Electronic component embedded substrate

Abstract

The present invention provides an electronic component embedded substrate, the electronic component embedded substrate comprising: a core member including a first wiring layer, a first insulating layer covering the first wiring layer and having a first through portion, a second wiring layer arranged on the first insulating layer, and a second insulating layer arranged on the first insulating layer and having a second through portion exposing at least a portion of the second wiring layer; a first electronic component arranged in the first through portion; a second electronic component arranged in the second through portion; and an insulating resin covering at least a portion of each of the first electronic component and the second electronic component. The second wiring layer includes a first wiring pattern having a portion covered by the second insulating layer and a second wiring pattern having a portion covered by the insulating resin. The second electronic component is connected to the second wiring pattern.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2019-0167958 filed on December 16, 2019, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] The present disclosure relates to an electronic component embedded substrate. Background Art

[0003] Recently, since electronic devices such as smart phones, PCs, etc. are required to have high performance and high functionality, the number of electronic components to be mounted on a printed circuit board is increasing. Under such circumstances, in terms of miniaturization and thinning of electronic devices, shortening of connection paths between electronic components, improvement of noise, etc., a technology of an electronic component embedded substrate for embedding electronic components such as passive components, active components, etc. in a printed circuit board has been developed. In such an electronic component embedded substrate, a structure for increasing the number of electronic components embedded therein is required. Summary of the invention

[0004] An aspect of the present disclosure is to provide an electronic component embedded substrate that includes a plurality of electronic components and allows for miniaturization and thinning of products.

[0005] Another aspect of the present disclosure is to provide an electronic component embedded substrate having improved freedom of wiring design.

[0006] According to one aspect of the present disclosure, an electronic component embedded substrate includes: a core member including a first wiring layer, a first insulating layer covering the first wiring layer and having a first through portion, a second wiring layer disposed on the first insulating layer, and a second insulating layer disposed on the first insulating layer and having a second through portion exposing at least a portion of the second wiring layer; a first electronic component disposed in the first through portion; a second electronic component disposed in the second through portion; and an insulating resin covering at least a portion of each of the first electronic component and the second electronic component. The second wiring layer includes a first wiring pattern and a second wiring pattern, in which at least a portion of the upper surface of the second wiring layer is covered by the second insulating layer, and in which at least a portion of the upper surface of the second wiring layer is covered by the insulating resin. The second electronic component is connected to the second wiring pattern. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] The above and other aspects, features and advantages of the present disclosure will be more clearly understood through the following detailed description taken in conjunction with the accompanying drawings, in which:

[0008] Figure 1 is an example of a block diagram schematically illustrating an electronic device system according to an example.

[0009] Figure 2 is a perspective view schematically illustrating an electronic device according to an example.

[0010] Figure 3 is a cross-sectional view schematically showing an electronic component embedded substrate 100A according to an example.

[0011] Figure 4 is a cross-sectional view schematically showing an electronic component embedded substrate 100B according to another example.

[0012] Figure 5 is a cross-sectional view schematically showing an electronic component embedded substrate 100C according to another example.

[0013] Figure 6 is a cross-sectional view schematically showing an electronic component embedded substrate 100D according to another example.

[0014] Figure 7 is a cross-sectional view schematically showing an electronic component embedded substrate 100E according to another example.

[0015] FIG. 8A to FIG. 8C A manufacturing process of the electronic component embedded substrate 100A according to an example is schematically illustrated. DETAILED DESCRIPTION

[0016] Hereinafter, the present disclosure will be described with reference to the accompanying drawings. For clearer description, the shapes and sizes of elements in the drawings may be exaggerated or reduced.

[0017] Electronic Devices

[0018] Figure 1 is an example of a block diagram schematically illustrating an electronic device system according to an example.

[0019] Referring to the drawings, the electronic device 1000 may house a mainboard 1010 therein. The mainboard 1010 may include chip-related components 1020, network-related components 1030, other components 1040, etc., which are physically and / or electrically connected thereto. These components may be connected to other components to be described below through various signal lines 1090.

[0020] The chip-related components 1020 may include: memory chips, such as volatile memory (e.g., dynamic random access memory (DRAM)), non-volatile memory (e.g., read-only memory (ROM)), flash memory, etc.; application processor chips, such as central processing units (e.g., central processing units (CPU)), graphics processors (e.g., graphics processing units (GPU)), digital signal processors, cryptographic processors, microprocessors, microcontrollers, etc.; and logic chips, such as analog-to-digital converters, application-specific integrated circuits (ASICs), etc. However, the chip-related components 1020 are not limited thereto, but may also include other types of chip-related components. In addition, the chip-related components 1020 may be combined with each other. The chip-related components 1020 may be in the form of a package including the above-mentioned chips or electronic components.

[0021] The network-related components 1030 may include components implementing protocols such as Wireless Fidelity (Wi-Fi) (Institute of Electrical and Electronics Engineers (IEEE) 802.11 family, etc.), Worldwide Interoperability for Microwave Access (WiMAX) (IEEE 802.16 family, etc.), IEEE 802.20, Long Term Evolution (LTE), Evolution Data Only (Ev-DO), High Speed ​​Packet Access + (HSPA+), High Speed ​​Downlink Packet Access + (HSDPA+), High Speed ​​Uplink Packet Access + (HSUPA+), Enhanced Data GSM Environment (EDGE), Global System for Mobile Communications (GSM), Global Positioning System (GPS), General Packet Radio Service (GPRS), Code Division Multiple Access (CDMA), Time Division Multiple Access (TDMA), Digital Enhanced Cordless Telecommunications (DECT), Bluetooth, 3G protocols, 4G protocols, and 5G protocols, as well as any other wireless protocols and wired protocols specified after the above protocols. However, the network-related components 1030 are not limited thereto, but may also include components implementing a variety of other wireless standards or protocols or wired standards or protocols. Furthermore, the network-related component 1030 may be combined with each other together with the chip-related component 1020 described above.

[0022] The other components 1040 may include high frequency inductors, ferrite inductors, power inductors, ferrite beads, low temperature co-fired ceramics (LTCC), electromagnetic interference (EMI) filters, multilayer ceramic capacitors (MLCC), etc. However, the other components 1040 are not limited thereto, but may also include passive components for various other purposes, etc. In addition, the other components 1040 may be combined with each other together with the chip-related components 1020 and / or the network-related components 1030 described above.

