Cooling device for electronic device and data processing system including the cooling device

Abstract

In one embodiment, an electronic device cooling device includes an inlet port for receiving cooling liquid from an external cooling liquid source. The cooling device also includes a lower cooling unit having a first liquid distribution channel therein. The lower cooling unit includes a cooling plate forming a lower surface, the lower surface being positioned on the top surface of one or more electronic devices to extract heat from the device through the cooling plate using at least a portion of the cooling liquid from the external cooling liquid source. The cooling device also includes an upper cooling unit having a second liquid distribution channel to extract heat from air in contact with the upper cooling unit using at least a portion of the cooling liquid received from the external cooling liquid source. The cooling device also includes an outlet port for returning the cooling liquid to the external cooling liquid source. The internal fluid channel structure design can be used and customized for different applications and use cases.

Description

Technical Field

[0001] Embodiments of the present invention generally relate to data centers. More particularly, embodiments of the present invention relate to composite liquid cooling devices. Background Art

[0002] Thermal management of a data center that includes several active electronic racks is critical to ensuring proper performance of the servers and other information technology (IT) equipment running in the racks. Without proper thermal management, the thermal environment within the rack may exceed the operating threshold, causing operational consequences (e.g., server failures, etc.). One way to manage the thermal environment is to use cooling air to cool the IT equipment. Most existing data centers are air-cooled. Recently, data centers have deployed higher power density electronic racks, where higher density chips are packed more closely together to provide greater processing power. One way to maintain a proper thermal environment in these high power density racks may be to use liquid cooling.

[0003] A data center can be a large system consisting of two main parts: IT equipment and facilities. These two parts are closely connected to each other in all stages of operation. However, the life of a facility is usually much longer than the IT equipment it houses. Therefore, it is a challenge to enable the facility to continuously support and meet the needs of IT deployments. These difficulties are compounded when air cooling and liquid cooling technologies are used simultaneously to cool IT equipment.

[0004] In addition, edge computing has recently become an important and popular technology, especially in conjunction with 5G technology. Edge computing requires more computing and storage workloads to be processed closer to the end user rather than in a core data center or central cloud environment. For example, in an autonomous vehicle, multiple sensors are assembled on the vehicle. The data collected by the sensors needs to be processed locally, which requires local vehicle computing hardware. The processing power requirements for edge computing applications (such as autonomous vehicles) are increasing, and the environment in which edge computing applications are deployed can be very different from the controlled environment of a data center. Edge computing devices can be deployed in harsh environments, including harsh temperature, humidity, air quality, and weather conditions. Therefore, these devices are deployed in fully enclosed packages. However, controlling the thermal environment of electronic devices with different thermal design powers and thermal specifications in a fully enclosed package has become a new challenge and a new focus. Summary of the invention

[0005] Embodiments of the present disclosure provide an electronic device cooling device, a data processing system, and an electronic rack of a data center.

[0006] In one aspect of the present disclosure, an electronic device cooling device includes: an inlet port for receiving cooling liquid from an external cooling liquid source; a lower cooling unit including a cooling plate forming a lower surface, the lower surface being positioned on a top surface of the electronic device, the lower cooling unit having a first liquid distribution channel embedded therein to extract heat from the electronic device through the cooling plate using at least a portion of the cooling liquid received from the external cooling liquid source; an upper cooling unit coupled to the lower cooling unit, the upper cooling unit having a second liquid distribution channel to extract heat from air in contact with the upper cooling unit using at least a portion of the cooling liquid received from the external cooling liquid source; an outlet port for returning the cooling liquid from the lower cooling unit and the upper cooling unit to the external cooling liquid source; and a fan for moving airflow through the upper cooling unit.

[0007] In another aspect of the present disclosure, a data processing system includes: a motherboard; an electronic device disposed on the motherboard, the electronic device including at least one processor; and a cooling device located on a top surface of the electronic device. The cooling device includes: an inlet port for receiving cooling liquid from an external cooling liquid source; a lower cooling unit including a cooling plate forming a lower surface, the lower surface being positioned on the top surface of the electronic device, the lower cooling unit having a first liquid distribution channel embedded therein to extract heat from the electronic device through the cooling plate using at least a portion of the cooling liquid received from the external cooling liquid source; an upper cooling unit coupled to the lower cooling unit, the upper cooling unit having a second liquid distribution channel to extract heat from air in contact with the upper cooling unit using at least a portion of the cooling liquid received from the external cooling liquid source; an outlet port for returning the cooling liquid from the lower cooling unit and the upper cooling unit to the external cooling liquid source; and a fan assembled with the upper cooling unit and used to move airflow through the upper cooling unit.

