Wireless charging equipment

By designing heat dissipation components in wireless charging devices and using the combination of radiator and fan, the problem of poor heat dissipation performance of traditional wireless charging devices is solved, achieving more efficient heat dissipation effects and reducing equipment temperature.

CN113036829BActive Publication Date: 2024-12-27GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP LTD
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Patent Information

Application Number
CN201911358688.X
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2019-12-25
Publication Date
2024-12-27
Estimated Expiration
2039-12-25

AI Technical Summary

Technical Problem

The poor heat dissipation performance of traditional wireless charging devices leads to a faster temperature rise and low heat dissipation efficiency during charging.

Method used

A wireless charging device is designed, using a heat dissipation component including a radiator and a fan. The airflow is guided through the air outlet and air guide hood to form a heat dissipation air duct, effectively dissipating the heat generated by the coil module and the motherboard module, reducing the Equipment temperature.

Benefits of technology

It improves the heat dissipation efficiency of wireless charging equipment, reduces the equipment temperature, and ensures that high heat dissipation performance is maintained during charging.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present application relates to a wireless charging device, comprising: a housing, which is provided with a first air outlet and a second air outlet. A coil module and a mainboard module are located in the housing. A heat dissipation component is used to dissipate the heat of the coil module and the mainboard module; the heat dissipation component includes a radiator and a fan, the radiator includes a first side and a second side arranged opposite to each other, the coil module is arranged on the first side, the fan is arranged on the second side, the fan is provided with a third air outlet and a fourth air outlet, and the first air outlet, the second air outlet, the third air outlet and the fourth air outlet are connected to form a heat dissipation duct located on the second side. When the fan is working, the external air flow can flow through the heat dissipation duct formed by the first air outlet, the second air outlet, the third air outlet and the fourth air outlet, so that the heat of the heat dissipation component can be transferred to the outside of the housing, thereby reducing the temperature of the wireless charging device, so that the wireless charging device has a higher heat dissipation efficiency.
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Description

Technical Field

[0001] The present application relates to the field of charging technology, and in particular to wireless charging equipment. Background Art

[0002] Traditional wireless charging devices have poor heat dissipation performance. When the device to be charged is charging, the temperature of the wireless charging device rises rapidly and the heat dissipation efficiency is low. Summary of the invention

[0003] The embodiment of the present application provides a wireless charging device to solve the technical problem of low heat dissipation efficiency of the above-mentioned wireless charging device.

[0004] A wireless charging device, comprising:

[0005] A housing, wherein the housing is provided with a first air outlet and a second air outlet;

[0006] The coil module and the mainboard module are located in the housing;

[0007] A heat dissipation component for dissipating heat generated by the coil module and the mainboard module; the heat dissipation component includes a radiator and a fan, the radiator includes a first side and a second side arranged opposite to each other, the coil module is arranged on the first side, the fan is arranged on the second side, the fan is provided with a third air outlet and a fourth air outlet, the first air outlet, the second air outlet, the third air outlet and the fourth air outlet are connected to form a heat dissipation air duct located on the second side of the radiator.

[0008] In the above-mentioned wireless charging device, the heat dissipation component can dissipate the heat of the coil module and the mainboard module, so that the heat of the coil module and the mainboard module can be transferred, thereby allowing the coil module and the mainboard module to be cooled; when the fan is working, the external air flow can flow through the heat dissipation duct formed by the first air outlet, the second air outlet, the third air outlet and the fourth air outlet, so that the heat generated by the coil module and the mainboard module can be transferred to the outside of the shell, thereby reducing the temperature of the wireless charging device, so that the wireless charging device has a higher heat dissipation efficiency.

[0009] In one of the embodiments, the heat dissipation assembly further includes an air guide cover connected to the fan to guide the airflow flowing out of the fan from the fourth air outlet to flow through the second side of the radiator and out of the housing from the second air outlet.

[0010] In one of the embodiments, the wind guide cover includes a connecting member and an air guide plate, one end of the connecting member is connected to an end of the fan where the fourth air outlet is provided, and the air guide plate is connected to the other end of the connecting member.

[0011] In one embodiment, the connecting member includes a top wall, a bottom wall and two side walls, the top wall, the bottom wall and the two side walls are arranged to form a through groove, the through groove is connected to the fourth air outlet, and the air guide plate is connected to the bottom wall.

[0012] In one of the embodiments, a through opening is formed at one end of the air guide plate away from the fan, and the through opening is communicated with the second air outlet.

[0013] In one embodiment, the heat dissipation assembly further includes at least two fins, wherein the fins are located between the second side of the radiator and the air guide plate, and air guide grooves are formed between adjacent fins, and both ends of the air guide grooves are respectively connected to the through groove and the through opening.

