sensor

Abstract

A sensor comprises a housing, a substrate assembly, a temperature sensing unit and a pressure sensing unit. The sensor has a receiving cavity and a flow channel located on different sides of the thickness direction of the substrate, the flow channel and the receiving cavity are not communicated, and electronic components and the pressure sensing unit are located in the receiving cavity. The temperature sensing unit is electrically connected with the electronic components, and the pressure sensing unit is electrically connected with the electronic components. The substrate is an integral structure, the substrate comprises a first surface facing the receiving cavity and a second surface facing the flow channel, and the distance between the pressure sensing unit and the first surface is less than the distance between the pressure sensing unit and the second surface. The application can protect the pins and other parts of the pressure sensing unit through the structure of the substrate itself, and the substrate is an integral structure, which is relatively simple.

Description

Technical Field

[0001] This application relates to a measuring device, and more particularly to a sensor. Background Technology

[0002] One type of sensor in the related technology includes: a housing, a substrate assembly, a temperature sensing unit, and a pressure sensing unit. The sensor has a receiving cavity and a flow channel located on different sides of the substrate thickness direction, and the flow channel and the receiving cavity are not connected. Electronic components are located in the receiving cavity, and the pressure sensing unit is located in the flow channel. The pressure sensing unit is disposed on the surface of the substrate near the flow channel. The feet of the pressure sensing unit need to be protected by sealant or similar means, and the substrate is composed of two separate plates, resulting in a relatively complex structure. Summary of the Invention

[0003] This application provides a sensor, which includes: a housing, a substrate assembly, a temperature sensing unit, and a pressure sensing unit; the substrate assembly is located inside the housing, and the substrate assembly includes a substrate and a plurality of electronic components connected to the substrate, and the substrate has a through hole extending along its thickness direction.

[0004] The sensor has a receiving cavity and a flow channel located on different sides of the substrate thickness direction. The flow channel and the receiving cavity are not connected. The electronic component is at least partially located in the receiving cavity. The pressure sensing unit is at least partially located in the receiving cavity. One end of the guide hole is connected to the flow channel. The pressure sensing unit seals the other end of the guide hole.

[0005] The temperature sensing unit is electrically connected to the electronic components, and the pressure sensing unit is electrically connected to the electronic components. The substrate is an integral structure, and the substrate includes a first surface facing the receiving cavity and a second surface facing the flow channel. The distance between the pressure sensing unit and the first surface is less than the distance between the pressure sensing unit and the second surface.

[0006] Compared with related technologies, the distance between the pressure sensing unit and the first surface in this application is less than the distance between the pressure sensing unit and the second surface. The pins and other parts of the pressure sensing unit can be protected by the substrate itself, and the substrate is an integral structure with a relatively simple structure. Attached Figure Description

[0007] Figure 1 This is a three-dimensional schematic diagram of the first embodiment of the sensor in this application.

[0008] Figure 2 Is it like this? Figure 1 A three-dimensional schematic diagram of the sensor from another angle.

[0009] Figure 3 Is it like this? Figure 1 An exploded view of the sensor shown.

[0010] Figure 4 is another perspective exploded view of the sensor as shown in Figure 3

[0011] Figure 5 is a perspective exploded view of the sensor as shown in Figure 3

[0012] Figure 6 is a perspective view of the temperature sensing unit as shown in Figure 3

[0013] Figure 7 is another perspective view of the sensor as shown in Figure 3

[0014] Figure 8 is a quarter perspective exploded view of the sensor as shown in Figure 1

[0015] Figure 9 is another perspective exploded view of the sensor as shown in Figure 1

[0016] Figure 10 is yet another perspective exploded view of the sensor as shown in Figure 1

[0017] Figure 11 is a longitudinal section view of the sensor as shown in Figure 1

[0018] Figure 12 is a perspective view of a second embodiment of the sensor of the present application.

[0019] Figure 13 is a perspective exploded view of the sensor as shown in Figure 12

[0020] Figure 14 is a quarter perspective exploded view of the sensor as shown in Figure 12

[0021] Figure 15 is a perspective exploded view of a third embodiment of the sensor of the present application.

[0022] Figure 16 is a longitudinal section view of a fourth embodiment of the sensor of the present application.

[0023] Figure 17 is a perspective exploded view of a fifth embodiment of the sensor of the present application.

