Liquid cooling heat dissipation structure

Abstract

This invention provides a liquid cooling structure, including a cover that covers a substrate and defines a heat exchange chamber between the cover and the substrate, a heat dissipation fin unit, and a baffle disposed within the heat exchange chamber. The baffle diverts the cooling liquid entering the heat exchange chamber, causing the cooling fluid to flow from the periphery of the heat dissipation fin unit towards its center, preventing it from flowing directly through the heat dissipation fin unit. The periphery of the heat dissipation fin unit is also provided with a plurality of flow-blocking protrusions to help the cooling liquid flow evenly across the heat dissipation fin unit. Through the structural design of this invention, a significant improvement in heat exchange efficiency can be achieved.

Description

Technical Field

[0001] This invention relates to the field of liquid heat dissipation structures, and more particularly to a heat dissipation structure for a liquid (water) cooling head. Background Technology

[0002] With the surge in demand for big data and cloud computing services, the heat dissipation requirements of related electronic products are also increasing, especially for servers in large computing centers. As their computing density increases, the amount of waste heat generated in the same space also increases significantly. In order to reduce the energy consumed in heat dissipation, liquids have recently been used to remove the heat source from the server and dissipate heat in other ways to solve the problem of high-density waste heat.

[0003] The working mechanism of a water block or water plate is that the working fluid carries away the heat from the chip. As the working fluid passes through the chip, it gradually heats up. Therefore, the temperature distribution of the chip is affected by the flow channel configuration inside the water plate. The temperature is lower near the inlet and higher at the outlet.

[0004] However, the increased heat-generating area in the new generation of chip designs leads to a greater temperature difference between the inlet and outlet, resulting in uneven chip temperature distribution. This significant temperature variation reduces chip lifespan. Furthermore, the working fluid enters the water block through the inlet and flows directly and quickly out through the outlet. Because the working fluid spends a short time inside the water block, its contact time with the cooling fins is even shorter, preventing sufficient heat exchange to remove heat.

[0005] Therefore, how to solve the above-mentioned problems and deficiencies is the direction that the inventors of this case and related manufacturers in this industry urgently want to study and improve. Summary of the Invention

[0006] To improve the above-mentioned problems, one object of the present invention is to provide a baffle between an inlet and a heat dissipation fin unit in a heat exchange chamber, thereby diverting a cooling liquid entering the heat exchange chamber from the inlet, so that the cooling fluid flows from the periphery of the heat dissipation fin unit to the center of the heat dissipation fin unit, thereby preventing the cooling liquid from passing straight through the heat dissipation fin unit.

[0007] Another objective of this invention is to achieve a uniform flow field distribution within the heat exchange chamber to reduce temperature differences in the heating elements, thereby achieving a liquid-cooled heat dissipation structure with uniform temperature distribution.

[0008] Another objective of this invention is to utilize a plurality of baffle protrusions located around the heat dissipation fin unit to distribute the surrounding cooling liquid to the area requiring heat dissipation, thereby effectively reducing the temperature difference of the heat-generating element in a liquid cooling structure.

[0009] Another objective of this invention is to delay the residence time of the coolant in the heat exchange chamber to ensure sufficient time for adequate heat exchange with the heat dissipation fin unit.

[0010] Another objective of this invention is to provide a plurality of ribs in the heat exchange chamber, with each rib located between two adjacent heat dissipation fin groups, so as to prevent the cooling liquid flowing through each heat dissipation fin group from flowing to the other heat dissipation fin group.

[0011] To achieve the above objectives, the present invention provides a liquid cooling structure, comprising: a substrate having a heat exchange surface and a heat contact surface; a heat dissipation fin unit including a plurality of heat dissipation fin groups disposed on the heat exchange surface, each heat dissipation fin group having a top surface and two inflow sides; a cover coupled to the substrate and covering the heat dissipation fin unit; a heat exchange chamber defined between the substrate and the cover to accommodate the heat dissipation fin unit; the cover having an inner side and a sidewall; the inner side having a guide channel corresponding to the top surface of each heat dissipation fin group; and the heat dissipation fin unit being disposed of by a heat exchange fin unit. A peripheral flow channel group is defined between the heat dissipation fin unit and the side wall. An inlet and an outlet are respectively provided on the cover. The inlet connects to the heat exchange chamber, and the outlet connects to the guide channel. A baffle is provided in the heat exchange chamber and is located between the inlet and the heat dissipation fin unit to isolate the inlet from the heat dissipation fin unit. The baffle is adjacent to the inlet to divert the cooling liquid entering the heat exchange chamber from the inlet and allow it to flow along the peripheral flow channel to a middle of the heat dissipation fin unit, thereby preventing the cooling liquid from passing straight through the heat dissipation fin unit.