[0014] In one of the embodiments, a wind guide wall extending obliquely relative to the wind guide plate is provided on the second side of the radiator, and the wind guide wall is provided corresponding to the through-port to guide the airflow passing through the wind guide groove to the through-port and the second air outlet.

[0015] In one of the embodiments, the housing includes a first shell, the first shell is located on a side of the fan facing away from the radiator; the first air outlet and the second air outlet are located in the first shell.

[0016] In one of the embodiments, a wind shield is included, the wind shield protrudes from the outer surface of the first shell, and the wind shield is located between the first air outlet and the second air outlet.

[0017] In one embodiment, a support foot is provided on the outer surface of the first shell, and the support foot is at the same height as the wind deflector.

[0018] In one embodiment, the wireless charging device includes reinforcing ribs disposed at the first air outlet and the second air outlet, and the reinforcing ribs are located on one side of the inner surface of the first shell.

[0019] In one of the embodiments, the heat dissipation assembly includes a heat conductive element, and the heat conductive element is fixed to the first side of the heat sink;

[0020] At least a part of the structure of the coil module is in contact with the heat-conducting element, and the heat-conducting element can absorb the heat of the coil module;

[0021] At least a portion of the structure of the mainboard module is in contact with the heat-conducting element, and the heat-conducting element can absorb the heat of the mainboard module.

[0022] In one embodiment, a groove is formed on the first side of the heat sink, and the heat conducting element is accommodated in the groove.

[0023] In one of the embodiments, a convex ring is provided on the first side of the heat sink, and the coil module is accommodated in the area surrounded by the convex ring.

[0024] In one of the embodiments, a notch is formed on the mainboard module, and the convex ring is located in the notch.

[0025] In one of the embodiments, the mainboard module includes a heat source area, the heat source area is in contact with the heat conductive element, and the heat conductive element can absorb heat from the heat source area.

[0026] In one of the embodiments, the heat source area and the fan are arranged on the heat sink in opposite directions.

[0027] In one embodiment, the heat conducting element includes a heat pipe or a vapor chamber.

[0028] In one of the embodiments, the housing includes a first shell and a second shell connected to each other, the first air vent and the second air vent are located in the first shell; and the second shell is used to support the device to be charged.

[0029] In one embodiment, a heat storage material is attached to the surface of the second shell; or,

[0030] The surface of the second shell is pasted with heat insulation material; or,

[0031] The surface of the second shell is covered with heat-conducting material. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0033] Figure 1 A side view of a wireless charging device provided by an embodiment, wherein a device to be charged is located on the wireless charging device;

[0034] Figure 2 for Figure 1 A perspective view of the wireless charging device shown;

[0035] Figure 3 for Figure 1 A three-dimensional view of the wireless charging device from another angle;

[0036] Figure 4a for Figure 1 An exploded view of the wireless charging device shown;

[0037] Figure 4b for Figure 1 The wireless charging device is shown in a cross-sectional view at an angle, wherein the first housing is removed;

[0038] Figure 4c for Figure 1 A cross-sectional view of the wireless charging device shown at another angle;

[0039] Figure 4d for Figure 1 A cross-sectional view of the wireless charging device at another angle;

[0040] Figure 5 for Figure 4a A three-dimensional view of a first housing of the wireless charging device shown;

[0041] Figure 6 for Figure 5 A main body diagram of the first shell shown;

[0042] Figure 7 for Figure 2 A top view of the wireless charging device shown, wherein the second housing and the electronic components are removed;

[0043] Figure 8 for Figure 4a A three-dimensional view of a heat dissipation assembly of the wireless charging device shown;

[0044] Fig. 9 for Figure 4a A three-dimensional diagram of the heat dissipation component and the electronic component of the wireless charging device in an assembled state;

[0045] Fig.10 for Figure 4a A three-dimensional view of a fan and an air guide cover of the wireless charging device shown;

[0046] Fig.11 for Fig.10 A three-dimensional diagram of the fan and the air guide cover in a separated state;

[0047] Fig.12 for Figure 4a A three-dimensional view of the heat sink and fins of the wireless charging device shown at another angle;

[0048] Fig.13 for Figure 8 A three-dimensional view of the heat dissipation assembly shown at another angle. DETAILED DESCRIPTION

[0049] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive.

[0050] like Figure 1 As shown, in one embodiment, a wireless charging device 10 is provided, and the wireless charging device 10 can charge a device 20 to be charged.

