A packaging base and optical semiconductor device thereof

Abstract

The present invention relates to the field of electronic packaging technology, and specifically discloses a packaging base and an optical semiconductor device thereof, wherein the packaging base includes a substrate, a frame, a through hole, an optical fiber fixing member, a mounting portion, an input / output terminal, and a wire terminal; a mounting portion for mounting an optical semiconductor element is provided on the upper surface of the substrate; the frame is mounted on the upper surface of the substrate; the through hole is provided on a side wall of the frame; the optical fiber fixing member is inserted and fixed on the through hole; two mounting portions are provided, and the two mounting portions are respectively provided on the two side walls of the frame in the form of grooves; two input / output terminals are provided, and each input / output terminal is embedded in one of the mounting portions; the wire terminal is connected to the input / output terminal located outside the frame. The packaging base of the present invention reduces the possibility of cracking of the input / output terminal and ensures good air tightness of the packaging base.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic packaging, in particular to a packaging base and an optical semiconductor device thereof. Background Art

[0002] In recent years, fiber optic communication data has tended to be information-based and integrated, and the field of microelectronic packaging has developed rapidly. In fiber optic communication technology, semiconductor lasers are usually used as signal sources for fiber optic communication to convert electrical signals into optical signals and transmit them out. In order to introduce the laser generated by the semiconductor laser into the optical fiber, the semiconductor laser needs to be coupled and packaged into a certain packaging base. The butterfly packaging base is a typical microelectronic multi-pin packaging form, which has the characteristics of electrical connectivity and airtight packaging, and is widely used in the field of optical communications.

[0003] The frame and substrate for mounting the semiconductor tube in the butterfly package base are generally made of metal, while the input and output terminals are mainly made of ceramic materials. The thermal expansion coefficients of the two materials do not match, which easily generates excessive thermal stress when the temperature changes, causing the input and output terminals to crack due to excessive thermal stress, resulting in poor sealing of the package base and affecting the performance of the optical semiconductor device. Summary of the invention

[0004] The object of the present invention is to provide a package base and an optical semiconductor device thereof, which have a simple and compact structure, reduce the possibility of cracking of input and output terminals, and ensure good airtightness of the package base.

[0005] In order to solve the above technical problems, the present invention provides a packaging base, including a substrate, a frame, a through hole, an optical fiber fixing component, a mounting portion, an input-output terminal and a wire terminal; the substrate has an upper surface and a lower surface, and the upper surface of the substrate is provided with a mounting portion for mounting an optical semiconductor element; the frame is installed on the upper surface of the substrate in a manner surrounding the mounting portion; the through hole is opened on a side wall of the frame; the optical fiber fixing component is inserted and fixed on the through hole; two mounting portions are provided, and the two mounting portions are respectively provided on the two side walls of the frame in the form of grooves; two input-output terminals are provided, and each of the input-output terminals is embedded in one of the mounting portions for transmitting electrical signals; the wire terminal is connected to the input-output terminal located outside the frame.

[0006] Preferably, the input-output terminal has a rectangular flat plate portion and a vertical wall portion; wherein: the flat plate portion is embedded in the mounting portion, and a pad electrode is provided on the upper surface of the flat plate portion, and the pad electrode extends from one of the long sides of the upper surface of the flat plate portion to the other long side; the lower surface of the vertical wall portion is provided in the middle position of the upper surface of the flat plate portion, and the vertical wall portion spans the pad electrode along the long side of the flat plate; the pad electrodes located on both sides of the vertical wall portion serve as external connection ends of the pad electrode and internal connection ends of the pad electrode, respectively, wherein the distance between the external connection end and the carrier portion is greater than the distance between the internal connection end and the carrier portion; the wire terminal is connected to the external connection end.

[0007] Preferably, the ratio of the width of the flat plate portion to the width of the mounting portion is (4-5):1.

[0008] Preferably, the packaging base further includes a sealing ring, which is disposed on the upper surface of the frame body and clamps the input and output terminals together with the frame body.

[0009] Preferably, the ratio of the length of the mounting portion to the length of the input / output terminal is 1:(0.990-0.995).

[0010] Preferably, the mounting portion is joined to the input / output terminal through solder, and the solder at the joint of the front side and / or rear side of the input / output terminal extends toward the side of the input / output terminal outside the frame and the outer side of the frame to form a solder extension portion.

