Packaging cover plate and preparation method thereof, display panel and display device

Abstract

The embodiment of the present application provides a package cover plate and a preparation method thereof, a display panel and a display device, wherein the package cover plate comprises: a cover plate structure layer; a spacer column structure, located on one side of the cover plate structure layer, the spacer column structure comprises a first spacer column located on one side of the cover plate structure layer, the first spacer column comprises a water absorption structure; an auxiliary electrode layer, located on the side of the spacer column structure away from the cover plate structure layer, wherein the spacer column structure is configured to block water vapor from diffusing along the spacer column structure toward the auxiliary electrode layer. The technical solution of the embodiment of the present disclosure, the spacer column structure can block water vapor from diffusing along the spacer column structure toward the auxiliary electrode layer, and then block water vapor from diffusing to the top electrode and the organic functional layer of the display substrate, which can avoid black spots and improve the display effect and service life of the display panel.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a packaging cover plate and a preparation method thereof, a display panel and a display device. Background Art

[0002] Organic Light-Emitting Diode (OLED) is a display lighting technology that has gradually developed in recent years. Especially in the display industry, OLED display is considered to have broad application prospects due to its advantages such as high response, high contrast, and flexibility. Top-emitting OLED display devices have become the main research direction due to their higher aperture ratio. For top-emitting OLED structures, the top electrode, which serves as the light-emitting surface of the OLED, must have good light transmittance. At present, top-emitting transparent electrodes mostly use thin metals, indium tin oxide, indium zinc oxide and other materials. Due to the poor transmittance of metals, it is easy to increase resistance when used as large-area electrodes after thinning, which is not conducive to the development of large-size devices.

[0003] The existing top-emitting OLED display device has black spots in the display, and the life of the display device needs to be improved. Summary of the invention

[0004] Embodiments of the present disclosure provide a packaging cover plate and a method for preparing the same, a display panel, and a display device to solve or alleviate one or more technical problems in the prior art.

[0005] As a first aspect of an embodiment of the present disclosure, an embodiment of the present disclosure provides a package cover plate, including:

[0006] Cover plate structural layer;

[0007] A spacer column structure is located at one side of the cover plate structure layer, the spacer column structure includes a first spacer column located at one side of the cover plate structure layer, and the first spacer column includes a water absorption structure;

[0008] The auxiliary electrode layer is located on the side of the spacer structure away from the cover structure layer.

[0009] The spacer column structure is configured to block water vapor from diffusing along the spacer column structure toward the auxiliary electrode layer.

[0010] In some possible implementations, the water absorption structure is a material of the first spacer column doped with desiccant particles, and the desiccant particles are used to absorb water vapor.

[0011] In some possible implementations,

[0012] The particle size of the desiccant particles ranges from 20 nm to 50 nm; and / or,

[0013] The desiccant particles include at least one of calcium oxide particles, barium oxide particles, and calcium chloride particles; and / or,

[0014] The volume ratio of the desiccant particles in the first spacer column ranges from 20% to 40%; and / or,

[0015] The first spacer column is a columnar structure, the outer diameter of the first spacer column ranges from 15 μm to 20 μm, and the height of the first spacer column ranges from 2 μm to 8 μm.

[0016] In some possible implementations, the spacer column structure further includes a liquid-repellent layer, and the liquid-repellent layer is located on a side of the first spacer column away from the cover plate structure layer.

[0017] In some possible implementations, the spacer column structure also includes a second spacer column, which is located on the side of the first spacer column away from the cover plate structure layer, and the orthographic projection of the second spacer column on the cover plate structure layer includes the orthographic projection of the first spacer column on the cover plate structure layer, and at least a portion of the second spacer column is treated to be liquid-repellent to obtain a liquid-repellent layer.

[0018] In some possible implementations,

[0019] The material of the second spacer column includes at least one of polyimide, polymethyl methacrylate, and organic silane; and / or,

[0020] The outer diameter of the second spacer column is in the range of 20 μm to 30 μm; and / or,

[0021] The height of the second spacer column is in the range of 5 μm to 10 μm; and / or,

[0022] The material used to perform the liquid-repellent treatment on the second spacer is at least one of tetrafluoromethane, fluorinated silane, and chlorosiloxane.

[0023] In some possible implementations, the spacer column structure also includes a second spacer column, which is located on the side of the first spacer column away from the cover plate structure layer, and the orthographic projection of the second spacer column on the cover plate structure layer includes the orthographic projection of the first spacer column on the cover plate structure layer, and the liquid-repellent layer is located on the side of the second spacer column away from the cover plate structure layer.

[0024] In some possible implementations,

[0025] The material of the second spacer column includes at least one of polyimide, polymethyl methacrylate, and organic silane; and / or,

[0026] The outer diameter of the second spacer column is in the range of 20 μm to 30 μm; and / or,

[0027] The height of the second spacer column is in the range of 5 μm to 10 μm; and / or,

[0028] The material of the liquid-repellent layer includes at least one of fluorinated polyimide, fluorinated polymethyl methacrylate and polysiloxane.

[0029] In some possible implementations, the spacer column structure also includes a second spacer column, which is located on the side of the first spacer column away from the cover plate structure layer, and the orthographic projection of the second spacer column on the cover plate structure layer includes the orthographic projection of the first spacer column on the cover plate structure layer, and the material of the second spacer column includes a liquid-phobic material.

[0030] As a second aspect of an embodiment of the present disclosure, an embodiment of the present disclosure provides a method for preparing a package cover plate, comprising:

[0031] forming a cover plate structure layer;

[0032] A spacer column structure is formed on one side of the cover plate structure layer, wherein the spacer column structure includes a first spacer column located on one side of the cover plate structure layer, and the first spacer column includes a water absorption structure;

[0033] An auxiliary electrode layer is formed on the side of the spacer structure away from the cover plate structure layer.