[0051] like Figure 2 As shown, in one embodiment, the wireless charging device 10 includes a housing 100, and the housing 100 includes a first housing 120 and a second housing 110. The first housing 120 and the second housing 110 are assembled to form the external structure of the wireless charging device 10. When the wireless charging device 10 is used to charge the device 20 to be charged, the device 20 to be charged needs to be placed on the second housing 110.

[0052] like Figure 3 As shown, in one embodiment, a first air outlet 121 and a second air outlet 122 are provided on the first shell 120, and external air flow can enter the housing 100 through one of the first air outlet 121 and the second air outlet 122, and flow out of the housing 100 from the other of the first air outlet 121 and the second air outlet 122, so that the heat in the housing 100 can be taken away by the external air flow, thereby reducing the temperature of the wireless charging device 10.

[0053] like Figure 4a As shown, in one embodiment, the wireless charging device 10 includes an electronic component 200 and a heat dissipation component 300 which are sequentially arranged in a housing 100. The electronic component 200 can charge the device 20 to be charged, and the electronic component 200 generates heat when charging the device 20 to be charged. By providing the heat dissipation component 300, the heat generated by the electronic component 200 is transferred and dissipated to the external environment.

[0054] In one embodiment, the electronic assembly 200 includes a coil module 210 and a mainboard module 220. The heat dissipation assembly 300 includes a heat conductive element 310, a heat sink 320, a fan 410 and an air guide 420. The heat sink 320 includes a first side 326 and a second side 327 that are arranged opposite to each other. The coil module 210, the mainboard module 220 and the heat conductive element 310 are fixed to the first side 326, and the fan and the air guide 420 are fixed to the second side 327. The heat of the coil module 210 and the mainboard assembly 220 can be transferred to the heat conductive element 310 and the heat sink 320, and the heat of the heat conductive element can be transferred to the heat sink 320. There is a gap between the air guide 420 and the second side 327. The first air outlet 121 and the second air outlet 122 are located on the side of the fan 410 that is opposite to the second side 327.

[0055] In one embodiment, the fan 410 is a centrifugal fan.

[0056] like Figure 4b and Figure 4d As shown, in one embodiment, the fan 410 is provided with a third air port 411 and a fourth air port 412. The third air port 411 is an air inlet of the fan 410, and the fourth air port 412 is an air outlet of the fan 410. The third air port 411 is connected to the first air port 121, and the fourth air port 412 is connected to the second air port 122.

[0057] like Figure 4b to Figure 4d As shown, in one embodiment, when the fan 410 is working, the airflow in the external environment can enter the housing 100 through the first air outlet 121, and flow through the fan 410, the air guide cover 420 and the gap between the second side 327, and finally be discharged from the housing 100 through the second air outlet 122, thereby taking away the heat of the radiator 320, so that the heat inside the wireless charging device 10 can be transferred to the outside of the housing 100. The first air outlet 121, the second air outlet 122, the third air outlet 411, and the fourth air outlet 412 form a heat dissipation duct 30 located on the second side 327 of the radiator 320, and the airflow flowing through the heat dissipation duct 30 flows through the second side 327 of the radiator 320, and can take away the heat of the radiator 320.

[0058] In another embodiment, the placement of the fan 410 can be changed to change the direction of the airflow. For example, when the fan 410 is working, the external airflow enters the fan 410 from the second air outlet 122, then flows through the second side 327 of the radiator 320, takes away the heat of the radiator 320, flows to the first air outlet 121, and flows out of the housing 100, taking away the heat inside the housing 100.

[0059] like Figure 4aAs shown, in one embodiment, the first housing 120 is a frame-shaped structure with one side open, and the second housing 110 covers the opening of the first housing 120, so that the housing 100 forms a structure with a storage space. The electronic component 200, the heat sink 320, the fan 410 and the air guide cover 420 are all located in the storage space, and in the direction from the second housing 110 to the first housing 120, the electronic component 200, the heat sink 320, the fan 410 are arranged in sequence, and the air guide cover 420 and the fan 410 are both fixed to the second side 327 of the heat sink 320, and the coil module 210 and the mainboard module 220 are both fixed to the first side 326 of the heat sink 320. In one embodiment, the housing 100 is an elliptical structure. In other embodiments, the housing 100 can be a square or polygonal structure, which is not specifically limited here.

[0060] like Figure 5 As shown, in one embodiment, the first air vent 121 and the second air vent 122 are opened on the bottom wall of the first shell 120. The first air vent 121 and the second air vent 122 are respectively located at the two ends of the length direction of the bottom wall of the first shell 120, and will not extend to the two ends of the width direction of the bottom wall of the first shell 120, that is, the two ends of the bottom wall of the first shell 120 in the width direction are closed structures to prevent the first air vent 121 and the second air vent 122 from being connected. In one embodiment, the first air vent 121 is an arc-shaped structure, and there are multiple first air vents, so that the bottom wall at the first air vent 121 is an arc-shaped strip structure, and is spaced apart from the first air vent 121; the second air vent 122 is an arc-shaped structure, and there are multiple second air vents, so that the bottom wall at the second air vent 122 is an arc-shaped strip structure, and is spaced apart from the second air vent 122.

