A scattering film and an electronic device

Abstract

The present invention discloses a scattering film and an electronic device. The scattering film comprises a scattering layer, an impedance gradient layer and a protective layer stacked in sequence along a stacking direction. The scattering layer is provided with a scattering structure through which electromagnetic waves can pass, so that the electromagnetic waves can be dispersed around after passing through the scattering structure, thereby increasing the spatial range of electromagnetic wave emission, thereby realizing the divergence function of electromagnetic waves and avoiding communication blind spots as much as possible. By arranging an impedance gradient layer between the scattering layer and the protective layer, the impedance of the impedance gradient layer along the stacking direction gradually changes from the impedance of the scattering structure to the impedance of the protective layer, eliminating the impedance mutation at the interface between the scattering structure and the protective layer, reducing the energy loss in the process of electromagnetic waves passing through the scattering film, and improving the signal propagation distance and the quality of the transmission signal.

Description

Technical Field

[0001] The present invention relates to the technical field of communication equipment, and in particular to a scattering film and electronic equipment. Background Art

[0002] Electromagnetic wave communication is the communication using electromagnetic waves with wavelengths between 0.1 mm and 1 m. The frequency range corresponding to this wavelength band is 300 MHz (0.3 GHz) - 3 THz. Unlike modern communication network transmission methods such as coaxial cable communication, optical fiber communication and satellite communication, electromagnetic wave communication is the communication directly using electromagnetic waves as the medium. It does not require solid media and can be transmitted using electromagnetic waves when there is no obstacle in the straight line distance between the transmitter and the receiver.

[0003] During the transmission of electromagnetic waves, energy loss directly affects the distance of signal propagation and the quality of the transmitted signal. When electromagnetic waves pass through the same medium, there is basically no energy loss; however, when electromagnetic waves pass through the interface of different media, partial reflection will occur. Due to the reflection of part of the electromagnetic wave, the electromagnetic energy along the propagation direction will be lost accordingly, which seriously affects the distance of signal propagation and the quality of the transmitted signal. Summary of the invention

[0004] One purpose of an embodiment of the present invention is to provide a scattering film, which, on the one hand, can increase the spatial range of electromagnetic wave emission and avoid communication blind spots as much as possible; on the other hand, can reduce the energy loss of electromagnetic waves passing through the scattering film and increase the signal propagation distance and the quality of the transmitted signal.

[0005] Another object of an embodiment of the present invention is to provide an electronic device having a large electromagnetic wave emission spatial range, a long signal propagation distance and good signal quality.

[0006] In a first aspect, an embodiment of the present invention provides a scattering film, the scattering film comprising a scattering layer, an impedance gradient layer and a protective layer stacked in sequence along a stacking direction;

[0007] The scattering layer is provided with a scattering structure through which electromagnetic waves can pass, so that the electromagnetic waves are scattered around after passing through the scattering structure;

[0008] The impedance of the scattering structure is a first impedance value, the impedance of the protection layer is a second impedance value, and the impedance of the impedance gradient layer gradually changes from the first impedance value to the second impedance value along the stacking direction.

[0009] Optionally, the impedance gradient layer includes n sub-layers, namely the first sub-layer to the nth sub-layer stacked in sequence along the stacking direction. The impedance of the first sub-layer in contact with the scattering layer is a first impedance value, and the impedance of the nth sub-layer in contact with the protective layer is a second impedance value. The impedance of the first sub-layer to the nth sub-layer gradually changes along the stacking direction, where n≥3.

[0010] Optionally, each of the sub-layers is made of a different base material, and the impedance of each of the base materials gradually changes along the stacking direction.

[0011] Optionally, each of the sub-layers is made of the same base material, and a plurality of first through-holes penetrating the sub-layer are formed on each of the sub-layers. The volumes of the first through-holes on the same sub-layer are the same, and the volumes and / or the numbers of the first through-holes on different sub-layers are different, so that the impedance of the first sub-layer to the nth sub-layer gradually changes along the stacking direction.

[0012] Optionally, the volumes of the first through-holes on each sub-layer are the same, and the numbers of the first through-holes on different sub-layers gradually decrease along the stacking direction.

[0013] Optionally, the numbers of the first through-holes formed on each of the sub-layers are equal, the volumes of the first through-holes on the same sub-layer are the same, and the volumes of the first through-holes on different sub-layers gradually decrease along the stacking direction.

[0014] Optionally, each sub-layer is made of the same base material, first through-holes penetrating the sub-layer are formed on each sub-layer, the volumes of the first through-holes are the same, and the numbers of the first through-holes formed on each sub-layer are equal;

[0015] The first through-holes are filled with a first dielectric material. The dielectric constants of the first dielectric materials filled in the first through-holes on the same sub-layer are the same, and the dielectric constants of the first dielectric materials filled in the first through-holes on different sub-layers gradually increase along the stacking direction.

[0016] Optionally, a plurality of second through-holes penetrating the scattering layer are formed on the scattering layer. The second through-holes allow electromagnetic waves to pass through. The second through-holes are filled with a second dielectric material, and the aperture of the second through-holes is smaller than the wavelength of the electromagnetic waves.

[0017] Optionally, the number and / or the aperture of the second through-holes show a continuous change trend in at least one preset direction, and the preset direction is any direction within the surface of the scattering layer.

[0018] Optionally, the scattering layer is provided with a plurality of second through holes penetrating the scattering layer, and the second through holes are filled with a second dielectric material. In at least one preset direction, the refractive index of the second dielectric material to the incident electromagnetic wave presents a variation trend of being small in the middle and large on both sides, and the preset direction is any direction within the surface of the scattering layer.

[0019] Optionally, the scattering film further includes a first protruding structure, which is disposed on a side of the impedance gradient layer away from the scattering layer, and extends into the protective layer. When electromagnetic waves pass through the first protruding structure, reflection occurs.

[0020] Optionally, the first protrusion structure includes a plurality of protrusions, and a distance between adjacent protrusions is smaller than a wavelength of the electromagnetic wave.

[0021] Optionally, the scattering film further includes a connecting layer, and the connecting layer is arranged on a side of the scattering layer away from the impedance gradient layer.

[0022] Optionally, the scattering film further includes a second protruding structure, wherein the second protruding structure is disposed on a side of the scattering layer away from the impedance gradient layer, and the second protruding structure extends into the connecting layer.

[0023] Optionally, the material of the second protrusion structure is the same as that of the scattering layer.

[0024] In a second aspect, an embodiment of the present invention provides an electronic device, comprising the scattering film provided in the first aspect of the present invention, and further comprising an antenna device, wherein a surface of the antenna device is connected to the scattering film.

[0025] The scattering film provided by the embodiment of the present invention comprises a scattering layer, an impedance gradient layer and a protective layer stacked in sequence along the stacking direction. The scattering layer is provided with a scattering structure through which electromagnetic waves can pass, so that the electromagnetic waves diverge to all sides after passing through the scattering structure, thereby increasing the spatial range of electromagnetic wave emission, thereby realizing the divergence function of electromagnetic waves and avoiding communication blind spots as much as possible. By providing an impedance gradient layer between the scattering layer and the protective layer, the impedance of the impedance gradient layer along the stacking direction gradually changes from the impedance of the scattering structure to the impedance of the protective layer, eliminating the impedance mutation at the interface between the scattering structure and the protective layer, reducing the energy loss in the process of electromagnetic waves passing through the scattering film, and improving the signal propagation distance and the quality of the transmission signal. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The present invention is further described in detail below based on the accompanying drawings and embodiments.

