A box-type six-sided appearance inspection device and method for chip electronic components

Abstract

The present invention provides a six-sided appearance inspection device and method for a box-type chip electronic component. Multiple components are loaded into a carrier box. The inspection device has a conveyor belt for placing and driving the carrier box to move. Along the conveyor belt, there are: a top surface inspection unit, which is provided with a first camera for inspecting the top surface of the component; a side inspection unit, which is provided with multiple suction heads and multiple side cameras, the suction heads are used to grab the corresponding components and move upward to the height of the multiple side cameras, and the multiple side cameras are used to inspect the four sides of the component; a flip unit, which is used to flip the component upside down, and after flipping, the bottom surface of the component faces upward; a bottom surface inspection unit, which is provided with a second camera for inspecting the bottom surface of the flipped component. The neat arrangement of the components of the present invention greatly simplifies the difficulty of operation and improves the efficiency and accuracy of the six-sided appearance inspection.

Description

Technical Field

[0001] The present invention relates to the field of automation equipment, and in particular to a box-type six-side appearance inspection device and method for chip-type electronic components. Background Art

[0002] The existing technology usually puts chip electronic components in bulk, and then uses a vibration plate to line up the electronic components on the edge of a larger rotating transparent glass disk and arrange them in a certain way. Then, multiple cameras installed above, below, and at other locations on the edge of the disk are used to capture and image the six sides of each electronic component on the edge of the rotating glass disk. This method cannot ensure that all sides of each capacitor can face the camera at a consistent and optimal angle, and the effect of appearance inspection is also greatly limited. Summary of the invention

[0003] An object of the present invention is to provide a six-sided appearance inspection device and method for chip-type electronic components, which greatly simplifies the operation difficulty and improves the efficiency and accuracy of appearance inspection by utilizing the neat arrangement of components.

[0004] In particular, according to one aspect of the present invention, a six-sided appearance inspection device for a chip electronic component box is provided, wherein a plurality of components are loaded into a carrier box, and the inspection device has a conveyor belt for placing and driving the carrier box to move; and along the conveyor belt are arranged:

[0005] A top surface inspection unit is provided with a first camera and is used to inspect the top surface of the component;

[0006] A side inspection unit is provided with a plurality of suction heads and a plurality of side cameras, wherein the suction heads are used to grab corresponding components and move upward to the height of the plurality of side cameras, and the plurality of side cameras are used to inspect four sides of the components;

[0007] A flip unit is used to flip the components upside down, so that the bottom of the components face upwards after flipping;

[0008] The bottom surface inspection unit is provided with a second camera for inspecting the bottom surface of the flipped component.

[0009] Preferably, the side inspection unit comprises two independent subunits:

[0010] A longitudinal side inspection unit is provided with left and right cameras and a row of longitudinal suction heads, wherein the longitudinal suction heads are used to grab corresponding components and move upward to the height of the left and right cameras;

[0011] The lateral inspection unit is provided with front and rear cameras and a row of lateral suction heads, wherein the lateral suction heads are used to grab corresponding components and move upwards to the height of the front and rear cameras.

[0012] Preferably, the multiple suction heads are arranged in a row, the suction heads can move up and down and rotate around the center by a predetermined angle, and the suction heads are also used to drive the components to rotate 90° around the center; the multiple side cameras are a group of left and right cameras or a group of front and rear cameras.

[0013] Preferably, the flipping unit includes an upper mechanism, a lower mechanism, a flipping mechanism and a vibrating mechanism, the upper mechanism is provided with an inverted empty carrier box; the lower mechanism is flush with the conveyor belt, and is placed with a carrier box containing components; the upper mechanism and the lower mechanism move toward each other, and the empty carrier box is aligned and clamped with the carrier box containing components; the flipping mechanism is used to swap the positions of the upper and lower mechanisms, after the swap, the previous upper mechanism and the empty carrier box are located at the bottom, and the previous lower mechanism and the carrier box containing components are located at the top; the vibrating mechanism is used to vibrate the upper and lower mechanisms so that the components fall into the empty carrier box.

[0014] Preferably, a waste rejection unit is also provided along the conveyor belt, which is provided with a suction head for grabbing unqualified components and placing them into a waste box.