[0061] like Figure 5 As shown, in one embodiment, the wireless charging device 10 includes a reinforcing rib 123, which is an annular structure and is disposed on the inner surface of the bottom wall of the first housing 120, and is located at the positions of the first air outlet 121 and the second air outlet 122. The reinforcing rib 123 is staggered with the bottom wall of the first housing 120 in an arc-shaped strip structure at the first air outlet 121 and the second air outlet 122, which can enhance the strength of the first housing 120 at the first air outlet 121 and the second air outlet 122, and prevent the first housing 120 from being slightly hit, that is, breaking at the first air outlet 121 or the second air outlet 122.

[0062] like Figure 6As shown, in one embodiment, the outer surface of the first housing 120 is provided with legs 125, and the number of legs 125 is 2, which are respectively located at both ends of the length direction of the first housing 120. It can be understood that one leg 125 is located on the side of the first air outlet 121 away from the second air outlet 122, and the other leg 125 is located on the side of the second air outlet 122 away from the first air outlet 121, and the leg 125 is located outside the area of ​​the first air outlet 121 or the second air outlet 122, so as to prevent the leg 125 from blocking the flow of the airflow of the first air outlet 121 or the second air outlet 122.

[0063] In one embodiment, a windshield 124 is provided between the first air outlet 121 and the second air outlet 122 to prevent the high temperature airflow flowing out of the second air outlet 122 from flowing into the first air outlet 121 again, thereby reducing the heat dissipation effect. In one embodiment, the windshield 124 is a flat plate structure protruding from the outer surface of the first shell 120, and is located between the first air outlet 121 and the second air outlet 122. The height of the windshield 124 is the same as the height of the support leg 125, so that when the wireless charging device 10 is placed on a horizontal surface, the windshield 124 can completely isolate the airflow between the first air outlet 121 and the second air outlet 122, and prevent the airflow of the second air outlet 122 from flowing into the first air outlet 121.

[0064] In another embodiment, if Figure 6 As shown, the windshield 124 is a disc-shaped structure located between the first air outlet 121 and the second air outlet 122, and protrudes from the outer surface of the first shell 120. The height of the windshield 124 protruding from the outer surface of the first shell 120 is the same as the height of the support leg 125, so that when the wireless charging device 10 is placed on a horizontal plane, the disc-shaped windshield 124 can completely isolate the airflow between the first air outlet 121 and the second air outlet 122, and prevent the airflow of the second air outlet 122 from flowing into the first air outlet 121. The disc-shaped windshield 124 is more beautiful, and is integrally formed with the first shell 120, which increases the strength of the first shell 120, and can achieve the purpose of preventing the airflow of the second air outlet 122 from entering the first air outlet 121.

[0065] like Figure 7 As shown, in one embodiment, the wireless charging device is provided with a power cable 230, which passes through the first housing 120 and is electrically connected to the coil module 210 and the mainboard module 220, so that the wireless charging device 10 can be electrically connected to an external power source. The heat sink 320 covers most of the first housing 120, and the size of the first housing 120 is slightly larger than the size of the heat sink 320, so that the space inside the wireless charging device 10 can be effectively utilized.

[0066] like Figure 8As shown, in one embodiment, a first side 326 of the heat sink 320 is provided with a groove 322, the heat conducting element 310 is fixed in the groove 322, and the surface of the heat conducting element 310 is flush with the surface of the heat sink 320. It can be understood that the surface of the heat conducting element 310 is slightly higher than the surface of the heat sink 320 or slightly lower than the surface of the heat sink 320, both of which fall into the category of being flush.

[0067] like Fig. 9 As shown, in one embodiment, the heat-conducting element 310 is a heat pipe, one end of which can absorb heat and the other end of which can release heat. That is, part of the structure of the heat-conducting element 310 can absorb heat, and the rest of the structure can release heat. The coil module 210 is fitted with the part of the heat-conducting element 310 that can absorb heat, and the heat-conducting element 310 can absorb the heat of the coil module 210, and transfer the heat to the end of the heat-conducting element 310 that can release heat, so as to complete the heat transfer and reduce the temperature of the coil module 210. The mainboard module 220 includes a heat source area 222, and the electronic components of the mainboard module 220 with large heat generation are mainly located in the heat source area 222. When the mainboard module 220 is working, the heat source area 222 generates more heat due to the presence of more heat-generating electronic components, resulting in a faster temperature rise. The heat source area 222 of the mainboard module 220 is attached to the end of the heat-conducting element 310 that can absorb heat. The heat-conducting element 310 can absorb the heat of the heat source area 222 and transfer it to the end of the heat-conducting element 310 that can release heat, thereby completing the heat transfer, so that the temperature of the heat source area 222 of the mainboard module 220 is reduced, thereby reducing the temperature of the mainboard module 220.