[0034] The spacer column structure is configured to block water vapor from diffusing along the spacer column structure toward the auxiliary electrode layer.

[0035] In some possible implementations, a spacer column structure is formed on one side of the cover plate structure layer, including:

[0036] A first spacer column is formed on one side of the cover plate structure layer. The material of the first spacer column is doped with desiccant particles, and the desiccant particles are used to absorb water vapor.

[0037] In some possible implementations, a spacer column structure is formed on one side of the cover plate structure layer, further comprising:

[0038] A second spacer is formed on a side of the first spacer facing away from the cover plate structure layer, wherein the orthographic projection of the second spacer on the cover plate structure layer includes the orthographic projection of the first spacer on the cover plate structure layer;

[0039] At least a portion of the second spacer columns is treated with liquid repellency to form a liquid repellency layer located on a side of the first spacer columns away from the cover plate structure layer.

[0040] In some possible implementations, the second spacer column is treated with lyophobicity using at least one of tetrafluoromethane, fluorinated silane, and chlorosiloxane.

[0041] In some possible implementations, a spacer column structure is formed on one side of the cover plate structure layer, further comprising:

[0042] forming a second spacing film on a side of the first spacing column away from the cover plate structure layer;

[0043] forming a liquid-repellent film on a side of the second spacing film away from the cover plate structure layer;

[0044] The liquid-repellent film and the second spacer film are patterned to form a second spacer column and a liquid-repellent layer, wherein the orthographic projection of the second spacer column on the cover plate structure layer includes the orthographic projection of the first spacer column on the cover plate structure layer, and the liquid-repellent layer is located on the side of the second spacer column away from the cover plate structure layer.

[0045] As a third aspect of the embodiments of the present disclosure, the embodiments of the present disclosure provide a display panel, comprising a display substrate and a packaging cover plate in any embodiment of the present disclosure, the packaging cover plate being arranged opposite to the display substrate, the display substrate comprising a top electrode facing a side of the packaging cover plate, and an auxiliary electrode layer in the packaging cover plate being coupled to the top electrode.

[0046] As a fourth aspect of an embodiment of the present disclosure, an embodiment of the present disclosure provides a display device, including the display panel in the embodiment of the present disclosure.

[0047] In the technical solution of the embodiment of the present disclosure, the spacer column structure is configured to prevent water vapor from diffusing along the spacer column structure toward the auxiliary electrode layer. Thus, the spacer column structure can prevent water vapor from being conducted along the spacer column structure to the auxiliary electrode layer, and further prevent water vapor from being conducted to the top electrode and the organic functional layer of the display substrate. In this way, it is possible to prevent the water vapor remaining in the package cover from corroding the OLED device in the display substrate, avoid black spots, and improve the display effect and service life of the display panel.

[0048] The above summary is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present disclosure will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the multiple drawings represent the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments according to the present disclosure and should not be regarded as limiting the scope of the present disclosure.

[0050] Figure 1 is a structural schematic diagram of a display panel;

[0051] Figure 2 This is a schematic diagram of the structure of a packaging cover plate in an embodiment of the present disclosure;

[0052] Figure 3 This is a schematic structural diagram of a packaging cover plate in another embodiment of the present disclosure;

[0053] Figure 4It is a schematic diagram of a process of preparing a packaging cover plate in an embodiment of the present disclosure;

[0054] Figure 5 This is a schematic diagram of the structure after a cover plate structure layer is formed in a packaging cover plate according to an embodiment of the present disclosure;

[0055] Figure 6 This is a schematic diagram of the structure after a first spacing film is formed in a packaging cover plate according to an embodiment of the present disclosure;

[0056] Figure 7 This is a schematic diagram of the structure after a first spacer column is formed in a packaging cover plate according to an embodiment of the present disclosure;

[0057] Figure 8 This is a schematic diagram of the structure after a second spacing film is formed in a packaging cover plate according to an embodiment of the present disclosure;

[0058] Fig. 9 This is a schematic diagram of the structure after a second spacer column is formed in a packaging cover plate according to an embodiment of the present disclosure;

[0059] Fig.10 This is a schematic diagram of the structure after a liquid-repellent layer is formed in a packaging cover plate according to an embodiment of the present disclosure;

[0060] Fig.11 This is a schematic diagram of the structure after a liquid-repellent film is formed in a packaging cover plate according to another embodiment of the present disclosure;

[0061] Fig.12 This is a schematic diagram of the structure after a liquid-repellent layer is formed in a packaging cover plate according to another embodiment of the present disclosure;

[0062] Fig.13 FIG. 4 is a schematic diagram of the structure of a display panel in an embodiment of the present disclosure.

[0063] Description of reference numerals:

[0064] 10 / 30, packaging cover; 11 / 311, cover; 12 / 312, black matrix; 13 / 313, color film structure layer; 14 / 314, flat layer; 15, auxiliary electrode column; 16, spacer column; 17 / 33, auxiliary electrode layer; 20, display substrate; 21, driving substrate; 22, pixel defining layer; 23, organic functional layer; 24, top electrode; 321, first spacer column; 322, second spacer column; 323, liquid-repellent layer. DETAILED DESCRIPTION

[0065] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present disclosure. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0066] In order to reduce the resistance of the top electrode in the top-emitting OLED structure, in the related art, an auxiliary electrode can be made on the packaging cover to reduce the resistance of the top-emitting transparent electrode. However, water vapor is easily accumulated during the production process of the packaging cover, and the water vapor remains in the packaging cover. After the packaging cover is packaged with the display substrate, the water vapor is easily transferred to the display substrate, corroding the display substrate, forming black spots, and affecting the life of the display substrate.

