Liquid handling device

Abstract

The present invention improves the control performance of liquid, especially droplets, and improves the manufacturing efficiency of a liquid operation device. A liquid operation device includes: a substrate (1, 11) formed in a sheet or film shape in a flexible manner, a plurality of electrodes (2) arranged on the surface (1b, 11b) of the substrate, and an insulating film (3) arranged on the surface of the substrate in a manner covering the plurality of electrodes; liquid (L) is moved on the surface (3b) of the insulating film by utilizing an electrostatic force generated by applying a voltage to at least one of the electrodes. In the liquid operation device, the insulating film has a plurality of pits (4) located at positions corresponding to the plurality of electrodes, respectively, and is bent in a concave direction from the surface of the insulating film toward the back side (3a), and each electrode has a pit corresponding portion (5), which is bent in a concave direction together with the pit located at a position corresponding to each electrode.

Description

Technical Field

[0001] The present invention relates to a liquid manipulation device configured to move a liquid using electrostatic force. Background Art

[0002] In various technical fields such as biology, medicine, drug development, and MEMS (Micro Electro Mechanical Systems), EWOD (Electro Wetting On Dielectric), which uses electrostatic force to manipulate liquids, especially droplets, has attracted attention. In particular, in the technical fields of biology, medicine, and drug development, EWOD is expected to be used as a technology for manipulating rare and dangerous reagents.

[0003] Typically, a device using EWOD (hereinafter referred to as a "liquid manipulation device") includes a substrate and an insulating film, wherein the substrate has a plurality of electrodes, and the insulating film has a back surface and a surface, wherein the back surface of the insulating film is arranged and bonded to the surface of the substrate, and the surface of the insulating film is opposite to the back surface and suppresses frictional resistance, and the electrostatic force based on the voltage applied to the electrodes is changed, so that the droplet moves in a sliding manner on the surface of the insulating film (for example, refer to non-patent document 1). In the aforementioned liquid manipulation device, in order to stop the droplet at a desired position on the surface of the insulating film suppressing frictional resistance, it is important to appropriately adjust environmental conditions such as the magnitude of the electrostatic force, the hydrophobicity of the insulating film, and the frictional resistance.

[0004] However, it is difficult to properly adjust such environmental conditions, and the droplet control performance of the liquid manipulation device becomes low. This has become a major factor hindering the popularization of EWOD. Therefore, in order to improve the droplet control performance, various liquid manipulation devices have been proposed.

[0005] For example, as such a liquid operating device, the following liquid operating device can be cited, which is configured to include a substrate, a first insulating film, a second insulating film and a second electrode; the substrate includes a plurality of first electrodes; the first insulating film has a back side and a surface, the back side of the first insulating film is configured and bonded to the surface of the substrate, and the surface of the first insulating film is opposite to the back side and suppresses frictional resistance; the second insulating film is configured in a manner separated from the surface of the first insulating film and has a surface that suppresses frictional resistance; the second electrode is located on the opposite side of the first insulating film relative to the second insulating film; by changing the electrostatic force based on the voltage applied to the first electrode and the second electrode, the droplets move along the surfaces of the first insulating film and the second insulating film in the space between the first insulating film and the second insulating film.

[0006] In addition, specifically, as an example of a liquid operating device, there can be cited a liquid operating device in which a first insulating film and an adhesive layer composed of an adhesive and located between the first insulating film and a substrate are arranged in a manner corresponding to a first electrode and are formed to have a recessed portion recessed from the surface of the first insulating film, and the surface of the substrate and the surface of the first electrode arranged along the surface of the substrate are formed to be flat. In such a liquid operating device, when forming the recessed portion, a convex portion of a mold corresponding to the recessed portion is pressed against the surface of the first insulating film at a predetermined heating temperature and for a predetermined pressing time in a manner that only the first insulating film and the adhesive layer are deformed (for example, see Patent Document 1).

[0007] As another example of a liquid operating device, the following liquid operating device can be cited: the first insulating film is bent in a manner having a recessed portion sunken from the surface of the first insulating film, and the substrate has a hole corresponding to the recessed portion of the first insulating film and passing through the substrate (for example, refer to patent document 2).

