5G wireless communication base station

Abstract

The present invention relates to a 5G wireless communication base station, comprising an outer cover, an antenna array, a filter, a shielding cover, a PCB board and a radiator arranged in sequence; the radiator comprises a heat sink and heat dissipation teeth extending from one side of the heat sink, and the outer cover is arranged on the heat sink of the radiator; the PCB board is a single-layer arrangement and fits with the other side of the heat sink, and the shielding cover covers the PCB board in the space enclosed by the shielding cover and the heat sink. Compared with the prior art, the present invention makes full use of the internal space, has a compact arrangement, good heat dissipation effect, small size and light weight.

Description

Technical Field

[0001] The present invention relates to the field of communication technology, and in particular to a 5G wireless communication base station. Background Art

[0002] A wireless communication base station refers to a radio transceiver station that transmits information to wireless terminals through a wireless communication exchange center in a certain radio coverage area. The receiving mode of the base station is that the antenna receives the signal, and the signal is transmitted to the PCB board through the filter, and then to the core network through the low noise amplifier circuit, digital intermediate frequency module and optical module in turn through the optical fiber. The transmitting mode of the base station is that the data of the core network is transmitted to the PCB board through the optical fiber, and then to the antenna end through the filter for transmission.

[0003] With the development of 5G edge computing and high-speed local caching, small base stations hanging on utility poles will perform more and more data storage and computing functions in the future. As the cost of 5G transmission rate increases, 5G base stations will process massive amounts of data, resulting in a significant increase in computing power consumption, which will bring great heat dissipation requirements. Existing base stations, such as Fig. 9 and Fig.10 As shown, due to the multi-layer arrangement of the internal circuit board and other reasons, in order to ensure the heat dissipation effect, the front, back, bottom and sides of the entire base station are provided with heat dissipation teeth C, which increases the volume and weight of the entire base station. Summary of the invention

[0004] The technical problem to be solved by the present invention is to avoid the shortcomings of the prior art and propose a 5G wireless communication base station that has good heat dissipation effect and small size.

[0005] The technical solution adopted by the present invention to solve the technical problem is:

[0006] A 5G wireless communication base station is provided, comprising an outer cover, an antenna array, a filter, a shielding cover, a PCB board and a radiator arranged in sequence; the radiator comprises a heat sink and heat dissipation teeth extending from one side of the heat sink, and the outer cover is arranged on the heat sink or the shielding cover of the radiator; the PCB board is arranged in a single layer and is bonded to the other side of the heat sink.

[0007] Further:

[0008] The PCB board includes a power amplifier circuit, a digital intermediate frequency circuit, an optical module and a power module, and is a whole board bonded to a heat sink, or is divided into a plurality of small boards that are bonded to the heat sink respectively.

[0009] The power module and the optical module on the PCB are located at the lower edge of the PCB and are arranged outwards.

[0010] The chip on the PCB board and components with a thickness close to that of the chip are arranged on the side in contact with the heat sink, and components with a large thickness difference from that of the chip are arranged on the other side of the PCB board.

[0011] The arrangement of thick components on the other side of the PCB board is staggered with the arrangement of the filter on the board surface.

[0012] The antenna array includes a plurality of antenna elements, each antenna element includes a metal reflector, a feed plate and a radiation plate, the feed plate is connected to the metal reflector; the upper surface of the feed plate is electroplated or chemically plated with a metal feed network, and a support base is provided, and the radiation plate is connected to the support base.

[0013] The support base and the feed plate are integrally formed by injection molding.

[0014] The support seat includes a head chamfer and a waist bevel groove. The radiation plate is provided with a connecting hole connected to the support seat. An elastic tongue is provided in the connecting hole. After the connecting hole of the radiation plate passes through the head of the support seat to the waist bevel groove, the elastic tongue is stuck in the waist bevel groove.

[0015] The filter is honeycomb-shaped, with three or more connected regularly shaped cylindrical or regular polygonal cavities, and a connector is set in the middle part of the three adjacent cavities. Each filter is connected to the antenna through a pin at one end and connected to the PCB board through another pin through the shielding cover at the other end.