[0008] In another aspect of the present disclosure, an electronic rack of a data center includes: a plurality of blade servers arranged in a stack, each blade server having one or more servers for providing data processing services to a client. Each blade server includes: a motherboard; an electronic device disposed on the motherboard, the electronic device including at least one processor; and a cooling device located on a top surface of the electronic device. wherein the cooling device comprises: an inlet port for receiving cooling liquid from an external cooling liquid source; a lower cooling unit comprising a cooling plate forming a lower surface, the lower surface being positioned on the top surface of the electronic device, the lower cooling unit having a first liquid distribution channel embedded therein to extract heat from the electronic device through the cooling plate using at least a portion of the cooling liquid received from the external cooling liquid source; an upper cooling unit coupled to the lower cooling unit, the upper cooling unit having a second liquid distribution channel to extract heat from air in contact with the upper cooling unit using at least a portion of the cooling liquid received from the external cooling liquid source; an outlet port for returning the cooling liquid from the lower cooling unit and the upper cooling unit to the external cooling liquid source; and a fan assembled with the upper cooling unit and used to move airflow through the upper cooling unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Embodiments of the invention are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings in which like references indicate similar elements.

[0010] Figure 1 is a block diagram illustrating a composite liquid cooling device according to one embodiment.

[0011] Figure 2 is a block diagram showing a composite liquid cooling device according to another embodiment.

[0012] Figure 3 A side view of a composite liquid cooling device according to one embodiment is shown.

[0013] Figure 4 A side view of a composite liquid cooling device according to another embodiment is shown.

[0014] Figure 5 A side view of a composite liquid cooling device according to another embodiment is shown.

[0015] Figure 6 A system using a composite liquid cooling device for liquid cooling and air cooling of electronic devices on a motherboard is shown.

[0016] Figure 7 A server cooling system using multiple composite liquid cooling devices is shown according to one embodiment. DETAILED DESCRIPTION

[0017] Various embodiments and aspects of the present invention will be described with reference to the details discussed below, and the accompanying drawings will illustrate various embodiments. The following description and accompanying drawings are explanations of the present invention and do not constitute limitations of the present invention. Many specific details are described to provide a thorough understanding of various embodiments of the present invention. However, in some cases, in order to provide a concise discussion of embodiments of the present invention, known or conventional details are not described.

[0018] Reference to "one embodiment" or "an embodiment" in the specification means that a particular feature, structure, or characteristic described in conjunction with the embodiment may be included in at least one embodiment of the present invention. The phrase "in one embodiment" appearing in various places in the specification does not necessarily refer to the same embodiment.

[0019] Embodiments of the present invention provide an electronic device cooling device design that can be applied to multiple hardware systems and platforms, including data center applications and edge computing devices. The design includes an upper cooling component, a lower cooling component, and a fluid channel that distributes cooling fluid to the upper cooling component and the lower cooling component. The upper cooling component is used as a liquid-to-air (liquid / air) cooling device (in some cases, used to cool air, and in some other cases, using air to cool its internal liquid), while the lower cooling component is directly attached to the electronic device to be used as a liquid cooling device. Internal fluid channels are used for both the upper cooling component and the bottom cooling component. At least two fluid ports are used to connect the device to an external cooling fluid source. In addition, a blower such as a fan can be assembled with the device for certain use cases to move air through the upper cooling component.

[0020] According to one embodiment, an electronic device cooling device includes an inlet port for receiving cooling liquid from a cooling liquid source external to the cooling device. The cooling device also includes a lower cooling unit having a first liquid distribution channel integrated therein. The lower cooling unit includes a cooling plate forming a lower surface, which is positioned on the top surface of one or more electronic devices to extract heat from the one or more electronic devices through the cooling plate using at least a portion of the cooling liquid received from the external cooling liquid source. The cooling device also includes an upper cooling unit having a second liquid distribution channel to use at least a portion of the cooling liquid received from the external cooling liquid source to perform heat exchange with air contacting the upper cooling unit. The cooling device also includes an outlet port for returning cooling liquid from the lower cooling unit and the upper cooling unit to the external cooling liquid source.

[0021] In one embodiment, the lower cooling unit, the upper cooling unit, the inlet port and the outlet port are fixed together into a single composite device. The lower cooling unit can be manufactured as a first layer, the inlet port and the outlet port can be manufactured as a second layer, and the upper cooling unit can be manufactured as a third layer. In another embodiment, the inlet port and the outlet port are connected together in one layer as a single port unit located between the lower cooling unit and the upper cooling unit.