[0008] As another example of a liquid operating device, the following liquid operating device can be cited: a concave portion and a convex portion are formed on the surface of a second insulating film, the convex portion is arranged corresponding to the first electrode, and the droplet stops on the convex portion corresponding to the first electrode when a voltage is applied to the first electrode (for example, refer to patent document 3).

[0009] Prior art literature

[0010] Patent Literature

[0011] Patent Document 1: U.S. Patent Application Publication No. 2012 / 261264

[0012] Patent Document 2: Japanese Patent Application Publication No. 2007-212943

[0013] Patent Document 3: International Publication No. 2008 / 007511

[0014] Non-patent literature

[0015] Non-Patent Literature 1: Hyojin Ko, 7 others, “Active Digital Microfluidic PaperChips with Inkjet-Printed Patterned Electrodes,” ADVANCED MATERIALS, Vol. 26, No. 15, April 16, 2014, pp. 2335-2340 Summary of the invention

[0016] Problem that the invention aims to solve

[0017] However, in one example of the above-mentioned liquid operating device, when a recessed portion is formed in the first insulating film, processing conditions such as heating temperature, pressure, and pressing time are set in such a way that only the first insulating film and the adhesive layer are deformed. However, it is difficult to appropriately set such processing conditions. In addition, in another example of the above-mentioned liquid operating device, when a recessed portion is formed in the first insulating film, a process of forming a hole in the substrate is necessary. Such an operation of forming a hole in the substrate reduces the manufacturing efficiency of the liquid operating device. In another example of the above-mentioned liquid operating device, since the droplet moves from the convex portion to the concave portion, the droplet cannot be effectively stopped at a position corresponding to the first electrode. Therefore, the control performance of the droplet becomes low.

[0018] In view of such actual situation, it is hoped that the control performance of liquid, especially droplets, can be improved in liquid operation devices and the manufacturing efficiency of the devices can be improved.

[0019] Means of solving the problem

[0020] In order to solve the above-mentioned problems, a liquid operation device according to one embodiment of the present invention is configured as follows: it includes a substrate, a plurality of electrodes and an insulating film, the substrate is formed into a sheet or film shape in a flexible manner, the plurality of electrodes are arranged on the surface of the substrate, and the insulating film is arranged on the surface of the substrate in a manner covering the plurality of electrodes; the insulating film has a back side and a front side, the back side of the insulating film faces the surface of the substrate; the surface of the insulating film is located on the opposite side of the thickness direction of the insulating film relative to the back side of the insulating film, and the liquid is moved on the surface of the insulating film by utilizing the electrostatic force generated by applying a voltage to at least one of the electrodes; wherein the insulating film has a plurality of pits, the plurality of pits are respectively located at positions corresponding to the plurality of electrodes, and are bent in a manner concave in a concave direction from the surface of the insulating film toward the back side of the insulating film; each electrode has a pit corresponding portion, and the pit corresponding portion is bent in a manner concave in the concave direction together with the pit located at the position corresponding to the electrode.

[0021] Effects of the Invention

[0022] In the liquid manipulation device according to one embodiment of the present invention, the control performance of liquid, especially liquid droplets, can be improved, and the manufacturing efficiency can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A plan view schematically shows the liquid handling device according to the first embodiment.

[0024] Figure 2 yes Figure 1 AA line section view.

[0025] Figure 3(a), (b) and (c) are along the Figure 1 The BB line cuts off the liquid manipulation device, schematically showing a cross-sectional view of the liquid manipulation device before, during, and after the movement of the liquid droplet.

[0026] Figure 4 (a), (b) and (c) are along the Figure 1 The cross-sectional views of the liquid operating device before the pit forming process, during the pit forming process, and after the pit forming process are schematically shown in a state cut along the AA line.

[0027] Figure 5 is along the equivalent of Figure 1 A cross-sectional view of the liquid handling device according to the second embodiment is schematically shown in a state cut along line AA. DETAILED DESCRIPTION

[0028] The liquid handling devices according to the first embodiment and the second embodiment will be described.

[0029] In the specification of the present invention, "film" refers to a film-like object having a thickness of about 200 μm (micrometers) or less, and "sheet" refers to a film-like object having a thickness exceeding about 200 μm.

[0030] "First Implementation Method"

[0031] The liquid handling device according to the first embodiment will be described.