[0068] In one embodiment, the heat source area 222 and the fan 410 are disposed opposite to each other on the heat sink 320. When the external airflow is set to flow into the housing 100 from the first air outlet 121 and flow out of the housing 100 from the second air outlet 122, the fan 410 is placed as shown in FIG. Figure 4b As shown. The airflow enters the third air outlet 411 from the first air outlet 121, flows out of the fan 410 from the fourth air outlet 412 and flows to the second air outlet 122. When the external airflow is set to enter the housing 100 from the second air outlet 122 and flow out of the housing 100 from the first air outlet 121, the fan 410 is placed upright relative to the radiator 320. The third air outlet 411 is directed toward the wind guide cover 420, and the fourth air outlet 412 is directed toward the first air outlet 121. The airflow enters the housing 100 from the second air outlet 122, enters the fan 410 from the third air outlet 411, and then flows out of the fan 410 from the fourth air outlet 412 and flows to the first air outlet 121, thereby flowing out of the housing 100.

[0069] like Figure 8As shown, in one embodiment, the number of the heat-conducting elements 310 is two, and they are arranged along the length direction of the heat sink 320, so that the heat-absorbing part of the heat-conducting element 310 is located at one end of the heat sink 320, and the heat-releasing part of the heat-conducting element 310 is located at the other end of the heat sink 320. In the width direction of the heat sink 320, the two heat-conducting elements 310 are evenly distributed, so that the heat of the coil module 210 and the mainboard module 220 can be evenly absorbed. When the temperature of the heat-conducting element 310 is higher than that of the heat sink 320, the heat-conducting element 310 can transfer heat to the heat sink 320. The airflow flowing through the heat sink 320 can take away the heat of the heat sink 320, thereby taking away the heat generated by the coil module 210 and the mainboard module 220.

[0070] In another embodiment, the number of the thermal conductive elements 310 may be one or more, which is not specifically limited herein.

[0071] In one embodiment, the heat conducting element 310 is a structure such as a heat spreader or a graphite sheet, which is not specifically limited herein. The heat conducting element 310 may have high thermal conductivity.

[0072] like Figure 8 As shown, in one embodiment, the heat sink 320 is made of metal, so that the heat sink 320 has good heat transfer and heat dissipation effects.

[0073] like Fig. 9 As shown, in one embodiment, part of the structure of the coil module 210 is fitted with the heat-conducting element 310, so that the heat-conducting element 310 can absorb the heat of the coil module 210 and tend to evenly distribute the heat on the heat-conducting element 310. The remaining structure of the coil module 210 is fitted with the radiator 320, so that the radiator 320 can absorb the heat of the coil module 210 and tend to evenly distribute the heat on the radiator 320. After the radiator 320 absorbs the heat of the coil module 210, most of the heat is dissipated through the heat dissipation duct 30, and part of the heat can be dissipated through the radiator 320 itself. It can be understood that the main heat dissipation path of the coil module 210 is heat dissipation through the heat-conducting element 310, and the auxiliary heat dissipation path is heat dissipation through the radiator 320.

[0074] like Fig. 9As shown, in one embodiment, the outline shape and size of the mainboard module 220 are the same or similar to the outline shape and size of the heat sink 320, and the mainboard module 220 is disposed on the first side 326 of the heat sink 320. The heat source area 222 of the mainboard module 220 is in contact with the end of the heat-conducting element 310 that can absorb heat, so that the heat generated by the heat source area 222 can be absorbed by the heat-conducting element 310, and the heat is transferred on the heat-conducting element 310 until it is evenly distributed on the heat-conducting element 310. It can be understood that when the heat-conducting element 310 is a heat pipe, the heat-conducting element 310 will not completely cover the heat sink 320, so that part of the structure of the heat source area 222 of the mainboard module 220 is in contact with the heat sink 320, so that the heat generated by the heat source area 222 can be transferred through the heat sink 320 to be evenly distributed on the heat sink 320. After the heat sink 320 absorbs the heat of the mainboard module 220 , most of the heat is dissipated through the heat dissipation duct 30 , and part of the heat can be dissipated through the heat sink 320 itself.

