Power supply system and method for providing uninterrupted power supply to external equipment

Abstract

The present disclosure provides a power supply system and method for providing uninterrupted power to external devices. The system and method include a power supply module coupled to an AC power source and connected to an external device via a power cable; a switching module coupled to the power cable; and a redundant power supply unit coupled to the AC power source and to the switching module. The switching module detects the electrical status of the power cable and, based on the detected electrical status, connects the redundant power supply unit to the power cable to provide redundant power to the external device.

Description

Technical Field

[0001] The present disclosure relates to a power supply system and a method for providing uninterrupted power supply to external devices. Background Art

[0002] Semiconductor manufacturing facilities use a variety of equipment and systems for processing semiconductor wafers when manufacturing integrated circuits. Integrated circuit (IC) manufacturing includes multiple processing steps performed by various powered processing equipment, including etching, deposition, ion implantation, doping, bonding, etc., and typically forms insulating structures, conductive structures, trenches, vias, metal lines, and passive and active electrical circuit elements such as capacitors, resistors, inductors, transistors, and antennas on semiconductor wafers.

[0003] Many of the processing equipment use DC power.In the case of using expensive processing procedures, since batches of wafers are processed under tight time constraints, it is very important to minimize disruption to the production process. Summary of the Invention

[0004] In one embodiment, a power supply system includes a power supply module having a first input terminal coupled to an AC power source and a first output terminal coupled to an external device via a power connection. The power supply module is used to provide power to the external device via the power connection. The power supply system may further include: a switching module coupled to the power connection; and a redundant power supply unit having a second input terminal coupled to the AC power source and a second output terminal coupled to the switching module. The switching module is used to detect the electrical state of the power connection and, based on the detected electrical state, connect the redundant power supply unit to the power connection for providing redundant power to the external device. The power supply system may further include a housing located outside the external device, the housing being used to accommodate the power supply module, the switching module and the redundant power supply unit.

[0005] In another embodiment, the power supply system includes a plurality of power supply modules. Each power supply module has a first input terminal coupled to an AC power source; and a first output terminal coupled to a corresponding external device via a corresponding power connection. Each power supply module is used to provide power to a corresponding external device via a corresponding power connection. The power supply system may further include a plurality of corresponding switching modules. Each corresponding switching module is coupled to a corresponding power connection. The power supply system may further include a redundant power supply unit, which has: a second input terminal, which is coupled to an AC power source; and a second output terminal, which is coupled to each corresponding switching module. Each corresponding switching module is used to detect the electrical state of the corresponding power connection, and based on the detected electrical state, connect the redundant power supply unit to the corresponding power connection for providing redundant power to the corresponding external device. The power supply system may further include a housing located outside the external device, which is used to accommodate the power supply module, the corresponding switching module and the redundant power supply unit.

[0006] In another embodiment, a method for providing uninterrupted power supply to an external device includes: receiving AC power from an external AC power source, which is contained in a housing outside the external device; converting the received AC power to DC power; powering the external device through the DC power via a power connection; charging the backup power source through the DC power when the backup power source is decoupled from the power connection; detecting DC power on the power connection; and coupling the backup power source to the power connection based on the detected DC power for powering the external device. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] The aspects of the present disclosure will be best understood by the following detailed description when taken in conjunction with the accompanying drawings. It should be noted that, in accordance with standard industry practice, various features are not drawn to scale. In fact, the dimensions of various features may be arbitrarily increased or decreased for clarity of discussion.

[0008] Figure 1 A diagram illustrates a power supply system according to an embodiment of the present disclosure;

[0009] Figure 2 The present invention is illustrated in accordance with an embodiment of the present disclosure. Figure 1 The housing of the power supply system;

[0010] Figure 3 A flowchart illustrating a method for providing redundant power to external devices according to an embodiment of the present disclosure is shown.

[0011]

Explanation of symbols

[0012] 100: Power supply system

[0013] 102: Power supply module / board

[0014] 102A: Power supply module

[0015] 102B: Power supply module

[0016] 104: first input terminal

[0017] 104A: First input terminal

[0018] 104B: first input terminal

[0019] 106:AC power source

[0020] 108: first output terminal

[0021] 108A: First output terminal

[0022] 108B: first output terminal

[0023] 110: External device

[0024] 110A: External equipment

[0025] 110B: External device

[0026] 112: Power wiring

[0027] 112A: Power supply wiring

[0028] 112B: Power supply wiring

[0029] 114: Redundant power supply unit / board

[0030] 116: Second input terminal

[0031] 118: Second output terminal

[0032] 119:Switch module

[0033] 119A: Switching module

[0034] 119B: Switching module

[0035] 120: Shell / Casing

[0036] 121: Switch

[0037] 121A: Switch

[0038] 121B: Switch

[0039] 122:AC / DC converter

[0040] 124: Redundant power supply module

[0041] 125:AC / DC converter

[0042] 126: Power Source / Capacitor

[0043] 130: First node

[0044] 132: Second Node

[0045] 134: Electrical monitoring equipment

[0046] 136: Display

[0047] 202: Slot

[0048] 202A: Slot

[0049] 202B: Slot

[0050] 204: Slot

[0051] 206: Top part

[0052] 208: Side part

[0053] 210: bottom part

[0054] 302: Steps

[0055] 304: Steps

[0056] 306: Steps

[0057] 308: Steps

[0058] 310: Steps

[0059] 312: Steps

[0060] d: distance DETAILED DESCRIPTION

[0061] The following disclosure provides many different embodiments or examples for implementing the different features of the provided subject matter. Specific examples of components and configurations are described below to simplify the present disclosure. Of course, these are merely examples and are not intended to be restrictive. For example, in the following description, forming a first feature on or on a second feature may include an embodiment in which the first and second features are formed to be in direct contact, and may also include an embodiment in which an additional feature may be formed between the first and second features so that the first and second features may not be in direct contact. In addition, the present disclosure may repeat element symbols and / or letters in various examples. This repetition is for simplicity and clarity purposes and does not itself indicate the relationship between the various embodiments and / or configurations discussed.

