Cooling device

Abstract

The invention relates to a cooling device (1) for dissipating heat of an electrical component (2), the cooling device comprising a heat pipe (3) and a cooling body (4), wherein the cooling body (4) has a groove recess (6) extending on a first cooling body side (5), the groove recess at least partially surrounding the heat pipe (3), wherein a heat pipe surface (7) of the heat pipe (3) has a fiber structure (8) consisting of first fibers (9) in a region surrounded by the groove recess (6), and wherein the first fibers (9) of the heat pipe surface (7) of the heat pipe (3) form a mechanical connection with a cooling body surface (10) of the cooling body (4) in the region of the groove recess (6).

Description

Technical Field

[0001] The invention relates to a cooling device for dissipating heat of an electrical component, wherein the cooling device comprises a heat pipe and a cooling body, and the cooling body has a groove recess extending on a first cooling body side surface, and the groove recess at least partially surrounds the heat pipe. Background Art

[0002] In electrical devices of drive technology, such as frequency converters, heat pipes, such as heat conduits, are used to dissipate the heat loss generated during operation, in particular for dissipating the heat loss in electrical components of power electronics in the middle and higher power ranges, wherein one or more heat pipes distribute the heat loss in or at, for example, an aluminum heat sink evenly from a heat source to multiple cooling locations of the heat sink and thus dissipate the heat efficiently.

[0003] Establishing a mechanically stable and thermally efficient connection of a heat pipe to a cooling body is an expensive and time-consuming process. Therefore, the manufacturing cost of a cooling body equipped with a heat pipe sometimes rises to twice the manufacturing cost of a cooling body without a heat pipe. In many electrical devices, the manufacturing cost of a cooling body with a heat pipe exceeds the planned budget, which leads to the cooling body being designed with a larger volume, especially in the case of expected high power consumption. However, the disadvantage is that a correspondingly large structural space must be preset in the electrical device and it is difficult to achieve a compact structure of the electrical device.

[0004] In order to install the heat pipe in the cooling body, the heat pipe is introduced into the contact surface of the cooling body, so that, for example, a groove for the heat pipe is machined, that is, usually milled, in the cooling body, which groove reflects the shape and cross-section of the corresponding heat pipe. Before the heat pipe is pressed into the corresponding cooling body groove, a heat-conducting material, which mainly serves as an adhesive, is applied to the cooling body groove in the form of a heat-conducting adhesive. After the heat pipe is pressed into the cooling body groove, the heat-conducting adhesive is dried, so that this heat-conducting adhesive connection is cured. Subsequently, the surface of the cooling body with the pressed heat pipe is usually milled again to remove material irregularities and residual heat-conducting adhesive.

[0005] The disadvantage of heat-conducting adhesives (for example compared to metal connections made of copper and / or aluminum) is that they are substantially less heat-conducting, but better than, for example, the partially enclosed air produced in the extrusion cavity. Such thermal barriers in the heat transfer are at least reduced by heat-conducting adhesives.

[0006] Another key disadvantage is that after often short operating times, the heat-conducting adhesive introduced between the cooling element and the heat pipe can clump or become brittle. The thermal resistance of the cooling element is thus significantly increased locally and can impair the operation of the electrical components in the electrical device that are cooled or damage the electrical components and even the entire electrical device. Summary of the invention

[0007] It is therefore an object of the present invention to provide a cooling device having a heat pipe and a cooling body, the mechanical / thermal connection of which is improved compared to the prior art.

[0008] This object is achieved by a cooling device having the features specified in claim 1 and a converter having the cooling device having the features specified in claim 13 .

[0009] To achieve the object, a cooling device is proposed, which comprises a heat pipe and a cooling body for heat dissipation of an electrical component, wherein the cooling body has a groove recess extending at a first cooling body side, the groove recess at least partially surrounding the heat pipe, wherein a heat pipe surface of the heat pipe has a fiber structure made of first fibers in an area surrounded by the groove recess, and wherein the first fibers of the heat pipe surface of the heat pipe form a mechanical connection with the cooling body surface of the cooling body in the area of ​​the groove recess.

[0010] By advantageously using the first fibers of the fiber structure of the heat pipe, which in particular have the material of the heat pipe, the gaps that are usually present in the microscopic range in the groove recesses of the cooling body due to the extrusion of the heat pipe can be filled and thus compensated. The pressure applied during the extrusion usually leads to the heat pipe surface of the heat pipe being connected to the metallic cooling body surface of the cooling body by means of the metallic first fibers in a material-bonded, irreversible or at least partially reversible connection. In this case, the first fibers are a component of the heat pipe surface of the heat pipe.