[0022] In one embodiment, the cooling device includes an air moving unit (e.g., a fan) coupled to the upper cooling unit. The air moving unit is mounted on the upper cooling unit to move air along a surface of the upper cooling unit (i.e., around or through the upper cooling unit). In one embodiment, the cooling device includes one or more air guiding components coupled to the upper cooling unit and the lower cooling unit to guide airflow around the upper cooling unit.

[0023] In one embodiment, the upper module of the cooling device includes a first inlet for receiving cooling liquid from an inlet port and a first outlet for providing cooling liquid to an outlet port. The lower module includes a second inlet for receiving cooling liquid from the inlet port and a second outlet for providing cooling liquid to the outlet port. The first inlet and the second inlet can be arranged in parallel or in series so that a portion of the cooling liquid flows through each unit simultaneously or one by one. In one embodiment, the upper cooling unit and the lower cooling unit each include a plurality of liquid channels to provide uniform distribution of cooling liquid to the upper cooling unit and the lower cooling unit. According to another embodiment, the server cooling system includes a plurality of liquid cooling devices, each of which is located on a surface of one or more electronic devices.

[0024] According to another embodiment, the cooling device can be used as a cooling device disposed on top of an electronic device of a data processing system (e.g., a processor of a server) to provide direct cooling to the electronic device and to provide air cooling to other electronic devices on the same motherboard. The data processing system can be one of the servers of an electronic rack of a data center, wherein the electronic rack typically includes an array of blade servers arranged in a stack. The electronic rack can include a rack cooling liquid manifold to receive cooling liquid from an external cooling liquid source and supply the cooling liquid to the cooling device of each blade server.

[0025] Figure 1 is a block diagram showing an example of the composite liquid cooling device 100 as described above. Figure 1A simplified device design structure is shown. The device includes a top cooling unit and a lower cooling plate and a fluid port. These three parts can be designed as a unit with a detailed internal fluid structure inside the unit. The top cooling unit is used as a cooling device for airflow. It includes an internal fluid structure that enables the cooling fluid to be evenly distributed through the top cooling unit. The cooling fluid is then used to cool the air. The lower cooling unit is used as a direct cooling device for high-performance processors (the high-performance processors are thermally managed by liquid cooling). The fluid port is connected to an external cooling fluid source.

[0026] The fan is used to move the airflow through the top cooling unit or upper cooling unit. When the cooling fluid is recirculated by means of the top cooling unit, the unit is used to cool the air flow. When the fluid stops recirculating by means of the top cooling unit, the air flow moved by the fan is used to cool the device. This design allows for flexible applications in different environments for different scenarios. The device will be directly attached to the liquid cooled electronic device. The lower cooling plate will be assembled on top of these chips. The corresponding mounting method or mounting kit will be assembled on the device not shown in the figure.

[0027] In one embodiment, the composite liquid cooling device 100 includes a lower cooling unit 102, an upper cooling unit 104, and a fluid port 106. In one embodiment, the composite liquid cooling device also includes a fan 108 (or other air moving component) attached to the upper cooling unit 104 using a fan mounting frame 110. Figures 2 to 5 Described in more detail, the lower cooling unit 102 and the upper cooling unit 104 each include one or more liquid distribution channels that distribute cooling liquid through the lower cooling unit 102 and the upper cooling unit 104. The cooling liquid is received from a cooling liquid source external to the composite liquid cooling device 100 at an inlet port of the fluid port 106. The upper cooling unit 104 and the lower cooling unit 102 may each include an inlet port that receives the cooling liquid from the fluid port 106.

[0028] The lower cooling unit 102 can be directly attached to an electronic device (e.g., a high-performance processor) to provide liquid cooling to the electronic device. The heat generated by the electronic device can be extracted through the cooling plate on the bottom surface of the lower cooling unit 102 and carried away by the cooling liquid flowing through the liquid channel of the lower cooling unit 102. The upper cooling unit 104 can extract heat from the air in contact with the upper cooling unit 104 using the cooling liquid flowing through the liquid channel of the upper cooling unit 104. The fan 108 can move air through the surface of the upper cooling unit to cool the air and circulate the air to the additional air-cooled electronic device. Therefore, the composite liquid cooling device 100 serves as a liquid cooling device for the electronic components to which the lower cooling unit 102 is attached, and as an air cooling device for other electronic components in the same housing as the composite liquid cooling device 100. In addition, if the circulation of the cooling liquid fails, the composite liquid cooling device can continue to serve as a heat sink for the electronic device due to the heat being extracted from the upper cooling device into the air.