[0027] Figure 1 It is a structural schematic diagram of a scattering film in the prior art;

[0028] Figure 2A cross-sectional view of a diffusion film provided by an embodiment of the present invention;

[0029] Figure 3 A cross-sectional view of another diffusion film provided by an embodiment of the present invention;

[0030] Figure 4 A cross-sectional view of another diffusion film provided by an embodiment of the present invention;

[0031] Figure 5 A cross-sectional view of another diffusion film provided by an embodiment of the present invention;

[0032] Figure 6 A cross-sectional view of another diffusion film provided by an embodiment of the present invention;

[0033] Figure 7 A top view of a diffusion layer provided by an embodiment of the present invention;

[0034] Figure 8 A top view of another diffusion layer provided by an embodiment of the present invention;

[0035] Figure 9 A top view of another diffusion layer provided by an embodiment of the present invention;

[0036] Figure 10 A top view of another diffusion layer provided by an embodiment of the present invention;

[0037] Figure 11 A cross-sectional view of an electronic device provided by an embodiment of the present invention;

[0038] Figure 12 A cross-sectional view of another electronic device provided by an embodiment of the present invention;

[0039] Figure 13 A cross-sectional view of another electronic device provided by an embodiment of the present invention;

[0040] Figure 14 A cross-sectional view of another electronic device provided by an embodiment of the present invention;

[0041] Figure 15 A cross-sectional view of another electronic device provided by an embodiment of the present invention. Description of the Drawings:

[0043] 110. Scattering layer; 120. Protective layer; 210. Scattering layer; 220. Impedance gradient layer; 230. Protective layer; 201. Second through-hole; 202. Second dielectric material; 221. First sub-layer; 222. Second sub-layer; 223. Third sub-layer; 203. First through-hole; 204. First dielectric material; 240. First convex structure; 241. Convex portion; 250. Connection layer; 260. Second convex structure; 10. Scattering film; 20. Antenna device; 21. Antenna circuit; 22. Substrate. Detailed implementation manners

[0044] To make the technical problems solved by the present invention, the technical solutions adopted, and the achieved technical effects clearer, the technical solutions of the embodiments of the present invention will be further described in detail below with reference to the drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present invention.

[0045] In the description of the present invention, unless otherwise clearly defined and limited, the terms "connected", "connected to", and "fixed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the internal communication of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0046] In the present invention, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include direct contact between the first and second features, or may include that the first and second features are not in direct contact but in contact through other features therebetween. Moreover, the first feature being "above", "above", and "on" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "below", "below", and "under" the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is lower than that of the second feature.

[0047] Figure 1 Structural schematic diagram of a scattering film for the prior art, as Figure 1As shown, the scattering film includes a scattering layer 110 and a protective layer 120. The protective layer 120 has a protective function to prevent the scattering film from being damaged during use. As described in the background technology of the present invention, after the electromagnetic wave is dispersed by the scattering layer 110, reflection occurs at the interface between the scattering layer 110 and the protective layer 120, resulting in electromagnetic energy loss along the propagation direction, which seriously affects the signal propagation distance and the quality of the transmission signal. After research, the inventor found that this is due to the different impedances of the scattering layer 110 and the protective layer 120, and the impedances of the two media suddenly change at the interface, and the greater the impedance difference, the more serious the reflection phenomenon.

[0048] Based on the above technical problems, this embodiment provides the following solutions:

[0049] The scattering film comprises a scattering layer, an impedance gradient layer and a protective layer stacked in sequence;

[0050] The scattering layer is provided with a scattering structure through which electromagnetic waves can pass, so that the electromagnetic waves radiate to all directions after passing through the scattering structure;

[0051] The impedance of the scattering structure is a first impedance value, the impedance of the protection layer is a second impedance value, and the impedance of the impedance gradient layer gradually changes from the first impedance value to the second impedance value along the stacking direction.

[0052] The scattering film provided by the embodiment of the present invention comprises a scattering layer, an impedance gradient layer and a protective layer stacked in sequence along the stacking direction. The scattering layer is provided with a scattering structure through which electromagnetic waves can pass, so that the electromagnetic waves diverge to all sides after passing through the scattering structure, thereby increasing the spatial range of electromagnetic wave emission, thereby realizing the divergence function of electromagnetic waves and avoiding communication blind spots as much as possible. By providing an impedance gradient layer between the scattering layer and the protective layer, the impedance of the impedance gradient layer along the stacking direction gradually changes from the impedance of the scattering structure to the impedance of the protective layer, eliminating the impedance mutation at the interface between the scattering structure and the protective layer, reducing the energy loss in the process of electromagnetic waves passing through the scattering film, and improving the signal propagation distance and the quality of the transmission signal.

[0053] In order to enable those skilled in the art to more clearly understand the technical solution of the present invention, the mask assembly provided in this embodiment is specifically described below in conjunction with specific drawings:

[0054] The embodiment of the present invention provides a scattering film. Figure 2 A cross-sectional view of a scattering film provided by an embodiment of the present invention, such as Figure 2 As shown, the scattering film includes a scattering layer 210, a graded impedance layer 220 and a protective layer 230 which are sequentially stacked in the Z direction.

[0055] The scattering layer 210 is made of any one of copper, aluminum, titanium, zinc, iron, nickel, chromium, cobalt, silver or gold or an alloy of two or more of the above. For example, in the embodiment of the present invention, the scattering layer 210 is made of copper.

[0056] A scattering structure through which electromagnetic waves can pass is provided on the scattering layer 210. When the electromagnetic waves pass through the scattering layer 210, the scattering structure scatters the electromagnetic waves, thereby expanding the spatial range of the electromagnetic wave emission, thereby realizing the divergence function of the electromagnetic waves and avoiding communication blind spots as much as possible. Exemplarily, the scattering structure may include a plurality of second through holes 201 penetrating the scattering layer 210, each of which is filled with the same or different second dielectric materials 202, the second through holes 201 being capable of allowing electromagnetic waves to pass through, and the aperture of the second through holes 201 may be smaller than the wavelength of the electromagnetic waves, so that the electromagnetic waves are diffracted after being incident on the through holes, so that the propagation path of the electromagnetic waves that were originally only transmitted in a directional manner is changed, and propagation paths in multiple directions are generated after diffraction, thereby realizing the scattering of the electromagnetic waves. Exemplarily, the scattering structure may also include a plurality of second through holes 201 penetrating the scattering layer 210, the aperture of the second through hole 201 may be larger than the wavelength of the electromagnetic wave, each second through hole 201 is filled with a different second dielectric material 202, and in at least one preset direction, the refractive index of the second dielectric material 202 to the incident electromagnetic wave presents a trend of being small in the middle and large on both sides, and the preset direction is any direction within the surface of the scattering layer. When the electromagnetic wave passes through the scattering layer 210, the electromagnetic wave is deflected in the direction with a larger refractive index, thereby achieving scattering of the electromagnetic wave.

[0057] The material of the protective layer 230 is an insulating material through which electromagnetic waves can pass, and has a certain impact resistance, so as to prevent the scattering film from contacting with other external electronic components during use and causing a short circuit, and also protect the scattering film from being damaged during use. Exemplarily, the material of the protective layer 230 can be any one of a PPS (Polyphenylene sulfide) film layer, a PEN (Polyethylene naphthalate two formic acid glycol ester) film layer, a polyester film layer, a polyimide film layer, a film layer formed after epoxy resin ink is cured, a film layer formed after polyurethane ink is cured, a film layer formed after modified acrylic resin is cured, or a film layer formed after polyimide resin is cured.

