and has high structural reliability after processing.

[0042] The above-mentioned clamping structure 2 is particularly suitable for an embodiment in which the DMD package structure 4 is an LGA package. Specifically, in an embodiment in which the DMD package structure 4 is an LGA package, the DMD package structure 4 includes a DMD device 41 and an LGA connector 42. The contacts on the LGA connector 42 contact the contacts on the circuit board 5 to achieve electrical connection. The contacts on the LGA connector 42 are arranged in two rows. In the assembled state, the two pressing pieces 22 correspond to the positions of the two rows of contacts, that is, the extension direction of the pressing piece 22 is consistent with the arrangement direction of the contacts on the circuit board 5. In this way, the pressing piece 22 can better act on the contacts, so that the contact between the LGA connector 42 and the circuit board 5 is more precise and stable, so as to ensure the projection effect of the projection equipment using this installation component.

[0043] Furthermore, the heat dissipation portion 11 may be any structure that is convenient for heat dissipation, for example, Figure 1 In the embodiment shown, the heat dissipation portion 11 includes a connecting plate 111 and a plurality of heat sinks 112 arranged on the connecting plate 111. The connecting plate 111 is used to carry the heat sink 112 and the heat transfer portion 12 on the one hand, and is used to connect to the fixing seat 6 on the other hand. Specifically, the connecting plate 111 includes two opposite side surfaces, one of which is provided with the heat sink 112, and the other is provided with the heat transfer portion 12. The heat sink 112 is arranged at an angle to the connecting plate 111, and is preferably arranged perpendicular to each other. The side of the connecting plate 111 on which the heat transfer portion 12 is arranged is arranged to fit the first side surface of the fixing seat 6. In order to ensure the largest possible heat dissipation area, preferably, the edge profile of the connecting plate 111 is roughly the same as the edge profile of the fixing seat 6, except that a avoidance structure is provided at the position corresponding to the first fastener 71 to provide an operating space for the installation of the first fastener 71 (detailed description will be given later).

[0044] The heat transfer part 12 is a columnar structure, and the fixing seat 6 and the circuit board 5 are provided with corresponding holes for the heat transfer part 12 to pass through. The pressing structure 2 can be arranged away from the heat transfer part 12, or a corresponding hole for the heat transfer part 12 to pass through can be provided on the pressing structure 2. Preferably, Figure 6 In the illustrated embodiment, the through hole of the fixing seat 6 is arranged at the position of the groove 63 and located between the two pressing plates 22 , so that the heat transfer portion 12 can pass between the two pressing plates 22 .

[0045] Furthermore, the connecting plate 111 and the fixing seat 6 can be fixedly connected together by means of snap connection, fastener connection, etc. To ensure structural reliability, preferably, the connecting plate 111 and the fixing seat 6 are fixedly connected by a third fastener 73. Specifically, a first mounting hole 1111 is provided on the connecting plate 111, and a second mounting hole 64 is provided on the fixing seat 6. The connecting plate 111 and the fixing seat 6 are fixedly connected by the third fastener 73, the first mounting hole 1111, and the second mounting hole 64. In order to avoid the third fastener 73, the heat sink 112 can be omitted at the location where the third fastener 73 is provided, or a heat sink 112 can be provided as shown in FIG. Figure 1 As shown, a heat sink 112 is provided, and a notch is provided on the heat sink 112 to avoid the third fastener 73, which is more conducive to increasing the heat dissipation area.

[0046] The first fastener 71 , the second fastener 72 and the third fastener 73 may be structural members such as screws, rivets, and pins that can achieve fastening connection. For easy assembly and disassembly, preferably, the first fastener 71 , the second fastener 72 and the third fastener 73 are all screws.

[0047] In order to further improve the connection reliability between the heat dissipation structure 2 and the fixing seat 6, preferably, an elastic member is provided between the third fastener 73 and the connecting plate 111, such as a spring or a Figure 3 The coil spring 13 is shown.

[0048] The number of the first mounting hole 1111 and the second mounting hole 64 can be one or more. To improve the installation reliability, the first mounting hole 1111 and the second mounting hole 64 are preferably provided in plurality, and the plurality of second mounting holes 64 are symmetrically distributed on both sides of the middle structure of the aforementioned fixing seat 6. For example, Figure 6 In the illustrated embodiment, two second mounting holes 64 are provided, and the two second mounting holes 64 are respectively located on both sides of the groove 63 .