[0067] Figure 1 FIG. 1 is a schematic diagram of the structure of a display panel. Figure 1 As shown, the display panel may include a packaging cover plate 10 and a display substrate 20, and the packaging cover plate 10 and the display substrate 20 are arranged in a box. The display substrate 20 may include a driving substrate 21. A pixel defining layer (Pixel Define Layer, PDL) 22 is provided on the side of the driving substrate 21 facing the packaging cover plate 10, and the pixel defining layer 22 defines a pixel area. An organic functional layer 23 is provided on the side of the pixel defining layer 22 away from the driving substrate 21, and a top electrode 24 is provided on the side of the organic functional layer 23 away from the driving substrate 21. The top electrode 24 may be a cathode. The driving substrate 21 may include a bottom electrode (not shown in the figure), the bottom electrode is located in the pixel area, and the bottom electrode may be an anode. The bottom electrode, the organic functional layer 23 and the top electrode 24 located in the pixel area may form an OLED device, and the OLED device emits light for display under the voltage of the bottom electrode and the top electrode 24.

[0068] The package cover plate 10 may include a cover plate 11, a black matrix (BM) 12 and a color filter structure layer 13 arranged on one side of the cover plate 11. The black matrix 12 is arranged corresponding to the pixel defining layer 22. The color filter structure layer 13 may include a red color film (CF), a green color film and a blue color film. A flat layer 14 is arranged on the side of the color filter structure layer 13 away from the cover plate 11, and an auxiliary electrode column 15 is arranged on the side of the flat layer 14 away from the cover plate 11, and a spacer column 16 is arranged on the side of the auxiliary electrode column 15 away from the cover plate 11. The auxiliary electrode column 15 is arranged corresponding to the black matrix 12, and the orthographic projection of the spacer column 16 on the cover plate 11 is located within the orthographic projection range of the auxiliary electrode column 15 on the cover plate 11, and the orthographic projection of the spacer column 16 on the cover plate 11 is smaller than the orthographic projection of the auxiliary electrode column 15 on the cover plate 11. An auxiliary electrode layer 17 is arranged on the side of the spacer column 16 away from the cover plate 11. Since the orthographic projection of the spacer column 16 on the cover plate 11 is smaller than the orthographic projection of the auxiliary electrode column 15 on the cover plate 11 , the auxiliary electrode layer 17 is connected to the auxiliary electrode column 15 .

[0069] During the packaging process of the packaging cover plate 10 and the display substrate 20, the spacer column 16 squeezes the packaging glue material so that the auxiliary electrode layer 17 of the packaging cover plate 10 contacts the top electrode 24 of the display substrate 20. Thus, the auxiliary electrode layer 17 and the auxiliary electrode column 15 are both connected to the top electrode 24, thereby reducing the resistance of the top electrode 24 and enhancing the conductivity of the top electrode 24. However, the color film structure layer 13 of the packaging cover plate 10 is made of organic material, which is easy to accumulate water vapor during the preparation process, and the water vapor remains in the packaging cover plate 10. After the packaging of the packaging cover plate 10 and the display substrate 20 is completed, the water vapor remaining in the packaging cover plate 10 is easily conducted along the spacer column 16 to the OLED device of the display substrate 20, causing corrosion to the electrodes and organic functional layers of the OLED device, forming black spots, and affecting the service life of the OLED device.

[0070] Figure 2 FIG. 1 is a schematic diagram of the structure of a packaging cover plate in an embodiment of the present disclosure. Figure 2 As shown, the package cover plate 30 may include a cover plate structure layer, a spacer column structure 32 and an auxiliary electrode layer 33. The spacer column structure 32 is located on one side of the cover plate structure layer, and the spacer column structure 32 may include a first spacer column 321, the first spacer column 321 is located on one side of the cover plate structure layer, and the first spacer column 321 may include a water absorption structure. The auxiliary electrode layer 33 is located on the side of the spacer column structure 32 away from the cover plate structure layer. The spacer column structure 32 is configured to prevent water vapor from diffusing along the spacer column structure 32 toward the auxiliary electrode layer 33.

[0071] It is understandable that the package cover plate can be applied to a display panel, in which the package cover plate can be packaged with a display substrate, and the auxiliary electrode layer 33 is used to couple with the top electrode of the display substrate to reduce the resistance of the top electrode. Figure 1 As shown, the water vapor remaining in the package cover plate is easily transferred to the OLED device of the display substrate 20 along the spacer 16, corroding the electrodes and organic functional layers of the OLED device, forming black spots, and affecting the service life of the OLED device.

[0072] According to the technical solution of the embodiment of the present disclosure, the spacer column structure 32 may include a first spacer column 321, and the first spacer column 321 may include a water absorption structure. The spacer column structure 32 is configured to prevent water vapor from diffusing along the spacer column structure 32 toward the auxiliary electrode layer 33. Thus, the water absorption structure can absorb water vapor, and the spacer column structure can prevent water vapor from being conducted along the spacer column structure to the auxiliary electrode layer, and further prevent water vapor from being conducted to the top electrode and the organic functional layer of the display substrate. In this way, it is possible to prevent the water vapor remaining in the package cover from corroding the OLED device in the display substrate, avoid black spots, and improve the display effect and service life of the display panel.