[0058] The impedance of the scattering structure is the first impedance value, that is, the impedance of the second dielectric material 202 is the first impedance value, and the impedance of the protective layer 230 is the second impedance value. The impedance of the impedance gradient layer 220 along the stacking direction (positive direction of Z) continuously changes from the first impedance value to the second impedance value, eliminating the impedance mutation at the interface between the scattering structure and the protective layer, reducing the energy loss of electromagnetic waves when passing through the interface between the scattering structure and the protective layer, and improving the signal propagation distance and the quality of the transmitted signal.

[0059] For example, Figure 2 As shown, the impedance gradient layer 220 is an integral structure, and the impedance of the integral structure along the stacking direction (positive direction of Z) continuously changes from a first impedance value to a second impedance value. Exemplarily, the impedance gradient layer 220 can control the doping concentration of the substrate along the stacking direction by doping the substrate, thereby achieving the impedance of the integral structure along the stacking direction continuously changing from a first impedance value to a second impedance value.

[0060] In other embodiments of the present invention, the impedance gradient layer may not be an integral structure, but may be formed by stacking multiple sub-layers, and the impedance of the multiple sub-layers may be continuously gradiently changed from a first impedance value to a second impedance value along the stacking direction.

[0061] Figure 3 A cross-sectional view of another scattering film provided by an embodiment of the present invention, such as Figure 3 As shown, the scattering film includes a scattering layer 210, a graded impedance layer 220 and a protective layer 230 which are sequentially stacked in the Z direction.

[0062] The scattering layer 210 is made of any one of copper, aluminum, titanium, zinc, iron, nickel, chromium, cobalt, silver or gold or an alloy of two or more of the above. For example, in the embodiment of the present invention, the scattering layer 210 is made of copper.

[0063] The scattering layer 210 is provided with a plurality of second through holes 201 penetrating the scattering layer 210, and the second through holes 201 can allow electromagnetic waves to pass through. The second through holes 201 are filled with a second dielectric material 202, and the second dielectric material 202 can be air or a material that has no shielding effect on electromagnetic waves. In the embodiment of the present invention, the second dielectric material 202 is air to illustrate the present invention. The aperture of the second through hole 201 is smaller than the wavelength of the electromagnetic wave, so that the electromagnetic wave diffracts after being incident on the second through hole 201, so that the propagation path of the electromagnetic wave that was originally only transmitted in a directional manner is changed, and propagation paths in multiple directions are generated after diffraction, thereby expanding the spatial range of electromagnetic wave emission, thereby realizing the divergence function of the electromagnetic wave and avoiding communication blind spots as much as possible.

[0064] The material of the protective layer 230 is an insulating material through which electromagnetic waves can pass, and it has a certain impact resistance, which can prevent the scattering film from coming into contact with other external electronic components during use and causing short - circuit problems, and can also protect the scattering film from being damaged during use.

[0065] The impedance of the second dielectric material 202 is a first impedance value, and the impedance of the protective layer 230 is a second impedance value. Exemplarily, the impedance - gradient layer 220 includes a first sub - layer 221, a second sub - layer 222, and a third sub - layer 223 stacked in sequence along the stacking direction. Each sub - layer is made of a different base material, and the impedance of each base material gradually changes from the first impedance value to the second impedance value along the stacking direction. Specifically, the impedance of the base material of the first sub - layer 221 in contact with the scattering layer 210 is the first impedance value, and the impedance of the base material of the third sub - layer 223 in contact with the protective layer 230 is the second impedance value, so that the impedance from the first sub - layer 221 to the third sub - layer 223 gradually changes along the stacking direction. The impedance of the impedance - gradient layer gradually changes continuously from the first impedance value to the second impedance value along the stacking direction, eliminating the impedance mutation at the interface between the scattering structure and the protective layer, reducing the energy loss when electromagnetic waves pass through the interface between the scattering structure and the protective layer, and improving the signal propagation distance and the quality of the transmitted signal.

[0066] In the above - mentioned embodiment, each sub - layer is prepared from a different base material, and the impedance of each of the base materials gradually changes along the stacking direction, so that the impedance from the first sub - layer to the nth sub - layer gradually changes along the stacking direction. In other embodiments of the present invention, each sub - layer can also be made of the same base material, and a plurality of first through - holes penetrating the sub - layer are formed on each sub - layer. The volumes of the first through - holes on the same sub - layer are the same, and the volumes and / or the numbers of the first through - holes on different sub - layers are different, so that the impedance from the first sub - layer to the nth sub - layer gradually changes along the stacking direction. The specific description is as follows:

[0067] Figure 4 Another cross - sectional view of the scattering film provided by the embodiment of the present invention is shown as Figure 4 shown. The scattering film includes a scattering layer 210, an impedance - gradient layer 220, and a protective layer 230 stacked in sequence in the Z direction.

[0068] The material of the scattering layer 210 is any one of metal materials such as copper, aluminum, titanium, zinc, iron, nickel, chromium, cobalt, silver, or gold, or an alloy material of two or more of them. Exemplarily, in the embodiment of the present invention, the material of the scattering layer 210 is copper.

[0069] The scattering layer 210 is provided with a plurality of second through holes 201 penetrating the scattering layer 210, and the second through holes 201 can allow electromagnetic waves to pass through. The second through holes 201 are filled with a second dielectric material 202, and the second dielectric material 202 can be air or a material that has no shielding effect on electromagnetic waves. In the embodiment of the present invention, the second dielectric material 202 is air to illustrate the present invention. The aperture of the second through hole 201 is smaller than the wavelength of the electromagnetic wave, so that the electromagnetic wave diffracts after being incident on the second through hole 201, so that the propagation path of the electromagnetic wave that was originally only transmitted in a directional manner is changed, and propagation paths in multiple directions are generated after diffraction, thereby expanding the spatial range of electromagnetic wave emission, thereby realizing the divergence function of the electromagnetic wave and avoiding communication blind spots as much as possible.

[0070] The material of the protective layer 230 is an insulating material through which electromagnetic waves can pass and has a certain impact resistance, which can prevent the scattering film from contacting other external electronic components during use and causing a short circuit, and can also protect the scattering film from being damaged during use.

[0071] The impedance of the second dielectric material 202 is a first impedance value, and the impedance of the protective layer 230 is a second impedance value. Exemplarily, the impedance gradient layer 220 includes a first sublayer 221, a second sublayer 222, and a third sublayer 223 stacked in sequence along the stacking direction. Each sublayer is made of the same substrate, and each sublayer is provided with a first through hole 203 penetrating the sublayer. A plurality of first through holes 203 are arranged in an array along the X direction and the Y direction, wherein the X direction and the Y direction are two directions perpendicular to each other in the plane where the impedance gradient layer 220 is located. The volume of each first through hole 203 is the same, and the number of first through holes 203 on different sublayers decreases in sequence along the stacking direction, so that the impedance of each sublayer gradually changes from the first impedance value to the second impedance value along the stacking direction. Specifically, the number of first through holes 203 on the first sublayer 211 is the largest, so that the equivalent impedance of the first sublayer 221 is equal to or close to the first impedance value, the number of first through holes 203 on the third sublayer 223 is the smallest, so that the equivalent impedance of the third sublayer 223 is equal to or close to the second impedance value, and the number of first through holes 203 on different sublayers decreases in sequence along the stacking direction, so that the equivalent impedance of the first sublayer 221 to the third sublayer 223 changes gradually along the stacking direction. The impedance of the impedance gradient layer changes continuously from the first impedance value to the second impedance value along the stacking direction, eliminating the impedance mutation at the interface between the scattering structure and the protective layer, reducing the energy loss when the electromagnetic wave passes through the interface between the scattering structure and the protective layer, and improving the signal propagation distance and the quality of the transmission signal.

