An embedded MOV component

Abstract

The present invention relates to the technical field of surge protection, and provides an embedded MOV component, which includes a PCB board, at least one MOV chip, and a thermal shedding structure; an installation slot hole corresponding to the MOV chip is provided on the PCB board; the MOV chip is embedded into the installation slot hole from the back of the PCB board, and forms a fixed circuit connection with the PCB board under the fixation of the thermal shedding structure. By providing the installation slot hole corresponding to the MOV chip on the PCB board in the present invention, the semi-sunken installation of the MOV chip is realized. Then, the thermal shedding structure is designed so that the MOV chip and the PCB board form a fixed circuit connection under normal conditions. When the temperature generated by the deterioration of the MOV chip is too high, the thermal shedding structure will disconnect the fixed circuit connection between the MOV chip and the PCB board, causing the MOV chip to automatically fall off, and the two are safely separated, effectively avoiding equipment damage or fire hazards caused by the breakdown of the MOV chip, and further improving the safety factor of the supporting equipment; setting the installation slot hole on the PCB board can assist in the installation and positioning of the MOV chip in the production line, and can improve the mechanized production efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of surge protection, and particularly to an embedded MOV component. Background Art

[0002] Conventional voltage-limiting surge protective devices (SPDs) are assembled from passive electronic component MOV (Metal Oxide Varistors) chips and have special non-linear current-voltage characteristics. When abnormal conditions such as lightning strikes, electromagnetic field interference, frequent power switch operations, and power system failures occur, the voltage on the line will suddenly increase. If it exceeds the conduction voltage of the surge protective device (SPD), it will enter the conduction region, and the current and voltage have a non-linear relationship, generally referred to as the non-linearity parameter, and its value can reach dozens or hundreds. At this time, the impedance of the surge protective device (SPD) will become low, only a few ohms, causing the overvoltage to form a surge current to flow out, so as to protect the connected electronic products or expensive components.

[0003] With the rapid development of automation technology and the wide application of electromechanics (such as robots, manipulators, etc.), the application demand for surge protective devices (SPDs) is also increasing day by day. To protect the computer systems in vulnerable electromechanics, the MOV components are often installed on the same PCB board as the device power supply system. The conventional MOV installation is to insert the leads into the PCB board and weld them. Once the MOV component is damaged, since it is integrally connected to the PCB board, it will cause the device to stop working at best and cause fire and combustion at worst, posing a great potential safety hazard. Summary of the Invention

[0004] The present invention provides an embedded MOV component, which solves the technical problem that when the existing MOV component is integrated with the device power supply system on the same PCB board, there is a great potential safety hazard when the MOV component works overheat.

[0005] To solve the above technical problems, the present invention provides an embedded MOV component, including a PCB board, at least one MOV chip, and a thermal detachment structure; the PCB board is provided with mounting holes corresponding to the MOV chip; the MOV chip is embedded into the mounting holes from the back of the PCB board and forms a fixed circuit connection with the PCB board under the support of the thermal detachment structure;

[0006] The thermal detachment structure disconnects its circuit connection with the PCB board when the temperature generated by the deterioration of the MOV chip is too high.

[0007] In this basic solution, mounting slots corresponding to the MOV chip are opened on the PCB board to achieve semi-embedded installation of the MOV chip. Then, a thermal detachment structure is designed so that the MOV chip and the PCB board are fixedly connected under normal conditions. However, when the temperature generated by the deterioration of the MOV chip is too high, the thermal detachment structure will disconnect the circuit connection between the MOV chip and the PCB board, and the MOV chip will automatically fall off, enabling the two to be safely separated. Thus, it effectively avoids equipment damage or fire hazards caused by the breakdown of the MOV chip, further improving the safety factor of the supporting equipment; setting mounting slots on the PCB board can assist in the installation and positioning of the MOV chip in the production line, improving the mechanized production efficiency.

[0008] In a further implementation, the thermal detachment structure is a temperature alloy; the temperature alloy is used to weld the MOV chip and the PCB board, and conduct the electrodes of the MOV chip and the circuits on the PCB board.