[0023] Depending on the type of the electronic device 1000, the electronic device 1000 may include other components that may or may not be physically and / or electrically connected to the mainboard 1010. These other components may include, for example, a camera 1050, an antenna module 1060, a display 1070, a battery 1080, and the like. However, these other components are not limited thereto, but may also include an audio codec, a video codec, a power amplifier, a compass, an accelerometer, a gyroscope, a speaker, a mass storage unit (e.g., a hard disk drive), a compact disc (CD) drive, a digital versatile disc (DVD) drive, and the like. Depending on the type of the electronic device 1000, etc., these other components may also include other components for various purposes.

[0024] The electronic device 1000 may be a smart phone, a personal digital assistant (PDA), a digital camera, a digital still camera, a network system, a computer, a monitor, a tablet PC, a laptop PC, a netbook PC, a TV, a video game console, a smart watch, an automotive component, etc. However, the electronic device 1000 is not limited thereto and may be any other electronic device that processes data.

[0025] Figure 2 is a perspective view schematically illustrating an electronic device according to an example.

[0026] Referring to the accompanying drawings, the electronic device may be, for example, a smart phone 1100. A mainboard 1110 may be housed in the smart phone 1100, and various electronic components 1120 may be physically and / or electrically connected to the mainboard 1110. In addition, other electronic components (such as a camera module 1130 and / or a speaker 1140) that may or may not be physically and / or electrically connected to the mainboard 1110 may be housed in the smart phone 1100. A portion of the electronic component 1120 may be the above-mentioned chip-related component, for example, a semiconductor package 1121, but is not limited thereto. The semiconductor package 1121 may be a device in which a semiconductor chip or a passive component is mounted on a package substrate in the form of a package substrate, but is not limited thereto. The electronic device is not necessarily limited to the smart phone 1100, but may be other electronic devices as described above.

[0027] Electronic component embedded substrate

[0028] Figure 3 is a cross-sectional view schematically showing an electronic component embedded substrate 100A according to an example.

[0029] Reference Figure 3According to the example, the electronic component embedded substrate 100A may include a core member 110, a first electronic component 120A disposed in a first through portion 110HA of the core member 110, a second electronic component 120B disposed in a second through portion 110HB of the core member 110, and an insulating resin 130 covering at least a portion of each of the first electronic component 120A and the second electronic component 120B.

[0030] The core member 110 may include a plurality of insulating layers 111, a plurality of wiring layers 112, and a plurality of vias 113. For example, the core member 110 may include a first wiring layer 112A, a first insulating layer 111A covering the first wiring layer 112A and having a first through portion 110HA, a second wiring layer 112B disposed on the first insulating layer 111A, a first via 113A passing through the first insulating layer 111A and connecting the first wiring layer 112A and the second wiring layer 112B to each other, a second insulating layer 111B disposed on the first insulating layer 111A and having a second through portion 110HB, a third wiring layer 112C disposed on the second insulating layer 111B, and a second via 113B passing through the second insulating layer 111B and connecting the second wiring layer 112B and the third wiring layer 112C to each other.

[0031] The electronic component embedded substrate 100A according to an example may further include a wiring layer 132 disposed on the insulating resin 130 , and a via 133 that penetrates the insulating resin 130 and connects the wiring layer 132 and the third wiring layer 112C of the core member 110 to each other.

[0032] The electronic component embedded substrate 100A according to the example may further include a connection member 140 including an insulating layer 141 on the lower side of the core member 110 (the first insulating layer 111A is provided on the insulating layer 141), a wiring layer 142, and a via 143 that passes through the insulating layer 141 and connects the wiring layer 142 to at least one of the first wiring layer 112A of the core member 110 and the first electronic component 120A. In this case, the via 143 connected to the first electronic component 120A may directly contact and then be connected to the first electronic component 120A.

[0033] The second through-portion 110HB may expose at least a portion of the first insulating layer 111A and / or at least a portion of the second wiring layer 112B disposed on the first insulating layer 111A. In this case, the second wiring layer 112B exposed by the second through-portion 110HB may be covered by the insulating resin 130. For example, the second wiring layer 112B may include a wiring pattern in which at least a portion of the upper surface of the second wiring layer 112B is covered by the second insulating layer 111B and a wiring pattern in which at least a portion of the upper surface of the second wiring layer 112B is covered by the insulating resin 130. In this case, as described below, the second electronic component 120B may be connected to a wiring pattern in which at least a portion of the upper surface of the second wiring layer 112B is covered by the insulating resin 130 among the wiring patterns of the second wiring layer 112B. Each of the first through-portion 110HA and the second through-portion 110HB may have a rectangular shape in a plane, but is not limited thereto.

[0034] In at least one of the cross sections, the width of the second through portion 110HB may be wider than the width of the first through portion 110HA. In addition, in at least one of the cross sections, the width of the second electronic component 120B disposed in the second through portion 110HB may also be wider than the width of the first electronic component 120A disposed in the first through portion 110HA. In some cross sections, the width of the second through portion 110HB may be narrower than or equal to the width of the first through portion 110HA.

[0035] As will be described later, when the second through-portion 110HB is formed in the second insulating layer 111B, the second wiring layer 112B exposed by the second through-portion 110HB may serve as a stop layer (process stop layer). For example, after the second through-portion 110HB is formed, the lower surface of the second through-portion 110HB may have a region in which the second wiring layer 112B is disposed. In this case, in the region in which the second wiring layer 112B is not disposed, the second insulating layer 111B may be further processed to expose the first insulating layer 111A. Therefore, the exposed first insulating layer 111A may be further processed to form the first through-portion 110HA. According to the process, the side surface of the wiring pattern of the second wiring layer 112B exposed by the second through-portion 110HB may have a region whose surface is substantially coplanar with the wall surface of the first through-portion 110HA. This is because the first through-portion 110HA may be formed along some boundaries of the second wiring layer 112B on a plane. The term “substantially coplanar” in the present specification may be a concept including absolutely coplanar surfaces and including a tolerance range for process errors in absolutely coplanar surfaces.

[0036] In the drawings, the second wiring layer 112B is shown as covering the entire area of ​​the upper surface of the first insulating layer 111A in which the second through portion 110HB is formed, so that the second wiring layer 112B is provided only on the lower surface of the second through portion 110HB. However, this is to clearly illustrate that the second wiring layer 112B can be used as a stop layer, and the configuration of the present disclosure is not limited to that shown in the drawings. For example, depending on its design and / or processing method, the second wiring layer 112B may not be provided in at least a portion of the upper surface of the first insulating layer 111A in which the second through portion 110HB is formed. Therefore, the area in which the first insulating layer 111A is provided and the area in which the second wiring layer 112B is provided can coexist on the lower surface of the second through portion 110HB.