[0024] Figure 18 is a perspective view of the sensor of the present application applied to a solenoid valve. ​​​​​​​​​​

[0025] Figure 19 is a perspective exploded view of the electromagnetic valve as shown in Figure 18

[0026] Figure 20 is another perspective exploded view of the electromagnetic valve as shown in Figure 19

[0027] Figure 21 is a perspective sectional view of the electromagnetic valve as shown in Figure 18

[0028] Figure 22 is a system schematic diagram of a heat management system to which the sensor of the present application is applied. DETAILED DESCRIPTION

[0029] As shown in Figures 1 to 11 , a sensor 100 according to a first embodiment of the present application includes a housing 10, a sealing ring 30, a substrate assembly 40, a temperature sensing unit 50, a pressure sensing unit 60, and a conductive member 70.

[0030] As shown in Figure 8 and Figure 11 , the sensor 100 has a receiving cavity 102 and a flow passage 101 extending in a vertical direction. In combination, as shown in Figures 3 to 5 , the substrate assembly 40 is located inside the housing 10, and the substrate assembly 40 includes a substrate 41, a plurality of conductive paths (not numbered), and a plurality of electronic components 45. The thickness direction Y of the substrate 41 is the same as the vertical direction, and the substrate 41 includes a first surface 411 on the upper side of the thickness direction Y of the substrate 41, a second surface 412 on the lower side of the thickness direction Y of the substrate 41, and a peripheral wall surface 413 connected between the first surface 411 and the second surface 412. The first surface 411 faces the receiving cavity 102, and the second surface 412 faces the flow passage 101. The substrate 41 has a guide hole 414 extending through the thickness direction thereof, one end of the guide hole 414 communicates with the flow passage 101, and the pressure sensing unit 60 seals the other end of the guide hole 414.

[0031] As shown in Figure 8 , the flow passage 101 is located on the lower side of the thickness direction of the substrate 41, and the receiving cavity 102 is located on the upper side of the thickness direction of the substrate 41, that is, the receiving cavity 102 and the flow passage 101 are located on different sides of the thickness direction of the substrate 41, respectively. The sealing ring 30 is sealed and connected between the substrate 41 and the housing 10, so that the flow passage 101 and the receiving cavity 102 are not communicated, thereby reducing the risk of refrigerant flowing from the flow passage 101 into the receiving cavity 102 and causing refrigerant leakage.

[0032] As shown in Figure 3 and Figure 8 ​​​As shown, electronic component 45 and pressure sensing unit 60 are connected to the first surface 411 of substrate 41, and both electronic component 45 and pressure sensing unit 60 are at least partially located in receiving cavity 102. Temperature sensing unit 50 is electrically connected to electronic component 45, and pressure sensing unit 60 is electrically connected to electronic component 45. Pressure sensing unit 60 may include leaded soft pins or hard pins.

[0033] like Figures 3 to 5 As shown, the substrate 41 is generally disk-shaped, and the peripheral wall surface 413 is generally annular. The peripheral wall surface 413 is provided with a first guide groove 416, and the interior of the outer shell 10 has a guide post 115. The first guide groove 416 and the guide post 115 cooperate to facilitate the guiding and installation of the substrate 41 and to position the installation direction of the substrate 41. In other optional embodiments, the substrate 41 may also be square, rhomboid, polygonal, or irregular in shape, as long as it can realize the reception and fixation of the substrate 41 in the reception cavity 102 of the outer shell 10. This application is not limited to the shape of the substrate 41 shown in the figure.

[0034] The substrate 41 can be a ceramic substrate 41, and the conductive path can be a copper-plated conductive line or other conductive line disposed within the substrate 41, thereby forming a ceramic circuit board. The substrate 41 of the substrate assembly 40 can also be a printed circuit board (PCB) made of resin or other materials, and the conductive path can be a copper-plated conductive line or other conductive line disposed within the substrate 41. Ceramic circuit boards have better corrosion resistance and better thermal conductivity than printed circuit boards. Printed circuit boards have lower manufacturing costs than ceramic circuit boards and facilitate the soldering of electronic components 45. The conductive path within the substrate 41 and the substrate 41 in this application can achieve electrical connection between the temperature sensing unit 50, the pressure sensing unit 60, several electronic components 45, and the conductive element 70, and is not limited to the two embodiments mentioned above. The substrate 41 adopts an integral structure, and the pressure sensing unit 60 and the temperature sensing unit 50 are both electrically connected to the conductive path of the substrate 41, which is simpler than the structure of assembling two boards together, reducing assembly steps and simplifying the manufacturing process.