[0009] This solution designs the temperature alloy as the thermal detachment structure, which can enable the thermal detachment structure to form a functional characteristic with fixed support points and overheat melting protection, further improving the safety factor of the product.

[0010] In a further implementation, the present invention further includes an auxiliary detachment structure, and the auxiliary detachment structure includes a pressing plate end, an elastic element, and a fixed end connected in sequence;

[0011] The fixed end is provided with a mounting screw hole for cooperating with a screw to fix the auxiliary detachment structure on the front side of the PCB board;

[0012] The elastic element is a plate-like structure extending below the protruding edge of the MOV chip, and will generate elastic deformation when the MOV chip is fixedly connected to the PCB board;

[0013] The pressing plate end is tangent to the edge of the MOV chip, and is used to convert the elastic deformation into a reverse thrust when the temperature generated by the deterioration of the MOV chip is too high, disconnecting the circuit connection between the MOV chip and the PCB board.

[0014] In a further implementation, the manufacturing material of the pressing plate end includes insulating materials.

[0015] This solution further sets up an auxiliary detachment structure according to actual needs. When the PCB board is parallel to the horizontal plane, the setting of the auxiliary detachment structure can further accelerate the separation of the MOV chip from the PCB board and improve the reaction sensitivity; when the PCB board is perpendicular to the horizontal plane, it can give an outward thrust to the MOV chip to quickly separate the MOV chip from the PCB board. That is, under the setting of the auxiliary detachment structure, any installation orientation of the embedded MOV component can be covered, and the separation of the MOV chip from the PCB board can be achieved. In a further embodiment, the mass center of the MOV chip is close to the back surface of the PCB board.

[0016] In a further embodiment, the slotting length of the mounting slot hole is less than the chip diameter of the MOV chip; the slotting width of the mounting slot hole is greater than the chip thickness of the MOV chip.

[0017] This solution fixes the MOV chip on the PCB board in a way of back embedding. At the same time, it is defined that the mass center of the MOV chip is close to the back surface of the PCB board, and the slotting length of the mounting slot hole is less than the chip diameter of the MOV chip, so as to define the dropping direction of the MOV chip when it is used vertically or horizontally, and ensure the gravity of the MOV chip when it drops downward.

[0018] In a further embodiment, the MOV chip is a bare chip without lead electrodes and without encapsulation, and its periphery is coated with an insulating layer.

[0019] This solution uses a bare chip without lead electrodes and without encapsulation to make the MOV chip. On the premise of saving the component manufacturing cost, it can further improve the heat dissipation of the chip to extend the service durability and reduce the risk of overheating damage, thereby improving the reliability of the component.

[0020] In a further embodiment, the present invention further includes a housing. The PCB board is installed inside the housing with the front side facing up, and the linear distance between the bottom of the housing and the back surface of the PCB board is greater than the diameter of the MOV chip.

[0021] This solution designs the housing to fix the PCB board, and defines that the linear distance between the bottom of the housing and the back surface of the PCB board is greater than the diameter of the MOV chip. When the MOV chip thermally detaches and drops, it will directly fall to the bottom of the housing without being hindered.

[0022] In another embodiment, the present invention further includes an auxiliary detachment structure. The auxiliary detachment structure includes a fixed end, an elastic element and a pressing plate end connected in sequence;

[0023] One end of the fixed end is fixed on the inner top surface of the housing;

[0024] Both ends of the elastic element are respectively fixed on the fixed end head and the pressure plate end head. The installation position of the pressure plate end head is aligned with the MOV chip. When the PCB board is installed in the housing, it will produce elastic deformation and be in a compressed state.

[0025] The pressure plate end head is aligned with the MOV chip and is tangent to the edge of the MOV chip. When the temperature generated by the deterioration of the MOV chip is too high, the compressed elastic release deformation is converted into a reverse thrust to disconnect the circuit connection between the MOV chip and the PCB board.

