A bend-resistant flexible electronic and a multi-layer flexible electronic

Abstract

The embodiment of the present application discloses a kind of anti-bending flexible electronic and multilayer flexible electronic, it is related to flexible electronic technical field.The anti-bending flexible electronic includes: net gauze matrix and the conductive circuit of target position on the net gauze matrix;Wherein, the conductive circuit is by conductive paste into the net gauze matrix, and the gauze surface of target position is attached, forms the conductive circuit of two sides of the net gauze matrix penetration.This embodiment of the present application is by net gauze as the substrate of conductive circuit, so that conductive circuit is attached to the surface of net gauze, since net gauze fabric itself is good and not easy to produce fold on it Bending performance, therefore can improve the bending resistance of conductive circuit, not easy to break down.

Description

TECHNICAL FIELD

[0001] The present application belongs to the field of flexible electronics, and particularly relates to a bending-resistant flexible electronic and a multilayer flexible electronic. BACKGROUND

[0002] RFID is a non-contact automatic identification technology, which automatically identifies target objects and obtains relevant data through radio frequency signals, and identification work does not require human intervention and can work in various harsh environments. Today, RFID technology has realized the identification of high-speed moving objects and the simultaneous identification of multiple tags, greatly expanding the application of RFID electronic tags in various industries. RFID washing electronic tags (also known as washing tags) are products of the application of RFID technology in the field of linen washing. Their function is to monitor and manage the entire life cycle of hotel linen, thereby improving the safety of hotel linen. Therefore, an important indicator of RFID washing electronic tags is that they can withstand industrial washing and work normally after industrial washing.

[0003] At present, most of the RFID washing electronic tags on the market cannot withstand current industrial washing equipment (such as washing dragons). This is mainly because current industrial washing equipment not only produces high-temperature and high-pressure washing environment and large-torque rotation, which causes unpredictable distortion of RFID washing electronic tags during washing, but also exerts great mechanical pressure on RFID washing electronic tags during washing, especially when RFID washing electronic tags are distorted and deformed, which causes the RFID washing electronic tags to bend, thereby producing irreversible creases, causing the tag antenna at the crease to break or crack, thereby directly affecting or even destroying the performance of the RFID washing electronic tag. SUMMARY

[0004] Therefore, an object of the present application is to provide a bending-resistant flexible electronic to solve the problem of poor bending resistance of flexible electronics in the prior art.

[0005] In some illustrative embodiments, the bending-resistant flexible electronic includes a gauze base and a conductive circuit attached to the gauze base at a target position. The conductive circuit is formed by conductive paste penetrating into the gauze base and adhering to the surface of the yarn at the target position, forming a conductive circuit through both sides of the gauze base.

[0006] In some optional embodiments, the conductive paste includes a high-molecular carrier, high-melting-point metal particles, and a low-melting-point metal in a liquid state at room temperature.

[0007] In some optional embodiments, the anti-bending flexible electronic further comprises: a packaging protective layer covering the gauze substrate.

[0008] In some optional embodiments, the packaging protective layer comprises: a first packaging protective layer and / or a second packaging protective layer which are laminated; wherein the first packaging protective layer and / or the second packaging protective layer are flexible and non-stretchable materials.

[0009] In some optional embodiments, the anti-bending flexible electronic further comprises: a fabric layer arranged outside the packaging protective layer.

[0010] In some optional embodiments, the anti-bending flexible electronic further comprises: an electronic chip directly connected or coupled to the conductive circuit.

[0011] In some optional embodiments, the anti-bending flexible electronic is an RFID electronic tag, and the conductive circuit is a printed antenna of the RFID electronic tag.

[0012] Another object of the present application is to provide a multi-layer flexible electronic, comprising: at least two single-layer flexible electronics connected by lamination; wherein each single-layer flexible electronic comprises: a gauze substrate, and a conductive circuit attached to the gauze substrate at a target position; wherein the conductive circuit is formed by conductive paste penetrating into the gauze substrate and adhering to the surface of the yarn at the target position, so as to form a conductive circuit penetrating through both surfaces of the gauze substrate; the conductive circuit comprises a connection point; the single-layer flexible electronics are connected by lamination of the connection points of the conductive circuits of the single-layer flexible electronics.

[0013] In some optional embodiments, the multi-layer flexible electronic further comprises: a packaging protective layer covering the at least two single-layer flexible electronics connected by lamination.

[0014] In some optional embodiments, the single-layer flexible electronics are provided with an insulating layer between the areas other than the connection points.

