A coupling fixture for receiving end of optical device

Abstract

A coupling fixture for receiving end of optical device belongs to the field of optical device packaging technology, including a main structure, a coupling platform main body is provided on the main structure, an ejection module for ejecting a chip is also provided on the main structure, at least two groups of UV lamp modules for pre-curing the chip are also provided in the main structure, a mounting base for mounting the chip is provided in the middle of the coupling platform main body, and a plurality of groups of power-on modules for automatically powering on the chip are evenly arranged along the circumference of the coupling platform main body. The present invention can effectively reduce the poor appearance of chip pins, the ejection module only acts on the chip base, and can offset the friction damping between the chip pins and the mounting seat during the chip withdrawal process, thereby effectively protecting the pre-cured bonding part, significantly reducing the quality problems of the product caused by deformation of the bonding part due to stress, and at the same time, the whole process does not generate force on the chip bonding part, and has high reliability.

Description

Technical Field

[0001] The invention belongs to the technical field of optical device packaging, and relates to a coupling fixture, in particular to a coupling fixture for an optical device receiving end. Background Art

[0002] In the optical device packaging process, the process for connecting the transmitter end is usually glue bonding. Due to various errors, the PT end must be coupled to the light to meet the process requirements. The general process steps are: coupling, glue dispensing, pre-curing, and reinforcement. The coupling fixture here will cover the three steps of coupling, glue dispensing, and pre-curing. The existing industry practice is usually to install the chip 1 on a special plastic power-on seat 2 and connect it to the circuit board 3 through the claw 4. Some solutions will cancel the circuit board 3 and connect it directly to the board. The claw 4 is generally made of copper alloy, which has a certain degree of elasticity and can provide a relatively stable clamping force. The entire coupling fixture only provides chip installation, and the clamping is completed by the claw. After the coupling is completed, glue is dispensed around the chip 1. After irradiating the UV lamp for a certain period of time, the product and the chip are bonded by ultraviolet glue, and the chip 1 is taken away from the power-on seat 2 together, and then enters the next process, such as Figure 1 shown.

[0003] The traditional solution is effective for conventional products (communication rate 2.5G), with low cost and relatively good stability, so it is widely used. However, with the continuous advancement of technology, conventional products are gradually replaced by higher-end products such as 10G and 25G. High-end products are more sensitive to position. When the chip exits the claw 4 with the product, there will inevitably be pulling resistance, and the unbalanced force will cause the product to fail. In response to this phenomenon, the industry currently has other solutions, such as replacing the claw 4 with a detachable ejector pin to eliminate the force on the chip caused by the power-on structure. However, in actual use, there will still be a certain amount of pulling resistance due to various factors such as the power-on seat and the bending of the chip pins. To solve this phenomenon, this design adopts an automatic power-on and automatic withdrawal solution. The withdrawal mechanism only exerts force on the chip base, eliminating all known factors that will cause pulling resistance to the chip, greatly reducing the adverse phenomena caused by pulling resistance. Summary of the invention

[0004] In view of the shortcomings of the prior art described above, an object of the present invention is to provide a coupling fixture for the receiving end of an optical device, which is used to solve the technical problem in the prior art that the chip is subjected to uneven force due to the existence of pulling resistance when the chip is withdrawn during the coupling process of the optical device, resulting in product NG.

[0005] To achieve the above-mentioned purpose and other related purposes, the present invention provides a coupling fixture for an optical device receiving end, comprising a main structure, a coupling platform main body is provided on the main structure, an ejection module for ejecting a chip is also provided on the main structure, at least two groups of UV lamp modules are also provided in the main structure, a mounting base for mounting a chip is provided in the middle of the coupling platform main body, and a plurality of groups of evenly arranged power-on modules are provided on the coupling platform main body along the circumference of the coupling platform main body.

[0006] Preferably, the main structure includes a bottom plate, a support platform is fixed on the bottom plate, a first mounting opening is provided on a side wall of the support platform, at least two second mounting openings penetrating the support platform and the coupling platform main body are provided on the side walls of the support platform and the coupling platform main body, a plurality of third mounting openings are evenly provided on the side walls of the coupling platform main body, a cover plate is provided on the top of the coupling platform main body, a chip coupling opening is provided in the middle of the cover plate, and the center of the mounting base is in the same straight line as the midline of the chip coupling opening.