[0015] According to another aspect of the present invention, a method for inspecting the appearance of a six-sided box of a chip-type electronic component adopts the above-mentioned inspection device, and comprises the following steps:

[0016] S1: The carrier enters the conveyor belt;

[0017] S2: After passing through the top surface inspection unit, the first camera traverses the top surface of each component or photographs the top surfaces of all components at one time, and the image is transmitted to the central processing unit;

[0018] S3: After passing through the side inspection unit, the multiple suction heads grab the corresponding components and move upward to the height of the multiple side cameras; the multiple side cameras traverse the four sides of each inspected component or shoot the sides of all components at one angle at a time, and the images are transmitted to the central processing unit;

[0019] S4: The component is turned upside down by the turning unit so that the bottom surface of the component faces upward after turning;

[0020] S5: After passing through the bottom surface inspection unit, the second camera traverses the bottom surface of each component or photographs the bottom surfaces of all components at one time, and the image is transmitted to the central processing unit;

[0021] S6: Eliminate unqualified components;

[0022] S7: The carrier box leaves the conveyor belt.

[0023] Preferably, the side inspection unit includes two independent longitudinal side inspection units and a transverse side inspection unit, and step S3 specifically includes the following sub-steps:

[0024] S301: After passing through the longitudinal side inspection unit, a row of longitudinal suction heads grabs the corresponding components and moves upward to the height of the left and right cameras. The left and right cameras traverse the left and right sides of each inspected component or shoot the left and right sides of all components at one time;

[0025] S302: The row of longitudinal suction heads moves downward to put the corresponding components back to their original positions;

[0026] S303: After passing through the lateral inspection unit, a row of lateral suction heads grabs the corresponding components and moves upward to the height of the front and rear cameras. The front and rear cameras traverse the front and rear sides of each inspected component or take pictures of the front and rear sides of all components at one time;

[0027] S304: The row of lateral suction heads moves downward to put the corresponding components back to their original positions.

[0028] Preferably, the flip unit comprises an upper mechanism, a lower mechanism, a flip mechanism and a vibration mechanism, wherein the upper mechanism is provided with an inverted empty carrier box; the lower mechanism is flush with the conveyor belt and is provided with a carrier box containing components, and step S4 specifically comprises the following sub-steps:

[0029] S401: the upper mechanism and the lower mechanism move toward each other, and the empty carrier box and the carrier box loaded with components are aligned and clamped;

[0030] S402: The flip mechanism rotates to swap the positions of the upper and lower mechanisms. After the swap, the previous upper mechanism and the empty carrier box are located at the bottom, and the previous lower mechanism and the carrier box with components are located at the top.

[0031] S403: the vibration mechanism vibrates the upper and lower mechanisms, and the components fall into the empty box below;

[0032] S404: The upper mechanism and the lower mechanism move in opposite directions, and the empty carrier box is separated from the carrier box loaded with components.

[0033] The inspection device of the present invention is equipped with a top surface inspection unit, a side surface inspection unit, a flip unit, and a bottom surface inspection unit along the conveyor belt, so it can completely and orderly traverse the six surfaces of each component, and is particularly suitable for tantalum capacitors or chip aluminum capacitors. The electronic component six-side appearance inspection device using this solution has the following advantages compared with the prior art:

[0034] (1) This solution does not require the use of a vibration plate to convert the electronic components from a chaotically stacked state to an orderly arrangement. This operation will cause the electronic components to rub against each other and collide, thereby damaging their surfaces, and will also increase equipment costs.

[0035] (2) This solution does not use a rotating glass disk, and there is no need to observe the bottom surface through the glass surface. This is because the glass surface may be worn or contaminated after long-term use, which may cause misjudgment during inspection.

[0036] (3) In this solution, the position of each electronic component is highly consistent with the angle and distance of the observation camera, which can achieve unified and detailed observation of the six surfaces of each electronic component. In the prior art, the arrangement position of the electronic components on the glass plate has a certain gap with respect to the angle and distance of each observation camera, which has a certain adverse effect on detailed observation.

[0037] (4) After the inspection, the electronic components of this solution are always arranged in order in the carrier box, which is beneficial to the subsequent taping process to save the vibration plate sorting, orientation and other loading operations, and also reduces the cost and the chance of damaging the surface of the components again. The existing technology will output the electronic components in a chaotic stacking state, and the subsequent taping process still needs to use vibration plate sorting, orientation and other loading operations, which not only increases the chance of damage to the surface of the electronic components, but also increases the equipment cost.