[0015] Compared with the prior art, the present application has the following advantages:

[0016] In the embodiments of the present application, the gauze is used as the substrate of the conductive circuit, and the conductive circuit is attached to the surface of the gauze. Since the gauze fabric itself has good bending resistance and is not easy to produce folds, the bending resistance of the conductive circuit can be improved, and the problem of easy breakage can be solved. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 is a structure example one of the RFID washing electronic tag in the embodiments of the present application;

[0018] Figure 2is a structural example two of the RFID washable electronic tag in the embodiments of the present application;

[0019] Figure 3 is a structural example three of the RFID washable electronic tag in the embodiments of the present application;

[0020] Figure 4 is a structural example four of the RFID washable electronic tag in the embodiments of the present application;

[0021] Figure 5 is a structural example five of the RFID washable electronic tag in the embodiments of the present application;

[0022] Figure 6 is a structural example six of the RFID washable electronic tag in the embodiments of the present application;

[0023] Figure 7 is a structural example seven of the RFID washable electronic tag in the embodiments of the present application;

[0024] Figure 8 is a structural example one of the anti-bending flexible electronics in the embodiments of the present application;

[0025] Figure 9 is a side view of the anti-bending flexible electronics in the embodiments of the present application;

[0026] Figure 10 is a structural example two of the anti-bending flexible electronics in the embodiments of the present application. DETAILED DESCRIPTION

[0027] The following description and drawings are illustrative of specific embodiments of the application and are not intended to be limiting thereof. Other embodiments can include structural, logical, electrical, process, and other changes. The embodiments are representative only. Individual components and functions are optional unless explicitly required, and the order of operations can be varied. Portions and features of some embodiments can be included in, or substituted for, those of other embodiments. The scope of embodiments of the application encompasses the entire scope of the claims, and all available equivalents of the claims. In this document, these embodiments of the application can be referred to, individually and / or collectively, by the term "application" merely for convenience and without intending to voluntarily limit the ambit of this application to a single application or inventive concept if in fact more than one application or inventive concept is disclosed.

[0028] It should be noted that the technical features in the embodiments of the present application can be combined with each other without conflict.

[0029] Disclosed in the embodiments of the present application is an RFID washable electronic tag (also can be referred to as a washable electronic tag, a washable label, an RFID washable label), such asFigure 1 As shown, Figure 1 Figure 1 is a structural schematic diagram of a water-washing electronic tag in an embodiment of the present application. The water-washing electronic tag comprises a flexible and non-stretchable bending protection layer 1 and an antenna layer 2; wherein the bending protection layer 1 comprises a first bending protection layer 11 and a second bending protection layer 12, both of which are located on the two sides of the antenna layer 2 and cover the antenna layer 2 therebetween. The antenna layer 2 comprises a flexible and non-stretchable substrate layer 21 and a printed antenna 22 attached to the substrate layer 21; wherein the minimum curvature radius of the first bending protection layer 11 and the second bending protection layer 12 is greater than the minimum curvature radius of the substrate layer 21.

[0030] The minimum curvature radius in this embodiment refers to the curvature radius of the outer arc surface of the substrate in the folded state. For a substrate without elastic deformation, the thickness of the substrate is generally considered to be approximately equal to its minimum curvature radius, i.e., the thickness of the first bending protection layer 11 and the second bending protection layer 12 is greater than the thickness of the substrate layer 21.

[0031] The substrate layer 21 is located between the first bending protection layer 11 and the second bending protection layer 12, and when the entire tag is bent, the substrate layer 21 attached to the first bending protection layer 11 and the second bending protection layer 12 will maintain a greater degree of circular arc than the circular arc surface in the folded state of the first bending protection layer 11 / second bending protection layer 12. Therefore, due to the limitation of the first bending protection layer 11 / second bending protection layer 12, the substrate layer 21 itself is difficult to reach the dead-fold state, thus effectively reducing the probability of creases on the substrate layer 21, and also achieving the effect of reducing the probability of cracks or fractures of the printed antenna 22 attached to the substrate layer 21, thereby improving the washing resistance of the water-washing electronic tag.

[0032] The present application reduces the bending strength and bending stress of the antenna layer when subjected to external pressure by setting flexible and non-stretchable bending protection layers on both sides of the flexible and non-stretchable antenna layer, using bending protection layers with a greater curvature radius than the antenna layer, making the antenna layer less likely to produce creases, thereby reducing the risk of fractures or cracks at the creases. On the other hand, the bending protection layer and the substrate layer are made of flexible and non-stretchable materials, making them less likely to stretch and deform under pressure, so that their curvature radius is hardly affected during washing, thereby ensuring the protection of the bending protection layer for the antenna layer and guaranteeing the industrial washing resistance of the water-washing electronic tag in the present application.

[0033] Furthermore, in the embodiment of the present invention, the thickness of the first bending protection layer 11 and the second bending protection layer 12 is 2-5 times the thickness of the base layer 21. Specifically, the thickness of the base layer 21 can range from 20 μm to 100 μm; the thickness of the first bending protection layer 11 and / or the second bending protection layer 12 can range from 100 μm to 300 μm.

[0034] In some embodiments, one or more of the first bending protection layer 11, the second bending protection layer 12, and the base layer 21 in the embodiments of the present invention may be made of a flexible, non-stretchable material such as PI film, PET film, or other flexible, non-stretchable materials known in the art. In the embodiments of the present invention, the first bending protection layer 11, the second bending protection layer 12, and the base layer 21 are all made of insulating materials.

[0035] In some embodiments, the first bending protective layer 11 and the second bending protective layer 12 in the embodiment of the present invention can be a split structure or an integrated structure. In the integrated structure, the antenna layer 2 can be covered by folding and packaging. The thickness of the first bending protective layer 11 and the second bending protective layer 12 in the split structure can be selected within the above-mentioned thickness range, and their thicknesses can be inconsistent.

