Data center chip-level cooling device based on pulsating heat pipe and manufacturing method thereof

Abstract

The present invention discloses a data center chip-level cooling device based on a pulsating heat pipe and a manufacturing method thereof. The device includes: a condenser; an evaporation end, an adiabatic section, and a condensation end formed by bending the pulsating heat pipe; the adiabatic section is arranged between the evaporation end and the condensation end; the condenser is arranged above the chip and is used to conduct the heat generated by the chip to the evaporation end. The condenser is composed of upper and lower cover plates, and the pulsating heat pipe at the evaporation end is encapsulated between the upper and lower cover plates of the condenser; the gap between the condenser and the evaporation end of the pulsating heat pipe is filled with a material with high thermal conductivity. Thereby, efficient cooling of high-power chips in the data center is achieved, the optimal operating temperature is reached, the stable and reliable operation of the data center is ensured, the data center is made more energy-efficient and more environmentally friendly, and the development of big data and the Internet is further promoted.

Description

Technical Field

[0001] The present invention relates to the technical field of chip cooling, and particularly relates to a data center chip-level cooling device based on a pulsating heat pipe and a manufacturing method thereof. Background Art

[0002] With the rapid development of computer and Internet technologies, the construction of data centers has been continuously developing. The integration and powerization pose new challenges to the low-energy consumption and high-efficiency cooling of global data centers for stable operation. Traditional data center cooling uses precision air conditioners to cool the computer room, that is, to cool the equipment and chips in the computer room through air cooling. With the continuous increase in the heat flux density of data centers, liquid cooling technologies have been adopted. There is immersion liquid cooling, that is, directly contacting the coolant with high heat flux density chips, and there is also indirect liquid cooling, which uses liquid cooling to remove heat by setting microchannels at the chip end. Due to its high thermal conductivity, heat pipes have also been applied to data center heat dissipation, with mostly separated heat pipes, and there are also a few heat pipe end coolings for chip-level.

[0003] The traditional cooling method using precision air conditioners is through mechanical vapor compression air cooling, which has problems such as huge energy consumption, low air heat transfer coefficient, long distance between the cold source and the heat source, and uneven heat dissipation. The insufficient air heat transfer coefficient, the insufficient distance between the cold source and the heat source, and uneven heat dissipation lead to a further increase in the air conditioner power, an increase in power consumption, and an excessively high Power Usage Effectiveness (PUE) value of the data center, forming a vicious cycle. The pure air conditioner air cooling technology is the most mature and simplest, but the least energy-saving, with the worst temperature control and the worst stable operation ability of the computer room. Liquid cooling has high efficiency and improved thermal conductivity. Especially when two-phase heat transfer of gas and liquid occurs, the thermal conductivity is increased by 2 - 3 orders of magnitude. However, for electronic devices, especially data center chips, liquid cooling has the problem of liquid leakage. Once the liquid working medium leaks, the data center will not be able to operate, and it is necessary to consider sealing and leakage prevention problems, which increases the complexity of the equipment pipeline and raises the cost. At the same time, due to the circulation of liquid cooling, power drive is required, which will also lead to an increase in the PUE value and is not green and energy-saving enough. The heat pipe system can achieve high-efficiency heat conduction without external energy, has good energy efficiency and cooling capacity, and has no interference with the indoor environment. Currently, the heat pipes applied in data centers are mainly separated heat pipes, and a small part are traditional tubular heat pipes. On the one hand, the existing heat pipes fail to directly dissipate heat deep into the chip heat source end, and the chip and the heat pipe can be in closer contact, and the chip cooling performance needs to be further improved. On the other hand, the efficiency of traditional heat pipes is not as good as that of pulsating heat pipes, and there is still room for further optimization in terms of the structural size of traditional heat pipes and their cooperation with the chip heat source end. In related technologies, it is proposed to use pulsating heat pipes to cool chips, but the way of its circular winding and fan matching is only applicable to the cooling of chips inside personal computers and cannot meet the heat dissipation and usage requirements of high-power chips in data centers. Summary of the Invention

[0004] The present invention aims to solve at least one of the technical problems in the related art to some extent.

