Chemical liquid supply system, chemical liquid testing method, and semiconductor wafer processing method

Abstract

According to some embodiments, a chemical liquid supply system, a method for testing chemical liquid, and a method for processing semiconductor wafers are provided. The method for processing semiconductor wafers includes connecting a cylinder for storing chemical liquid to a test tube. The method also includes guiding the chemical liquid in the cylinder into the test tube. In addition, the method includes detecting the condition of the chemical liquid in the test tube. The method further includes determining whether the condition of the chemical liquid is acceptable. When the condition of the chemical liquid is acceptable, the chemical liquid is supplied to a processing tool for processing semiconductor wafers.

Description

Technical Field

[0001] The present disclosure relates to a chemical liquid supply system and a method for supplying chemical liquid. Background Art

[0002] The semiconductor integrated circuit system (IC) industry has experienced rapid growth. Advances in integrated circuit materials and design techniques have produced generations of integrated circuits, each with smaller and more complex circuits than the previous generation. In the course of IC development, functional density (i.e., the number of interconnected components per chip area) has generally increased, while geometry size (i.e., the smallest component (or circuit) that can be created using a manufacturing process) has decreased. This scaling down process generally provides benefits by increasing production efficiency and reducing associated costs. However, these scaling downs have also increased the complexity of IC processing and manufacturing.

[0003] During the manufacture of semiconductor devices, various processing steps are used to produce integrated circuits on semiconductor wafers. As is well known, wet chemical processing or cleaning is widely used in the semiconductor industry. Chemical liquid is supplied into the chamber and then rinses the substrate. In order to properly treat or clean the substrate, a sufficient amount of chemical solution is supplied over the substrate. If the chemical solution is not distributed correctly, chemical or physical reactions (such as particle removal, wettability improvement, or development) may not be achieved, which may cause serious defects that affect product quality.

[0004] Although existing methods and apparatus for operating process steps are generally adequate for their intended purposes, they are not satisfactory in all respects.Therefore, there remains a need to provide a solution for process control of semiconductor manufacturing operations. Summary of the invention

[0005] According to some embodiments of the present disclosure, a method for processing a semiconductor wafer includes the following steps: connecting a cylinder storing a chemical liquid to a test tube; guiding the chemical liquid in the cylinder into the test tube; detecting a condition of the chemical liquid in the test tube; determining whether the condition of the chemical liquid is acceptable; and when the condition of the chemical liquid is acceptable, supplying the chemical liquid to a processing tool for processing the semiconductor wafer.

[0006] According to some embodiments of the present disclosure, a method for testing a chemical liquid in a manufacturing facility includes the following steps: moving a cylinder storing the chemical liquid from a storage system to a location near a chemical liquid supply system; moving the cylinder into a chamber in the chemical liquid supply system through a front door; connecting the cylinder to a test tube; guiding the chemical liquid in the cylinder into the test tube; detecting a condition of the chemical liquid in the test tube; determining whether the condition of the chemical liquid is acceptable; and removing the cylinder from the chamber of the chemical liquid supply system when the condition of the chemical liquid is unacceptable.

[0007] According to some embodiments of the present disclosure, a chemical liquid supply system includes a chamber; a roller located in the chamber; a connection module located in the chamber and above the roller; a test tube connected to the connection module; a liquid detection assembly positioned relative to the test tube; and a control module electrically connected to the liquid detection assembly and configured to determine whether the chemical liquid is acceptable. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] When with Figure 1 When read together, the aspects of the present disclosure can be best understood from the following embodiments. Note that according to standard practice in this industry, various features are not drawn to scale. In fact, the size of various features may be arbitrarily increased or reduced for clarity of discussion.

[0009] Figure 1 A schematic diagram of a production facility according to some embodiments is depicted;

[0010] Figure 2 A schematic diagram showing some equipment in a production facility according to some embodiments is shown;

[0011] Figure 3 A schematic diagram of a chemical liquid supply system according to some embodiments is shown;

[0012] Figure 4 A schematic diagram showing some components of a chemical liquid supply device according to some embodiments is shown;

[0013] Figure 5 A schematic diagram showing some components of a chemical liquid supply system and a processing tool connected to the chemical liquid supply system according to some embodiments;

[0014] Figure 6 depicts concepts for liquid testing methods according to some embodiments;

[0015] Figure 7 A flow chart illustrating a method for supplying chemical liquid in a semiconductor manufacturing facility according to some embodiments is shown;

[0016] Figure 8 depicts a schematic diagram of stages of a method for testing chemical liquids in a semiconductor manufacturing facility according to some embodiments, wherein a number of cylinders are delivered to a front door proximate to a chemical liquid supply system;

[0017] Fig. 9 A schematic diagram depicting stages of a method for testing a chemical liquid in a semiconductor manufacturing facility according to some embodiments, wherein a front door of a chemical liquid supply system is opened;

[0018] Fig.10 depicts a schematic diagram of stages of a method for testing chemical liquids in a semiconductor manufacturing facility according to some embodiments, wherein a number of cylinders are delivered into a chemical liquid supply system through a front door;

[0019] Fig.11 A schematic diagram depicting stages of a method for testing chemical liquids in a semiconductor manufacturing facility according to some embodiments, wherein a number of cylinders are transferred into a front door of a chemical liquid supply system and the front door of the chemical liquid supply system is closed;

[0020] Fig.12 A schematic diagram depicting stages of a method for testing chemical liquids in a semiconductor manufacturing facility, according to some embodiments, wherein names and images for a number of cylinders are generated;

[0021] Fig.13 depicts a schematic diagram of stages of a method for testing chemical liquids in a semiconductor manufacturing facility according to some embodiments, wherein a number of cylinders are connected to inlet and outlet connectors for supplying chemical liquids;

[0022] Fig.14 A schematic diagram depicting stages of a method for testing a chemical liquid in a semiconductor manufacturing facility according to some embodiments, wherein a chemical liquid is circulated in a plurality of cylinders;

[0023] Fig.15 depicts a schematic diagram of stages of a method for testing a chemical liquid in a semiconductor manufacturing facility, wherein the condition of the chemical liquid is monitored, according to some embodiments;

[0024] Fig.16 A flowchart illustrating a method for processing a semiconductor wafer according to some embodiments is shown;

[0025] Fig.17 FIG. 4 is a block diagram of a controller module of a chemical liquid supply apparatus according to some embodiments.