[0026] In a further embodiment, the present invention further includes a discharge tube. An embedded slot hole corresponding to the discharge tube is provided on the PCB board; the slotting length of the embedded slot hole is greater than the length of the discharge tube; the slotting width of the embedded slot hole is less than the diameter of the discharge tube.

[0027] This solution installs the discharge tube in the same way as the MOV chip, which can make the discharge tube disconnect from the PCB board when it overheats and protect the circuit from damage; limiting the slotting width of the embedded slot hole to be less than the diameter of the discharge tube can also limit the falling direction of the discharge tube. Description of the Drawings

[0028] Figure 1 is a three-dimensional structure diagram of an embedded MOV component provided by Embodiment 1 of the present invention;

[0029] Figure 2 is a three-dimensional structure diagram of an embedded MOV component provided by Embodiment 2 of the present invention;

[0030] Figure 3 is an installation schematic diagram of the PCB board and the housing provided by Embodiment 2 of the present invention;

[0031] Figure 4 is an installation schematic diagram of the auxiliary detachment structure 5 provided by Embodiment 3 of the present invention;

[0032] Figure 5 is an equivalent circuit diagram provided by Embodiment 1 or 2 or 3 of the present invention;

[0033] Figure 6 is a three-dimensional structure diagram of an embedded MOV component provided by Embodiment 5 of the present invention;

[0034] Figure 7 is an equivalent circuit diagram provided by Embodiment 4 or 5 or 6 of the present invention. Detailed Embodiments

[0035] The embodiments of the present invention will be specifically described below in conjunction with the accompanying drawings. The given embodiments are only for illustrative purposes and should not be construed as limiting the present invention. The included drawings are for reference and illustration only and do not constitute a limitation on the scope of patent protection of the present invention, because many changes can be made to the present invention without departing from the spirit and scope of the present invention.

[0036] Example 1

[0037] In this embodiment, the reference numerals in the drawings include: PCB board 1, mounting slot holes 11, circuit 12, embedded slot holes 13; MOV chip 2, electrodes 21, insulating layer 22; thermal detachment structure 3.

[0038] An embedded MOV component provided by an embodiment of the present invention, as Figure 1 、 Figure 5 shown, in this embodiment, includes a PCB board 1, at least one MOV chip 2, and a thermal detachment structure 3; the PCB board 1 is provided with mounting slot holes 11 corresponding to the MOV chip 2; the MOV chip 2 is embedded in the mounting slot holes 11 from the back of the PCB board 1 and forms a fixed circuit connection with the PCB board 1 under the support of the thermal detachment structure 3;

[0039] In this embodiment, it is preferably designed that 3 groups of MOV chips 2 are fixed on the PCB board 1.

[0040] When the temperature generated by the deterioration of the MOV chip 2 is too high, the thermal detachment structure 3 melts itself and disconnects its circuit connection with the PCB board 1.

[0041] In this embodiment, the thermal detachment structure 3 is a temperature alloy; the temperature alloy is used to weld the MOV chip 2 and the PCB board 1 and conduct the electrodes 21 of the MOV chip 2 and the circuit 12 on the PCB board 1.

[0042] Among them, the position where the end of the circuit 12 on the PCB board 1 is close to the mounting slot holes 11 is the lead-out end. When performing welding and fixing, the electrodes 21 of the MOV chip 2 are aligned with the lead-out end and welded with the temperature alloy.

[0043] This embodiment designs the temperature alloy as the thermal detachment structure 3, which can make the thermal detachment structure 3 form a fixed support point and have the functional characteristics of overheat melting protection, further improving the safety factor of the product.

[0044] In this embodiment, the center of mass of the MOV chip 2 is close to the back of the PCB board 1.

[0045] In this embodiment, the slotting length of the mounting slot holes 11 is less than the chip diameter of the MOV chip 2; the slotting width of the mounting slot holes 11 is greater than the chip thickness of the MOV chip 2.