[0062] Spatially relative terms, such as "below," "beneath," "below," "above," "upper," "in front of," "behind," and the like, may be used herein for convenience of description to describe one element or feature in relationship to another element or feature, as exemplified in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein should be interpreted accordingly.

[0063] Wafers are typically processed in batches (referred to as lots). Depending on the process, wafers may be processed in tanks or chambers, such as plasma processing chambers, chemical vapor deposition chambers, physical vapor deposition chambers, ion implantation chambers, and photolithography chambers. Wafers may also be cleaned, etched, and rinsed in the tanks or chambers. Processing chambers, tanks, and other processing / containment systems, as well as other associated components such as wafer transport / delivery systems and automated systems or equipment, such as robotics, are typically powered by a DC source.

[0064] Typically, these powered components of the processing system have an integrated DC power source or an integrated AC / DC conversion system, and / or a power system combined with other control circuitry for controlling the integrated power system and / or controlling the powered components during wafer processing. Due at least to the integration of the DC power system or AC / DC conversion system with the powered processing components and / or with the control system, the DC power systems of known DC powered devices are susceptible to overheating, leading to power failures or power inconsistencies, such as power spikes, thereby disrupting production or the production of substandard products. It would be advantageous to provide a system and method for addressing these issues.

[0065] Figure 1The diagram illustrates a power supply system 100 according to an embodiment of the present disclosure. In the illustrated embodiment, the power supply system 100 includes a power supply module 102 having a first input 104 coupled to an AC power source 106 and a first output 108 coupled to an external device 110 via a power connection 112. According to some embodiments of the present disclosure, the AC power source 106 is a power transformer for the external device 110. The power supply module 102 is configured to provide power to the external device 110 via the power connection 112. The illustrated power supply system 100 also includes a redundant power supply unit 114 having a second input 116 coupled to the AC power source 106 and a second output 118 coupled to the power connection 112. The power supply system 100 also includes a switching module 119. The switching module 119 is configured to detect an electrical state of the power connection 112 and, based on the detected electrical state, couple the redundant power supply unit 114 to the power connection 112 to provide backup power (also referred to as redundant power) to the external device 110, or decouple the redundant power supply unit 114 from the power connection 112. According to the disclosed embodiments, the system also includes a housing 120, such as a chassis, a rack, or a frame. The following describes embodiments according to the present disclosure with reference to the housing 120; however, the embodiments of the present disclosure are not limited to the housing being a chassis. The housing 120 supports, and in some embodiments, encloses, the power supply module 102, the switching module 119, and the redundant power supply unit 114.

[0066] According to an embodiment of the present disclosure, the power supply module 102 includes an AC / DC converter 122. The AC / DC converter 122 is configured to convert a 220V AC signal received at a first input terminal 104 from an AC power source 106 to a 24V DC signal, as measured at a first output terminal 108 of the power supply module 102. However, the scope of the present disclosure encompasses AC / DC converters adapted to convert a 110V AC signal or a 220V AC signal to a 12V or 24V DC signal, as well as to step down an AC signal to any DC voltage or DC current. The AC / DC converter 122 may include one or more of the following components, including components such as a transformer, a full-wave rectifier, a smoothing capacitor, and a voltage regulator. AC / DC converters are well known in the art of one embodiment of the present disclosure and will not be described in further detail.

[0067] In another embodiment of the present disclosure, the power supply module 102 is a power supply board 102 that is used to mount the AC / DC converter 122 and any circuitry used in conjunction with the AC / DC converter. The power supply board includes a circuit board and may have metal wires, connectors, and other electrical components such as resistors, capacitors, inductors, and transistors formed as integrated circuits and / or discrete components.

[0068] In another embodiment of the present disclosure, the power supply module 102 may optionally include a switching module 119. For example, the AC / DC converter 122 and the switching module 119 may be mounted to the power supply board 102.

[0069] Figure 2 The diagram illustrates a housing 120 according to an embodiment of the present disclosure. The housing 120 includes a slot 202 for receiving the power supply module 102. In one embodiment, the housing 120 is configured to receive the power supply board 102. According to one embodiment of the present disclosure, the slot 202 and the power supply board 102 are configured with corresponding electrical contacts (not shown) and corresponding locking tabs (not shown) such that when the power supply board 102 is slid into the slot 202, the corresponding tabs engage with each other to lock the power supply board 102 in place, and the corresponding electrical contacts engage with each other to electrically connect the power supply board 102 to electrical components of the power supply system 100 (such as the power connector 112 and / or the switching module 119).

[0070] The power supply plate 102 can also be easily removed from the power supply system 100 by disengaging the corresponding locking tabs and pulling the power supply plate 102 from the slot 202. In one embodiment, the operator can, for example, push, pull, and / or rotate the locking tabs to disengage and / or engage the tabs with each other. However, the scope of this disclosure also encompasses securing the power supply plate 102 in place within the slot 202 via screws, clamps, bars, or other mechanically removable connections.

[0071] Reference again Figure 1According to another embodiment of the present disclosure, the redundant power supply unit 114 includes a redundant power supply module 124 coupled between the second input terminal 116 of the redundant power supply unit 114 and the second output terminal 118 of the redundant power supply unit 114. According to an embodiment of the present disclosure, the redundant power supply unit 114 further includes a backup power source 126 coupled to the second output terminal 118 of the redundant power supply unit 114. In one embodiment, the redundant power supply module 124 is configured to charge the backup power source 126. For example, in one embodiment, the redundant power supply module 124 is configured to charge the backup power source 126 when the redundant power supply unit 114 is decoupled from the power connection 112 via the switching module 119. According to an embodiment of the present disclosure, the redundant power supply unit is electrically connected to and powered by a power transformer for the external device 110.