[0073] In one embodiment, the cover plate structure layer may include a cover plate 311, a black matrix 312, a color film structure layer 313 and a flat layer 314. The cover plate 311 may be glass. The black matrix 312 is located on one side of the cover plate 311. It is understood that the black matrix 312 is arranged corresponding to the pixel definition layer in the display substrate. The color film structure layer 313 is located on the side of the black matrix 312 away from the cover plate 311. The color film structure layer may include a red color film, a green color film and a blue color film. The flat layer 314 is located on the side of the color film structure layer 313 away from the cover plate 311. The material of the flat layer 314 may include an elastic resin material. For example, the material of the flat layer 314 may include at least one of a phenol-based resin, a polypropylene-based resin, a polyimide-based resin, and a propylene-based resin. The flat layer 314 covers the black matrix 312 and the color film structure layer 313, and the thickness range may be 1 μm to 2 μm.

[0074] In one implementation, the spacer structure 32 corresponds to the black matrix 312 .

[0075] In one embodiment, the first spacer 321 is located on one side of the cover plate structure layer, and illustratively, the first spacer 321 is located on the side of the flat layer 314 away from the cover plate 311. The water absorption structure is a material of the first spacer 321 doped with desiccant particles, which are used to absorb water vapor.

[0076] Therefore, when the water vapor is conducted to the first spacer 321 , the desiccant particles in the first spacer 321 can absorb the water vapor and prevent the water vapor from diffusing toward the auxiliary electrode layer 33 , thereby preventing the water vapor from diffusing toward the OLED in the display substrate.

[0077] In one embodiment, the first spacer column 321 is a columnar structure, and the cross-sectional shape of the first spacer column 321 can be set according to actual needs, for example, it can be at least one of a circular shape, a square shape, etc. Figure 2 As shown, the outer diameter of the first spacer 321 can range from 15 μm to 20 μm, for example, the outer diameter of the first spacer 321 can be any value of 15 μm, 16 μm, 17 μm, 18 μm, 19 μm, and 20 μm. The outer diameter of the first spacer 321 is the size of the first spacer in a direction parallel to the cover plate 311. When the cross section of the first spacer is circular, the outer diameter of the first spacer can be the diameter of the cross section of the first spacer, and when the first spacer is non-circular, the outer diameter of the first spacer can be the maximum size of the cross section of the first spacer. The height range h1 of the first spacer 321 can be 2 μm to 8 μm, for example, the height of the first spacer 321 can be any value of 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, and 8 μm.

[0078] In one embodiment, the material of the first spacer 321 may also include an organic material, such as a photoresist material, and the desiccant particles are doped in the organic material. For example, the desiccant particles are uniformly distributed in the organic material. The organic material may be a photoresist, and the organic material may include at least one of polyimide, bisphenol A polycarbonate, a polymer containing an alkyl group in the main chain, a polymer containing a cyclic rigid structure in the main chain, etc. The desiccant particles are doped in the organic material, so that the outside of the desiccant particles is wrapped by the organic material, which can prevent the desiccant particles from absorbing a large amount of external water vapor too early and becoming ineffective. Therefore, after the encapsulation cover plate and the display substrate are encapsulated, the desiccant particles can be better used to absorb the residual water vapor of the encapsulation cover plate.

[0079] Exemplarily, the particle size range of the desiccant particles is 20nm to 50nm, and the particle size of the desiccant particles can be any value between 20nm and 50nm, for example, the particle size of the desiccant particles can be any value between 20nm, 30nm, 40nm, and 50nm. The particle size of the desiccant particles is less than 20nm, and the effect of absorbing water vapor is not good; the particle size of the desiccant particles is greater than 50nm, which may affect the first spacer formed. The particle size range of the desiccant particles is set to 20nm to 50nm, so that the desiccant particles can better absorb water vapor, and particles of this size will not affect the first spacer formed, thereby improving the display effect of the display panel. The desiccant particles may include at least one of calcium oxide (CaO) particles, barium oxide (BaO) particles, and calcium chloride (CaCl2) particles. The volume ratio of the desiccant particles in the first spacer material can range from 20% to 40%, for example, the volume ratio of the desiccant particles in the first spacer material can be any value between 20%, 25%, 30%, 35%, and 40%.

[0080] In one embodiment, the spacer column structure 32 may further include a liquid-repellent layer 323 . The liquid-repellent layer 323 may be located on a side of the first spacer column 321 away from the cover structure layer. Thus, the liquid-repellent layer 323 is located between the first spacer column 321 and the auxiliary electrode layer 33 .

[0081] When the desiccant particles cannot completely absorb the water vapor remaining in the package cover plate, the water vapor will remain on the surface of the spacer column structure 32, and then enter the display substrate through the auxiliary electrode layer 33, causing defects. In the embodiment of the present disclosure, by setting a liquid-repellent layer 323, the liquid-repellent layer 323 has hydrophobicity, and the liquid-repellent layer 323 can prevent water vapor from remaining on the surface of the first spacer column 321. The liquid-repellent layer 323 can block water vapor from entering the auxiliary electrode layer 33 through the liquid-repellent layer 323, avoiding the defects caused by water vapor remaining on the surface of the spacer column structure, further improving the barrier property of the spacer column structure to water vapor, and further improving the display effect and service life of the display panel.

[0082] In one embodiment, if Figure 2 As shown, the spacer column structure may further include a second spacer column 322, the second spacer column 322 is located on the side of the first spacer column 321 away from the cover plate structure layer, and the orthographic projection of the second spacer column 322 on the cover plate structure layer includes the orthographic projection of the first spacer column 321 on the cover plate structure layer. Exemplarily, the orthographic projection boundary of the second spacer column 322 on the cover plate structure layer is located outside the orthographic projection boundary of the first spacer column 321 on the cover plate structure layer, so that the second spacer column 322 covers the outer surface of the first spacer column 321. The material of the second spacer column 322 may include a photoresist material, and exemplarily, the material of the second spacer column 322 may include at least one of polyimide, polymethyl methacrylate, and organosilane. The outer diameter of the second spacer column 322 may range from 20 μm to 30 μm, for example, the outer diameter of the second spacer column 322 may be any value of 20 μm, 22 μm, 24 μm, 26 μm, 28 μm, and 30 μm. It can be understood that the outer diameter of the second spacer is the dimension of the second spacer in a direction parallel to the cover plate. The cross-sectional shape of the second spacer may correspond to the cross-sectional shape of the first spacer.