[0038] Based on the following detailed description of specific embodiments of the present invention in conjunction with the accompanying drawings, those skilled in the art will become more aware of the above and other objects, advantages and features of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Hereinafter, some specific embodiments of the present invention will be described in detail in an exemplary and non-limiting manner with reference to the accompanying drawings. The same reference numerals in the accompanying drawings indicate the same or similar components or parts. It should be understood by those skilled in the art that these drawings are not necessarily drawn to scale. In the accompanying drawings:

[0040] Figure 1 is a schematic diagram of a box-type six-sided appearance inspection device for chip electronic components according to Embodiment 1 of the present invention;

[0041] Figure 2 is a schematic diagram of a top surface inspection unit;

[0042] Figure 3 is a schematic diagram of a longitudinal side inspection unit;

[0043] Figure 4 is a schematic diagram of a lateral side inspection unit;

[0044] Figure 5 is the main view of the flip unit;

[0045] Figure 6 It is a three-dimensional picture of the material box of the flip unit before flipping;

[0046] Figure 7 It is a three-dimensional picture of the material box of the flip unit after flipping. DETAILED DESCRIPTION

[0047] In the field of chip electronic component production and testing, automation is achieved by transferring the components between various processes through carrier boxes. When multiple components are placed in a carrier box, the six sides of the carrier box need to be inspected during the appearance inspection, and then the components are taken out of the carrier box, taped, and packaged. This method can avoid appearance damage caused by stacking and collision of components during operation.

[0048] Embodiment 1

[0049] like Figure 1 As shown, the inspection device has a conveyor belt for placing and driving the carrier box to move. Along the conveyor belt, there are mainly: a conveyor belt entrance 1, a top surface inspection unit 2, a side inspection unit (longitudinal side inspection unit 3, a transverse side inspection unit 4, a flip unit 5, a bottom surface inspection unit 6, a waste rejection unit 7, and a conveyor belt exit 8. The image information obtained by these units can be transmitted to the central processing unit to which they are remotely connected. Each component in the carrier box is numbered.

[0050] like Figure 2 As shown, a first camera 203 is provided in the top surface inspection unit 2. The first camera 203 is above the conveyor belt, with the lens facing downward. The first camera 203 can photograph components one by one, thereby traversing the top surface of each component; or, the first camera 203 can photograph the top surfaces of all components in the carrier box at one time. The first camera 203 is controlled by the first Y-axis slide 201 and the first X-axis slide 202. When photographing the top surfaces of components one by one, the camera lens and the carrier box will have relative movement, and the lens can be aimed at the top surface of a component each time. The image is transmitted to the central processing unit to determine whether there are defects on the top surface.

[0051] The side inspection unit includes two independent subunits, which are respectively a longitudinal side inspection unit 3 and a transverse side inspection unit 4 along the conveyor belt. The order of the two subunits on the conveyor belt can also be exchanged.

[0052] like Figure 3As shown, the longitudinal side inspection unit 3 has a row of longitudinal suction heads 305, the number and longitudinal distribution position of the longitudinal suction heads 305 correspond to a row of components arranged longitudinally in the carrier box; and it also has left and right cameras 304. The second Z-axis slide 303 controls the vertical movement of the longitudinal suction head 305, and the longitudinal suction head 305 grabs the corresponding components and moves upward to the height of the left and right cameras 304, and the left and right cameras 304 face the left and right sides of the components respectively. The second Y-axis slide 302 controls the Y-axis movement of the left and right cameras 304. At this time, the method of relative longitudinal movement of the lens and the component queue can be adopted, so that the lens can shoot the left and right sides of the components one by one. It is also possible to use a static method to align the left and right sides of all the electronic components in a row to take pictures. After the photo is taken, the longitudinal suction head 305 moves downward to put the component into the original position of the carrier box. The second X-axis slide 301 controls the movement of the longitudinal suction head 305 in the X-axis, and the carrier box moves a row in the transverse X-axis, so that the longitudinal suction head 305 queues up the next row of longitudinally arranged components and conducts a longitudinal appearance inspection row by row. After all components are photographed, the carrier box moves along the conveyor belt to the next station. The image is transmitted to the central processing unit to determine whether there are defects on the left and right sides.