[0007] Preferably, the mounting base includes a push plate mounting seat, which is fixed to the bottom plate, and is connected to a push plate that can move up and down along the height direction of the push plate mounting seat. A mounting seat is installed on the top of the push plate, and an insulating power-adding seat for placing the chip is connected to the center of the mounting seat. A positioning seat is provided in the center of the coupling platform body, and the lower end of the insulating power-adding seat passes through the center of the positioning seat and extends into the positioning seat, and the insulating power-adding seat is pressed onto the positioning seat by a pressing sheet.

[0008] Preferably, the push plate mounting seat is connected to the push plate via a pair of linear guide rails, two spring supports are symmetrically mounted on the push plate mounting seat, a spring is connected to the spring support, and the other end of the spring is connected to the bottom of the push plate.

[0009] Preferably, the UV lamp module includes a connecting rod, which is connected to the mounting base through a pin and is arranged in the second mounting port, the connecting rod is connected to a rotating base, a rotating seat is hinged on the rotating base, a UV lamp is connected to the rotating seat through an axial hole, the end of the UV lamp is located above the mounting base, and the connecting rod and the pin, and the UV lamp and the rotating seat are fixed by top screws.

[0010] Preferably, the ejection module includes a first cylinder, which is fixed in the first mounting port through a first cylinder seat, and is connected to a first air pipe joint. The output shaft of the first cylinder is connected to a connecting rod, and a section of shaft diameter change is provided in the middle of the connecting rod. A rolling shaft in contact with the connecting rod is provided above the shaft diameter change section of the connecting rod, and the rolling shaft is connected to a swing base through a rocker arm, and the swing base is fixed to a bottom plate, and the rolling shaft is in contact with the center of the lower surface of the push plate.

[0011] Preferably, the connecting rod includes a first cylindrical section, a second cylindrical section, a conical section and a third cylindrical section which are connected to each other, the diameters of the first cylindrical section and the third cylindrical section are equal, the diameter of the second cylindrical section is larger than the diameter of the first cylindrical section, the maximum diameter of the conical section is larger than the diameter of the second cylindrical section, the minimum diameter of the conical section is equal to the diameter of the third cylindrical section, and the rolling shaft is arranged on the conical section.

[0012] Preferably, the first cylindrical section and the third cylindrical section of the connecting rod are respectively provided with a first linear bearing and a second linear bearing, and the first linear bearing and the second linear bearing are both arranged on the bottom plate.

[0013] Preferably, the positioning seat is provided with a plurality of power-on holes extending horizontally through its side wall along its circumference, the power-on assembly comprises a second cylinder, the second cylinder is fixed in the third mounting port through a second cylinder seat, the second cylinder is connected with a second air pipe joint, the output shaft of the second cylinder is connected with an adapter through a thimble, the adapter is connected with an ejector pin through a first insulating member and a second insulating member, and the second insulating member is provided with an ejector pin wiring port.

[0014] Preferably, a ceramic ring is provided between the ejector pin and the inner wall of the electrification hole.

[0015] As described above, the optical device receiving end coupling fixture of the present invention has the following beneficial effects:

[0016] 1. In the present invention, the cylinder controls the power supply of the ejector pin, which can effectively reduce the poor appearance of the chip pins. The ejection module only acts on the chip base and does not act on other parts. At the same time, the friction damping between the chip pins and the mounting seat can be offset during the chip withdrawal process. Therefore, the pre-cured bonding area is effectively protected, and the quality problems of the product caused by the deformation of the bonding area due to stress are significantly reduced.

[0017] 2. In the present invention, the entire process does not generate any force on the chip bonding part, and there is no artificial factor except for loading and unloading. The reliability is high and the defect rate is greatly reduced compared with the original technology.

[0018] 3. In the present invention, the ejection module, UV lamp module and power-on module are integrated into one, with a compact structure, small size and high space utilization. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 Shown is a schematic diagram of a coupling fixture in the prior art.

[0020] Figure 2 Shown is a perspective view of the coupling fixture of the present invention.

[0021] Figure 3 The figure shows a three-dimensional view of the coupling fixture of the present invention after the cover plate is removed.