[0037] In addition, as shown in the drawings, although the wiring pattern of the second wiring layer 112B is shown to be provided on the lower surface of the second through portion 110HB to extend to the wall surface of the second through portion 110HB, the configuration of the present disclosure is not limited thereto. Figure 7 As shown in , the wiring pattern of the second wiring layer 112B disposed on the lower surface of the second through portion 110HB may extend to the inner side of the second insulating layer 111B to cover a portion of the second insulating layer 111B. Alternatively, the wiring pattern of the second wiring layer 112B disposed on the lower surface of the second through portion 110HB may be covered by the insulating resin 130 without extending to the wall surface of the second through portion 110HB. Therefore, as described above, the first insulating layer 111A may be disposed in a portion of the lower surface of the second through portion 110HB.

[0038] The second electronic component 120B may be connected to the wiring pattern of the second wiring layer 112B exposed by the second through portion 110HB. In this case, the second electronic component 120B may be connected to the wiring pattern of the second wiring layer 112B through the connection conductor 150.

[0039] The first electronic component 120A and the second electronic component 120B may be arranged to be spaced apart from each other. In this case, the insulating resin 130 may fill at least a portion of the space between the first electronic component 120A and the second electronic component 120B. Therefore, the first electronic component 120A and the second electronic component 120B may be spaced apart from each other by the insulating resin 130.

[0040] There are cases where a plurality of substrates each embedded with a plurality of electronic components may be stacked to form an electronic component embedded substrate. In these cases, it may be difficult to provide a thinner substrate because the entire electronic component embedded substrate may inevitably become thicker. In addition, due to the limitation of interlayer matching between the plurality of substrates, there may be a problem that it is difficult to achieve a relatively high-density substrate.

[0041] In addition, there are cases where a plurality of electronic components may be bonded to each other in the cavity of the core substrate by an adhesive member or the like to form an electronic component embedded substrate. In these cases, since a plurality of electronic components may inevitably come into contact with each other, there may be problems such as heat generation due to heat transfer between the electronic components. In addition, in an electronic component disposed relatively away from a wiring layer disposed on a side portion of the substrate, there may be a problem that a signal path with the wiring layer may become long.

[0042] In the case of the electronic component embedded substrate 100A according to the example, the first electronic component 120A may be arranged in the first through-portion 110HA of the core member 110, and the second electronic component 120B may be arranged in the second through-portion 110HB to achieve thinning. In addition, since the first wiring layer 112A is not arranged on the first insulating layer 111A and has a structure covered by the first insulating layer 111A, thinning can be further achieved. In addition, the second electronic component 120B can be directly connected to the wiring pattern exposed by the second through-portion 110HB of the second wiring layer 112B through the connecting conductor 150. Therefore, the signal path between the electronic component and the wiring layer can be shortened. In addition, the plurality of wiring layers 112A, 112B and 112C included in the core member 110 can be used to improve the degree of freedom of wiring design.

[0043] Hereinafter, each configuration of the electronic component embedded substrate 100A according to an example will be described in more detail.

[0044] The first and second through portions 110HA and 110HB may pass through the first and second insulating layers 111A and 111B, respectively. Each of the first and second through portions 110HA and 110HB may be formed by a sandblasting process using abrasive particles, a dry etching process using plasma, a mechanical drill, a laser drill, or the like.

[0045] As described above, when the second through-portion 110HB is formed in the second insulating layer 111B, the second wiring layer 112B exposed by the second through-portion 110HB may serve as a stop layer (process stop layer). For example, after the second through-portion 110HB is formed, the lower surface of the second through-portion 110HB may have an area in which the second wiring layer 112B is disposed. In this case, in an area in which the second wiring layer 112B is not disposed, the second insulating layer 111B may be further processed to expose the first insulating layer 111A. Therefore, the exposed first insulating layer 111A may be further processed to form the first through-portion 110HA. According to the process, the side surface of the wiring pattern of the second wiring layer 112B exposed by the second through-portion 110HB may have an area whose surface is substantially coplanar with the wall surface of the first through-portion 110HA. This is because the first through-portion 110HA may be formed along some boundaries of the second wiring layer 112B on a plane.

[0046] When processing the first through portion 110HA, a portion of the first insulating layer 111A may remain on the lower surface of the first through portion 110HA. In addition, when processing the second through portion 110HB, a portion of the second insulating layer 111B may remain on the lower surface of the second through portion 110HB. In some cases, the second through portion 110HB may further pass through a portion of the insulating layer 111A.

[0047] Each of the first penetration portion 110HA and the second penetration portion 110HB may have various shapes according to a processing method. For example, the width of the first penetration portion 110HA and / or the second penetration portion 110HB may not be constant in the penetration direction. For example, the first penetration portion 110HA and / or the second penetration portion 110HB may have a shape in which the width becomes narrower in the downward direction.

[0048] The material used to form each of the first insulating layer 111A and the second insulating layer 111B is not particularly limited, and any material can be used as long as it has insulating properties. For example, a thermosetting resin such as an epoxy resin, a thermoplastic resin such as a polyimide, or a material including a reinforcing material (such as an inorganic filler and / or glass cloth, glass fabric, etc.) together with the above resin (such as a prepreg, ABF (Ajinomoto Build-up Film), FR-4, bismaleimide triazine (BT), etc.) can be used. If necessary, a photosensitive dielectric (PID) resin can be used.

[0049] The formation material of each of the first insulating layer 111A and the second insulating layer 111B may be the same as or may be different from each other. In addition, the thickness of each of the first insulating layer 111A and the second insulating layer 111B may be the same as or may be different from each other.

[0050] The thickness of the first insulating layer 111A may be greater than the thickness of the first electronic component 120A. Therefore, the upper surface of the first insulating layer 111A may be located at a height higher than the upper surface of the first electronic component 120A. Therefore, the first electronic component 120A may be spaced apart from the second electronic component 120B disposed on the second wiring layer 112B. In this case, the insulating resin 130 may fill at least a portion of the space between the first electronic component 120A and the second electronic component 120B.

[0051] Similarly, the thickness of the second insulating layer 111B may be greater than the thickness of the second electronic component 120B. However, the present disclosure is not limited thereto. The thickness of each of the first insulating layer 111A and the second insulating layer 111B may be substantially equal to or thinner than the thickness of each of the first electronic component 120A and the second electronic component 120B.