[0072] Figure 5 A cross-sectional view of another scattering film provided by an embodiment of the present invention, such as Figure 5 As shown, the scattering film includes a scattering layer 210, a graded impedance layer 220 and a protective layer 230 which are sequentially stacked in the Z direction.

[0073] The scattering layer 210 is made of any one of copper, aluminum, titanium, zinc, iron, nickel, chromium, cobalt, silver or gold or an alloy of two or more of the above. For example, in the embodiment of the present invention, the scattering layer 210 is made of copper.

[0074] The scattering layer 210 is provided with a plurality of second through holes 201 penetrating the scattering layer 210, and the second through holes 201 can allow electromagnetic waves to pass through. The second through holes 201 are filled with a second dielectric material 202, and the second dielectric material 202 can be air or a material that has no shielding effect on electromagnetic waves. In the embodiment of the present invention, the second dielectric material 202 is air to illustrate the present invention. The aperture of the second through hole 201 is smaller than the wavelength of the electromagnetic wave, so that the electromagnetic wave diffracts after being incident on the second through hole 201, so that the propagation path of the electromagnetic wave that was originally only transmitted in a directional manner is changed, and propagation paths in multiple directions are generated after diffraction, thereby expanding the spatial range of electromagnetic wave emission, thereby realizing the divergence function of the electromagnetic wave and avoiding communication blind spots as much as possible.

[0075] The material of the protective layer 230 is an insulating material through which electromagnetic waves can pass and has a certain impact resistance, which can prevent the scattering film from contacting other external electronic components during use and causing a short circuit, and can also protect the scattering film from being damaged during use.

[0076] The impedance of the second dielectric material 202 is a first impedance value, and the impedance of the protective layer 230 is a second impedance value. Exemplarily, the impedance gradient layer 220 includes a first sub-layer 221, a second sub-layer 222, and a third sub-layer 223 stacked in sequence along the stacking direction. Each sub-layer is made of the same base material, and a first through-hole 203 penetrating the sub-layer is formed on each sub-layer. A plurality of first through-holes 203 are arranged in an array along the X direction and the Y direction, where the X direction and the Y direction are two mutually perpendicular directions in the plane where the impedance gradient layer 220 is located. The number of first through-holes 203 formed on each sub-layer is equal, the volume of each first through-hole 203 on the same sub-layer is the same, and the volume of the first through-holes 203 on different sub-layers decreases sequentially along the stacking direction, so that the impedance of each sub-layer gradually changes from the first impedance value to the second impedance value along the stacking direction. Specifically, the volume of the first through-hole 203 on the first sub-layer 211 is the largest, so that the equivalent impedance of the first sub-layer 221 is equal to or close to the first impedance value, the volume of the first through-hole 203 on the third sub-layer 223 is the smallest, so that the equivalent impedance of the third sub-layer 223 is equal to or close to the second impedance value, and the volume of the first through-holes 203 on different sub-layers decreases sequentially along the stacking direction, so that the equivalent impedance of the first sub-layer 221 to the third sub-layer 223 gradually changes along the stacking direction. The impedance of the impedance gradient layer gradually changes continuously from the first impedance value to the second impedance value along the stacking direction, eliminating the impedance mutation at the interface between the scattering structure and the protective layer, reducing the energy loss when the electromagnetic wave passes through the interface between the scattering structure and the protective layer, and improving the signal propagation distance and the quality of the transmitted signal.

[0077] In the above embodiments, each sub-layer is made of the same base material, and by forming first through-holes with different pore diameters and / or different numbers on each sub-layer, the impedance of the first sub-layer to the nth sub-layer gradually changes along the stacking direction. In other embodiments of the present invention, the impedance of the first sub-layer to the nth sub-layer can also be gradually changed along the stacking direction by filling different first dielectric materials into the first through-holes of each sub-layer. The specific description is as follows:

[0078] Figure 6 A cross-sectional view of another scattering film provided by an embodiment of the present invention is shown in Figure 6 As shown, the scattering film includes a scattering layer 210, an impedance gradient layer 220, and a protective layer 230 stacked in sequence in the Z direction.

[0079] The material of the scattering layer 210 is any one of metal materials such as copper, aluminum, titanium, zinc, iron, nickel, chromium, cobalt, silver, or gold, or an alloy material of two or more. Exemplarily, in the embodiment of the present invention, the material of the scattering layer 210 is copper.

[0080] The scattering layer 210 is provided with a plurality of second through holes 201 penetrating the scattering layer 210, and the second through holes 201 can allow electromagnetic waves to pass through. The second through holes 201 are filled with a second dielectric material 202, and the second dielectric material 202 can be air or a material that has no shielding effect on electromagnetic waves. In the embodiment of the present invention, the second dielectric material 202 is air to illustrate the present invention. The aperture of the second through hole 201 is smaller than the wavelength of the electromagnetic wave, so that the electromagnetic wave diffracts after being incident on the second through hole 201, so that the propagation path of the electromagnetic wave that was originally only transmitted in a directional manner is changed, and propagation paths in multiple directions are generated after diffraction, thereby expanding the spatial range of electromagnetic wave emission, thereby realizing the divergence function of the electromagnetic wave and avoiding communication blind spots as much as possible.

[0081] The material of the protective layer 230 is an insulating material through which electromagnetic waves can pass and has a certain impact resistance, which can prevent the scattering film from contacting other external electronic components during use and causing a short circuit, and can also protect the scattering film from being damaged during use.

[0082] The impedance of the second dielectric material 202 is a first impedance value, and the impedance of the protective layer 230 is a second impedance value. Exemplarily, the impedance gradient layer 220 includes a first sublayer 221, a second sublayer 222, and a third sublayer 223 stacked in sequence along the stacking direction. Each sublayer is made of the same substrate, and each sublayer is provided with a first through hole 203 that penetrates the sublayer. Multiple first through holes 203 are arranged in an array along the X direction and the Y direction, wherein the X direction and the Y direction are two directions perpendicular to each other in the plane where the impedance gradient layer 220 is located. The number of first through holes 203 opened on each sublayer is equal, and the volume of each first through hole 203 is the same. The first through hole 203 is filled with a first dielectric material 204, and the dielectric constant of the first dielectric material 204 filled in each first through hole 203 on the same sublayer is the same, and the dielectric constant of the first dielectric material 204 filled in each first through hole 203 on different sublayers increases in sequence along the stacking direction. As Figure 6 As shown, the shadows in the first through hole 203 represent the filled first dielectric material 204 , and a greater density of the shadows indicates a greater dielectric constant of the first dielectric material 204 .