[0022] Figure 4 Shown is a top view of the coupling fixture of the present invention.

[0023] Figure 5 Shown is a cross-sectional view of the UV lamp module surface in the present invention.

[0024] Figure 6 Shown is a cross-sectional view of the ejector module surface in the present invention.

[0025] Figure 7 Shown is a schematic structural diagram of the power-on module of the present invention.

[0026] Figure 8 Shown is a schematic structural diagram of the connecting rod in the present invention.

[0027] Component number description

[0028] 1-main structure, 11-bottom plate, 12-support platform, 13-first mounting port, 2-coupling platform body, 21-cover plate, 22-second mounting port, 23-third mounting port, 24-chip coupling port, 3-UV lamp module, 31-UV lamp, 32-rotating seat, 33-pin, 34-rotating base, 35-connecting rod, 4-ejection module, 41-first cylinder, 42-connecting rod, 421-first cylindrical section, 422-second cylindrical section, 423-conical section, 424-third cylindrical section, 43-first cylinder seat, 44-first linear bearing, 45- The first air pipe joint, 46-rolling axis, 47-second linear bearing, 48-swing base, 49-rocker, 5-power-on module, 51-second air pipe joint, 52-second cylinder, 53-second cylinder seat, 54-adapter, 55-first insulating member, 56-second insulating member, 57-thimble, 58-thimble wiring port, 6-mounting base, 61-pressing sheet, 62-insulating power-on seat, 63-positioning seat, 631-power-on hole, 64-mounting seat, 65-linear guide, 66-push plate, 67-spring, 68-spring support, 69-push plate mounting seat. DETAILED DESCRIPTION

[0029] The following is a description of the implementation of the present invention by means of specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0030] See also Figures 2 to 8. It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings in this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention, so they have no substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size should still fall within the scope of the technical content disclosed by the present invention without affecting the effects and purposes that can be achieved by the present invention. At the same time, the terms such as "upper", "lower", "left", "right", "middle" and "one" quoted in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of the present invention. Changes or adjustments in their relative relationships should also be regarded as the scope of the implementation of the present invention without substantially changing the technical content.

[0031] See also Figure 2-8 The present invention provides a coupling fixture for an optical device receiving end, comprising a main structure 1, a coupling platform main body 2 is provided on the main structure 1, an ejection module 4 for ejecting a chip is also provided on the main structure 1, at least two groups of UV lamp modules 3 are also provided in the main structure 1, a mounting base 6 for mounting a chip is provided in the middle of the coupling platform main body 2, and a plurality of groups of evenly arranged power-on modules 5 are provided on the coupling platform main body 2 along the circumference of the coupling platform main body 2.

[0032] When this embodiment is used, the main structure 1 is used to provide installation and positioning of the clamp, and the coupling platform body 2 provides installation of the power-on module 5 and the mounting base 6. The UV lamp module 3 mainly realizes the positioning and adjustment of the UV lamp 31, and realizes the pre-curing of the chip after dispensing. The ejection module 4 provides the ejection action of the chip, so that the ejection force only acts on the chip base when the chip is ejected, and does not act on other parts. At the same time, during the chip withdrawal process, the friction damping between the chip pins and the mounting seat 64 can be offset. Therefore, the pre-cured bonding parts are effectively protected, and the quality problems of the product caused by the deformation of the bonding parts due to stress are significantly reduced. The power-on module 5 realizes the effect of automatic power-on, which effectively reduces the poor appearance of the chip pins.

[0033] In this embodiment, two groups of UV lamp modules 3 are symmetrically arranged in the main structure 1 along the vertical center line of the main structure 1. The symmetrical arrangement of the two groups of UV lamp modules 3 can ensure the uniformity and comprehensiveness of chip pre-curing, thereby ensuring the chip coupling quality. The number of UV lamp modules 3 is not limited to two groups, and can be increased or decreased accordingly according to actual use requirements. The position of the UV lamp module 3 is not limited to the symmetrical arrangement about the vertical center line of the main structure 1, as long as the chip can be pre-cured uniformly and comprehensively.

[0034] In this embodiment, the ejection module 4, the UV lamp module 3 and the power-on module 5 are integrated into one, with a compact structure, a small volume and a high space utilization rate.