[0012] The aforementioned peripheral flow channel group is provided with multiple flow-blocking protrusions corresponding to the two inflow sides of each heat dissipation fin group.

[0013] The aforementioned peripheral flow channel assembly has a first, a second, and a third peripheral flow channel. The first and second peripheral flow channels are respectively defined between the two inflow sides and the sidewall. The third peripheral flow channel is defined between the baffle and the sidewall and corresponds to the inlet. The cooling liquid of the peripheral flow channel assembly flows from the two inflow sides to the middle of the heat dissipation fin unit and flows out from the outlet through the guide channel.

[0014] The aforementioned third peripheral flow channel is equipped with another heat dissipation fin unit.

[0015] The aforementioned flow-blocking protrusions are distributed in the first and second peripheral flow channels and are disposed on the side wall of the cover or the heat exchange surface of the substrate.

[0016] A rib is provided between the two adjacent heat dissipation fin groups, and each rib has a free end that contacts or is joined to the inner side of the cover.

[0017] The aforementioned rib has another free end that is combined with the heat exchange surface of the substrate.

[0018] The aforementioned baffle is disposed on the heat exchange surface of the substrate or on the inner side of the cover.

[0019] With the above-described structure, the present invention enables a uniform flow distribution of the cooling liquid entering the heat exchange chamber, thereby reducing temperature differences in the heating elements and ensuring a uniform temperature distribution of the heating elements. Attached Figure Description

[0020] Figure 1A This is a three-dimensional exploded view of the present invention;

[0021] Figure 1B This is a three-dimensional assembly diagram of the present invention;

[0022] Figure 1C This is a schematic cross-sectional view of the present invention:

[0023] Figure 2 This is a top-view perspective diagram of the present invention;

[0024] Figure 3 This is a top-view perspective diagram of the original work featuring a flow-blocking protrusion;

[0025] Figures 4A to 4C These are schematic diagrams of various shapes of flow-blocking protrusions.

[0026] Explanation of reference numerals in the attached drawings: substrate 11; heat exchange surface 111; heat contact surface 112; cover 12; inner side 121; side wall 122; guide channel 123; inlet 124; outlet 125; baffle protrusion 127; heat dissipation fin unit 13, 18; fin 131; flow channel 132; top surface 134; inflow side 135; non-inflow side 136; heat dissipation fin assembly 137; rib 138; heat exchange chamber 14; baffle 15; peripheral flow channel assembly 17; first peripheral flow channel 171; second peripheral flow channel 172; third peripheral flow channel 173; cooling liquid 19; liquid inlet connector 21; liquid outlet connector 22. Detailed Implementation

[0027] The above-mentioned objectives of the present invention and its structural and functional characteristics will be described with reference to the preferred embodiments shown in the accompanying drawings.

[0028] This invention provides a liquid cooling structure, such as a water block, which is part of a liquid cooling loop and is used to contact a heat-generating element to help dissipate heat. The liquid cooling structure is connected to an external heat dissipation unit and / or pump through a pipe body. This invention utilizes a baffle in a heat exchange chamber within the liquid cooling unit to divert the cooling liquid entering the heat exchange chamber. The diverted cooling fluid flows to the periphery of a heat dissipation fin unit before flowing towards the center of the heat dissipation fin unit, thus preventing the cooling fluid from flowing directly through the heat dissipation fin unit. This invention also incorporates multiple flow-blocking protrusions corresponding to the heat dissipation fin unit to help the cooling liquid flow evenly across the heat dissipation fin unit. The detailed structure is described below.

[0029] Please see Figure 1A This is a three-dimensional exploded view of the present invention; Figure 1B This is a three-dimensional assembly diagram of the present invention;

[0030] Figure 1C This is a schematic cross-sectional view of the present invention: Figure 2 This is a top perspective view of the present invention. As shown in these figures, the liquid cooling structure of the present invention includes a substrate 11 and a cover 12 covering the substrate 11, a heat exchange chamber 14 defined between the substrate 11 and the cover 12 for the flow of a cooling liquid 19, a baffle 15 disposed within the heat exchange chamber 14, and a heat dissipation fin unit 13 disposed within the heat exchange chamber 14. The substrate 11 has a heat exchange surface 111 and a heat contact surface 112. The cover 12 has an inner side 121 and a side wall 122. The inner side 121 faces the heat exchange surface 111 of the substrate 11 and has a guide channel 123. An inlet 124 and an outlet 125 are respectively disposed on the cover 12. The inlet 124 communicates with the heat exchange chamber 14, and the outlet 125 communicates with the guide channel 123. The side wall 122 is circumferentially disposed around the outer edge of the cover 12 and engages with the substrate 11. A liquid inlet connector 21 and a liquid outlet connector 22 are respectively connected to the inlet 124 and the outlet 125. The baffle 15 is disposed on the heat exchange surface 111 of the substrate 11 or the inner side 121 of the cover 12, and is located behind the inlet 124. In addition to preventing the cooling liquid 19 from flowing from the inlet 124 into the heat exchange chamber 14 and directly through the heat dissipation fin unit 13, it also diverts the cooling liquid 19 to both sides before it flows through the heat dissipation fin unit 13, as detailed later.

