A device for adjusting the pitch of a micro chip

Abstract

The present invention proposes a device for adjusting the pitch of tiny chips, which belongs to the technical field of tiny electronic components; it specifically includes a fixed frame, in which a pitch adjustment mechanism that can move left and right is arranged, the pitch adjustment mechanism includes multiple parallel pitch execution plates, and the distance between two adjacent pitch execution plates can be stretched and shrunk at equal distances under the pushing mechanism. A limiting mechanism is arranged in the fixed frame, and the limiting mechanism is used for positioning the pitch execution plates after stretching or shrinking. The pitch execution plates are used to insert into rows or columns of tiny chips on the suction cup for pitch adjustment; the present invention can simply and quickly realize the pitch adjustment of tiny chips through the pitch adjustment device, and is used in conjunction with a variety of transfer devices to improve the efficiency and accuracy of transfer, and can be completed without complex equipment, thereby saving a lot of costs.

Description

Technical Field

[0001] The invention belongs to the technical field of micro electronic components and relates to a micro chip pitch adjustment device. Background Art

[0002] With the development of micro-UHD display technology, UHD displays require ultra-high density LED pixels, each pixel consisting of a corresponding LED chip. Therefore, the production of UHD LED display products requires the rapid batch matrix transfer of a large number of LED chips to the corresponding substrate. The current more mature transfer technology still uses a mechanical structure of the "suck→release" process, that is, the chip is sucked from the wafer with a suction head and then transferred to the corresponding position on the corresponding substrate. However, during this process, the position of the chip cannot be adjusted or corrected. Although rapid transfer can be achieved, after the transfer, a large number of chips are not aligned, affecting subsequent operations. This reduces the accuracy of the rapid and massive transfer of microchips and is far from meeting the production requirements of UHD and ultra-small pixel pitch display products. Summary of the Invention

[0003] The present invention overcomes the shortcomings of the prior art and proposes a microchip pitch adjustment device, which aims to improve the position accuracy of microchips during rapid and massive transfer.

[0004] In order to achieve the above object, the present invention is implemented through the following technical solutions.

[0005] The pitch adjustment device includes a fixed frame, in which a pitch adjustment mechanism that can move left and right is arranged. The pitch adjustment mechanism includes multiple parallel pitch execution plates. The distance between two adjacent pitch execution plates can be stretched and shrunk at equal distances under the pushing mechanism. A limiting mechanism is arranged in the fixed frame. The limiting mechanism is used to position the pitch execution plate after stretching or shrinking. The pitch execution plate is used to be inserted into the row or column of tiny chips on the suction cup for pitch adjustment.

[0006] Furthermore, a motion giving way hole is arranged in the middle of the pitch actuator plate, and the output plate, the dynamic pitch adjustment plate, and multiple pitch actuator plates are connected to the screw rod in sequence, the dynamic pitch adjustment plate is connected to the output plate, and the end of the screw rod connected to the output plate is connected to a driving device, and the output plate drives the dynamic pitch adjustment plate along the screw rod into the motion giving way hole under the action of the driving device, and the dynamic pitch adjustment plate pushes the multiple pitch actuator plates step by step to stretch the pitch actuator plates to the same spacing; the pitch actuator plate away from the output plate is connected to a pitch execution return sleeve, and the pitch execution return sleeve is driven by the screw rod to push the multiple pitch actuator plates back toward the output plate.

[0007] Furthermore, the upper and lower edges of the dynamic pitch adjustment plate are symmetrically provided with first steps, and the first steps are gradually retracted in the direction of the screw rod from the output plate to the pitch execution plate. The upper and lower walls within the fixed frame are symmetrically provided with fixed pitch adjustment plates, and the edges of the fixed pitch adjustment plates are provided with second steps that engage with the first steps; the height of the multi-section execution plate is matched with the distance between the upper and lower second steps in sequence.

[0008] Furthermore, the limiting mechanism includes an in-situ fixing plate, an in-situ pitch limiting sleeve and a fixed spring piece; the in-situ fixing plate is arranged on the upper and lower walls of the fixed frame, and is located between the dynamic pitch adjustment plate and the pitch execution plate adjacent to the dynamic pitch adjustment plate, and is used for overall limiting when the pitch execution plate retracts; the in-situ pitch limiting sleeve is arranged on the guide rod connecting multiple pitch execution plates, and is located between two adjacent pitch execution plates, and is used for limiting between the two adjacent pitch execution plates; the fixed spring piece is arranged on the second step.