[0035] As a further description of the above embodiment, the main structure 1 includes a bottom plate 11, a support platform 12 is fixed on the bottom plate 11, a first mounting opening 13 is provided on the side wall of the support platform 12, at least two second mounting openings 22 penetrating the support platform 12 and the coupling platform body 2 are provided on the side walls, a plurality of third mounting openings 23 are evenly provided on the side walls of the coupling platform body 2, a cover plate 21 is provided on the top of the coupling platform body 2, a chip coupling opening 24 is provided in the middle of the cover plate 21, and the center of the mounting base 6 is on the same straight line as the midline of the chip coupling opening 24.

[0036] When this embodiment is used, the bottom plate 11 is provided with mounting holes at the four corners of the bottom plate 11, and the connecting screws are passed through the mounting holes to fix the coupling fixture on the workbench to couple the receiving end of the optical device. The entire device is easy to install and disassemble, easy to move, and has a wide range of applications. A support platform 12 is welded or integrally formed on the bottom plate 11, and a coupling platform body 2 is arranged above the support platform 12.

[0037] The side wall of the support platform 12 is provided with a first installation opening 13 for installing the ejection module 4. The size of the first installation opening 13 can be adjusted accordingly according to actual use requirements. When the height of the first installation opening 13 is not enough, it can be opened downward on the bottom plate 11.

[0038] The second mounting openings 22 are used to mount the UV lamp modules 3, and the number of the second mounting openings 22 is equal to the number of the UV lamp modules 3. The second mounting openings 22 are connected and opened on the support platform 12 and the coupling platform body 2 to provide a larger range of movement for the UV lamp 31, thereby facilitating the adjustment of the UV lamp 31 and achieving a better pre-curing effect.

[0039] The third mounting port 23 is used to install the power-on module 5. The number of the third mounting ports 23 is the same as the number of the power-on modules 5. The third mounting port 23 is opened on the side wall of the coupling platform body 2 to realize that the power-on module 5 and the insulating power-on seat 62 are at the same height, thereby realizing direct power-on of the insulating power-on seat 62, which is convenient for automatic power-on.

[0040] A circular opening is provided at the center of the chip coupling port 24, and the circular opening is provided to facilitate chip installation, gluing and ejection. Both ends of the circular opening of the chip coupling port 24 are connected with long strip movable openings, and the provision of the long strip movable openings can facilitate the position adjustment of the UV lamp 31, thereby achieving a better pre-curing effect.

[0041] As a further description of the above embodiment, the mounting base 6 includes a push plate mounting seat 69, which is fixed on the bottom plate 11, and is connected to a push plate 66 that can move up and down along the height direction of the push plate mounting seat 69. A mounting seat 64 is installed on the top of the push plate 66, and an insulating power-adding seat 62 for placing a chip is connected to the center of the mounting seat 64. A positioning seat 63 is provided in the center of the coupling platform body 2, and the lower end of the insulating power-adding seat 62 passes through the center of the positioning seat 63 and extends into the positioning seat 63, and the insulating power-adding seat 62 is pressed against the positioning seat 63 by a pressing sheet 61.

[0042] When this embodiment is used, the mounting base 6 provides chip mounting and powering, the chip is placed on the insulating powering seat 62, the pins of the chip are separated by the insulating powering seat 62, and the positioning of the chip is completed by the cooperation between the concave platform of the mounting seat 64 and the outer edge of the chip. The insulating powering seat 62 is pressed against the positioning seat 63 by the pressing sheet 61. When the push plate 66 moves up and down, the mounting seat 64 connected to the push plate 66 is driven to move up and down, thereby realizing the ejection and withdrawal of the chip.

[0043] As a further description of the above embodiment, the push plate mounting seat 69 is connected to the push plate 66 via a pair of linear guide rails 65, and two spring supports 68 are symmetrically mounted on the push plate mounting seat 69, and a spring 67 is connected to the spring support 68, and the other end of the spring 67 is connected to the bottom of the push plate 66.