[0083] In one embodiment, the height h2 of the second spacer 322 may range from 5 μm to 10 μm. For example, the height h2 of the second spacer 322 may be any value of 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, and 10 μm. The height of the second spacer is the distance between the surface of the second spacer facing away from the cover plate and the flat layer. Figure 2 As shown in h2.

[0084] By setting a second spacer column 322 covering the outer surface of the first spacer column 321, the second spacer column 322 can wrap the first spacer column 321, confine water vapor in the first spacer column 321, and further block external water vapor from entering the first spacer column 321, further preventing the desiccant particles in the first spacer column 321 from absorbing external water vapor and becoming ineffective.

[0085] In one embodiment, the second spacer 322 may be treated with liquid repellency to obtain a liquid repellent layer 323. Exemplarily, the second spacer may be treated with liquid repellency using at least one of tetrafluoromethane, fluorinated silane, and chlorosiloxane to obtain a liquid repellent layer 323. For example, the second spacer 322 may be surface treated with at least one of tetrafluoromethane, fluorinated silane, and chlorosiloxane so that the surface of the second spacer 322 on the side away from the cover plate 311 has liquid repellency (also called hydrophobicity). The liquid repellent layer 323 is located on the side of the first spacer 321 away from the cover plate 311, and the thickness of the liquid repellent layer 323 may be set according to the liquid repellent treatment process or needs.

[0086] In one embodiment, if Figure 2 As shown, the material of the auxiliary electrode layer 33 may include a transparent conductive material. For example, the material of the auxiliary electrode layer 33 may include at least one of indium zinc oxide, indium tin oxide, etc. The thickness of the auxiliary electrode layer 33 may range from 10 nm to 100 nm. For example, the thickness of the auxiliary electrode layer 33 may be any value of 10 nm, 20 nm, 30 nm, 40 nm, 50 nm, 60 nm, 70 nm, 80 nm, 90 nm, and 100 nm. In actual implementation, the thickness of the auxiliary electrode layer 33 may be set according to actual needs.

[0087] In one embodiment, the material of the auxiliary electrode layer can be a metal material. For example, the material of the auxiliary electrode layer can include one of metals such as magnesium (Mg), silver (Ag), molybdenum (Mo), neodymium (Nd), and aluminum (Al). When the material of the auxiliary electrode layer is a non-transparent material, the auxiliary electrode layer can be set to a grid shape that crosses horizontally and vertically, and the spacer column structure can be located at the grid intersection position of the auxiliary electrode layer. Exemplarily, the auxiliary electrode layer can be set corresponding to the black matrix, or the auxiliary electrode layer can be set corresponding to the pixel definition layer in the display substrate. Thus, the hollow area defined by the grid-like auxiliary electrode layer corresponds to the pixel area. In this way, the auxiliary electrode layer can be prevented from affecting the aperture ratio of the display panel.

[0088] Figure 3 FIG. 1 is a schematic diagram of the structure of a packaging cover plate in another embodiment of the present disclosure. Figure 3 As shown, the liquid-repellent layer 323 may be located on the side of the second spacer 322 away from the cover structure layer. The material of the liquid-repellent layer 323 may include a liquid-repellent material, and illustratively, the material of the liquid-repellent layer 323 may include at least one of fluorinated polyimide, fluorinated polymethyl methacrylate, and polysiloxane.

[0089] In a possible implementation, the material of the first spacer may include a liquid-repellent material. Thus, the first spacer has liquid-repellent properties, which can prevent the residual water vapor in the package cover from being transferred to the auxiliary electrode layer through the first spacer, thereby preventing the water vapor from corroding the top electrode and organic functional layer of the OLED in the display substrate.

[0090] In one possible implementation, the material of the second spacer column may include a liquid-repellent material. Thus, the second spacer column can form a barrier to prevent water vapor from passing through and corroding the auxiliary electrode layer, thereby preventing water vapor from corroding the top electrode and the organic functional layer in the display substrate. In addition, when the desiccant particles in the first spacer column cannot completely absorb the residual water vapor, the second spacer column can block the water vapor from passing through the second spacer column due to its liquid-repellent property, thereby preventing water vapor from remaining on the surface of the spacer column structure and causing poor display. Moreover, the second spacer column can also block external water vapor from entering the first spacer column, thereby preventing the desiccant particles in the first spacer column from absorbing external water vapor, thereby ensuring that the desiccant particles are used to absorb the residual water vapor on the packaging cover plate.

[0091] The liquid-repellent material may include at least one of fluorinated polyimide, fluorinated polymethyl methacrylate, and polysiloxane.

[0092] Figure 4 FIG. 1 is a flow chart of a method for preparing a packaging cover plate in an embodiment of the present disclosure. Figure 4 As shown, the method for preparing the package cover plate may include:

[0093] S41, forming a cover plate structure layer;

[0094] S42, forming a spacer column structure on one side of the cover plate structure layer, wherein the spacer column structure includes a first spacer column located on one side of the cover plate structure layer, and the first spacer column includes a water absorption structure;

[0095] S43, forming an auxiliary electrode layer on the side of the spacer structure away from the cover plate structure layer,

[0096] The spacer column structure is configured to block water vapor from diffusing along the spacer column structure toward the auxiliary electrode layer.