[0011] As a result, the use of a thermally conductive adhesive for establishing a mechanical / thermal connection between the heat pipe and the cooling element can be advantageously dispensed with, so that the known agglomeration and embrittlement of the thermally conductive adhesive no longer have a negative impact on the thermal resistance of the thermal connection between the heat pipe and the cooling element, and a more mechanically stable metal connection can also be formed in this case.

[0012] Advantageous embodiments of the modular converter are specified in the dependent claims.

[0013] In a first advantageous embodiment of the cooling device, the first heat sink surface has a further fiber structure composed of second fibers in the region of the groove recesses, and the first fibers of the heat pipe surface of the heat pipe form a mechanical connection with the second fibers of the heat sink surface of the heat sink in the region of the groove recesses.

[0014] The fiber structure and the further fiber structure each have a geometric structure similar to brush bristles by means of the first and second fibers. By winding or entwining the first fibers on the heat pipe surface of the heat pipe and the second fibers on the cooling body surface of the cooling body with each other, a favorable mechanical and thermal connection can be formed between the heat pipe surface and the cooling body surface, and between the heat pipe and the cooling body. This particularly strengthens the material-matched mechanical connection of the heat pipe and the cooling body and further improves their thermal coupling.

[0015] The second fibers, if appropriately present, are a component of the cooling body surface of the cooling body.

[0016] In a further advantageous embodiment of the cooling device, the second fibers arranged at the groove edge of the groove recess are longer than the second fibers arranged at the groove bottom of the groove recess.

[0017] This embodiment advantageously takes into account that when the heat pipe with the cooling body is pressed, its force action is mainly exerted in the direction of the groove base. Therefore, the mechanical / thermal connection of the longer second fibers at the groove edge and the first fibers arranged there is equivalent at least in terms of mechanical stability and thermal resistance values, just like the mechanical / thermal connection of the shorter second fibers at the groove base and the first fibers arranged there.

[0018] In a likewise advantageous embodiment of the cooling device, the first heat sink surface has a rough surface structure in the region of the groove recesses, and the first fibers of the heat pipe surface of the heat pipe are mechanically connected to the rough surface structure of the heat sink surface of the heat sink in the region of the groove recesses.

[0019] The first fibers of the heat pipe surface of the heat pipe are wound around the rough surface structure or wedged between the rough surface structures of the cooling body surface of the cooling body and form an advantageous mechanical and thermal connection between the heat pipe surface and the cooling body surface and between the heat pipe and the cooling body.

[0020] In a further advantageous embodiment of the cooling device, the first fibers of the heat pipe surface of the heat pipe penetrate the heat sink surface of the heat sink in the region of the groove recess.

[0021] The first fibers of the heat pipe surface of the heat pipe are inserted into the cooling body surface of the cooling body, so that the first fibers form a particularly mechanical material connection with the cooling body surface in an advantageous manner. The first fibers can also be inserted deeper into the basic structure of the cooling body, which can further improve the mechanical and thermal connection of the heat pipe to the cooling body.

[0022] In a likewise advantageous embodiment of the cooling device, the first fibers of the fiber structure and, if appropriate, the second fibers of the further fiber structure or the rough surface structure have a nanoscale or microscale structure.

[0023] Due to the nanoscale or microscale structure of the first fibers of the fiber structure and, if appropriate, the second fibers of the further fiber structure, extrusion cavities that may be present in the cooling body due to the extrusion of the heat pipe, such as air impurities, can be advantageously filled with the granular metal material of the fibers, so that the thermal resistance of the thermal connection of the heat pipe to the cooling body is improved further, in particular, compared to the introduction of a heat-conducting adhesive. Nanoscale or microscale structures are understood to be dimensions of bodies or structures in the nanoscale or microscale range that are only visible to the human eye under strong magnification.

[0024] In a further advantageous embodiment of the cooling device, the first fibers have barbs and, if present, the second fibers have eyes.

[0025] With this barb, the first fiber establishes a mechanical connection with the cooling body surface, which can hardly be separated without destruction. If a second fiber is present on the cooling body surface, the barb and the eyelet form an improved, more stable mechanical connection, in which the barb hooks. The eyelet is also understood to be an opening in the second fiber, which is formed by the barb piercing the second fiber when the heat pipe is squeezed into the cooling body. The connection formed by the fiber with barb and eyelet is also called a hook-and-loop connection.