[0031] The heat dissipation fin unit 13 has a plurality of fins 131 spaced apart, with flow channels 132 between the fins 131. The heat dissipation fin unit 13 has a top surface 134, two inflow sides 135, and two non-inflow sides 136. The top surface 134 is adjacent to or adjacent to the inner side 121 of the cover 12 and corresponds to the guide channel 123. The two inflow sides 135 are opposite sides and communicate with the flow channels 132 between the fins 131. The two non-inflow sides 136 are also opposite sides and adjacent to the two inflow sides 135. The heat dissipation fin unit 13 is disposed on or formed on the heat exchange surface 111 of the substrate 11, that is, the heat dissipation fin unit 13 and the substrate 11 are integrally or non-integrally made. In addition, the two non-flow sides 136 are respectively adjacent to the inlet 124 and outlet 125 of the cover 12, and the baffle 15 is adjacent to the inlet 124 and located between the inlet 124 and the non-flow side 136 of the heat dissipation fin unit 13.

[0032] Furthermore, the present embodiment shows that the heat dissipation fin unit 13 has a plurality of heat dissipation fin groups 137, and a rib 138 is provided between two adjacent heat dissipation fin groups 137. The thickness of a single rib 138 is thicker than the thickness of a single fin 131. The heat dissipation fin unit 13 and / or the rib 138 are integrally formed on the heat exchange surface 111 of the substrate 11, or are separate individual components from the substrate 11 and are joined by a bonding means (such as welding, including hard soldering, soft soldering, and ultrasonic welding) on ​​the heat exchange surface 111 of the substrate 11. Each rib 138 has a free end (the upper end as shown in the figure) adjacent to or in contact with or joined to the inner side 12 of the cover 12.

[0033] A peripheral flow channel group 17 is formed between the heat dissipation fin unit 13 and the side wall 122 around the heat dissipation fin unit 13. This peripheral flow channel group includes a first peripheral flow channel 171, a second peripheral flow channel 172, and a third peripheral flow channel 173. The first and second peripheral flow channels 171 and 172 are respectively located between the two inflow sides 135 and the side wall 122. The third peripheral flow channel 173 is located between the baffle 15 and the side wall 122, corresponding to the inlet 124. That is, the inlet 124 is located above the third peripheral flow channel 173, and both ends of the third peripheral flow channel 173 are connected to the first and second peripheral flow channels 171 and 172, respectively. Another heat dissipation fin unit 18 is optionally disposed or formed in the third peripheral flow channel 173 and located below the inlet 124. The heat dissipation fins 18 are not limited to the aforementioned implementation; if the corresponding heat-generating area of ​​the heat-generating element is small, the number of heat dissipation fins 18 disposed in the third peripheral flow channel 173 can be reduced.

[0034] The coolant 19 flows into the third peripheral flow channel 173 of the heat exchange chamber 14 from the inlet 124 of the cover 12 through the inlet connector 21. The coolant 19 is not only blocked by the baffle 15 behind the inlet 124 from flowing straight through the heat dissipation fin unit 13, but is also divided into two opposing flows that flow from both ends of the third peripheral flow channel 173 through the first peripheral flow channel 171 and the second peripheral flow channel 172. Then, the coolant 19 in the first and second peripheral flow channels 171 and 172 flows further from the two inflow sides 135 of the heat dissipation fin unit 13 towards the middle of the heat dissipation fin unit 13. Then, the coolant 19 flows out of the heat exchange chamber 14 through the guide channel 123 from the outlet 125 and the outlet connector 22. The rib 138 is used to block the coolant 19 flowing through each heat dissipation fin group 137 from flowing to the other heat dissipation fin group 137. This design ensures that the diverted cooling liquid 19 is not heated and flows through each heat dissipation fin assembly 137 at the same liquid temperature.

[0035] Furthermore, since the baffle 15 prevents the cooling liquid 19 flowing into the heat exchange chamber 14 from flowing straight through the heat dissipation fin unit 13, the residence time of the cooling liquid 19 in the heat exchange chamber 14 is delayed, so that the cooling liquid 19 can fully exchange heat with the heat dissipation fin unit 13 before the heat is carried away.