[0044] When this embodiment is used, the arrangement of the linear guide 65 can realize the connection between the push plate 66 and the push plate mounting seat 69 on the one hand, and can realize the push plate 66 to move up and down on the push plate mounting seat 69 along the direction of the linear guide 65 on the other hand, so as to ensure the stability of the movement of the push plate 66 and prevent the push plate 66 from deflecting during the movement, thereby ensuring the stability of chip ejection and withdrawal and ensuring the chip coupling quality. The arrangement of the spring 67 between the push plate mounting seat 69 and the push plate 66 can provide the force for the push plate 66 to return to the initial state. After the push plate 66 ejects the chip, the force acting on the push plate 66 is removed, and the elastic force generated in the process of the spring 67 returning to its original state drives the push plate 66 to move downward, so that the push plate 66 can automatically return to the initial state.

[0045] In this embodiment, the push plate 66 is an H-shaped plate, and the two vertical ends of the H-shaped push plate 66 are respectively located in the two linear guide rails 65, and the top of the H-shaped push plate 66 is connected through the mounting seat 64. The shape of the push plate 66 is not limited to the H-shaped plate, and other shapes that can meet the requirements are all acceptable, and can be selected accordingly according to actual use requirements.

[0046] In this embodiment, the connection method between the push plate mounting seat 69 and the push plate 66 is not limited to the use of a pair of linear guide rails 65 for connection, and other connection structures that can ensure stable connection between the two and ensure that the push plate 66 can only move along the height direction of the push plate mounting seat 69 are all acceptable. For example, vertical blocks (not shown in the figure) are connected to both side walls of the push plate mounting seat 69, and the ends of the vertical blocks are connected to horizontal blocks (not shown in the figure) parallel to the push plate mounting seat 69. The push plate mounting seat 69, the vertical blocks and the horizontal blocks are integrally formed to form a push plate slot (not shown in the figure), and the two sides of the push plate 66 are respectively clamped in the push plate slot.

[0047] As a further description of the above embodiment, the UV lamp module 3 includes a connecting rod 35, which is connected to the mounting base 6 through a pin 33 and is arranged in the second mounting port 22. The connecting rod 35 is connected to a rotating base 34, and a rotating seat 32 is hinged on the rotating base 34. The rotating seat 32 is connected to a UV lamp 31 through an axial hole. The end of the UV lamp 31 is located above the mounting base 6. The connecting rod 35 and the pin 33, and the UV lamp 31 and the rotating seat 32 are fixed by top screws.

[0048] When this embodiment is used, the UV lamp module 3 is used in pairs. The UV lamp 31 is connected to the rotating seat 32 through the shaft hole, and the rotating seat 32 is hinged on the rotating base 34. Therefore, the swing angle of the UV lamp 31 can be adjusted by rotating the rotating seat 32, thereby adjusting the irradiation angle of the UV lamp 31 to the chip, achieving a better pre-curing effect and improving the pre-curing quality. The UV lamp 31 is fixed to the rotating seat 32 by a top screw, and the axial distance of the UV lamp 31 can be adjusted by the top screw, thereby adjusting the distance between the UV lamp 31 and the chip to achieve a better effect. The rotating base 34 is fixedly mounted on the connecting rod 35, and the connecting rod 35 is fixed to the bottom plate 11 by a pin 33, and the connecting rod 35 and the pin 33 are fixed by a top screw. Therefore, the Z-direction position of the UV lamp 31 can be adjusted by adjusting the height of the connecting rod 35. Therefore, this embodiment can realize the adjustment of the irradiation angle and irradiation distance of the UV lamp 31, thereby meeting the irradiation requirements when coupling different chips, improving the coupling quality, and expanding the scope of application.

[0049] In this embodiment, the structure for adjusting the irradiation angle of the UV lamp 31 is not limited to using the rotating seat 32 hinged on the rotating base 34, and other structures that can adjust the irradiation angle of the UV lamp 31 are all acceptable. For example, a first gear (not shown in the figure) that can rotate on the first rotating base 34 is connected to the rotating base 34, and a second gear (not shown in the figure) that meshes with the first gear is set on the rotating seat 32, and the second gear is fixed to the support platform 12 through a rotating shaft. When the irradiation angle of the UV lamp 31 needs to be adjusted, the UV lamp 31 is rotated, and the first gear drives the second gear to rotate; when the UV lamp 31 is not rotated, the second gear plays a positioning role for the first gear to ensure the stability of the UV lamp 31.