[0053] like Figure 4 As shown, the lateral inspection unit 4 has a row of lateral suction heads 405, the number and longitudinal distribution positions of which correspond to a row of components arranged horizontally in the carrier box; and also has front and rear cameras 404. The third Z-axis slide 403 controls the vertical movement of the lateral suction heads 405, which grab the corresponding components and move upward to the height of the front and rear cameras 404, which face the front and rear sides of the components, respectively. The third X-axis slide 401 controls the X-axis movement of the front and rear cameras 404. At this time, the method of relative lateral movement of the lens and the component queue can be used, so that the lens can shoot the front and rear sides of the components one by one. It is also possible to use a static method to align the front and rear sides of all rows of electronic components to take pictures. After the picture is taken, the lateral suction head 405 moves downward to put the components of the horizontal row into the original position of the carrier box. The third Y-axis slide 402 controls the movement of the transverse suction head 405 in the Y-axis. The transverse suction head 405 moves a row in the longitudinal Y-axis, allowing the transverse suction head 405 queue to suck up the next row of transversely arranged components and perform a transverse row-by-row appearance inspection. After all components are photographed, the carrier moves along the conveyor belt to the next station. The image is transmitted to the central processing unit to determine whether there are defects on the front and rear sides.

[0054] like Figure 5As shown, the flip unit 5 is used to flip the components upside down. After flipping, the bottom surface of the components faces upward. The flip unit includes a carrier box 501, a transfer box 502, a servo motor 503, a linear vibrator 504, and a box pressing plate 505. First, the upper mechanism is provided with an inverted transfer box 502 and a box pressing plate 505, which are suspended above the lower mechanism. The lower mechanism is flush with the conveyor belt, and a carrier box 501 containing components is placed thereon. The flip mechanism is configured as a mechanism that can rotate around a center, and the rotation is controlled by a servo motor 503. As shown Figure 6 and Figure 7 As shown, the positions of the upper and lower mechanisms can be swapped after 180° rotation. The linear vibrator 504 is connected to the upper and lower mechanisms and can drive the upper and lower mechanisms to vibrate slightly.

[0055] First, the upper mechanism and the lower mechanism move toward each other, the transfer box 502 is aligned with the carrier box 501 containing components, and clamped by the box pressing plate 505. The servo motor 503 swaps the positions of the upper and lower mechanisms. After the swap, the upper mechanism and the transfer box 502 are located at the bottom as shown in the figure. Figure 7 As shown, the lower mechanism and the carrier box 501 containing components are located at the top. Then, the linear vibrator 504 is used to vibrate the upper and lower mechanisms so that the components fall into the transfer box 502 below. At this time, the bottom surface of the components is facing upward. Finally, the original carrier box 501 containing components becomes an empty carrier box, and the original transfer box 502 becomes a carrier box containing flipped components. The new carrier box is sent to the next station.

[0056] The bottom surface inspection unit 6 is provided with a second camera, and its structure is the same as that of the top surface inspection unit 1. The second camera is above the conveyor belt, and its lens faces downward. The second camera can photograph components one by one, thereby traversing the bottom surface of each component; or, the second camera can photograph the bottom surfaces of all components in the carrier box at one time. When photographing the bottom surfaces of components one by one, the camera lens and the carrier box will have relative movement, and the lens can be aimed at the bottom surface of one component each time. The image is transmitted to the central processing unit to determine whether there are defects on the bottom surface.

[0057] The reject unit 7 is provided with a suction head for grabbing unqualified components and placing them in a waste box. Then the qualified components continue to stay in the carrier box and leave from the conveyor belt outlet 8. During the entire six-sided appearance inspection process, the components are always arranged in order, avoiding appearance damage caused by stacking and mutual collision during operation.

[0058] According to the above detection device, the box-type six-side appearance inspection method of chip-type electronic components of the present invention has the following specific steps.