[0036] Please continue to refer to this. Figure 3 This is a top perspective view of the present invention with baffle protrusions. As shown, in another embodiment, a plurality of baffle protrusions 127 are distributed in the peripheral flow channel group 17, for example, in the first peripheral flow channel 171 and the second peripheral flow channel 172, corresponding to the two inflow sides 135 of the heat dissipation fin unit 13, and each heat dissipation fin group 137 corresponds to at least two opposing baffle protrusions 127. In this embodiment, the plurality of baffle protrusions 127 are shown to be disposed on the side wall 122 of the cover 12, but are not limited thereto, and may also be disposed on the heat exchange surface 111 of the substrate 11. With each baffle protrusion 127, the cooling liquid 19 flowing in the first peripheral flow channel 171 and the second peripheral flow channel 172 is guided to each heat dissipation fin group 137 of the heat dissipation fin unit 13, reducing the concentration of the cooling liquid 19 at the end of the flow direction, and allowing the cooling liquid 19 to flow more uniformly within the liquid cooling structure. Furthermore, not limited to the aforementioned implementation, the present invention can assign each heat dissipation fin group 137 to multiple opposing baffles 127 according to different heat dissipation requirements. Therefore, the baffles 127 can be configured according to the different temperatures of each heat-generating area of ​​the heat-generating element during the design process. For example, two opposing baffles 127 can be configured in the low-temperature area, and four or more opposing baffles 127 can be configured in the high-temperature area.

[0037] Please continue to refer to this. Figures 4A to 4CThis is a schematic diagram of various shapes of the flow-blocking protrusion. As shown in the figure, the aforementioned flow-blocking protrusion 127 is not limited to a semi-circle, but can also be triangular (e.g., Figure 4A ) or square (such as Figure 4B ) or L-shaped (such as Figure 4C (e.g., any geometric shape)

[0038] With the above structure, the flow field of the cooling liquid 19 entering the heat exchange chamber 14 is uniformly distributed, thereby reducing the temperature difference of the heating element and making the temperature of the heating element uniformly distributed.

[0039] The above description is illustrative only and not restrictive of the present invention. Those skilled in the art will understand that many modifications, variations or equivalents can be made without departing from the spirit and scope defined by the claims, and all such modifications, variations or equivalents will fall within the protection scope of the present invention.

Claims

1. A liquid-cooled heat dissipation structure, characterized in that, Include: A substrate having a heat exchange surface and a heat contact surface; A heat dissipation fin unit includes a plurality of heat dissipation fin groups disposed on the heat exchange surface, and has a top surface and two inflow sides; A cover is attached to the substrate and covers the heat dissipation fin unit. A heat exchange chamber is defined between the substrate and the cover and accommodates the heat dissipation fin unit. The cover has an inner side and a side wall. The inner side is provided with a guide channel corresponding to the top surface of the heat dissipation fin unit. A peripheral flow channel group is defined between the heat dissipation fin unit and the side wall. An inlet and an outlet are respectively provided on the cover. The inlet communicates with the heat exchange chamber and the outlet communicates with the guide channel. A baffle is provided in the heat exchange chamber and located between the inlet and the heat dissipation fin unit. The baffle is located behind the inlet so that the cooling liquid entering the heat exchange chamber from the inlet is diverted and flows along the peripheral flow channel toward the middle of the heat dissipation fin unit, thereby preventing the cooling liquid from passing straight through the heat dissipation fin unit. A rib is provided between two adjacent heat dissipation fin groups. Each rib is attached to the heat exchange surface of the substrate. Each rib has a free end adjacent to or in contact with or attached to the inner side of the cover.

2. The liquid cooling heat dissipation structure as described in claim 1, characterized in that: The peripheral flow channel group has multiple flow-blocking protrusions on both inflow sides corresponding to each heat dissipation fin group.

3. The liquid cooling heat dissipation structure as described in claim 1 or 2, characterized in that: The peripheral flow channel assembly has a first peripheral flow channel, a second peripheral flow channel and a third peripheral flow channel. The first peripheral flow channel and the second peripheral flow channel are respectively defined between the two inflow sides and the side wall. The third peripheral flow channel is defined between the baffle and the side wall and corresponds to the inlet. The cooling liquid of the peripheral flow channel assembly flows from the two inflow sides to the middle of the heat dissipation fin unit and flows out from the outlet through the guide channel.

4. The liquid cooling heat dissipation structure as described in claim 3, characterized in that: The third peripheral flow channel is equipped with another heat dissipation fin unit.

5. The liquid cooling heat dissipation structure as described in claim 3, characterized in that: The plurality of flow-blocking protrusions are distributed in the first peripheral flow channel and the second peripheral flow channel, and are disposed on the side wall of the cover or the heat exchange surface of the substrate.

6. The liquid cooling heat dissipation structure as described in claim 1, characterized in that: The baffle is located on the heat exchange surface of the substrate or on the inner side of the cover.

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