[0097] In one embodiment, forming a spacer column structure on one side of the cover plate structure layer mentioned above may include: forming a first spacer column on one side of the cover plate structure layer, wherein the material of the first spacer column is doped with desiccant particles, and the desiccant particles are used to absorb water vapor.

[0098] In one embodiment, the spacer column structure is formed on one side of the cover plate structure layer in the above text, and can also include: forming a second spacer column on the side of the first spacer column away from the cover plate structure layer, the orthographic projection of the second spacer column on the cover plate structure layer includes the orthographic projection of the first spacer column on the cover plate structure layer; performing a liquid-repellent treatment on at least a portion of the second spacer column to form a liquid-repellent layer located on the side of the first spacer column away from the cover plate structure layer.

[0099] In one embodiment, the second spacer column may be treated with lyophobicity by using at least one of tetrafluoromethane, fluorinated silane, and chlorosiloxane.

[0100] In one embodiment, the spacer column structure is formed on one side of the cover plate structure layer in the above text, and can also include: forming a second spacer film on the side of the first spacer column facing away from the cover plate structure layer; forming a liquid-repellent film on the side of the second spacer film facing away from the cover plate structure layer; patterning the liquid-repellent film and the second spacer film to form a second spacer column and a liquid-repellent layer, the orthographic projection of the second spacer column on the cover plate structure layer includes the orthographic projection of the first spacer column on the cover plate structure layer, and the liquid-repellent layer is located on the side of the second spacer column facing away from the cover plate structure layer.

[0101] The technical solution of the embodiment of the present disclosure is further explained below through the preparation process of the package cover in one embodiment of the present disclosure. It can be understood that the "patterning" mentioned in this article, when the patterned material is an inorganic material or metal, "patterning" includes processes such as coating photoresist, mask exposure, development, etching, and stripping photoresist, and when the patterned material is an organic material, "patterning" includes processes such as mask exposure and development. The evaporation, deposition, coating, and coating mentioned in this article are all mature preparation processes in the relevant technology.

[0102] The preparation process of the package cover plate may include:

[0103] S41, forming a cover plate structure layer, such as Figure 5 As shown, Figure 5 FIG. 1 is a schematic diagram of a structure after a cover plate structure layer is formed in a package cover plate according to an embodiment of the present disclosure. Figure 5 As shown, forming the cover plate structure layer may include:

[0104] A black matrix film is coated on one side of the cover plate 311, and the black matrix film is patterned to form a black matrix 312. It is understood that the black matrix 312 may correspond to a pixel defining layer in the display substrate.

[0105] A color film structure layer 313 is formed on the side of the black matrix 312 away from the cover plate 311, and the color film structure layer 313 may include a red color film, a green color film and a blue color film. The process of forming the red color film may include: forming a red color film film on the side of the black matrix 312 away from the cover plate 311; patterning the red color film film to form a red (R) color film in the corresponding area. The formation process of the green (G) color film and the blue (B) color film is the same as the formation process of the red color film, which will not be repeated here. The material of the color film structure layer is usually an organic material. In the process of forming the color film structure layer, water vapor is easily accumulated, and the water vapor will remain in the packaging cover plate.

[0106] A coating process (e.g., spin coating process) is used to form a flat layer 314 on the side of the color filter structure layer 313 away from the cover plate 311. The material of the flat layer 314 may include an elastic resin material. For example, the material of the flat layer 314 may include at least one of a phenol-based resin, a polypropylene-based resin, a polyimide-based resin, and a propylene-based resin. The flat layer 314 covers the black matrix 312 and the color filter structure layer 313, and the thickness of the flat layer 314 may be any value between 1 μm and 2 μm (including the end value).

[0107] S42, forming a spacer column structure on one side of the cover plate structure layer, may include steps S4211 to S4215, each step is as follows:

[0108] S4211, coating a first spacer film 321' on the side of the flat layer 314 facing away from the cover plate 311, such as Figure 6 As shown, Figure 6 This is a schematic diagram of the structure after the first spacing film is formed in the packaging cover of an embodiment of the present disclosure. Exemplarily, the material of the first spacing film 321' may include an organic material and desiccant particles uniformly distributed in the organic material. The organic material may include at least one of polyimide, bisphenol A polycarbonate, a polymer containing an alkyl group in the main chain, a polymer containing a cyclic rigid structure in the main chain, etc. The particle size range of the desiccant particles may be 20nm to 50nm. The desiccant particles may include at least one of calcium oxide (CaO) particles, barium oxide (BaO) particles, and calcium chloride (CaCl2) particles. The volume ratio of the desiccant particles in the first spacing column material may range from 20% to 40% (including the endpoint values). The thickness range of the first spacing film 321' may be 2μm to 8μm (including the endpoint values).

[0109] S4212, patterning the first spacing film to form a first spacing column 321, such as Figure 7 As shown, Figure 7 Schematic diagram of the structure after the first spacer is formed in the package cover according to an embodiment of the present disclosure. The first spacer 321 corresponds to the black matrix 312. The outer diameter of the first spacer 321 may range from 15 μm to 20 μm.

[0110] S4213, coating a second spacing film 322' on the side of the first spacing column 321 away from the cover plate 311, such as Figure 8 As shown, Figure 8 The schematic diagram of the structure after the second spacing film is formed in the package cover of one embodiment of the present disclosure. The thickness of the second spacing film 322' is greater than the height of the first spacing column 321, and the material of the second spacing film may include at least one of polyimide, polymethyl methacrylate, and organic silane. The thickness of the second spacing film may be 5μm to 10μm (including the end value).