[0075] like Figure 8 As shown, in one embodiment, the surface of the heat sink 320 facing the coil module 210 is provided with a protruding ring 321 protruding from the heat sink 320. The number of the protruding rings 321 is multiple and they are arranged at intervals to avoid interference between the protruding rings 321 and the thermal conductive element 310 arranged along the length direction of the heat sink 320.

[0076] like Fig. 9 As shown, a plurality of convex rings 321 are arranged to form a circular area, and the coil module 210 can be accommodated in the circular area, so that the coil module 210 is fixed to the heat sink 320. In another embodiment, according to the different shapes of the coil module 210, the area surrounded by the convex rings 321 is different. For example, if the coil module 210 is square, the area surrounded by the convex rings 321 is square.

[0077] like Fig. 9 As shown, in one embodiment, the mainboard module 220 is fixed to the first side 326 of the heat sink 320 by screws or bolts. A notch 221 is provided on the mainboard module 220, and the coil module 210 and the convex ring 321 are located in the notch 221 and are electrically connected to the mainboard module 220, so as to avoid interference between the coil module 210 and the mainboard module 220 in the thickness direction of the wireless charging device 10, and avoid overlapping of the coil module 210 and the mainboard module 220 in the thickness direction, thereby reducing the thickness of the wireless charging device 10. It can be understood that the portion of the heat conductive element 310 in contact with the coil module 210 can absorb heat, so that the heat of the coil module 210 can be absorbed and transferred by the heat conductive element 310.

[0078] like Fig.10 and Fig.11As shown, in one embodiment, the air guide cover 420 includes a connector 430 and an air guide plate 440. One end of the connector 430 is connected to the fan 410, and the other end is connected to the air guide plate 440. More specifically, the connector 430 includes a top wall 431, a bottom wall 432 and two side walls 433. The top wall 431, the bottom wall 432 and the two side walls 433 are surrounded to form a through groove 421. The top wall 431 and the bottom wall 432 are respectively engaged with the opposite sides of the fan 410, so that the connector 430 is connected to the fan 410, and the through groove 421 is connected to the fourth air outlet 412. The air guide plate 440 is connected to the other end of the connector 430 and is connected to the bottom wall 432. It can be understood that the connector 430 can be engaged with the fan 410 and can be removed from the fan 410. The end of the air guide plate 440 away from the connecting member 430 is provided with a through hole 422 so that the airflow from the fourth air port 412 of the fan 410 can flow through the through hole 422 in a direction away from the second side 327. The shape of the through hole 422 can be circular, square, polygonal, etc.

[0079] In one embodiment, the connecting member 430 and the air guide plate 440 are an integrally formed structure.

[0080] like Fig.12 and Fig.13 As shown, in one embodiment, the heat dissipation assembly 300 further includes at least two fins 323, which may be a plurality of fins. The fins 323 are arranged along the length direction of the wireless charging device 10. The fins 323 are fixed to the second side 327 of the radiator 320, and the fins 323 are located between the second side 327 and the wind guide plate 440, that is, the wind guide cover 420 covers the fins 323, and there is no air leakage between the wind guide cover 420 and the fins 323. An air guide groove 423 is formed between two adjacent fins 323, and the two ends of the air guide groove 423 are respectively connected to the through groove 421 and the through port 422. In one embodiment, the number of the air guide groove 423 may be one; in another embodiment, the number of the air guide groove 423 is multiple. The airflow flowing through the fan 410 can flow to the air guide groove 423 through the fourth air outlet 412 and the through groove 421, and then flow through the through port 422 to the second air outlet 122. When the airflow passes through the air guide groove 423 , it can take away the heat of the radiator 320 .

[0081] The arrangement of the air guide 420 and the fins 323 can guide the flow direction of the airflow flowing through the fan 410, so that the airflow flowing through the fan 410 can flow through the second side 327 of the radiator 320 to take away the heat of the radiator 320. The air guide 420 and the fins 323 guide the airflow flowing through the radiator 320 to the second air outlet 122 to flow outside the housing 100. It can be understood that the arrangement of the air guide 420 and the fins 323 prevents the airflow between the fourth air outlet 412 and the second air outlet 122 from flowing irregularly and being retained inside the housing 100.

[0082] In one embodiment, the fins 323 and the heat sink 320 are an integrally formed structure.