[0026]

Explanation of symbols

[0027] S80,S90: Method

[0028] S801~S816,S901~S903: Operation

[0029] L: Direction

[0030] 1: Production facilities

[0031] 2: Storage system

[0032] 3: RGV system

[0033] 4: Chemical liquid supply system

[0034] 9: Processing Tools

[0035] 11,12,30: Shelves

[0036] 13: Platform

[0037] 20: Rack

[0038] 21,31: Orbit

[0039] 22: Storage shelves

[0040] 23:Transmission mechanism

[0041] 24: Input port

[0042] 25: Output port

[0043] 33: Shuttle

[0044] 34: Input Station

[0045] 35: Output Station

[0046] 36:Conveyor belt

[0047] 41: Shell

[0048] 42: Front door

[0049] 43: Chamber

[0050] 44:Connection module

[0051] 45:Roller

[0052] 46: Imaging module

[0053] 47: Scanning module

[0054] 48:Driver module

[0055] 49: Gas detector

[0056] 50: Control module

[0057] 60: Cylinder

[0058] 61: outlet nozzle

[0059] 62: Inlet nozzle

[0060] 63: Tags

[0061] 65:Chemical liquid

[0062] 69: Pallet

[0063] 70: Liquid monitoring module

[0064] 71: Test tube

[0065] 72: Filter

[0066] 73: Pump

[0067] 74: Liquid detection assembly

[0068] 91: Supply pipe

[0069] 92: Flow control component

[0070] 95:Semiconductor wafer

[0071] 411: Bottom wall

[0072] 412: Top wall

[0073] 415: Side wall

[0074] 416: Gas outlet

[0075] 419: Exhaust flow

[0076] 441:Export connector

[0077] 442: Inlet connector

[0078] 443: Transport head

[0079] 444: Actuator

[0080] 451: terminal part

[0081] 452:Wheels

[0082] 481: Motor

[0083] 482: Transmission components

[0084] 502: Input / output interface (etc.)

[0085] 503: Input / output device (etc.)

[0086] 504: Processor

[0087] 506: Communication infrastructure or bus

[0088] 508: Main memory

[0089] 510: Secondary memory

[0090] 512: Hard disk

[0091] 514: Removable storage device

[0092] 520: Interface

[0093] 522: Removable storage unit

[0094] 524: Communication interface

[0095] 526: Communication path

[0096] 528: Component

[0097] 635:Signal

[0098] 711~714: Segment

[0099] 741: Camera

[0100] 742: Light Source

[0101] 743:Sensor

[0102] 744: The First Beam

[0103] 745: Second beam DETAILED DESCRIPTION

[0104] The following disclosure provides many different embodiments or examples for implementing the different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the disclosure. Of course, these are only examples and are not intended to be restrictive. For example, in the following description, the formation operation of a first feature on or above a second feature may include an embodiment in which the first feature and the second feature are formed in direct contact, and may also include an embodiment in which an additional feature is formed between the first feature and the second feature so that the first feature and the second feature may not be in direct contact. In addition, in various examples, the disclosure may repeat element symbols and / or letters. This repetition is for the purpose of simplicity and clarity, and does not itself regulate the relationship between the various embodiments and / or configurations discussed.

[0105] Furthermore, for ease of description, spatially relative terms such as "below," "beneath," "lower," "above," "higher," and the like may be used herein to describe the relationship of one element or feature to another element(s) or feature(s) illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the elements in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may be interpreted accordingly.

[0106] In semiconductor manufacturing, chemical liquids are often used in a variety of manufacturing processes, for example, ultrapure water in wafer cleaning processes, acid or alkaline liquids in wet etching processes, slurries in CMP (chemical mechanical polishing) processes, and photoresists in photolithography processes. In some manufacturing processes, chemical liquids are applied directly to the surface of the wafer to be processed. The quality of the chemical liquid can affect the performance of the manufacturing process, such as the defects and removal rate of the process. However, the quality of the stored chemical liquid is analyzed through offline monitoring (not real-time). In other words, abnormalities in the chemical liquid cannot be discovered in time, and before being detected by offline monitoring, damage to the wafer surface may occur during the manufacturing process, resulting in a decrease in the performance of the manufacturing process.

[0107] Embodiments of the present disclosure are intended to provide a chemical liquid testing and supply system and a method for real-time feedback control of the supply of chemical liquid for a production process. In this method, the chemical liquid in the chemical liquid testing and supply system is first sampled to obtain the sampled chemical liquid, and then the parameters of the sampled chemical liquid are measured, and the supply of the chemical liquid is controlled based on the parameters. In an embodiment of the present disclosure, the parameters of the sampled chemical liquid are measured in real time. Thus, automatic and dynamic control of the chemical liquid supply is achieved, thereby improving the supply quality and stability of the chemical liquid, and thus improving process defects.

[0108] Figure 1 A schematic diagram of a manufacturing facility 1 is shown according to some embodiments. In the present disclosure, the manufacturing facility 1 is located at a hazardous process material (HPM) building, which is connected to a wafer fabrication (FAB) building and is configured to store or handle chemical liquids used in semiconductor wafer fabrication. In some embodiments, the manufacturing facility 1 includes a storage system 2, an RGV system 3, and a number of chemical liquid supply systems 4. Additional features may be added to the manufacturing facility 1. For additional embodiments of the manufacturing facility 1, certain features described below may be replaced or removed.

[0109] In some embodiments, the storage system 2 is an automated storage and retrieval system (AS / RS) and is configured to place the cylinders 60 to a defined location and retrieve the cylinders 60 from a defined location. In some embodiments, the storage system 2 includes a rack 20, a plurality of storage shelves 22, a conveyor mechanism 23, and a plurality of input ports 24 and output ports 25. The storage shelves 22 are configured to facilitate storage of the cylinders 60 within the rack 20. In some embodiments, the storage shelves 22 are positioned on two parallel side walls of the rack 20. In some embodiments, each storage shelf 22 is configured to support four cylinders 60 positioned on a pallet 69. It should be noted that although Figure 1 Each storage rack 22 is illustrated as supporting four cylinders 60 , but the storage rack 22 may have a larger area to store any number of cylinders 60 , and these cylinders 60 may be positioned on the same pallet 69 or different pallets 69 .

[0110] The conveyor mechanism 23 is configured to move the cylinders 60 within the storage system 2. In some embodiments, the conveyor mechanism 23 includes an extractor. The conveyor mechanism 23 travels along the track 21 between two rows of storage racks 22 and pulls the required cylinder 60 from its location and brings it to an access point, such as an output port 25. In some embodiments, the conveyor mechanism 23 is also moved vertically by a lift (not shown) to reach the upper storage rack 22 in the rack 20.

[0111] The input port 24 and the output port 25 are configured to support and dock the cylinder 60, so as to facilitate the insertion / removal of the cylinder 60 from the rack 20 of the storage system 2. In some embodiments, the input port 24 and the output port 25 are positioned along the track 21. The input port 24 is used to place the cylinder 60 on the input port 24 to the conveying mechanism 23, and the output port 25 is used to receive the cylinder 60 conveyed from the conveying mechanism 23. With the help of the automatic storage and retrieval system, manpower for transporting the cylinder 60 can be saved. In one simulation result, 30% of manpower is reduced.

[0112] The RGV system 3 is configured to transport the cylinder 60 across a distance in the production facility 1 (for example, between the storage system 2 and the chemical liquid supply system 4). In some embodiments, the RGV system 3 includes a track 31, a shuttle 33, an input station 34, an output station 35, and a plurality of conveyor belts 36. The track 31 extends in a longitudinal direction L. The shuttle 33 travels along the track 31. The input station 34 and the output station 35 are positioned in such a manner that they correspond to the input port 24 and the output port 25 of the storage system 2, and are used to transfer the cylinder 60 from the storage system 2 and transfer the cylinder 60 to the storage system 2. The chemical liquid supply system 4 is arranged along the longitudinal direction L. The conveyor belt 36l is positioned between the track 31 and the chemical liquid supply system 4 to transfer the cylinder 60 between the shuttle 33 and the chemical liquid supply system 4.