[0011] Preferably, the ratio of the width of the input / output terminal to the length of the solder extension portion is 1:(0.05-0.2).

[0012] Preferably, the input-output terminal comprises a rectangular flat plate portion and a vertical wall portion; the flat plate portion is embedded in the mounting portion, the lower surface of the vertical wall portion is vertically arranged in the middle position of the upper surface of the flat plate portion, and the long side of the vertical wall portion is parallel to the long side of the flat plate portion; the solder extension portion comprises a first extension portion corresponding to the flat plate portion and a second extension portion corresponding to the vertical wall portion; wherein: the ratio of the width of the flat plate portion to the length of the first extension portion is 1:(0.05~0.2); the ratio of the width of the vertical wall portion to the length of the second extension portion is 1:(0.05~0.2).

[0013] Preferably, metal layers are respectively provided on the front side and the rear side of the input / output terminal.

[0014] Preferably, a nickel layer and a gold layer are formed on the surface of the metal layer by sequential electroplating.

[0015] In order to solve the above problems, the present invention also provides an optical semiconductor device, including a packaging base as described in any of the above items, an optical semiconductor element arranged in the mounting portion, an optical fiber component connected to the optical fiber fixing piece, and a cover body covering the upper surface of the frame body.

[0016] The present invention has the following beneficial effects:

[0017] The packaging base of the present invention facilitates the production of the base, reduces production costs and improves production efficiency by adopting a splicing type of various parts, and a mounting portion is provided on the frame, and the input and output terminals are fixed in the mounting portion in an embedded manner, which facilitates the maintenance and replacement of the input and output terminals and also allows an appropriate gap to exist between the input and output terminals and the frame, thereby alleviating the phenomenon of excessive thermal stress caused by the mismatch of thermal expansion coefficients of the input and output terminals and the frame materials of the packaging base, reducing the possibility of cracking of the input and output terminals, and ensuring good air tightness of the packaging base. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a schematic structural diagram of a packaging base provided by an embodiment of the present invention;

[0019] Figure 2 is a schematic diagram of the frame structure of the packaging base provided by an embodiment of the present invention;

[0020] Figure 3 It is a schematic diagram of the input and output terminal structure of the packaging base provided by an embodiment of the present invention;

[0021] Figure 4 is a top view of a packaging base provided by an embodiment of the present invention;

[0022] Figure 5 yes Figure 4 The enlarged view of H;

[0023] Figure 6 is a schematic structural diagram of a packaging base provided by an embodiment of the present invention from another angle;

[0024] Figure 7 yes Figure 6 Enlarged view of point I.

[0025] Figure numerals: 1, substrate; 2, frame; 201, front side wall; 202, left side wall; 203, right side wall; 3, through hole; 4, optical fiber fixing member; 5, mounting portion; 6, input / output terminal; 601, flat plate portion; 602, vertical wall portion; 603, pad electrode; 604, first extension portion; 605, second extension portion; 7, wire terminal; 8, sealing ring. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0027] In the description of the present application, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0028] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0029] See also Figure 1 and Figure 2 A preferred embodiment of the present invention provides a packaging base, comprising a substrate 1, a frame 2, a through hole 3, an optical fiber fixing member 4, a mounting portion 5, an input-output terminal 6 and a wire terminal 7; the substrate 1 has an upper surface and a lower surface, and the upper surface of the substrate 1 is provided with a mounting portion for mounting an optical semiconductor element; the frame 2 is mounted on the upper surface of the substrate 1 in a manner surrounding the mounting portion; the through hole 3 is opened on a side wall of the frame 2; the optical fiber fixing member 4 is inserted and fixed on the through hole 3; two mounting portions 5 are provided, and the two mounting portions 5 are respectively provided on the two side walls of the frame 2 in the form of grooves; two input-output terminals 6 are provided, and each of the input-output terminals 6 is embedded in one of the mounting portions 5 for transmitting electrical signals; the wire terminal 7 is connected to the input-output terminal 6 located outside the frame 2.