[0009] Preferably, the pitch adjustment device has another structure: an output plate is provided on one side of the fixed frame, the output plate is connected to the screw rod, the screw rod is connected to a driving device, and tracks are provided on both sides of the screw rod; the pitch adjustment mechanism includes a mesh telescopic arm and multiple pitch execution plates, the mesh telescopic arm includes an active joint, multiple sliding joints and a main fixed joint that are slidably connected to the track in sequence, a mesh arm is connected between the multiple sliding joints, and the mesh arm is telescopic through multiple intermediate joints; the active joint is connected to the output plate, and the main fixed joint is fixedly connected to one end away from the output plate; the active joint, sliding joint and main fixed joint all carry a pitch execution plate.

[0010] Furthermore, the main fixed joint is arranged on the fixed frame through a fixing plate.

[0011] The pitch adjustment device is connected to an alignment motion mechanism, and the alignment motion mechanism is used to drive the pitch adjustment device to move left and right as a whole to align the tiny chips.

[0012] The beneficial effects of the present invention compared to the prior art are:

[0013] The present invention uses a pitch adjustment device to quickly and easily adjust the pitch of tiny chips. When used in conjunction with a variety of transfer devices, it improves transfer efficiency and accuracy, eliminating the need for complex equipment and significantly reducing costs. The present invention is applicable to both tiny wafers and other tiny chips distributed in other matrices. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the following description is made with reference to the following drawings:

[0015] Figure 1 It is a side view of the pitch adjustment device described in Example 1 when the pitch actuator plate is in a retracted state.

[0016] Figure 2 yes Figure 1 Top view of .

[0017] Figure 3 It is a side view of the pitch adjustment device described in Example 1 when the pitch actuator plate is extended.

[0018] Figure 4 yes Figure 3 Top view of .

[0019] Figure 5 It is a side view of the pitch adjustment device described in Example 2 when the pitch actuator plate is extended.

[0020] Figure 6 yes Figure 5 Top view of .

[0021] Figure 7 It is a top view of the pitch adjustment device described in Example 2 during the contraction process of the pitch execution plate.

[0022] Figure 8 It is a top view of the pitch adjustment device described in Example 2 after the pitch execution plate is retracted.

[0023] Figure 9 This is the chip before it is snapped.

[0024] Figure 10 It is the chip after being photographed.

[0025] In the figure, 1 is a servo motor, 2 is a motor mounting plate, 3 is an output plate, 4 is a lower baffle, 5 is an upper baffle, 6 is a guide rod, 7 is a screw rod, 8 is a fixed pitch adjustment plate, 9 is a fixed spring piece, 10 is an in-situ fixed plate, 11 is a pitch execution plate, 12 is a movable pitch plate movement clearance hole, 13 is a fixed pitch plate step, 14 is a movable pitch adjustment plate, 15 is a movable pitch adjustment plate step, 16 is a right baffle, 17 is an in-situ pitch limiting sleeve, 18 is a pitch execution return sleeve, 19 is a wafer alignment servo motor, 20 is a wafer alignment motion mechanism, and 21 is a wafer;

[0026] 06 is the track plate, 07 is the motor output plate, 09 is the track slot, 100 is the active joint, 110 is the sliding joint, 120 is the intermediate joint, 130 is the main fixed joint, 140 is the fixed plate, and 150 is the mesh robotic arm. DETAILED DESCRIPTION

[0027] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail with reference to the embodiments and the accompanying drawings. It should be understood that the specific embodiments described herein are merely for explaining the present invention and are not intended to limit the present invention. The technical solutions of the present invention will be described in detail below with reference to the embodiments and the accompanying drawings, but the scope of protection is not limited thereto.

[0028] Example 1

[0029] This embodiment is a method for batch transferring tiny LED chips based on micro-vacuum plus UV dissociation. After epitaxial growth and electrode fabrication, the LED chip forms a whole GaN or GaAs wafer. The wafer crystal is affixed to a blue adhesive film, and then laser cut or blade cut to form a single LED chip arranged in a matrix, which is evenly distributed on the bonding surface of the blue UV adhesive film. After the LED chips are spot-tested to screen out defective products, the remaining good products are the wafer sheets to be transferred, or they can be wafer sheets that have been tested, sorted, and rearranged by the chip factory. The outer layer of the chip electrode is made of tin with a thickness of about 5 to 30 μm. The single wafer crystal is evenly distributed on the UV adhesive film with the electrode facing upward.

[0030] Next, you need to transfer the single chip of the entire wafer to the corresponding substrate soldering position.