[0036] Specifically, in the embodiment of the present invention, the first bending protection layer 11 and the antenna layer 2 can be bonded together via a first adhesive layer 31, while the second bending protection layer 12 and the antenna layer 2 can also be bonded together via a second adhesive layer 32. In addition to adhesive layers, the two can also be bonded together via sewing. Preferably, the first and second bending protection layers 11 and 12 in the embodiment of the present invention are bonded together with the antenna layer 2 via the first and second adhesive layers 31 and 32, respectively. Compared to sewing, adhesive bonding is simpler to process, less likely to damage the substrate, and has a much lower impact on thickness than sewing.

[0037] The adhesive layer in this embodiment can be made of liquid / solid adhesive, the liquid adhesive being such as a two-component hot-pressed adhesive, and the solid adhesive being such as a hot-melt adhesive film, specifically TPE, TPU, TPV, etc. having such properties and functions.

[0038] In some embodiments, the base layer 21 can be but is not limited to a single-layer structure. In the case of a single-layer structure, the antenna layer 2 is a double-layer structure, namely the base layer 21 and the printed antenna 22 attached thereto; the antenna layer 2 of this structure is combined with the first bending protection layer 11 and the second bending protection layer 12 through the first adhesive layer 31 and the second adhesive layer 32, that is, the label structure from top to bottom is the first bending protection layer 11, the first adhesive layer 31, the printed antenna 22, the base layer 21, the second adhesive layer 32, and the second bending protection layer 12.

[0039] like Figure 2As shown, the base layer 21 can also be a multi-layer structure encapsulating the printed antenna 22, for example, the base layer 21 as a first base layer 21, further comprising a second base layer 23, the first base layer 21 and the second base layer 23 cooperate to clamp the printed antenna 22 inside, the first base layer 21 and the second base layer 23 are combined by a third adhesive layer 33, thereby forming an antenna layer 2 with a 4-layer structure; which can be formed by first printing the printed antenna 22 on the surface of the first base layer 21, and then combining the first base layer 21 and the second base layer 23 through the third adhesive layer 33. Among them, the first base layer 21 and the second base layer 23 can be combined in a split type, or can be combined in an integral type by bending to form a cover for the printed antenna 22. After the antenna layer 2 is combined with the first bending protection layer 11 and the second bending protection layer 12, a first bending protection layer 11, a first adhesive layer 31, a second base layer 23, a third adhesive layer 33, a printed antenna 22, a first base layer 21, a second adhesive layer 32, and a second bending protection layer 12 are obtained from top to bottom.

[0040] In the case of the above-mentioned embodiment of the base layer using a double-layer structure, the first base layer 21 and the second base layer 23 can form protection for the printed antenna 22, so the first bending protection layer 11 and the second bending protection layer 22 can also be selected from a flexible and non-stretchable fabric material, such as artificial fiber or synthetic fiber, such as nylon fiber. Such fabric has flexibility and is not easy to stretch, and also has good fabric resilience after bending, and is not easy to form creases thereon, so the influence of the stress on the creases of the first bending protection layer 11 and / or the second bending protection layer 12 on the antenna layer 2 can be reduced. In this embodiment, the first bending protection layer 11 and / or the second bending protection layer 12 are both selected from the above-mentioned fabric material, or only one is selected from the above-mentioned fabric material, and the other can be selected from a PI film, a PET film, etc. material, and still can achieve certain effect.

[0041] Among them, the base layer 21 in the present application selects a single-layer structure, that is, a label structure from top to bottom in turn as a first bending protection layer 11, a first adhesive layer 31, a printed antenna 22, a base layer 21, a second adhesive layer 32, and a second bending protection layer 12. Among them, the second bending protection layer 12 combined with the base layer 21 through the second adhesive layer 32 can be selected from a fabric material. Since the first bending protection layer 11 and the base layer 21 protect the printed antenna, there is no waterproof performance requirement for the second bending protection layer 12, so the second bending protection layer 12 can be selected from a fabric material, which can reduce the probability of creases on the bending protection layer to a certain extent, and at the same time, the base layer 21 in the antenna layer 2 does not need to be selected from a double-layer structure, which can reduce the overall thickness of the washing label, and also can at least reduce a label production process, thereby improving the label production efficiency and reducing the label production cost.

[0042] As Figure 3As shown, further, the water-washing electronic tag in the embodiment of the present application can further include an outer protective layer of the first bending protective layer 11 and the second bending protective layer 12, such as the first fabric layer 41 and the second fabric layer 42; the first fabric layer 41 and the first bending protective layer 11 can be combined through the fourth adhesive layer 34; and the second fabric layer 42 and the second bending protective layer 12 can be combined through the fifth adhesive layer 35. By arranging the fabric layer outside the tag body, the consistency between the water-washing electronic tag and the linen to be installed can be improved, thereby improving the user experience of comfort.

[0043] The water-washing electronic tag in the embodiment of the present application can be used as a chipless tag, and the corresponding printed antenna can select a chipless tag antenna specification, and the specific graphic size is not limited in the present application.

