A special cold cavity for refrigeration in the process gas pipeline of semiconductor vacuum conveying technology

Abstract

The present invention discloses a special cold cavity for refrigeration in a semiconductor vacuum conveying process gas pipeline, comprising: a box body and a cover plate, the cover plate is bolted to the top of the box body and the connection is sealed, a buffer cavity, a pressure relief cavity, a heat sink assembly and an inner lining plate are installed inside the box body, and four fixing columns are vertically installed on the inner bottom of the box body, the inner lining plate is sleeved on the fixing columns, and the heat sink assembly is installed on the inner lining plate. The present invention discharges the air to be cooled into the interior through the air inlet and filters it once through the filter cartridge, and flows downward through the pressure relief cavity after filtering. When the air contacts the heat sink assembly, it is blocked by the top long horizontal plate and diverted to the surroundings. The diverted air is guided downward to the inner cavity through the air guide hole, fully exchanges heat after contacting the short horizontal plate, and is guided again by the short horizontal plate, so that the air passes through the circulation groove and flows downward along the surface of the longitudinal plate, thereby improving the effect of heat exchange and increasing the uniformity of cooling.

Description

Technical Field

[0001] The present invention relates to the technical field of gas pipeline refrigeration coolers, and more specifically to a special cold cavity for refrigeration in a semiconductor vacuum conveying process gas pipeline. Background Art

[0002] Semiconductors refer to materials with electrical conductivity between conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. Whether from the perspective of science and technology or economic development, the importance of semiconductors is enormous. Most electronic products, such as computers, mobile phones or digital recorders, have a very close relationship with semiconductors in their core units. Common semiconductor materials include silicon, germanium, gallium arsenide, etc. Silicon is the most influential one in the application of various semiconductor materials.

[0003] At present, the existing coolers have the following problems: when cooling the gas, due to the single blowing direction of the gas, the contact area with the heat sink is small, and the local cooling capacity of the heat sink is insufficient, resulting in uneven cooling of the gas, affecting the subsequent use, and as the gas is cooled, the internal pressure of the cooler increases, and the cooler is damaged when the pressure is too high. Therefore, a new solution needs to be designed to improve it. Summary of the invention

[0004] The purpose of the present invention is to provide a special cold cavity for refrigeration in the gas pipeline of a semiconductor vacuum conveying process, which solves the problem that when cooling the gas, the gas has a single blowing direction, a small contact area with the heat sink, and insufficient local cooling capacity of the heat sink, resulting in uneven gas cooling, affecting subsequent use, and as the gas cooling proceeds, the internal pressure of the cooler increases, and the cooler is damaged due to excessive pressure, thereby meeting actual use needs.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a cold cavity body for refrigeration in a semiconductor vacuum conveying process gas pipeline, comprising: a box body and a cover plate, the cover plate is bolted to the top of the box body and the connection is sealed, a buffer cavity, a pressure relief cavity, a heat sink assembly and an inner lining plate are installed inside the box body, four fixing columns are vertically installed on the inner bottom of the box body, the inner lining plate is sleeved on the fixing columns, the heat sink assembly is installed on the inner lining plate, an air inlet is arranged in the middle of the top surface of the cover plate, an air outlet corresponding to the air inlet is arranged in the middle of the bottom surface of the box body, the buffer cavity is placed below the air inlet, the pressure relief cavity is placed below the buffer cavity, and a filter cartridge is installed between the pressure relief cavity and the buffer cavity;

[0006] Two joints are installed on the side wall of the box body, and the inner ends of the joints are connected to conduits. The conduits are U-shaped and the ends thereof penetrate the heat sink assembly. The bent ends of the conduits are close to the inner wall of the box body and away from the joints.

[0007] As a preferred embodiment of the present invention, the heat sink assembly includes a plurality of transverse plates and longitudinal plates, the transverse plates include long transverse plates and short transverse plates, the longitudinal plates are arranged equidistantly and connected at both ends by long transverse plates to form a frame-shaped structure, and a longitudinal inner cavity is formed between adjacent longitudinal plates, the short transverse plates are horizontally placed inside the inner cavity and divide the inner cavity into a plurality of cooling cavities.

[0008] As a preferred embodiment of the present invention, one end of the short transverse plate is connected to the longitudinal plate on one side of the inner cavity, and the other end is close to the longitudinal plate on the other side of the inner cavity to form a flow groove between the longitudinal plate.

