Keyboard backlight module capable of heat conduction, light shielding and electricity conduction and thermal conductive ink

Abstract

The present invention discloses a backlight module for a keyboard that can conduct heat, block light, and conduct electricity. The backlight module includes: a light-shielding film, a light-conducting film, a reflective film, and an FPC stacked in sequence. A light-shielding heat-conducting layer is provided on the light-shielding film and / or the reflective film and / or the FPC; by providing a light-shielding heat-conducting layer on the light-shielding film and / or the reflective film and / or the FPC, heat is dissipated through the light-shielding heat-conducting layer, and the heat dissipation performance of the backlight module can be improved. The present invention also discloses a black light-shielding heat-conducting ink for forming a light-shielding heat-conducting layer. The black light-shielding heat-conducting ink contains the following components in percentage: a percentage content of graphene of 65%-69%, a resin of 13%-17%, a defoaming agent of 2%-4%, a degreasing water of 4%-6%, and a black ink of 8%-12%. The ink can significantly improve the heat dissipation performance of the backlight module.

Description

Technical Field

[0001] The invention relates to a backlight module of a notebook computer keyboard, in particular to a keyboard backlight module capable of heat conduction, light shielding and electricity conduction, and black light shielding heat conductive ink for forming a light shielding heat conductive layer. Background Art

[0002] Currently, laptop computers are getting thinner and thinner, so heat dissipation has become an important obstacle to improving the performance of laptop computers. Good performance requires good heat dissipation. At present, it is more urgent to solve the heat problem of laptop keyboards with backlights. Because a keyboard with backlight function will have a backlight module installed under the backlight, and the light source on the backlight module will generate heat. The heat generated by the computer host plus the heat from the backlight, the heat concentrated in certain areas will cause the laptop to crash and reduce performance.

[0003] The backlight module currently on the market is composed of an upper shading film, a middle light-guiding film, a lower reflective film and a light source FPC (with LED). The current backlight module only provides light for the keyboard. Heat is concentrated where the LED is located. Because the shading film, light-guiding film, reflective film and FPC cannot quickly dissipate the heat and cool it down, the performance of the laptop is affected.

[0004] The present invention is proposed in view of the deficiencies in the prior art. Summary of the invention

[0005] The technical problem that the backlight module in the prior art mentioned above cannot quickly dissipate heat and cool down the notebook computer affects its performance is addressed.

[0006] The technical solution adopted by the present invention to solve its technical problems is: a backlight module of a keyboard that can conduct heat, block light and conduct electricity, the backlight module comprising: a shading film, a light-guiding film, a reflective film and an FPC stacked in sequence, and a shading and heat-conducting layer is provided on the shading film and / or the reflective film and / or the FPC.

[0007] In the keyboard backlight module capable of heat conduction, light shielding and electricity conduction as described above, the light shielding and heat conducting layer is formed by curing black light shielding and heat conducting ink.

[0008] For the keyboard backlight module capable of heat conduction, light shielding and electricity conduction as mentioned above, the thickness of the light shielding and heat conducting layer is 0.01-0.2 mm.

[0009] The backlight module of the keyboard capable of heat conduction, light shielding and electricity conduction as described above, the light shielding film comprises: a first glue layer, a substrate, a reflective layer A and a second glue layer stacked in sequence, and the light shielding and heat conducting layer is arranged between the substrate and the reflective layer A.

[0010] As described above, the backlight module of the keyboard capable of heat conduction, light shielding and electricity conduction, the reflective film comprises: a glue layer B, a reflective layer B and an outer layer B stacked in sequence, and the light shielding and heat conducting layer is arranged between the reflective layer B and the outer layer B.

[0011] The backlight module of the keyboard capable of heat conduction, light shielding and electricity conduction as described above, the FPC comprises: an electronic component layer, a glue layer C, an FPC layer with circuits and an outer layer C stacked in sequence, and the light shielding and heat conducting layer is arranged between the FPC layer and the outer layer C.

[0012] The present invention discloses a black light-shielding thermal conductive ink for forming a light-shielding thermal conductive layer, wherein the black light-shielding thermal conductive ink comprises the following components in percentage:

[0013] The percentage content of graphene is 65%-69%,

[0014] Resin 13%-17%,

[0015] Defoaming agent 2%-4%,

[0016] Oil water 4%-6%,

[0017] Black ink 8%-12%.

[0018] The black light-shielding thermal conductive ink used to form the light-shielding thermal conductive layer as described above comprises the following components in percentage: 67% graphene, 15% resin, 3% defoaming agent, 5% open oil water, and 10% black ink.

[0019] The beneficial effects of the present invention are:

[0020] 1. The backlight module of the present invention is provided with a light-shielding heat-conducting layer on the light-shielding film and / or the light-reflecting film and / or the FPC, and heat dissipation is achieved through the light-shielding heat-conducting layer, thereby improving the heat dissipation performance of the backlight module.