[0052] In addition, the lower surface of the first insulating layer 111A may be substantially coplanar with the lower surface of the first electronic component 120A. The lower surface of the first wiring layer 112A buried in the lower surface of the first insulating layer 111A may also be substantially coplanar with the lower surface of the first electronic component 120A.

[0053] As a material for forming each of the first wiring layer 112A, the second wiring layer 112B, and the third wiring layer 112C, a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), their alloys, etc. can be used. Each of the first wiring layer 112A, the second wiring layer 112B, and the third wiring layer 112C can perform various functions according to its design. For example, a ground (GND) pattern, a power (PWR) pattern, a signal (S) pattern, etc. may be included. In this case, the signal (S) pattern may include various signal patterns other than the ground (GND) pattern, the power (PWR) pattern, etc., such as a data signal pattern. In addition, a via pad, etc. may be included.

[0054] The first wiring layer 112A may be buried in the first insulating layer 111A so that at least a portion of each of the upper surface and the side surface of the first wiring layer 112A may be covered by the first insulating layer 111A. In addition, the lower surface of the first wiring layer 112A may be substantially coplanar with the lower surface of the first insulating layer 111A and / or the lower surface of the first electronic component 120A.

[0055] A portion of the wiring pattern of the second wiring layer 112B may be exposed by the second penetration portion 110HB. Therefore, the second electronic component 120B may be connected to the wiring pattern of the second wiring layer 112B exposed by the second penetration portion 110HB. In this case, the second electronic component 120B may be connected to the wiring pattern of the second wiring layer 112B through the connecting conductor 150. The wiring pattern of the second wiring layer 112B exposed by the second penetration portion 110HB protrudes from the first insulating layer 111A, so that at least a portion of each of its upper surface and side surface may be covered by the insulating resin 130.

[0056] As shown in the drawings, the first wiring layer 112A may be buried in the lower portion of the first insulating layer 111A, and as shown in the drawings, the lower surface of the first wiring layer 112A may be coplanar with the lower surface of the first insulating layer 111A. As shown in the drawings, in the second wiring layer 112B, at least a portion of the second wiring layer 112B may also be buried in the lower portion of the second insulating layer 111B, and as shown in the drawings, the lower surface of the second wiring layer 112B may be coplanar with the lower surface of the second insulating layer 111B. Alternatively, at least a portion of the second wiring layer 112B may protrude from the lower surface of the second insulating layer 111B, in which case at least a portion of the second wiring layer 112B may be buried in the first insulating layer 111A. As shown in the drawings, the third wiring layer 112C may be provided on the upper surface of the second insulating layer 111B, and optionally, the third wiring layer 112C may also be buried in the upper portion of the second insulating layer 111B.

[0057] The first via 113A may pass through the first insulating layer 111A, and may connect the first wiring layer 112A and the second wiring layer 112B to each other. In addition, the second via 113B may pass through the second insulating layer 111B, and may connect the second wiring layer 112B and the third wiring layer 112C to each other. Therefore, the plurality of wiring layers 112A, 112B, and 112C of the core member 110 may be electrically connected therebetween.

[0058] As a material for forming each of the first via hole 113A and the second via hole 113B, a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), an alloy thereof, etc. can be used. Each of the first via hole 113A and the second via hole 113B may be completely filled with a conductive material, or a conductive material may be formed along the wall of the via hole. When the via hole includes a conductive material formed along the wall of the via hole, an insulating material may fill the via hole. In addition, the shape of each of the first via hole 113A and the second via hole 113B may be any shape known in the art, such as a conical shape, a cylindrical shape, etc.

[0059] When the first and second via holes 113A and 113B have a tapered shape, they may have a shape tapered in the same direction. For example, as shown in the drawings, the first and second via holes 113A and 113B may have a shape whose width narrows in a downward direction.

[0060] In addition, when the first via hole 113A and / or the second via hole 113B have a tapered shape, the first via hole 113A and / or the second via hole 113B may have a shape that tapers in a direction opposite to a via hole 143 (to be described later) of the connection member 140. For example, as shown in the drawings, the first via hole 113A and the second via hole 113B may have a shape in which the width thereof narrows in a downward direction, and the via hole 143 of the connection member 140 may have a shape in which the width thereof widens in a downward direction.

[0061] As shown in the drawings, the first via 113A may have a structure integrated with a wiring pattern of the second wiring layer 112B connected to the first via 113A. The second via 113B may have a structure integrated with a wiring pattern of the third wiring layer 112C connected to the second via 113B.

[0062] Each of the first electronic component 120A and the second electronic component 120B may be an active component such as a semiconductor chip, an integrated circuit (IC), etc., and may be a passive component such as a multilayer ceramic capacitor (MLCC), a low inductance chip capacitor (LICC), an inductor, etc. In addition, each of the first electronic component 120A and the second electronic component 120B may include a connection pad and / or an electrode for electrical connection.

[0063] The first electronic component 120A may be in contact with and directly connected to the via 143 of the connection member 140. In addition, the second electronic component 120B may be connected to the second wiring layer 112B of the core member 110 through the connection conductor 150.

[0064] The insulating resin 130 may cover at least a portion of each of the first electronic component 120A and the second electronic component 120B. In addition, the insulating resin 130 may fill at least a portion of each of the first through-portion 110HA and the second through-portion 110HB. For example, the insulating resin 130 may cover the upper surface and the side surface of each of the first electronic component 120A and the second electronic component 120B, and may fill the space between the first through-portion 110HA and the first electronic component 120A and the space between the second through-portion 110HB and the second electronic component 120B. In addition, at least a portion of the space between the first electronic component 120A and the second electronic component 120B may be filled with the insulating resin 130.

[0065] In addition, the insulating resin 130 may cover at least a portion of the first insulating layer 111A and / or the second wiring layer 112B exposed by the second through portion 110HB. In addition, the insulating resin 130 may cover the upper surface of the second insulating layer 111B and at least a portion of the third wiring layer 112C.

[0066] The material used to form the insulating resin 130 is not particularly limited, and any material can be used as long as it has insulating properties. For example, a thermosetting resin such as an epoxy resin, a thermoplastic resin such as a polyimide, or a material including a reinforcing material (such as an inorganic filler and / or glass cloth, glass fabric, etc.) together with the above resin (such as a prepreg, ABF (Ajinomoto Build-up Film), FR-4, bismaleimide triazine (BT), etc.) can be used. If necessary, a photosensitive dielectric (PID) resin can be used.

[0067] The wiring layer 132 may be provided on the insulating resin 130 , and may be connected to the third wiring layer 112C of the core member 110 .