[0031] Step 1: Pass the wafer through a wafer expander with controlled and precise expansion to evenly space the rows of single chips on the wafer to facilitate subsequent pitch adjustment.

[0032] The second step: Use a micro vacuum suction cup made of alloy metals such as super-hard tungsten steel. The surface smoothness and flatness of the suction cup are required to be between 0.5 and 5μm, and ideally, it should be controlled within 2μm. The suction cup is densely covered with a large number of micropores with a pore diameter of 1 to 20μm and a pore spacing of 5-20μm. According to the size of the chip, the appropriate pore diameter and pore spacing are selected to ensure that each chip can correspond to about 20 micropores to ensure that the chip can be effectively adsorbed on the disk surface and keep the position fixed. The suction cup is vacuumed and the vacuum requirement is above -70Kpa to ensure that each chip is firmly adsorbed in the corresponding position.

[0033] Step 3: Fix the expanded UV Wafer on the UV rack and align it vertically downward with the micro vacuum suction cup (the micro vacuum suction cup is facing upward), slowly bring the UV film wafer close to the micro vacuum suction cup surface, and turn on the vacuum.

[0034] Step 4: Irradiate UV light from the back of the UV film. Adjust the UV light power to reduce the adhesive strength enough to release the single chip. After the chip's adhesive strength decreases, it is adsorbed onto the suction cup surface by a slight vacuum, and the chip is separated from the UV film. The chip's electrodes face upward to avoid scratching the electrodes during the next step of pitch adjustment; the electrodes face the suction cup surface.

[0035] Step 5: Use the pitch adjustment device to adjust the chip row and column pitch so that the chip pitch is consistent with the substrate matrix rows and columns.

[0036] Step 6: Apply UV adhesive film again, turning the chip electrodes toward the UV adhesive film surface. The method is as follows: Use a transparent glass bump carrier, heat the UV adhesive film and adhere it to the bump carrier. Place the bump carrier with the UV adhesive film close to the micro-vacuum chuck wafer, placing the back of the wafer against the UV adhesive film. Reduce the vacuum until it is closed, and transfer the entire wafer to the bump carrier, with each wafer corresponding to a bump; the electrodes face upward.

[0037] Step 7: This project adopts the tin spraying process on the surface of the substrate chip fixed solder joints. The thickness of the tin layer is 5~30μm. The chip is fixed with adhesive glue at the middle point between the two fixed solder joints of the chip. The amount of glue is controlled to ensure that the chip does not touch the solder joint range after attachment.

[0038] Step 8: Place the bumps on the UV film of the bump carrier corresponding to the chip on the chip fixing position on the substrate, so that the chip fixing adhesive on the substrate in the middle of the chip electrode surface is adhered, and the two tin electrodes of the chip correspond to the tin-sprayed solder points of the chip fixing position of the substrate, with an error of ±5μm; the chip electrodes are in contact with each chip fixing solder point on the substrate.

[0039] Step 9: Turn on the UV light and adjust the UV power to illuminate the transparent bump carrier until the UV film adhesion is reduced to less than the adhesion of the wafer adhesive holding the wafer to the substrate. Then, transfer the entire wafer electrode toward the solder joint and transfer it to the corresponding position on the substrate. Repeat this process to transfer additional wafers.

[0040] Step 10: Adjust the spacing and laser power of the multiple parallel laser beams of the laser welding head to align the multiple laser beams of the laser head with the chip electrodes on the substrate. The laser welding head is precisely driven by a high-speed magnetic levitation motor and cooperates with image recognition and positioning. The multiple laser beams are instantly heated to 250~350℃ at the chip electrodes, melting the tin of the chip electrodes and then forming a connection with the molten tin of the substrate welding position. The welding time of each electrode is adjustable from about 10 to 60ms. After welding, the display device is formed as a finished product.