[0026] In a likewise advantageous embodiment of the cooling device, the first fibers and, if appropriate, the second fibers are formed by coating with material or by cutting away material.

[0027] If the first fibers and, if present, the second fibers are formed by a material coating, the material of the fibers can differ from the material of the heat pipe or the cooling body. It is advantageous for the material of the second fibers on the cooling body surface to differ from the material of the cooling body, i.e. the material of the basic structure of the cooling body. For this purpose, the cooling body can consist of aluminum or an aluminum alloy, while the surface of the cooling body with the second fibers consists, for example, of copper or a copper alloy. If the first fibers on the heat pipe surface of the heat pipe are then also made of copper, for example, a mechanical material connection with particularly good thermal heat conduction capacity is formed.

[0028] In a further advantageous embodiment of the cooling device, the first fibers of the heat pipe surface of the heat pipe and, if appropriate, the second fibers of the cooling body surface of the cooling body consist of copper or a copper alloy.

[0029] Copper or a copper alloy is a particularly suitable material for the thermal connection of the first fibers of the heat pipe surface of the heat pipe to the cooling body surface of the cooling body and, if appropriate, the second fibers of the cooling body surface of the cooling body, since the thermal resistance of the mechanical / thermal connection can be advantageously reduced in comparison with a connection using, for example, a thermally conductive adhesive or with respect to a connection consisting, for example, of aluminum and copper.

[0030] In a likewise advantageous embodiment of the cooling device, the material of the first fibers of the heat pipe is mechanically harder than the material of the cooling body surface of the cooling body.

[0031] Because the material of the first fibers is advantageously harder than the material of the heat sink surface of the heat sink, the first fibers are deeply embedded in the heat sink surface, which can increase the stability of the mechanical connection, especially when the first fibers have barbs. In addition, the first fibers can also better penetrate the heat sink surface in the basic structure of the heat sink.

[0032] In a further advantageous embodiment of the cooling device, the heat pipe is a heat tube.

[0033] The use of heat pipes as heat conduits in cooling devices has the advantage that, in contrast to gravity-driven thermosyphon two-phase flows, heat conduits can be installed in both horizontal and vertical installation positions. In addition, the procurement costs of heat conduits for dissipating heat of higher power levels of electrical components are lower, since heat conduits are mass-produced, thereby making it possible to provide cooling devices that are also inexpensive.

[0034] In a likewise advantageous embodiment of the cooling device, the heat sink has heat sink ribs on a second heat sink side facing away from the first heat sink side.

[0035] The heat sink ribs on the heat sink are combined with the heat pipes to support the heat dissipation of the electrical components during operation, in such a way that the lost heat of the electrical components can be advantageously dissipated into the surrounding environment.

[0036] Furthermore, in order to achieve this object, a converter is proposed for an electric machine operated on a power grid, the converter having a cooling device according to the invention and an electrical component, wherein the electrical component is mechanically connected to the cooling body of the cooling device in an area of ​​a heat pipe of the cooling device which is at least partially surrounded by the cooling body.

[0037] During operation of the converter or of the electrical components, the heat losses generated therein are advantageously conducted away from the electrical components via heat pipes integrated in the heat sink and discharged from the heat sink to the surrounding environment.

[0038] In an advantageous embodiment of the converter, the heat sink is designed as a converter housing or as part of a converter housing.

[0039] In this case, a cooling device for the converter, ie a cooling body with integrated heat pipes, can be arranged in an advantageous manner from the perspective of spatial layout and expansion, using existing or necessary converter structures, ie the converter housing.

[0040] In a further advantageous embodiment of the converter, the electrical component is a power semiconductor or a power semiconductor module.

[0041] The power semiconductor module can therefore include a plurality of power semiconductors, the heat of which is dissipated by the cooling device during operation of the converter or the power semiconductor module. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] The characteristics, features and advantages of the present invention and their implementation modes and methods will become more clearly understood with reference to the following description of the embodiments, which are described in detail with reference to the accompanying drawings. The accompanying drawings show:

[0043] Figure 1 A schematic diagram showing a metal fiber structure on the surface of a metal body,

[0044] Figure 2 A first schematic cross-sectional view of a cooling device according to the invention is shown, having a first fiber of a fiber structure and a second fiber of a further fiber structure,

[0045] Figure 3 a second schematic cross-sectional view of a cooling device according to the invention showing a first fiber having a fiber structure and a second fiber having a further fiber structure,