[0044] In other embodiments, the water-washing electronic tag in the embodiment of the present application can further include a tag chip 5; the tag chip 5 can be directly connected with the printed antenna 22 in the antenna layer 2, or a coupling mutual inductance interaction tag chip can be used; the tag chip 5 does not need to be directly connected with the printed antenna 22, but only needs to be arranged at a specified position of the printed antenna, such as the center position; the specific position of the coupling tag chip 5 is not described herein. By selecting the tag chip 5, the tag chip 5 can be arranged on the outer side of the first bending protective layer 11 / second bending protective layer 12, so as to avoid the influence of the tag chip 5 arranged inside the bending protective layer on the bending resistance and structural stability of the printed antenna; the fixation of the tag chip 5 on the bending protective layer can be achieved through various ways such as point gluing.

[0045] Preferably, the tag chip 5 can be arranged between the bending protective layer and the fabric layer, and the tag chip 5 is limited and fixed by the structure formed by the adhesive layer between the bending protective layer and the fabric layer.

[0046] In combination Figures 4-5 In some embodiments, a flexible and stretchable first pressure-resistant protective layer 61 and a second pressure-resistant protective layer (not shown) can be arranged between the bending protective layer and the fabric layer, and the tag chip 5 is arranged between the first bending protective layer 11 and the first pressure-resistant protective layer 61; through this structure, the tag chip 5 can have a certain deformation displacement in the vertical direction, so as to offset / relieve the pressure borne by the tag chip during the industrial washing of the water-washing electronic tag, thereby avoiding the damage of the tag chip. The pressure-resistant protective layer can be selected in a fluid structure or a sheet structure, and the material thereof can be selected from silicone, rubber, silicone rubber, polyurethane, epoxy resin, etc.

[0047] Preferably, the pressure-proof layer in the embodiments of the present application can be selected from vulcanized silicone rubber or silicone rubber film for hot-pressing adhesion or thermoplastic polyurethane, which can directly replace the adhesive layer between the bending protection layer and the fabric layer or cooperate with the adhesive layer to construct a stable layer structure.

[0048] The conductive paste for printing the printed antenna 22 in the embodiments of the present application can include a high-molecular carrier, high-melting-point metal particles and low-melting-point metal in a liquid state at room temperature. The high-molecular carrier can include resin (water-based / oil-based), thickening agent, diluent and other functional additives; the high-melting-point metal particles can include but are not limited to silver powder, copper powder, silver-coated copper powder and aluminum powder; and the low-melting-point metal can include but is not limited to gallium, gallium-indium alloy, gallium-indium-tin alloy and gallium-based alloy such as gallium-indium-tin-zinc alloy.

[0049] In other embodiments, the conductive paste can also be selected from conventional conductive silver paste, conductive aluminum paste, conductive copper paste and liquid metal. Preferably, the conductive paste in the present application is a liquid metal mixed conductive paste directly prepared by mixing liquid metal with conductive silver paste (aluminum paste). By mixing such low-melting-point metal in the silver paste, the flexibility of the printed antenna can be enhanced, and the printed antenna based on the liquid metal with fluidity can self-recover even in the case of its own fracture due to bending, thereby ensuring the stability, normality and reliable performance of the printed antenna. Preferably, the conductive silver paste can be selected from the silver paste for silk printing on the market.

[0050] The weight ratio of the liquid metal to the conductive silver paste in the embodiments of the present application can be 1:30-30:1. For example, the weight ratio of the liquid metal to the conductive silver paste can be 1:30, 1:25, 1:20, 1:15, 1:10, 1:5, 1:3, 1:2, 2:3, 4:5, 1:1, 4:4, 3:2, 2:1, 3:1, 5:1, 10:1, 15:1, 20:1, 25:1, 25:1 or 30:1.

[0051] Preferably, the weight ratio of the liquid metal to the conductive silver paste is selected as 1:20-1:2; if the proportion of the liquid metal in the entire conductive paste exceeds the above range, the content of the liquid metal in the unit area is large, and under the condition that the water-washing electronic tag is subjected to great pressure, the flowable liquid metal not only migrates to the printed antenna circuit, but also can break through the binding between the adhesive layer between the substrate layer 21 and the bending protection layer, thereby migrating outward from the original position of the printed antenna, causing the structural stability of the printed antenna to decrease, affecting the conductive performance of the printed antenna, and even causing the problem of local short circuit / breakage of the printed antenna. If the proportion of the liquid metal in the entire conductive paste is lower than the above range, the content of the liquid metal in the unit area is small, and the flowability is poor, and when the water-washing electronic tag is bent to cause the printed antenna to break, the liquid metal at the broken part migrates to the surrounding circuit, but is easily bound by the frame of the solidified silver paste in the surrounding circuit, and after the bending is restored, the liquid metal cannot be restored from the migration position, affecting the self-repairing effect of the liquid metal. When the proportion of the liquid metal is within the above range, the migration problem of the liquid metal under pressure is improved, and in the case that the printed antenna has a breakage, the solidified silver paste at the bending part can also pull the liquid metal back to the original position, and the self-repairing effect can be guaranteed.

[0052] The thickness of the printed antenna formed by the liquid metal mixed conductive paste in the embodiment of the application is controlled in the range of 5-20 μm; if the thickness of the printed antenna is lower than the size range, the liquid metal cannot be uniformly coated in the silver paste system after sintering, and if the thickness of the printed antenna exceeds the size range, the printed antenna is prone to breakage.