[0029] Figure 2 is a block diagram showing a top view of a composite liquid cooling device. Figure 2 A top view of the design of the device is shown. The cooling unit is above the top of the lower cooling plate. The two units can be understood as two separate parts, but can also be understood as one unit. The liquid supply and liquid return parts are connected to an external cooling circuit or cooling source. In addition, the internal fluid structure as shown in the figure provides fluid distribution for the top cooling unit and the lower cooling plate.

[0030] In one embodiment, the composite liquid cooling device includes a lower cooling unit 102 and an upper cooling unit 104, which can be respectively connected to the upper cooling unit 104 as described above. Figure 1 The lower cooling unit 102 and the upper cooling unit 104 are identical or similar. The composite liquid cooling device further includes a liquid supply port 210 and a liquid return port 212. The liquid supply port 210 receives cooling liquid from an external cooling liquid source and supplies the cooling liquid to the lower cooling unit 102 and the upper cooling unit 104. The liquid return port 212 receives cooling liquid that has passed through the internal liquid channels of the lower cooling unit 102 and the upper cooling unit 104 and returns it to the external cooling liquid source. Therefore, the liquid supply port 210 supplies cooling liquid to the lower cooling unit 102 and the upper cooling unit 104, where heat is extracted from the electronic device and the air to the cooling liquid, respectively. Then, the cooling liquid is taken away from the composite liquid cooling device together with the extracted heat and returned to the cooling liquid source through the liquid return port 212.

[0031] The liquid supply port 210 provides cooling liquid to the upper cooling unit 104 through the upper unit liquid inlet 222. The upper unit liquid inlet 222 is an opening on the top side of the liquid supply port 210. The liquid supply port 210 provides cooling liquid to the lower cooling unit 102 through the lower unit liquid inlet 224. The lower unit liquid inlet 224 is an opening on the bottom side of the liquid supply port 210. The upper unit liquid inlet 222 and the lower unit liquid inlet 224 can have the same or different sizes (as shown). Similarly, the upper unit liquid outlet 226 can provide cooling liquid from the upper cooling unit 104 to the liquid return port 212, and the lower unit liquid outlet 228 can provide cooling liquid from the lower cooling unit 102 to the liquid return port 212.

[0032] Figures 3 to 5 A cross-sectional side view of a composite liquid cooling device according to various embodiments is shown. Figure 3 A detailed side view of a cross section of a cooling device (e.g., fluid inlet) is shown. It can be seen that the internal fluid channels enable the fluid to be delivered to the top cooling unit as well as the lower cooling plate after entering the fluid inlet port on the side. The detailed fluid internal channels evenly distribute the fluid in the cooling unit and the lower cooling plate.

[0033] Reference Figure 3 , the cooling device includes a lower cooling unit 102, an upper cooling unit 104, and a fluid inlet / outlet port 106. The lower cooling unit 102 includes a lower cooling unit fluid channel 315 and receives cooling liquid through the lower unit liquid inlet 224. For example, cooling liquid flows into the fluid inlet port 106 from an external source. A portion of the cooling liquid enters the lower cooling unit fluid channel 315 through the lower unit liquid inlet 224. Then, the cooling liquid flows through the lower cooling unit fluid channel 315 to the fluid outlet port 106 (for example, on the end of the device opposite to the fluid inlet port 106). The inlet / outlet port 106 forms a port unit located between the upper cooling unit 104 and the lower cooling unit 102. The cooling liquid enters the port unit via the inlet port. The cooling liquid is supplied upward to the upper cooling unit 104 and downward to the lower cooling unit 102. Similarly, the cooling liquid carrying the exchanged heat returns downward to the port unit from the upper cooling unit 104, and returns upward to the port unit from the lower cooling unit 102.

[0034] The lower cooling unit fluid passages 315 evenly distribute the cooling liquid through the lower cooling unit 102. The cooling liquid is discharged through the lower unit liquid outlets (e.g., Figure 2The lower unit liquid outlet 228 of the lower cooling unit 102 exits the lower cooling unit fluid channel 315 to the fluid outlet port 106 and returns to the cooling liquid source. The lower cooling unit 102 can extract heat from the electronic device to the cooling liquid through the cooling plate on the bottom surface of the lower cooling unit 102 as the cooling liquid flows through the lower cooling unit fluid channel 315.