[0035] Please refer to the following: Figures 3 to 5 and Figures 8 to 11As shown, the housing 10 comprises a first shell 11 and a second shell 12, the second shell 12 is at least partially received in the first shell 11. The first shell 11 has a platform portion 13, a cylindrical portion 14 extending upwardly from the platform portion 13, a docking portion 15 extending downwardly from the platform portion 13, and a bent portion 16 bent from the cylindrical portion 14. The bent portion 16 is formed by riveting and bending from the cylindrical portion 14, the bent portion 16 abuts the second shell 12, the second shell 12 abuts the second surface 412 of the substrate 41 so as to fix the substrate 41 in the housing 10. The docking portion 15 is used for insertion and mounting into an electromagnetic valve or a system pipeline, the electromagnetic valve can be an electronic expansion valve, and the system pipeline can be a connecting pipeline connecting any two of a heat exchanger, a compressor, an electromagnetic valve, a liquid reservoir, and a gas-liquid separator. The platform portion 13 has a platform surface 131 matched with a corresponding mounted element, the platform surface 131 is planar. The first shell 11 comprises a first inner wall surface 117 arranged opposite to the second surface 412, and the first shell 11 has a first recess 114 recessed from the first inner wall surface 117.

[0036] The sealing ring 30 is received in the first recess 114, and the sealing ring 30 is fluidly sealed between the flow channel 101 and the receiving cavity 102. The sealing ring 30 is compressed between the second surface 412 of the substrate 41 and the groove bottom surface 115 of the first recess 114. As shown, the sealing ring 30 is in the shape of an O-ring, and the sealing ring 30 has a top portion 301 abutting the second surface 412 of the substrate 41 and a bottom portion 302 abutting the groove bottom surface 115 of the first recess 114. Figure 9

[0037] Figure 3 Figure 8 Figure 11 As shown, the cylindrical portion 14 comprises a first cylindrical portion 141 connected with the platform portion 13 and a second cylindrical portion 142 connected between the first cylindrical portion 141 and the bent portion 16, and the wall thickness of the first cylindrical portion 141 in the radial direction X is greater than the thickness of the second cylindrical portion 142 in the radial direction X. The outer wall surface 143 of the first cylindrical portion 141 and the outer wall surface 143 of the second cylindrical portion 142 are arranged in alignment, the first cylindrical portion 141 has a first protruding portion 144 protruding inwardly relative to the second cylindrical portion 142, the first protruding portion 144 forms a first step portion 171 with the first inner wall surface 117 of the first shell 11, and the first protruding portion 144 forms a second step portion 172 with the second inner wall surface 145 of the second cylindrical portion 142.

[0038] Figure 4 Figure 9 ​​​​​​As shown, the second housing 12 has a first end 121 and a second end 122, the bending portion 16 abuts against the second end 122, and the first end 121 abuts against the first surface 411 of the substrate 41 and the second step portion 172, the bottom surface 173 of the second step portion 172 is substantially in the same horizontal line as the first surface 411, and the second step portion 172 is arranged to position the installation position of the second housing 12.

[0039] As shown in Figure 3 and Figure 4 , the second housing 12 is substantially inverted-bowl-shaped, and the second housing 12 includes a top wall 123, a surrounding wall 127 extending downward from the top wall 123, and a receiving cavity 102 enclosed by the top wall 123 and the surrounding wall 127. The top wall 123 includes a first platform 124 perpendicular to the surrounding wall 127, a second platform 125 above the first platform 124, and a smooth transition portion 126 connected between the first platform 124 and the second platform 125. The surrounding wall 127 is provided with a second guide groove 129 for cooperating with the guide column 115, and the first guide groove 416 of the substrate 41 and the second guide groove 129 of the second housing 12 are arranged in alignment, so that the guide column 115 of the first housing 11 cooperates with the first guide groove 416 and the second guide groove 129 to guide the installation direction of the substrate assembly 40 and the second housing 12.

[0040] The second housing 12 is provided with a plurality of second through holes 128 penetrating the second platform 125 in the vertical direction, the plurality of second through holes 128 are in communication with the receiving cavity 102, and the plurality of second through holes 128 can be uniformly distributed around the axis of the second platform 125. As shown in Figure 9 , the bending portion 16 is riveted and pressed against the first platform portion 124, and the conductive member 70 penetrates the second through hole 128 of the second platform portion 125.

