An intelligent terminal radio frequency antenna and its manufacturing process

Abstract

The present invention discloses an intelligent terminal radio frequency antenna and its manufacturing process, which relates to the field of electronic communication technology. The manufacturing process of the intelligent terminal radio frequency antenna includes: selecting a housing; spraying liquid metal slurry on the inner and outer surfaces of the housing and in the through holes reserved at corresponding positions; using laser patterning on the liquid metal slurry located on the inner and outer surfaces of the housing, and after the liquid metal slurry is cured, forming a liquid metal antenna and a liquid metal feed point connected by liquid metal metallized through holes; wherein, the liquid metal antenna is located on the outer surface of the housing, and the liquid metal feed point is located on the inner surface of the housing; coating at least a first insulating encapsulation protection layer covering the liquid metal antenna on the outer surface of the housing. The embodiments of the present invention can meet the formation of antennas on three-dimensional structural surfaces of the housing, have low selectivity requirements for the housing material, can meet the formation of antennas on materials other than PC and ABS materials, and the spraying process in this application can be formed at one time without repeated overprinting, with high overall efficiency and high yield.

Description

Technical Field

[0001] The present invention belongs to the technical field of electronic communication, and particularly relates to a radio frequency antenna for an intelligent terminal and a manufacturing process thereof. Background Art

[0002] Nowadays, the development of electronic products is changing with each passing day, with more and more powerful functions, and the products are becoming smaller and thinner. As one of the important components of electronic products, the performance and size of the antenna are directly related to the quality of electronic products. With the miniaturization development of wireless communication products, built-in antennas have gradually replaced external antennas and have now become the mainstream of antenna design.

[0003] The existing manufacturing processes of built-in antennas mainly include FPC (Flexible Printed Circuit Board) process, LDS (laser direct structuring) process and PDS (printing direct structuring) process. The FPC process is to use a flexible substrate to make a printed circuit board with an antenna pattern and bond the printed circuit board inside the housing; the LDS process is to use a special plastic particle injection molded housing material to be activated by a laser machine and then electrolessly plated with copper, and then nickel plated after copper plating; the PDS process is to print a pattern on the housing by using a special rubber head through a pad printing machine.

[0004] At present, there are many deficiencies in the antenna manufacturing processes used; for the FPC process, the FPC antenna can be pasted on a plane or a two-dimensional curved surface, but it cannot be pasted on a three-dimensional or higher curved surface and a connection surface provided with a feed point. Another is that the thickness will affect the overall stacking of the machine. For the LDS process, there are high requirements for the substrate, and only special special raw materials can be used, such as PC and ABS materials, and it cannot be achieved on special materials such as glass, ceramic, zirconia and sapphire glass. For the PDS process, first, different pad printing screens need to be made for different antennas, and the pad printing thickness is extremely thin, and repeated overprinting is required to reach the target thickness, and the film printed last time needs to be pre-cured before overprinting, and the overall efficiency is low. Summary of the Invention

[0005] In view of this, an object of the present invention is to provide a manufacturing process of a radio frequency antenna for an intelligent terminal to solve the problems of large thickness, high requirement for substrate selection and low manufacturing efficiency in the prior art.

[0006] In some illustrative embodiments, the manufacturing process of the intelligent terminal radio frequency antenna includes: selecting a housing; spraying liquid metal slurry on the inner and outer surfaces of the housing and in the vias reserved at corresponding positions; using laser patterning on the liquid metal slurry located on the inner and outer surfaces of the housing, and after the liquid metal slurry is cured, forming a liquid metal antenna and a liquid metal feed point connected by liquid metal metallized vias; wherein, the liquid metal antenna is located on the outer surface of the housing, and the liquid metal feed point is located on the inner surface of the housing; coating a first insulating encapsulation protection layer on the outer surface of the housing to at least cover the liquid metal antenna.

[0007] In some optional embodiments, before coating the first insulating encapsulation protection layer on the outer surface of the housing to at least cover the liquid metal antenna, it further includes: forming at least one metal plating layer on the surface of at least one of the liquid metal antenna, the liquid metal feed point, and the liquid metal metallized via.

[0008] Another object of the present invention is to propose an intelligent terminal radio frequency antenna to solve the problems in the prior art.

