Rigid-flexible board lens module

Abstract

The present invention provides a rigid-flexible board lens module, comprising a rigid-flexible board unit, having two rigid circuit boards and a flexible circuit board connected between the two rigid circuit boards, a photosensitive element and a lens arranged on the flexible circuit board, two gaps between the lens and the two rigid circuit boards respectively filled with a gap glue, thereby reinforcing and strengthening the two joints between the flexible circuit board and the two rigid circuit boards, and after the gap glue is cured, the rigid-flexible board lens module becomes an integrated structure.

Description

Technical Field

[0001] The invention relates to the field of lenses, and in particular to a rigid-flexible board lens module. Background Art

[0002] Camera lenses are important functional components of electronic products such as mobile phones, tablets, and notebooks. With the rapid development of this consumer industry, the camera industry has also grown rapidly. Especially as these electronic products become thinner, the size of the camera lenses installed in electronic products needs to be thinner.

[0003] There are three packaging methods for traditional camera lens modules: 1. Chip Scale Package (CSP) method, 2. Chip On Board (COB) method, and 3. Flip Chip method.

[0004] The advantage of CSP packaging is that the packaging stage is completed by the front-end process, and the wafer of CSP packaging is covered by glass, so the cleanliness requirement is lower. The qualified rate is also good, the process equipment cost is low, and the process time is short. The challenges are poor light penetration, high price, high height, and backlight penetration ghosting phenomenon.

[0005] The Flip Chip process is difficult for general companies to adopt due to its complex process and high cost.

[0006] COB packaging has the advantages of better image quality, lower packaging cost and lower module height. In addition, major brand manufacturers gradually require module manufacturers to assemble and ship with COB process. In the future, COB process will become a trend in the development of camera module process. There are two FPCB bonding processes in the post-process of COB packaging process, namely: 1. Hot Bar (solder paste hot pressing), 2. ACF (anisotropic conductive paste hot pressing) / ACP (anisotropic conductive paste hot pressing). Hot Bar is basically no longer used due to its low reliability; and ACF / ACP requires additional equipment purchase, which makes the cost rise sharply. In addition, traditional packaging technologies such as wafer-level packaging process are directly assembled according to the set tolerance parameters. As the number of superimposed parts increases, the final matching tolerance becomes larger and larger, and the final shooting effect of the image is affected. The ordinary COB process has no advantages and characteristics in module thickness. The final lens installation also has no obvious characteristics.

[0007] As the number of camera lens parts increases, the qualified rate of packaging becomes lower and the overall thickness also increases. Therefore, how to make the overall thickness of the camera lens thinner and improve the qualified rate is the direction that the inventor of this case and related manufacturers engaged in this industry are eager to study and improve. Summary of the invention

[0008] In order to improve the above-mentioned problems, an object of the present invention is to provide a thin rigid-flexible board lens module with integrated strength.

[0009] To achieve the above-mentioned purpose, the present invention provides a rigid-flexible board lens module, comprising: a rigid-flexible board unit, having two rigid circuit boards and a flexible circuit board, the flexible circuit board being located between the two rigid circuit boards and being combined with the two rigid circuit boards, and the flexible circuit board defining a second thickness that is smaller than a first thickness defined by each rigid circuit board; a photosensitive element being attached to the flexible circuit board and being electrically connected to the flexible circuit board; a lens being aligned with the photosensitive element and fixed on the flexible circuit board, and having two gaps between the lens and the two rigid circuit boards, each of which is filled with a gap glue, and the two joints between the flexible circuit board and the two rigid circuit boards are reinforced by the gap glue.

[0010] The photosensitive element is covered with a filter element.

[0011] The lens is located in a light sensing path of the light sensing element, and the light sensing element is located between the lens and the filter element.

[0012] The flexible circuit board is combined with the two rigid circuit boards by a combination method without connectors or welding.

[0013] The flexible printed circuit board and the photosensitive element are electrically connected together by a plurality of conductive wires.

[0014] Each of the aforementioned rigid circuit boards is covered by a shell, the gaps are located between the lens and the shell, and the gap glue fills the gap between the lens and the shell.

[0015] The aforementioned rigid circuit board has an inner edge adjacent to the flexible circuit board, the lens has two outer edges respectively spaced from the inner edges of the adjacent rigid circuit boards, and the gaps are respectively located between the two outer edges of the lens and the inner edges of the two rigid circuit boards.