[0041] The first shell 11 is a metal piece, so that the electromagnetic interference (EMI) from the outside to the internal electronic components of the sensor 100 can be reduced, and the second shell 12 is an insulating piece, so that the first shell 11 and the conductive piece 70 can be insulated and separated. Optionally, the first shell 11 can be a metal piece made of aluminum or stainless steel. The metal piece made of aluminum is lighter in weight, so that the light weight of the sensor 100 can be facilitated, and thus the light weight of the whole vehicle can be facilitated when the sensor 100 is used in the automotive thermal management system. Although the metal piece made of stainless steel is slightly heavier than the metal piece made of aluminum, the metal piece made of stainless steel has the advantage of convenient welding. The second shell 12 is an insulating piece made of plastic, which can be manufactured by the process of injection molding. The second shell 12 made of insulating material insulates the conductive piece 70 and the first shell 11. The first shell 11 made of metal can be manufactured by the processes of die casting, extrusion molding or metal injection molding (MIM).

[0042] As shown in Figure 3 and Figure 10 , the conductive piece 70 is a coil spring. The conductive piece 70 includes a first end 71, a second end 72 and an intermediate portion 73 connected between the first end 71 and the second end 72. The first end 71 abuts against the first surface 411 of the substrate 41, the intermediate portion 73 is accommodated in the second hole 128 of the second shell 12, and the second end 72 extends upward from the intermediate portion 73 beyond the second shell 12. The first end 71 of the conductive piece 70 is electrically connected to the conductive path, and the second end 72 of the conductive piece 70 is used to be electrically connected to the elements outside the sensor 100. The conductive piece 70 in the form of a coil spring abuts against the circuit board inside the electromagnetic valve, so that the sensing signal can be transmitted to the electromagnetic valve, and the further control of the electromagnetic valve is facilitated.

[0043] As shown in Figure 8 and Figure 11As shown, the substrate 41 is provided with a through hole 414 along the vertical direction, the pressure sensing unit 60 is arranged above the through hole 414, and the distance between the pressure sensing unit 60 and the first surface 411 is less than the distance between the pressure sensing unit 60 and the second surface 412, that is, the pressure sensing unit 60 is a back pressure type pressure sensing unit. The pressure sensing unit 60 is arranged on the first surface 411 of the substrate 41, and compared with the second surface 412 of the substrate 41, the risk of corrosion of the refrigerant to the pressure sensing unit 60 and its pins is reduced, and the corresponding corrosion-resistant glue protection can be omitted, so that the structure is simpler and the production cost is lower. The refrigerant can flow from the flow channel to the pressure sensing unit 50 through the through hole 414, so that the pressure sensing unit 50 converts the pressure of the refrigerant into an electrical signal, and the electronic element 45 includes a conditioning chip, a processing chip, a resistor, a capacitor and the like, so that the real-time pressure of the refrigerant can be calculated.

[0044] The temperature sensing unit 50 includes a temperature sensing part 51 and a pin part 52, the temperature sensing part 51 is located below the substrate 41, and the temperature sensing part 51 is exposed in the flow channel 101 or extends downward beyond the flow channel 101. The temperature sensing part 51 arranged in this way can be in full contact with the refrigerant, reducing the temperature difference after the refrigerant flows into the flow channel 101, thereby improving the sensitivity and accuracy of the refrigerant temperature detection. The substrate 41 has a pin hole 418 penetrating the substrate 41 along the thickness direction of the substrate 41, the distance between the temperature sensing part 51 and the second surface 412 is less than the distance between the temperature sensing part 51 and the first surface 411, and the pin part 52 extends from the temperature sensing part 51 through the pin hole 418. The pin part 52 is connected to the substrate 41 and electrically connected to the conductive path of the substrate assembly 40, and the temperature change of the refrigerant causes the current change in the temperature sensing part 51 to be conducted to the substrate assembly 40 through the pin, and the electronic element 45 includes a conditioning chip, a processing chip, a resistor, a capacitor and the like, so that the real-time temperature of the refrigerant can be calculated.

[0045] When the pressure sensing unit 60 is in contact with the refrigerant, the pressure of the refrigerant is converted into an electrical signal, and when the temperature sensing unit 50 is in contact with the refrigerant, the temperature of the refrigerant is converted into an electrical signal, and the corresponding chip or other electronic elements 45 on the substrate assembly 40 calculate the real-time pressure and temperature of the refrigerant according to the electrical signal, thereby realizing real-time monitoring of the temperature and pressure of the refrigerant, which is conducive to accurate control and intelligent design of the electromagnetic valve. The temperature sensing unit 50 can be an NTC (Negative Temperature Coefficient) temperature sensing element, and the pressure sensing unit 60 can be a MEMS (Micro Electromechanical System) pressure sensing element. MEMS pressure integrated chips are relatively small in size, and the size of common MEMS pressure integrated chip products is generally in the millimeter level or even smaller. The silicon cup thin film surface of the pressure sensor integrated chip prepared by MEMS technology is made into a Wheatstone bridge with four resistors. When there is no pressure acting on the silicon cup thin film, the Wheatstone bridge is balanced and the output voltage is 0. When there is pressure acting on the silicon cup thin film, the Wheatstone bridge balance is broken and there is voltage output. Therefore, by detecting the change of the electrical signal in the circuit, the change of the pressure can be reflected, thereby realizing the pressure detection function. The NTC temperature sensing element is a kind of thermistor and probe, whose principle is that the resistance value decreases rapidly with the increase of temperature. It is usually composed of 2 or 3 kinds of metal oxides, mixed in clay similar to fluid, and forged into dense sintered ceramics in a high temperature furnace. The actual size is very flexible, which can be as small as 0.010 inches or very small in diameter.