[0041] Among them, the pitch adjustment device used in the fifth step is as follows Figure 1-4As shown, the pitch adjustment device includes a fixed frame formed by a motor mounting plate 2 on the left, and upper baffles 5, lower baffles 4, and right baffles 16. A servo motor 1 is mounted on the motor mounting plate 2, with an in-situ fixing plate 10 mounted on the upper baffles 5 and lower baffles 4 to limit the return of the eight pitch actuator plates 11. A screw 7 is mounted axially in the middle of the fixed frame, with two circular guide rods 6 symmetrically mounted above and below the screw 7. The guide rods 6 provide motion guidance for the output plate 3, the dynamic pitch adjustment plate 14, and the eight pitch actuator plates 11. The output plate 3 is mounted on the screw 7 and can move left and right. The guide rods 6 and screw 7 ensure that the output plate 3 and the pitch actuator plates 11 do not deviate from their positions. The servo motor 1 drives the screw 7 through a coupling, which drives the output plate 3 to output force. The eight parallel pitch actuator plates 11 are also mounted on the screw 7. During movement, the screw 7 drives the eight pitch actuator plates 11 horizontally to the right. The dynamic pitch adjustment plate 14 is installed on the output plate 3. The pitch actuator plates 11 and the in-situ pitch limit sleeves 17 are alternately assembled on the guide rods 6. Each pitch actuator plate 11 forms a triangular support stability structure through the screw rod 7 and two guide rods 6 to ensure that the pitch actuator plates 11 remain parallel. A dynamic pitch plate movement clearance hole 12 is arranged in the middle of the pitch actuator plate 11. Among them, the dynamic pitch plate movement clearance holes 12 in the middle of the 1st to 7th pitch actuator plates 11 from left to right are slightly larger than the step width corresponding to the dynamic pitch adjustment plate 14, so that the dynamic pitch adjustment plate 14 can pass through the corresponding pitch actuator plate 11; in addition, the dynamic pitch plate movement clearance hole 12 in the middle of the eighth pitch actuator plate 11 is smaller than the end of the dynamic pitch adjustment plate 14, so that when the dynamic pitch adjustment plate 14 moves to the right, it can push the eighth pitch actuator plate 11 to move to the right until it hits the rightmost step of the fixed pitch adjustment plate 8. The first step of the dynamic pitch adjustment plate 14, from left to right, is larger than the clearance hole of the seventh pitch actuator plate 11, allowing it to push the seventh pitch actuator plate 11 to the right. The second step of the dynamic pitch adjustment plate 14 pushes the sixth pitch actuator plate 11 to the right, and so on. When the output plate 3 drives the dynamic pitch adjustment plate 14 to push the eight pitch actuator plates 11 to the right, they sequentially contact the steps of the fixed pitch adjustment plate 8 and are fixed by the fixed spring pieces 9 on the fixed pitch adjustment plate 8, completing the pitch adjustment. When the pitch needs to return to its original position, the servo motor 1 drives the output plate 3 and the screw rod 7 to return, and the output plate 3 drives the pitch adjustment plate 14 to move to the left; the screw rod 7 drives the pitch execution return sleeve 18 to move to the left, and the pitch execution return sleeve 18 drives the pitch execution plate 11 to move to the left after overcoming the resistance of the fixed spring piece 9, until the first pitch execution plate 11 hits the original position fixed plate 10, and then the original position pitch limit sleeve 17 hits the left pitch execution plate 11 in turn, and finally the pitch execution plates 11 of the 1st to 8th blocks are all returned to their initial positions, and the spacing between each pitch execution plate 11 is the length of the original position pitch limit sleeve 17.

[0042] The pitch adjustment device is integrally mounted on the wafer alignment mechanism 20 and driven by the wafer alignment servo motor 19. The wafer alignment mechanism 20 drives the pitch adjustment device in a left-right reciprocating motion. This pitch adjustment device can achieve two pitch variations: one pitch when the pitch actuator plate 11 is in its original position on the left, and another pitch when it moves rightward until it encounters the steps of the fixed pitch adjustment plate 8. The wafer alignment mechanism 20 is a conventional mechanical device that achieves left-right vibration or shaking.