[0068] As a material for forming the wiring layer 132, a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), their alloys, etc. can be used. The wiring layer 132 can perform various functions according to its design. For example, a ground (GND) pattern, a power (PWR) pattern, a signal (S) pattern, etc. may be included. In this case, the signal (S) pattern may include various signal patterns other than the ground (GND) pattern, the power (PWR) pattern, etc., such as a data signal pattern. In addition, a via pad, etc. may be included.

[0069] The via 133 may penetrate the insulating resin 130, and may connect the wiring layer 132 and the third wiring layer 112C of the core member 110 to each other. The via 133 may be integrated with the wiring layer 132 connected thereto.

[0070] As a material forming the via hole 133, a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), their alloys, etc. can be used. The via hole 133 may be completely filled with a conductive material, or the conductive material may be formed along the wall of the via hole. When the via hole includes a conductive material formed along the wall of the via hole, an insulating material may fill the via hole. In addition, the shape of the via hole 133 may apply all shapes known in the art, such as a conical shape, a cylindrical shape, etc.

[0071] According to the design, an insulating layer, a wiring layer, a via hole, etc. may be further provided on the insulating resin 130 .

[0072] The connection member 140 may be disposed under the core member 110 and may include an insulating layer 141, a wiring layer 142 disposed under the insulating layer 141, and a via 143 that passes through the insulating layer 141 and connects the wiring layer 142 to at least one of the first wiring layer 112A of the core member 110 and the first electronic component 120A.

[0073] According to the design, an insulating layer, a wiring layer, a via, etc. may be further provided under the connection member 140 .

[0074] The material for forming the insulating layer 141 of the connection member 140 is not particularly limited, and any material can be used as long as it has insulating properties. For example, a thermosetting resin such as epoxy resin, a thermoplastic resin such as polyimide, or a material including a reinforcing material (such as an inorganic filler and / or glass cloth, glass fabric, etc.) together with the above resin (such as a prepreg, ABF (Ajinomoto Build-up Film), FR-4, bismaleimide triazine (BT), etc.) can be used. If necessary, a photosensitive dielectric (PID) resin can be used.

[0075] The insulating layer 141 of the connection member 140 may be thinner than each of the first insulating layer 111A and the second insulating layer 111B. However, the present disclosure is not limited thereto, and the thickness of the insulating layer 141 may be substantially the same as that of each of the first insulating layer 111A and the second insulating layer 111B, and the insulating layer 141 may be thicker than each of the first insulating layer 111A and the second insulating layer 111B.

[0076] The wiring layer 142 of the connection member 140 may be disposed under the insulating layer 141 and may be connected to the first wiring layer 112A and / or the first electronic component 120A. In addition, the wiring layer 142 of the connection member 140 may also be connected to the second electronic component 120B through the first wiring layer 112A and the second wiring layer 112B.

[0077] As a material for forming the wiring layer 142 of the connection member 140, a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), their alloys, etc. can be used. The wiring layer 142 of the connection member 140 can perform various functions according to its design. For example, a ground (GND) pattern, a power (PWR) pattern, a signal (S) pattern, etc. may be included. In this case, the signal (S) pattern may include various signal patterns other than the ground (GND) pattern, the power (PWR) pattern, etc., such as a data signal pattern. In addition, a via pad, etc. may be included.

[0078] The via 143 of the connection member 140 may pass through the insulating layer 141 and may connect the wiring layer 142 of the connection member 140 to the first wiring layer 112A and / or the first electronic component 120A of the core member 110. As described above, the via 143 of the connection member 140 may directly contact and be connected to the first electronic component 120A.

[0079] As a material for forming the via hole 143 of the connecting member 140, a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), their alloys, etc. can be used. The via hole 143 of the connecting member 140 can be completely filled with a conductive material, or the conductive material can be formed along the wall of the via hole. When the via hole includes a conductive material formed along the wall of the via hole, an insulating material can fill the via hole. In addition, the shape of the via hole 143 of the connecting member 140 can apply all shapes known in the art, such as a conical shape, a cylindrical shape, etc.

[0080] When the via hole 143 of the connection member 140 has a tapered shape, according to the process, the via hole 143 of the connection member 140 may have a shape that tapers in a direction opposite to the first via hole 113A and / or the second via hole 113B of the core member 110. For example, as shown in the drawings, the first via hole 113A and the second via hole 113B of the core member 110 may have a shape in which the width thereof narrows in a downward direction, and the via hole of the connection member 140 may have a shape in which the width thereof widens in a downward direction.

[0081] The connecting conductor 150 may connect the second electronic component 120B to the second wiring layer 112B of the core member 110. The material for forming the connecting conductor 150 may include solder and / or conductive paste. However, the present disclosure is not limited thereto, and as a material for forming the connecting conductor 150, any material may be used as long as it has conductive properties. The connecting conductor 150 may also be used to fix the second electronic component 120B to the second wiring layer 112B.

[0082] Figure 4 is a cross-sectional view schematically showing an electronic component embedded substrate 100B according to another example.

[0083] Referring to the drawings, in an electronic component embedded substrate 100B according to another example, compared with the electronic component embedded substrate 100A according to the example, the core member 110 may include a first wiring layer 112A, a first insulating layer 111A covering the first wiring layer 112A, a second wiring layer 112B provided on the first insulating layer 111A, a first via hole 113A passing through the first insulating layer 111A and connecting the first wiring layer 112A and the second wiring layer 112B to each other, and a first via hole 113A provided on the first insulating layer 111A. A second insulating layer 111B, a third wiring layer 112C arranged on the second insulating layer 111B, a second via 113B that passes through the second insulating layer 111B and connects the second wiring layer 112B and the third wiring layer 112C to each other, a third insulating layer 111C arranged on the second insulating layer 111B, a fourth wiring layer 112D arranged on the third insulating layer 111C, and a third via 113C that passes through the third insulating layer 111C and connects the third wiring layer 112C and the fourth wiring layer 112D to each other.

[0084] In addition, the first penetration portion 110HA may pass through the first insulating layer 111A and the second insulating layer 112B.

[0085] The first electronic component 120A may be thicker than the second electronic component 120B. In the electronic component embedded substrate 100B according to another example, since the first penetration portion 110HA passes through the first insulating layer 111A and the second insulating layer 112B together, the first penetration portion 110HA may be formed deeply compared to the electronic component embedded substrate 100A according to the example. Therefore, the first electronic component 120A having a relatively thick thickness may be embedded. In addition, as the number of wiring layers included in the core member 110 increases, the degree of freedom of wiring design may also be further improved.