[0072] According to an embodiment of the present disclosure, redundant power supply module 124 includes an AC / DC converter 125 (also referred to as a redundant AC / DC converter) configured to convert a 220V AC signal received at second input 116 of redundant power supply unit 114 to a 24V DC signal, as measured at second output 118 of redundant power supply unit 114. AC / DC converter 125 may be the same as AC / DC converter 122 of power supply module 102, or may be different. The scope of the present disclosure encompasses AC / DC converters adapted to convert a 110V AC signal or a 220V AC signal to a 12V or 24V DC signal, as well as to step down an AC signal to any DC voltage or DC current. AC / DC converter 125 may include one or more of the following components, including components such as a transformer, a full-wave rectifier, a smoothing capacitor, and a voltage regulator.

[0073] According to another embodiment of the present disclosure, the redundant power supply module 124 is a power supply board 124 (also referred to as a redundant power supply board 124), which is used to mount a redundant AC / DC converter 125 and any circuits used in conjunction with the AC / DC converter. Figure 2The housing 120 includes a slot 204 for receiving the redundant power supply module 124. In one embodiment, the housing 120 is configured to receive the redundant power supply board 124. The slot 204 and the redundant power supply board 124 are configured with corresponding electrical contacts (not shown) and corresponding locking tabs (not shown), such that when the redundant power supply board 124 is slid into the slot 204, the corresponding tabs engage with each other to lock the redundant power supply board 124 in place, and the corresponding electrical contacts engage with each other to electrically connect the redundant power supply board 124 to electrical components of the power supply system 100 (such as the backup power source 126 and / or the switching module 119).

[0074] The redundant power supply board 124 can also be easily removed from the power supply system 100 by disengaging the corresponding locking tabs and pulling the redundant power supply board 124 from the slot 204. In one embodiment, the operator can, for example, push, pull, and / or rotate the locking tabs to disengage and / or engage the tabs with each other. However, the scope of this disclosure also encompasses securing the redundant power supply board 124 in place within the slot 204 via screws, clamps, rods, or other mechanically removable connections.

[0075] In another embodiment of the present disclosure, the redundant power supply unit 114 is configured as a redundant power supply board, in which the redundant power supply module 124, the backup power source 126, and optionally the switching module 119 are electrically mounted. In this embodiment, the slot 204 of the housing 120 is configured to receive the redundant power supply board. The slot 204 and the redundant power supply board can be configured with corresponding electrical contacts (not shown) and corresponding locking tabs (not shown), such that when the redundant power supply board is slid into the slot 204, the corresponding tabs engage with each other to lock the redundant power supply board in place, and the corresponding electrical contacts engage with each other to electrically connect the redundant power supply board to other electrical components of the power supply system 100 (such as the switching module 119 or the power wiring 112).

[0076] Reference again Figure 1 In another embodiment of the present disclosure, the backup power source 126 has a first node 130 and a second node 132. The first node 130 of the backup power source 126 is coupled to the second output terminal 118 of the redundant power supply unit 114, and the second node 132 of the backup power source 126 is coupled to ground (e.g., the ground of the power supply system 100).

[0077] In one embodiment of the present disclosure, the backup power source 126 is a power capacitor 126. The power capacitor 126 can be any capacitor for 25 volts or higher. In another embodiment of the present disclosure, the backup power source 126 is a battery for 25 volts or higher. In one embodiment, a first plate (not shown) of the power capacitor 126 (or battery) is coupled to a first node 130, and a second plate (not shown) of the power capacitor 126 (or battery) is coupled to a second node 132 (i.e., coupled to ground). Embodiments according to the present disclosure are not limited to power capacitors and batteries that store 25 volts or higher. The embodiments described herein include power capacitors or batteries that cannot store 25 volts or higher, for example, power capacitors or batteries that can only store less than 25 volts.

[0078] The switching module 119 is configured to detect the electrical status of the power connection 112 and, based on the detected electrical status, couple / decouple the redundant power supply unit 114 to / from the power connection 112. According to one embodiment of the present disclosure, the electrical status is the voltage on the power connection 112, the current on the power connection 112, and / or the power on the power connection 112. The electrical status may also include the resistance of the power connection 112, which can be used to determine, for example, whether the power connection 112 is shorted to ground or whether the power connection 112 is open.

[0079] In one embodiment, the switching module 119 includes a switch 121 that closes or remains closed when the switching module 119 detects that the voltage on the power connection 112 is less than a predefined minimum voltage threshold or greater than a predefined maximum voltage threshold, or that the current on the power connection 112 is less than a predefined minimum current threshold or greater than a predefined maximum current threshold, and / or that the power on the power connection 112 (e.g., the power delivered to the external device 110 via the power connection 112) is less than a predefined minimum power threshold or greater than a predefined maximum power threshold. When one of the above-defined electrical states of the power connection 112 is detected, the power supply module 102 provides the external device 110 with a small amount of power, voltage, and / or current, or excess power, voltage, and / or current for proper operation of the external device 110. When the switch 121 is closed, the backup power source 126 is connected to the external device 110 via the power connection 112, and the backup power source 126 provides sufficient power (also known as redundant power) and / or voltage and / or current to the external device 110. Thus, the power supply system 100 provides an uninterrupted supply of in-spec operating power, voltage, and / or current to the external device 110 regardless of whether the power supply module 102 is malfunctioning, has malfunctioned, or is operating in a sub-spec manner.

[0080] Although not illustrated, the switching module 119 may include integrated circuits and / or discrete components, such as resistors, capacitors, and inductors, for measuring voltage, current, and / or power on the power connection 112. Circuits for measuring voltage, current, and power on electrical connections are well known in the art and will not be discussed in further detail.

[0081] In another embodiment of the present disclosure, the switch 121 is configured to open or remain open when the switching module 119 detects that the voltage on the power connection 112 is greater than or equal to a predefined minimum voltage threshold and less than or equal to a predefined maximum voltage threshold, the current on the power connection 112 is greater than or equal to a predefined minimum current threshold and less than or equal to a predefined maximum current threshold, and / or the power on the power connection 112 is greater than or equal to a predefined minimum power threshold and less than or equal to a predefined maximum power threshold. When the switch 121 is in the open state, the external device 110 is disconnected from the backup power source 126. By disconnecting the backup power source 126 from the external device 110, the backup power source 126 can be effectively recharged by the redundant power supply module 124.