[0005] To this end, an object of the present invention is to provide a data center chip-level cooling device based on a pulsating heat pipe, which is used for data center chip-level thermal management, can ensure the efficient and stable operation of high-power chips within a normal temperature range, reduce the energy consumption of the data center, and ensure the stable and reliable operation of the data center.

[0006] Another object of the present invention is to provide a manufacturing method for a data center chip-level cooling device based on a pulsating heat pipe.

[0007] To achieve the above object, an embodiment of one aspect of the present invention provides a data center chip-level cooling device based on a pulsating heat pipe, including: a condenser; an evaporation end, an adiabatic section, and a condensation end formed by bending the pulsating heat pipe;

[0008] The adiabatic section is arranged between the evaporation end and the condensation end;

[0009] The condenser is arranged above the chip and is used to conduct the heat generated by the chip to the evaporation end. The condenser is composed of two upper and lower cover plates, and the pulsating heat pipe at the evaporation end is encapsulated between the upper and lower cover plates of the condenser;

[0010] The gap between the condenser and the evaporation end of the pulsating heat pipe is filled with a material with high thermal conductivity.

[0011] In addition, the data center chip-level cooling device based on a pulsating heat pipe according to the above embodiment of the present invention may further have the following additional technical features:

[0012] Further, the adiabatic section is bent to form a stepped structure with a height difference between the upper and lower parts.

[0013] Further, both the upper and lower cover plates of the condenser are provided with grooves having the same size as the evaporation end of the pulsating heat pipe.

[0014] Further, a liquid filling port is provided on the pulsating heat pipe of the adiabatic section.

[0015] Further, the pulsating heat pipe is formed by bending a capillary tube. The evaporation end and the condensation end of the pulsating heat pipe are flattened capillary tubes, and the capillary tube is a metal tube with a smooth inner wall, and the material includes a metal or a metal alloy.

[0016] Further, the working fluid of the pulsating heat pipe is selected according to the working temperature range of the high-power chip, and includes a single solution of water or ethanol or a nanofluid mixture.

[0017] Further, the geometric dimensions of the pulsating heat pipe are determined according to the package size of the chip, the heat flux density, and the working temperature requirements.

[0018] Further, the high thermal conductivity material includes thermal grease or liquid metal.

[0019] Further, the condensation end is connected to a secondary heat dissipation device connected to the outside of the data center rack.

[0020] To achieve the above object, another embodiment of the present invention provides a manufacturing method of a data center chip-level cooling device based on a pulsating heat pipe, including:

[0021] Select a capillary tube with the required pipe diameter, total length, and material. After cleaning, removing dirt, and drying, put protective sleeves on both ends of the capillary tube;

[0022] Use a bending machine to bend the capillary tube, flatten the capillary tubes at the evaporation end and the condensation end, and reserve a liquid filling port at the outermost periphery of the adiabatic section;

[0023] Select two metal blocks corresponding to the chip size, use micro milling to groove the surfaces of the metal blocks. The groove size is the same as that of the capillary tube at the evaporation end. After grooving, perform degreasing and cleaning to obtain the upper and lower covers of the condenser;

[0024] Apply a high thermal conductivity material to the evaporation end, then cooperate and press it with the upper and lower covers of the condenser, and use welding to fixedly connect the condenser and the pulsating heat pipe;

[0025] Through a four-way valve, evacuate and then fill the pulsating heat pipe with liquid. After the liquid filling is completed, solder-seal the liquid filling port to complete the manufacture of the entire heat dissipation device.

[0026] The data center chip-level cooling device based on a pulsating heat pipe and its manufacturing method according to the embodiments of the present invention have the following advantages:

[0027] (1) Extremely high heat transfer efficiency. The highest heat transfer efficiency of the pulsating heat pipe can reach 90%, while the heat transfer efficiency of traditional heat pipes is usually 60% - 70%, far exceeding air-cooled air conditioners and single-phase liquid cooling methods, ensuring efficient heat dissipation of the chip;

[0028] (2) Higher anti-dry-burning ability. Once traditional heat pipes are overloaded and dry-burned, the entire heat pipe cannot work properly. However, the pulsating heat pipe has multiple circulation sections. If dry-burning occurs, it first occurs in one or several evaporation pipe sections, and then gradually spreads to the entire evaporation end. Therefore, it has the effect of delaying dry-burning;