[0053] The water-washing electronic tag disclosed in the embodiment of the application has a stable layer structure, and the layers are not prone to separation, and can also solve the problem that the liquid metal in the printed antenna printed by the conductive paste mixed by the liquid metal and the conductive silver paste is prone to break through the binding between the substrate layer and the adhesive layer under external pressure.

[0054] As shown in Figure 6 The water-washing electronic tag in the embodiment includes a substrate layer 21, a reinforcing layer 71, a printed antenna 22, a first adhesive layer 31 and a protection layer 8; the reinforcing layer 71 is arranged on the surface of the substrate layer 21, the printed antenna is arranged on the surface of the reinforcing layer 71, and the size of the printed antenna 22 is smaller than that of the reinforcing layer 71, and the reinforcing layer 71 completely bears the printed antenna 22; the substrate layer 21 and the protection layer 8 are combined by the reinforcing layer 71 and the first adhesive layer 31, and the printed antenna 22 is encapsulated in the inside; the first adhesive layer 31 is located above the printed antenna 22 and simultaneously contacts the reinforcing layer 71 below the printed antenna 22.

[0055] One of the functions of the protective layer 8 is to encapsulate the printed antenna 22 together with the base layer 21, thereby achieving the functions of oxygen isolation, water resistance and corrosion resistance.

[0056] The base layer 21 and the protective layer 8 can be made of flexible and non-stretchable substrates such as PI film, PET film and other flexible and non-stretchable substrates known in the art.

[0057] The reinforcing layer (adhesion-reinforcing layer) 71 has a roughened surface that can improve the adhesion between the first adhesive film 31 and the printed antenna 22, and the printed antenna 22 covered by the reinforced layer 71 and the first adhesive layer 31 is stably limited in its initial shape pattern under the strong adhesion between the reinforcing layer 71 and the first adhesive film 31, thereby improving the structural stability of the washable electronic tag and the difficulty of the migration of the liquid metal in the printed antenna 22 to the nearby non-antenna area under pressure, and ensuring the performance stability of the washable electronic tag.

[0058] The reinforcing layer 71 can be selected with a special adhesion-improving agent for the selected substrate, which can exhibit good adhesion on the surface of the corresponding substrate, and the surface of the formed reinforcing layer can also exhibit good adhesion to the outside, so as to form an adhesion-improving film layer on the surface of the substrate; for example, for PI film, polyimide paint can be selected; the same applies to PET film; preferably, the reinforcing layer 71 in the embodiments of the present application can be made of a polydopamine film layer; the polydopamine film layer can be formed by coating a polydopamine solvent on the surface of the substrate and then solidifying, or by immersing the substrate in a polydopamine solvent and then solidifying after taking it out. Compared with other special coatings, polydopamine can be applied to the surface improvement of most substrates.

[0059] In some embodiments, the reinforcing layer 71 described above is a first reinforcing layer, and the washable electronic tag further comprises a second reinforcing layer 72 disposed on the surface of the protective layer 8, so that the first reinforcing layer 71 on the base layer 21 is connected to the second reinforcing layer 72 on the protective layer 8 through the first adhesive layer 31. Since the surfaces of the base layer 21 and the protective layer 8 are both modified to form reinforcing layers, the adhesion strength between the two is high under the adhesion of the first adhesive film 31, thereby further improving the stability of the overall structure of the tag and the binding force on the printed antenna.

[0060] Specifically, the base layer 21 and the protective layer 8 in the embodiments of the present application can be made of PI film, PET film and other materials.

[0061] The present application improves the adhesion of the reinforcing layer on the surface of the base layer to improve the adhesion stability between the base layer and the protective layer, thereby improving the structural stability of the washable electronic tag and ensuring its wash resistance.

[0062] As Figure 7As shown, the embodiment in the embodiment of the present application can be combined with the above-mentioned embodiment of improving the bending resistance of the water-washing electronic tag to enhance the stability of the combination between the water-washing electronic tag layer structure. The protective layer 8 can include the above-mentioned bending protective layer, i.e., the water-washing electronic tag, and the structure from top to bottom includes: the first bending protective layer 11, the second reinforcing layer 72, the first adhesive layer 31, the printed antenna 22, the first reinforcing layer 71, the substrate layer 21, the second adhesive layer 32, and the second bending protective layer 12.

[0063] In some embodiments, a third reinforcing layer 73 and / or a fourth reinforcing layer 74 can be further arranged between the substrate layer 21 and the second bending protective layer 12.

[0064] Referring to Figures 3-5 Further, the protective layer of the water-washing electronic tag in the embodiment of the present application can further include an outer protective layer, such as a first fabric layer 41 and a second fabric layer 42, between the first bending protective layer 11 and the second bending protective layer 12. The first fabric layer 41 and the first bending protective layer 11 can be combined by the fourth adhesive layer 34, and the second fabric layer 42 and the second bending protective layer 12 can be combined by the fifth adhesive layer 35. By arranging the fabric layer outside the tag body, the consistency between the water-washing electronic tag and the linen to be installed can be improved, thereby improving the user's comfort experience.

[0065] The combination surface of the first bending protective layer 11 and the second bending protective layer 12 and the fourth adhesive layer 34 and the fifth adhesive layer 35 can further be provided with a fifth reinforcing layer and a sixth reinforcing layer, respectively, so as to improve the bonding force with the adhesive layer.