[0050] As a further description of the above embodiment, the ejection module 4 includes a first cylinder 41, which is fixed in the first mounting port 13 through a first cylinder seat 43, and a first air pipe joint 45 is connected to the first cylinder 41. The output shaft of the first cylinder 41 is connected to a connecting rod 42, and there is a section of axial diameter change in the middle of the connecting rod 42. A rolling shaft 46 in contact with the connecting rod 42 is provided above the axial diameter change section of the connecting rod 42, and the rolling shaft 46 is connected to a swing base 48 through a rocker rod 49. The swing base 48 is fixed on the bottom plate 11, and the rolling shaft 46 is in contact with the center of the lower surface of the push plate 66.

[0051] When this embodiment is used, the power source of the ejection module 4 is the first cylinder 41, which provides reciprocating thrust. The connecting rod 42 is connected to the output shaft of the first cylinder 41 by a thread. When the chip needs to be ejected, the first cylinder 41 drives the connecting rod 42 to move in a direction away from the first cylinder 41. During the movement of the connecting rod 42, the rolling shaft 46 above the axial diameter change section of the connecting rod 42 is driven to rotate upward around the swing base 48 through the swing rod 49. During the upward rotation of the rolling shaft 46, the push plate 66 in contact with the rolling shaft 46 is driven to move upward, thereby ejecting the chip. When the first cylinder 41 drives the connecting rod 42 to move in a direction close to the first cylinder 41, the rolling shaft 46 rotates downward and separates from the push plate 66, and the push plate 66 returns to its original position under the action of its own gravity and the elastic force of the spring 67. Therefore, the rolling shaft 46 can realize stable up and down reciprocating motion with the change of the axial diameter of the connecting rod 42, thereby driving the push plate 66 and the mounting seat 64 installed on the push plate 66 to move up and down, thereby realizing the ejection and withdrawal of the chip.

[0052] In this embodiment, the first cylinder 41 is fixed in the first mounting port 13 via a first cylinder seat 43 , and the portion of the first cylinder 41 outside the support platform 12 is connected to a first air pipe joint 45 , and is connected to an air source via the first air pipe joint 45 .

[0053] As a further description of the above embodiment, the connecting rod 42 includes a first cylindrical segment 421, a second cylindrical segment 422, a conical segment 423 and a third cylindrical segment 424 which are connected to each other, the diameters of the first cylindrical segment 421 and the third cylindrical segment 424 are equal, the diameter of the second cylindrical segment 422 is larger than the diameter of the first cylindrical segment 421, the maximum diameter of the conical segment 423 is larger than the diameter of the second cylindrical segment 422, the minimum diameter of the conical segment 423 is equal to the diameter of the third cylindrical segment 424, and the rolling shaft 46 is arranged on the conical segment 423.

[0054] When this embodiment is used, the setting of the tapered section 423 can facilitate the rolling shaft 46 on the connecting rod 42 to rotate up and down along the tapered section 423 when the connecting rod 42 moves in the horizontal direction, thereby realizing the ejection and retraction of the chip.

[0055] In this embodiment, the change in the shaft diameter on the connecting rod 42 is not limited to first increasing and then decreasing. Other shaft diameter changes that can drive the rolling shaft 46 on the connecting rod 42 to rotate up and down during the horizontal movement of the connecting rod 42 are also possible.

[0056] As a further description of the above embodiment, a first linear bearing 44 and a second linear bearing 47 are respectively disposed on the first cylindrical section 421 and the third cylindrical section 424 of the connecting rod 42 , and the first linear bearing 44 and the second linear bearing 47 are both disposed on the base plate 11 .

[0057] When the present embodiment is used, in order to ensure that the connecting rod 42 can achieve stable linear reciprocating motion, a first linear bearing 44 and a second linear bearing 47 are respectively provided at both ends of the connecting rod 42 in the present embodiment.

[0058] In this embodiment, the number of linear bearings can be increased or decreased according to demand. For example, only one linear bearing can be provided at the end of the third cylindrical segment 424 .