[0046] In this embodiment, the MOV chip 2 is fixed on the PCB board 1 in a way of back embedding. Meanwhile, the mass center of the MOV chip 2 is limited to be close to the back of the PCB board 1, and the slotting length of the mounting slot hole 11 is less than the chip diameter of the MOV chip 2, so as to limit the dropping direction when the MOV chip 2 is used vertically or horizontally and ensure the gravity of the MOV chip 2 dropping downward.

[0047] In this embodiment, the MOV chip 2 is a leadless electrode 21 and non-encapsulated bare chip, and an insulating layer 22 is coated around it.

[0048] This embodiment uses a leadless electrode 21 and non-encapsulated bare chip to make the MOV chip 2. On the premise of saving the component manufacturing cost, it can further improve the heat dissipation of the chip, extend the service durability and reduce the risk of overheat damage, thereby improving its reliability.

[0049] In this embodiment, the present invention further includes a housing 4. The PCB board 1 is installed inside the housing 4 with the front side facing up, and the linear distance S between the bottom of the housing 4 and the back of the PCB board 1 is greater than the diameter of the MOV chip 2.

[0050] This embodiment designs the housing 4 to fix the PCB board 1, and limits the linear distance S between the bottom of the housing 4 and the back of the PCB board 1 to be greater than the diameter of the MOV chip 2. When the MOV chip 2 thermally detaches and drops, it will directly fall to the bottom of the housing 4 without being hindered.

[0051] In this embodiment, the overheat protection principle of the MOV component is as follows:

[0052] First of all, in this embodiment, the MOV chip is installed and fixed with the PCB board parallel to the horizontal plane.

[0053] Among them, since the connection circuit on this PCB board is a single-phase use circuit, which is a three-terminal fully symmetric circuit (the electrical parameters of the three MOVs are completely the same), it is not necessary to distinguish the L terminal, N terminal, and PE terminal, and any mounting slot hole 11 can be selected to be inserted from its back for welding.

[0054] When the MOV deteriorates and generates heat, after the temperature alloy of the thermal detachment structure 3 melts, due to the gravitational traction of the MOV chip, it will fall downward (see the arrow direction in the attachment Figure 1 ), and land on the bottom of the housing 4. In this way, the thermal separation process of the MOV component is automatically completed.

[0055] In the embodiment of the present invention, an installation slot hole 11 corresponding to the MOV chip 2 is opened on the PCB board 1 to achieve the semi - sunken installation of the MOV chip 2. Then, a thermal detachment structure 3 is designed so that the MOV chip 2 and the PCB board 1 are fixedly connected under normal conditions. When the temperature generated by the deterioration of the MOV chip 2 is too high, the thermal detachment structure 3 will disconnect the circuit connection between the MOV chip 2 and the PCB board, and the MOV chip 2 will automatically fall off, and the two are safely separated, thus effectively avoiding equipment damage or fire hazards caused by the breakdown of the MOV chip 2, and further improving the safety factor of the supporting equipment; setting the installation slot hole 11 on the PCB board 1 can assist in the installation and positioning of the MOV chip 2 in the production line and improve the mechanized production efficiency.

[0056] Example 2

[0057] In this embodiment, the reference numerals in the drawings include: PCB board 1, installation slot hole 11, circuit 12, embedding slot hole 13; MOV chip 2, electrode 21, insulating layer 22; thermal detachment structure 3; housing 4; auxiliary detachment structure 5, pressure plate end 51, elastic element 52, fixed end 53; screw 6.

[0058] In this embodiment, refer to Figure 2 、 Figure 3 、 Figure 5 This embodiment is different from Embodiment 1 in that: the embodiment of the present invention further includes an auxiliary detachment structure 5, and the auxiliary detachment structure 5 includes a pressure plate end 51, an elastic element 52 and a fixed end 53 connected in sequence;

[0059] The fixed end 53 is provided with an installation screw hole, and the PCB board 1 is provided with a corresponding installation screw hole for cooperating with the screw 6 to fix the auxiliary detachment structure 5 on the front surface of the PCB board 1. It should be noted that the MOV chip 2 and the PCB board 1 are welded first, and then the auxiliary detachment structure 5 is installed.