[0083] As is known to those skilled in the art, the dielectric constant of a medium is directly proportional to its impedance. The greater the dielectric constant of the medium, the greater its impedance. By setting the dielectric constants of the first dielectric materials 204 filled in the respective first vias 203 on different sub-layers to increase sequentially in the stacking direction, the equivalent impedance of each sub-layer gradually changes from a first impedance value to a second impedance value in the stacking direction. Specifically, the dielectric constant of the first dielectric material 204 filled in the first via 203 on the first sub-layer 221 is the smallest, such that the equivalent impedance of the first sub-layer 221 is equal to or close to the first impedance value. The dielectric constant of the first dielectric material 204 filled in the first via 203 on the third sub-layer 223 is the largest, such that the equivalent impedance of the third sub-layer 223 is equal to or close to the second impedance value. The dielectric constants of the first dielectric materials 204 in the first vias 203 on different sub-layers increase sequentially in the stacking direction, such that the equivalent impedance of the first sub-layer 221 to the third sub-layer 223 gradually changes in the stacking direction. The impedance of the impedance gradient layer continuously changes from the first impedance value to the second impedance value in the stacking direction, eliminating the impedance mutation at the interface between the scattering structure and the protective layer, reducing the energy loss when electromagnetic waves pass through the interface between the scattering structure and the protective layer, and improving the signal propagation distance and the quality of the transmitted signal.

[0084] Exemplarily, in the stacking direction, the first dielectric materials 204 filled in the first vias 203 of each sub-layer can be air, glass, sodium chloride, polystyrene, quartz, crystal, copper oxide, iodine crystal, etc.

[0085] It should be noted that in the above embodiments, the present invention is described by taking the impedance gradient layer including three sub-layers as an example. The number of sub-layers included in the impedance gradient layer in the embodiments of the present invention is not limited. In other embodiments of the present invention, the impedance gradient layer may also include more than four sub-layers. Those skilled in the art should understand that the more the number of sub-layers included in the impedance gradient layer, the smoother the impedance change of the impedance gradient layer, and the better the effect of eliminating the impedance mutation at the interface between the scattering structure and the protective layer. Considering the production cost, the number of sub-layers of the impedance gradient layer can be 3 - 10 layers.

[0086] In the above embodiments, the cross-sectional shapes of the second via and the first via are not limited. For any cross-section perpendicular to the Z direction, the cross-sectional areas of the vias intercepted may be the same or different, and this is not limited in the embodiments of the present invention, as long as it satisfies that electromagnetic waves diffract after entering the second via. In some embodiments of the present invention, for the convenience of via formation, the cross-sectional shapes of the second via and the first via can be regular shapes such as circles and squares, and the cross-sectional areas of the vias intercepted for any cross-section perpendicular to the Z direction are the same.

[0087] On the basis of the above embodiment, the scattering structure provided on the scattering layer may include a plurality of second through holes penetrating the scattering layer, the second through holes being provided for electromagnetic waves to pass through, the second through holes being filled with a second dielectric material, the aperture of the second through holes being smaller than the wavelength of the electromagnetic wave, so that the electromagnetic wave diffracts after being incident on the second through holes, thereby changing the propagation path of the electromagnetic wave that was originally only transmitted in a direction, generating propagation paths in multiple directions after diffraction, and expanding the spatial range of the electromagnetic wave emission, thereby realizing the divergence function of the electromagnetic wave and avoiding communication blind spots as much as possible.

[0088] Furthermore, the number and / or aperture of the second through holes in a preset direction of the scattering layer presents a trend of continuous change, and the preset direction is an arbitrary direction within the surface of the scattering layer, which enhances the disorder of the diffraction of the electromagnetic wave and further increases the spatial range of the electromagnetic wave emission. The specific description is as follows:

[0089] Figure 7 A top view of a scattering layer provided in an embodiment of the present invention, such as Figure 7 As shown, the scattering layer 210 is provided with a plurality of second through holes 201 penetrating the scattering layer 210, and the plurality of second through holes 201 are arranged in an array. Specifically, the plurality of second through holes 201 are arranged in an array along the X direction and the Y direction of the surface of the scattering layer 210, and the second through holes 201 are cylindrical through holes, and the apertures of the plurality of second through holes 201 present a variation trend of being larger in the middle and smaller on both sides along the X direction. By setting the apertures of the second through holes 201 to present a variation trend of being larger in the middle and smaller on both sides along the X direction, the disorder of the diffraction of the electromagnetic wave is enhanced, and the spatial range of the electromagnetic wave emission is further increased.

[0090] The second through hole 201 is filled with a second dielectric material 202, which may be air or a material that has no shielding effect on electromagnetic waves. In the embodiment of the present invention, the second dielectric material 202 is air to illustrate the present invention.

[0091] In the above embodiment, the apertures of the plurality of second through holes 201 present a variation trend of being larger in the middle and smaller on both sides along the X direction. In other embodiments of the present invention, the apertures of the plurality of second through holes 201 may also present other variation trends along the X direction. For example, along the X direction, the apertures of the plurality of second through holes 201 present a variation trend of being smaller in the middle and larger on both sides, continuously increasing or continuously decreasing, which can also achieve the technical effect of the present invention and will not be described in detail in the embodiments of the present invention.

[0092] Figure 8 A top view of another scattering layer provided in an embodiment of the present invention, such as Figure 8As shown in the figure, a plurality of second through holes 201 penetrating the scattering layer 210 are formed in the scattering layer 210, and the plurality of second through holes 201 are arranged in an array. Specifically, the plurality of second through holes 201 are arranged in an array along the X direction and the Y direction on the surface of the scattering layer 210. The second through holes 201 are cylindrical through holes, and the plurality of second through holes 201 have the same aperture. Along the X direction, the number of the second through holes 201 shows a trend of more in the middle and less on both sides. That is, along the X direction, the second through holes 201 in the middle are arranged more densely, and the second through holes 201 on both sides are arranged more sparsely. By setting the number of the second through holes 201 to show a trend of more in the middle and less on both sides along the X direction, the disorder of the electromagnetic wave diffraction is strengthened, and the spatial range of the electromagnetic wave emission is further increased.

[0093] The second through holes 201 are filled with a second dielectric material 202, and the second dielectric material 202 can be air or a material that has no shielding effect on the electromagnetic wave. In the embodiment of the present invention, the second dielectric material 202 is air to illustrate the present invention.

[0094] In the above embodiment, along the X direction, the number of the second through holes 201 shows a trend of more in the middle and less on both sides. In other embodiments of the present invention, along the X direction, the number of the second through holes 201 may also be unequal. For example, it shows a trend of less in the middle and more on both sides, a continuous increasing or decreasing trend, and the technical effects of the present invention can also be achieved. The embodiments of the present invention will not be described in detail herein.

[0095] In the above embodiment, the technical solution of the present invention is described by taking the second dielectric materials in each second through hole as the same dielectric material as an example. In other embodiments of the present invention, the second dielectric materials in the second through holes may also be different dielectric materials. For example, in at least one preset direction, the refractive index of the second dielectric material for the incident electromagnetic wave shows a trend of smaller in the middle and larger on both sides, and the preset direction is any direction in the surface of the scattering layer. The specific description is as follows:

[0096] Figure 9 This is a top view of another scattering layer provided by the embodiment of the present invention. As Figure 9 shown, a plurality of second through holes 201 penetrating the scattering layer 210 are formed in the scattering layer 210, and the plurality of second through holes 201 are arranged in an array. Specifically, the plurality of second through holes 201 are arranged in an array along the X direction and the Y direction on the surface of the scattering layer 210. The aperture of the second through holes 201 shows a trend of smaller in the middle and larger on both sides along the X direction. By setting the aperture of the second through holes 201 to show a trend of smaller in the middle and larger on both sides along the X direction, the disorder of the electromagnetic wave diffraction is strengthened, and the spatial range of the electromagnetic wave emission is further increased.