[0059] As a further description of the above embodiment, the positioning seat 63 is provided with a plurality of power-on holes 631 penetrating the side wall in the horizontal direction along its circumference, and the power-on module 5 includes a second cylinder 52, which is fixed in the third mounting port 23 through a second cylinder seat 53, and a second air pipe joint 51 is connected to the second cylinder 52, and an output shaft of the second cylinder 52 is connected to an adapter 54 through a top screw, and a top pin 57 is connected to the adapter 54 through a first insulating member 55 and a second insulating member 56, and a top pin wiring port 58 is provided on the second insulating member 56.

[0060] When this embodiment is used, the power-on module 5 is powered by the second cylinder 52, and the second air pipe joint 51 is connected to the second cylinder 52. The first insulating member 55 and the second insulating member 56 provide installation and positioning for the ejector pin 57, and the second insulating member 56 is provided with an ejector pin connection port 58 for connecting the ejector pin 57. When the chip needs to be powered, the second cylinder 52 is started, and the second cylinder 52 drives the adapter 54 to move away from the second cylinder 52, thereby driving the ejector pin 57 to contact the pin to achieve power-on. When the ejector pin 57 is retracted with the movement of the second cylinder 52, the top of the ejector pin 57 leaves the pin, and the power is cut off. In this embodiment, the method of controlling the power-on of the ejector pin 57 by the second cylinder 52 can effectively reduce the poor appearance of the chip pin.

[0061] In this embodiment, the ejector pin 57 is made of brass.

[0062] In this embodiment, a ceramic ring is provided between the ejector pin 57 and the inner wall of the electrification hole 631 for insulation, thereby ensuring the safety of the operation.

[0063] The working process of the coupling fixture in the present invention includes the following steps:

[0064] 1. The chip is loaded onto the insulating power-on seat 62, and the power-on module 5 is started to work, and the chip is powered on;

[0065] 2. Glue the chip and adjust the UV lamp module 3 to irradiate with UV lamp 31;

[0066] 3. The power module 5 is withdrawn and the chip is powered off;

[0067] 4. The first cylinder 41 works, driving the connecting rod 42 to move away from the first cylinder 41. The movement of the connecting rod 42 drives the swing rod 49 and the rolling shaft 46 to rotate upward;

[0068] 5. The rolling shaft 46 rotates upward to drive the push plate 66 and the mounting seat 64 mounted on the push plate 66 to move upward, so that the chip is ejected;

[0069] 6. The first cylinder 41 works to drive the connecting rod 42 to withdraw. Under the action of the spring 67 and gravity, the mounting seat 64 returns to its original position. When the chip is inserted, the pins are close to the position of the pins, and the friction force on the pins is the largest. The role of ejection is to make the chip leave this area. After the mounting seat 64 withdraws, the chip will withdraw a short distance, but will not fall back to its original position due to the friction and gravity. At this time, the bottom of the chip has been exposed to the mounting position and the ejection action is maintained;

[0070] 7. Use tweezers to remove the chip.

[0071] The entire process does not generate any force on the chip bonding parts, and is not affected by any human factors except for loading and unloading. It has high reliability and greatly reduces the defective rate compared to the original technology.

[0072] In summary, the present invention can effectively reduce the poor appearance of the chip pins by controlling the power supply of the ejector pins through the cylinder. The ejection module only acts on the chip base and does not act on other parts. At the same time, the friction damping between the chip pins and the mounting seat can be offset during the chip withdrawal process. Therefore, the pre-cured bonding parts are effectively protected, and the quality problems of the product caused by the deformation of the bonding parts due to stress are significantly reduced. At the same time, the whole process does not generate force on the chip bonding parts, and there is no artificial factor except for loading and unloading. The reliability is high, and the defect rate is greatly reduced compared with the original technology. Therefore, the present invention effectively overcomes the various shortcomings of the prior art and has a high industrial utilization value.