[0060] The elastic element 52 is a plate - like structure extending below the protruding edge of the MOV chip 2, and will produce elastic deformation when the MOV chip 2 is fixedly connected to the PCB board 1. For example, the elastic element 52 is set at a certain inclination angle with the fixed end 53, but the vertical height of its end with respect to the PCB board 1 is less than the protruding height of the MOV chip 2 on the front surface of the PCB board 1. Therefore, when the auxiliary detachment structure 5 is installed on the PCB board 1, due to the semi - sunken installation structure, the pressure plate end 51 presses on the MOV chip 2, causing the elastic element 52 to be stretched to form a pressure.

[0061] In other embodiments, the elastic element 52 can also be set parallel to the fixed end 53 according to needs to increase the elastic deformation.

[0062] The pressing plate end 51 is tangent to the edge of the MOV chip 2 and is used to convert elastic deformation into a reverse thrust when the temperature generated by the deterioration of the MOV chip 2 is too high, accelerating the separation of the MOV chip 2 from the PCB board 1.

[0063] In this embodiment, the material for making the pressing plate end 51 includes insulating material. In other embodiments, the auxiliary shedding structure 5 can also be made of insulating material as needed.

[0064] In this embodiment, the overheat protection principle of the MOV component is as follows:

[0065] In this embodiment, when the MOV component is installed and fixed with the PCB board parallel to the horizontal plane. When the MOV deteriorates and generates heat, after the temperature alloy serving as the thermal shedding structure 3 melts, due to the gravitational traction on the MOV chip and the reverse thrust of the pressing plate end 51, it will quickly fall downward and land at the bottom of the housing 4. In this way, the thermal separation process of the MOV component is automatically completed.

[0066] When the MOV component is installed and fixed with the PCB board perpendicular to the horizontal plane. When the MOV deteriorates and generates heat, after the temperature alloy serving as the thermal shedding structure 3 melts, due to the reverse thrust of the pressing plate end 51 on the MOV chip, it will quickly fall to the bottom of the housing 4 and finally land at the bottom of the housing 4. In this way, the thermal separation process of the MOV component is automatically completed.

[0067] In this embodiment, the auxiliary shedding structure 5 is further provided according to actual needs. When the PCB board 1 is parallel to the horizontal plane, the setting of the auxiliary shedding structure 5 can further accelerate the separation of the MOV chip 2 from the PCB board 1 and improve the reaction sensitivity; when the PCB board 1 is perpendicular to the horizontal plane, it can give an outward thrust to the MOV chip 2 to quickly separate the MOV chip 2 from the PCB board 1. That is, with the setting of the auxiliary shedding structure 5, any installation orientation of the embedded MOV component can be covered, and the separation of the MOV chip 2 from the PCB board 1 can be achieved.

[0068] Example 3

[0069] In this embodiment, the reference numerals in the drawings include: MOV chip 2; housing 4; auxiliary shedding structure 5, pressing plate end 51, elastic element 52, fixed end 53.

[0070] In this embodiment, refer to Figure 4 、 Figure 5 This embodiment is different from Embodiment 1 in that: the present invention further includes an auxiliary shedding structure 5, and the auxiliary shedding structure 5 includes a pressing plate end 51, an elastic element 52, and a fixed end 53 connected in sequence;

[0071] One end of the fixed end 53 is fixed to the inner top surface of the housing 4;

[0072] Both ends of the elastic element 52 are respectively fixed on the fixed end 53 and the pressing plate end 51. The installation position of the pressing plate end 51 is aligned with the MOV chip 2. When the PCB board 1 is installed in the housing, it will generate elastic deformation and be in a compressed state.

[0073] In this embodiment, the elastic element 52 includes but is not limited to a spring.