[0082] In another embodiment of the present disclosure, the housing 120 is a casing used as a heat sink for the power supply module 102, the redundant power supply unit 114 and / or the switch module 119. Figure 2According to an embodiment of the present disclosure, the housing 120 includes a top portion 206, side portions 208, and a bottom portion 210, or any combination of the top portion 206, side portions 208, and bottom portion 210. According to one embodiment, the top portion 206, side portions 208, and / or bottom portion 210, or any combination of the top portion 206, side portions 208, and bottom portion 210, serve as a heat sink for the power supply module 102, the redundant power supply unit 114, and / or the switching module 119. For example, any of the top portion 206, side portions 208, and bottom portion 210 of the housing 120 may be formed of metal (e.g., a metal with relatively high thermal conductivity), may have a contoured surface, and / or may have slotted openings for conducting heat from the interior of the housing 120 to the exterior of the housing 120 and to the surrounding environment. According to other embodiments, the housing 120 may be a frame or housing frame that does not include a top, side, and / or bottom portion. According to such alternative embodiments, the housing 120 is open at one or more of its top, side, and / or bottom sides. In such alternative embodiments, the housing 120 includes heat-conducting structures, such as heat-conducting fins, designed to dissipate thermal energy to the environment surrounding such heat-conducting structures. The housing 120 includes a thermal energy path along which thermal energy from the power supply module 102, the redundant power supply unit 114, and / or the switching module 119 is transferred to the heat-conducting structures.

[0083] In addition, although not illustrated, thermally conductive strips may connect portions of the top portion 206, side portion 208 and / or bottom portion 210 of the housing 120 to portions of the power supply module 102, redundant power supply unit 114 and / or switching module 119 (such as portions of the power supply board 102 and the redundant power supply board 114). Alternatively, the power supply board 102, the redundant power supply board 114 and the slots 202, 204 can be configured so that when the power supply board 102, the redundant power supply board 114 is inserted into the corresponding slots 202, 204, contact occurs between the power supply board 102, the redundant power supply board 114 (for example, the edges of the power supply board 102, the redundant power supply board 114 (not shown)) and the top portion 206, the side portion 208 and / or the bottom portion 210 of the housing 120, thereby allowing heat to be transferred from the power supply board 102, the redundant power supply board 114 to the top portion 206, the side portion 208 and / or the bottom portion 210 of the housing 120.

[0084] According to another embodiment of the present disclosure, the power supply system 100 may include an electrical monitoring device 134 having a display 136, such as a display 136. Figure 1 and Figure 2The electrical monitoring device 134 can be attached to the housing 120, for example, to the side portion 208 of the housing, so that the electrical monitoring device 134 is not contained within the housing 120. The electrical monitoring device 134 can be coupled to the power supply module 102 and, optionally, to the redundant power supply unit 114. The electrical monitoring device 134 is configured to detect the electrical status of the power supply module 102 and the redundant power supply unit 114 and display the electrical status of the power supply module 102 and the redundant power supply unit 114 on the display 136. For example, the electrical status of the power supply module 102 and the redundant power supply unit 114 may include any internal voltage, current, or power measured relative to any components or wiring connections comprising the power supply module 102 and the redundant power supply unit 114 (such as transformers, rectifiers, capacitors, voltage regulators), as well as, optionally, the backup power source 126 and / or the switching module 119. Although not illustrated, the electrical monitoring device 134 may include integrated circuits and / or discrete components such as resistors, capacitors, and inductors for measuring voltage, current, and / or power of circuit elements of the electrical system.

[0085] In addition to detecting the electrical status of the power supply module 102 and, optionally, the redundant power supply unit 114, the electrical monitoring device 134 can be configured to generate warning messages displayed on the display 136 and / or audio warning messages sent to a speaker (not shown) based on the detected electrical status. Thus, a system operator can be alerted that a power supply module is performing inefficiently, is malfunctioning, or has failed. The operator can then replace the failed power supply module, such as the power supply module 102, with a new one. The failure or inefficient performance of the power supply module and its replacement can be performed without any interruption in power to the external device 110, as the backup power source 126 of the redundant power supply unit 114 will continue to supply power to the external device 110 until the new power supply module is installed and provides sufficient (i.e., compliant) power to the external device 110 via the power connection 112, as measured by the switching module 119.

[0086] Alternatively or additionally, the electrical monitoring device 134 may be coupled to the power connection 112 and / or the switching module 119. In this embodiment, the electrical monitoring device 134 is additionally configured to detect the electrical status of the power connection 112 and / or the switching module 119 and display the electrical status of the power connection 112 and / or the switching module 119 on the display 136. For example, the electrical status of the power connection 112 may include the voltage on the power connection 112, the current on the power connection 112, and / or the power on the power connection 112. The electrical status may also include the resistance of the power connection 112, which can be used to determine, for example, whether the power connection 112 is shorted to ground or whether the power connection 112 is open. In addition to detecting the electrical status of the power connection 112 and / or the switching module 119 and displaying the electrical status on the display 136, the electrical monitoring device 134 can be used to generate a warning message displayed on the display 136 or an audio warning message sent to a speaker (not shown) based on the detected electrical status of the power connection 112 and / or the switching module 119.