[0046] The pressure sensing unit 60 is mounted on the first surface 411 of the substrate 41 in a SMT (Surface Mount Technology) manner, and the temperature sensing unit 50 is welded on the first surface 411 of the substrate 41 in a Through hole manner. The pressure sensing unit 60 is a MEMS sensor, and the temperature sensing unit 50 is a pin type NTC thermistor temperature sensor. The temperature sensing unit 501 in pin type can extend the temperature sensing part 51 into the flow channel 101 or close to the opening side of the flow channel 101, so as to timely sense the temperature when sensing the refrigerant flowing into the flow channel, and reduce the measurement temperature error caused by the temperature change of the refrigerant flowing into the flow channel. At the same time, the temperature sensing unit 501 in pin type can perfectly combine the simple structure of the pressure sensing unit 51 and the timeliness and accuracy of the temperature sensing unit 501 with the back pressure type patch pressure sensing unit 60.

[0047] As Figures 3 to 7As shown, the temperature sensing unit 50 further comprises a foot support 53 for protecting the pin portion 52, the foot support 53 is made of a refrigerant corrosion resistant insulating material, and is optionally made of plastic. The first housing 11 has a first housing inner cavity 111 and a first hole 112, the first housing inner cavity 111 is at least partially located between the cylindrical portion 14, the bent portion 16 and the platform portion 13, and the first hole 112 is at least partially located inside the platform portion 13. The first hole 112 is in communication with the first housing inner cavity 111, and the foot support 53 is at least partially located in the first hole 112. The pin portion 52 has a first foot portion 521 located in the foot support 53, a second foot portion 522 located in the substrate 41, a third foot portion 523 located in the receiving cavity 102, and a fourth foot portion 524 connected between the first foot portion 521 and the temperature sensing portion 51. The foot support 53 comprises a support body portion 531 and a first positioning portion 532, and the inner wall of the first housing 11 has a second positioning portion 113, the first positioning portion 532 and the second positioning portion 113 are matched, as shown in Figure 10 As shown, the first positioning portion 532 is clamped between the second positioning portion 113 and the second surface 412 of the substrate 41. The first positioning portion 532 cooperates with the second positioning portion 114 of the first housing 11, which facilitates the positioning of the foot support 53 during installation.

[0048] As shown in Figure 5 and Figure 10 , the first positioning portion 532 protrudes relative to the support body portion 531, and the second positioning portion 113 forms a stepped surface on the inner wall of the first housing 11. The first positioning portion 532 has a first contact surface 533, the second positioning portion 113 has a second contact surface 114, the first contact surface 533 and the second contact surface 114 are in contact, and the first positioning portion 532 further comprises a third contact surface 534, the third contact surface 534 is in contact with the second surface 412 of the substrate 41, and the third contact surface 534 is away from the opening 105 of the flow channel relative to the first contact surface 114.

[0049] As shown in Figure 9 and Figure 11 , the flow channel 101 is at least partially arranged in the foot support 53, and the flow channel 101 comprises a first flow channel 103 and a second flow channel 104 in communication with each other. The first flow channel 103 is located between the second flow channel 104 and the guide hole 414, the inner diameter of the first flow channel 103 is smaller than the inner diameter of the second flow channel 104, the inner diameter of the first flow channel 103 is larger than the inner diameter of the guide hole 414, and the axis of the first flow channel 103 coincides with the axis of the guide hole 414.