[0016] The shielding cover and the filter are die-casted at one time.

[0017] The middle parts of the upper and lower edges of the heat dissipation plate of the radiator are where the handles are installed, and the height of the handles is flush with the heat dissipation teeth or lower than the heat dissipation teeth.

[0018] Compared with the prior art, the present invention fully utilizes the internal space, has a compact structure, good heat dissipation effect, small size and light weight. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is an axial schematic diagram of an embodiment of a 5G wireless communication base station of the present invention;

[0020] Figure 2 is an exploded schematic diagram of an embodiment of a 5G wireless communication base station of the present invention;

[0021] Figure 3 is a cross-sectional schematic diagram of an embodiment of a 5G wireless communication base station of the present invention;

[0022] Figure 4 It is a schematic diagram of an exploded antenna array of a 5G wireless communication base station embodiment of the present invention;

[0023] Figure 51 is a plan view of a radiation plate of an antenna array of a 5G wireless communication base station embodiment of the present invention;

[0024] Figure 6 It is a schematic diagram of the connection state between the radiation plate and the connection seat on the feeder plate of the antenna array of the 5G wireless communication base station embodiment of the present invention;

[0025] Figure 7 is an axial schematic diagram of a filter of an embodiment of a 5G wireless communication base station of the present invention;

[0026] Figure 8 It is a schematic diagram of the structure of the shielding cover and the side close to the PCB board of the 5G wireless communication base station embodiment of the present invention;

[0027] Fig. 9 is an axial schematic diagram of an embodiment of a small wireless communication base station in the prior art;

[0028] Fig.10 It is a rear view schematic diagram of an embodiment of a small wireless communication base station in the prior art. DETAILED DESCRIPTION

[0029] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0030] like Figures 1 to 3 As shown, a 5G wireless communication base station is a square body, including an outer cover 1, an antenna array 2, a filter 3, a shielding cover 4, a PCB board 5 and a radiator 6 arranged vertically in sequence. The radiator 6 includes a heat sink 61 and heat dissipation teeth 62 extending from one side of the heat sink. The outer cover 1 is arranged on the heat sink of the radiator; the PCB board 5 is a single-layer arrangement and is bonded to the other side of the heat sink 6, and the shielding cover 4 covers the PCB board 5 in the space enclosed by the shielding cover 4 and the heat sink. In other embodiments, the outer cover 1 can also be covered on the shielding cover 4. The PCB board 5 includes a power amplifier circuit, a digital intermediate frequency circuit, an optical module, a power module, etc., and can be a whole board bonded to the heat sink, or divided into several small boards that are bonded to the heat sink respectively. In the present invention, since the PCB board is arranged in a single layer and is attached to the heat dissipation plate, the heat emitted by the electronic components and chips arranged on the PCB board is dissipated through the heat dissipation plate and heat dissipation teeth installed on the back of the base station. Compared with the prior art in which the entire base station is provided with heat dissipation teeth on the front, back, bottom and sides, not only is the heat dissipation effect good, but also the volume and weight are reduced.

[0031] like Figure 2 As shown, the antenna array 2 includes a plurality of antenna elements. In this embodiment, three antenna elements are combined into a unit and two polarization ports are provided. Figure 4As shown, each antenna array includes a metal reflector 21, a feed plate 22 and a radiation plate 23, and the feed plate 22 is connected to the metal reflector 21 and the radiation plate 23 respectively. The feed plate 22 is provided with a convex strip 221 and a support seat 222, and the convex strip 221 divides the feed plate into multiple areas, and the surface of each area is electroplated or chemically plated with metal wiring; the support seat 222 is used to support the radiation plate 23, and is integrally formed with the feed plate 22 through a plastic injection molding process, and the plastic can be made of low-cost modified plastic materials. Figures 4 to 6 As shown, the support seat 222 is perpendicular to the surface of the feed plate 22, and the connection is a smooth arc transition, including a head chamfer 2221 and a waist bevel groove 2222. The radiation plate 23 is provided with a connection hole 231 connected to the support seat, and an elastic tongue 232 is provided in the hole. During assembly, the connection hole 231 of the radiation plate 23 passes through the head of the support seat to the waist bevel groove 2222. At this time, the elastic tongue 232 is inserted into the waist bevel groove 2222 to achieve the connection and fixation between the radiation plate 23 and the support seat 222. The entire assembly process does not require any welding. Compared with the prior art that the 5G base station antenna adopts a PCB form and is assembled from multiple parts by welding and other methods, the present invention has simple assembly without welding, improved production efficiency, high product consistency, and low material cost and production cost.