[0021] 2. The light-shielding film of the present invention has a light-shielding heat-conducting layer between the substrate and the reflective layer A, and the heat on the light-shielding film is dissipated through the light-shielding heat-conducting layer, thereby improving the heat dissipation performance of the light-shielding film and further improving the heat dissipation performance of the backlight module.

[0022] 3. The reflective film of the present invention is provided with a light-shielding heat-conducting layer between the reflective layer B and the outer layer B, so that the heat on the reflective film is dissipated through the light-shielding heat-conducting layer, the heat dissipation performance of the reflective film is improved, and the heat dissipation performance of the backlight module is further improved.

[0023] 4. The FPC of the present invention is provided with a light-shielding heat-conducting layer between the FPC layer and the outer layer C, so that the heat on the FPC is dissipated through the light-shielding heat-conducting layer, thereby improving the heat dissipation performance of the FPC and further improving the heat dissipation performance of the backlight module.

[0024] The present invention will be further described below in conjunction with the accompanying drawings and specific implementation methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 is a cross-sectional schematic diagram of the backlight module of the present invention;

[0026] Figure 2 It is a front view of the backlight module in the present invention.

[0027] Figure 3 is a schematic cross-sectional view of the light-shielding film of the present invention;

[0028] Figure 4 It is a front view of the light-shielding film of the present invention;

[0029] Figure 5 It is a cross-sectional schematic diagram of the reflective film of the present invention;

[0030] Figure 6 It is a front view of the reflective film of the present invention;

[0031] Figure 7 It is a cross-sectional schematic diagram of the FPC of the present invention;

[0032] Figure 8 It is a front view of the FPC of the present invention. DETAILED DESCRIPTION

[0033] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0034] like Figures 1 to 8 As shown, the backlight module of the keyboard capable of heat conduction, light shielding and electricity conduction in this embodiment, the backlight module 800 comprises: a light shielding film 1, a light guiding film 2, a light reflecting film 3 and an FPC 4 stacked in sequence, and a light shielding heat conducting layer 1000 is provided on the light shielding film 1 and / or the light reflecting film 3 and / or the FPC 4. The backlight module of the present invention is provided with a light shielding heat conducting layer on the light shielding film and / or the light reflecting film and / or the FPC, and heat is dissipated through the light shielding heat conducting layer, thereby improving the heat dissipation performance of the backlight module.

[0035] In this embodiment, the light-shielding thermal conductive layer 1000 is formed by curing black light-shielding thermal conductive ink, which is prepared by stirring graphene, resin, defoaming agent, oil-opening water and black ink provided by Kunshan Fulin Xinda Electronics Co., Ltd., wherein the percentages are as follows: graphene 65%-69%, resin 13%-17%, defoaming agent 2%-4%, oil-opening water 4%-6%, black ink 8%-12%.

[0036] In this embodiment, the thickness of the light-shielding heat-conducting layer 1000 is 0.01-0.2 mm.

[0037] like Figure 3 and Figure 4 As shown, the light-shielding film 1 comprises: a first glue layer 11, a substrate 12, a reflective layer A14 and a second glue layer 15 stacked in sequence, and the light-shielding heat-conducting layer 1000 is arranged between the substrate 12 and the reflective layer A14. The light-shielding film of the present invention is provided with a light-shielding heat-conducting layer between the substrate and the reflective layer A, and the heat on the light-shielding film is dissipated through the light-shielding heat-conducting layer, thereby improving the heat dissipation performance of the light-shielding film, and further improving the heat dissipation performance of the backlight module.

[0038] In this embodiment, the reflective layer A14 is formed by curing white ink, the ink model is HV800-W100, and the manufacturer is Kunshan Fulin Xinda Electronics Co., Ltd.

[0039] In this embodiment, the substrate 12 is a PET film; the thickness of the substrate 12 is 0.01-0.2 mm.

[0040] In this embodiment, in order to facilitate the folding of the light-shielding film, a release paper layer A16 is provided on the outer side of the first glue layer 11 .

[0041] In this embodiment, the thickness of the reflective layer A14 is 0.01-0.2 mm.

[0042] In order to improve the heat dissipation performance, a plurality of heat dissipation holes A17 penetrating the reflective film are provided on the reflective film.

[0043] like Figure 5 and Figure 6 As shown, the reflective film 3 includes: a glue layer B31, a reflective layer B32 and an outer layer B34 stacked in sequence, and the light-shielding heat-conducting layer 1000 is arranged between the reflective layer B32 and the outer layer B34. The reflective film of the present invention is provided with a light-shielding heat-conducting layer between the reflective layer B and the outer layer B, and the heat on the reflective film is dissipated through the light-shielding heat-conducting layer, thereby improving the heat dissipation performance of the reflective film, and further improving the heat dissipation performance of the backlight module.