[0032] "General description of liquid handling equipment"

[0033] First, refer to Figure 1 as well as Figure 2 The liquid handling device of this embodiment is schematically described. The liquid handling device has a substrate 1, which is formed in a sheet or film shape in a flexible manner. The substrate 1 has a back surface 1a and a front surface 1b, and the front surface 1b is located on the opposite side of the back surface 1a in the thickness direction of the substrate 1.

[0034] The liquid manipulation device has a plurality of electrodes 2 disposed on a surface 1b of a substrate 1. The liquid manipulation device has an insulating film 3 disposed on the surface 1b of the substrate 1 in a manner covering the plurality of electrodes 2. The liquid manipulation device can move a liquid L, especially a droplet L, on a surface 3b of the insulating film 3 described below by utilizing an electrostatic force generated by applying a voltage to at least one of the electrodes 2.

[0035] In such a liquid handling device, the insulating film 3 has a back surface 3a and a front surface 3b, the back surface 3a faces the front surface 1b of the substrate 1, and the front surface 3b is located on the opposite side of the thickness direction of the insulating film 3 relative to the back surface 3a. The insulating film 3 further has a plurality of pits 4, which are curved so as to be concave in a concave direction from the front surface 3b of the insulating film 3 toward the back surface 3a of the insulating film 3. The plurality of pits 4 are arranged so as to correspond to the plurality of electrodes 2, respectively. Each electrode 2 has a first pit corresponding portion 5, which is curved so as to be concave in the above-mentioned concave direction together with the pits 4 located at the position corresponding to each electrode 2.

[0036] In addition, it is preferable that the surface 3b of the insulating film 3 is open to the outside. It is preferable that each electrode 2 is formed larger than the corresponding recess 4.

[0037] "Detailed description of the substrate"

[0038] Reference Figure 1 and Figure 2 The substrate 1 is described in detail. That is, the substrate 1 is preferably configured as follows. Figure 2 In the embodiment, the substrate 1 is formed to have a recessed concave portion 1c in a manner corresponding to the electrode 2. In addition, the substrate 1 has a plurality of second concave corresponding portions 6, which respectively correspond to the plurality of first concave corresponding portions 5 of the electrode 2 and are recessed in the concave direction. The second concave corresponding portions 6 are arranged in the concave portion 1c. The back surface 1a of the substrate 1 is formed to be smooth or flat. However, the substrate may also have a second concave corresponding portion on the side without the concave portion, for example, a printer such as an inkjet printer may be used to enable the electrode to be carried on the substrate.

[0039] The substrate 1 is preferably made of paper, resin, etc. Here, "paper" refers to paper made by gluing plant fibers, other fibers, etc., and inorganic substances such as porous bodies and organic molecules such as synthetic molecules can be added. "Resin" is a resin with natural and / or synthetic polymer compound materials as the main component, and can be a composite material that also contains fibers, inorganic substances, etc., and is particularly preferably a thermoplastic resin that can be easily processed using heat. It is particularly preferred that the substrate 1 can be bent, and it is further preferred that the substrate 1 can be easily cut using a sharp tool such as scissors or a cutter.

[0040] In addition, the thickness of the substrate 1 is set in such a manner that the substrate 1 has flexibility. For example, when the substrate 1 is made of paper or is paper, the thickness of the substrate 1 can be about 100 μm to 200 μm. When the substrate 1 is a resin or is made of a resin, the substrate 1 can be a film with a thickness of about 200 μm or less, or can be a sheet with a thickness greater than about 200 μm. Preferably, the substrate 1 is not made of glass or silicon. However, the relationship between the material and thickness of the substrate of the present invention is not limited to this. In addition, the thickness of the substrate 1 can be set so that the substrate 1 has flexibility while enabling the back side 1a of the substrate 1 to maintain a smooth or flat shape at the second pit corresponding portion 6 after the pit forming process for forming the pit 4 described later.

[0041] "Detailed description of electrodes"

[0042] Reference Figure 1 , Figure 2 and Figure 3 (a)~ Figure 3 (c) describes the electrode 2 in detail. That is, the electrode 2 is preferably constructed in the following manner. The electrode 2 is composed of a conductive material. The conductive material is preferably a metal, carbon, a metal oxide, a material containing at least one of these materials, etc. The electrode 2 is also formed in a film shape. As an example, the electrode can be formed using conductive ink. The thickness of the electrode 2 is set so that the electrode 2 can be plastically deformed together with the insulating film 3 through the pit forming process described later.