[0066] The above-mentioned water-washing electronic tag in the embodiment of the present application can be used as a chipless tag, and the corresponding printed antenna is selected according to the chipless tag antenna specification, and the specific graphic size is not limited in the present application.

[0067] In other embodiments, the water-washing electronic tag in the embodiment of the present application can further include a tag chip 5. The tag chip 5 can be directly connected with the printed antenna 22 in the antenna layer 2, or a coupling-type tag chip 5 can be used to interact with the printed antenna 22. The tag chip 5 does not need to be directly connected with the printed antenna 22, but only needs to be arranged at a specified position of the printed antenna, such as the center position. The specific position of the coupling-type tag chip 5 is not described herein. By selecting the tag chip 5, it can be arranged on the outer side of the first bending protective layer 11 / second bending protective layer 12, which can avoid affecting the bending resistance and structural stability of the printed antenna when the tag chip 5 is arranged inside the bending protective layer. The fixation of the tag chip 5 on the bending protective layer can be achieved by various ways such as dispensing.

[0068] Preferably, the label chip 5 can be arranged between the bending protection layer and the fabric layer, and is limited and fixed by the structure formed by the adhesive layer between the bending protection layer and the fabric layer.

[0069] In some embodiments, the protection layer can further include a flexible and stretchable first pressure-resistant protection layer 61 and a second pressure-resistant protection layer 62 arranged between the bending protection layer and the fabric layer, and the label chip 5 is arranged between the first bending protection layer 11 and the first pressure-resistant protection layer 61. Through this structure, the label chip 5 can have a certain deformation displacement in the vertical direction, so as to offset / relieve the pressure borne by the label chip during the industrial washing of the water-washing electronic tag, and avoid damage to the label chip. The pressure-resistant protection layer can be selected in a fluid structure or a sheet structure, and the material thereof can be selected from silicone, rubber, polyester and the like.

[0070] Preferably, the pressure-resistant protection layer in the embodiments of the present application can be selected from vulcanized silicone or a silicone sheet for hot pressing, which can directly replace the adhesive layer between the bending protection layer and the fabric layer or cooperate with the adhesive layer to construct a stable layer structure.

[0071] In some embodiments, the fabric layer has a plain weave textile surface and a twill weave textile surface, and the twill weave textile surface is opposite to the adhesive layer, so that the adhesive layer is combined with the fabric layer by being immersed in the twill weave textile surface of the fabric layer. The burrs on the twill weave textile surface can be stably combined with the adhesive layer, thereby improving the combination stability of the twill weave textile surface and the adhesive layer.

[0072] The conductive paste for printing the printed antenna 22 in the embodiments of the present application can include a high molecular carrier, high melting point metal particles and low melting point metal in a liquid state at room temperature. The high molecular carrier can include resin (water-washing / oily), thickening agent, diluent and other functional additives. The high melting point metal can refer to a metal with a melting point of 300 DEG C or higher, and the low melting point metal can refer to a metal with a melting point of 30 DEG C or lower. Specifically, the high melting point metal particles can include but are not limited to silver powder, copper powder, silver-coated copper powder and aluminum powder, and the low melting point metal can include but is not limited to gallium, gallium-indium alloy, gallium-indium-tin alloy, gallium-indium-tin-zinc alloy and other gallium-based alloys.

[0073] In some other embodiments, the conductive paste can also be selected from conventional conductive silver paste, conductive aluminum paste, conductive copper paste, liquid metal, etc. Preferably, the conductive paste in the present application is a liquid metal mixed conductive paste directly formed by mixing liquid metal with conductive silver paste (aluminum paste). After mixing such low-melting-point metal into the silver paste, on the one hand, the flexibility of the printed antenna can be enhanced, and on the other hand, based on the printed antenna with fluidity of the liquid metal, even in the case of its own fracture due to bending, the liquid metal in the printed antenna can also play a self-repairing role, thereby ensuring the stable normal and reliable performance of the printed antenna. Preferably, the conductive silver paste can be selected from the silk-screen silver paste on the market.

[0074] The weight ratio of the liquid metal to the conductive silver paste in the embodiment of the present application can be 1:30-30:1. For example, the weight ratio of the liquid metal to the conductive silver paste can be 1:30, 1:25, 1:20, 1:15, 1:10, 1:5, 1:3, 1:2, 2:3, 4:5, 1:1, 4:4, 3:2, 2:1, 3:1, 5:1, 10:1, 15:1, 20:1, 25:1, 25:1 or 30:1.

[0075] Preferably, the weight ratio of the liquid metal to the conductive silver paste is selected to be 1:20-1:2. If the proportion of the liquid metal in the entire conductive paste exceeds the above range, the liquid metal content in the unit area is large. In the case that the water-washing electronic tag is subjected to great pressure, the flowable liquid metal not only migrates to the printed antenna circuit, but also can break through the binding of the adhesive layer between the substrate layer 21 and the bending protection layer, thereby migrating outward from the original position of the printed antenna, causing the structural stability of the printed antenna to decrease, affecting the conductive performance of the printed antenna, and even causing the problem of local short circuit / breakage of the printed antenna. If the proportion of the liquid metal in the entire conductive paste is lower than the above range, the liquid metal content in the unit area is small, and its fluidity is poor. When the printed antenna is broken due to the bending of the water-washing electronic tag, the liquid metal at the broken part migrates to the surrounding circuit, but is easily bound by the frame of the solidified silver paste in the surrounding circuit, and after the bending is restored, it cannot be well restored from the migration position, affecting the self-repairing effect of the liquid metal. When the proportion of the liquid metal is within the above range, the problem of migration of the liquid metal under pressure is improved, and in the case that the printed antenna has a fracture, the liquid metal can also be pulled back to its original position by the solidified silver paste at the bending part, and the self-repairing effect can be guaranteed.