[0030] Based on the above scheme, the assembly method of the packaging base of the preferred embodiment of the present invention is as follows: the frame 2 is soldered to the substrate 1 in a manner surrounding the loading portion to form a semiconductor element accommodating cavity; the optical fiber fixing part is soldered to the through hole 3 of the frame 2 by solder; the wire terminal 7 is welded to the pad electrode 603, and the input and output terminal 6 is soldered to the mounting portion 5 of the frame 2 by solder.

[0031] See also Figure 3 As a preferred embodiment, the input / output terminal 6 has a rectangular flat plate portion 601 and a vertical wall portion 602; wherein: the flat plate portion 601 is embedded in the mounting portion 5, and a pad electrode 603 is provided on the upper surface of the flat plate portion 601, and the pad electrode 603 extends from one long side of the upper surface of the flat plate portion 601 to the other long side; the lower surface of the vertical wall portion 602 is provided in the middle position of the upper surface of the flat plate portion 601, and the vertical wall portion 602 crosses the pad electrode 603 along the long side direction of the flat plate portion 601; the pad electrodes 603 located on both sides of the vertical wall portion 602 serve as external connection ends of the pad electrode 603 and internal connection ends of the pad electrode 603, respectively, wherein the distance between the external connection end and the carrier portion is greater than the distance between the internal connection end and the carrier portion; the guide terminal is connected to the external connection end.

[0032] Specifically, the structure of the flat plate portion 601 and the vertical wall portion 602 can disperse the stress of the input / output terminal 6, thereby ensuring the overall stability of the input / output terminal 6 and reducing the possibility of cracking thereof.

[0033] As a preferred solution, the ratio of the width a of the flat plate portion 601 to the width b of the mounting portion 5 is (4-5):1.

[0034] Specifically, if the ratio of the width a of the flat plate portion 601 to the width b of the mounting portion 5 is too small, the sealing surface is too small, too much solder is accumulated, the thermal expansion coefficient of the solder is poorly matched with the ceramic part, and reliability testing is likely to cause ceramic cracks;

[0035] If the ratio of the two is too large, the sealing surface will be too large and the stress will be reduced, but the position will be too large and the device mounting area will become smaller, which is not conducive to the installation of semiconductor components.

[0036] As a preferred solution, the package base further includes a sealing ring 8, which is disposed on the upper surface of the frame 2 and clamps the input / output terminal 6 with the frame 2. Specifically, the sealing ring 8 is soldered to the upper surface of the frame 2 by solder, and the input / output terminal 6 is clamped between the sealing ring 8 and the frame 2 to ensure the sealing inside the frame 2.

[0037] As a preferred solution, the ratio of the length c of the mounting portion 5 to the length d of the input / output terminal 6 is 1:(0.990-0.995).

[0038] Specifically, if the ratio of the length c of the mounting portion 5 to the length d of the input / output terminal 6 is greater than 1:0.990, the gap between the input / output terminal 6 and the side wall of the mounting portion 5 is too large, and the amount of solder filled is too large. When the package base is subjected to high temperature impact, the expansion amount of the solder and the metal frame 2 / ceramic input / output terminal 6 is very different, and the ceramic part is prone to cracking due to thermal stress;

[0039] If the ratio of the length c of the mounting portion 5 to the length d of the input / output terminal 6 is less than 1:0.995, the gap between the input / output terminal 6 and the side wall of the mounting portion 5 is too small, the assembly of the input / output terminal 6 and the frame 2 is restricted, and mechanical cracking is easily caused during operation.

[0040] See also Figures 4 to 7 As a preferred solution, the mounting portion 5 is joined to the input / output terminal 6 by solder, and the solder at the joint of the front side and / or rear side of the input / output terminal extends toward the side direction of the input / output terminal 6 outside the frame 2 and the outer side direction of the frame 2 to form a solder extension portion.

[0041] Specifically, the solder extension portion can prevent cold solder joints from occurring between the mounting portion 5 and the input / output terminal 6 , thereby ensuring the airtightness of the package base.

[0042] As a preferred solution, the ratio of the width of the input / output terminal 6 to the length of the solder extension is 1:(0.05-0.2). Specifically, if the ratio of the width of the input / output terminal 6 to the length of the solder extension is greater than 1:0.05, the solder will not be wetted enough, the strength of the solder joint will decrease, and a cold solder layer will be easily formed. Insufficient solder strength will easily lead to poor air tightness.