[0046] Figure 4 A third schematic cross-sectional view of a cooling device according to the invention is shown, with a rough surface structure of the cooling body surface of the cooling body,

[0047] Figure 5 A fourth schematic cross-sectional view of a cooling device according to the invention is shown, with a first fiber penetrating a cooling body surface of the cooling body,

[0048] Figure 6 A fifth schematic cross-sectional view of a cooling device according to the invention is shown, with a connection of an electrical component to the cooling device,

[0049] Figure 7 Shown according to Figure 6 A schematic top view of a cooling device according to the present invention,

[0050] Figure 8 Shows that according to Figures 2 to 7 Schematic diagram of a converter of a cooling device according to the invention. DETAILED DESCRIPTION

[0051] Figure 1 A metal fiber structure 26 is schematically shown on the surface 24 of the metal body 23. In this case, the metal fiber structure 26 has metal fibers 25 which are substantially perpendicular to the surface 24 of the metal body 23. In addition, Figure 1The illustration of FIG. 2 is greatly exaggerated, since here the metal fibers 25 of the metal fiber structure 26 are designed in the nanometer and micrometer range.

[0052] All described below Figures 2 to 7 The schematic diagrams are strongly exaggerated, and Figures 2 to 7 A cooling device, in particular in the nanoscale and microscale range, is shown, which has a heat pipe 3 which is mechanically / thermally connected to a cooling body 4 .

[0053] Figure 2 A first schematic cross-sectional view of a cooling device according to the invention is shown, which has first fibers 9 of a fiber structure 8 and second fibers 12 of a further fiber structure 11 .

[0054] The heat pipe 3 of the cooling device 1 is mechanically connected to the cooling body 4 of the cooling device 1 by the first fibers 9 of the fiber structure 8 on the heat pipe surface 7 of the heat pipe 3 and the second fibers 12 of the other fiber structure 11 on the cooling body surface 10 of the cooling body 4. Here, the heat pipe 3 is partially surrounded by the groove recess 6, which is arranged at the first cooling body side 5 of the cooling body 4, wherein the first fibers 9 and the second fibers 12 are arranged in the surrounded area. The mechanical connection is basically a material-fit connection (here it is strongly enlarged). The heat pipe 3 and the cooling body 4 form a flat surface at the first cooling body side 5 of the cooling body 4.

[0055] Furthermore, the first fiber 9 has a barb 14 and the second fiber 12 has an eyelet 15, wherein the barb 14 of the first fiber 9 is mechanically connected to the eyelet 15 of the second fiber 12 (here only Figure 2 ). This connection is very stable mechanically and can be referred to as a Velcro connection.

[0056] Figure 3 A second schematic cross-sectional view of a cooling device according to the invention is shown, through a first fiber 9 having a fiber structure 8 and a second fiber 12 having a further fiber structure 11 .

[0057] The heat pipe 3 of the cooling device 1 is mechanically connected to the cooling body 4 of the cooling device 1 by means of the first fibers 9 of the fiber structure 8 on the heat pipe surface 7 of the heat pipe 3 and the second fibers 12 of the other fiber structure 11 on the cooling body surface 10 of the cooling body 4. Here, the heat pipe 3 is partially surrounded by the groove recess 6, which is arranged on the first cooling body side 5 of the cooling body 4, wherein the first fibers 9 and the second fibers 12 are arranged in the surrounded area. The mechanical connection is basically a material-fit connection (here it is strongly enlarged). The heat pipe 3 and the cooling body 4 form a flat surface on the first cooling body side 5.

[0058] The heat pipe 3 and the cooling body 4 can be mechanically connected by pressing the heat pipe 3 in the cooling body 4 onto the first cooling body side 5 of the cooling body 4, wherein during the pressing process, the force is mainly applied in the direction of the groove bottom 22 of the groove recess 6.

[0059] exist Figure 3 The result of the extrusion is shown in the form of an efficient mechanical / thermal connection of the heat pipe 3 to the cooling body 4, wherein the connection of the longer second fibers 12 at the groove edge 21 of the groove recess 6 to the first fibers 9 arranged there is at least equivalent in terms of mechanical stability and thermal resistance values, just like the connection of the shorter second fibers 12 at the groove bottom 22 of the groove recess 6 to the first fibers 9 arranged there.

[0060] Figure 4 A third schematic cross-sectional view of a cooling device according to the invention is shown with a rough surface structure 13 of the cooling body surface 10 of the cooling body 4 .