[0043] The electrode 2 has a back surface 2a and a front surface 2b, the back surface 2a faces the front surface 1b of the substrate 1, and the front surface 2b is located on the opposite side of the back surface 2a in the thickness direction of the electrode 2. The electrode 2 further has an outer peripheral portion 2c, and the outer peripheral portion 2c is located on the outer peripheral side relative to the first pit corresponding portion 5. The outer peripheral portion 2c is arranged along the front surface 1b of the substrate 1.

[0044] exist Figure 2 In the embodiment, the electrode 2 is arranged in the recessed portion 1c of the substrate 1, and the surface 2b of the electrode 2 is substantially consistent with the surface 1b of the substrate 1. However, as described above, when the substrate is formed in a manner having a second pit corresponding portion on the side without the recessed portion, the outer peripheral portion of the electrode may be arranged on the substrate surface in a manner protruding from the substrate surface.

[0045] The plurality of electrodes 2 are arranged on the surface 1b of the substrate 1 in a manner that they are spaced apart from each other. In addition, the plurality of electrodes 2 are arranged on the surface 1b of the substrate 1 in a matrix (row and column) of m rows and n columns. In addition, m is an integer greater than 1 and n is an integer greater than 2, or m is an integer greater than 2 and n is an integer greater than 1. Figure 1As an example, 12 electrodes 4 are arranged in a matrix of 3 rows and 4 columns. However, the arrangement of the plurality of electrodes is not limited to the matrix, and the plurality of electrodes can be arranged so as to provide a desired movement path for the intended movement of the liquid. For example, the plurality of electrodes can be arranged so that their shape is not limited to a roughly hexagonal honeycomb matrix.

[0046] like Figure 3 (a)~ Figure 3 As shown in (c), such multiple electrodes 2 are connected to a circuit C, and the circuit C can apply voltage to the multiple electrodes 2 respectively. Figure 1 In the embodiment, the circuit C is arranged outside the substrate 1. However, the present invention is not limited to this, and at least a part of the circuit may be arranged on the substrate. For example, wiring etc. as a part of the circuit may also be arranged on the substrate.

[0047] In addition, Figure 3 (a)~ Figure 3 In (c), in order to illustrate the state of applying voltage to the plurality of electrodes 2, a circuit C including a switch, a power supply, a ground, etc. is schematically shown as an example. However, the circuit connected to the plurality of electrodes is not limited to Figure 3 (a)~ Figure 3 The circuit C of (c) may be configured in any manner as long as voltages can be applied to the plurality of electrodes to generate electrostatic forces for stopping and moving the droplets.

[0048] "Detailed description of insulating film"

[0049] Reference Figure 1 as well as Figure 2 , the insulating film 3 is described in detail. That is, the insulating film 3 is preferably constructed in the following manner. The insulating film 3 is preferably electrically insulating, and the insulating film 3, especially the surface 3b of the insulating film 3, is preferably hydrophobic. Therefore, the insulating film 3 is preferably constructed using a material having electrical insulation and hydrophobicity. The material is preferably a resin having electrical insulation and hydrophobicity, such as a fluorine-based resin. In addition, the surface of the insulating film can be constructed using a hydrophobic material or a material having electrical insulation and hydrophobicity, and the portion other than the surface of the insulating film can be constructed using a material having electrical insulation.

[0050] The pit 4 of the insulating film 3 has an opening 4a and an opening edge 4b, wherein the opening 4a is open on the surface 3b of the insulating film 3, and the opening edge 4b ​​is located at the periphery of the opening 4a in a manner of surrounding the opening 4a. The opening edge 4b ​​is formed into a roughly circular shape. However, the shape of the opening edge is not limited to a roughly circular shape. For example, the opening edge can be formed into a roughly polygonal shape such as a roughly quadrilateral shape, a roughly hexagonal shape, a roughly elliptical shape, etc. In addition, the opening edge can also be formed to have a curved corner.

[0051] The pit 4 also has a bottom 4c, which is opposite to the opening 4a in the thickness direction of the insulating film 3 and is located on the back side 3a of the insulating film 3 relative to the opening 4a. The pit 4 has a peripheral wall portion 4d, which extends between the opening edge portion 4b and the bottom 4c. The bottom 4c is formed into a roughly circular arc shape that is depressed in the concave direction. However, the shape of the bottom is not limited to a roughly circular arc shape. For example, the bottom can be formed into a roughly flat shape. The bottom can also be formed into a roughly conical shape that is depressed in the concave direction.