[0113] Figure 2 A schematic diagram of part of the equipment in the production facility 1 according to some embodiments is depicted. In some embodiments, the production facility 1 includes a plurality of shelves, such as shelves 11 and 12, located at different levels. The chemical liquid supply system 4 is positioned at both shelves 11 and 12. In this embodiment, the production facility 1 may further include another RGV system 3 corresponding to the chemical liquid supply system 4 located at different levels, and the storage system 2 may also include another input port 24 and an output port 25 for transporting cylinders to or from the RGV system 3. Due to the adoption of a double-layer design (i.e., multiple shelves 11 and 12), the number of chemical liquid supply systems 4 per unit floor space is increased. In one simulation result, 25% of the valuable floor space within the production facility 1 is saved.

[0114] Figure 3 A schematic diagram of a chemical liquid supply system 4 according to some embodiments is depicted. In some embodiments, the chemical liquid supply system 4 includes a housing 41 and a front door 42. The front door 42 is located near the conveyor belt 36. Through the front door 42, the cylinder 60 can be moved into the chamber 43 inside the housing 41. In some embodiments, the front door 42 is an automatic door. The chamber 43 can be sealed by a plurality of hollow sealing members (not shown in the figure) mounted on the outer edge of the front door 42, thereby forming an airtight space in the chamber 43. As a result, the gas generated due to the leakage of the liquid from the cylinder 60 can be retained in the chamber 43, thereby protecting the safety and health of personnel from the harmful substances.

[0115] In some embodiments, the platform 13 is positioned above the housing 41 opposite the front door 42. A person can stand on the platform 13 to operate the chemical liquid supply system through the control module 50. However, it should be understood that many changes and modifications can be made to the embodiments of the present disclosure. In some other embodiments, the platform 13 is replaced by another conveyor belt (not shown in the figure), and the empty cylinder can be removed from the chamber 43 through a rear door (not shown in the figure) located near the additional conveyor belt.

[0116] Figure 4 FIG. 4 is a schematic diagram of some components of the chemical liquid supply system 4 according to some embodiments. In some embodiments, the chemical liquid supply system 4 further includes a plurality of connection modules 44, a plurality of rollers 45 ( Fig. 9 The connecting module 44 is located at the top wall 412 of the housing 41 and is located inside the chamber 43. The connecting module 44 is configured to connect the cylinder 60 with the liquid monitoring module 70 (see FIG. Figure 5 ).

[0117] The number of connection modules 44 corresponds to the number of cylinders 60 that can be handled in the chamber 43 at the same time. In an exemplary embodiment, the chemical liquid supply system 4 handles four cylinders 60 supported by the pallet 69, and these four cylinders 60 are used for chemical liquid supply (operation) through four independent connection modules 44. However, it should be understood that many changes and modifications can be made to the embodiments of the present disclosure. Depending on the number of cylinders 60 to be handled in each operation, the chamber 43 can have any suitable width or length.

[0118] In some embodiments, each connection module 44 includes an outlet connector 441, an inlet connector 442, a handling head 443, and an actuator 444. The outlet connector 441 and the inlet connector 442 connect the two ends of the test tube 71 ( Figure 5 ) and are configured to engage with the outlet nozzle 61 and the inlet nozzle 62 of the cylinder 60 located below, respectively. In some embodiments, the outlet connector 441 and the inlet connector 442 are mounted on the bottom of the handling machine head 443. The handling machine head 443 is arranged to rotate around the rotation axis ( Figure 4 Alternatively or additionally, as indicated by the dashed line in Figure 4 As shown by the indicated arrow, the transport head 443 is arranged to move in the vertical direction relative to the cylinder 60. The transport head 443 can move according to the control signal issued from the control module 50 to the actuator 444.

[0119] The rollers 45 are configured to move the pallet 69 horizontally together with the cylinder 60 in the chamber 43. In some embodiments, the rollers 45 are arranged in a side-by-side manner, and each roller 45 extends in a direction parallel to the front door 42. Both ends of each roller 45 are rotatably connected to the side wall 415 of the housing 41. In some embodiments, as Figure 4 As shown, at least one of the rollers 45 is an active member and has an end portion 451 that penetrates through the side wall 415 of the housing 41 and is located outside the chamber 43. A wheel 452 (such as a gear or a pulley) is connected to the end portion 451.

[0120] In some embodiments, the drive module 48 includes a motor 481 and a transmission element 482. The transmission element 482 is connected to the output shaft (not shown in the figure) of the motor 481 and the wheel 452 connected to the end portion 451 of the roller 45. In operation, the transmission element 482 transmits mechanical power from the motor 481 to the roller 45 to actuate the movement of the cylinder 60 and the pallet 69 positioned on the pallet 69 in the chamber 43. The transmission element 482 can be a transmission belt or a chain. It should be noted that since the wheel 452 connected to the transmission element 482 is located outside the chamber 43, the wheel 452 is prevented from being corroded by the liquid in the event of a liquid leak from the cylinder 60. The motor 481 can be driven by a control signal issued by the control module 50.

[0121] The imaging module 46 is configured to generate images about the internal environment of the chamber 43. In an exemplary embodiment, the imaging module 46 is configured to generate images about the outlet nozzle 61 and the inlet nozzle 62 of the cylinder 60 positioned in the chamber 43. In some embodiments, the imaging module 46 includes a wide-angle camera to take pictures of all the cylinders 60 located in the chamber 43 in one image screen. In some other embodiments, the imaging module 46 includes a plurality of cameras positioned at different positions in the chamber 43, and each camera is used to take pictures of one of the cylinders 60 located in the chamber 43. In some embodiments, the imaging module 46 is configured to generate images about the bottom wall 411 of the housing 41, so as to determine whether there is residual chemical liquid leaking from the cylinder 60.

[0122] The imaging module 46 may output raw data or processed data representing an image of the interior of the chamber 43 to the control module 50. For example, the imaging module 46 outputs a signal directly from an image sensor, and performs image analysis externally (e.g., by the control module 50). In the image analysis, the image of the cylinders 60 is analyzed to determine the positioning of the outlet nozzle 61 and the inlet nozzle 62 of each cylinder 60 for subsequent engagement with the outlet connector 441 and the inlet connector 442. Alternatively, the imaging module 46 includes a dedicated processor or hardware for performing image analysis, and outputs a digital or analog signal representing the positioning of the outlet nozzle 61 and the inlet nozzle 62 of each cylinder 60.

[0123] The scanning module 47 is configured to identify the cylinder 60 that is transferred into the chamber 43. In some embodiments, the scanning module 47 includes a scanner to scan a tag 63 attached to the cylinder 60. The tag 63 can be a radio frequency identification (RFID) and contains electronically stored information about the cylinder 60. The tag 63 can be a passive tag and can collect energy from the scanning module 47 that interrogates radio waves nearby. The radio waves have a frequency of up to 300 GHz to 30 Hz. The scanning module 47 outputs data representing the name of the cylinder 60 to the control module 50, and the control module 50 matches the name of the cylinder 60 with the data representing the cylinder to determine the chemical liquid 65 that the cylinder 60 is storing.