[0097] Along the X direction, each of the second through-holes 201 is filled with a different second dielectric material 202. Along the X direction, the refractive index of the second dielectric material 202 filled in each of the second through-holes 201 shows a trend of being smaller in the middle and larger on both sides. As a result, the refractive index of the overall scattering layer 210 for electromagnetic waves in the X direction shows a trend of being lower in the middle and higher on both sides, thereby achieving the divergence of electromagnetic waves. Exemplarily, iodine crystal, copper oxide, quartz crystal, quartz, polystyrene, sodium chloride, glass, air, glass, sodium chloride, polystyrene, quartz, quartz crystal, copper oxide, and iodine crystal are filled in sequence along the X direction. As Figure 9 shown, the shaded areas in the second through-holes 201 represent the filled second dielectric material 202, and the greater the shaded density, the greater the refractive index of the second dielectric material 202.

[0098] In the above embodiment, the apertures of the multiple second through-holes 201 show a trend of being smaller in the middle and larger on both sides along the X direction. In other embodiments of the present invention, along the X direction, the apertures of the multiple second through-holes 201 may also show other changing trends. For example, along the X direction, the apertures of the multiple second through-holes 201 show a trend of being larger in the middle, smaller on both sides, continuously increasing, or continuously decreasing, and the technical effects of the present invention can also be achieved. The embodiments of the present invention will not be elaborated here.

[0099] In the above embodiment, the scattering structure provided on the scattering layer includes multiple second through-holes penetrating the scattering layer, and the aperture of the second through-hole is smaller than the wavelength of the electromagnetic wave as an example to illustrate the technical solution of the present invention. In other embodiments of the present invention, the scattering structure provided on the scattering layer may include multiple second through-holes penetrating the scattering layer, the aperture of the second through-hole is larger than the wavelength of the electromagnetic wave, the second through-hole is filled with a second dielectric material, and in at least one preset direction, the refractive index of the second dielectric material for the incident electromagnetic wave shows a trend of being smaller in the middle and larger on both sides, and the preset direction is any direction within the surface of the scattering layer. The specific description is as follows:

[0100] Figure 10 This is a top view of another scattering layer provided by an embodiment of the present invention. As Figure 10 shown, a plurality of second through-holes 201 penetrating the scattering layer 210 are formed on the scattering layer 210, and the aperture of the second through-hole 201 is larger than the wavelength of the electromagnetic wave. The plurality of second through-holes 201 are arranged in an array. Specifically, the plurality of second through-holes 201 are arranged in an array along the X direction and the Y direction on the surface of the scattering layer 210. The second through-holes 201 are cylindrical through-holes, and the plurality of second through-holes 201 have the same aperture. Along the X direction, the second through-holes 201 are arranged at equal intervals.

[0101] Along the X direction, each of the second through-holes 201 is filled with a different second dielectric material 202. Along the X direction, the refractive indices of the second dielectric materials 202 filled in the second through-holes 201 show a trend of being smaller in the middle and larger on both sides, such that the refractive index of the overall scattering layer 210 for electromagnetic waves shows a trend of being lower in the middle and higher on both sides along the X direction, thereby achieving the divergence of electromagnetic waves. Exemplarily, iodine crystal, copper oxide, quartz crystal, quartz, polystyrene, sodium chloride, glass, air, glass, sodium chloride, polystyrene, quartz, quartz crystal, copper oxide, iodine crystal are filled in sequence along the X direction. As Figure 10 shown, the shading in the second through-hole 201 represents the filled second dielectric material 202, and the greater the shading density, the greater the refractive index of the second dielectric material 202.

[0102] In this case, the second through-holes 201 no longer have a diffraction effect on electromagnetic waves. Along the X direction, the refractive indices of the dielectric materials 202 filled in the second through-holes 201 show a trend of being smaller in the middle and larger on both sides, such that the refractive index of the overall scattering layer 210 for electromagnetic waves shows a trend of being lower in the middle and higher on both sides along the X direction. When electromagnetic waves pass through the scattering layer 210, the electromagnetic waves deflect towards the direction with a larger refractive index, thereby achieving the scattering of electromagnetic waves.

[0103] Based on the above embodiments, as Figures 2 - 6 shown, the scattering film may further include a first convex structure 240. The first convex structure 240 is disposed on the side of the impedance gradient layer 220 away from the scattering layer 210, and the first convex structure 240 extends into the protective layer 230, that is, the protective layer 230 covers the first convex structure 240. When electromagnetic waves are emitted and pass through the first convex structure 240, diffuse reflection will occur, causing the movement path of the originally only directionally transmitted electromagnetic waves to change, and multiple direction transmission paths are generated through diffuse reflection, further expanding the divergence range of electromagnetic waves. For the material for realizing the electromagnetic wave reflection function, the present invention preferably uses a first convex structure 240 made of a metal material. Of course, the present invention is not limited thereto, and any material that can realize the electromagnetic wave reflection function can be applicable to the present invention. For example, a first convex structure 240 made of an alloy material can also be used.

[0104] The first protruding structure 240 extends into the protective layer 230, improves the connection reliability between the impedance gradient layer 220 and the protective layer 230, and prevents peeling and falling off between the protective layer 230 and the impedance gradient layer 220. The height of the first protruding structure 240 is less than the thickness of the protective layer 230. The design ensures that the first protruding structure 240 extends into the protective layer 230, but does not extend out of the protective layer 230, so as to avoid failure of the protective layer 230. It should be noted that when the first protruding structure 240 includes a plurality of protrusions 241 of different heights, the height of the first protruding structure 240 at this time refers to the highest height of all the protrusions 241. Exemplarily, the thickness of the protective layer 230 is 1μm-25μm, and the height of the first protruding structure 240 is 0.1μm-15μm.

[0105] Exemplarily, the first protrusion structure 240 may include a plurality of protrusions 241 to improve the diffuse reflection effect. The distance between adjacent protrusions 241 is less than the wavelength of the electromagnetic wave. Exemplarily, the distance between adjacent protrusions 241 is 0 μm-500 μm. Adjacent protrusions 241 may be arranged in a connected manner or may be arranged at intervals from each other. The present invention does not specifically limit the size of the protrusions 241, and the sizes of the plurality of protrusions 241 may be the same or different.

[0106] In the embodiment of the present invention, the shape of the first protrusion structure 240 can be varied according to actual needs, and can be a regular or irregular three-dimensional geometric shape, which is not limited in the embodiment of the present invention. In some examples, the shape of the first protrusion structure 240 is one or more of a pointed angle, an inverted cone, a granular shape, a dendrite, a columnar shape, and a block shape. For example, Figures 2 - 6 In the example shown, the first protruding structure 240 is an irregular curved shape.

[0107] In order to facilitate the connection of the scattering film of the present invention with other components, such as Figures 2 - 6 As shown, the scattering film may further include a connecting layer 250, and the connecting layer 250 covers the side of the scattering layer 210 away from the impedance gradient layer 220. Exemplarily, the connecting layer 250 is an adhesive film layer. By providing the adhesive film layer, the scattering film of this embodiment can be easily connected to other components. Exemplarily, the material used for the adhesive film layer is selected from any one of the following materials: epoxy resin, modified epoxy resin, acrylic acid, modified rubber, thermoplastic polyimide, modified thermoplastic polyimide, polyurethane, polyacrylate, and silicone.