[0016] Each of the aforementioned shells has an inner shell wall that is aligned with the inner edge of the rigid circuit board and is spaced to correspond to the two outer sides of the lens, and the gap glues are filled between the inner shell wall of the shell and the outer side of the lens.

[0017] The aforementioned gap glue is a curing glue.

[0018] The flexible printed circuit board forms a recessed area.

[0019] The present invention thereby reinforces and strengthens the two joints between the flexible circuit board and the two rigid circuit boards, and after the gap glue is cured, the rigid-flexible combined board lens module becomes an integrated structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1A-Figure 1C It is an exploded schematic diagram of the present invention and a partially enlarged schematic diagram thereof;

[0021] Figure 2A-2C It is a combined schematic diagram of the present invention and a partially enlarged schematic diagram thereof.

[0022] Explanation of the reference numerals: rigid-flex board lens module 10; rigid-flex board unit 11; rigid circuit board 111; inner edge 1111; flexible circuit board 112; electrical contact 1121; photosensitive element 113; conductive line 1131; filter element 114; lens 115; outer edge 1151; shell 116; inner shell wall 1161; gap glue 117; gap 118; recessed area A; first thickness H1; second thickness H2. DETAILED DESCRIPTION

[0023] The above-mentioned objects and the structural and functional characteristics of the present invention will be described based on the preferred embodiments shown in the accompanying drawings.

[0024] In the present invention, unless otherwise clearly specified and limited, the terms "set", "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection; it can be a mechanical connection; it can be a direct connection or an indirect connection through an intermediate medium. For those with ordinary knowledge in the relevant technical field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0025] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "multiple" and "plurality" is two or more, unless otherwise clearly and specifically defined.

[0026] Figure 1A-Figure 1C It is an exploded schematic diagram of the present invention and a partially enlarged schematic diagram thereof; Figure 2A-2CIt is a combined schematic diagram of the present invention and a partially enlarged schematic diagram thereof. As shown in the figure, the rigid-flex PCB lens module 10 of the present invention includes a rigid-flex PCB unit 11 as a component carrier. The rigid-flex PCB unit 11 is a printed circuit board that connects two or more rigid circuit boards through a flexible part. In this embodiment, the rigid-flex PCB unit 11 has two rigid circuit boards (PCB) 111 and a flexible circuit board (FPC) 112, and the flexible circuit board 112 is located between the two rigid circuit boards 111. The flexible circuit board 112 and the two rigid circuit boards 111 are combined together by a combination method without a connector or without soldering. For example, holes are drilled in advance in the circuit layers to be connected between the flexible circuit board 112 and the two rigid circuit boards 111, and they are bonded after being aligned by a precise positioning device, and the circuit connection is made by using the conductive plated through holes between each layer.

[0027] The rigid circuit board 111 defines a first thickness H1, and the flexible circuit board 112 defines a second thickness H2 which is smaller than the first thickness H1. Due to the difference in thickness between the two, the flexible circuit board 112 forms a recessed area A (such as Figure 1C ).

[0028] The two shells 116 cover the rigid circuit boards 111 respectively. The shells 116 are, for example, metal (iron) shells or plastic shells, and can be used to shield the electronic components on the rigid circuit boards 111. The shells 116 protect the electronic components on the rigid circuit boards 111 and shield the electromagnetic waves generated by these electronic components to prevent these electromagnetic waves from interfering with the operation of the photosensitive element 113 described later. Each rigid circuit board 111 has an inner edge 1111 adjacent to the flexible circuit board 112, and each shell 116 has an inner shell wall 1161 that is aligned with the inner edge 1111 of the rigid circuit board.

[0029] A photosensitive element 113 is attached to the flexible printed circuit 112 and electrically connected to the flexible printed circuit 112. A filter element 114 is covered on the photosensitive element 113. The photosensitive element 113 is, for example, a CCD or a CMOS. The filter element 114 is, for example, an infrared filter (IR Cut Filter) for filtering out infrared rays and retaining colors visible to the naked eye. In one embodiment, the flexible printed circuit 112 is provided with a plurality of electrical (or metal) contacts 1121. The photosensitive element 113 has a plurality of conductive wires (or electrical pins) 1131 corresponding to the electrical contacts 1121 of the flexible printed circuit 112.