[0043] If the ratio of the width of the input / output terminal 6 to the length of the solder extension portion is less than 1:0.2, there will be too much solder accumulation, the size of the solder extension portion will be too large, the package base will be subjected to high temperature shock, and the ceramic body of the input / output terminal 6 will be easily affected by thermal stress, causing micro cracks to form at the position where the flat plate portion 601 and the vertical wall portion 602 are combined. After the micro cracks expand and extend, the airtightness of the package base will be poor.

[0044] As a preferred embodiment, the input / output terminal 6 has a rectangular flat portion 601 and a vertical wall portion 602; the flat portion 601 is embedded in the mounting portion 5, the lower surface of the vertical wall portion 602 is vertically arranged in the middle position of the upper surface of the flat portion 601, and the long side of the vertical wall portion 602 is parallel to the long side of the flat portion 601; the solder extension portion includes a first extension portion 604 corresponding to the flat portion 601 and a second extension portion 605 corresponding to the vertical wall portion 602; wherein: the ratio of the width a of the flat portion 601 to the length e of the first extension portion 604 is 1: (0.05~0.2); the ratio of the width f of the vertical wall portion 602 to the length g of the second extension portion 605 is 1: (0.05~0.2).

[0045] Specifically, if the ratio of the width a of the flat plate portion 601 to the length e of the first extension portion 604 is greater than 1:0.05, the solder will not be wetted enough, the strength of the welded joint will decrease, and a cold solder joint layer will be easily formed. Insufficient welding strength will easily lead to poor air tightness.

[0046] If the ratio of the width a of the flat plate portion 601 to the length e of the first extension portion 604 is less than 1:0.2, the solder is too much accumulated, the size of the solder extension portion is too large, the package base is subjected to high temperature shock, and the ceramic body of the input and output terminals 6 is easily affected by thermal stress, so that micro cracks are generated at the position where the flat plate portion 601 and the vertical wall portion 602 are combined. After the micro cracks are extended, the airtightness of the package base is poor.

[0047] The relationship between the vertical wall portion 602 and the second extending portion 605 is similar to that between the flat plate portion 601 and the first extending portion 604 .

[0048] As a preferred solution, the through hole 3 is provided on the front side wall 201 of the frame body 2 ; and the mounting portion 5 is symmetrically provided on the left side wall 202 and the right side wall 203 of the frame body 2 .

[0049] As a preferred solution, metal layers are respectively provided on the front side and the rear side of the input / output terminal 6 .

[0050] As a preferred solution, a nickel layer and a gold layer are formed on the surface of the metal layer by electroplating in sequence.

[0051] As a preferred solution, a metal layer is formed on the lower surface of the flat plate portion 601 and the upper surface of the vertical wall portion 602 .

[0052] As a preferred solution, the through hole 3 is provided on the front side wall 201 of the frame body 2 ; and the mounting portion 5 is symmetrically provided on the left and right side walls of the frame body 2 .

[0053] As a preferred solution, a nickel layer and a gold layer are formed on the surface of the pad electrode 603 by electroplating in sequence.

[0054] Specifically, the materials of various parts of the preferred embodiment of the present invention are shown in Table 1:

[0055] Table 1

[0056]

[0057] A preferred embodiment of the present invention further provides an optical semiconductor device, comprising a packaging base as described in any one of the above items, an optical semiconductor element arranged in the mounting portion, an optical fiber component connected to the optical fiber fixing piece, and a cover body covering the upper surface of the frame body 2.

[0058] Based on the above scheme, the package base is tested for indicators, as follows:

[0059] Test indicators: air tightness;

[0060] Test method: After the package base is sealed and welded to the cover, a 2-hour helium pressure test is carried out at 0.5Mpa, and a helium leak tester is used to detect gas leakage; when the test result is less than 1*10^-9Pa.m3 / s, it is qualified.

[0061] The test results are shown in Table 2:

[0062] Table 2

[0063]

[0064] It can be seen from the test results in Table 2 that when the ratio of the length of the input / output terminal 6 to the length of the mounting portion 5 is (0.990-0.995):1 and the ratio of the extension length of the solder extension portion to the width of the vertical wall is (0.05-0.2):1, the airtightness of the package base is stable and reliable.