[0108] In some embodiments of the present invention, Figures 2 - 6As shown, the scattering film may further include a second protruding structure 260, which is disposed on a side of the scattering layer 210 away from the impedance gradient layer 220. The second protruding structure 260 extends into the connecting layer 250, thereby improving the connection reliability between the scattering layer 210 and the connecting layer 250, and preventing the connection layer 250 from peeling off from the scattering layer 210. The connecting layer 250 covers all the second protruding structures 260, and therefore, the height of the second protruding structure 260 of this embodiment is less than or equal to the thickness of the connecting layer 250. Through the design, it is ensured that the second protruding structure 260 extends into the connecting layer 250, but does not extend out of the connecting layer 250. It should be noted that Figures 2 - 6 The shape of the second protruding structure 260 is only exemplary. Due to differences in process means and parameters, the shape of each second protruding structure 260 is a regular or irregular three-dimensional geometric shape. For example, the shape of the second protruding structure 260 can be one or more of a sharp angle, an inverted cone, a granular shape, a dendrite, a column, and a block. The second protruding structure 260 in the embodiment of the present invention is not limited by the illustrated and above-mentioned shapes. As long as it is a second protruding structure 260 that is beneficial to improving the connection stability between the connecting layer 250 and the scattering layer 210, it is within the protection scope of the present invention. The shapes of the plurality of second protruding structures 260 can be the same or different, and the sizes of the second protruding structures 260 can also be the same or different. That is, the shapes of the plurality of second protruding structures 260 can be one or more of a sharp angle, an inverted cone, a granular shape, a dendrite, a column, and a block, and the sizes of the plurality of second protruding structures 260 of the same shape may not be completely the same. In addition, the plurality of second protrusion structures 260 are distributed continuously or discontinuously on one side of the scattering layer 210 close to the connection layer 250. For example, when the plurality of second protrusion structures 260 are pointed and continuously distributed, a regular, periodic, tooth-shaped three-dimensional pattern or an irregular, disordered, tooth-shaped three-dimensional pattern can be formed. Of course, only one case is listed here, and combinations of other shapes mentioned above are also within the protection scope of the present application, which are not listed here one by one.

[0109] It should be noted that the plurality of second protruding structures 260 may have different heights, in which case the height of the second protruding structure 260 refers to the highest height of all the second protruding structures 260. The outer surface of the connecting layer 250 and the surface of the scattering layer 210 may be a flat surface with no undulations or a non-flat surface with gentle undulations, which is not limited in the embodiment of the present invention.

[0110] In some embodiments of the present invention, the second protrusion structure 260 is made of a conductive material, so as to facilitate the derivation of the interfering charges accumulated in the scattering layer 210 during the use of the scattering film, thereby avoiding the formation of an interference source due to the accumulation of interfering charges. Exemplarily, the scattering layer 210 and the second protrusion structure 260 are integrally formed of the same metal material. When connecting to other components, by extrusion, a plurality of second protrusion structures 260 pierce through the connection layer 250 and are grounded, so as to derive the interfering charges accumulated in the scattering layer 210.

[0111] In the embodiments of the present invention, the height of the second protrusion structure 260 is preferably 0.1 μm - 30 μm, and the thickness of the connection layer 250 is preferably 0.1 μm - 45 μm, so as to ensure that the second protrusion structure 260 can pierce through the connection layer 250 when the scattering film is in use, thereby ensuring that the scattering film can be grounded.

[0112] In order to adapt to more application scenarios, the scattering film described in the present invention has a flexible, foldable and bendable structure. Specifically, the scattering layer 210, the impedance gradient layer 220 and the protective layer 230 can be made of a flexible structure, such as an FPC circuit board. The connection layer 250 provided on one surface of the scattering layer 210 has bendability, so that the scattering film of the present invention has the properties of being foldable and bendable. During actual use, the scattering film can be bent or folded into any shape such as a ring structure or a semi-closed structure according to needs, for example, an arc structure, an elliptical structure, a stacked structure.

[0113] The embodiments of the present invention also provide an electronic device. Figure 11 is a cross-sectional view of an electronic device provided by the embodiments of the present invention. Figure 12 is a cross-sectional view of another electronic device provided by the embodiments of the present invention. Figure 13 is a cross-sectional view of another electronic device provided by the embodiments of the present invention. Figure 14 is a cross-sectional view of another electronic device provided by the embodiments of the present invention. Figure 15 is a cross-sectional view of another electronic device provided by the embodiments of the present invention, as Figures 11 - 15 shown, the electronic device includes a scattering film 10 and an antenna device 20. Among them, the antenna device 20 includes an antenna circuit 21 and a substrate 22 for arranging the antenna circuit 21.

[0114] The scattering film 10 includes a scattering layer 210, an impedance gradient layer 220 and a protective layer 230 that are sequentially stacked along the stacking direction (the positive direction of Z).

[0115] The scattering layer 210 is provided with a plurality of second through holes 201 penetrating the scattering layer 210, and the second through holes 201 are filled with a second dielectric material 202, and the second through holes 201 are for electromagnetic waves to pass through. The aperture of the second through hole 201 is smaller than the wavelength of the electromagnetic wave, so that the electromagnetic wave diffracts after entering the second through hole 201, so that the propagation path of the electromagnetic wave that was originally only transmitted in a directional manner is changed, and propagation paths in multiple directions are generated after diffraction, thereby expanding the spatial range of electromagnetic wave emission, thereby realizing the divergence function of the electromagnetic wave and avoiding communication blind spots as much as possible. The number and / or aperture of the second through holes in the X direction of the scattering layer 210 show a trend of continuous change, which strengthens the disorder of the diffraction of the electromagnetic wave and further increases the spatial range of the electromagnetic wave emission.

[0116] The impedance of the impedance gradient layer 220 along the stacking direction changes gradually from the first impedance of the scattering structure (the second dielectric material 202) to the second impedance of the protective layer 230, eliminating the impedance mutation at the interface between the scattering structure and the protective layer 230, reducing the energy loss of electromagnetic waves passing through the scattering film, and improving the signal propagation distance and the quality of the transmitted signal.

[0117] For example, Figure 11 As shown, the impedance gradient layer 220 is an integral structure, and the impedance of the integral structure along the stacking direction (positive direction of Z) continuously gradiently changes from a first impedance value to a second impedance value.

[0118] For example, Figure 12 As shown, the impedance gradient layer 220 includes a first sublayer 221, a second sublayer 222 and a third sublayer 223 stacked in sequence along the stacking direction. Each sublayer is made of a different substrate, and the impedance of each substrate gradually changes from a first impedance value to a second impedance value along the stacking direction.

[0119] For example, Figure 13 As shown, the impedance gradient layer 220 includes a first sublayer 221, a second sublayer 222, and a third sublayer 223 stacked in sequence along the stacking direction. Each sublayer is made of the same substrate, and each sublayer is provided with a first through hole 203 penetrating the sublayer. The volume of each first through hole 203 is the same, and the number of first through holes 203 on different sublayers decreases in sequence along the stacking direction, so that the impedance of each sublayer gradually changes from the first impedance value to the second impedance value along the stacking direction.