[0009] In some illustrative embodiments, the intelligent terminal radio frequency antenna includes: a housing; a liquid metal antenna provided on the outer surface of the housing, and a liquid metal feed point provided on the inner surface of the housing; the liquid metal antenna is connected to the liquid metal feed point through a liquid metal metallized via.

[0010] In some optional embodiments, the liquid metal antenna, the liquid metal feed point, and the liquid metal metallized via are an integrally formed structure; its formed material structure includes: a resin matrix having three-dimensional cross-linked pores, and liquid metal confined within the three-dimensional cross-linked pores.

[0011] In some optional embodiments, the formed material structure further includes: solid metal particles confined within the three-dimensional cross-linked pores and forming a metal infiltration effect with the liquid metal.

[0012] In some optional embodiments, a first insulating encapsulation protection layer is provided on the liquid metal antenna; the first insulating encapsulation protection layer at least covers the liquid metal antenna.

[0013] In some optional embodiments, at least one metal plating layer is formed on the surface of at least one of the liquid metal antenna, the liquid metal feed point, and the liquid metal metallized via.

[0014] In some optional embodiments, the intelligent terminal radio frequency antenna further includes: a liquid metal trace provided on the inner surface of the housing and connected to the liquid metal feed point.

[0015] In some optional embodiments, the smart terminal radio frequency antenna further includes: a second insulating encapsulation protection layer covering the liquid metal feed point and part of the liquid metal traces; and part of the liquid metal traces not covered by the second insulating encapsulation protection layer serves as the electrical contact point of the liquid metal feed point.

[0016] In some optional embodiments, the thickness of the liquid metal antenna is 3μm - 20μm.

[0017] Compared with the prior art, the present invention has the following advantages:

[0018] In the embodiments of the present invention, by directly spraying a conductive paste on the surface of the housing and then realizing the liquid metal antenna, the liquid metal feed point and the liquid metal metallized via holes therebetween through laser patterning, it is possible to meet the formation of the antenna on the three-dimensional structural surface of the housing, with low selectivity requirements for the housing material, and it is possible to meet the formation of the antenna on materials other than PC and ABS materials. Moreover, the spraying process in the present application can be formed at one time compared with the pad printing process, without repeated overprinting, with high overall efficiency and high yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a flowchart of the manufacturing process of the smart terminal radio frequency antenna in the embodiments of the present invention;

[0020] Figure 2 is a schematic structural diagram of the smart terminal radio frequency antenna in the embodiments of the present invention;

[0021] Figure 3 is a perspective view of the near-field antenna located inside the housing in the embodiments of the present invention;

[0022] Figure 4 is a schematic structural diagram of the cured liquid metal paste in the embodiments of the present invention;

[0023] Figure 5 is a schematic structural diagram of the smart terminal radio frequency antenna in the embodiments of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0024] The following description and the accompanying drawings fully illustrate specific embodiments of the present invention, enabling those skilled in the art to practice them. Other embodiments may include structural, logical, electrical, process, and other changes. Examples merely represent possible variations. Unless explicitly required, individual components and functions are optional, and the order of operations may vary. Parts and features of some embodiments may be included in or replace parts and features of other embodiments. The scope of the embodiments of the present invention includes the entire scope of the claims and all available equivalents of the claims. Herein, these embodiments of the present invention may be individually or collectively referred to by the term "invention" merely for convenience, and if in fact more than one invention is disclosed, it is not intended to automatically limit the scope of the application to any single invention or inventive concept.

[0025] It should be noted that, without conflict, the technical features in the embodiments of the present invention may be combined with each other.

[0026] An embodiment of the present invention discloses a manufacturing process for a radio frequency antenna of an intelligent terminal, as Figure 1 shown, Figure 1 is a flowchart of the manufacturing process for the radio frequency antenna of the intelligent terminal in the embodiment of the present invention. As shown in this flowchart, the manufacturing process for the radio frequency antenna of the intelligent terminal includes:

[0027] Step S11: Select a housing;

[0028] Step S12: Spray liquid metal slurry on the inner and outer surfaces of the housing and in the through holes reserved at corresponding positions respectively;

[0029] Among them, the liquid metal slurry may be a liquid metal slurry obtained by uniformly mixing at least liquid metal and resin.