[0035] The upper cooling unit 104 includes a top cooling unit fluid channel 320 and receives cooling liquid from the fluid inlet / outlet port 106 through the upper unit liquid inlet 222. For example, a portion of the cooling liquid flowing into the fluid inlet port 106 from an external source enters the top cooling unit fluid channel 320 through the upper unit liquid inlet 222. In some embodiments, as Figure 3 104. As shown, the upper unit liquid inlet 222 is larger than the lower unit liquid inlet 224. However, the device may include other fluid inlet size ratios than shown. The coolant then flows through the top cooling unit fluid channel 320, extracting heat from the air in contact with the upper cooling unit 104. The upper cooling unit fluid channel 320 evenly distributes the coolant through the upper cooling unit 104. The coolant then exits the upper cooling unit fluid channel 320 to the upper unit liquid outlet (e.g., Figure 2 The cooling liquid may then be recombined with the cooling liquid from the lower cooling unit fluid channel 315 and returned to the external source through the fluid outlet port 106.

[0036] It should be noted that other structures and designs may also be used for the composite liquid cooling device, and the upper cooling unit fluid channels 320, the lower cooling unit fluid channels 315, the internal fluid channel structure design, and the fluid inlet / outlet ports 106. For example, there may be additional fluid inlet and outlet ports, such as separate ports dedicated to the upper cooling unit 104 and the lower cooling unit 102. In addition, the fluid channels may be oriented in different directions, include channels of different sizes, etc.

[0037] Figure 4 Another design method for the fluid channel of the composite device is shown. The fluid inlet and outlet can be assembled or designed in any part or side of the device. However, different designs will lead to different performances. Figure 4 A case shown in considers the fluid inlet on the side. It can be seen that the fluid inlet channels leading to the top cooling unit and the lower cooling unit are parallel, and their fluid inlets are also on one side.

[0038] Reference Figure 4 , similar to Figure 3 The composite cooling device shown, Figure 4The cooling device of the embodiment includes a lower cooling unit 102, an upper cooling unit 104, and a fluid inlet / outlet port 406 as part of a port unit. The lower cooling unit 102 includes a lower cooling unit fluid channel 415 and receives cooling fluid through the lower unit liquid inlet 402. The upper cooling unit 104 includes an upper cooling unit fluid channel 420 and receives cooling liquid from the fluid inlet / outlet port 406 through the upper unit liquid inlet 404. In this embodiment, the port unit having the inlet and outlet ports 406 is located on one side across the upper cooling unit 104 and the lower cooling unit 102. The cooling liquid received from an external cooling liquid source is supplied to the upper cooling unit 104 and the lower cooling unit 102 in parallel.

[0039] However, if Figure 4 As shown, the fluid inlet port 406 and the upper unit liquid inlet 404 and the lower unit liquid inlet 402 are located at different points within the cooling device. The upper cooling unit 104 and the lower cooling unit 102 can be directly connected to each other, and the fluid inlet / outlet port 406 is attached to the side. Therefore, the upper unit liquid inlet 404 and the lower cooling unit inlet 402 are also located (e.g., respectively and in parallel) on the side of each of the upper cooling unit 104 and the lower cooling unit 102. Therefore, the cooling liquid received from the external source enters and leaves the upper cooling unit 104 and the lower cooling unit 102 at different points, so that liquid flows with different distribution volumes can be provided. The lower cooling unit inlet 402 and the upper cooling unit inlet 404 are positioned so that the cooling liquid is received from the external cooling liquid source and then split between the upper cooling unit 104 and the lower cooling unit 102. Therefore, the cooling liquid flows through the lower cooling unit 102 and the upper cooling unit 104 in parallel, and then recombines and returns to the external cooling liquid source.

[0040] Figure 5 Designs are shown with fluid inlet / outlet in series to the top cooling unit and the lower cooling plate. These designs are provided as examples of internal fluid channels. It can be designed in different configurations to achieve better performance depending on the actual use case. In some designs, the fluid can be used to cool the top cooling unit first, then the lower cooling unit, in some designs, the fluid can be used to cool both parts in parallel, and so on.

[0041] Reference now Figure 5 , similar to Figure 3 and 4 The composite cooling device shown in Figure 5The cooling device of includes a lower cooling unit 102, an upper cooling unit 104, and a fluid inlet / outlet port 506 as a part of a port unit. The lower cooling unit 102 includes a lower cooling unit fluid channel 515 and receives cooling fluid through the lower unit liquid inlet 502. The upper cooling unit 104 includes an upper cooling unit fluid channel 520 and receives cooling liquid from the fluid inlet / outlet port 506 through the upper unit liquid inlet 504. In this example, the cooling liquid received from the external cooling liquid source is first supplied to the upper cooling unit 104, and then the cooling liquid is supplied from the upper cooling unit 104 to the lower cooling unit 102 in series.