[0050] As shown in Figure 4As shown, the foot support 53 includes an upper end 535, a lower end 536, and two pin holes 537 extending through the upper end 535 and the lower end 536 in the vertical direction (the length direction of the foot support 53). The pin portion 52 passes through the two pin holes 537 of the lower end 536 and exits from the pin holes 537 of the upper end 535, and is soldered to the substrate 41. The upper end 535 can be fixed to the second surface 412 of the substrate 41 by physical structure fixation or adhesive bonding, thereby enhancing the stability of the foot support 53 under refrigerant impact. The foot support 53 can also be directly clamped between the temperature sensing unit 51 and the second surface 412, resulting in a simpler structure and fewer manufacturing processes. The lower end 536 is adjacent to the temperature sensing unit 51, thereby maximizing the protection of the pin portion 52 from the effects of refrigerant. The design of the foot support 53 reduces the risk of refrigerant impact and corrosion to the pin portion 52 of the temperature sensing unit 50, thereby improving the service life of the sensor 100. The pin portion 52 can also be coated with a refrigerant-resistant coating to further reduce the corrosion of the pin 512 by the refrigerant. The first positioning portion 532 is provided at the upper end portion 535, and the first positioning portion 532, together with the second positioning portion 114 of the first housing 11, facilitates the positioning of the foot support 53 during installation.

[0051] like Figure 7 and Figure 8 As shown, the footrest 53 has a base plate portion 541, which is located at the lower end 536 of the footrest 53. The base plate portion 541 is part of the main body portion 531. The base plate portion 541 separates the temperature sensing portion 51 outside the footrest 53. The pin portion 52 is inserted into the pin hole 537, thereby blocking the refrigerant from the pin portion 52 and further reducing the impact of refrigerant on the pin portion 52.

[0052] The first positioning part 532 includes a disc part 538 protruding radially X relative to the tray body part 531 and a plurality of protruding pillars 539 protruding upward from the disc part 538. The diameter of the disc part 538 is larger than the diameter of the tray body part 531, and the outer circumferential surfaces of the plurality of protruding pillars 539 are aligned with the outer circumferential surfaces of the disc part. The plurality of protruding pillars 539 are evenly distributed circumferentially around the axis of the tray body part 538. Optionally, there are four protruding pillars 539, thereby providing more stable support for the substrate 41. A first contact surface 533 is provided on the lower side of the disc part 538, and a third contact surface 534 is provided on the upper side of the protruding pillars 539.

[0053] like Figures 12 to 14As shown, the sensor conforms to the second embodiment of this application. The main difference between the second embodiment and the first embodiment is that the first housing 11 includes a first main housing 21 and a first inner housing 22, which are separately configured. The first main housing 21 is sealed and fixedly connected to the second surface 412 of the substrate 41 by adhesive bonding, or a metal ring is exposed on the second surface 412 of the substrate 41, and the first inner housing 22 is sealed and fixedly connected to the metal ring by soldering. In addition, the foot holder 53 of the temperature sensing unit 50 in the second embodiment is also different from that in the first embodiment. The foot holder 53 in the second embodiment does not form a flow channel 101 as in the first embodiment. The flow channel 101 is formed by the first inner housing 22, and the foot holder 53 is located in the flow channel 101. Compared with the first embodiment, the refrigerant flow rate into the flow channel in the second embodiment is larger, and the pressure sensing is more timely. The first inner housing 22 and the first main housing 21 can be sealed and fixedly connected by adhesive bonding or welding methods such as laser welding. The presence of the first inner shell 22 facilitates the sealing connection between the first shell 11 and the substrate 41. The first inner shell 22 can be glued or welded to the substrate 41 first, and then glued or welded to the first main shell 21, thus reducing the difficulty of gluing or welding. The arrangement of the sealing ring 30, conductive element 70, second shell 12, temperature sensing part 51, and pin part 52 is basically the same as in the first embodiment, and will not be described further here.

[0054] like Figure 15 As shown, the sensor conforming to the third embodiment of this application differs from the second embodiment mainly in that the sealing ring 30 is omitted in this embodiment. The entire sensor has no sealing ring. The first inner shell 22 and the second surface 412 of the substrate 41 are first fixed and sealed together by welding or adhesive. Then, the first inner shell 22 is inserted into the first channel 112 of the first main shell 21, and the sealing connection between the first inner shell 22 and the first main shell 21 is achieved by laser welding or adhesive. The seal between the flow channel 101 and the receiving cavity 102 is achieved by welding, adhesive, etc., between the first inner shell 22, the substrate 41, and the first main shell 21, eliminating the need for a sealing ring, reducing material costs, and reducing the risk of refrigerant leakage due to sealing ring failure.

[0055] like Figure 16 As shown, the sensor conforming to the fourth embodiment of this application differs from the third embodiment mainly in that the first housing 11 is an integral structure, and the inner wall of the first housing 11 is provided with a second protrusion 18 protruding towards the second surface 412 of the substrate 41. The second protrusion is sealed to the second surface 412 of the substrate 41 by means of adhesive or welding, eliminating the need for a sealing ring. Compared with the third embodiment, the structure of the first housing 11 in the fourth embodiment is simpler, eliminating the need for separate components and reducing the sealing and fixing connection processes between the separately configured first housings 11.