[0052] The peripheral wall portion 4d is formed to narrow as it goes from the opening edge portion 4b to the bottom portion 4c. The peripheral wall portion 4d is formed in a substantially circular arc shape that is recessed in the concave direction. However, the shape of the peripheral edge portion is not limited to such a substantially circular arc shape. For example, the peripheral wall portion can be formed to extend substantially linearly between the opening edge portion and the bottom portion.

[0053] In such a concave pit 4, the curvatures of the bottom 4c and the peripheral wall 4d of the substantially arc-shaped concave direction become substantially equal. However, the curvatures of the bottom and the peripheral wall of the substantially arc-shaped shape may be different from each other. In addition, the maximum depth of the concave pit 4, the size of the opening edge 4b ​​of the concave pit 4, the shape of the concave pit 4, etc. are determined so that the liquid L, especially the droplet L, can be quantitatively and stably held at the position where the concave pit 4 is arranged, and on the other hand, the liquid L, especially the droplet L, which is engaged with the concave pit 4 can be smoothly moved.

[0054] "On the movement of liquids"

[0055] Reference Figure 1 as well as Figure 3 (a)~ Figure 3 (c) of the present embodiment will now be described the movement operation of the liquid droplet L by the liquid operation device. Figure 1 as well as Figure 3 As shown in (a), the droplet operation device is in a first voltage application state in which a voltage is applied to one electrode 2 and a voltage lower than the voltage of the one electrode 2 or no voltage is applied to the remaining electrodes 2 or the electrodes 2 around the one electrode 2. The droplet L is quantitatively and stably held at the first stop position where the one pit 4 is arranged by utilizing the electrostatic force generated in the first voltage application state and the fit between the droplet L and the one pit 4 corresponding to the one electrode 2.

[0056] Then, if Figure 3As shown in (b), the droplet operation device is put into a second voltage application state in which a voltage is applied to another electrode adjacent to the one electrode 2 and a voltage lower than the voltage of the other electrode 2 or no voltage is applied to the remaining electrodes 2 or the electrodes 2 around the other electrode 2. At this time, the droplet L located at the first stop position is pulled by the electrostatic force generated in the second voltage application state to the second stop position where another pit 4 corresponding to the other electrode is arranged, and moves from the first stop position to the second stop position.

[0057] Afterwards, if Figure 1 as well as Figure 3 As shown in (c), by utilizing the electrostatic force generated in the second voltage application state and the engagement of the droplet L with the above-mentioned other pit 4, the droplet L is reliably stopped at the second stop position and is quantitatively and stably maintained at the second stop position. In particular, the droplet L moving from the first stop position to the second stop position can be reliably stopped at the second stop position by utilizing the above-mentioned other pit 4 in a manner that counteracts the inertial force of the droplet L. In addition, in Figure 1 In FIG. 1 , the droplet L is indicated by a dotted line, i.e., a double-dashed line.

[0058] "About how pits are formed"

[0059] Reference Figure 4 (a)~ Figure 4 (c) The method for forming the pit 4 of the liquid handling device of this embodiment is described. Figure 4 As shown in (a), in the liquid operating device before the pit 4 is formed, the electrode 2 is arranged on the substrate 1, and the insulating film 3 is arranged on the substrate 1 in a manner covering the electrode 2, while the insulating film 3, the electrode 2 and the substrate 1 are formed in a roughly flat state.

[0060] Then, if Figure 4 As shown in (b), the following processing is performed on the liquid operating device before the formation of the pit 4: the lower mold D is brought into contact with the back side 1a of the substrate 1, and the upper mold U is pressed against the surface 3b of the insulating film 3 with a specified pressing pressure for a specified time (hereinafter referred to as "pit forming processing" as needed). In the pit forming processing, the contact surface d1 of the lower mold D that contacts the back side 1a of the substrate 1 is formed to be roughly flat, and the convex portion u2 corresponding to the pit 4 is formed on the contact surface u1 of the upper mold U that contacts the surface 3b of the insulating film 3. In addition, it is preferred to perform the processing in a state where the upper mold U is heated to a specified heating temperature. The pressing pressure, pressing time and heating temperature of the pit forming processing are preferably adjusted so as to appropriately plastically form the pit 4 of the insulating film 3 and the pit corresponding portion 5 of the electrode 2. The pit forming processing is preferably a embossing process, but is not limited to this.