[0087] In another embodiment of the present disclosure, and as described by Figure 1 As illustrated, the housing 120 is configured to be physically separated from the external device 110. For example, in the illustrated embodiment, the minimum distance between the housing 120 and the external device is indicated by the distance d. By containing the components of the power supply module 102 and / or one or more of the redundant power supply units 114 in the housing 120 spaced apart from the external device 110 being powered, thermal energy generated by the components of the power supply module 102 and, optionally, one or more of the redundant power supply units 114 is easily removed from such components and more easily dissipated into the environment. This reduces the risk that any of the components enclosed by the housing 120 will be exposed to temperatures that cause the components to overheat, which could otherwise cause such components to fail. The distance d will depend on the type of external device 110 and the operation of the external device 110, the amount of heat energy generated by the components of the power supply module 102 and, optionally, the redundant power supply unit 114, the ambient temperature of the surrounding environment in which the chassis 120 is located, and the power generated by the power supply board 102, the redundant power supply unit 114, and the switching module 119 of the chassis 120. Examples of suitable distances d are within a wide range, for example, within 1 meter, within 2 meters, within 3 meters, or within 5 meters. The embodiments of the present disclosure are not limited to the aforementioned values ​​of distance d. Distance d can be a distance outside the aforementioned ranges.

[0088] In one embodiment according to the present disclosure, external device 110 is a powered component of a semiconductor processing system, such as a deposition chamber, an ion impact chamber, or an etching chamber / reservoir. The semiconductor processing system may be used for the fabrication of integrated circuits on semiconductor wafers. However, embodiments of the present disclosure may be implemented in any DC power supply system where minimizing the risk of power failure, delivering uninterrupted power, and controlling heat dissipation are critical.

[0089] In another embodiment according to the present disclosure, and as Figure 1 As illustrated, the power supply system 100 includes a plurality of power supply modules, including optional power supply modules 102A, 102B. Figure 1 The diagram illustrates three power supply modules 102, 102A, and 102B. The scope of this disclosure includes more than three power supply modules. Each of power supply modules 102A and 102B has a first input 104A / 104B coupled to an AC power source 106, and a first output 108A / 108B coupled to a corresponding external device 110A / 110B via a corresponding power connection 112A / 112B. Each power supply module 102A, 102B is configured to provide power to a corresponding external device 110A, 110B via a corresponding power connection 112A, 112B. The power supply system 100 may also include multiple switching modules, including optional switching modules 119A and 119B. In one embodiment of the present disclosure, the switching module 119A includes a switch 121A, and the switching module 119B includes a switch 121B. The switching modules 119A and 119B are respectively coupled to the corresponding power connections 112A and 112B. The second output end 118 of the redundant power supply unit 114 is coupled to each of the switching modules 119A and 119B. Each of the switching modules 119A and 119B is used to detect the electrical state of the corresponding power connection 112A and 112B, and based on the detected electrical state, the redundant power supply unit 114 is connected to the corresponding power connection 112A and 112B for providing redundant power (i.e., backup power) to the corresponding external devices 110A and 110B. The housing 120 is used to enclose a plurality of power supply modules 102, 102A, 102B, a plurality of corresponding switching modules 119, 119A, 119B, and the redundant power supply unit 114. As Figure 2 As illustrated, the slots 202A, 202B may be used to receive the power supply modules 102A, 102B, respectively.

[0090] although Figure 1 and Figure 2While only one electrical monitoring device 134 is illustrated, the scope of this disclosure includes embodiments having multiple electrical monitoring devices 134, wherein each electrical monitoring device 134 is coupled to a corresponding power supply module 102, and one electrical monitoring device 134 may be coupled to a redundant power supply unit 114. Therefore, if a system includes n power supply modules 102 and one redundant power supply unit 114, the system may include n+1 electrical monitoring devices 134.

[0091] Figure 3 A flow chart illustrating a method 300 for providing uninterrupted power to an external device according to an embodiment of the present disclosure is provided. At step 302, AC power is received from an external AC power source. For example, the power supply module 102 and the redundant power supply unit 114 may receive an AC signal, such as a 220V AC signal, from the external AC power source 106.

[0092] At step 304, the received AC power is converted to DC power. For example, both the power supply module 102 and the redundant power supply unit 114 may convert a received AC signal (e.g., a 220V AC signal) to a DC signal (e.g., a 24V DC signal). However, the scope of the present disclosure encompasses converting any AC signal to any DC signal.

[0093] In step 306, the external device is powered by the DC power supply. For example, the power supply module may provide DC power via the power connection for powering the external device.

[0094] At step 308, the backup power source is charged via the DC power source. For example, the redundant power supply unit charges the backup power source via the DC power source. In one embodiment of the present disclosure, the redundant power supply unit charges the backup power source when the backup power source is decoupled from the power supply wiring.

[0095] At step 310 , a DC power source is detected on the power connection. For example, the switching module includes circuitry for detecting power, voltage, and / or current on the power connection.

[0096] In step 312, a backup power source is coupled to the power wiring based on the detected DC power for powering the external device. For example, the switching module may include a switch that is closed based on the detected DC power for coupling the backup power source to the power wiring for powering the external device. In one embodiment, the backup power source is coupled to the power wiring when the detected DC power is below a predefined minimum DC power threshold or above a predefined maximum DC power threshold. In another embodiment, the backup power source may be decoupled from the power wiring when the detected DC power is greater than or equal to the predefined minimum DC power threshold and less than or equal to the predefined maximum DC power threshold. In another embodiment according to the present disclosure, the backup power source is a power capacitor or a battery. In one embodiment, the power capacitor or battery is charged to at least 25V.

[0097] The present disclosure provides a power supply system and method that provides uninterrupted power supply to external devices and reduces the risk of power failure of the power supply system due to overheating of the power supply system by providing a heat sink for the power supply system and / or physically separating the power supply system from the external devices powered by the power supply system so as to control the dissipation of heat generated by the power supply system and mitigate the effects of heat generated by the external devices on the power supply system. In the event of a power failure or substandard output, the power supply system and method of the present disclosure provides uninterrupted delivery of backup power to the external devices until the subsystem providing the failed power can be replaced. The power supply system and method of the present disclosure provides uninterrupted delivery of power in the event of a power failure and during the replacement of the failed power supply subsystem with a new power supply subsystem. In addition, the power supply system and method of the present disclosure provides monitoring of system components and efficient replacement of failed components detected by monitoring.