[0009] As a preferred embodiment of the present invention, the surfaces of the longitudinal plate and the long transverse plate are further provided with a plurality of equally spaced air guide holes, the air guide holes are circular in structure, and the conduit passes through the air guide holes.

[0010] As a preferred embodiment of the present invention, two clamping plates are vertically installed on the top of the inner lining plate and on both sides of the heat sink assembly, the lower ends of the clamping plates are welded to the inner lining plate, and the side walls of the clamping plates are fixed to the heat sink assembly with bolts.

[0011] As a preferred embodiment of the present invention, heat sinks are further installed inside the box, and five groups of heat sinks are provided in total and are arranged horizontally and equidistantly in the longitudinal direction.

[0012] As a preferred embodiment of the present invention, a pressure relief box is installed on one side of the top of the cover plate, and a pressure relief plate and a pressure relief pipe are installed inside the pressure relief box. There are three pressure relief pipes in total and they are arranged horizontally equidistantly, and the end of the pressure relief pipe extends into the pressure relief cavity and is connected to the inside of the pressure relief cavity.

[0013] As a preferred embodiment of the present invention, a hinge is installed at the end of the pressure relief plate and is rotatably connected to the inner wall of the pressure relief box through a spring hinge. The other end of the pressure relief plate extends horizontally toward the middle of the pressure relief box. A rubber plate is installed on the bottom surface of the pressure relief plate and is connected to the upper end of the pressure relief pipe.

[0014] Compared with the prior art, the present invention has the following beneficial effects:

[0015] (1) In the present invention, the air to be cooled is discharged into the interior through the air inlet and filtered once through the filter cartridge. After being filtered, the air flows downward through the pressure relief chamber. When the air contacts the heat sink assembly, the air is blocked by the top long horizontal plate and diverted to the surrounding areas. The diverted air is guided downward to the interior of the inner cavity through the air guide holes, contacts the short horizontal plate for sufficient heat exchange, and is guided again by the short horizontal plate so that the air passes through the flow groove and flows downward along the surface of the longitudinal plate, thereby improving the heat exchange effect and increasing the uniformity of cooling.

[0016] (2) A pressure relief chamber is set inside the box. When the internal pressure is too high, part of the air will move upward through the pressure relief pipe and lift the pressure relief plate to relieve the pressure, which protects the cooler. The pressure relief standard can be adjusted by adjusting the strength of the pressure relief plate hinge spring. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a structural diagram of a cold cavity dedicated for refrigeration in a process gas pipeline of a semiconductor vacuum conveying process according to the present invention;

[0018] Figure 2 for Figure 1 The cross-sectional structure diagram of AA in the middle;

[0019] Figure 3 for Figure 1 Cross-sectional structure diagram of BB.

[0020] In the figure: 1. box body; 2. cover plate; 3. pressure relief box; 4. air inlet; 5. pressure relief plate; 6. filter cartridge; 7. heat sink assembly; 8. conduit; 9. lining plate; 10. pressure relief pipe; 11. pressure relief chamber; 12. cooling chamber; 13. longitudinal plate; 14. transverse plate; 15. air outlet; 16. air guide hole; 17. splint; 18. buffer chamber; 19. heat sink; 20. joint. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] See also Figure 1-3The present invention provides a technical solution: a special cold cavity for refrigeration in a semiconductor vacuum conveying process gas pipeline, comprising: a box body 1 and a cover plate 2, the cover plate 2 is bolted to the top of the box body 1 and the connection is sealed, a buffer cavity 18, a pressure relief cavity 11, a heat sink assembly 7 and an inner lining plate 9 are installed inside the box body 1, four fixing columns are vertically installed at the inner bottom of the box body 1, the inner lining plate 9 is sleeved on the fixing columns, the heat sink assembly 7 is installed on the inner lining plate 9, an air inlet 4 is arranged in the middle of the top surface of the cover plate 2, and a gas inlet 4 is arranged in the middle of the bottom surface of the box body 1. An air outlet 15 corresponding to the air inlet 4 is arranged, and a buffer chamber 18 is arranged below the air inlet 4. The gas to be cooled enters the interior of the box body 1 through the air inlet 4, and is discharged through the air outlet 15 after being cooled. The pressure relief chamber 11 is arranged below the buffer chamber 18, and a filter cartridge 6 is installed between the pressure relief chamber 11 and the buffer chamber 18. The buffer chamber 18 has a buffering effect on the intake air to reduce its impact force, and has a protective effect on the filter cartridge 6. The coordinated use of the pressure relief chamber 11 and the pressure relief box 3 can make the cooler have a certain pressure relief effect, and have a protective effect on the cooler;