[0111] S4214, patterning the second spacing film to form a second spacing column 322, such as Fig. 9 As shown, Fig. 9 The schematic diagram of the structure after the second spacer is formed in the package cover of one embodiment of the present disclosure. The orthographic projection of the second spacer 322 on the cover structure layer includes the orthographic projection of the first spacer 321 on the cover structure layer. Exemplarily, the orthographic projection boundary of the second spacer 322 on the cover structure layer is located outside the orthographic projection boundary of the first spacer 321 on the cover structure layer, so that the second spacer 322 covers the outer surface of the first spacer 321, and the outer diameter of the second spacer 322 can range from 20μm to 30μm.

[0112] S4215, performing liquid-repellent treatment on at least a portion of the second spacer column 322 to form a liquid-repellent layer 323 located on a side of the first spacer column 321 away from the cover plate structure layer, such as Fig.10 As shown, Fig.10 Schematic diagram of the structure after the liquid-repellent layer is formed in the package cover according to an embodiment of the present disclosure. For example, the second spacer 322 may be treated with liquid repellent by using at least one of tetrafluoromethane, fluorinated silane, and chlorosiloxane.

[0113] S43, forming an auxiliary electrode layer on the side of the spacer column structure away from the cover plate structure layer, including: forming an auxiliary electrode film on the side of the spacer column structure away from the cover plate structure layer by deposition, thereby forming an auxiliary electrode layer 33, such as Figure 2 The material of the auxiliary electrode layer 33 may include at least one of indium zinc oxide, indium tin oxide, etc. The thickness of the auxiliary electrode layer 33 may range from 10 nm to 100 nm (including end values).

[0114] In another embodiment, S42, forming a spacer column structure on one side of the cover plate structure layer, may include steps S4221 to S4224, each step being as follows:

[0115] S4221 and S4222 are the same as S4211 and S4212 respectively, and will not be repeated here.

[0116] S4223, forming a second spacing film 322' and a liquid-repellent film 323' in sequence on the side of the first spacing column 321 away from the cover plate structure layer, such as Fig.11 As shown, Fig.11Schematic diagram of the structure after a liquid-repellent film is formed in the package cover of another embodiment of the present disclosure. Exemplarily, a coating process can be used to form the second spacing film 322', and a coating process can be used to form the liquid-repellent film 323'. The thickness of the second spacing film 322' is greater than the height of the first spacing column 321, and the material of the second spacing film may include at least one of polyimide, polymethyl methacrylate, and organic silane. The material of the liquid-repellent film 323' may include a liquid-repellent material, and exemplarily, the material of the liquid-repellent film 323' may include at least one of fluorinated polyimide, fluorinated polymethyl methacrylate, and polysiloxane.

[0117] S4224, patterning the liquid-repellent film 323' and the second spacer film 322' to form the second spacer column 322 and the liquid-repellent layer 323, such as Fig.12 As shown, Fig.12 This is a schematic diagram of the structure after a liquid-repellent layer is formed in the package cover of another embodiment of the present disclosure. The orthographic projection of the second spacer 322 on the cover structure layer includes the orthographic projection of the first spacer 321 on the cover structure layer. Exemplarily, the orthographic projection boundary of the second spacer 322 on the cover structure layer is located outside the orthographic projection boundary of the first spacer 321 on the cover structure layer, so that the second spacer 322 covers the outer surface of the first spacer 321, and the liquid-repellent layer 323 is located on the side of the second spacer 322 away from the cover structure layer.

[0118] By adopting the method of the embodiment of the present disclosure, the process of liquid-repellent treatment can be reduced, the steps of preparing the packaging cover plate can be reduced, and the preparation cost can be reduced.

[0119] Fig.13 Schematic diagram of the structure of a display panel in an embodiment of the present disclosure. Based on the above embodiment, an embodiment of the present disclosure provides a display panel, including a display substrate 20 and a package cover plate 30 in the above embodiment. The package cover plate 30 is arranged opposite to the display substrate 20, and the display substrate 20 includes a top electrode 24 facing one side of the package cover plate 30, and the auxiliary electrode layer 33 in the package cover plate 30 is coupled to the top electrode 24.

[0120] In the display panel of the embodiment of the present disclosure, the spacer column structure in the package cover plate 30 is configured to prevent water vapor from diffusing along the spacer column structure toward the auxiliary electrode layer 33. Therefore, the water vapor remaining in the package cover plate will not diffuse to the auxiliary electrode layer 33 along the spacer column structure 32, and the water vapor will not diffuse to the top electrode 24 and the organic functional layer of the display substrate through the auxiliary electrode layer 33. In this way, it is possible to prevent the water vapor remaining in the package cover plate from corroding the light-emitting device in the display substrate, avoid black spots, and improve the display effect and service life of the display panel.

[0121] In one embodiment, the display substrate may include an OLED display substrate.

[0122] Based on the inventive concept of the above embodiments, the embodiments of the present disclosure further provide a display device, which includes a display panel using the above embodiments. The display device can be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, etc.

[0123] In the description of this specification, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present disclosure.

[0124] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present disclosure, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0125] In the present disclosure, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to specific circumstances.

[0126] In the present disclosure, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being “above”, “above”, and “above” a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0127] The disclosure above provides many different embodiments or examples to implement different structures of the present disclosure. In order to simplify the present disclosure, the components and settings of specific examples are described above. Of course, they are only examples, and the purpose is not to limit the present disclosure. In addition, the present disclosure can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed.