[0049] The fixing base 6 is provided with a third mounting hole 65 for cooperating with the first fastener 71. The third mounting hole 65 can be set at any position of the fixing base 6. In order to facilitate operation and avoid the setting of the structure, it is preferably as follows: Figure 6 As shown, the third mounting holes 65 are set at the four corners of the fixing base 6. In this way, it is only necessary to adjust the four corners of the heat dissipation structure 1 to the corresponding default structure (refer to Figure 1 ).

[0050] More preferably, Figure 1As shown, the four corners of the first side surface of the fixing seat 6 are provided with notched grooves 66, and the third mounting hole 65 is provided at the notched grooves 66. The meaning of the notched grooves 66 is that the shape of the groove is a notched structure, and the groove extends to communicate with the edge of the fixing seat 6. This arrangement can increase the installation space of the first fastener 71, thereby improving the convenience of installation and disassembly of the first fastener 71.

[0051] Further preferably, in order to improve the installation efficiency, a positioning structure is provided on the fixing seat 6 for positioning the fixing seat 6 on the base. The positioning structure can be, for example, a positioning column, a positioning plate, etc. In a preferred embodiment, as shown in FIG. Figure 6 As shown, the positioning structure includes a positioning hole 67 provided on one side of the groove 63 and a positioning through groove 68 on the other side. The circular hole of the positioning hole 67 and the positioning through groove 68 are grooves that pass through the thickness direction of the fixing seat 6, respectively used to cooperate with the structure on the base, for example, Figure 3 As shown, the optical housing 8 is provided with two positioning posts 81, one of which cooperates with the positioning hole 67 for positioning, and the other with the positioning slot 68 for positioning. Thus, the positioning hole 67 serves as the primary positioning structure, while the positioning slot 68 allows for slight deviation during the installation of the fixing base 6, thereby compensating for processing deviations. Furthermore, the positioning slot 68 can also be replaced with a waist-shaped hole or other structure, as long as it can compensate for processing deviations. Of course, it is understood that the positioning structures can also be all positioning holes or all positioning slots.

[0052] Further preferably, in order to prevent dust, water vapor, etc. from entering the circuit board 5 and the DMD packaging structure 4 and causing damage thereto, the DMD packaging structure mounting assembly also includes a sealing structure 9 for sealing the circuit board 5 and the DMD packaging structure 4 to ensure the reliability of the product and extend its service life.

[0053] In a specific embodiment, Figures 3 to 5 As shown, the sealing structure 9 includes a sealing sheet 91 and a sealing ring 92, wherein the sealing sheet 91 is arranged between the pressing structure 2 and the circuit board 5, and the sealing ring 92 is arranged around the outer edge of the circuit board 5. The circuit board 5 can be as shown in FIG. Figure 3 As shown, its edge structure is pressed against the sealing ring 92 , or the entire circuit board 5 is located inside the sealing ring 92 . In this way, the sealing of the circuit board 5 and the DMD packaging structure 4 is achieved through the cooperation of the sealing sheet 91 and the sealing ring 92 .

[0054] Preferably, the sealing sheet 91 is in contact with the second side surface of the fixing seat 6, as shown in FIG. Figure 3 and Figure 5As shown, a recess 82 for mounting the DMD package 4 and the circuit board 5 is provided on a substrate, such as an optical housing 8. A seal 91 is preferably disposed within the recess 82, with the outer edge of the seal 91 abutting against the sidewalls of the recess 82. The outer sidewalls of the seal ring 92 are also preferably abutting against the sidewalls of the recess 82. In embodiments where the edge structure of the circuit board 5 is pressed against the seal ring 92, the edge structure of the circuit board 5 presses the seal ring 92 against the bottom wall of the recess 82. Thus, the seal structure 9 provides comprehensive protection for the circuit board 5 and the DMD package 4.

[0055] Furthermore, the present application also provides an electronic device, including a substrate and a DMD packaging structure, and also includes the above-mentioned DMD packaging structure mounting assembly to reliably mount the DMD packaging structure on the substrate and facilitate disassembly, assembly and debugging.

[0056] The electronic device may be a device that requires a DMD device, such as a projector and a 3D printer. When the electronic device is a projector, the base is an optical housing 8 .

[0057] Those skilled in the art will appreciate that, provided there is no conflict, the above preferred solutions can be freely combined and superimposed.

[0058] It should be understood that the above-mentioned embodiments are merely illustrative and non-restrictive. Without departing from the basic principles of the present invention, various obvious or equivalent modifications or substitutions that can be made by those skilled in the art to the above-mentioned details will be included in the scope of the claims of the present invention.