[0030] A lens 115 is aligned with the photosensitive element 113 and fixed on the flexible circuit board 112. The lens 115 is located in a photosensitive path of the photosensitive element 113, and the filter element 114 is located between the lens 115 and the photosensitive element 113. There are two gaps 118 between the lens 115 and the two rigid circuit boards 111 and the two housings 116, which are filled with gap glue 117 respectively. The gap glue 117 is, for example but not limited to, a curing glue that can be transformed from liquid to solid, with strong adhesion and fast curing speed. In one embodiment, the gap glue 117 uses UV curing glue.

[0031] In detail, the lens 115 has two outer sides 1151 that respectively space the inner edges 1111 of the adjacent rigid circuit boards 111 and the inner shell walls 1161 of the housings 116, and the two gaps 118 are respectively located between the two outer sides 1151 of the lens 115 and the inner edges 1111 of the two rigid circuit boards 111 and the inner shell walls 1161 of the two housings 116. The gap glue 117 in the two gaps 118 not only fills the two outer sides 1151 of the lens 115 and the inner edges 1111 of the two rigid circuit boards 111, but also fills the gaps between the two outer sides 1151 of the lens 115 and the inner shell walls 1161 of the two housings 116. In this way, the gap glue 117 can reinforce the joint between the flexible circuit board 112 and the two rigid circuit boards 111. The cured gap glue 117 makes the rigid-flexible board lens module 10 of the present invention an integrated structure.

[0032] The present invention reduces the thickness of the entire rigid-flexible board lens module by placing the lens 115, the photosensitive element 113 and the filter 114 on the thinner flexible circuit board 112. The gap glue 117 is used to reinforce the joint between the flexible circuit board 112 and the two rigid circuit boards 111, so that the rigid-flexible board lens module 10 becomes an integrated structure.

[0033] The above description is only illustrative rather than restrictive of the present invention. Those skilled in the art will understand that many modifications, changes or equivalents may be made without departing from the spirit and scope defined by the claims, but all will fall within the protection scope of the present invention.

Claims

1. A rigid-flexible lens module. It is characterized in that include: A rigid-flexible board unit, comprising two rigid circuit boards and a flexible circuit board, wherein the flexible circuit board is located between the two rigid circuit boards and is combined with the two rigid circuit boards, and the flexible circuit board defines a second thickness that is smaller than a first thickness defined by each rigid circuit board; A photosensitive element is attached to the flexible printed circuit board and is electrically connected to the flexible printed circuit board; A lens is aligned with the photosensitive element and fixed on the flexible circuit board. The lens is located in a photosensitive path of the photosensitive element. Two gaps between the lens and the two rigid circuit boards are respectively filled with gap glue, and the two joints between the flexible circuit board and the two rigid circuit boards are reinforced by the gap glue.

2. The rigid-flex board lens module according to claim 1, Features: The photosensitive element is covered with a filter element.

3. The rigid-flexible board lens module according to claim 2, Features: The photosensitive element is located between the lens and the filter element.

4. The rigid-flex board lens module according to claim 1, Features: The flexible circuit board is combined with two rigid circuit boards by a combination method without connectors or welding.

5. The rigid-flexible board lens module according to claim 1, Features: The photosensitive element has a plurality of conductive wires for electrically connecting the flexible circuit board.

6. The rigid-flex board lens module according to claim 1, Features: Each rigid circuit board is covered by a shell, the two gaps are located between the lens and the shell, and the gap glue fills the space between the lens and the shell.

7. The rigid-flex board lens module according to claim 6, Features: Each rigid circuit board has an inner edge adjacent to the flexible circuit board, the lens has two outer edges respectively spaced from the inner edges of the two rigid circuit boards, and the gap is respectively located between the two outer edges of the lens and the inner edges of the two rigid circuit boards.

8. The rigid-flexible board lens module according to claim 7, Features: Each shell has an inner shell wall aligned with the inner edge of the rigid circuit board, and the inner shell walls are spaced to correspond to the two outer sides of the lens, and the gap glue is filled between the inner shell wall of the shell and the outer side of the lens.

9. The rigid-flex board lens module according to claim 1, Features: The gap glue is a curing glue.

10. The rigid-flex board lens module according to claim 1, Features: The flexible circuit board forms a recessed area.

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