[0086] Since the others may be substantially the same as those described in the electronic component embedded substrate 100A according to the example, a detailed description thereof will be omitted.

[0087] Figure 5 is a cross-sectional view schematically showing an electronic component embedded substrate 100C according to another example.

[0088] Referring to the drawings, in an electronic component embedded substrate 100C according to another example, compared with the electronic component embedded substrate 100A according to the example, the core member 110 may include a first wiring layer 112A, a first insulating layer 111A covering the first wiring layer 112A, a second wiring layer 112B provided on the first insulating layer 111A, a first via 113A passing through the first insulating layer 111A and connecting the first wiring layer 112A and the second wiring layer 112B to each other, and a first via hole 113A provided on the first insulating layer 111A. A second insulating layer 111B, a third wiring layer 112C disposed on the second insulating layer 111B, a second via 113B passing through the second insulating layer 111B and connecting the second wiring layer 112B and the third wiring layer 112C to each other, a third insulating layer 111C disposed on the second insulating layer 111B, a fourth wiring layer 112D disposed on the third insulating layer 111C, and a third via 113C passing through the third insulating layer 111C and connecting the third wiring layer 112C and the fourth wiring layer 112D to each other. In addition, a third electronic component 120C may be further included.

[0089] The second through portion 110HB may expose at least a portion of the first insulating layer 111A and / or the second wiring layer 112B disposed on the first insulating layer 111A, and the third through portion 110HC may expose at least a portion of the second insulating layer 111B and / or the third wiring layer 112C disposed on the second insulating layer 111B. In addition, the first through portion 110HA may pass through the first insulating layer 111A, the second through portion 110HB may pass through the second insulating layer 111B, and the third through portion 110HC may pass through the third insulating layer 111C. In at least one cross section, the width of the third through portion 110HC may be wider than the width of the second through portion 110HB, and the width of the second through portion 110HB may be wider than the width of the first through portion 110HA.

[0090] In addition, in at least one cross section, the width of the third electronic component 120C disposed in the third through portion 110HC may be wider than the width of the second electronic component 120B, and the width of the second electronic component 120B disposed in the second through portion 110HB may be wider than the width of the first electronic component 120A disposed in the first through portion 110HA.

[0091] The second electronic component 120B may be disposed on the wiring pattern of the second wiring layer 112B exposed by the second through portion 110HB, and may be connected to the wiring pattern of the second wiring layer 112B. In this case, the second electronic component 120B may be connected to the wiring pattern of the second wiring layer 112B through the first connection conductor 150A. Similarly, the third electronic component 120C may be disposed on the wiring pattern of the third wiring layer 112C exposed by the third through portion 110HC, and may be connected to the wiring pattern of the third wiring layer 112C. In this case, the third electronic component 120C may be connected to the wiring pattern of the third wiring layer 112C through the second connection conductor 150B.

[0092] Since the others may be substantially the same as those described in the electronic component embedded substrate 100A according to the example, a detailed description thereof will be omitted.

[0093] Figure 6 is a cross-sectional view schematically showing an electronic component embedded substrate 100D according to another example.

[0094] In the electronic component embedded substrate 100D according to another example, the first wiring layer 112A of the core member 110 may be disposed under the first insulating layer 111A, but may not be buried in the first insulating layer 111A in a manner different from the electronic component embedded substrate 100B according to another example. In addition, the first via 113A of the core member 110 may have a shape that tapers in a direction opposite to that of the first via 113A of the electronic component embedded substrate 100B according to another example. For example, as shown in the drawings, the first via 113A of the core member 110 may have a shape in which its width widens in a downward direction.

[0095] Since the rest may be substantially the same as those described in the electronic component embedded substrate 100A according to an example and the electronic component embedded substrate 100B according to another example, a detailed description thereof will be omitted.

[0096] Figure 7 is a cross-sectional view schematically showing an electronic component embedded substrate 100E according to another example.

[0097] In the electronic component embedded substrate 100E according to another example, the first wiring layer 112A of the core member 110 may be disposed under the first insulating layer 111A, but may not be buried in the first insulating layer 111A in a manner different from the electronic component embedded substrate 100C according to another example. In addition, the first via 113A of the core member 110 may have a shape that tapers in a direction opposite to that of the first via 113A of the electronic component embedded substrate 100B according to another example. For example, as shown in the drawings, the first via 113A of the core member 110 may have a shape in which its width widens in a downward direction.

[0098] Since the rest may be substantially the same as those described in the electronic component embedded substrate 100A according to an example and the electronic component embedded substrate 100C according to another example, a detailed description thereof will be omitted.

[0099] FIG. 8A to FIG. 8C A manufacturing process of the electronic component embedded substrate 100A according to an example is schematically illustrated.

[0100] Reference Fig. 8A , a core member 110 can be prepared, the core member 110 including a first wiring layer 112A, a first insulating layer 111A covering the first wiring layer 112A, a second wiring layer 112B disposed on the first insulating layer 111A, a first via 113A passing through the first insulating layer 111A and connecting the first wiring layer 112A and the second wiring layer 112B to each other, a second insulating layer 111B disposed on the first insulating layer 111A, a third wiring layer 112C disposed on the second insulating layer 111B, and a second via 113B passing through the second insulating layer 111B and connecting the second wiring layer 112B and the third wiring layer 112C to each other.

[0101] The core member 110 may include a plurality of insulating layers 111 (including a first insulating layer 111A and a second insulating layer 111B), a plurality of wiring layers 112 (including a first wiring layer 112A to a third wiring layer 112C), and a plurality of vias 113 (including a first via 113A and a second via 113B), and the construction and / or structure of the core member 110 may be changed according to the design.

[0102] Reference Figure 8B , the second through portion 110HB passing through the second insulating layer 111B and the first through portion 110HA passing through the first insulating layer 111A may be sequentially formed.

[0103] Each of the first through portion 110HA and the second through portion 110HB may be formed by a sandblasting process using abrasive particles, a dry etching process using plasma, a mechanical drill, a laser drill, or the like.

[0104] When the second through portion 110HB is formed in the second insulating layer 111B, the second wiring layer 112B may serve as a stop layer (process stop layer). For example, after the second through portion 110HB is formed, the lower surface of the second through portion 110HB may have a region in which the second wiring layer 112B is disposed. In this case, in the region in which the second wiring layer 112B is not disposed, the second insulating layer 111B may be further processed to expose the first insulating layer 111A. Therefore, the exposed first insulating layer 111A may be further processed to form the first through portion 110HA.