[0061] The heat pipe 3 of the cooling device 1 is mechanically connected to the cooling body 4 of the cooling device 1 by means of the first fibers 9 of the fiber structure 8 on the heat pipe surface 7 of the heat pipe 3 and the rough surface structure 13 on the cooling body surface 10 of the cooling body 4. Here, the heat pipe 3 is partially surrounded by the groove recess 6, which is arranged on the first cooling body side 5 of the cooling body 4, wherein the first fibers 9 and the rough surface structure 13 are arranged in the surrounded area. The mechanical connection is basically a material-fit connection (here it is strongly enlarged and shown). The heat pipe 3 and the cooling body 4 form a flat surface on the first cooling body side 5.

[0062] The first fibers 9 of the heat pipe surface 7 of the heat pipe 3 have barbs 14 which further improve the wrapping or enveloping on the rough surface structure 13 of the heat sink surface 10 of the heat sink 4 .

[0063] Figure 5 A fourth schematic cross-sectional view of a cooling device 1 according to the invention is shown with first fibers 9 penetrating a cooling body surface 10 of a cooling body 4 .

[0064] The heat pipe 3 of the cooling device 1 is mechanically connected to the cooling body 4 of the cooling device 1 by means of the first fibers 9 of the fiber structure 8 on the heat pipe surface 7 of the heat pipe 3, wherein the first fibers 9 pass through the cooling body surface 10 of the cooling body 4. Here, the heat pipe 3 is partially surrounded by the groove recess 6, which is arranged on the first cooling body side 5 of the cooling body 4, wherein the first fibers 9 are arranged in the surrounded area. The mechanical connection is basically a material-fit connection (here it is strongly enlarged). The heat pipe 3 and the cooling body 4 form a flat surface at the first cooling body side 5.

[0065] The first fibers 9 of the heat pipe surface 7 of the heat pipe 3 have barbs 14 which hook at least onto the heat sink surface 10 of the heat sink 4 . Figure 5 It is also shown that the first fibers 9 are embedded deeper into the basic structure of the heat sink 4 and that the first fibers 9 hook there.

[0066] Figure 6 A fifth schematic cross-sectional view of a cooling device 1 according to the invention is shown with a connection of an electrical component 2 to the cooling device 1 .

[0067] The heat pipe 3 of the cooling device 1 is mechanically connected to the cooling body 4 of the cooling device 1 by means of the first fibers 9 of the fiber structure 8 on the heat pipe surface 7 of the heat pipe 3 and the second fibers 12 of the other fiber structure 11 on the cooling body surface 10 of the cooling body 4. Here, the heat pipe 3 is partially surrounded by the groove recess 6, which is arranged on the first cooling body side 5 of the cooling body 4, wherein the first fibers 9 and the second fibers 12 are arranged in the surrounded area. The mechanical connection is basically a material-fit connection (here it is strongly enlarged and shown). The heat pipe 3 and the cooling body 4 form a flat surface at the first cooling body side 5.

[0068] The electrical components 2 are arranged on a flat surface of the first heat sink side 5 via the heat pipes 3 , so that during operation, heat from the electrical components can be dissipated via the heat pipes 3 and the heat sink 4 .

[0069] The heat sink 4 has heat sink fins 20 on a second heat sink side 19 facing away from the first heat sink side 5. The heat sink fins 20 of the heat sink 4 in combination with the heat pipes 3 support the heat dissipation of the electrical components during operation in such a way that the heat sink fins advantageously dissipate the lost heat of the electrical components 2 to the surrounding environment.

[0070] Figure 7 Shown according to Figure 6 Schematic top view of a cooling device 1 according to the present invention.

[0071] However Figure 7 Not introduced in Figure 6 The heat sink ribs shown in FIG. 2 are not shown because the second heat sink side facing away from the first heat sink side 5 and the heat sink ribs arranged on the second heat sink side are not shown for the sake of clarity.

[0072] Figure 8 Shows that according to Figures 2 to 7 FIG. 1 is a schematic diagram of a converter 16 of a cooling device 1 according to the invention.

[0073] In this case, the converter 16 is connected in an exemplary manner to the grid 18 and the electric machine 17 via three-phase current lines, wherein during operation the converter 16 usually supplies the electric machine 17 with torque- and speed-dependent electrical energy from the grid 18 .