[0073] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A coupling fixture for receiving end of an optical device, comprising a main structure (1), on which a coupling platform main body (2) is arranged, characterized in that: An ejection module (4) for ejecting a chip is provided in the main structure (1), at least two groups of UV lamp modules (3) are also provided in the main structure (1), a mounting base (6) for mounting a chip is provided in the middle of the coupling platform body (2), and a plurality of groups of power-on modules (5) are evenly arranged on the coupling platform body (2) along the circumference of the coupling platform body (2); The main structure (1) comprises a bottom plate (11), a support platform (12) is fixed on the bottom plate (11), a first mounting opening (13) is provided on the side wall of the support platform (12), at least two second mounting openings (22) penetrating the support platform (12) and the coupling platform body (2) are provided on the side walls of the support platform (12) and the coupling platform body (2), a plurality of third mounting openings (23) are evenly provided on the side wall of the coupling platform body (2), a cover plate (21) is provided on the top of the coupling platform body (2), a chip coupling opening (24) is provided in the middle of the cover plate (21), and the center of the mounting base (6) and the midline of the chip coupling opening (24) are on the same straight line; The mounting base (6) comprises a push plate mounting seat (69), the push plate mounting seat (69) is fixed on the bottom plate (11), a push plate (66) is connected to the push plate mounting seat (69) and can move up and down along the height direction of the push plate mounting seat (69), a mounting seat (64) is installed on the top of the push plate (66), the center of the mounting seat (64) is connected to an insulating charging seat (62) for placing a chip, a positioning seat (63) is provided at the center of the coupling platform body (2), the lower end of the insulating charging seat (62) passes through the center of the positioning seat (63) and extends into the positioning seat (63), and the insulating charging seat (62) is pressed against the positioning seat (63) by a pressing sheet (61); The UV lamp module (3) comprises a connecting rod (35), the connecting rod (35) being connected to the mounting base (6) via a pin (33) and the connecting rod (35) being arranged in the second mounting opening (22), the connecting rod (35) being connected to a rotating base (34), the rotating base (34) being hinged with a rotating seat (32), the rotating seat (32) being connected to a UV lamp (31) via an axial hole, and the end of the UV lamp (31) being located above the mounting base (6).

2. The optical device receiving end coupling fixture according to claim 1, characterized in that: The push plate mounting seat (69) is connected to the push plate (66) via a pair of linear guide rails (65). Two spring supports (68) are symmetrically mounted on the push plate mounting seat (69). A spring (67) is connected to the spring support (68). The other end of the spring (67) is connected to the bottom of the push plate (66).

3. The optical device receiving end coupling fixture according to claim 1, characterized in that: The ejection module (4) comprises a first cylinder (41), the first cylinder (41) is fixed in the first mounting port (13), the output shaft of the first cylinder (41) is connected to a connecting rod (42), the middle part of the connecting rod (42) has a section of shaft diameter change, a rolling shaft (46) in contact with the connecting rod (42) is provided above the shaft diameter change section of the connecting rod (42), the rolling shaft (46) is connected to a swing base (48) through a swing rod (49), the swing base (48) is fixed on the bottom plate (11), and the rolling shaft (46) is in contact with the center of the lower surface of the push plate (66).

4. The optical device receiving end coupling fixture according to claim 3, characterized in that: The connecting rod (42) includes a first cylindrical section (421), a second cylindrical section (422), a conical section (423) and a third cylindrical section (424) which are connected to each other. The diameters of the first cylindrical section (421) and the third cylindrical section (424) are equal, the diameter of the second cylindrical section (422) is larger than the diameter of the first cylindrical section (421), the maximum diameter of the conical section (423) is larger than the diameter of the second cylindrical section (422), the minimum diameter of the conical section (423) is equal to the diameter of the third cylindrical section (424), and the rolling shaft (46) is arranged on the conical section (423).

5. The optical device receiving end coupling fixture according to claim 4, characterized in that: A first linear bearing (44) and a second linear bearing (47) are respectively provided on the first cylindrical section (421) and the third cylindrical section (424) of the connecting rod (42).

6. The optical device receiving end coupling fixture according to claim 1, characterized in that: The positioning seat (63) is provided with a plurality of power-on holes (631) penetrating the side wall in the horizontal direction along its circumference. The power-on module (5) comprises a second cylinder (52). The second cylinder (52) is fixed in the third mounting port (23). The output shaft of the second cylinder (52) is connected to an adapter (54) via a thimble. The adapter (54) is connected to an ejector pin (57) via a first insulating member (55) and a second insulating member (56). The second insulating member (56) is provided with an ejector pin connection port (58).

7. The optical device receiving end coupling fixture according to claim 6, characterized in that: A ceramic ring is provided between the ejector pin (57) and the inner wall of the electrification hole (631).

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