[0124] In some embodiments, Figure 4 As shown, the gas outlet 416 is connected to the side wall 415 of the housing 41. The gas outlet 416 is configured to guide the exhaust gas from the chamber 43 to a gas handling system (not shown in the figure). The exhaust gas can be actuated by a pump (not shown in the figure) connected to the gas outlet 416 or by a negative pressure generated in the gas handling system. In some embodiments, the gas detector 49 is connected to the gas outlet 416 and configured to detect at least one condition related to the exhaust gas flowing in the gas outlet 416. For example, the gas detector 49 is configured to measure the concentration of the exhaust gas in the gas outlet 416 and output a signal related to the measurement result to the control module 50 for further processing.

[0125] Figure 5 A schematic diagram of some components of the chemical liquid supply system 4 and a processing tool 9 connected to the chemical liquid supply system 4 is depicted according to some embodiments. In some embodiments, the chemical liquid supply system 4 further includes a liquid monitoring module 70. The liquid monitoring module 709 is configured to sample the chemical liquid 65 stored in the cylinder 60 and generate data representing at least one condition of the chemical liquid 65 to the control module 50. In some embodiments, the liquid monitoring module 70 includes a test tube 71, a filter 72, a pump 73, and a liquid detection assembly 74. The filter 72, the pump 73, and the liquid detection assembly 74 are arranged in sequence along the test tube 71.

[0126] Specifically, the test tube 71 includes a plurality of sections, such as a section 711, a section 712, a section 713, and a section 714. One end of the section 711 is connected to the outlet connector 441, and the other end of the section 711 is connected to the filter 72. One end of the section 712 is connected to the filter 72, and the other end of the section 712 is connected to the pump 73. One end of the section 713 is connected to the pump 73, and the other end of the section 713 is connected to the liquid detection ion assembly 74. One end of the section 714 is connected to the liquid detection assembly 74, and the other end of the section 714 is connected to the inlet connector 442.

[0127] In operation, the pump 73 actuates the flow of the chemical liquid 65 from the cylinder 60, sequentially through the outlet connector 441, the filter 72, the pump 73, and the liquid detection ion assembly 74, and recirculates into the cylinder 60 via the inlet connector 442. In some embodiments, the supply tube 91 is connected to the section 714 of the test tube 71, and guides the chemical liquid from the test tube 71 to the processing tool 9 where the semiconductor wafer 95 is processed. A flow control member 92 (such as a valve) is connected to the supply tube 91. When the flow control member 92 is opened, the chemical liquid passing through the liquid detection ion assembly 74 enters the supply tube 91 and is supplied into the processing tool 9. The operation of the flow control member 92 can be actuated by a control signal issued from the control module 50.

[0128] The liquid detection ion assembly 74 is configured to detect the condition of the chemical liquid 65 flowing in the test tube 71 and generate data representing the condition of the chemical liquid 65 to the control component 50. In some embodiments, the liquid detection ion assembly 74 measures at least one condition of the chemical liquid 65 in the test tube 71 by different techniques.

[0129] For example, Figure 6 As shown, the liquid detection assembly 74 includes a camera 741, and the test tube 71 is made of a transparent material such as glass. As a result, the camera 741 takes a photo of the chemical liquid 65 in the test tube 71 and transmits data representing the image of the chemical liquid 65 to the control module 50. The control module 50 then compares the data representing the image with an archive database containing data representing another image, which another image illustrates the standard properties of the chemical liquid 65. When the data of the photo is significantly different from the data representing the standard properties of the chemical liquid 65, an alarm can be issued.

[0130] Alternatively or additionally, such as Figure 6As shown, the liquid detection assembly 74 includes a light source 742 and a sensor 743, and the test tube 71 is made of a transparent material (such as glass, for example). The light source 742 generates a first light beam 744 toward the test tube 71. The first light beam 744 is converted into a second light beam 745 after passing through the test tube 71. The second light beam 745 and the first light beam 744 may have different properties (e.g., vibration mode). The sensor 743 is a mass spectrometer and is configured to detect the second light beam 745 and transmit data representing the second light beam 745 to the control module 50 for further processing to determine the condition of the chemical liquid 65.

[0131] In an exemplary embodiment of the present disclosure, the control module 50 compares the data representing the second light beam 745 to an archived database containing standard properties representing the chemical liquid 65. When the data representing the second light beam 745 is significantly different from the data representing the standard properties of the chemical liquid 65, an alarm may be issued. In some embodiments, the chemical liquid 65 is tested by infrared spectroscopy, and the first light beam 744 generated by the light source 742 includes infrared radiation. The data representing the second light beam 745 includes, for example, a graph of the transmittance of the second light beam 745 versus the number of peaks. However, it should be understood that many changes and modifications may be made to the embodiments of the present disclosure.

[0132] It should be understood that although the preferred embodiment is intended for using two method techniques (i.e., image analysis and infrared spectroscopy techniques) to measure the condition of the chemical liquid 65, any number of methods may be used to detect the chemical liquid 65. In some embodiments, the camera 741 is omitted and the condition of the chemical liquid 65 is detected using infrared spectroscopy techniques.

[0133] Figure 7 A flow chart illustrating a method S80 for supplying a chemical liquid in a production facility 1 according to some embodiments is shown. It should be recognized that additional operations may be performed. Furthermore, not all operations of the disclosure provided herein need to be performed. Further, some of these operations may be performed simultaneously or in combination. Figure 7 In some implementations, one or more other operations may be performed in addition to the operations described herein, or the operations described herein may be replaced by one or more other operations. For illustrative purposes, reference is made to Figure 1 Pass Figures 8 to 15 Method S80 is described. However, method S80 is not limited to these embodiments.

[0134] Method S80 begins with operation S801, in which one or more cylinders 60 are transported from storage system 2 to a position near front door 42 of chemical liquid supply system 4. In some embodiments, as Figure 1As shown, four cylinders 60 are placed on a pallet 69, and the four cylinders 60 are stored in one of the storage racks 22 of the storage system 2. The required cylinders 60 are transported from the storage system 2 to a location (e.g., conveyor belt 36) near the front door 42, and the cylinders 60 are extracted from the storage rack 22 and moved to the output port 25 together with the pallet 69 of the lower layer by the conveying mechanism 23. Then, the output port 25 and the output station 35 move the cylinders 60 and the pallet 69 to the shuttle 33, and the shuttle 33 transports the cylinders 60 and the pallet 69 to one of the conveyor belts 36, which corresponds to one of the chemical liquid supply systems 4 where the cylinders 60 will be used, as shown in FIG. Figure 8 In some embodiments, operation S801 takes about 4 minutes to about 6 minutes. In other embodiments, operation S801 takes about 5 minutes.

[0135] Method S80 continues with operation S802, in which the front door 42 is opened. In some embodiments, after the cylinder 60 is detected to be present at the conveyor belt 36, the front door 42 of the chemical liquid supply system 4 is automatically opened, such as Fig. 9 As shown. The presence of the cylinder 60 on the conveyor belt 36 can be detected by applying a suitable sensor (such as a photo sensor). Data representing the presence of the cylinder 60 is sent to the control module 50, and the control module 50 triggers a control signal to control the movement of the front door 42. In some embodiments, operation S802 takes about 20 seconds to about 40 minutes. In other embodiments, operation S802 takes about 30 seconds.