[0065] The assembly process of the present invention is as follows: the frame 2 is soldered to the substrate 1 in a manner surrounding the loading portion to form a semiconductor element accommodating cavity; the optical fiber fixing part is soldered to the through hole 3 of the frame 2; the wire terminal 7 is soldered to the pad electrode 603, and the input / output terminal 6 is soldered to the mounting portion 5 of the frame 2.

[0066] In summary, the preferred embodiment of the present invention provides a packaging base, which, compared with the prior art:

[0067] The packaging base of the present invention facilitates the production of the base, reduces production costs and improves production efficiency by adopting a splicing type of various parts, and a mounting portion 5 is provided on the frame 2, and the input / output terminals 6 are fixed in the mounting portion 5 in an embedded manner, which facilitates the maintenance and replacement of the input / output terminals 6 and also allows a proper gap to exist between the input / output terminals 6 and the frame 2, thereby alleviating the phenomenon of excessive thermal stress of the packaging base caused by the mismatch in thermal expansion coefficients of the input / output terminals 6 and the frame 2, reducing the possibility of cracking of the input / output terminals 6, and ensuring good airtightness of the packaging base.

[0068] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principles of the present invention. These improvements and substitutions should also be regarded as the scope of protection of the present invention.

Claims

1. A packaging base, Features: include: a substrate having an upper surface and a lower surface, wherein a mounting portion for mounting an optical semiconductor element is provided on the upper surface of the substrate; a frame body mounted on the upper surface of the substrate in a manner surrounding the mounting portion; A through hole is formed on a side wall of the frame; An optical fiber fixing member, which is inserted into and fixed on the through hole; There are two mounting parts, and the two mounting parts are respectively arranged on the two side walls of the frame in the form of grooves; Two input / output terminals are provided, and each of the input / output terminals is embedded in one of the mounting parts and is used for transmitting electrical signals; A lead terminal connected to an input / output terminal outside the frame; The input / output terminal is composed of a pad electrode, a rectangular flat plate portion and a vertical wall portion; wherein: The flat plate portion is embedded in the mounting portion, and a pad electrode is disposed on the upper surface of the flat plate portion, and the pad electrode extends from one long side of the upper surface of the flat plate portion to the other long side; The lower surface of the vertical wall portion is arranged at the middle position of the upper surface of the flat plate portion, and the vertical wall portion crosses the pad electrode along the long side direction of the flat plate; the pad electrodes located on both sides of the vertical wall portion serve as the external connection end of the pad electrode and the internal connection end of the pad electrode respectively, wherein the distance between the external connection end and the carrier portion is greater than the distance between the internal connection end and the carrier portion; the lead terminal is connected to the external connection end; The ratio of the width of the flat plate portion to the width of the mounting portion is (4-5):1; the ratio of the length of the mounting portion to the length of the input / output terminal is 1:(0.990-0.995); The mounting portion is joined to the input / output terminal by solder, and the solder at the joint of the front side and / or the rear side of the input / output terminal extends toward the side of the input / output terminal outside the frame and the outer side of the frame to form a solder extension portion; The ratio of the width of the input / output terminal to the length of the solder extension portion is 1:(0.05-0.2).

2. The package base according to claim 1, Features The packaging base also includes a sealing ring, which is arranged on the upper surface of the frame and clamps the input and output terminals together with the frame.

3. The package base according to claim 1, Features : The input / output terminal comprises a rectangular flat plate portion and a vertical wall portion; the flat plate portion is embedded in the mounting portion, the lower surface of the vertical wall portion is vertically arranged at the middle position of the upper surface of the flat plate portion, and the long side of the vertical wall portion is parallel to the long side of the flat plate portion; the solder extension portion comprises a first extension portion corresponding to the flat plate portion and a second extension portion corresponding to the vertical wall portion; wherein: The ratio of the width of the flat plate portion to the length of the first extension portion is 1:(0.05-0.2); The ratio of the width of the vertical wall portion to the length of the second extension portion is 1:(0.05-0.2).

4. The package base according to claim 1, Features : A metal layer is respectively arranged on the front side and the rear side of the input and output terminals.

5. An optical semiconductor device, Features: The invention comprises the package base according to any one of claims 1 to 4, an optical semiconductor element provided in the mounting portion, an optical fiber component connected to the optical fiber fixture, and a cover body provided on the upper surface of the frame body.

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