[0043] Principle: When the mechanism is not in motion, the servo motor 1 drives the pitch execution return sleeve 18 to make the pitch execution plate 11 contact the in-situ fixed plate 10 and be limited to the in-situ position. The distance between the pitch execution plates 11 is m. Figure 10 As shown, after the wafer has been precisely expanded to the required spacing of m±0.02mm, it is held by the micro-vacuum chuck. The pitch actuator plate 11 is then inserted into the row or column spacing of the wafer on the micro-vacuum chuck. The wafer alignment servo motor 19 drives the wafer alignment mechanism 20, which in turn moves the mechanism left or right, aligning the wafer rows or columns. The servo motor 1 is activated to drive the output plate 3, pushing the dynamic pitch adjustment plate 14 rightward. The plate passes through the dynamic pitch motion clearance holes 12 between the first to seventh pitch actuator plates 11, from left to right. The right edge of the dynamic pitch adjustment plate 14 strikes the eighth pitch actuator plate 11 on the far right. The output step 15 of the dynamic pitch adjustment plate 14 then strikes the first to seventh pitch actuator plates 11, reducing the spacing between the pitch actuator plates 11 to n. The pitch actuator plates 11 are then secured by the fixed springs 9 on the fixed pitch adjustment plate 8, thereby reducing the wafer row or column spacing to n. Then, the chip alignment servo motor 19 drives the chip alignment motion mechanism 20 to drive the pitch adjustment device to move back and forth twice, so that the pitch execution plate 11 drives the chip row or column to move as a whole, thereby completing the pitch change and alignment. To repeat the next action, the servo motor 1 rotates to drive the pitch execution return sleeve 18 to pull the pitch execution plate 11 to overcome the resistance of the fixed spring piece 9, and move to the left in turn. The pitch execution plate 11 contacts the original pitch limit sleeve 17, and until the first pitch execution plate 11 touches the original fixed plate 10, the pitch adjustment device stops moving, the pitch execution plate spacing is changed to m, and the next action is repeated. When a different pitch needs to be adjusted, it is only necessary to replace the sliding pitch adjustment plate, the fixed pitch adjustment plate, and the original pitch limit sleeve.

[0044] Example 2

[0045] like Figure 5-8The figure shows another pitch adjustment device. A servo motor 1 is mounted on a motor mounting plate 2. The motor mounting plate 2 forms a fixed frame with the upper baffle 5, lower baffle 4, and right baffle 16. A motor output plate 07 is mounted on one side of the fixed frame. This plate is connected to a screw 7, which is connected to the servo motor 1. Two track plates 06 are located between the upper baffle 5 and the lower baffle 4, and are positioned on either side of the screw 7. A track groove 09 is defined in the center of each track plate 06. The servo motor 1 drives the screw 7 to rotate via a coupling. The motor output plate 07 is mounted on the screw 7. The rotation of the servo motor 1 drives the motor output plate 07 to move left and right.

[0046] The pitch adjustment device also includes a mesh telescopic arm and multiple pitch actuator plates 11. The mesh telescopic arm includes an active joint 100, six sliding joints 110, and a main fixed joint 130, which are sequentially slidably connected to the track groove 09. A mesh robotic arm 150 is connected between the active joint 100, the six sliding joints 110, and the main fixed joint 130. The mesh robotic arm 150 is telescopic via multiple intermediate joints 120. The active joint 100 is connected to the motor output plate 07, and the main fixed joint 130 is mounted on the right baffle 05 via a fixed plate 140. The active joint 100, sliding joint 110, and main fixed joint 130 each carry a pitch actuator plate 11. The motor output plate 07 is connected to the mesh telescopic arm via the active joint 100.

[0047] The output of the servo motor 1 drives the transmission screw 7 to move, and the screw 7 drives the motor output plate 07 to move left and right. The motor output plate 07 then pushes the mesh telescopic arm to move left and right, driving the pitch execution plate 11 to move, thereby changing the pitch between the pitch execution plates 11.

[0048] The pitch adjustment device is integrally mounted on the wafer alignment mechanism 20 and driven by the wafer alignment servo motor 19. The wafer alignment mechanism 20 drives the pitch adjustment device in a left-right reciprocating motion, thereby aligning the wafers at the appropriate pitch. The wafer alignment mechanism 20 is a conventional mechanical device that achieves left-right vibration or shaking.

[0049] The servo motor 1 drives the motor output plate 07 through the screw rod 7. The motor output plate 07 drives the active joint 100 to move along the track groove 09 of the track plate 06, driving the mesh robot arm 150 and the sliding joint 110 to move along the track groove 09. The main fixed joint 130 is fixed by the fixed plate 140 and does not move. The servo motor 1 drives the mesh robot arm 150 to move telescopically. The mesh robot arm 150 drives the pitch actuator plate 11 to change different pitches. When the servo motor 1 pulls the mesh robot arm 150 to the left, the spacing of the pitch actuator plate 11 increases. Figure 6As shown in a; when the servo motor 1 pushes the pitch actuator plate 11 to the right, the pitch of the pitch actuator plate 11 gradually becomes smaller, and when it moves to the middle, as shown in Figure 7 When the servo motor 1 pushes the motor output plate 07 to drive the mesh robot 150 to move to the rightmost side, the pitch execution plate 11 has the smallest spacing, as shown in FIG. Figure 8 As shown, it is c, and the pitch sizes are a>b>c.