[0061] In addition, if Figure 4 As shown in (c), after a predetermined pushing time, if the upper mold U and the lower mold D are separated from the liquid operation device, the pit 4 of the insulating film 3 is formed to be curved in a concave direction, and the pit corresponding portion 5 of the electrode 2 is formed to be curved in a concave direction together with the pit 4 located at the corresponding position. On the other hand, the back surface 1a of the substrate 1 is kept smooth or flat.

[0062] As described above, in the liquid handling device of the present embodiment, the insulating film 3 has a plurality of dimples 4 located at positions corresponding to the plurality of electrodes 2, and is curved in a concave direction from the surface 3b of the insulating film 3 toward the back surface 3a of the insulating film 3, and each electrode 2 has a dimple corresponding portion 5, and the dimple corresponding portion 5 is curved in a concave direction together with the dimples 4 located at positions corresponding to each electrode 2. Therefore, on the surface 3b of the insulating film 3, the liquid L can be effectively stopped at a desired position by using the dimples 4. Therefore, in the liquid handling device, the control performance of the liquid L, especially the droplets L, can be improved. In addition, since each electrode 2 is formed to have the dimple corresponding portion 5 as described above, in order to form the dimples 4, a dimple forming process such as a embossing process can be performed in which the insulating film 3, the electrode 2, and the substrate 1 are integrally squeezed out from the surface 3b of the insulating film 3 while a strong force is applied in a manner that allows the electrode 2 to deform. As a result, the dimples 4 can be easily formed into a desired shape, and the processing accuracy of the liquid handling device can be improved. This can improve the manufacturing efficiency of the liquid handling device.

[0063] In the liquid manipulation device of this embodiment, the surface 3b of the insulating film 3 is open to the outside. Therefore, the structure of the liquid manipulation device on the surface 3b side of the insulating film 3 can be simplified, and the manufacturing efficiency of the liquid manipulation device can be improved.

[0064] In the liquid handling device of the present embodiment, each electrode 2 is formed larger than the corresponding dimple 4. Therefore, when the dimple 4 is formed on the insulating film 3 by a dimple forming process such as a embossing process, the dimple corresponding portion 5 of the electrode 2 can be stably formed in accordance with the dimple 4 while pressing the outer peripheral portion 2c of the electrode 2 located closer to the outer peripheral side of the dimple 4 than the dimple 4. Therefore, the manufacturing efficiency of the liquid handling device can be improved.

[0065] "Second Implementation Method"

[0066] The liquid handling device of the second embodiment is described. The liquid handling device of the present embodiment is configured similarly to the liquid handling device of the first embodiment except for the substrate. For such components of the present embodiment, when they are the same as the components of the first embodiment, the same reference numerals as the components of the first embodiment are given.

[0067] like Figure 5 As shown, the liquid handling device of this embodiment has a substrate 11 having the same structure as the substrate 1 of the first embodiment except for the following points. The substrate 11 has a back surface 11a, a surface 11b, and a recess 11c, which correspond to the back surface 1a, the surface 1b, and the recess 1c of the substrate 1 of the first embodiment, respectively. The substrate 11 has a plurality of second recess corresponding portions 16, which correspond to the plurality of second recess corresponding portions 6 of the first embodiment, respectively.

[0068] Each of the pit corresponding portions 16 of the substrate 11 is curved so as to be concave in the concave direction together with the pit corresponding portion 5 of the electrode 2 and the pit 4 of the insulating film 3 located at the corresponding position. The second pit corresponding portion 16 is arranged in the concave portion 11c. The back surface 11a of the substrate 11 is formed so as to protrude in the second pit corresponding portion 16. In addition, the thickness of the substrate 11 is set so that the substrate 11 can be plastically deformed together with the electrode 2 and the insulating film 3 by the pit forming process.

[0069] The moving operation of the liquid droplet L of the liquid operation device of this embodiment is the same as the moving operation of the liquid droplet L of the first embodiment. In addition, although the method for forming the dimple 4 of this embodiment is not particularly illustrated, as described above, it is the same as the method for forming the dimple in the first embodiment except that a recessed portion recessed toward the abutting surface of the lower mold is provided corresponding to the protruding second dimple corresponding portion.