[0083] like Fig.13 As shown, in one embodiment, the second side 327 of the heat sink 320 is provided with an air guide wall 328 extending obliquely relative to the air guide plate 440, the air guide wall 328 is located at one end of the air guide groove 423 away from the through groove 421, and the air guide wall 328 forms the groove wall of the air guide groove 423. One end of the air guide wall 328 connected to the second side 327 is close to the fan 410, and the other end of the air guide wall 328 is away from the fan 410. The air guide wall 328 is arranged corresponding to the through port 422, and the through port 422 is arranged corresponding to the second air port 122. Since the air guide wall 328 is arranged obliquely, the airflow flowing through the air guide groove 423 is guided by the air guide wall 328 and flows to the through port 422, and then flows to the second air port 122, so that the wind resistance of the airflow can be reduced.

[0084] like Figure 4c and Figure 4d As shown, in one embodiment, the through port 422 is located at one end of the heat sink 320 away from the fan 410, and corresponds to the second air port 122. The airflow flowing through the fan 410 enters the air guide groove 423 through the fourth air port 412 and the through slot 421, and flows along the air guide groove 423 to the air guide wall 328, and flows to the through port 422 under the guidance of the air guide wall 328, taking away the heat of the heat sink 320. The airflow flows out of the air guide groove 423 through the through port 422, and is discharged from the housing 100 from the second air port 122, thereby taking away the heat in the housing 100. It can be understood that when the airflow with a lower temperature flowing out of the fan 410 flows in the air guide groove 423, it can take away the heat of the heat sink 320 itself, so that the temperature of the heat sink 320 is reduced.

[0085] In one embodiment, the fins 323 are made of metal, so that the heat sink 320 has better heat dissipation performance. When the airflow flows through the air guide groove 423, the airflow can take away the heat of the fins 323, so that the heat sink 320 can be cooled. In another embodiment, the fins 323 are made of a composite material of metal and plastic, so that the temperature of the fins 323 is not easy to rise, thereby avoiding the temperature from being transferred to the housing 100. When the user touches the housing 100, the temperature of the housing 100 is lower, so that the user has a better use experience.

[0086] In one embodiment, for a wireless charging device 10 equipped with a relatively low-power fan 410, the heat dissipation effect of the wireless charging device 10 is not particularly strong, and a heat storage material may be attached to the outer surface or inner surface of the second housing 110. The heat storage material can absorb the heat of the wireless charging device 10, so that the temperature of the wireless charging device 10 rises slowly, thereby avoiding the heat from being transferred to the device to be charged 20. The outer surface or inner surface of the second housing 110 may also be attached with a heat insulation material, which can block the transfer of heat, thereby avoiding the heat of the wireless charging device 10 from being transferred to the device to be charged 20.

[0087] In another embodiment, for a wireless charging device 10 equipped with a fan 410 with a relatively high power, the heat dissipation effect of the wireless charging device 10 is better, and the outer surface or inner surface of the second shell 110 can be attached with a high-efficiency thermal conductive material. The high-efficiency thermal conductive material can transfer heat faster. Because the heat dissipation effect of the wireless charging device 10 is better, the temperature of the wireless charging device 10 is lower, and the temperature of the device to be charged 20 may rise during charging, thereby being higher than the wireless charging device 10. The heat of the device to be charged 20 can be transferred to the wireless charging device 10 through the high-efficiency thermal conductive material, and the heat is discharged to the environment through the better heat dissipation duct 30 of the wireless charging device 10.

[0088] In the wireless charging device 10 of the present application, a heat conducting element 310 is arranged on the heat sink 320, and the coil module 210 and the mainboard module 220 are both attached to the heat conducting element 310, so that the heat generated by the coil module 210 and the mainboard module 220 can be absorbed by the heat conducting element 310, and transferred through the heat conducting element 310, so that the heat conducting element 310 tends to be evenly heated, so that the coil module 210 and the mainboard module 220 can be cooled. The coil module 210 and the mainboard module 220 are both attached to the heat sink 320 made of metal material, and the heat sink 320 has good heat transfer and heat dissipation effects, so that the heat of the coil module 210 and the mainboard module 220 can be transferred to the heat sink 320, and the heat sink 320 tends to be evenly heated, which can help reduce the temperature of the coil module 210 and the mainboard module 220. The relatively low-temperature airflow entering the interior of the housing 100 from the first air outlet 121 can be guided through the air guide groove 423 formed by the fan 410, the air guide cover 420 and the fins 323 to flow through the radiator 320, taking away the heat of the radiator 320 itself, so that the wireless charging device 10 can be cooled. The design of the windshield 124 can separate the second air outlet 122 from the first air outlet 121 to prevent the high-temperature airflow of the second air outlet 122 from entering the first air outlet 121. According to the power of the fan 410, a heat storage material, a heat insulating material or a heat conductive material can be set on the surface of the second housing 110 to avoid the temperature of the device 20 to be charged from rising, or to better reduce the temperature of the device 20 to be charged.