[0030] Step S13: Pattern the liquid metal slurry on the inner and outer surfaces of the housing by laser. After the patterned liquid metal slurry is cured, a liquid metal antenna and a liquid metal feed point connected by a liquid metal metallized through hole are formed;

[0031] Among them, the liquid metal antenna is located on the outer surface of the housing, and the liquid metal feed point is located on the inner surface of the housing; the liquid metal metallized through hole refers to the structure formed after the liquid metal slurry in the through hole is cured.

[0032] Step S14: Coat a first insulating encapsulation protection layer on the outer surface of the housing to at least cover the liquid metal antenna.

[0033] In the embodiments of the present invention, by directly spraying conductive paste on the surface of the housing, and then realizing the liquid metal antenna, the liquid metal feeding point and the liquid metal metallized via between the two through laser patterning, it is possible to meet the formation of the antenna on the three-dimensional structural surface of the housing, with low selectivity requirements for the housing material, and it can meet the formation of the antenna on materials other than PC and ABS materials. Moreover, the spraying process in this application can be formed at one time compared with the pad printing process, without repeated overprinting, with high overall efficiency and high yield rate.

[0034] Specifically, the housing selected in the embodiments of the present invention is a housing of an intelligent communication device, which is not limited to mobile phone housings, tablet computer housings, computer housings, watch housings, bracelet housings, etc. And the liquid metal paste selected in the embodiments of the present invention is a mixture of liquid metal and resin. Therefore, the materials for the housing are not limited to PC, ABS, plastics, glass, ceramics, zirconia, and sapphire glass, etc. The liquid metal paste can achieve good adhesion on the above materials. Among them, the mobile phone housing can be composed of multiple housing components spliced together, or an integrally formed housing structure can be selected.

[0035] In step S12 of the embodiments of the present invention, the position where the liquid metal paste is sprayed on the housing is a preset antenna area, and a through hole penetrating both the inside and outside of the housing is reserved in the antenna area of the housing. When spraying the liquid metal paste, the liquid metal can be sprayed onto the preset antenna area on the outer surface and into the through hole, thereby forming the internal and external conductive structures of the housing. The liquid metal paste in this embodiment is formed at one time through the spraying process. Compared with the pad printing process in the PDS process, it greatly improves the process production efficiency and avoids the process of pre-curing the previously printed ink during overprinting, reducing the process complexity.

[0036] In some embodiments, during the spraying process, a mask can be used to reduce the impact of spraying on non-antenna areas, which is beneficial for the subsequent laser patterning. Among them, the mask can be selected to cover the surface of the housing in the form of a temporary film, and expose the antenna area to be sprayed.

[0037] The spraying in the embodiments of the present invention can be achieved through an atomizing nozzle or a rotating nozzle, and the spraying thickness of such nozzles is relatively easy to control; the thickness of the liquid metal antenna in the embodiments of the present invention can be controlled between 3μm - 20μm, and it can ensure the structural stability and electrical performance stability of the liquid metal antenna within a relatively thin thickness range. Among them, a dot nozzle can be used for spraying at the through hole to ensure the quality of through hole metallization.

[0038] In some embodiments, in the embodiments of the present invention, before step S12, the reserved antenna area on the housing can be roughened, such as by sandblasting or other methods, so as to further improve the adhesion strength of the liquid metal paste on the housing.

[0039] In some embodiments, an inner wall with a certain thickness can be formed by spraying liquid metal paste into the vias, so as to form liquid metal metallized vias. Alternatively, liquid metal metallized vias can be formed by filling the vias completely.

[0040] In some embodiments, the liquid metal feed point on the inner side of the housing selects the side of the liquid metal metallized via facing the inner side of the housing. This liquid metal feed point can be electrically connected to the communication chip element through a shrapnel or a jumper. In some other embodiments, the liquid metal feed point can also be realized by spraying additional liquid metal paste connected to the liquid metal metallized via on the inner side of the housing.

[0041] Among them, liquid metal traces connected to the liquid metal feed point can also be sprayed on the inner side of the housing (the patterning of the traces can be achieved by laser engraving in step S13), so as to change the relative position of the liquid metal feed point on the inner side of the housing, thereby simplifying the connection complexity between the communication components inside the housing and the liquid metal antenna. Further, a second insulating encapsulation protective layer can be coated on the liquid metal traces and liquid metal feed points inside the housing. This second insulating encapsulation protective layer can cover the liquid metal feed point and part of the liquid metal traces, so as to minimize the scratching of the liquid metal material by the components inside the housing. The part of the liquid metal trace not blocked by the second insulating encapsulation protective layer serves as the electrical contact point of the liquid metal feed point (i.e., can serve as the new feed point of the liquid metal antenna).