[0105] Reference Figure 8C , the first electronic component 120A and the second electronic component 120B may be disposed in the first through portion 110HA and the second through portion 110HB, respectively, and may be sealed by the insulating resin 130 .

[0106] The first electronic component 120A may be provided in the first penetration portion 110HA by attaching a known tape or the like to the lower surface of the core member 110. The second electronic component 120B may be provided so as to be fixed on the second wiring layer 112B through the connection conductor 150.

[0107] In addition, a via hole 133 passing through the insulating resin 130 may be formed, and a wiring layer 132 may be formed on the insulating resin 130 .

[0108] A connection member 140 including an insulating layer 141, a via 143 passing through the insulating layer 141, and a wiring layer 142 disposed on the insulating layer 141 may be formed under the core member 110. When the first electronic component 120A is provided using a known tape or the like, the known tape or the like may be first removed from the first electronic component 120A before forming the connection member 140.

[0109] The manufacturing process of the electronic component embedded substrate 100A according to the example is not limited to the above description and can be changed by those skilled in the art. For example, it can be realized by changing the forming method, forming order, forming material, etc. of each component. In this case, the modified example can be a concept including the addition and omission of the configuration.

[0110] In the present specification, the terms "upper", "on", "upper surface", "lower", "under", and "lower surface" may be used based on the drawings. However, they may be described in different terms according to relative arrangements between components.

[0111] In this specification, the meaning of "disposed on a component" is not limited to the direction of being disposed on a component or disposed on the upper surface of a component. In some cases, it may be a case of being disposed under or on the lower surface of any component.

[0112] As used herein, the term "connected" or "connected" in this specification may be not only a direct connection, but also a concept including an indirect connection through an adhesive layer, etc. In addition, the term "electrically connected" or "electrically connected" in this specification is a concept including both physical connection and physical non-connection.

[0113] In this specification, the expressions "first", "second", etc. in this specification are used to distinguish one component from another component, and do not limit the order and / or importance of the components. In some cases, without departing from the spirit of the present disclosure, the "first" component may be referred to as the "second" component, and similarly, the "second" component may be referred to as the "first" component.

[0114] The terms used in the present disclosure are only used to illustrate various examples and are not intended to limit the inventive concept. Unless the context clearly indicates otherwise, a singular expression includes a plural expression.

[0115] The expression "example" used in this specification does not refer to examples that are identical to one another, but may be provided to emphasize and explain different unique features. However, the above examples do not exclude the possibility of implementing the above examples in combination with features of other examples. For example, although a description in a specific example is not described in other examples, it may be understood as a description related to another example unless otherwise described or contradicted with another example.

[0116] As one effect of the present disclosure, it is possible to provide an electronic component embedded substrate including a plurality of electronic components capable of miniaturizing and thinning a product.

[0117] As another effect of the present disclosure, an electronic component embedded substrate having improved freedom of wiring design can be provided.

[0118] While example embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations may be made without departing from the scope of the present disclosure as defined by the appended claims.

Claims

1. An electronic component embedded substrate, comprising: a core member including a first wiring layer, a first insulating layer covering the first wiring layer and having a first through portion, a second wiring layer provided on the first insulating layer, and a second insulating layer provided on the first insulating layer and having a second through portion exposing at least a portion of the second wiring layer; A first electronic component is disposed in the first penetration portion; A second electronic component is disposed in the second penetration portion; as well as an insulating resin covering at least a portion of each of the first electronic component and the second electronic component, wherein the second wiring layer includes a first wiring pattern and a second wiring pattern, in the first wiring pattern, at least a portion of an upper surface of the second wiring layer is covered by the second insulating layer, and in the second wiring pattern, at least a portion of the upper surface of the second wiring layer is covered by the insulating resin, wherein the second electronic component is connected to the second wiring pattern, wherein the core member further comprises: a third wiring layer disposed on the second insulating layer; and a third insulating layer disposed on the second insulating layer and having a third penetration portion exposing at least a portion of the third wiring layer, Wherein, the electronic component embedded substrate further includes a third electronic component arranged in the third penetration portion, wherein the third wiring layer includes a third wiring pattern and a fourth wiring pattern, in the third wiring pattern, at least a portion of an upper surface of the third wiring layer is covered by the third insulating layer, and in the fourth wiring pattern, at least a portion of the upper surface of the third wiring layer is covered by the insulating resin, wherein the third electronic component is connected to the fourth wiring pattern, wherein the insulating resin also covers at least a portion of the third electronic component, The electronic component embedded substrate further includes a connecting member, the connecting member including: a fourth insulating layer disposed below the first insulating layer; a fourth wiring layer disposed below the fourth insulating layer; and a via hole penetrating the fourth insulating layer and connecting the fourth wiring layer to at least one of the first wiring layer and the first electronic component, wherein the second electronic component is connected to the second wiring pattern via a first connecting conductor embedded in the insulating resin, wherein the third electronic component is connected to the fourth wiring pattern via a second connecting conductor embedded in the insulating resin.

2. The electronic component embedded substrate according to claim 1, wherein: The first electronic component and the second electronic component are spaced apart from each other, and The insulating resin is provided in at least a portion of a space between the first electronic component and the second electronic component.

3. The electronic component embedded substrate according to claim 1, wherein: the first wiring layer is embedded in the first insulating layer, and at least a portion of each of an upper surface and a side surface of the first wiring layer is covered by the first insulating layer, The second wiring pattern protrudes from the first insulating layer, and at least a portion of each of an upper surface and a side surface of the second wiring pattern is covered with the insulating resin.

4. The electronic component embedded substrate according to claim 1, wherein: The side surface of the second wiring pattern has an area coplanar with the wall surface of the first through portion.

5. The electronic component embedded substrate according to claim 1, wherein: The core member further comprises: a first via hole that passes through the first insulating layer and connects the first wiring layer and the second wiring layer to each other; and A second via hole penetrates the second insulating layer and connects the second wiring layer and the third wiring layer to each other.

6. The electronic component embedded substrate according to claim 5, wherein: The first via is integrated with at least a portion of the second wiring layer, and The second via is integrated with at least a portion of the third wiring layer.

7. The electronic component embedded substrate according to claim 5, wherein: The first via hole and the second via hole have shapes tapered in the same direction as each other.

8. The electronic component embedded substrate according to claim 7, wherein: The via hole in the connection member and the first via hole respectively have shapes that taper in opposite directions to each other.