[0089] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0090] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A wireless charging device, characterized in that: include: A housing, wherein the housing is provided with a first air outlet and a second air outlet; The coil module and the mainboard module are located in the housing; A heat dissipation component, used to dissipate the heat generated by the coil module and the mainboard module; the heat dissipation component includes a heat sink, a heat conducting element and a fan, the heat sink includes a first side and a second side arranged opposite to each other, the coil module, the mainboard module and the heat conducting element are fixed to the first side, the first side of the heat sink is provided with a groove, the heat conducting element is accommodated in the groove, the fan is fixed to the second side, and the fan is provided with a third air outlet and a fourth air outlet; The housing comprises a first shell, the first shell is located on a side of the fan facing away from the radiator; the first air outlet and the second air outlet are located at two ends of the bottom wall of the first shell in the length direction; The first air outlet, the second air outlet, the third air outlet and the fourth air outlet are connected to form a heat dissipation air duct located on the second side of the radiator, so that the airflow flowing through the heat dissipation air duct flows through the second side of the radiator and takes away the heat of the radiator; At least a part of the structure of the coil module is in contact with the heat-conducting element, and the heat-conducting element can absorb the heat of the coil module and transfer it to the radiator to dissipate heat through the heat dissipation duct; At least a part of the structure of the mainboard module is in contact with the heat-conducting element, and the heat-conducting element can absorb the heat of the mainboard module and transfer it to the radiator to dissipate heat through the heat dissipation duct; The heat dissipation assembly also includes an air guide cover, which is at a distance from the second side. The air guide cover is connected to the fan to guide the airflow flowing out of the fan from the fourth air outlet to flow through the second side of the radiator and out of the housing from the second air outlet.

2. The wireless charging device according to claim 1, characterized in that: The wind guide cover includes a connecting member and a wind guide plate. One end of the connecting member is connected to an end of the fan where the fourth air outlet is provided, and the wind guide plate is connected to the other end of the connecting member.

3. The wireless charging device according to claim 2, characterized in that: The connecting member includes a top wall, a bottom wall and two side walls, wherein the top wall, the bottom wall and the two side walls are arranged to form a through groove, the through groove is communicated with the fourth air outlet, and the air guide plate is connected to the bottom wall.

4. The wireless charging device according to claim 3, characterized in that: An opening is formed at one end of the air guide plate away from the fan, and the opening is communicated with the second air outlet.

5. The wireless charging device according to claim 4, characterized in that: The heat dissipation assembly also includes at least two fins, which are located between the second side of the radiator and the air guide plate. Air guide grooves are formed between adjacent fins, and both ends of the air guide grooves are respectively connected to the through groove and the through port.

6. The wireless charging device according to claim 5, characterized in that: The second side of the radiator is provided with an air guide wall extending obliquely relative to the air guide plate, and the air guide wall is provided corresponding to the through-port to guide the airflow passing through the air guide groove to the through-port and the second air outlet.

7. The wireless charging device according to claim 1, characterized in that: A wind shield is included, the wind shield protrudes from the outer surface of the first shell, and the wind shield is located between the first air outlet and the second air outlet.

8. The wireless charging device according to claim 7, characterized in that: A support foot is provided on the outer surface of the first shell, and the support foot has the same height as the wind shield.

9. The wireless charging device according to claim 1, characterized in that: The wireless charging device includes reinforcing ribs disposed at the first air outlet and the second air outlet, and the reinforcing ribs are located on one side of the inner surface of the first shell.

10. The wireless charging device according to claim 1, characterized in that: A convex ring is disposed on the first side of the heat sink, and the coil module is accommodated in the area surrounded by the convex ring.

11. The wireless charging device according to claim 10, characterized in that: The mainboard module is provided with a notch, and the convex ring is located in the notch.

12. The wireless charging device according to claim 1, characterized in that: The mainboard module includes a heat source area, the heat source area is in contact with the heat conductive element, and the heat conductive element can absorb the heat of the heat source area.

13. The wireless charging device according to claim 12, characterized in that: The heat source area and the fan are arranged on the radiator in opposite directions.

14. The wireless charging device according to claim 1, characterized in that: The heat conducting element includes a heat pipe or a heat spreader.

15. The wireless charging device according to any one of claims 1 to 9, characterized in that: The housing includes a first shell and a second shell connected to each other, the first air vent and the second air vent are located in the first shell; and the second shell is used to support the device to be charged.

16. The wireless charging device according to claim 15, characterized in that: The surface of the second shell is affixed with heat storage material; or, The surface of the second shell is pasted with heat insulation material; or, The surface of the second shell is covered with heat-conducting material.