[0056] like Figure 17 As shown, the sensor conforms to the fifth embodiment of this application. The main difference from the previous embodiments is that a metal ring 46 is provided on the second surface 412 of the substrate 41. The first inner shell 22 and the metal ring 46 are sealed and fixed by welding. The assembly formed by the substrate 41 and the first inner shell 22 is then inserted into the first hole 112 of the first main shell 21, and the sealing and fixing between the first inner shell 22 and the first main shell 21 are achieved by laser welding.

[0057] like Figures 18 to 21 As shown, a solenoid valve 200 conforming to this application includes the sensor 100 of any of the aforementioned embodiments, taking the sensor 100 of the first embodiment as an example. The solenoid valve 200 may be an electronic expansion valve (EXV), which includes a valve body 80, a cover 81, a valve core 82, a valve core seat 83, a motor, a circuit board 84, and a connector 85. The valve body 80 includes a first channel 801 and a second channel 802 that are parallel to each other, as well as a first mounting cavity 803 and a second mounting cavity 804 that are parallel to each other. The first mounting cavity 803 is connected to the first channel 801, and the second mounting cavity 804 is connected to the second channel 802.

[0058] A valve core 82 is installed in the first mounting cavity 803 to control the flow of refrigerant in the first channel 801 or to put it in a throttling state. A sensor 100 is installed in the second mounting cavity 804 to detect the temperature and pressure of the refrigerant flowing into the second channel 802. A circuit board 84 is installed in the cover cavity 811 of the cover 81. The conductive element 70 of the sensor 100 abuts against the lower surface of the circuit board 84, and the connector 100 is connected to the upper surface of the circuit board 84.

[0059] The motor section and valve core 82 are located within the valve core seat. The motor section includes a stationary iron core / stator 86 and a moving iron core / rotor 87. The stationary iron core 86 surrounds the moving iron core 87, and the moving iron core 87 is mechanically connected to the valve core 82. The stationary iron core 86 is electrically connected to the circuit board 84. The sensor 100 and connector 85 are electrically connected to the circuit board 84, and the connector 85 is electrically connected to an external source, allowing power to be supplied to the stationary iron core 86 or to transmit temperature and pressure signals from the sensor 100 to an external controller. When the stationary iron core 86 is energized, the changing current generates a magnetic field that drives the moving iron core 97 to rotate. The moving iron core 97, through a nut and screw mechanism, drives the valve core 82 to move linearly up and down, thereby controlling the flow or throttling of the refrigerant in the first channel 801.

[0060] like Figure 22As shown, the present application also provides a heat management system or air conditioning system 900, which comprises a compressor 91, a condenser 92, a solenoid valve (electronic expansion valve) 200, an evaporator 93 and a sensor 100. The compressor 91 compresses the refrigerant into high-temperature and high-pressure refrigerant, which releases heat to the air or cooling liquid through the condenser 92, enters the first passage 801 of the solenoid valve (electronic expansion valve) 200 to be throttled and reduced in pressure into low-temperature and low-pressure refrigerant, and then enters the evaporator 93 to absorb heat from the air or cooling liquid to evaporate into gaseous refrigerant. After passing through the second passage 802 and the sensor 100 to measure the temperature and pressure of the refrigerant, the refrigerant enters the compressor for circulation. The sensor 100 and the electronic expansion valve 200 in the system are only illustrative, and the actual physical structure is as follows Figures 18 to 21 As shown, the present application also provides a heat management system or air conditioning system 900, which comprises a compressor 91, a condenser 92, a solenoid valve (electronic expansion valve) 200, an evaporator 93 and a sensor 100. The compressor 91 compresses the refrigerant into high-temperature and high-pressure refrigerant, which releases heat to the air or cooling liquid through the condenser 92, enters the first passage 801 of the solenoid valve (electronic expansion valve) 200 to be throttled and reduced in pressure into low-temperature and low-pressure refrigerant, and then enters the evaporator 93 to absorb heat from the air or cooling liquid to evaporate into gaseous refrigerant. After passing through the second passage 802 and the sensor 100 to measure the temperature and pressure of the refrigerant, the refrigerant enters the compressor for circulation. The sensor 100 and the electronic expansion valve 200 in the system are only illustrative, and the actual physical structure is as follows

[0061] The above embodiments are only used to illustrate the present application and not to limit the technical solutions described in the present application. The understanding of the present application should be based on the skilled person in the art. Although the present application has been described in detail with reference to the above embodiments, those skilled in the art should understand that the skilled person in the art can still modify or equivalently replace the present application, and all technical solutions and improvements which do not deviate from the spirit and scope of the present application should be covered within the scope of the claims of the present application.