[0042] However, if Figure 5 As shown, the fluid inlet port 506 and the upper unit liquid inlet 504 and the lower unit liquid inlet 502 are located at different points within the cooling device. The upper cooling unit 104 and the lower cooling unit 102 can be directly attached to each other, and the fluid inlet / outlet port 406 is connected to one side of the device. The upper cooling unit fluid inlet 504 is located on one side of the upper cooling unit 104 and spans almost all fluid channels in the upper cooling unit 104. The fluid inlet 502 of the lower cooling unit is located at the top of the lower cooling unit 102 and receives the cooling liquid from the upper cooling unit 104, rather than directly receiving the cooling liquid from the fluid inlet port 506. In this way, the cooling liquid first enters the upper cooling unit 104, and the same cooling liquid (but under different thermal conditions) then enters the lower cooling unit 102 (i.e., in series) from the upper cooling unit 104. Alternatively, the cooling liquid can flow in the opposite direction, so that the cooling liquid enters the lower cooling unit 102 and then enters the upper cooling unit 104.

[0043] Figure 6 An electronic system is shown that uses a composite liquid cooling device to cool electronic devices by both liquid cooling and air cooling. The system may represent a data processing system, such as a server having one or more electronic devices (e.g., processors) arranged on a motherboard. The system may be one of an array of blade servers arranged in a stack of electronic racks in a data center.

[0044] Figure 6 A server cooling system for liquid cooling and air cooling electronic devices using multiple composite liquid cooling devices is shown. The composite cooling device is mounted on the liquid cooled electronic device. It can be seen that some of the other electronic devices are air cooled using a radiator. The system can be understood as a completely closed system. The air is moved by a fan so that the air is recirculated within the housing. It should be mentioned that the fan position can be changed according to the actual system design. Figure 1The solution proposed in can also be applied here. The top cooling unit can be understood as a liquid-to-air heat exchanger that removes heat from the air and supplies cooling air to the radiator. Finally, all the heat generated within the system is extracted into the liquid. It should be mentioned that some systems may need to apply air channels or air baffles to obtain better air cooling performance or air flow management.

[0045] In one embodiment, the cooling system includes a composite liquid cooling device, which includes a lower cooling unit 102, an upper cooling unit 104, and an inlet / outlet port 106. The lower cooling unit 102 and the upper cooling unit 104 may include a plurality of fluid channels to distribute the cooling liquid received from the fluid inlet port 106 through the cooling unit (as shown by the fluid flow). The upper cooling unit 104 extracts heat from the air flow flowing through the surface of the upper cooling unit 104 using the cooling liquid flowing through the fluid channels of the upper cooling unit 104. The lower cooling unit 102 extracts heat from one or more liquid-cooled electronic devices 612 by using the cooling liquid flowing through the fluid channels of the lower cooling unit 102. The liquid-cooled electronic devices 612 may include high-performance processors or other high power density devices. The lower cooling unit 102 may include a cooling plate on the bottom surface that contacts the liquid-cooled electronic devices 612 to extract heat from the liquid-cooled electronic devices 612 and transfer the heat to the cooling liquid.

[0046] The system also includes a motherboard 610, an air-cooled electronic device 614 attached to the motherboard 610, a heat sink 616 attached to the air-cooled electronic device 614, and a liquid-cooled electronic device 612. In one embodiment, the system also includes a fan 618. The fan can be attached to the upper cooling unit 104 or can be installed elsewhere in the housing. The fan 618 can move air through the upper cooling unit 104 to cool the air. The fan 618 can also circulate air through the housing, as shown in the air flow. The air cooled by the upper cooling unit 104 then flows along the heat sink 616 and the air-cooled electronic device 614, extracting heat from the heat sink 616 and the air-cooled electronic device 614. In some embodiments, an air channel or air baffle can be included in the system to direct the air flow to the air-cooled electronic device. Therefore, the composite liquid cooling device is used as a liquid cooling device for the liquid-cooled electronic device 612, and is also used as an air cooling device for the air-cooled electronic device 614 by cooling the circulating air in the housing.

[0047] Figure 7Another system integration using the proposed method is shown. It can be seen that the system is partially air-cooled and partially liquid-cooled. The air-cooled electronic device has a heat sink attached. These air-cooled electronic devices can be understood as lower power density devices, such as PCIE switches. There may be some electronic devices packaged on air-cooled boards. Liquid-cooled boards can be understood as having multiple high-performance processors closer to each other. These units are partially assembled with the composite device proposed in the present invention and partially assembled with liquid-cooled cold plates to be liquid-cooled. Again, detailed fluid ducting and airflow management design is required, which is not shown here. There is no air moving fan because it can be assembled in the rack or on the device as a separate device.