[0074] The pressing plate end is aligned with the MOV chip 2 and is tangent to the edge of the MOV chip 2. When the temperature generated by the deterioration of the MOV chip is too high, the temperature alloy is melted, the compression elasticity is released, and the deformation is converted into a reverse thrust to disconnect the circuit connection between the MOV chip 2 and the PCB board 1.

[0075] Specifically, the fixed end 53 is fixed on the inner top surface of the housing 4. One end of the elastic element 52 is installed on the fixed end 53, and the other end is fixed on the pressing plate end 51. The pressing plate end 51 is directly opposite to the MOV installation position on the PCB board 1.

[0076] In this embodiment, the manufacturing material of the pressing plate end 51 includes insulating material. In other embodiments, the auxiliary detachment structure 5 can also be made of insulating material according to needs.

[0077] In this embodiment, the overheat protection principle of the auxiliary detachment structure 5 is as follows:

[0078] When the MOV chip 2 is fixedly connected to the PCB board 1 and installed in the housing, the elastic element 52 will generate elastic deformation and be in a compressed state, and form an elastic pressure on the top of the MOV chip 2. When the temperature generated by the deterioration of the MOV chip is too high, the temperature alloy is melted. At this time, under the combined action of the thrust generated by the release of the elastic pressure and the self-gravity of the chip, the MOV chip 2 drops from the PCB board 1, disconnecting the connection therebetween. In this way, the thermal separation process of the MOV component is automatically completed.

[0079] This embodiment only describes the overheat protection principle of the auxiliary detachment structure 5, which is applicable to the installation and fixation of the MOV component with the PCB board parallel to or perpendicular to the horizontal plane.

[0080] Example 4

[0081] In this embodiment, the reference numerals in the drawings include: live wire L, neutral wire N, ground wire PE, discharge tube 7.

[0082] In this embodiment, refer to Figure 7, The difference between this embodiment and Embodiment 1 is that this embodiment of the present invention further includes a discharge tube 7, and an embedding slot hole 13 corresponding to the discharge tube 7 is provided on the PCB board 1; the slotting length of the embedding slot hole 13 is greater than the length of the discharge tube 7; the slotting width of the embedding slot hole 13 is smaller than the diameter of the discharge tube 7.

[0083] Moreover, the circuit on the PCB board is a typical 3 + 1 protection mode of three-phase five-wire system.

[0084] This embodiment installs the discharge tube 7 in the same fixing manner as the MOV chip 2, and can also disconnect from the PCB board 1 when overheated to protect the circuit from damage; limiting the slotting width of the embedding slot hole 13 to be smaller than the diameter of the discharge tube 7 also limits the falling direction of the discharge tube 7.

[0085] Example 5

[0086] In this embodiment, the reference numerals in the drawings include: live wire L, neutral wire N, and ground wire PE.

[0087] See Figure 6 、 Figure 7 , This embodiment of the present invention is a combined solution of Embodiment 1, Embodiment 2, and Embodiment 4.

[0088] Example 6

[0089] This embodiment of the present invention is a combined solution of Embodiment 1, Embodiment 3, and Embodiment 4.

[0090] In other embodiments, if the thermal detachment protection mechanism formed by the "PCB board 1 + thermal detachment structure 3" proposed based on Embodiment 1 of the present invention or the "PCB board 1 + thermal detachment structure 3 + auxiliary detachment structure 5" proposed in Embodiment 2 and Embodiment 3, it can also be made into a lightning protection module, a lightning protection box, or a lightning protection cabinet according to requirements. The protection device and its attached equipment manufactured according to the concept of this embodiment all fall within the scope covered by the present invention.

[0091] The above are only embodiments of the present invention. Common knowledge such as specific structures and characteristics known in the art is not described in detail herein. Those of ordinary skill in the art know all the common general technical knowledge in the technical field to which the invention pertains before the filing date or the priority date, can learn all the existing technologies in this field, and have the ability to apply the conventional experimental means before this date. Those of ordinary skill in the art can, under the inspiration given in this application, combine their own abilities to complete and implement this solution. Some typical well-known structures or well-known methods should not become an obstacle for those of ordinary skill in the art to implement this application. It should be noted that for those skilled in the art, without departing from the structure of the present invention, several deformations and improvements can be made, and these should also be regarded as the protection scope of the present invention, and these will not affect the implementation effect of the present invention and the practicality of the patent. The protection scope required by this application should be based on the content of its claims, and the specific implementation manners and the like recorded in the specification can be used to interpret the content of the claims.