[0029] (3) The pulsating heat pipe has excellent temperature uniformity. The pulsating heat pipe formed by bending a single capillary tube has a good pulsating circulation heat transfer inside. Through the transfer of sensible heat and latent heat, the evaporation end can achieve better temperature uniformity, thus realizing uniform cooling of the heat source;

[0030] (4) Good adaptability and safety. The working mode of the pulsating heat pipe changes according to the change of the chip heat flux. Within a certain range, the greater the heat flux, the better the circulating flow performance, the higher the heat transfer efficiency, and there is no leakage risk compared with liquid cooling, which is safe and reliable;

[0031] (5) Simple, variable and compact structure. The pulsating heat pipe is in the shape of a long capillary tube and can be flexibly bent, flattened, etc. according to the working requirements to change its structure. Since the diameter of the pulsating heat pipe is small, it can achieve a compact and highly integrated heat dissipation effect;

[0032] (6) Low manufacturing cost and good economy. The pulsating heat pipe is a smooth tube, and this device can be completed by conventional means such as milling, vacuum pumping and welding in the manufacturing process, which is easy for batch production. During use, no external energy is required to drive it, and the PUE of the data center is lower and more environmentally friendly.

[0033] Additional aspects and advantages of the present invention will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present invention. Description of the Drawings

[0034] The above-mentioned and / or additional aspects and advantages of the present invention will become apparent and easy to understand from the following description of the embodiments in conjunction with the drawings, in which:

[0035] Figure 1 Schematic diagram of the structure of a data center chip-level cooling device based on a pulsating heat pipe according to an embodiment of the present invention;

[0036] Figure 2 Schematic diagram of the evaporation end, adiabatic section and condensation end according to an embodiment of the present invention;

[0037] Figure 3 Schematic diagram of the structure of a data center chip-level cooling device based on a pulsating heat pipe according to another embodiment of the present application;

[0038] Figure 4 Schematic diagram of the evaporation end, adiabatic section and condensation end according to another embodiment of the present application;

[0039] Figure 5 Flow chart of the manufacturing method of a data center chip-level cooling device based on a pulsating heat pipe according to an embodiment of the present invention. Detailed Embodiments

[0040] Embodiments of the present invention will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to explain the present invention, and should not be construed as limiting the present invention.

[0041] Next, a data center chip-level cooling device based on a pulsating heat pipe and a manufacturing method thereof according to an embodiment of the present invention will be described with reference to the accompanying drawings.

[0042] First, a data center chip-level cooling device based on a pulsating heat pipe according to an embodiment of the present invention will be described with reference to the accompanying drawings.

[0043] Figure 1 FIG. is a schematic structural diagram of a data center chip-level cooling device based on a pulsating heat pipe according to an embodiment of the present invention.

[0044] Figure 2 FIG. is a schematic diagram of an evaporation end, an adiabatic section, and a condensation end according to an embodiment of the present application.

[0045] As Figure 1 and Figure 2 shown, the data center chip-level cooling device based on a pulsating heat pipe includes: a condenser; an evaporation end, an adiabatic section, and a condensation end formed by bending the pulsating heat pipe.

[0046] The adiabatic section is disposed between the evaporation end and the condensation end.

[0047] The condenser is disposed above the chip and is used to conduct the heat generated by the chip to the evaporation end. The condenser is composed of upper and lower cover plates, and the pulsating heat pipe at the evaporation end is encapsulated between the upper and lower cover plates of the condenser.

[0048] The gap between the condenser and the evaporation end of the pulsating heat pipe is filled with a material having high thermal conductivity.

[0049] It can be understood that the pulsating heat pipe is a new type of heat transfer device with a simple structure. The working fluid inside it absorbs heat to form a gas plug and releases heat to form a liquid plug. Its heat transfer is achieved through the sensible heat and latent heat of phase change of the working fluid, as well as the oscillation between the gas plug / liquid plug. Its heat transfer effect is better than that of traditional heat pipes.

[0050] Furthermore, in a specific embodiment of the present application, the pulsating heat pipe can be bent in the middle adiabatic section to form a stepped structure with different heights up and down, as Figure 3 and Figure 4 shown.