[0070] As described above, in the liquid operation device of this embodiment, in addition to the same effects as those of the liquid operation device of the first embodiment, the following effects can be obtained. That is, in the liquid operation device of this embodiment, the substrate 11 has a plurality of pit corresponding portions 16 located at positions corresponding to the plurality of pits 4, respectively, and each pit corresponding portion 16 of the substrate 11 is curved in a concave direction together with the pit corresponding portion 5 of the electrode 2 and the pit 4 of the insulating film 3 located at the corresponding position.

[0071] Therefore, in order to form the dimple 4, a dimple forming process such as a embossing process can be performed in which the insulating film 3, the electrode 2, and the substrate 11 are integrally extruded from the surface 3b of the insulating film 3 in a state that allows a stronger force to be applied in addition to the deformation of the electrode 2 so as to deform the substrate 11. As a result, the dimple 4 can be easily formed into a desired shape, and the processing accuracy of the liquid operating device can be improved. As a result, the manufacturing efficiency of the liquid operating device can be improved.

[0072] Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and modifications and changes can be made based on the technical concept of the present invention.

[0073] Industrial Applicability

[0074] The liquid handling device of the present invention can be assembled into portable and disposable automatic batch equipment, analytical measurement equipment, etc. Such equipment includes, for example, a reagent component sensor, a reagent mixing processing device, a reagent component automatic selection machine, a micro-enclosed environment type sterile isolated cell culture device, an artificial organ synthesizer configured individually by cell type, etc., but the equipment is not limited to these.

[0075] Description of Reference Numerals

[0076] 1, 11: substrate; 1b, 11b: surface; 2: electrode; 3: insulating film;

[0077] 3a: back side; 3b: surface; 4: pit;

[0078] 5: a portion corresponding to the first concave pit; 16: a portion corresponding to the second concave pit.

Claims

1. A liquid operation device, comprising a substrate, a plurality of electrodes, and an insulating film, wherein the substrate is formed in a sheet or film shape in a flexible manner, the plurality of electrodes are arranged on a surface of the substrate, and the insulating film is arranged on the surface of the substrate in a manner covering the plurality of electrodes. The insulating film has a back surface and a front surface, the back surface of the insulating film faces the front surface of the substrate, and the front surface of the insulating film is located on the opposite side of the back surface of the insulating film in the thickness direction of the insulating film. The liquid operation device is configured to move the liquid on the surface of the insulating film by utilizing an electrostatic force generated by applying a voltage to at least one of the plurality of electrodes; The insulating film has a plurality of pits, each of which is located at a position corresponding to the plurality of electrodes and is curved so as to be concave in a concave direction from the surface of the insulating film toward the back surface of the insulating film. Each of the electrodes is formed to be larger than the pit corresponding to each of the electrodes, and each of the electrodes has a pit corresponding portion and a peripheral portion, the pit corresponding portion is curved in a concave direction together with the pit located at a position corresponding to each of the electrodes, and the peripheral portion is located on the peripheral side relative to the pit corresponding portion and is arranged along the substrate, The surface of the insulating film is open to the outside, and the liquid can move from a stop position where one of the plurality of pits is arranged to another stop position where another of the plurality of pits is arranged by utilizing the electrostatic force, Each of the plurality of pits has an opening portion, an opening edge portion, a bottom portion and a surrounding wall portion, wherein the opening portion opens on the surface of the insulating film, the opening edge portion is located at the periphery of the opening portion, and the surrounding wall portion extends between the opening edge portion and the bottom portion, the bottom and the surrounding wall portion are formed into a roughly arc shape, and the curvatures of the bottom and the surrounding wall portion are substantially equal.

2. The liquid handling device according to claim 1, in, The substrate has a plurality of pit corresponding portions, The positions of the plurality of pit corresponding parts correspond to the plurality of pits respectively. Each of the pit corresponding portions of the substrate is curved so as to be concave in the concave direction together with the pit corresponding portions of the electrode and the pits of the insulating film located at positions corresponding to the respective pit corresponding portions of the substrate.

3. The liquid handling device according to claim 1, in, The opening edge has a curved corner.

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