[0023] Two joints 20 are installed on the side wall of the box body 1, and the inner end of the joint 20 is connected to the conduit 8. The conduit 8 has a U-shaped structure and the end thereof passes through the heat sink assembly 7. The bent end of the conduit 8 is close to the inner wall of the box body 1 and is away from the joint 20. The coolant enters the conduit 8 through the lower joint 20 and circulates inside. When passing through the heat sink assembly 7, it exchanges heat with the heat sink assembly 7, takes out the heat and is discharged from the upper joint 20.

[0024] Further improvement, such as Figure 2-3 As shown: the heat sink assembly 7 includes a plurality of transverse plates 14 and longitudinal plates 13. The transverse plates 14 include long transverse plates and short transverse plates. The longitudinal plates 13 are arranged at equal distances and connected at both ends by long transverse plates to form a frame-shaped structure. A longitudinal inner cavity is formed between adjacent longitudinal plates 13. The short transverse plates are horizontally placed inside the inner cavity and divide the inner cavity into a plurality of cooling cavities 12. Air enters the cooling cavity 12 for cooling. One end of the short transverse plate is connected to the longitudinal plate 13 on one side of the inner cavity, and the other end is close to the longitudinal plate 13 on the other side of the inner cavity and a flow groove is formed between the longitudinal plate 13. The short transverse plate is divided into three layers: upper, middle and lower. The flow grooves formed at the ends of the short transverse plates of the upper and middle layers are in the same direction, and the flow grooves formed at the ends of the short transverse plates of the lower layer are opposite to those of the upper and middle layers. The short transverse plates play a buffering role, increasing the circulation time of air inside the cooling cavity 12 and improving the cooling efficiency. The air circulates through the flow grooves and adheres to the surface of the longitudinal plate 13, further improving the cooling efficiency. The surfaces of the longitudinal plate 13 and the long transverse plate are also provided with a plurality of equally spaced air guide holes 16, which are circular in structure, and the conduit 8 passes through the air guide holes 16, which guide and disperse the air to be cooled to improve the uniformity of cooling.

[0025] Further improvement, such as Figure 3As shown: two clamping plates 17 are vertically installed on the top of the inner lining plate 9 and on both sides of the heat sink assembly 7, the lower end of the clamping plate 17 is welded to the inner lining plate 9, and the side wall of the clamping plate 17 is fixed to the heat sink assembly 7 with bolts. The heat sink assembly 7 is clamped by the clamping plates 17 on both sides to improve the stability of the heat sink assembly 7.

[0026] Further improvement, such as Figure 2 As shown: a heat sink 19 is also installed inside the box 1. There are five groups of heat sinks 19, which are arranged horizontally and equidistantly in the vertical direction, so as to improve the heat dissipation effect and the structural strength of the box 1.

[0027] Further improvement, such as Figure 2 As shown: a pressure relief box 3 is installed on one side of the top of the cover plate 2, and a pressure relief plate 5 and a pressure relief pipe 10 are installed inside the pressure relief box 3. There are three pressure relief pipes 10 in total and they are arranged horizontally and equidistantly. The end of the pressure relief pipe 10 extends into the pressure relief cavity 11 and is connected with the inside of the pressure relief cavity 11. When the internal pressure of the box body 1 is too large, the pressure is discharged through the pressure relief pipe 10.

[0028] Specifically, a hinge is installed at the end of the pressure relief plate 5 and is rotatably connected to the inner wall of the pressure relief box 3 through a spring hinge. The other end of the pressure relief plate 5 extends horizontally toward the middle of the pressure relief box 3. A rubber plate is installed on the bottom surface of the pressure relief plate 5 and is connected to the upper end of the pressure relief pipe 10. The rubber plate improves the sealing between the pressure relief plate 5 and the pressure relief pipe 10. The pressure relief standard can be adjusted by adjusting the strength of the hinge spring of the pressure relief plate 5.