[0059] S1: The carrier enters the conveyor belt;

[0060] S2: After passing through the top surface inspection unit, the first camera traverses the top surface of each component or photographs the top surfaces of all components at one time, and the image is transmitted to the central processing unit;

[0061] S3: After passing through the side inspection unit, the multiple suction heads grab the corresponding components and move upward to the height of the multiple side cameras; the multiple side cameras traverse the four sides of each inspected component or shoot the sides of all components at one angle at a time, and the images are transmitted to the central processing unit;

[0062] S4: The component is turned upside down by the turning unit so that the bottom surface of the component faces upward after turning;

[0063] S5: After passing through the bottom surface inspection unit, the second camera traverses the bottom surface of each component or photographs the bottom surfaces of all components at one time, and the image is transmitted to the central processing unit;

[0064] S6: Remove unqualified components;

[0065] S7: The carrier box leaves the conveyor belt.

[0066] Since the side inspection unit includes two independent longitudinal side inspection units and a transverse side inspection unit, step S3 specifically includes the following sub-steps:

[0067] S301: After passing through the longitudinal side inspection unit, a row of longitudinal suction heads grabs the corresponding components and moves upward to the height of the left and right cameras. The left and right cameras traverse the left and right sides of each inspected component or shoot the left and right sides of all components at one time;

[0068] S302: The row of longitudinal suction heads moves downward to put the corresponding components back to their original positions;

[0069] S303: After passing through the lateral inspection unit, a row of lateral suction heads grabs the corresponding components and moves upward to the height of the front and rear cameras. The front and rear cameras traverse the front and rear sides of each inspected component or take pictures of the front and rear sides of all components at one time;

[0070] S304: The row of lateral suction heads moves downward to put the corresponding components back to their original positions.

[0071] In the flipping unit, step S4 specifically includes the following sub-steps:

[0072] S401: the upper mechanism and the lower mechanism move toward each other, and the empty carrier box and the carrier box loaded with components are aligned and clamped;

[0073] S402: The flip mechanism rotates to swap the positions of the upper and lower mechanisms. After the swap, the previous upper mechanism and the empty carrier box are located at the bottom, and the previous lower mechanism and the carrier box with components are located at the top.

[0074] S403: the vibration mechanism vibrates the upper and lower mechanisms, and the components fall into the empty box below;

[0075] S404: The upper mechanism and the lower mechanism move in opposite directions, and the empty carrier box is separated from the carrier box loaded with components.

[0076] Embodiment 2

[0077] The side inspection unit is different from that in the first embodiment, and the other units are the same as those in the first embodiment.

[0078] The multiple suction heads of the side inspection unit are arranged in a row. The number and lateral distribution positions of the suction heads correspond to a row of components arranged vertically in the carrier box. The suction heads can move up and down and rotate around the center at a predetermined angle. The multiple side cameras form a group of front and rear cameras.

[0079] The suction head grabs the corresponding component and moves upward to the height of the front and rear cameras, which face the front and rear sides of the component respectively. The front and rear cameras traverse the front and rear sides of each component to be inspected or take pictures of the front and rear sides of all components at once. Then, the suction head drives the component to rotate 90°. After the rotation, the original left and right sides of the component face the front and rear cameras. The front and rear cameras continue to acquire images of the left and right sides. Then, the suction head drives the component to rotate 90° in the opposite direction to reset the component.

[0080] The suction head moves one row in the longitudinal direction, allowing the suction head queue to pick up the next row of horizontally arranged components for horizontal row-by-row appearance inspection. After all components are photographed, the carrier moves along the conveyor belt to the next station. The image is transmitted to the central processing unit to determine whether there are defects on the left, right, front and rear sides.

[0081] Embodiment 3

[0082] The side inspection unit is different from that in the first embodiment, and the other units are the same as those in the first embodiment.

[0083] The multiple suction heads of the side inspection unit are arranged in a row. The number and longitudinal distribution positions of the suction heads correspond to a row of components arranged longitudinally in the carrier box. The suction heads can move up and down and rotate around the center at a predetermined angle. The multiple side cameras form a group of left and right cameras.

[0084] The suction head grabs the corresponding component and moves upward to the height of the left and right cameras, which face the left and right sides of the component respectively. The left and right cameras traverse the left and right sides of each component to be inspected or take pictures of the left and right sides of all components at once. Then, the suction head drives the component to rotate 90°. After the rotation, the original front and back sides of the component face the left and right cameras. The left and right cameras continue to acquire images of the front and back sides. Then, the suction head drives the component to rotate 90° in the opposite direction to reset the component.