[0042] Specifically, in step S13 of the embodiment of the present invention, laser patterning of the liquid metal paste on the inner and outer surfaces of the housing is to ablate the unnecessary liquid metal paste according to the target pattern. Among them, the type selection, power intensity, and speed of the laser can be selected and set according to the material of the liquid metal paste, the precision of the pattern, and the thickness of the liquid metal paste. Specifically, the laser can be an infrared laser engraving machine, an ultraviolet laser engraving machine, a green laser engraving machine, a lamp-pumped YAG laser engraving machine, a semiconductor side-pumped YAG laser engraving machine, a semiconductor end-pumped YAG laser engraving machine, a fiber laser engraving machine, and a CO2 laser engraving machine; specifically, the laser power setting range is between 5W and 150W; specifically, the moving speed of the laser operation is set to 0.5 cm / s - 10 cm / s. Under the above set parameters, the production of relatively precise millimeter-wave antenna patterns can be satisfied. At the same time, during the laser etching process, within this function range and operating speed, the influence on the liquid metal paste around the ablation points can be reduced.

[0043] Among them, a non-transparent material is selected for the housing. When the laser power and speed can achieve the ablation effect, the laser power is preferably set to a relatively small value, and the speed is set to a relatively high value. The liquid metal slurry can be etched layer by layer by means of repeated laser engraving, so as to realize the patterning of the liquid metal slurry, thereby reducing the impact of laser engraving on the non-transparent housing.

[0044] The liquid metal slurry in the embodiment of the present invention can be obtained by at least fully mixing liquid metal and resin. The liquid metal therein is dispersed into micro-nano scale metal droplets in the resin system, greatly reducing the surface tension and fluidity of the liquid metal, and then can fully fill the three-dimensional cross-linked pores of the resin matrix and be restricted and bound within the three-dimensional cross-linked pores of the resin matrix; the resin is formed from the resin with liquid metal dispersed therein through high-temperature or light curing to form a resin matrix with a certain structural strength and three-dimensional cross-linked pores.

[0045] The liquid metal slurry in the embodiment of the present invention can be cured by natural curing, high-temperature sintering curing and specific light curing. Preferably, the sintering curing method can be selected, and this curing method is efficient. Among them, the liquid metal slurry in the embodiment of the present invention can form a resin matrix with three-dimensional cross-linked pores and liquid metal bound within the three-dimensional cross-linked pores after curing. In the embodiment of the present invention, the liquid metal is bound by the resin matrix, thereby greatly improving the structural stability of the cured liquid metal slurry.

[0046] In some embodiments, the liquid metal slurry may further contain solid metal particles that have a metal wetting effect with the liquid metal, and they can be fully mixed into the resin together with the liquid metal. Specifically, the solid metal particles are micro-nano scale solid metal particles, and their solid form can maintain structural stability under the restraint of the resin matrix, and their metal properties can produce a metal wetting effect with the liquid metal, thereby further binding the liquid metal through the wetting effect and ensuring the structural stability of the liquid metal slurry.

[0047] The solid metal in the embodiment of the present invention can select a metal material that can wet the liquid metal. Among them, a metal material that does not react with the liquid metal to form an alloy can be selected, or a metal material that reacts with the liquid metal to form an alloy can also be selected. Preferably, the solid metal particles are made of a metal material with a conductivity better than that of the liquid metal. In this way, the solid metal can not only improve the structural stability of the liquid metal in the resin matrix, but also enhance the overall electrical properties of the liquid metal.

[0048] Preferably, the solid metal particles in the embodiment of the present invention can select micro-nano scale solid metal particles such as copper, silver, gold, silver-coated copper, etc., and their particle structures are not limited to linear, sheet-like, branched, spherical, etc.

[0049] With respect to the above-mentioned embodiment, the liquid metal slurry in the embodiment of the present invention can also be selected as a conductive slurry obtained by fully mixing micro-nano-scale solid metal particles, liquid metal and resin; wherein the solid metal particles can not only improve the structural stability of the liquid metal after the resin is cured, but also the addition of solid metal particles to the conductive slurry system makes it easier for the liquid metal to be fully mixed, and can reduce the degree of self-aggregation and phase separation of the liquid metal in the resin system.