[0136] Method S80 continues with operation S803, moving the cylinder 60 together with the pallet 69 into the chamber 43 of the chemical liquid supply system 4 through the front door 42. In some embodiments, as Fig.10 As shown, the movement of the cylinder 60 is driven by the conveyor belt 36 and the roller 45. Operation S803 can be started after operation S802 is completed. In some embodiments, operation S801 takes about 30 seconds to about 90 seconds. In other embodiments, operation S801 takes about 1 minute.

[0137] Once the cylinder 60 is moved into the chamber 43, the method S80 continues with operation S804 to close the front door 42, such as Fig.11 In some embodiments, the front door 42 is actuated to close in response to a control signal issued by the control module 50, and the control module 50 issues the control signal after detecting that the cylinder 60 is positioned in the chamber 43. The positioning of the cylinder 60 in the chamber 43 can be detected by applying a suitable sensor (such as a photoelectric sensor).

[0138] The method S80 continues with operation S805, in which the name of each cylinder 60 is reprogrammed. In some embodiments, after the chamber 43 is present in the cylinder 60, the scanning module 47 is triggered to transmit wireless power. Once the tag 63 is powered by the wireless power, the tag 63 transmits a signal 635 representing the information of the cylinder 60 to which the tag 63 is attached to the scanning module 47. The scanning module 47 forwards data representing the information of the cylinder 60 in the chamber 43 to the control module 50. The information of the cylinder 60 may include the name of the cylinder 60, and the control module 50 matches the name of the cylinder 60 with the chemical liquid stored in the corresponding cylinder 60 according to a database stored in the memory device of the control module 50.

[0139] Method S80 continues with operation S806, in which cylinder 60 is connected to liquid monitoring assembly 70. In some embodiments, prior to operation S806, one or more images of outlet nozzle 61 and inlet nozzle 62 are generated by imaging module 46. Data representing the images of outlet nozzle 61 and inlet nozzle 62 are sent to control assembly 50 for imaging analysis to determine the positioning of outlet nozzle 61 and inlet nozzle 62. Control module 50 outputs control signals to actuator 444 to rotate handling head 443 to align outlet nozzle 61 with outlet connector 441 and inlet nozzle 62 with inlet connector 442. After the alignment procedure, control module 50 outputs control signals to actuator 444 to rotate handling head 443 along the outlet nozzle 61 and inlet connector 442. Fig.13 The transport head 443 is lowered in the direction indicated by the arrow shown in FIG. As a result, the outlet connector 441 is connected to the outlet nozzle 61 , and the inlet connector 442 is connected to the inlet nozzle 62 .

[0140] Method S80 continues with operation S807, in which exhaust flow 419 is generated from chamber 43. In some embodiments, as Fig.13 As shown, exhaust gas flow 419 is directed through gas outlet 416. Operation S807 may be initiated during operation S803 and not stopped until cylinder 60 is removed from chamber 43.

[0141] The method S80 continues with operation S808, in which at least one condition of the exhaust gas flow 419 is monitored. In some embodiments, the concentration of harmful gases in the exhaust gas flow 419 is detected by the gas detector 49. When the concentration of harmful gases in the exhaust gas flow 419 is lower than the threshold, the method S80 continues with operation S811, otherwise an alarm is issued in operation S810. In operation S810, the chemical liquid 65 in the cylinder 60 may be stopped from being introduced into the test tube 71 to avoid more liquid leakage.

[0142] In some embodiments, volatile gases are generated due to a cracked cylinder or due to a fluid leak caused by an improper connection between the cylinder 60 and the connection assembly 44. By monitoring the condition of the exhaust gas, these problems can be indicated at an early stage, and the control module 50 will react immediately and take corrective action, for example, reconnecting the connection module 44 and the cylinder 60.

[0143] In operation S811, at least one condition of the chemical liquid 65 is monitored. In some embodiments, Fig.15 As shown, after the outlet nozzle 61 and the inlet nozzle 62 are connected to the outlet connector 441 and the inlet connector 442, the chemical liquid 65 in the cylinder is sampled through the liquid monitoring module 70. Specifically, the pump 73 actuates the flow of the chemical liquid 65 in the test tube 71 and recirculates the chemical liquid 65 into the cylinder 60. The flow of the chemical liquid 65 passes through the filter 72 before passing through the liquid detection ion assembly 74. In some embodiments, the operation S811 will not be started before the circulation operation of the chemical liquid 65 is performed for a predetermined time (e.g., about 1 minute to about 3 minutes) to increase the uniformity of the chemical liquid 65 stored in the cylinder 60.

[0144] In some embodiments, in operation S811, the light source 742 and the sensor 743 ( Figure 6 ) measures the composition of the chemical liquid 65, and sends data representing the composition of the chemical liquid 65 to the control module 50 to determine whether the composition of the chemical liquid 65 is acceptable through infrared spectroscopy technology (operation S812). The data representing the composition of the chemical liquid 65 can be compared with another data representing the composition of a standard chemical liquid.

[0145] Alternatively or additionally, in operation S811, an image ( Figure 6 ). The image of the chemical liquid 65 is sent to the control module 50 for image analysis to determine whether the condition of the chemical liquid 65 is acceptable (operation S812). The image of the chemical liquid 65 can be compared with another image of a standard chemical liquid. For example, if the standard chemical liquid is blue, but the image is displayed as yellow, it is determined that the condition of the chemical liquid is unacceptable.

[0146] In some embodiments, image analysis is performed before infrared spectroscopy. When the image analysis result is unacceptable, infrared spectroscopy will not be used to measure the composition of chemical liquid 65. Since infrared spectroscopy takes longer time than image analysis, performing image analysis before performing infrared spectroscopy can save time for testing chemical liquid. In some embodiments, operation S811 takes about 5 seconds to about 20 seconds. In other embodiments, operation S811 takes about 10 seconds for implanting infrared spectroscopy.

[0147] In operation S812, when it is determined that the condition of the chemical liquid 65 is unacceptable, the method S80 proceeds to operation S816 to remove the cylinder 60 from the chamber 43. On the other hand, when the condition of the chemical liquid 65 is acceptable, the method S80 proceeds to operation S813 to supply the chemical liquid 65 to the processing tool 9 processing the semiconductor wafer 95.

[0148] In some embodiments, in order to supply the chemical liquid 65, the control assembly 50 issues a control signal to the flow control member 92 to allow a portion of the chemical liquid 65 to flow from the test tube 71 to the supply tube 91. During operation S813, the supply time or amount of the chemical liquid 65 supplied to the processing tool 9 is counted by an appropriate means (such as a weighing machine) to determine whether the chemical liquid 65 in the cylinder 60 has been exhausted (operation S814). When the chemical liquid 65 has been exhausted, the method S80 continues with operation S815 to remove the cylinder 60 from the chamber 43, otherwise the chemical liquid 65 continues to be supplied.

[0149] In some embodiments, some substances in the chemical liquid 65 decay over time as they are stored in the cylinder 60. If the decayed substances are dispensed onto the semiconductor wafer 95, the process performance of the semiconductor wafer 95 may be reduced, resulting in product failure. By performing the test procedure (i.e., operation S811 and operation S812), the semiconductor wafer 95 can be processed with the correct chemical liquid, and the yield of the semiconductor wafer 95 can be significantly improved.