[0076] The thickness of the printed antenna formed by the liquid metal mixed conductive paste in the embodiment of the present application is controlled to be in the range of 5-20 μm. If the thickness of the printed antenna is lower than the size range, the liquid metal cannot be uniformly coated in the silver paste system after sintering, and if the thickness of the printed antenna exceeds the size range, the printed antenna is prone to fracture.

[0077] As Figures 8-10 Another object of the present application is to provide a bending-resistant flexible electronic which is not prone to creases and can be used as the antenna layer 2 described above, thereby improving the bending resistance of the washable electronic tag and preventing the printed antenna 22 from breaking. Specifically, the bending-resistant flexible electronic includes a mesh substrate 91 and a conductive circuit 92 attached to the mesh substrate 91 at a target position; wherein the conductive circuit 92 is formed by infiltrating a conductive paste into the mesh substrate and attaching to the surface of the yarn at the target position, and the conductive circuit penetrates through both sides of the mesh substrate.

[0078] In the embodiment of the present application, the mesh is used as the substrate of the conductive circuit, and the conductive circuit is attached to the surface of the mesh. Since the mesh fabric itself has good bending resistance and is not prone to creases, the bending resistance of the conductive circuit can be improved, and the problem of breaking is not prone to occur.

[0079] The conductive paste in the embodiment can include a high-molecular carrier, high-melting-point metal particles, and a low-melting-point metal in a liquid state at room temperature. For details, refer to the above embodiment, which will not be repeated here.

[0080] The bending-resistant flexible electronic in the embodiment of the present application can further improve the bending resistance of the flexible electronic by combining the liquid metal mixed conductive paste.

[0081] In some embodiments, a packaging protective layer 93 can be further included to cover the mesh substrate 91. The packaging protective layer 93 can include a first packaging protective layer (e.g., the bending protection layer described above) of flexible and non-stretchable layer stacked; and / or a second packaging protective layer (e.g., the pressure protection layer described above) of flexible and stretchable layer.

[0082] In some embodiments, a fabric layer (e.g., the fabric layer described above) can be further included outside the protective layer 93.

[0083] In some embodiments, electronic elements (e.g., conventional elements such as resistors, inductors, capacitors, and electronic chips) can be directly connected or coupled to the conductive circuit 92. The position of the electronic elements can be set according to the actual requirements of the conductive circuit 92, and can also refer to the above content in the present application or the prior art.

[0084] The bending-resistant flexible electronic in the embodiment of the present application can be used as an RFID electronic tag, a washable electronic tag, and the like. When used as the tag, the conductive circuit 92 serves as the tag antenna, and the electronic chip is selected as the tag chip. In addition to the RFID electronic tag, the bending-resistant flexible electronic in the present application can also be applied in a flexible electronic circuit and a rigid electronic circuit, which is not limited herein.

[0085] The application further discloses a multi-layer flexible electronic device, comprising: at least two single-layer flexible electronic devices connected through stacking; wherein each single-layer flexible electronic device comprises: a gauze substrate, and a conductive circuit attached to the gauze substrate at a target position; wherein the conductive circuit is formed by conductive paste penetrating into the gauze substrate and adhering to the surface of the gauze at the target position, and the conductive circuit comprises a connection point; and the single-layer flexible electronic devices are connected through the connection points of the conductive circuits.

[0086] Further, the multi-layer flexible electronic device further comprises a protective layer covering the at least two single-layer flexible electronic devices connected through stacking.

[0087] Further, the single-layer flexible electronic devices are provided with an insulating layer between the areas other than the connection points.

[0088] Specifically, the embodiments in the application can be combined with each other, for example, a water-washing electronic label, which comprises, from top to bottom, a first bending protective layer 11, a second reinforcing layer 72, a first adhesive layer 31, a printed antenna 22, a first reinforcing layer 71, a substrate layer 21, a third reinforcing layer 73, a second adhesive layer 32, a fourth reinforcing layer 74 and a second bending protective layer 12. The first bending protective layer 11, the second bending protective layer 12 and the substrate layer 21 are made of flexible and non-stretchable material, and the minimum curvature radius of the first bending protective layer 11 and / or the second bending protective layer 12 is greater than that of the substrate layer 11; the printed antenna is made of liquid metal mixed conductive paste, and preferably, the weight ratio of the liquid metal to the conductive silver paste in the conductive paste is 1:20-1:2.