[0120] For example, Figure 14As shown, the impedance gradient layer 220 includes a first sub-layer 221, a second sub-layer 222, and a third sub-layer 223 that are stacked in sequence along the stacking direction. Each sub-layer is made of the same base material. A first through-hole 203 penetrating the sub-layer is provided on each sub-layer. The number of the first through-holes 203 provided on each sub-layer is equal. The volumes of the first through-holes 203 on the same sub-layer are the same. The volumes of the first through-holes 203 on different sub-layers gradually decrease along the stacking direction, so that the impedance of each sub-layer gradually changes from a first impedance value to a second impedance value along the stacking direction.

[0121] Exemplarily, as Figure 15 As shown, the impedance gradient layer 220 includes a first sub-layer 221, a second sub-layer 222, and a third sub-layer 223 that are stacked in sequence along the stacking direction. Each sub-layer is made of the same base material. A first through-hole 203 penetrating the sub-layer is provided on each sub-layer. The number of the first through-holes 203 provided on each sub-layer is equal, and the volumes of the first through-holes 203 are the same. The first through-hole 203 is filled with a first dielectric material 204. The dielectric constants of the first dielectric materials 204 filled in the first through-holes 203 on the same sub-layer are the same. The dielectric constants of the first dielectric materials 204 filled in the first through-holes 203 on different sub-layers gradually increase along the stacking direction, so that the impedance of each sub-layer gradually changes from a first impedance value to a second impedance value along the stacking direction.

[0122] The scattering film 10 further includes a first convex structure 240 disposed on the first surface of the impedance gradient layer 220. The first convex structure 240 includes a plurality of convex portions 241. The first convex structure 240 extends into the protective layer 230. The scattering film 10 further includes a second convex structure 260 and a connecting layer 250 disposed on the scattering layer 210. The second convex structure 260 extends into the connecting layer 250.

[0123] One surface of the substrate 22 is adhesively connected to the connecting layer 250 of the scattering film 10 to realize the connection between the antenna device 20 and the scattering film 10. By connecting the scattering film 10 to the antenna device 20.

[0124] In the description herein, it should be understood that the terms such as "upper", "lower", "right", etc., the azimuth or positional relationship are based on the azimuth or positional relationship shown in the drawings, and are only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or element referred to must have a specific azimuth, be constructed and operated in a specific azimuth, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0125] In the description of this specification, the description referring to terms such as "one embodiment", "example", etc. means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example.

[0126] In addition, it should be understood that although this specification is described according to embodiments, not every embodiment only includes an independent technical solution. This narrative way of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0127] The technical principles of the present invention have been described above in conjunction with specific embodiments. These descriptions are only for explaining the principles of the present invention and cannot be interpreted in any way as a limitation on the protection scope of the present invention. Based on the explanations herein, those skilled in the art can think of other specific embodiments of the present invention without creative efforts, and these embodiments will fall within the protection scope of the present invention.

Claims

1. A diffusing film, characterized in that, It includes a scattering layer, an impedance gradient layer, and a protective layer stacked in sequence along the stacking direction; The scattering layer is provided with a scattering structure through which electromagnetic waves can pass, so that the electromagnetic waves diverge in all directions after passing through the scattering structure. The material of the scattering layer is any one of metal materials such as copper, aluminum, titanium, zinc, iron, nickel, chromium, cobalt, silver, or gold, or an alloy material of two or more of them; The impedance of the scattering structure is a first impedance value, the impedance of the protective layer is a second impedance value, and the impedance of the impedance gradient layer gradually changes from the first impedance value to the second impedance value along the stacking direction; A plurality of second through-holes penetrating the scattering layer are formed in the scattering layer. The second through-holes can allow electromagnetic waves to pass through. The second through-holes are filled with a second dielectric material, and the aperture of the second through-holes is smaller than the wavelength of the electromagnetic waves.

2. The diffusing film according to claim 1, characterized in that, The impedance gradient layer includes n sub-layers, namely the first sub-layer to the nth sub-layer stacked in sequence along the stacking direction. The impedance of the first sub-layer in contact with the scattering layer is the first impedance value, and the impedance of the nth sub-layer in contact with the protective layer is the second impedance value. The impedance of the first sub-layer to the nth sub-layer gradually changes along the stacking direction, where n≥3.

3. The diffusing film according to claim 2, characterized in that, Each of the sub-layers is made of a different base material, and the impedance of each of the base materials gradually changes along the stacking direction.

4. The diffusing film according to claim 2, characterized in that, Each of the sub-layers is made of the same base material. A plurality of first through-holes penetrating the sub-layer are formed in each of the sub-layers. The volumes of the first through-holes on the same sub-layer are the same, and the volumes and / or numbers of the first through-holes on different sub-layers are different, so that the impedance of the first sub-layer to the nth sub-layer gradually changes along the stacking direction.

5. The diffusing film according to claim 4, characterized in that, The volumes of the first through-holes on each sub-layer are the same, and the numbers of the first through-holes on different sub-layers gradually decrease along the stacking direction.

6. The diffusing film according to claim 4, characterized in that, The numbers of the first through-holes formed in each of the sub-layers are equal, the volumes of the first through-holes on the same sub-layer are the same, and the volumes of the first through-holes on different sub-layers gradually decrease along the stacking direction.

7. The diffusing film according to claim 2, characterized in that, Each sub-layer is made of the same base material. First through-holes penetrating the sub-layer are formed in each sub-layer. The volumes of the first through-holes are the same, and the numbers of the first through-holes formed in each sub-layer are equal; The first through-holes are filled with a first dielectric material. The dielectric constants of the first dielectric materials filled in the first through-holes on the same sub-layer are the same, and the dielectric constants of the first dielectric materials filled in the first through-holes on different sub-layers gradually increase along the stacking direction.

8. The diffusing film according to claim 1, characterized in that, The number and / or aperture of the second through-holes show a continuous change trend in at least one preset direction, and the preset direction is any direction within the surface of the scattering layer.

9. The diffusing film according to any one of claims 1-7, characterized in that, A plurality of second through-holes penetrating the scattering layer are formed in the scattering layer. The second through-holes are filled with a second dielectric material. In at least one preset direction, the refractive index of the second dielectric material for the incident electromagnetic waves shows a trend of being smaller in the middle and larger on both sides, and the preset direction is any direction within the surface of the scattering layer.

10. The diffusing film according to claim 1, characterized in that, It further includes a first convex structure, which is disposed on the side of the impedance gradient layer away from the scattering layer, and the first convex structure extends into the protective layer, and reflection occurs when electromagnetic waves pass through the first convex structure.

11. The diffusing film according to claim 10, characterized in that, The first convex structure includes a plurality of convex parts, and the distance between adjacent convex parts is less than the wavelength of the electromagnetic waves.

12. The diffusing film according to claim 1, characterized in that, It further includes a connection layer, which is disposed on the side of the scattering layer away from the impedance gradient layer.

13. The diffusing film according to claim 12, characterized in that, It further includes a second convex structure, which is disposed on the side of the scattering layer away from the impedance gradient layer, and the second convex structure extends into the connection layer.

14. The diffusing film according to claim 13, characterized in that, The material of the second convex structure is the same as that of the scattering layer.

15. An electronic device, characterized in that, It includes the scattering film according to any one of claims 1-14, and further includes an antenna device, and one surface of the antenna device is connected to the scattering film.

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