[0048] If the system is deployed in a hybrid cooling data center (which means that both cooling air source and cooling water source are available), the top cooling section can be used as an air cooling radiator when the cooling liquid is lost. (In this application, the internal fluid channel will be supplied to the lower cooling unit). When the main fluid is cut off, the current device continues to work as a pure air cooling device. The cold plate cannot be cooled. If the system is deployed in a pure liquid cooling data center, a device can be used to adapt the hybrid cooling equipment; then, one row of devices or two rows of devices in the device can be assembled with a composite cooling device. If the system is deployed in a hybrid cooling data center and when the cooling air source is lost, the top cooling section is used as a cooling device for cooling the air of the air-cooled plate.

[0049] In one embodiment, reference Figure 7 , the server cooling system includes an air-cooled plate 720 and a liquid-cooled plate 710. The liquid-cooled plate 710 is an electronic motherboard including a plurality of electronic devices cooled using a liquid cooling device. The electronic devices cooled using liquid cooling may be high-performance processors, or other electronic devices with higher power density. The liquid-cooled electronic devices may also be densely distributed (i.e., more closely distributed together) on the liquid-cooled plate 710. Some electronic devices on the liquid-cooled plate 710 are cooled using a cold plate 716, while other electronic devices on the liquid-cooled plate 710 are cooled using a composite liquid cooling device 712. The cooling liquid is distributed to the cold plate 716 and the composite liquid cooling device 712 using a fluid conduit 714. The cooling liquid is provided to the server cooling device from the main fluid inlet 702 and leaves the server through the main fluid outlet 704.

[0050] The air-cooled board 720 includes an electronic device that is cooled using air in contact with the electronic device. The air-cooled electronic device can be a device with a low power density and can be kept within an operating temperature using an air cooling method. The air in the housing can be circulated by one or more fans to increase the heat absorption of the air. In addition, the circulating air can be cooled by an upper cooling unit of a composite liquid cooling device 712 for extracting heat from the circulating air. The cooled air then flows through the electronic devices of the air-cooled board to extract the heat generated by these electronic devices. An air baffle or air channel can direct the cooled air to the air-cooled electronic device and can ensure uniform distribution of the cooled air. A heat sink 722 can be attached to some electronic devices on the air-cooled board 720 to increase the heat transfer from the electronic device to the air.

[0051] In the foregoing description, embodiments of the present invention have been described with reference to specific exemplary embodiments of the present invention. Obviously, various modifications may be made to these embodiments without departing from the broader spirit and scope of the present invention as set forth in the appended claims. Therefore, the description and drawings are to be regarded as illustrative rather than restrictive.

Claims

1. An electronic device cooling device, comprising: an inlet port for receiving coolant from an external coolant source; a lower cooling unit including a cooling plate forming a lower surface, the lower surface being positioned on the top surface of the electronic device, the lower cooling unit having a plurality of first liquid distribution channels embedded therein to extract heat from the electronic device through the cooling plate using at least a portion of the cooling liquid received from the external cooling liquid source, the plurality of first liquid distribution channels to provide uniform distribution of the cooling liquid to the lower cooling unit; an upper cooling unit coupled to the lower cooling unit, the upper cooling unit having a plurality of second liquid distribution channels to extract heat from air in contact with the upper cooling unit using at least a portion of the cooling liquid received from the external cooling liquid source, the plurality of second liquid distribution channels to provide uniform distribution of the cooling liquid to the upper cooling unit; the second liquid distribution channels being in communication with the first liquid distribution channels; an outlet port to return the coolant from the lower cooling unit and the upper cooling unit to the external coolant source; as well as a fan for moving airflow through the upper cooling unit; The lower cooling unit, the upper cooling unit, the inlet port, and the outlet port are integrated together and assembled into a single composite device.

2. The electronic device cooling device according to claim 1, further comprising a port unit having the inlet port and the outlet port for circulating the cooling liquid, wherein The port unit is located between the lower cooling unit and the upper cooling unit.

3. The electronic device cooling device according to claim 2, wherein: The port unit is configured to supply at least a portion of the cooling liquid upward to the upper cooling unit and to supply at least a portion of the cooling liquid downward to the lower cooling unit. 4 . The electronic device cooling device according to claim 1 , further comprising an air moving unit having at least one cooling fan coupled to the upper cooling unit for moving air along a surface of the upper cooling unit.

5. The electronic device cooling device according to claim 4, wherein: The upper cooling unit includes an air-liquid heat exchanger.

6. The electronic device cooling device according to claim 1, further comprising a port unit having the inlet port and the outlet port for circulating the cooling liquid, wherein: The port unit is located on one side across the lower cooling unit and the upper cooling unit.