[0044] The outer layer B should be selected according to the actual required function, wherein the outer layer B34 is formed by curing insulating or non-insulating ink.

[0045] In this embodiment, the reflective layer B32 is a PET film or a copper foil or an aluminum foil; preferably, the reflective layer B32 is a PET film, and the thickness of the reflective layer B32 is 0.01-0.2 mm.

[0046] In this embodiment, in order to facilitate the folding of the reflective film, a release paper layer B35 is provided on the outer side of the glue layer B31.

[0047] In this embodiment, the thickness of the outer layer B34 is 0.01-0.2 mm.

[0048] In order to improve the heat dissipation performance, the reflective film is provided with a plurality of heat dissipation holes B36 penetrating the reflective film.

[0049] like Figure 7 and Figure 8 As shown, FPC4 includes: an electronic component layer 41, a glue layer C42, an FPC layer 43 with a circuit and an outer layer C45 stacked in sequence, and the light-shielding heat-conducting layer 1000 is arranged between the FPC layer 43 and the outer layer C45. The FPC of the present invention is provided with a light-shielding heat-conducting layer between the FPC layer and the outer layer C, and the heat on the FPC is dissipated through the light-shielding heat-conducting layer, thereby improving the heat dissipation performance of the FPC, and further improving the heat dissipation performance of the backlight module.

[0050] The outer layer C should be selected according to the actual required functions, wherein the outer layer C45 is formed by curing insulating or non-insulating ink. In this embodiment, the thickness of C45 is 0.01-0.2 mm.

[0051] In this embodiment, the electronic component layer 41 has electronic components, such as LEDs, ICs, resistors, capacitors, and the like.

[0052] In order to improve the heat dissipation performance, the FPC is provided with a plurality of heat dissipation holes C46 penetrating the FPC.

[0053] In this embodiment, a black light-shielding thermal conductive ink is used to form a light-shielding thermal conductive layer. The black light-shielding thermal conductive ink comprises the following components in percentage:

[0054] The percentage content of graphene is 65%-69%,

[0055] Resin 13%-17%,

[0056] Defoaming agent 2%-4%,

[0057] Oil water 4%-6%,

[0058] Black ink 8%-12%.

[0059] The following ratio is preferred: the percentage content of graphene is 67%, the resin is 15%, the defoamer is 3%, the oil-opening water is 5%, and the black ink is 10%; the graphene, resin, defoamer, oil-opening water and black ink provided by Kunshan Fulin Xinda Electronics Co., Ltd. are stirred and formulated, and the ink can significantly improve the heat dissipation performance of the backlight module.

[0060] The above examples are only used to further illustrate the technical content of the present invention, so that readers can understand it more easily, but they do not mean that the implementation of the present invention is limited to this. Any technical extension or re-creation made according to the present invention is protected by the present invention. The protection scope of the present invention shall be subject to the claims.

Claims

1. The backlight module of the keyboard can conduct heat, light and electricity. It is characterized in that The backlight module (800) comprises: a light-shielding film (1), a light-guiding film (2), a light-reflecting film (3) and an FPC (4) stacked in sequence, wherein a light-shielding and heat-conducting layer (1000) is provided on the light-shielding film (1) and / or the light-reflecting film (3) and / or the FPC (4); The light-shielding film (1) comprises: a first glue layer (11), a substrate (12), a reflective layer A (14), and a second glue layer (15) stacked in sequence, and the light-shielding heat-conducting layer (1000) is arranged between the substrate (12) and the reflective layer A (14); The reflective film (3) comprises: a glue layer B (31), a reflective layer B (32) and an outer layer B (34) stacked in sequence, and the light-shielding heat-conducting layer (1000) is arranged between the reflective layer B (32) and the outer layer B (34); The FPC (4) comprises: an electronic component layer (41), a glue layer C (42), an FPC layer (43) having a circuit, and an outer layer C (45) stacked in sequence, wherein the light-shielding heat-conducting layer (1000) is arranged between the FPC layer (43) and the outer layer C (45); The light-shielding heat-conducting layer (1000) is formed by curing black light-shielding heat-conducting ink, and the black light-shielding heat-conducting ink comprises the following components in percentage: The percentage of graphene is 65%-69%. Resin 13%-17%, defoamer 2%-4%, Oil water 4%-6%, Black ink 8%-12%.

2. The backlight module of the keyboard capable of heat conduction, light shielding and electricity conduction according to claim 1, It is characterized in that The light-shielding heat-conducting layer (1000) is formed by curing black light-shielding heat-conducting ink.

3. The backlight module of the keyboard capable of heat conduction, light shielding and electricity conduction according to claim 1, It is characterized in that The thickness of the light-shielding and heat-conducting layer (1000) is 0.01-0.2 mm.

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