[0051] In Figure 3 , on the side of the adiabatic section close to the evaporation end, the pulsating heat pipe is bent to form a stepped structure with different heights, and the adiabatic section is higher than the evaporation end.

[0052] It is understandable that a stepped pulsating heat pipe can further improve the anti-gravity performance, promote the pulsating cycle, and enhance the heat transfer performance.

[0053] It should be noted that the stepped structure is not limited to the above-listed embodiments, and the pulsating heat pipe can be bent according to the actual situation, so as to avoid spatial interference of electronic components inside the data center server.

[0054] As Figure 1 shown, the pulsating heat pipe is formed by bending a capillary tube. The evaporation end and the condensation end of the pulsating heat pipe are flattened capillary tubes. The capillary tube is a metal tube with a smooth inner wall, and its material can be metals such as copper and aluminum or metal alloys.

[0055] The pulsating heat pipe in the adiabatic section is provided with a liquid filling port, and the working fluid of the pulsating heat pipe is selected according to the working temperature range of the high-power chip, and can be a single solution such as water and ethanol or a nanofluid mixture.

[0056] The geometric dimensions of the pulsating heat pipe are determined according to the package size, heat flux density and working temperature requirements of the specific high-power chip.

[0057] The condenser is determined according to the specific structure of the pulsating heat pipe. It mainly consists of two upper and lower cover plates. Both the upper and lower cover plates are provided with grooves having the same size as the evaporation end of the pulsating heat pipe. The condenser formed by the upper and lower cover plates is packaged with the evaporation end of the pulsating heat pipe.

[0058] The gap between the condenser and the evaporation end of the pulsating heat pipe is filled with a material having high thermal conductivity, which can be thermal grease or liquid metal.

[0059] Furthermore, the condensation end is connected to a secondary heat dissipation device connected to the outside of the data center rack.

[0060] Specifically, the power chip generates heat, which is conducted to the evaporation end of the pulsating heat pipe through the condenser. The excellent thermal conductivity of the pulsating heat pipe is used to quickly transfer the heat away from the chip, and finally the heat is transferred to the condensation end, and the heat is taken away by the secondary heat dissipation device connected to the outside of the data center rack, so as to realize the rapid heat dissipation of the high-power chip and ensure the efficient operation of the chip.

[0061] It should be noted that the specific capillary tube material and structural dimensions of the pulsating heat pipe, as well as the type of the working fluid, can all be changed and selected according to the heat dissipation of the specific high-power chip in the data center and the actual operation requirements. The heat dissipation method at the condensation end of the pulsating heat pipe can be flexibly selected from a separated heat pipe, liquid cooling, a fan, etc. according to the actual data center conditions, and the present application does not make specific limitations.

[0062] The data center chip-level cooling device based on a pulsating heat pipe according to an embodiment of the present invention is used for data center chip-level thermal management. It can quickly export the heat generated by the operation of high-power chips through the pulsating heat pipe, thereby ensuring the efficient and stable operation of high-power chips within the normal temperature range, reducing the energy consumption of the data center, and ensuring the stable and reliable operation of the data center.

[0063] Next, a manufacturing method of the data center chip-level cooling device based on a pulsating heat pipe according to an embodiment of the present invention will be described with reference to the accompanying drawings.

[0064] Figure 5 FIG. is a flowchart of a manufacturing method of a data center chip-level cooling device based on a pulsating heat pipe according to an embodiment of the present invention.

[0065] As Figure 5 shown, the manufacturing method of the data center chip-level cooling device based on a pulsating heat pipe includes the following steps:

[0066] S1. Select capillary tubes with the required pipe diameter, total length, and material. After cleaning, removing dirt, and drying, put protective sleeves on both ends of the capillary tubes.

[0067] S2. Use a bending machine to bend the capillary tubes according to the designed three-dimensional structure, and then flatten the capillary tubes at the evaporation end and the condensation end, leaving a liquid filling port at the outermost periphery of the adiabatic section.

[0068] S3. Take two metal blocks with a certain thickness and a size equivalent to that of the packaged high-power chip. Use micro milling to groove the surfaces of the metal blocks. The groove size is equivalent to that of the capillary tubes at the evaporation end. After grooving, perform degreasing and cleaning, and complete the upper and lower cover plates of the condenser.