[0050] Preferably, the liquid metal slurry in the embodiment of the present invention can be directly mixed with the conductive silver paste sold on the market by using liquid metal; wherein the weight ratio of the liquid metal to the conductive silver paste in the liquid metal slurry is selected to be 1:30 to 30:1. Specifically, the weight ratio of the liquid metal to the conductive silver paste in the embodiment of the present invention can be 1:30-30:1. Exemplarily, the weight ratio of the liquid metal to the conductive silver paste can be 1:30, 1:25, 1:20, 1:15, 1:10, 1:5, 1:3, 1:2, 2:3, 4:5, 1:1, 4:4, 3:2, 2:1, 3:1, 5:1, 10:1, 15:1, 20:1, 25:1, 25:1 or 30:1.

[0051] Preferably, the weight ratio of liquid metal to conductive silver paste is selected to be 1:20 to 1:2; the liquid metal paste with this weight ratio can exhibit good flexibility after solidification, and the liquid metal will be bound in the silver paste system as much as possible, so that the structure of the formed liquid metal conductive pattern is more stable and it is not easy for the liquid metal to migrate out of the conductive pattern when bent and compressed.

[0052] The liquid metal in the embodiment of the present invention can be a low-melting-point metal that is liquid at room temperature, and the low-melting-point metal can specifically be a single substance of gallium, a gallium-based alloy, etc.; gallium-based alloys such as gallium-indium eutectic alloys, gallium-tin eutectic alloys, gallium-indium-tin eutectic alloys, gallium-indium-tin-zinc eutectic alloys, etc. In some other embodiments, the liquid metal in the embodiment of the present invention can also be a low-melting-point metal that is solid at room temperature, specifically, the melting point of the low-melting-point metal is above room temperature and below 300°C, such as bismuth-based alloys, tin-based alloys, indium-based alloys, etc. The surface treatment method in the embodiment of the present invention can also be implemented on such low-melting-point metals.

[0053] In some embodiments, before coating the outer surface of the shell with a first insulating packaging protective layer that at least covers the liquid metal antenna, the process may further include: forming at least one metal plating layer on the surface of at least one of the liquid metal antenna, the liquid metal feed point, and the liquid metal metallized via, so as to increase the surface strength of the liquid metal slurry. The metal plating layer may be a copper plating layer, a nickel plating layer, or a gold plating layer, which may be specifically electroplated or chemically plated. The formation process of the metal plating layer is prior art and will not be described in detail herein.

[0054] In the embodiments of the present invention, the first insulating encapsulation protective layer and the second insulating encapsulation protective layer can be selected from insulating encapsulation paints, non-conductive metal oxides, etc. in the prior art.

[0055] Another object of the present invention is to provide a smart terminal radio frequency antenna to solve the problems in the prior art. The smart terminal radio frequency antenna can be obtained, but not limited to, through the manufacturing process of the above-mentioned smart terminal radio frequency antenna of the present application, or can also be obtained through other processes in the prior art. Specifically, Figure 2-3 the smart terminal radio frequency antenna includes: a housing 1; a liquid metal antenna 2 provided on the outer surface of the housing 1, and a liquid metal feed point 4 provided on the inner surface of the housing 1; the liquid metal antenna 2 is connected to the liquid metal feed point 4 through a liquid metal metallized via 3.

[0056] Such as Figure 4 in some embodiments, the liquid metal antenna, the liquid metal feed point and the liquid metal metallized via are an integrally formed structure (for example, spray-formed integrally); the formed material structure includes: a resin matrix 101 having three-dimensional cross-linked pores and liquid metal 102 confined within the three-dimensional cross-linked pores.

[0057] In some embodiments, the formed material structure further includes: solid metal particles confined within the three-dimensional cross-linked pores and forming a metal infiltration effect with the liquid metal.

[0058] In some embodiments, a first insulating encapsulation protective layer 5 is provided on the liquid metal antenna; the first insulating encapsulation protective layer 5 covers at least the liquid metal antenna 2.

[0059] In some embodiments, at least one surface of the liquid metal antenna, the liquid metal feed point and the liquid metal metallized via is formed with at least one metal plating layer.