[0050] In practice, after the wafers have been precisely expanded to the desired spacing and are held by the micro-vacuum chuck, the motor-driven output board 07 drives the meshed robotic arm 150 and the pitch actuator board 11 to the appropriate spacing, allowing the pitch actuator board 11 to be inserted into the rows or columns of wafers on the micro-vacuum chuck. The wafer alignment servo motor 19 then drives the wafer alignment mechanism 20 to drive the entire pitch adjustment device, aligning the rows or columns of wafers. The pitch adjustment device's servo motor 1 then drives the pitch actuator board 11 to adjust to the desired spacing.

[0051] The above content is a further detailed description of the present invention in combination with a specific preferred embodiment. It cannot be considered that the specific embodiments of the present invention are limited to this. For ordinary technicians in the technical field to which the present invention belongs, they can make several simple deductions or substitutions without departing from the present invention, which should be regarded as belonging to the scope of patent protection determined by the submitted claims of the present invention.

Claims

1. A micro chip pitch adjustment device, characterized in that: The device comprises a fixed frame, wherein a pitch adjustment mechanism capable of moving left and right is provided in the fixed frame, wherein the pitch adjustment mechanism comprises a plurality of parallel pitch actuator plates, wherein the spacing between two adjacent pitch actuator plates can be elongated or contracted at equal distances under the driving mechanism, and a limiting mechanism is provided in the fixed frame, wherein the limiting mechanism is used to position the pitch actuator plates after elongation or contraction, and the pitch actuator plates are used to be inserted into the rows or columns of tiny chips on the suction cup to perform pitch adjustment; A motion giving way hole is arranged in the middle of the pitch actuator plate, and the output plate, the dynamic pitch adjustment plate, and multiple pitch actuator plates are connected to the screw rod in sequence, the dynamic pitch adjustment plate is connected to the output plate, and one end of the screw rod connected to the output plate is connected to a driving device, and the output plate drives the dynamic pitch adjustment plate along the screw rod into the motion giving way hole under the action of the driving device, and the dynamic pitch adjustment plate pushes the multiple pitch actuator plates step by step to stretch the pitch actuator plates to the same spacing; a pitch actuator plate away from the output plate is connected to a pitch actuator return sleeve, and the pitch actuator return sleeve is driven by the screw rod to push the multiple pitch actuator plates to retract toward the output plate; An output plate is provided on one side of the fixed frame, the output plate is connected to a screw, the screw is connected to a driving device, and tracks are provided on both sides of the screw; the pitch adjustment mechanism includes a mesh telescopic arm and a plurality of pitch execution plates, the mesh telescopic arm includes an active joint, a plurality of sliding joints and a main fixed joint that are sequentially slidably connected to the track, a mesh arm is connected between the plurality of sliding joints, and the mesh arm is telescopic through a plurality of intermediate joints; The active joint is connected to the output plate, and the main fixed joint is fixedly connected to an end away from the output plate; the active joint, the sliding joint, and the main fixed joint all carry a pitch execution plate.

2. A micro chip pitch adjustment device according to claim 1, characterized in that: The upper and lower edges of the dynamic pitch adjustment plate are symmetrically provided with first steps, and the first steps are gradually retracted toward the direction of the screw rod from the output plate to the pitch execution plate. The upper and lower walls within the fixed frame are symmetrically provided with fixed pitch adjustment plates, and the edges of the fixed pitch adjustment plates are provided with second steps that engage with the first steps; the height of the pitch execution plate is matched with the distance between the upper and lower second steps in sequence.

3. The micro chip pitch adjustment device according to claim 2, characterized in that: The limiting mechanism includes an in-situ fixing plate, an in-situ pitch limiting sleeve and a fixed spring piece; the in-situ fixing plate is arranged on the upper and lower walls of the fixed frame, and is located between the dynamic pitch adjustment plate and the pitch execution plate adjacent to the dynamic pitch adjustment plate, and is used for overall limiting when the pitch execution plate retracts; the in-situ pitch limiting sleeve is arranged on the guide rod connecting multiple pitch execution plates, and is located between two adjacent pitch execution plates, and is used for limiting between the two adjacent pitch execution plates; the fixed spring piece is arranged on the second step.

4. The micro chip pitch adjustment device according to claim 1, characterized in that: The main fixed joint is arranged on the fixed frame through a fixing plate.

5. A micro chip pitch adjustment device according to any one of claims 1 to 4, characterized in that: The pitch adjustment device is connected to an alignment motion mechanism, and the alignment motion mechanism is used to drive the pitch adjustment device to move left and right as a whole to align the tiny chips.

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