[0150] In operation S815, the test tube 71 of the liquid monitoring assembly 70 is disconnected from the cylinder 60, and the front door 42 is opened. Then, the cylinder 60 is removed from the chamber 43 by the roller 45 and the conveyor belt 36. The cylinder 60 can be sent back to the storage system 2 through the RGV system 3, and the next required cylinder 60 can be sent to the empty chemical liquid supply system 4 for testing and supply procedures.

[0151] Fig.16 A flow chart illustrating a method S90 for processing a semiconductor wafer 5 using a chemical liquid 65 according to some embodiments is shown. It should be recognized that additional operations may be performed. Furthermore, not all operations of the disclosure provided herein need to be performed. Further, some of these operations may be performed simultaneously or in combination. Fig.16 In some implementations, one or more other operations may be performed in addition to the operations described herein, or the operations described herein may be replaced by one or more other operations. For illustrative purposes, reference is made to Fig.15 Method S90 is described. However, method S90 is not limited to these embodiments.

[0152] The method S90 includes an operation S901 of loading a semiconductor wafer 95 into a processing tool 9 ( Fig.15 ). The semiconductor wafer 95 may be made of silicon or other semiconductor materials. Alternatively or additionally, the semiconductor wafer 95 may include other basic semiconductor materials such as germanium (Ge). In some embodiments, the semiconductor wafer 95 is made of a compound semiconductor such as silicon carbide (SiC), gallium arsenide (GaAs), indium arsenide (InAs), or indium phosphide (InP). In some embodiments, the semiconductor wafer 95 is made of an alloy semiconductor such as silicon germanium (SiGe), silicon germanium carbide (SiGeC), gallium arsenic phosphide (GaAsP), or gallium indium phosphide (GaInP). In some embodiments, the semiconductor wafer 95 includes an epitaxial layer. For example, the epitaxial layer of the semiconductor wafer 95 is covered on a bulk semiconductor. In some other embodiments, the semiconductor wafer 95 may be a silicon on insulator (SOI) or a germanium on insulator (GOI) substrate.

[0153] The semiconductor wafer 95 may have various device elements. Examples of device elements formed in the semiconductor wafer include transistors (e.g., metal oxide semiconductor field effect transistors (MOSFETs), complementary metal oxide semiconductor (CMOS) transistors, bipolar junction transistors (BJTs), high voltage transistors, high frequency transistors, p-channel and / or n-channel field effect transistors (PFETs / NFETs), etc.), diodes, and / or other suitable elements. Various processes (such as deposition, etching, implantation, lithography, annealing, and / or other suitable processes) are performed to form the device elements.

[0154] The processing tool 9 is capable of performing one or more of several processes or processes, such as a wafer cleaning process (including pre-cleaning, cleaning, and post-cleaning processes), a wet etching process, a CMP (chemical mechanical polishing) process, a photolithography process, and the like.

[0155] Method S90 also includes operation S902, in which the following is performed: Figure 7 The method S80 of supplying the chemical liquid 65 is shown. Another regional valve (not shown) of the processing tool 9 is used to control the dispensing of the chemical liquid 65 onto the semiconductor wafer 95 .

[0156] The method S90 also includes an operation S903, in which the semiconductor wafer 95 may be removed from the processing tool 9. It is understood that the production of the semiconductor wafer 95 according to the disclosed method is subject to further processing, including material deposition, implantation, or etching operations to form various features, such as field effect transistors, capping insulating layers, contacts / vias, silicide layers, interconnect metal layers, dielectric layers, passivation layers, metallization layers with signal lines, etc. In some implementations, one or more conductive layers, semiconductive layers, and insulating material layers are formed on the substrate, and patterns are formed in one or more layers.

[0157] Fig.17 A block diagram of a controller module 50 is depicted according to some embodiments. The control module 50 may include any suitable control system (e.g., a mainframe computer and a portable electronic device) configured to store / execute programs for performing / monitoring various operations of the chemical liquid supply system 4. The control module 50 may be any well-known computer capable of performing the functions and operations described herein. For example, and not limitation, the control module 50 may have the ability to process and transmit signals. The control module 50 may be used, for example, to perform one or more operations of the chemical liquid supply system 4, method S80, and / or method S90.

[0158] The control module 50 may be configured to communicate (i.e., send instructions and receive data) with other components of the chemical liquid supply system 4 (e.g., the connection module 44, the imaging module 46, the scanning module 47, the drive module 48, the gas detector 49, or the liquid monitoring module 70) via the communication path 526. The communication path 526 may include any suitable network connection mechanism, such as a communication bus, a local area network (LAN), and / or a WiFi network. In some embodiments, the control module 50 may update instructions or stored programs based on data received from other components of the chemical liquid supply system 4 via the communication path 526.

[0159] The control system 50 includes one or more processors (also referred to as central processing units, or CPUs), such as a processor 504. The processor 504 is connected to a communication infrastructure or bus 506. The control system 50 also includes an input / output device (or the like) 503 (such as a monitor, keyboard, pointing device, etc.) that communicates with the communication infrastructure or bus 506 through an input / output interface (or the like) 502. The control tool can receive instructions via the input / output device (or the like) 503 to implement the functions and operations described herein. The control system 50 also includes a main memory 508, such as a random access memory (RAM). The main memory 508 may include one or more cache memory levels. Control logic (e.g., computer software) and / or data are stored in the main memory 508. In some embodiments, the control logic (e.g., computer software) and / or data may include one or more functions described above with respect to the chemical liquid supply system 4. In some embodiments, the processor 504 may be configured to execute the control logic stored in the main memory 508.

[0160] The control system 50 may also include one or more secondary memories 510. The secondary memories 510 may include, for example, a hard disk 512 and / or a removable storage device 514. The removable storage device 514 may be a floppy disk drive, a tape drive, an optical drive, an optical storage device, a tape backup device, and / or any other storage device / drive.

[0161] Removable storage device 514 can interact with removable storage unit 518. Removable storage unit 518 includes a computer usable or readable storage device on which computer software (control logic) and / or data are stored. Removable storage unit 518 can be a floppy disk, magnetic tape, compact disk, DVD, optical storage disk, and / or any other computer data storage device. Removable storage device 514 reads from and / or writes to removable storage unit 518 in a well-known manner.

[0162] According to some embodiments, the secondary memory 510 may include other mechanisms, tools, or other means for allowing the control system 50 to access computer programs and / or other instructions and / or data. These mechanisms, tools, or other means may include, for example, a removable storage unit 522 and an interface 520. Examples of removable storage units 522 and interfaces 520 may include a program cartridge and cartridge interface (such as found in a video game device), a removable memory chip (such as an EPROM or PROM) and associated slots, a memory stick and a USB port, a memory card and associated memory card slots, and / or other removable storage units and associated interfaces. In some embodiments, the secondary memory 510, the removable storage unit 518, and / or the removable storage unit 522 may include one or more of the functions described above with respect to the chemical liquid supply system 4.

[0163] The control system 50 may further include a communication interface 524. The communication interface 524 enables the control system 50 to communicate and interact with any combination of components 528 of remote devices, remote networks, remote entities, etc. For example, the communication interface 524 may allow the control system 50 to communicate with the components 528 across a communication path 526, which may be wired and / or wireless and may include any combination of a LAN, a WAN, the Internet, etc. Control logic and / or data may be transmitted to or from the control system 50 via the communication path 526.