[0029] When the present invention is in use, the coolant is introduced into the conduit 8 through the joint 20. After the coolant flows in the conduit 8, it exchanges heat with the heat sink assembly 7 to reduce the temperature of the heat sink assembly 7. The air to be cooled is discharged into the interior through the air inlet 4 and filtered once through the filter cartridge 6. After filtering, it flows downward through the pressure relief chamber 11. When the air contacts the heat sink assembly 7, it is blocked by the long horizontal plate on the top and diverted to the surroundings. The diverted air is guided downward to the interior of the inner cavity through the air guide hole 16. After contacting the short horizontal plate, it fully exchanges heat and is guided again by the short horizontal plate, so that the air passes through the circulation groove and flows downward along the surface of the longitudinal plate 13, thereby improving the heat exchange effect and increasing the uniformity of cooling. A pressure relief chamber 11 is set inside the box 1. When the internal pressure is too large, part of the air will move upward through the pressure relief pipe 10 and lift the pressure relief plate 5 to relieve pressure, which has a protective effect on the cooler. The pressure relief standard can be adjusted by adjusting the strength of the hinge spring of the pressure relief plate 5.

[0030] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A cold chamber for refrigeration in a semiconductor vacuum conveying process gas pipeline, comprising: Box body and cover plate, the cover plate is bolted to the top of the box body and the joint is sealed, characterized in that: a buffer chamber, a pressure relief chamber, a heat sink assembly and an inner lining plate are installed inside the box body, four fixing columns are vertically installed on the inner bottom of the box body, the inner lining plate is sleeved on the fixing columns, the heat sink assembly is installed on the inner lining plate, an air inlet is arranged in the middle of the top surface of the cover plate, an air outlet corresponding to the air inlet is arranged in the middle of the bottom surface of the box body, the buffer chamber is placed below the air inlet, the pressure relief chamber is placed below the buffer chamber, and a filter cartridge is installed between the pressure relief chamber and the buffer chamber; Two joints are installed on the side wall of the box body, and the inner ends of the joints are connected to conduits. The conduits are U-shaped and the ends thereof pass through the heat sink assembly, and the curved ends of the conduits are close to the inner wall of the box body and away from the joints. The heat sink assembly includes a plurality of transverse plates and longitudinal plates, wherein the transverse plates include long transverse plates and short transverse plates, the longitudinal plates are arranged equidistantly and connected at both ends by long transverse plates to form a frame-shaped structure, and a longitudinal inner cavity is formed between adjacent longitudinal plates, and the short transverse plates are horizontally placed inside the inner cavity and divide the inner cavity into a plurality of cooling cavities; One end of the short horizontal plate is connected to the longitudinal plate on one side of the inner cavity, and the other end is close to the longitudinal plate on the other side of the inner cavity to form a flow groove between the longitudinal plate; The surfaces of the longitudinal plate and the long transverse plate are also provided with a plurality of equally spaced air guide holes, the air guide holes are circular in structure, and the conduit passes through the air guide holes.

2. The cold chamber for refrigeration in a semiconductor vacuum conveying process gas pipeline according to claim 1, characterized in that: Two clamping plates are vertically installed on the top of the inner lining plate and on both sides of the heat sink assembly. The lower ends of the clamping plates are welded to the inner lining plate, and the side walls of the clamping plates are fixed to the heat sink assembly by bolts.

3. The cold chamber for refrigeration in a semiconductor vacuum conveying process gas pipeline according to claim 1, characterized in that: A heat sink is also installed inside the box, and five heat sinks are provided in total and are arranged horizontally and equidistantly in the longitudinal direction.

4. The cold chamber for refrigeration in a semiconductor vacuum conveying process gas pipeline according to claim 1, characterized in that: A pressure relief box is installed on one side of the top of the cover plate, and a pressure relief plate and a pressure relief pipe are installed inside the pressure relief box. There are three pressure relief pipes in total and they are arranged horizontally and equidistantly. The ends of the pressure relief pipes extend into the pressure relief cavity and are connected to the inside of the pressure relief cavity.

5. The cold chamber for refrigeration in a semiconductor vacuum conveying process gas pipeline according to claim 4, characterized in that: A hinge is installed at the end of the pressure relief plate and is rotatably connected to the inner wall of the pressure relief box through a spring hinge. The other end of the pressure relief plate extends horizontally toward the middle of the pressure relief box. A rubber plate is installed on the bottom surface of the pressure relief plate and is connected to the upper end of the pressure relief pipe.

Images