7. The electronic device cooling device according to claim 6, wherein: The port unit is configured to supply at least a portion of the cooling liquid upward to the upper cooling unit and to supply at least a portion of the cooling liquid downward to the lower cooling unit.

8. The electronic device cooling device according to claim 6, wherein: The port unit is configured to supply at least a portion of the cooling liquid to the upper cooling unit, wherein the cooling liquid flows through the upper cooling unit and then enters the lower cooling unit.

9. The electronic device cooling device according to claim 1, wherein: The upper cooling unit includes a first inlet for receiving the cooling liquid from the inlet port, and a first outlet for returning the cooling liquid to the outlet port, and wherein the lower cooling unit includes a second inlet for receiving the cooling liquid from the inlet port, and a second outlet for returning the cooling liquid to the outlet port. 10 . The electronic device cooling device of claim 1 , further comprising one or more air guide members coupled to the upper cooling unit and the lower cooling unit to guide air flow around the upper cooling unit.

11. A data processing system comprising: motherboard; An electronic device disposed on the motherboard, the electronic device comprising at least one processor; as well as A cooling device is located on the top surface of the electronic device, wherein the cooling device comprises: an inlet port for receiving coolant from an external coolant source; a lower cooling unit including a cooling plate forming a lower surface, the lower surface being positioned on the top surface of the electronic device, the lower cooling unit having a plurality of first liquid distribution channels embedded therein to extract heat from the electronic device through the cooling plate using at least a portion of the cooling liquid received from the external cooling liquid source, the plurality of first liquid distribution channels to provide uniform distribution of the cooling liquid to the lower cooling unit; an upper cooling unit coupled to the lower cooling unit, the upper cooling unit having a plurality of second liquid distribution channels to extract heat from air in contact with the upper cooling unit using at least a portion of the cooling liquid received from the external cooling liquid source, the plurality of second liquid distribution channels to provide uniform distribution of the cooling liquid to the upper cooling unit; the second liquid distribution channels being in communication with the first liquid distribution channels; an outlet port to return the coolant from the lower cooling unit and the upper cooling unit to the external coolant source; and a fan assembled with the upper cooling unit and used to move airflow through the upper cooling unit; The lower cooling unit, the upper cooling unit, the inlet port, and the outlet port are integrated together into a single composite device.

12. The data processing system according to claim 11, wherein: The cooling device further includes a port unit having the inlet port and the outlet port for circulating the cooling liquid, wherein the port unit is located between the lower cooling unit and the upper cooling unit.

13. The data processing system according to claim 12, wherein: The port unit is configured to supply at least a portion of the cooling liquid upward to the upper cooling unit and to supply at least a portion of the cooling liquid downward to the lower cooling unit.

14. An electronic rack for a data center, comprising: A plurality of blade servers arranged in a stack, each blade server having one or more servers for providing data processing services to clients, wherein each blade server comprises: motherboard; An electronic device disposed on the motherboard, the electronic device comprising at least one processor; and A cooling device is located on the top surface of the electronic device, wherein the cooling device comprises: an inlet port for receiving coolant from an external coolant source; a lower cooling unit including a cooling plate forming a lower surface, the lower surface being positioned on the top surface of the electronic device, the lower cooling unit having a plurality of first liquid distribution channels embedded therein to extract heat from the electronic device through the cooling plate using at least a portion of the cooling liquid received from the external cooling liquid source, the plurality of first liquid distribution channels to provide uniform distribution of the cooling liquid to the lower cooling unit; an upper cooling unit coupled to the lower cooling unit, the upper cooling unit having a plurality of second liquid distribution channels to extract heat from air in contact with the upper cooling unit using at least a portion of the cooling liquid received from the external cooling liquid source, the plurality of second liquid distribution channels to provide uniform distribution of the cooling liquid to the upper cooling unit; the second liquid distribution channels being in communication with the first liquid distribution channels; an outlet port to return the coolant from the lower cooling unit and the upper cooling unit to the external coolant source; and a fan assembled with the upper cooling unit and used to move airflow through the upper cooling unit; The lower cooling unit, the upper cooling unit, the inlet port, and the outlet port are integrated together into a single composite device.

15. The electronic rack according to claim 14, wherein: The cooling device further includes a port unit having the inlet port and the outlet port for circulating the cooling liquid, wherein the port unit is located between the lower cooling unit and the upper cooling unit.

16. The electronic rack according to claim 15, wherein: The port unit is configured to supply at least a portion of the cooling liquid upward to the upper cooling unit and to supply at least a portion of the cooling liquid downward to the lower cooling unit.

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