[0098] In one embodiment, a power supply system includes a power supply module having a first input coupled to an AC power source and a first output coupled to an external device via a power connection. The power supply module is configured to provide power to the external device via the power connection. The power supply system may further include a switching module coupled to the power connection; and a redundant power supply unit having a second input coupled to the AC power source and a second output coupled to the switching module. The switching module is configured to detect an electrical state of the power connection and, based on the detected electrical state, connect the redundant power supply unit to the power connection to provide redundant power to the external device. The power supply system may further include a housing located outside the external device, the housing accommodating the power supply module, the switching module, and the redundant power supply unit. The housing may be, for example, a casing. The casing encloses the power supply module, the switching module, and the redundant power supply unit. In one embodiment, the power supply module includes an AC / DC converter. The AC / DC converter is configured to convert a 220V AC signal at the first input to a 24V DC signal at the first output. In one embodiment, the power supply module includes a power supply board. The power supply board is used to mount an AC / DC converter. The housing includes a slot. The slot is used to removably receive the power supply board. In one embodiment, the redundant power supply unit includes a redundant power supply module and a backup power source. The redundant power supply module is coupled between a second input terminal and a second output terminal of the redundant power supply unit. The backup power source is coupled to the second output terminal of the redundant power supply unit. The redundant power supply module is used to charge the backup power source. The switching module includes a switch. The switch is closed based on a detected electrical state of the power wiring to provide redundant power to an external device. In one embodiment, the redundant power supply module includes a redundant AC / DC converter. The redundant AC / DC converter is used to convert a 220V AC signal at the second input terminal to a 24V DC signal at the second output terminal. In one embodiment, the redundant power supply module includes a redundant power supply board. The redundant power supply board is used to mount the redundant AC / DC converter. The housing includes a redundant slot. The redundant slot is used to removably receive the redundant power supply board. In one embodiment, the backup power source is a power capacitor. The power capacitor is configured to store at least 25 volts. In one embodiment, the power capacitor has a first node and a second node. The first node is coupled to the second output terminal of the redundant power supply unit, and the second node is coupled to ground.In one embodiment, the electrical state is one or more of the voltage on the power wiring, the current on the power wiring, and the power on the power wiring, and the switch is configured to close when at least one of the following occurs: the voltage is less than a predefined minimum voltage threshold or greater than a predefined maximum voltage threshold; the current is less than a predefined minimum current threshold or greater than a predefined maximum current threshold; and the power is less than a predefined minimum power threshold or greater than a predefined maximum power threshold. In one embodiment, the switch is configured to open when at least one of the following occurs: the voltage is greater than or equal to a predefined minimum voltage threshold and less than or equal to a predefined maximum voltage threshold; the current is greater than or equal to a predefined minimum current threshold and less than or equal to a predefined maximum current threshold; and the power is greater than or equal to a predefined minimum power threshold and less than or equal to a predefined maximum power threshold. In one embodiment, the housing is a chassis. The chassis serves as a heat sink for at least one of the power supply module, the switching module, and the redundant power supply unit. In one embodiment, the power supply system further includes an electrical monitoring device. The electrical monitoring device has a display. An electrical monitoring device is attached to the housing and coupled to at least the power supply module. The electrical monitoring device is configured to detect an electrical status of the power supply module and display the electrical status of the power supply module on a display. In one embodiment, the power supply module includes an AC / DC converter having AC / DC converter electrical components, and the electrical status of the power supply module is one of: a voltage of any of the AC / DC converter electrical components; a current of any of the AC / DC converter electrical components; and a power of any of the AC / DC converter electrical components. In one embodiment, the housing is physically separate from the external device. In one embodiment, the power supply module is configured to provide DC power to the external device. The redundant power supply unit is configured to provide redundant DC power to the external device. The external device is a powered component of the semiconductor processing system.

[0099] In another embodiment, a power supply system includes multiple power supply modules. Each power supply module has a first input coupled to an AC power source and a first output coupled to a corresponding external device via a corresponding power connection. Each power supply module is configured to provide power to a corresponding external device via the corresponding power connection. The power supply system may further include multiple corresponding switching modules. Each corresponding switching module is coupled to a corresponding power connection. The power supply system may further include a redundant power supply unit having a second input coupled to the AC power source and a second output coupled to each corresponding switching module. Each corresponding switching module is configured to detect an electrical state of a corresponding power connection and, based on the detected electrical state, connect the redundant power supply unit to the corresponding power connection to provide redundant power to the corresponding external device. The power supply system may further include a housing located outside the external device, the housing housing the power supply modules, the corresponding switching modules, and the redundant power supply unit. The housing may be, for example, a casing. The casing encloses the multiple power supply modules, the multiple corresponding switching modules, and the redundant power supply unit.

[0100] In another embodiment, a method for providing an uninterrupted power supply to an external device includes: receiving AC power from an external AC power source, the external AC power source being contained within a housing external to the external device; converting the received AC power to DC power; powering the external device via the DC power supply via a power connection; charging the backup power source via the DC power supply when the backup power source is decoupled from the power connection; detecting DC power on the power connection; and coupling the backup power source to the power connection based on the detected DC power for powering the external device. In one embodiment, the method for providing an uninterrupted power supply to an external device further includes: coupling the backup power source to the power connection when the detected DC power is below a predefined minimum DC power threshold or above a predefined maximum DC power threshold. In one embodiment, the method for providing an uninterrupted power supply to an external device further includes: decoupling the backup power source from the power connection when the detected DC power is greater than or equal to a predefined minimum DC power threshold and less than or equal to a predefined maximum DC power threshold. In one embodiment, the external AC power source comprises a 220V external AC power source. The step of converting the received AC power to DC power includes the steps of converting a 220V AC signal to a 24V DC signal, and wherein the backup power source is a power capacitor, the power capacitor being charged to at least 25V.

[0101] The foregoing summarizes the features of several embodiments so that those skilled in the art can better understand the various aspects of the present disclosure. Those skilled in the art should understand that they can easily use this disclosure as a basis for designing or modifying other processes and structures to achieve the same purposes and / or achieve the same advantages as the embodiments described herein.