[0164] The functions / operations of the aforementioned embodiments can be implemented in a variety of configurations and architectures. Thus, some or all of the operations (e.g., Figures 4 to 6 The functions of the chemical liquid supply system 4 described in Figure 7 The methods / programs described herein may be implemented in hardware, software, or both. In some embodiments, a tangible device or article (including a tangible computer-usable or readable medium) having control logic (software) stored thereon is also referred to herein as a "computer program product or program storage device." This includes, but is not limited to, the control system 50, the primary memory 508, the secondary memory 510, and the removable storage units 518 and 522, i.e., a tangible article embodying any combination of the foregoing. When the control logic is executed by one or more data processing devices (such as the control system 50), the control logic causes the data processing devices to operate as described herein. For example, the hardware / device may be connected to or be part of an element 528 (remote device (etc.), network (etc.), entity (etc.)) of the control system 50.

[0165] As described above, the various embodiments or examples described herein provide several advantages over the prior art, as set forth above. It will be understood that not all advantages are necessarily discussed herein, all embodiments or examples do not require specific advantages, and other embodiments or examples may provide different advantages.

[0166] Embodiments of the present disclosure provide a chemical liquid supply system with a liquid detection ion assembly to test the quality of a chemical liquid contained in a cylinder. The cylinder is automatically transported from a storage system to the chemical liquid supply system and automatically connected to an inlet connector of a liquid supply line for chemical liquid supply. As a result, the manpower requirements for preparing chemical liquid supplies can be reduced or eliminated. In addition, since the chemical liquid is not supplied to a processing tool before the quality of the chemical liquid is checked, the concern of supplying a bad chemical liquid to the processing tool can be alleviated.

[0167] According to some embodiments, a method for processing semiconductor wafers is provided. The method includes connecting a cylinder storing a chemical liquid to a test tube. The method also includes guiding the chemical liquid in the cylinder into the test tube. In addition, the method includes detecting the condition of the chemical liquid in the test tube. The method further includes determining whether the condition of the chemical liquid is acceptable. When the condition of the chemical liquid is acceptable, the chemical liquid is supplied to a processing tool for processing the semiconductor wafer. In some embodiments, detecting the condition of the chemical liquid in the test tube includes: generating an image of the chemical liquid in the test tube; analyzing the image to generate data associated with the image; and comparing the data associated with the image with data representing the chemical liquid in a standard stage. In some embodiments, detecting the condition of the chemical liquid in the test tube includes: emitting a first light beam toward the test tube, wherein the first light beam is converted into a second light beam after passing through the chemical liquid; receiving the second light beam with a sensor; analyzing the second light beam to generate data associated with the second light beam; and comparing the data associated with the second light beam with data representing the chemical liquid in the standard stage. In some embodiments, the method further includes circulating the chemical liquid back to the cylinder through the test tube; and guiding a portion of the chemical liquid from the test tube to a supply tube connected to the processing tool. In some embodiments, the method further includes moving the cylinder into a chamber where the cylinder is connected to the test tube; generating an exhaust flow from the chamber; detecting a condition of the exhaust flow; determining whether the condition of the exhaust flow exceeds a threshold; and when determining that the condition of the exhaust flow exceeds the threshold, stopping directing the chemical liquid in the cylinder into the test tube and issuing an alarm. In some embodiments, the method further includes moving the cylinder into a chamber where the cylinder is connected to the test tube; generating an image of an outlet nozzle and an inlet nozzle of the cylinder; rotating an inlet connector and an outlet connector connected to the test tube to align the inlet nozzle and the outlet nozzle based on the image; and after the rotation operation of the inlet connector and the outlet connector of the test tube, connecting the inlet connector to the inlet nozzle and connecting the outlet connector to the outlet. In some embodiments, the method further includes moving the cylinder into a chamber where the cylinder is connected to the test tube; and after moving the cylinder into the chamber, closing the front door of the chamber to form an airtight space in the chamber. In some embodiments, the method further includes identifying the cylinder by scanning an RFID (radio frequency identification) tag attached to the cylinder to reprogram the chemical liquid intended to be stored in the cylinder.

[0168] According to some embodiments, the method provides a method for testing chemical liquid semiconductor wafers in a semiconductor manufacturing facility. The method includes moving a cylinder storing chemical liquid from a storage system to a position close to a chemical liquid supply system. The method also includes moving the cylinder into a chamber in the chemical liquid supply system through a front door. The method further includes connecting the cylinder to a test tube. In addition, the method includes detecting the condition of the chemical liquid in the test tube. The method further includes determining whether the condition of the chemical liquid is acceptable. When the condition of the chemical liquid is unacceptable, the cylinder is removed from the chamber of the chemical liquid supply system. In some embodiments, detecting the condition of the chemical liquid in the test tube includes: generating an image of the chemical liquid in the test tube; analyzing the image to generate data associated with the image; and comparing the data associated with the image with data representing the chemical liquid in a standard stage. In some embodiments, detecting the condition of the chemical liquid in the test tube includes: emitting a first light beam toward the test tube, wherein the first light beam is converted into a second light beam after passing through the chemical liquid; receiving the second light beam with a sensor; analyzing the second light beam to generate data associated with the second light beam; and comparing the data associated with the second light beam with data representing the chemical liquid in the standard stage. In some embodiments, the method further includes supplying the chemical liquid to a processing tool for processing semiconductor wafers when the condition of the chemical liquid is acceptable. In some embodiments, the method further includes generating an exhaust flow from the chamber; detecting the condition of the exhaust flow; determining whether the condition of the exhaust flow exceeds a threshold; and when determining that the condition of the exhaust flow exceeds the threshold, stopping directing the chemical liquid in the cylinder into the test tube and issuing an alarm. In some embodiments, the method further includes; generating an image of the outlet nozzle and the inlet nozzle of the cylinder; rotating the inlet connector and the outlet connector connected to the test tube to align the inlet nozzle and the outlet nozzle based on the image; and after the rotation operation of the inlet connector and the outlet connector of the test tube, connecting the inlet connector to the inlet nozzle and connecting the outlet connector to the outlet nozzle. In some embodiments, this positioning is close to the front door of the chemical liquid supply system, and the cylinder is moved into the chamber through the front door. The method further includes: after moving the cylinder into the chamber, closing the front door of the chamber to form an airtight space in the chamber. In some embodiments, the method further comprises identifying the cylinder by scanning an RFID (radio frequency identification) tag attached to the cylinder to reprogram the chemical liquid intended to be stored in the cylinder.

[0169] According to some embodiments, a chemical liquid supply system is provided. The chemical liquid supply system includes a roller located in a chamber. The chemical liquid supply system also includes a connection module located in the chamber and above the roller. The chemical liquid supply system further includes a test tube connected to the connection module. In addition, the chemical liquid supply system includes a liquid detection assembly positioned relative to the test tube. The chemical liquid supply system further includes a control module, which is electrically connected to the liquid detection assembly and configured to determine whether the chemical liquid is acceptable. In some embodiments, at least a portion of the test tube near the liquid detection assembly is formed by a light-transmitting material, and the liquid detection assembly includes a camera or a mass spectrometer. In some embodiments, the system further includes a gas detector, which is connected to the chamber and configured to detect the condition of the exhaust gas from the chamber. The control module is electrically connected to the gas detector and configured to issue an alarm when the condition of the gas in the chamber exceeds a threshold value. In some embodiments, the system further includes a front door located on one side of the chamber. The front door is automatically operated, and when the front door is closed, an airtight space is formed in the chamber.