[0128] The above are only specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any technician familiar with the technical field can easily think of various changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A packaging cover plate, characterized in that: include: Cover plate structural layer; A spacer column structure is located at one side of the cover plate structure layer, the spacer column structure includes a first spacer column located at one side of the cover plate structure layer, the first spacer column includes a water absorption structure, the water absorption structure is a material of the first spacer column doped with desiccant particles, the desiccant particles are used to absorb water vapor; The auxiliary electrode layer is located on a side of the spacer structure away from the cover structure layer. The spacer column structure is configured to block water vapor from diffusing along the spacer column structure toward the auxiliary electrode layer. The spacer column structure also includes a liquid-repellent layer located on a side of the first spacer column away from the cover plate structure layer.

2. The package cover plate according to claim 1, characterized in that: The particle size of the desiccant particles ranges from 20 nm to 50 nm; and / or, The desiccant particles include at least one of calcium oxide particles, barium oxide particles, and calcium chloride particles; and / or, The volume ratio of the desiccant particles in the first spacer column is in a range of 20% to 40%; and / or, The first spacer column is a columnar structure, the outer diameter of the first spacer column ranges from 15 μm to 20 μm, and the height of the first spacer column ranges from 2 μm to 8 μm.

3. The package cover plate according to claim 1, characterized in that: The spacer column structure also includes a second spacer column, which is located on the side of the first spacer column away from the cover plate structure layer, and the orthographic projection of the second spacer column on the cover plate structure layer includes the orthographic projection of the first spacer column on the cover plate structure layer, and at least a portion of the second spacer column is treated with liquid repellency to obtain the liquid repellent layer.

4. The packaging cover plate according to claim 3, characterized in that: The material of the second spacer column includes at least one of polyimide, polymethyl methacrylate, and organic silane; and / or, The outer diameter of the second spacer column is in the range of 20 μm to 30 μm; and / or, The height of the second spacer column is in the range of 5 μm to 10 μm; and / or, The material used to perform the liquid-repellent treatment on the second spacer is at least one of tetrafluoromethane, fluorinated silane, and chlorosiloxane.

5. The package cover plate according to claim 1, characterized in that: The spacer column structure also includes a second spacer column, which is located on the side of the first spacer column away from the cover plate structure layer, and the orthographic projection of the second spacer column on the cover plate structure layer includes the orthographic projection of the first spacer column on the cover plate structure layer, and the liquid-repellent layer is located on the side of the second spacer column away from the cover plate structure layer.

6. The packaging cover plate according to claim 5, characterized in that: The material of the second spacer column includes at least one of polyimide, polymethyl methacrylate, and organic silane; and / or, The outer diameter of the second spacer column is in the range of 20 μm to 30 μm; and / or, The height of the second spacer column is in the range of 5 μm to 10 μm; and / or, The material of the liquid-repellent layer includes at least one of fluorinated polyimide, fluorinated polymethyl methacrylate and polysiloxane.

7. The packaging cover plate according to claim 1 or 2, characterized in that: The spacer column structure also includes a second spacer column, which is located on the side of the first spacer column away from the cover plate structure layer, and the orthographic projection of the second spacer column on the cover plate structure layer includes the orthographic projection of the first spacer column on the cover plate structure layer, and the material of the second spacer column includes a liquid-repellent material.

8. A method for preparing a packaging cover plate, used for preparing the packaging cover plate according to any one of claims 1 to 7, characterized in that: include: forming a cover plate structure layer; A spacer column structure is formed on one side of the cover plate structure layer, wherein the spacer column structure includes a first spacer column located on one side of the cover plate structure layer, and the first spacer column includes a water absorption structure; An auxiliary electrode layer is formed on a side of the spacer structure away from the cover plate structure layer, Wherein, the spacer column structure is configured to block water vapor from diffusing along the spacer column structure toward the auxiliary electrode layer.

9. The preparation method according to claim 8, characterized in that: The spacer column structure is formed on one side of the cover plate structure layer, comprising: A first spacer column is formed on one side of the cover plate structure layer. The material of the first spacer column is doped with desiccant particles, and the desiccant particles are used to absorb water vapor.

10. The preparation method according to claim 9, characterized in that: The step of forming a spacer column structure on one side of the cover plate structure layer further comprises: A second spacer is formed on a side of the first spacer facing away from the cover plate structure layer, wherein the orthographic projection of the second spacer on the cover plate structure layer includes the orthographic projection of the first spacer on the cover plate structure layer; Performing a liquid-repellent treatment on at least a portion of the second spacer columns to form a liquid-repellent layer located on a side of the first spacer columns away from the cover plate structure layer, The second spacer column is treated with liquid repellency by using at least one of tetrafluoromethane, fluorinated silane and chlorosiloxane.

11. The preparation method according to claim 9, characterized in that: The step of forming a spacer column structure on one side of the cover plate structure layer further comprises: forming a second spacing film on a side of the first spacing column away from the cover plate structure layer; forming a liquid-repellent film on a side of the second spacing film away from the cover plate structure layer; The liquid-repellent film and the second spacer film are patterned to form a second spacer column and a liquid-repellent layer, wherein the orthographic projection of the second spacer column on the cover plate structure layer includes the orthographic projection of the first spacer column on the cover plate structure layer, and the liquid-repellent layer is located on the side of the second spacer column away from the cover plate structure layer.

12. A display panel, characterized in that: The invention comprises a display substrate and a packaging cover plate according to any one of claims 1 to 7, wherein the packaging cover plate is arranged opposite to the display substrate, the display substrate comprises a top electrode facing one side of the packaging cover plate, and an auxiliary electrode layer in the packaging cover plate is coupled to the top electrode.

13. A display device, characterized in that: Includes the display panel as claimed in claim 12.

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