[0089] The base layer 21 of the water-washing electronic tag in the embodiment is protected by the first bending protection layer 11 and the second bending protection layer 12, which can effectively reduce the risk of creases on the base layer 21 itself, thereby reducing the probability of breakage of the printed antenna 22 attached to the base layer 21; and by using liquid metal conductive paste and by forming a reinforcing layer on the surfaces of the base layer 21, the first bending protection layer 11 and the second bending protection layer 12 to strengthen the bonding stability between the layers of the water-washing electronic tag, the manufacturing difficulty of the printed antenna of the water-washing electronic tag can be reduced, which can be realized by the mature printing technology in the prior art. In addition, the improvement of the bonding force between the layers of the water-washing electronic tag further limits the migration of the liquid metal in the printed antenna, which can greatly reduce the liquid metal in the printed antenna from breaking through the surrounding adhesive area under pressure. In addition, by selecting a liquid metal mixed conductive paste with a weight ratio of liquid metal to conductive silver paste in the range of 1:20 to 1:2, the migration of the liquid metal in the printed antenna under pressure can be further reduced, and the self-repairing ability of the liquid metal in the printed antenna can be ensured. That is, the water-washing electronic tag formed by the above combination can greatly improve the industrial washing performance of the water-washing electronic tag, and ensure the structural stability and functional reliability of the water-washing electronic tag.

[0090] The fifth reinforcing layer and the sixth reinforcing layer outside the first bending protection layer and the second bending protection layer can also be included in the embodiment. The first pressure-resistant protection layer, the second bending protection layer, the first fabric layer, the second fabric layer, the fourth adhesive layer and the fifth adhesive layer connecting the two, and the coupling tag chip cooperating with the printed antenna can also be included on the outer side. The specific material selection and position setting can be referred to the above embodiments, which will not be described here.

[0091] In another combined embodiment of the water-washing electronic tag, the base layer can be replaced with a mesh base, and the liquid metal mixed conductive paste can be infiltrated into the mesh base to form a printed antenna. The first reinforcing layer 71 and the third reinforcing layer 73 not only adhere to the surface fibers of the mesh base, but also infiltrate into the mesh holes of the mesh base, thereby ensuring the stable adhesion of the conductive paste in the mesh holes of the mesh base.

[0092] The remaining structures can be based on the above embodiments, which will not be described here.

[0093] Those of skill would further appreciate that the various illustrative logical blocks, modules, circuits, and algorithm steps described in connection with the embodiments disclosed herein can be implemented as electronic hardware, computer software, or combinations of both. To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and steps have been described above generally in terms of their functionality. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the overall system. Skilled artisans can implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present disclosure.

Claims

1. A bend- resistant flexible electronic structure, characterized by, The anti-bending flexible electronic structure is an electronic tag or an electronic circuit, comprising a netting substrate and a conductive circuit attached to the netting substrate at a target position; wherein the netting substrate is infiltrated with conductive paste, and the surface of the yarn at the target position is attached to form a conductive circuit penetrating through both sides of the netting substrate. The conductive paste is a liquid metal mixed conductive paste, comprising conductive silver paste and liquid metal in liquid state at room temperature; wherein the weight ratio of the liquid metal to the conductive silver paste is 1:20-1:

2. The liquid metal in the conductive circuit has fluidity and can self-recover when the circuit is broken due to bending.

2. The kink-resistant flexible electronic structure of claim 1, wherein, Further comprising: a packaging protective layer covering the netting substrate.

3. The kink-resistant flexible electronic structure of claim 2, wherein, The packaging protective layer comprises a first packaging protective layer and / or a second packaging protective layer stacked together; wherein the first packaging protective layer and / or the second packaging protective layer are made of flexible and non-stretchable material.

4. The kink-resistant flexible electronic structure of claim 2, wherein, Further comprising: a fabric layer outside the packaging protective layer.

5. The kink-resistant flexible electronic structure of claim 1, wherein, Further comprising: an electronic chip directly connected or coupled to the conductive circuit.

6. The bend-against-flexing flexible electronic structure according to any one of claims 1-5, characterized in that, The anti-bending flexible electronic structure is an RFID electronic tag, and the conductive circuit is a printed antenna of the RFID electronic tag.

7. A multilayer flexible electronic structure, characterized in that, The multi-layer flexible electronic structure is an electronic tag or an electronic circuit, comprising at least two single-layer flexible electronic structures connected by stacking; wherein each single-layer flexible electronic structure comprises a netting substrate and a conductive circuit attached to the netting substrate at a target position; wherein the netting substrate is infiltrated with conductive paste, and the surface of the yarn at the target position is attached to form a conductive circuit penetrating through both sides of the netting substrate; the conductive circuit contains a connection point; the single-layer flexible electronic structures are connected by stacking the connection points of the conductive circuits of the single-layer flexible electronic structures; the conductive paste is a liquid metal mixed conductive paste, comprising conductive silver paste and liquid metal in liquid state at room temperature; wherein the weight ratio of the liquid metal to the conductive silver paste is 1:20-1:

2. The liquid metal in the conductive circuit has fluidity and can self-recover when the circuit is broken due to bending.

8. The multilayer flexible electronic structure of claim 7, wherein, Further comprising: a packaging protective layer covering the at least two single-layer flexible electronic structures connected by stacking.

9. The multilayer flexible electronic structure of claim 7, wherein, The single-layer flexible electronic structures are provided with an insulating layer between the areas other than the connection points.

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