9. An electronic component embedded substrate, comprising: a core member including a first wiring layer, a first insulating layer covering the first wiring layer and having a first through portion, a second wiring layer provided on the first insulating layer, and a second insulating layer provided on the first insulating layer and having a second through portion exposing at least a portion of the second wiring layer; A first electronic component is disposed in the first penetration portion; A second electronic component is disposed in the second penetration portion; as well as an insulating resin covering at least a portion of each of the first electronic component and the second electronic component, wherein the second wiring layer includes a first wiring pattern and a second wiring pattern, in the first wiring pattern, at least a portion of an upper surface of the second wiring layer is covered by the second insulating layer, and in the second wiring pattern, at least a portion of the upper surface of the second wiring layer is covered by the insulating resin, wherein the second electronic component is connected to the second wiring pattern, The core member further includes: a third insulating layer disposed below the first insulating layer and having a third penetration portion; and a third wiring layer embedded in a lower portion of the third insulating layer or disposed on a lower surface of the third insulating layer. Wherein, the electronic component embedded substrate further includes a third electronic component arranged in the third penetration portion, wherein the first through portion exposes at least a portion of the first wiring layer, wherein the first wiring layer includes a third wiring pattern and a fourth wiring pattern, in the third wiring pattern, at least a portion of an upper surface of the first wiring layer is covered by the first insulating layer, and in the fourth wiring pattern, at least a portion of the upper surface of the first wiring layer is covered by the insulating resin, wherein the first electronic component is connected to the fourth wiring pattern, wherein the insulating resin also covers at least a portion of the third electronic component, The electronic component embedded substrate further includes a connecting member, the connecting member including: a fourth insulating layer disposed under the third insulating layer; a fourth wiring layer disposed under the fourth insulating layer; and a via hole penetrating the fourth insulating layer and connecting the fourth wiring layer to at least one of the third wiring layer and the third electronic component, wherein the first electronic component is connected to the fourth wiring pattern via a first connecting conductor embedded in the insulating resin, wherein the second electronic component is connected to the second wiring pattern via a second connecting conductor embedded in the insulating resin.

10. The electronic component embedded substrate according to claim 9, wherein: The first electronic component and the second electronic component are spaced apart from each other, and The insulating resin is provided in at least a portion of a space between the first electronic component and the second electronic component.

11. The electronic component embedded substrate according to claim 9, wherein: the third wiring layer is embedded in a lower portion of the third insulating layer, and at least a portion of each of an upper surface and a side surface of the third wiring layer is covered by the third insulating layer, The second wiring pattern protrudes from the first insulating layer, and at least a portion of each of an upper surface and a side surface of the second wiring pattern is covered with the insulating resin.

12. The electronic component embedded substrate according to claim 9, wherein: The side surface of the second wiring pattern has an area coplanar with the wall surface of the first through portion.

13. The electronic component embedded substrate according to claim 9, wherein: The core member further comprises: a first via hole that passes through the first insulating layer and connects the first wiring layer and the second wiring layer to each other; and A second via hole passes through the third insulating layer and connects the first wiring layer and the third wiring layer to each other.

14. The electronic component embedded substrate according to claim 13, wherein: The first via is integrated with at least a portion of the second wiring layer, and The second via is integrated with at least a portion of the third wiring layer.

15. The electronic component embedded substrate according to claim 13, wherein: The first via hole and the second via hole have shapes tapered in the same direction as each other.

16. The electronic component embedded substrate according to claim 15, wherein: The via hole in the connection member and the first via hole respectively have shapes that taper in opposite directions to each other.

17. An electronic component embedded substrate, comprising: a core member including a first wiring layer, a first insulating layer covering the first wiring layer and having a first through portion, a second wiring layer provided on the first insulating layer, and a second insulating layer provided on the first insulating layer and having a second through portion exposing at least a portion of the second wiring layer; A first electronic component is disposed in the first penetration portion; A second electronic component is disposed in the second penetration portion; as well as an insulating resin covering at least a portion of each of the first electronic component and the second electronic component, wherein the second wiring layer includes a first wiring pattern and a second wiring pattern, in the first wiring pattern, at least a portion of an upper surface of the second wiring layer is covered by the second insulating layer, and in the second wiring pattern, at least a portion of the upper surface of the second wiring layer is covered by the insulating resin, wherein the second electronic component is connected to the second wiring pattern, The core member further includes: a third insulating layer disposed below the first insulating layer; and a third wiring layer embedded in a lower portion of the third insulating layer or disposed on a lower surface of the third insulating layer, Wherein, the first penetration portion also passes through the third insulating layer, The electronic component embedded substrate further includes a connecting member, the connecting member including: a fourth insulating layer disposed under the third insulating layer; a fourth wiring layer disposed under the fourth insulating layer; and a via hole penetrating the fourth insulating layer and connecting the fourth wiring layer to at least one of the third wiring layer and the first electronic component, wherein the first electronic component is connected to the fourth wiring layer through a via embedded in the connecting member, wherein the second electronic component is connected to the second wiring pattern via a connecting conductor embedded in the insulating resin, Wherein, the thickness of the first electronic component is greater than the thickness of the second electronic component.

18. The electronic component embedded substrate according to claim 17, wherein: The first electronic component and the second electronic component are spaced apart from each other, and The insulating resin is provided in at least a portion of a space between the first electronic component and the second electronic component.

19. The electronic component embedded substrate according to claim 17, wherein: the third wiring layer is embedded in a lower portion of the third insulating layer, and at least a portion of each of an upper surface and a side surface of the third wiring layer is covered by the third insulating layer, The second wiring pattern protrudes from the first insulating layer, and at least a portion of each of an upper surface and a side surface of the second wiring pattern is covered with the insulating resin.

20. The electronic component embedded substrate according to claim 17, wherein: The side surface of the second wiring pattern has an area coplanar with the wall surface of the first through portion.

21. The electronic component embedded substrate according to claim 17, wherein: The core member further comprises: a first via hole that passes through the first insulating layer and connects the first wiring layer and the second wiring layer to each other; and A second via hole passes through the third insulating layer and connects the first wiring layer and the third wiring layer to each other.

22. The electronic component embedded substrate according to claim 21, wherein: The first via is integrated with at least a portion of the second wiring layer, and The second via is integrated with at least a portion of the third wiring layer.

23. The electronic component embedded substrate according to claim 21, wherein: The first via hole and the second via hole have shapes tapered in the same direction as each other.

24. The electronic component embedded substrate according to claim 23, wherein: The via hole of the connection member and the first via hole respectively have shapes tapered in opposite directions to each other.

Images