[0170] The foregoing summarizes the features of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should understand that those skilled in the art may easily use the present disclosure as a basis for designing or modifying other programs and structures to achieve the same purposes and / or achieve the same advantages of the embodiments described herein. Those skilled in the art should also recognize that these effective structures do not depart from the spirit and scope of the present disclosure, and that those skilled in the art may make various changes, substitutions, and modifications herein without departing from the spirit and scope of the present disclosure.

Claims

1. A method for processing a semiconductor wafer, characterized in that: The following steps are involved: Connecting a cylinder storing a chemical liquid to a test tube; directing the chemical liquid in the cylinder into the test tube; detecting a condition of the chemical liquid in the test tube; determine whether the condition of the chemical liquid is acceptable; When the condition of the chemical liquid is acceptable, supplying the chemical liquid to a processing tool for processing the semiconductor wafer; and The cylinder is identified by scanning a radio frequency identification tag attached to the cylinder to reprogram the chemical liquid intended to be stored in the cylinder.

2. The method according to claim 1, characterized in that The step of detecting the condition of the chemical liquid in the test tube comprises the following steps: generating an image of the chemical liquid in the test tube; analyzing the image to generate data associated with the image; and The data associated with the image is compared to data representing the chemical liquid in a standard phase.

3. The method according to claim 1, characterized in that The step of detecting the condition of the chemical liquid in the test tube The following steps are involved: emitting a first light beam toward the test tube, wherein the first light beam is transformed into a second light beam after passing through the chemical liquid; Receiving the second light beam with a sensor; analyzing the second light beam to generate data associated with the second light beam; and The data associated with the second light beam is compared to data representing the chemical liquid in a standard phase.

4. The method according to claim 1, characterized in that: Further comprising the steps of: circulate the chemical liquid back to the cylinder through the test tube; and A portion of the chemical liquid is directed from the test tube to a supply tube connected to the processing tool.

5. The method according to claim 1, characterized in that Further comprising the steps of: Moving the cylinder into a chamber where the cylinder is connected to the test tube; generating an exhaust gas flow from the chamber; detecting a condition of the exhaust flow; determining whether the condition of the exhaust flow exceeds a threshold; and When it is determined that the condition of the exhaust flow exceeds the threshold, directing the chemical liquid in the cylinder into the test tube is stopped and an alarm is issued.

6. The method according to claim 1, characterized in that Further comprising the steps of: Moving the cylinder into a chamber where the cylinder is connected to the test tube; generating an image of an outlet nozzle and an inlet nozzle of the cylinder; rotating an inlet connector and an outlet connector connected to the test tube to align the inlet nozzle and the outlet nozzle based on the image; and After the rotation operation of the inlet connector and the outlet connector of the test tube, the inlet connector is connected to the inlet nozzle, and the outlet connector is connected to the outlet nozzle.

7. The method according to claim 1, characterized in that Further comprising the steps of: moving the cylinder into a chamber where the cylinder is connected to the test tube; and After the cylinder is moved into the chamber, a front door of the chamber is closed to form an airtight space in the chamber.

8. The method according to claim 1, characterized in that Further comprising the steps of: The cylinder storing the chemical liquid is moved from a storage system to a location near a chemical liquid supply system.

9. A method for testing a chemical liquid in a production facility, characterized in that: The following steps are involved: Moving a cylinder storing the chemical liquid from a storage system to a location near a chemical liquid supply system; moving the cylinder through a front door into a chamber in the chemical liquid supply system; Connecting the cylinder to a test tube; directing the chemical liquid in the cylinder into the test tube; detecting a condition of the chemical liquid in the test tube; determine whether the condition of the chemical liquid is acceptable; and When the condition of the chemical liquid is unacceptable, the cylinder is removed from the chamber of the chemical liquid supply system.

10. The method according to claim 9, characterized in that The conditions for detecting the chemical liquid in the test tube include: generating an image of the chemical liquid in the test tube; analyzing the image to generate data associated with the image; and The data associated with the image is compared to data representing the chemical liquid in a standard phase.

11. The method according to claim 9, characterized in that The condition for detecting the chemical liquid in the test tube includes: emitting a first light beam toward the test tube, wherein the first light beam is transformed into a second light beam after passing through the chemical liquid; receiving the second light beam with a sensor; analyzing the second light beam to generate data associated with the second light beam; and Data associated with the second light beam is compared to data representing the chemical liquid in a standard phase.

12. The method according to claim 9, characterized in that Further including: When the condition of the chemical liquid is acceptable, the chemical liquid is supplied to a processing tool for processing a semiconductor wafer.

13. The method according to claim 9, characterized in that Further including: generating an exhaust flow from the chamber; detecting a condition of the exhaust flow; determining whether the condition of the exhaust flow exceeds a threshold; and When it is determined that the condition of the exhaust flow exceeds the threshold, directing the chemical liquid in the cylinder into the test tube is stopped and an alarm is issued.

14. The method according to claim 9, characterized in that Further including: generating an image of an outlet nozzle and an inlet nozzle of the cylinder; rotating an inlet connector and an outlet connector connected to the test tube to align the inlet nozzle and the outlet nozzle based on the image; and After the rotation operation of the inlet connector and the outlet connector of the test tube, the inlet connector is connected to the inlet nozzle, and the outlet connector is connected to the outlet nozzle.

15. The method according to claim 9, characterized in that The front door is positioned near the chemical liquid supply system, and the cylinder is moved into the chamber through the front door, and further includes: after the cylinder is moved into the chamber, the front door of the chamber is closed to form an airtight space in the chamber.

16. The method according to claim 9, characterized in that Further including: The cylinder is identified by scanning a radio frequency identification tag attached to the cylinder to reprogram the chemical liquid intended to be stored in the cylinder.

17. A chemical liquid supply system, characterized in that: include: One chamber; a roller located in the chamber; a connection module, located in the chamber and above the roller; a test tube connected to the connection module; a liquid testing assembly positioned relative to the test tube; and A control module is electrically connected to the liquid detection assembly and configured to determine whether the chemical liquid is acceptable.

18. The chemical liquid supply system according to claim 17, characterized in that: At least a portion of the test tube near the liquid detection assembly is formed by a light-transmitting material, and the liquid detection assembly includes a camera or a mass spectrometer.

19. The chemical liquid supply system according to claim 17, characterized in that: Further including: a gas detector coupled to the chamber and configured to detect a condition of exhaust gas from the chamber; The control module is electrically connected to the gas detector and is configured to issue an alarm when the condition of the gas in the chamber exceeds a threshold.

20. The chemical liquid supply system according to claim 17, characterized in that: Further including: A front door is located at one side of the chamber, the front door is automatically operated, and when the front door is closed, an airtight space is formed in the chamber.

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