[0102] Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions and alterations without departing from the spirit and scope of the present disclosure.

Claims

1. A power supply system for a semiconductor processing system to be charged, characterized in that: include: a plurality of power supply modules, each having a first input coupled to an AC power source and a first output coupled to the semiconductor processing system to be charged via a power connection, each power supply module configured to provide power to the semiconductor processing system to be charged via the power connection of the respective power supply module; a plurality of switching modules, each of the switching modules being coupled to one of the power supply modules and having a circuit for detecting an electrical state of the power connection of the respective power supply module coupled to the switching module, each of the switching modules comprising a first terminal, a second terminal, and a switch, the first terminal being coupled to the first output terminal of the respective power supply module connected to the switching module; a redundant power supply unit having a second input coupled to the AC power source and a second output coupled to the second terminal of each of the switching modules, wherein each of the switching modules is configured to connect the redundant power supply unit to the power connection of the respective power supply module coupled to the switching module by changing a state of the switch of the respective switching module based on the detected electrical state, wherein the redundant power supply unit comprises: a redundant power supply module; as well as a backup power capacitor comprising a first node, wherein the redundant power supply module is directly coupled to the first node, and the first node is directly coupled to the second output end, wherein when the redundant power supply unit is coupled to one of the power connections, the redundant power supply module provides a DC power to the second output end through the first node, wherein when the redundant power supply unit is decoupled from the power connections, the redundant power supply module charges the backup power capacitor through the first node; and a housing configured to serve as a heat sink for the power supply modules, the switching modules, and the redundant power supply unit, wherein the housing is physically separated from the semiconductor processing system being charged by a predetermined distance to reduce thermal impact of the semiconductor processing system on the power supply modules, the switching modules, and the redundant power supply unit and to facilitate heat dissipation, the predetermined distance being selected at least in part based on one or more of a type of the semiconductor processing system being charged, a heat output of the semiconductor processing system being charged, a heat output of the power supply system, or an ambient temperature of an environment in which the housing is located; The power supply modules include a first power supply module and a second power supply module, the power connections include a first power connection and a second power connection, the semiconductor processing system includes a first external device and a second external device, and the switching modules include a first switching module and a second switching module. The first input end of the first power supply module is electrically coupled to the AC power source, the first output end of the first power supply module is electrically coupled to the first external device via the first power connection, and the first switching module electrically couples the second output end of the redundant power supply unit to the first power connection. The first input end of the second power supply module is electrically coupled to the AC power source, the first output end of the second power supply module is electrically coupled to the second external device via the second power connection, and the second switching module electrically couples the second output end of the redundant power supply unit to the second power connection.

2. The power supply system according to claim 1, wherein: Each of the power supply modules includes an AC / DC converter, and the AC / DC converter is used to convert a 220VAC signal at the first input end into a 24V DC signal at the first output end.

3. The power supply system according to claim 2, wherein: Each of the power supply modules includes a power supply board for mounting the AC / DC converter, and the housing includes a slot for removably receiving the power supply board.

4. The power supply system according to claim 1, wherein: The redundant power supply module is coupled between the second input terminal of the redundant power supply unit and the second output terminal of the redundant power supply unit, and wherein the switch is used to close based on the detected electrical status of the power connections to provide the redundant power supply of the semiconductor processing system to be charged.

5. The power supply system according to claim 4, wherein: The redundant power supply module includes a redundant AC / DC converter. The redundant AC / DC converter is used to convert a 220V AC signal at the second input end into a 24V DC signal at the second output end.

6. The power supply system according to claim 5, wherein: The redundant power supply module includes a redundant power supply board, which is used to install the redundant AC / DC converter, wherein the shell includes a redundant slot, which is used to removably accommodate the redundant power supply board, and wherein the redundant power supply board in the redundant slot can support heat conduction from the redundant power supply board to the shell.

7. The power supply system according to claim 4, wherein: The backup power capacitor is used to store at least 25 volts.

8. The power supply system according to claim 7, wherein: The backup power capacitor has a second node coupled to ground.

9. The power supply system according to claim 4, wherein: The electrical state is one or more of a voltage on one of the power connections, a current on the one of the power connections, and a power on the one of the power connections, and wherein the switch is configured to close when at least one of: the voltage is less than a predefined minimum voltage threshold or greater than a predefined maximum voltage threshold; the current is less than a predefined minimum current threshold or greater than a predefined maximum current threshold; and the power is less than a predefined minimum power threshold or greater than a predefined maximum power threshold.

10. The power supply system according to claim 9, wherein: The switch is configured to open when at least one of the following conditions occurs: the voltage is greater than or equal to the predefined minimum voltage threshold and less than or equal to the predefined maximum voltage threshold; the current is greater than or equal to the predefined minimum current threshold and less than or equal to the predefined maximum current threshold; And the power is greater than or equal to the predefined minimum power threshold and less than or equal to the predefined maximum power threshold.

11. The power supply system according to claim 1, wherein: The housing is a casing, and the casing includes a heat conduction structure and a heat energy path for conducting heat energy from the power supply module, the switching module and the redundant power supply unit to the heat conduction structure.

12. The power supply system according to claim 1, wherein: It further includes an electrical monitoring device having a display, the electrical monitoring device being attached to the housing and coupled to at least one of the power supply modules, the electrical monitoring device being used to detect an electrical state of the at least one of the power supply modules and display the electrical state of the at least one of the power supply modules on the display.

13. The power supply system according to claim 12, wherein: At least one of the power supply modules includes an AC / DC converter having AC / DC converter electrical components, and the electrical state of the at least one of the power supply modules is one of: a voltage of any of the AC / DC converter electrical components; a current of any of the AC / DC converter electrical components; and a power of any of the AC / DC converter electrical components.

14. The power supply system according to claim 1, wherein: The semiconductor processing system that is charged includes a plasma processing chamber, a chemical vapor deposition chamber, a physical vapor deposition chamber, an ion implantation chamber, or a photolithography chamber.