Claims

1. A sensor, characterized in that, include: Housing, substrate assembly, temperature sensing unit, and pressure sensing unit; The substrate assembly is located inside the housing. The substrate assembly includes a substrate and several electronic components connected to the substrate. The substrate has a through hole extending through its thickness direction. The sensor has a receiving cavity and a flow channel located on different sides of the substrate thickness direction. The flow channel and the receiving cavity are not connected. The electronic component is at least partially located in the receiving cavity. The pressure sensing unit is at least partially located in the receiving cavity. One end of the guide hole is connected to the flow channel. The pressure sensing unit seals the other end of the guide hole. The temperature sensing unit is electrically connected to the electronic components, and the pressure sensing unit is electrically connected to the electronic components. The substrate is an integral structure, and the substrate includes a first surface facing the receiving cavity and a second surface facing the flow channel. The distance between the pressure sensing unit and the first surface is smaller than the distance between the pressure sensing unit and the second surface. The sensor also includes a footrest, the housing has a first inner cavity and a first channel, the first channel communicates with the first inner cavity, the footrest is at least partially located in the first channel, the footrest includes a support body and a first positioning part, and the inner wall of the first housing has a second positioning part; The first positioning part protrudes relative to the main body of the support, and the second positioning part forms a stepped surface on the inner wall of the first housing. The first positioning part has a first contact surface, and the second positioning part has a second contact surface. The first contact surface and the second contact surface are in contact. The first positioning part also includes a third contact surface. The third contact surface is in contact with the second surface, and the third contact surface is away from the opening of the flow channel relative to the first contact surface. The temperature sensing unit includes a pin portion, which is located inside the footrest.

2. The sensor as described in claim 1, characterized in that: The temperature sensing unit includes a temperature sensing part and a pin part connected to the temperature sensing part. The substrate has a pin hole that penetrates the substrate along the thickness direction. The distance between the temperature sensing part and the second surface is less than the distance between the temperature sensing part and the first surface. The pin part extends from the temperature sensing part through the pin hole.

3. The sensor as described in claim 2, characterized in that: The pressure sensing unit is patch-mounted to the first surface of the substrate, and the temperature sensing unit is through-hole soldered to the first surface of the substrate.

4. The sensor as described in claim 2, characterized in that: The outer casing includes a first housing and a second housing. The second housing has a first end and a second end. The first end abuts against a first surface of the substrate. The first housing has a platform portion, a cylindrical portion extending upward from the platform portion, and a bent portion bending from the cylindrical portion. The bent portion abuts against the second end of the second housing. The first housing is a metal housing, and the second housing is an insulating housing.

5. The sensor as described in claim 4, characterized in that: The outer casing includes a first housing and a second housing. The first housing has a first housing cavity and a first channel. The first housing cavity is at least partially located between the cylindrical portion, the bent portion and the platform portion. The first channel is at least partially located inside the platform portion. The pin portion has a first foot located inside the footrest, a second foot located inside the substrate, a third foot located in the receiving cavity and a fourth foot connected between the first foot and the temperature sensing portion.

6. The sensor as described in claim 5, characterized in that: The first positioning part and the second positioning part cooperate, with the first positioning part sandwiched between the second positioning part and the second surface.

7. The sensor as described in claim 1, characterized in that: The flow channel is at least partially disposed in the footrest, and the flow channel includes a first flow channel and a second flow channel that are interconnected. The first flow channel is located between the second flow channel and the guide hole. The inner diameter of the first flow channel is smaller than the inner diameter of the second flow channel. The inner diameter of the first flow channel is larger than the inner diameter of the guide hole. The axis of the first flow channel coincides with the axis of the guide hole.

8. The sensor as described in claim 4, characterized in that: The sensor further includes a sealing ring, the first housing includes a first inner wall surface disposed facing the second surface, the first housing includes a first groove recessed from the first inner wall surface, the sealing ring is received in the first groove, and the sealing ring fluid seals between the flow channel and the receiving cavity.

9. The sensor as described in claim 4, characterized in that: The sensor further includes a conductive element, the second housing includes a second channel extending through the thickness of the second housing, one end of the conductive element is electrically and physically connected to a first surface of the substrate, the other end of the conductive element is located outside the second housing, and the conductive element also includes a middle portion housed within the second channel.

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