[0060] In some embodiments, the smart terminal radio frequency antenna further includes: a liquid metal trace 6 provided on the inner surface of the housing 1 and connected to the liquid metal feed point.

[0061] In some embodiments, the smart terminal radio frequency antenna further includes: a second insulating encapsulation protective layer 7 covering the liquid metal feed point and a part of the liquid metal trace 6; the part of the liquid metal trace 6 not covered by the second insulating encapsulation protective layer 7 serves as the electrical contact point of the liquid metal feed point.

[0062] In some embodiments, the thickness of the liquid metal antenna, the liquid metal feed point and the liquid metal metallized via is 3μm - 20μm.

[0063] Those skilled in the art should also understand that all of the various illustrative logical blocks, modules, circuits, and algorithmic steps described in connection with the embodiments herein can be implemented as electronic hardware, computer software, or combinations thereof. To clearly illustrate the interchangeability of hardware and software, the various illustrative components, blocks, modules, circuits, and steps have been generally described in terms of their functionality above. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the overall system. Skilled artisans may implement the described functionality in a flexible manner for each particular application, but such implementation decisions should not be construed as departing from the scope of the present disclosure.

Claims

1. A manufacturing process for a radio frequency antenna of an intelligent terminal, characterized in that, Comprising: Select a housing; Spray liquid metal paste on the pre-set antenna areas on the inner and outer surfaces of the housing; wherein, through holes penetrating both sides of the housing are reserved in the antenna areas, and inner and outer conductive structures of the housing are formed during spraying; Use laser ablation to remove the unnecessary liquid metal paste on the inner and outer surfaces of the housing. After the remaining liquid metal paste is cured, a liquid metal antenna and a liquid metal feed point connected by liquid metal metallized vias are formed; Wherein, the liquid metal antenna is located on the outer surface of the housing, and the liquid metal feed point is located on the inner surface of the housing; Coat a first insulating encapsulation protection layer on the outer surface of the housing to at least cover the liquid metal antenna.

2. The manufacturing process of the intelligent terminal radio frequency antenna according to claim 1, wherein, Before coating the first insulating encapsulation protection layer on the outer surface of the housing to at least cover the liquid metal antenna, it further includes: Form at least one layer of metal coating on the surface of at least one of the liquid metal antenna, the liquid metal feed point, and the liquid metal metallized via.

3. An intelligent terminal radio frequency antenna manufactured by the manufacturing process of the intelligent terminal radio frequency antenna described in claim 1 or 2, characterized in that, Comprising: Housing; A liquid metal antenna provided on the outer surface of the housing, and a liquid metal feed point provided on the inner surface of the housing; The liquid metal antenna is connected to the liquid metal feed point through a liquid metal metallized via.

4. The intelligent terminal radio frequency antenna according to claim 3, characterized in that The liquid metal antenna, the liquid metal feed point, and the liquid metal metallized via are an integrally formed structure; Its formed material structure includes: a resin matrix having three-dimensional cross-linked pores, and liquid metal confined within the three-dimensional cross-linked pores.

5. The intelligent terminal radio frequency antenna according to claim 4, wherein The formed material structure further includes: solid metal particles confined within the three-dimensional cross-linked pores and forming a metal infiltration effect with the liquid metal.

6. The intelligent terminal radio frequency antenna according to claim 3, wherein A first insulating encapsulation protection layer is provided on the liquid metal antenna; the first insulating encapsulation protection layer at least covers the liquid metal antenna.

7. The intelligent terminal radio frequency antenna according to claim 3, wherein At least one layer of metal coating is formed on the surface of at least one of the liquid metal antenna, the liquid metal feed point, and the liquid metal metallized via.

8. The intelligent terminal radio frequency antenna according to claim 3, characterized in that, It further includes: A liquid metal trace provided on the inner surface of the housing and connected to the liquid metal feed point.

9. The smart terminal radio frequency antenna according to claim 8, wherein, It further includes: A second insulating encapsulation protection layer covering the liquid metal feed point and a part of the liquid metal trace; The part of the liquid metal trace not covered by the second insulating encapsulation protection layer serves as the electrical contact point of the liquid metal feed point.

10. The intelligent terminal radio frequency antenna according to claim 3, wherein The thickness of the liquid metal antenna is 3μm - 20μm.

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