[0074] The electrical components 2 are arranged on the cooling body 4 and on the heat pipes 3 of the cooling device 1 which are integrated in the cooling body 4. The heat loss generated by the electrical components 2 during operation can then be conducted to the cooler area of ​​the cooling body 4 via the heat pipes 3, and the heat loss can be mainly discharged to the environment inside or outside the converter 16 via the cooling body 4.

Claims

1. A cooling device (1) for dissipating heat from an electrical component (2), the cooling device comprising a heat pipe (3) and a cooling body (4), wherein: - the cooling body (4) has a groove recess (6) extending on the first cooling body side (5), the groove recess at least partially surrounding the heat pipe (3), - the heat pipe surface (7) of the heat pipe (3) has a fiber structure (8) consisting of first fibers (9) in the area surrounded by the groove recess (6), and The first fibers (9) of the heat pipe surface (7) of the heat pipe (3) form a mechanical connection with the cooling body surface (10) of the cooling body (4) in the region of the groove recess (6).

2. The cooling device (1) according to claim 1, wherein: The cooling body surface (10) has a further fiber structure (11) consisting of second fibers (12) in the region of the groove recess (6), and the first fibers (9) of the heat pipe surface (7) of the heat pipe (3) form a mechanical connection with the second fibers (12) of the cooling body surface (10) of the cooling body (4) in the region of the groove recess (6).

3. The cooling device (1) according to claim 2, wherein: The second fibers (12) arranged at the groove edge (21) of the groove recess (6) are longer than the second fibers (12) arranged at the groove bottom (22) of the groove recess (6).

4. The cooling device (1) according to claim 1, wherein: The cooling body surface (10) has a rough surface structure (13) in the region of the groove recess (6), and the first fibers (9) of the heat pipe surface (7) of the heat pipe (3) form a mechanical connection with the rough surface structure (13) of the cooling body surface (10) of the cooling body (4) in the region of the groove recess (6).

5. The cooling device (1) according to claim 1, wherein: The first fibers (9) of the heat pipe surface (7) of the heat pipe (3) penetrate the cooling body surface (10) of the cooling body (4) in the region of the groove recess (6).

6. The cooling device (1) according to any one of claims 1 to 5, wherein: The first fibers (9) of the fiber structure have a nanoscale or microscale structure.

7. The cooling device (1) according to any one of claims 1 to 5, wherein: The first fibers (9) of the fiber structure and the second fibers (12) of the further fiber structure or the rough surface structure (13) have a nanoscale or microscale structure.

8. The cooling device (1) according to any one of claims 1 to 5, wherein: The first fiber (9) has a barb (14).

9. The cooling device (1) according to any one of claims 1 to 5, wherein: The first fiber (9) has a barb (14) and the second fiber (12) has an eyelet (15).

10. The cooling device (1) according to any one of claims 1 to 5, wherein: The first fibers (9) are formed by material coating or by material cutting.

11. The cooling device (1) according to any one of claims 1 to 5, wherein: The first fibers (9) and the second fibers (12) are formed by material coating or by material cutting.

12. The cooling device (1) according to any one of claims 1 to 5, wherein: The first fibers (9) on the heat pipe surface (7) of the heat pipe (3) are made of copper or a copper alloy.

13. The cooling device (1) according to any one of claims 1 to 5, wherein: The first fibers (9) on the heat pipe surface (7) of the heat pipe (3) and the second fibers (12) on the cooling body surface (10) of the cooling body (4) are made of copper or a copper alloy.

14. The cooling device (1) according to any one of claims 1 to 5, wherein: The material of the first fibers (9) of the heat pipe (3) is mechanically harder than the material of the cooling body surface (10) of the cooling body (4).

15. The cooling device (1) according to any one of claims 1 to 5, wherein: The heat pipe (3) is a heat pipeline.

16. The cooling device (1) according to any one of claims 1 to 5, wherein: The heat sink (4) has heat sink ribs (20) on a second heat sink side (19) facing away from the first heat sink side (5).

17. A converter (16) for operating an electric machine (17) on a power grid (18), the converter (16) comprising a cooling device (1) and an electric component (2) according to any one of claims 1 to 16, wherein: The electrical component (2) is mechanically connected to the cooling device (1) in the region of a heat pipe (3) of the cooling device (1) which is at least partially surrounded by a cooling body (4).

18. The converter (16) according to claim 17, wherein: The cooling body (4) is designed as a converter housing or as a part of a converter housing.

19. The converter (16) according to claim 17 or 18, wherein: The electrical component (2) is a power semiconductor or a power semiconductor module.

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