15. The power supply system according to claim 1, wherein: At least one of the power supply modules is used to provide a charged DC power source for the semiconductor processing system, wherein the redundant power supply unit is used to provide a charged redundant DC power source for the semiconductor processing system.

16. A power supply system for a semiconductor processing system to be charged, characterized in that: include: a plurality of power supply modules, each having a first input coupled to an AC power source and a first output coupled to a corresponding semiconductor processing system to be charged via a corresponding power connection, each power supply module configured to provide power to the corresponding semiconductor processing system to be charged via the corresponding power connection; a plurality of corresponding switching modules, each of the corresponding switching modules being configured to detect an electrical state of the corresponding power connection to which the corresponding switching module is coupled, each of the corresponding switching modules comprising a first terminal, a second terminal, and a switch, the first terminal being coupled to the corresponding power connection; a redundant power supply unit having a second input terminal coupled to the AC power source and a second output terminal coupled to the second terminal of each corresponding switching module, each corresponding switching module being configured to connect the redundant power supply unit to the corresponding power connection by changing a state of the switch of the corresponding switching module based on the detected electrical state, wherein the redundant power supply unit comprises: a redundant power supply module; and a backup power capacitor comprising a first node, wherein the redundant power supply module is directly coupled to the first node, and the first node is directly coupled to the second output end, wherein when the redundant power supply unit is coupled to one of the power connections, the redundant power supply module provides a DC power to the second output end through the first node, wherein when the redundant power supply unit is decoupled from the power connections, the redundant power supply module charges the backup power capacitor through the first node; and a housing for housing the plurality of power supply modules, the plurality of corresponding switching modules, and the redundant power supply unit, wherein the housing is physically separated from the semiconductor processing system being charged by a predetermined distance to reduce thermal impact of the semiconductor processing system on the power supply modules, the switching modules, and the redundant power supply unit and to facilitate heat dissipation, the predetermined distance being selected at least in part based on one or more of a type of the semiconductor processing system being charged, a heat output of the semiconductor processing system being charged, a heat output of the power supply system, or an ambient temperature of an environment in which the housing is located; The power supply modules include a first power supply module and a second power supply module, the power connections include a first power connection and a second power connection, the semiconductor processing system includes a first external device and a second external device, and the switching modules include a first switching module and a second switching module. The first input end of the first power supply module is electrically coupled to the AC power source, the first output end of the first power supply module is electrically coupled to the first external device via the first power connection, and the first switching module electrically couples the second output end of the redundant power supply unit to the first power connection. The first input end of the second power supply module is electrically coupled to the AC power source, the first output end of the second power supply module is electrically coupled to the second external device via the second power connection, and the second switching module electrically couples the second output end of the redundant power supply unit to the second power connection.

17. A method for providing an uninterrupted power supply to a semiconductor processing system being charged, characterized in that: The following steps are involved: receiving AC power from an external AC power source; converting the received AC power to a first DC power source and a second DC power source via one of a plurality of power supply modules contained within a housing that serves as a heat sink and is external to the semiconductor processing system being charged; providing the first DC power to the semiconductor processing system being charged via a first power connection coupled to a first power supply module among the power supply modules for powering a first external device of the semiconductor processing system being charged; providing the second DC power to the semiconductor processing system being charged via a second power connection coupled to a second power supply module among the power supply modules for powering a second external device of the semiconductor processing system being charged; The present invention also provides a plurality of corresponding switching modules, each of which is coupled to one of the power supply modules and has a circuit for detecting an electrical state of the power connection of the respective power supply module coupled to the switching module. Each of the switching modules includes a first terminal, a second terminal, and a switch. The first terminal is coupled to a first output end of the respective power supply module to which the corresponding switching module is coupled. The switching modules include a first switching module and a second switching module. The first terminal of the first switching module is coupled to the first output end of the first power supply module, and the first terminal of the second switching module is coupled to the first output end of the second power supply module. Converting the received AC power into a third DC power by a redundant power supply unit housed in the housing and coupled to the second terminal of each switching module; detecting an electrical state on the corresponding power connection through one of the switching modules, each of the switching modules being configured to connect the redundant power supply unit to the power connection of the respective power supply module coupled to the switching module by changing a state of the switch of the respective switching module based on the detected electrical state, wherein detecting the electrical state on the corresponding power connection through one of the switching modules includes detecting the electrical state of the first power connection through the first switching module and detecting the electrical state of the second power connection through the second switching module; and Based on the detected electrical states of the first power connection and the second power connection, the redundant power supply unit is coupled to the power connection through the switching modules to power the charged semiconductor processing system, wherein the redundant power supply unit includes a redundant power supply module and a backup power capacitor. When the redundant power supply unit powers the first external device of the semiconductor processing system, the redundant power supply module and the backup power capacitor provide the third DC power to the first power connection through a common node. When the redundant power supply unit powers the second external device of the semiconductor processing system, the redundant power supply module and the backup power capacitor provide the third DC power to the second power connection through the common node. The housing and the semiconductor processing system being charged are physically separated by a predetermined distance to reduce the thermal impact of the semiconductor processing system on the power supply modules, the switching modules and the redundant power supply unit.

18. The method according to claim 17, characterized in that Further comprising the steps of: When it is detected through the first power connection that the first DC power is below a predefined minimum DC power threshold or above a predefined maximum DC power threshold, the third DC power source charges a backup power capacitor and couples the backup power capacitor to the first power connection.

19. The method according to claim 18, characterized in that Further comprising the steps of: The backup power capacitor is decoupled from the first power connection when it is detected through the first power connection that the first DC power is greater than or equal to the predefined minimum DC power threshold and less than or equal to the predefined maximum DC power threshold.

20. The method according to claim 18, wherein The external AC power source comprises a 220V external AC power source, wherein the step of converting the received AC power to DC power comprises the steps of converting a 220V AC signal to a 24V DC signal, and wherein the backup power capacitor is used to charge to at least 25V.

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