[0085] The carrier box is displaced horizontally by the distance of one row, allowing the suction head queue to pick up the next row of components arranged vertically for a vertical appearance inspection. After all components are photographed, the carrier box moves along the conveyor belt to the next station. The image is transmitted to the central processing unit to determine whether there are defects on the left, right, front and back sides.

[0086] At this point, those skilled in the art should recognize that, although multiple exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications that conform to the principles of the present invention can still be directly determined or derived based on the content disclosed in the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and recognized as covering all these other variations or modifications.

Claims

1. A six-sided appearance inspection device for chip electronic components, characterized in that: Multiple components are loaded into a carrier box, and the inspection device has a conveyor belt for placing and driving the carrier box to move; along the conveyor belt are arranged: A top surface inspection unit is provided with a first camera and is used to inspect the top surface of the component; A side inspection unit is provided with a plurality of suction heads and a plurality of side cameras, wherein the suction heads are used to grab corresponding components and move upward to the height of the plurality of side cameras, and the plurality of side cameras are used to inspect four sides of the components; A flip unit is used to flip the components upside down, so that the bottom of the components face upwards after flipping; A bottom surface inspection unit is provided with a second camera for inspecting the bottom surface of the flipped component; The flipping unit includes an upper mechanism, a lower mechanism, a flipping mechanism and a vibration mechanism. The upper mechanism is provided with an inverted empty carrier box; the lower mechanism is flush with the conveyor belt and is placed with a carrier box containing components; the upper mechanism and the lower mechanism move toward each other, and the empty carrier box is aligned and clamped with the carrier box containing components; the flipping mechanism is used to swap the positions of the upper and lower mechanisms, and after the swap, the previous upper mechanism and the empty carrier box are located at the bottom, and the previous lower mechanism and the carrier box containing components are located at the top; the vibration mechanism is used to vibrate the upper and lower mechanisms so that the components fall into the empty carrier box.

2. The inspection device according to claim 1, characterized in that: The side inspection unit consists of two independent sub-units: A longitudinal side inspection unit is provided with left and right cameras and a row of longitudinal suction heads, wherein the longitudinal suction heads are used to grab corresponding components and move upward to the height of the left and right cameras; The lateral inspection unit is provided with front and rear cameras and a row of lateral suction heads, wherein the lateral suction heads are used to grab corresponding components and move upwards to the height of the front and rear cameras.

3. The inspection device according to claim 1, characterized in that: The multiple suction heads are arranged in a row, and the suction heads can move up and down and rotate around the center by a predetermined angle. The suction heads are also used to drive the components to rotate 90° around the center; the multiple side cameras are a group of left and right cameras or a group of front and rear cameras.

4. A method for inspecting the appearance of a six-sided box of chip electronic components, using the inspection device according to claim 1, characterized in that: The following steps are involved: S1: The carrier enters the conveyor belt; S2: After passing through the top surface inspection unit, the first camera traverses the top surface of each component or photographs the top surfaces of all components at one time, and the image is transmitted to the central processing unit; S3: After passing through the side inspection unit, the multiple suction heads grab the corresponding components and move upward to the height of the multiple side cameras; the multiple side cameras traverse the four sides of each inspected component or shoot the sides of all components at one angle at a time, and the images are transmitted to the central processing unit; S4: The component is turned upside down by the turning unit so that the bottom surface of the component faces upward after turning; S5: After passing through the bottom surface inspection unit, the second camera traverses the bottom surface of each component or photographs the bottom surfaces of all components at one time, and the image is transmitted to the central processing unit; S6: Eliminate unqualified components; S7: The carrier box leaves the conveyor belt.

5. The inspection method according to claim 4, characterized in that: The upper mechanism is provided with an inverted empty carrier box; the lower mechanism is flush with the conveyor belt and is provided with a carrier box containing components. Step S4 specifically includes the following sub-steps: S401: the upper mechanism and the lower mechanism move toward each other, and the empty carrier box and the carrier box loaded with components are aligned and clamped; S402: The flip mechanism rotates to swap the positions of the upper and lower mechanisms. After the swap, the previous upper mechanism and the empty carrier box are located at the bottom, and the previous lower mechanism and the carrier box with components are located at the top. S403: the vibration mechanism vibrates the upper and lower mechanisms, and the components fall into the empty box below; S404: The upper mechanism and the lower mechanism move in opposite directions, and the empty carrier box is separated from the carrier box loaded with components.

Images