Claims

1. An embedded MOV component, characterized in that: It includes a PCB board, at least one MOV chip, and a thermal detachment structure; an installation slot hole corresponding to the MOV chip is provided on the PCB board; the MOV chip is embedded into the installation slot hole from the back of the PCB board and forms a fixed circuit connection with the PCB board under the support of the thermal detachment structure; When the temperature generated by the deterioration of the MOV chip is too high, the thermal detachment structure disconnects its circuit connection with the PCB board; The mass center of the MOV chip is close to the back of the PCB board; The slotting length of the installation slot hole is smaller than the chip diameter of the MOV chip; the slotting width of the installation slot hole is larger than the chip thickness of the MOV chip; The MOV chip is fixed on the PCB board in a way of being embedded from the back. At the same time, it is defined that the mass center of the MOV chip is close to the back of the PCB board, and the slotting length of the installation slot hole is smaller than the chip diameter of the MOV chip, so as to define the dropping direction when the MOV chip is used vertically or horizontally, and ensure the gravity of the MOV chip dropping downward.

2. The embedded MOV component according to claim 1, characterized in that: The thermal detachment structure is a temperature alloy; the temperature alloy is used to weld the MOV chip and the PCB board and conduct the electrodes of the MOV chip and the circuit on the PCB board.

3. An embedded MOV component according to claim 1, characterized in that: It further includes an auxiliary detachment structure, and the auxiliary detachment structure includes a pressing plate end, an elastic element, and a fixing end connected in sequence; The fixing end is provided with a mounting screw hole for cooperating with a screw to fix the auxiliary detachment structure on the front of the PCB board; The elastic element is a plate-like structure extending below the protruding edge of the MOV chip and will generate elastic deformation when the MOV chip is fixedly connected to the PCB board; The pressing plate end is tangent to the edge of the MOV chip and is used to convert the elastic deformation into a reverse thrust to disconnect the circuit connection between the MOV chip and the PCB board when the temperature generated by the deterioration of the MOV chip is too high.

4. An embedded MOV component according to claim 3, characterized in that: The manufacturing material of the pressing plate end includes insulating material.

5. An embedded MOV component as claimed in claim 1, wherein: The MOV chip is a bare chip without lead electrodes and without encapsulation, and an insulating layer is coated on its periphery.

6. An embedded MOV component according to claim 1, characterized in that: It further includes a housing, the PCB board is installed inside the housing with the front side facing up, and the linear distance between the bottom of the housing and the back of the PCB board is greater than the diameter of the MOV chip.

7. An embedded MOV component according to claim 6, characterized in that: It further includes an auxiliary detachment structure, and the auxiliary detachment structure includes a fixing end, an elastic element, and a pressing plate end connected in sequence; One end of the fixing end is fixed on the inner top surface of the housing; Both ends of the elastic element are respectively fixed on the fixing end and the pressing plate end, and the installation position of the pressing plate end is aligned with the MOV chip and will generate elastic deformation and be in a compressed state when the PCB board is installed in the housing; The pressing plate end is aligned with the MOV chip and is tangent to the edge of the MOV chip and is used to convert the elastic deformation into a reverse thrust to disconnect the circuit connection between the MOV chip and the PCB board when the temperature generated by the deterioration of the MOV chip is too high.

8. An embedded MOV component as claimed in claim 1, wherein: It further includes a discharge tube, and an embedding slot hole corresponding to the discharge tube is provided on the PCB board; the slotting length of the embedding slot hole is greater than the length of the discharge tube; the slotting width of the embedding slot hole is less than the diameter of the discharge tube.

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