Claims

1. A DMD package structure mounting assembly for mounting a DMD package structure and a circuit board on a substrate, comprising a heat dissipation structure and a pressing structure, wherein the heat dissipation structure comprises a heat dissipation portion and a heat transfer portion connected to each other, the heat transfer portion being in contact with the DMD package structure via a thermal pad, and the pressing structure being used to press the circuit board against the DMD package structure, and the DMD package structure is pressed against the substrate via the circuit board, characterized in that: The device further comprises a fixing seat, the fixing seat being arranged between the heat dissipation portion and the pressing structure, the heat transfer portion sequentially passing through the fixing seat, the pressing structure and the circuit board, the portion of the heat transfer portion exposed from the circuit board being in contact with the DMD packaging structure via the thermal pad, the heat dissipation structure and the pressing structure being both fixed to the fixing seat to form a heat dissipation pressing component, the fixing seat being fixed to the base by a first fastener, and an avoidance structure being provided on the heat dissipation portion in an area corresponding to the first fastener to avoid installation space for the first fastener; The heat dissipation portion includes a connecting plate and a plurality of heat dissipation fins provided on the connecting plate, and the connecting plate and the fixing seat are fixedly connected by a third fastener; The pressing structure is connected to the fixing seat via a second fastener; The base is provided with a first groove, and the pressing structure presses the DMD packaging structure and the circuit board into the first groove of the base.

2. The DMD package structure mounting assembly according to claim 1, wherein: The fixing seat is an elongated plate-shaped structure, including a first side surface and a second side surface that are opposite to each other, and the pressing structure cooperates with a middle structure in an extending direction of the fixing seat.

3. The DMD package structure mounting assembly according to claim 2, wherein: The second side surface is provided with a groove, the groove is formed by the inward concavity of the second side surface, and a part of the structure of the compression structure is located in the groove.

4. The DMD package structure mounting assembly according to claim 3, wherein: The clamping structure includes a connecting piece and a pressing piece connected to the connecting piece. The connecting piece is arranged to fit the bottom of the groove and is connected to the fixing seat through the second fastener. At least part of the structure of the pressing piece extends out of the groove.

5. The DMD packaging structure mounting assembly according to claim 4, wherein: The connecting piece is in the shape of a straight long strip, the pressing piece is in the shape of a long arch, and two connecting pieces and two pressing pieces are alternately connected end to end to form a square.

6. The DMD package structure mounting assembly according to claim 5, wherein: The DMD packaging structure is an LGA package, including a DMD device and an LGA connector. The LGA connector includes two rows of contacts, and the two pressing sheets correspond to the positions of the two rows of contacts respectively.

7. The DMD package structure mounting assembly according to claim 2, wherein: The connecting plate is fitted with the first side surface, and a plurality of first mounting holes for cooperating with the third fastener are provided on the connecting plate. A plurality of second mounting holes for cooperating with the third fastener are correspondingly provided on the fixing seat, and the plurality of second mounting holes are symmetrically distributed on both sides of the middle structure.

8. The DMD package structure mounting assembly according to claim 7, wherein: An elastic member is provided between the third fastener and the connecting plate.

9. The DMD package structure mounting assembly according to claim 2, wherein: The four corners of the fixing seat are provided with third mounting holes that cooperate with the first fasteners.

10. The DMD package structure mounting assembly according to claim 9, wherein: The four corners of the first side surface are provided with notched grooves, and the third mounting holes are provided at the notched grooves.

11. The DMD package structure mounting assembly according to any one of claims 1 to 10, characterized in that: The fixing seat is provided with a positioning structure for positioning the fixing seat on the base.

12. The DMD package structure mounting assembly according to claim 11, wherein: The positioning structure includes a positioning hole and / or a positioning through groove.

13. The DMD package structure mounting assembly according to any one of claims 1 to 10, characterized in that: The DMD package structure mounting assembly further includes a sealing structure for sealing the circuit board and the DMD package structure.

14. The DMD package structure mounting assembly according to claim 13, wherein: The sealing structure includes a sealing sheet and a sealing ring. The sealing sheet is arranged between the pressing structure and the circuit board, and the sealing ring is arranged around the outer edge of the circuit board.

15. An electronic device comprising a substrate and a DMD packaging structure, characterized in that: The DMD packaging structure is mounted on the substrate via the DMD packaging structure mounting assembly according to any one of claims 1 to 14.

16. The electronic device according to claim 15, characterized in that The electronic device is a projector or a 3D printer.

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