[0069] S4. After applying a high thermal conductivity material to the evaporation end, cooperate and press it tightly with the upper and lower cover plates of the condenser, and then use a welding method to fixedly connect the condenser and the pulsating heat pipe.

[0070] S5. Through a four-way valve, evacuate and then fill the pulsating heat pipe with liquid. After filling, solder and seal the liquid filling port to complete the manufacture of the entire heat dissipation device.

[0071] It should be noted that the foregoing explanations of the device embodiments also apply to the method of this embodiment, and will not be repeated here.

[0072] The manufacturing method of the data center chip-level cooling device based on a pulsating heat pipe according to an embodiment of the present invention. The data center chip-level cooling device manufactured by this method can achieve efficient cooling of high-power chips in the data center, reach its optimal operating temperature, ensure the stable and reliable operation of the data center, make the data center more energy-saving and more environmentally friendly, and further promote the development of big data and the Internet.

[0073] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0074] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0075] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present invention.

Claims

1. A manufacturing method of a chip-level cooling device for a data center based on a pulsating heat pipe, characterized in that, it includes the following steps: Select a capillary tube with the required pipe diameter, total length and material. After cleaning, removing dirt and drying, put protective sleeves on both ends of the capillary tube; Use a bending machine to bend the capillary tube, flatten the capillary tubes at the evaporation end and the condensation end, and reserve a liquid filling port at the outermost periphery of the adiabatic section; Select two metal blocks corresponding to the chip size, use micro milling to groove the surface of the metal blocks, the groove size is the same as the capillary tube size at the evaporation end, and perform degreasing cleaning after grooving to obtain the upper and lower covers of the condenser; After applying a high thermal conductivity material to the evaporation end, cooperate and press it with the upper and lower covers of the condenser, and use welding to fixedly connect the condenser and the pulsating heat pipe; Through a four-way valve, evacuate and then fill the pulsating heat pipe with liquid. After the liquid filling is completed, solder-seal the liquid filling port to complete the manufacture of the entire heat dissipation device.

2. A chip-level cooling device for a data center based on a pulsating heat pipe, characterized in that, it is a cooling device obtained by using the manufacturing method of the chip-level cooling device for a data center based on a pulsating heat pipe as described in claim 1. The cooling device includes: a condenser; an evaporation end, an adiabatic section and a condensation end formed by bending the pulsating heat pipe; the adiabatic section is arranged between the evaporation end and the condensation end; the condenser is arranged above the chip and is used to conduct the heat generated by the chip to the evaporation end. The condenser is composed of upper and lower covers, and the pulsating heat pipe at the evaporation end is encapsulated between the upper and lower covers of the condenser; The gap between the condenser and the evaporation end of the pulsating heat pipe is filled with a high thermal conductivity material.

3. The device according to claim 2, characterized in that, the adiabatic section is bent to form a stepped structure with upper and lower height differences.

4. The device according to claim 2, characterized in that, both the upper and lower covers of the condenser are provided with grooves having the same size as the evaporation end of the pulsating heat pipe.

5. The device according to claim 2, characterized in that, the pulsating heat pipe at the adiabatic section is provided with a liquid filling port.

6. The device according to claim 2, characterized in that, the pulsating heat pipe is formed by bending a capillary tube. The evaporation end and the condensation end of the pulsating heat pipe are flattened capillary tubes. The capillary tube is a metal tube with a smooth inner wall, and the material includes metal or metal alloy.

7. The device according to claim 2, characterized in that, the working fluid of the pulsating heat pipe is selected according to the working temperature range of the high-power chip, and includes a single solution of water or ethanol or a nanofluid mixture.

8. The device according to claim 2, characterized in that, the geometric size of the pulsating heat pipe is determined according to the package size, heat flux density and working temperature requirements of the chip.

9. The device according to claim 2, characterized in that, the high thermal conductivity material includes thermal conductive silicone grease or liquid metal.

10. The device according to claim 2, characterized in that, the condensation end is connected to a secondary heat dissipation device connected to the outside of the data center rack.

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