[0032] like Figure 7 As shown, the filter 3 is similar to a honeycomb, and has three or more connected resonant cavities 31 of regular shape. The resonant cavity 31 can be a cylindrical cavity or a regular polygonal cavity. Since the shape of each resonant cavity is regular and non-deformed, the performance of the filter is excellent. Connectors, such as screws, are provided in the middle of the three cavities. The connecting parts do not increase the volume, so the weight is light and the volume is small. In this embodiment, two groups of filters are configured, and the two groups of filters are adjacent to the shielding cover respectively. One group of filters has four filters, and each group of filters can be integrally die-cast or individually die-cast. Each filter is connected to the antenna at one end through a pin 32, and the other end is connected to the PCB board through another pin 33 through the shielding cover.

[0033] like Figure 2 and Figure 3As shown, the PCB board 5 is fitted with the radiator 6, and the shielding cover 4 covers the PCB board 5. There are many electronic components and chips on the PCB board 5. The principle of the layout of electronic components and chips on the PCB board 5 is: under the premise of making the thickness of the heat sink as small as possible, high-power devices with large heat dissipation requirements can be fitted with the heat sink. Based on this principle, when arranging components and chips on the PCB board 5, high-power devices and electronic components with basically the same thickness are arranged on the side that fits with the heat sink. Generally speaking, chips and components with small thickness are arranged on the side that fits with the radiator, and components with large thickness are arranged on the other side of the PCB board. Otherwise, if chips and components with large thickness differences are arranged on the side that fits with the heat sink, in order to allow each chip and component to fit with the heat sink for conduction and heat dissipation, the thickness of the heat sink needs to be partially increased, which will increase the volume and weight of the entire base station.

[0034] The power module and the optical module are arranged at the lower edge of the PCB board 5 and are arranged outwardly so as not to block the air duct and to facilitate heat dissipation. In addition, the optical fiber socket 51 and the power socket 52 are designed at the bottom of the base station to facilitate installation and rainproof.

[0035] In some embodiments, the shielding cover 4 can be die-casted with the filter 3 at one time, which is lighter and smaller in size. In addition, the layout of the thick components on the other side of the PCB board is staggered with the arrangement of the filter on the board. For example, when there are two groups of filters, the two groups of filters are arranged on both sides, the middle part is raised to the same height as the filter, and the thick components on the other side of the PCB board are accommodated in the back cavity of the raised part. In other embodiments, when the shielding cover 4 is not die-casted with the filter 3 at one time, the shielding cover 4 can be made into a shape with a concave in the middle, a convex in the middle, or alternating concave and convex shapes, the concave part is arranged with the filter, and the back cavity of the convex part is used to accommodate thick components. In this way, the thickness of the components on the other side of the PCB board will not overlap with the thickness of the filter to increase the thickness of the entire base station.

[0036] like Figure 2 and Figure 8 As shown, in order to adapt to the layout of the PCB board, the shielding cover 4 is provided with a connector covering area 41 and an electronic component covering area 42. The connector covering area 41 is arranged at the edge of the shielding cover. Since the height of the connector is generally higher than the electronic component, the connector covering area 41 is designed to be higher than the electronic component covering area 42, and the filter is arranged on the plane of the electronic component covering area 42. In this way, the height of the connector will not overlap with the height of the filter to increase the thickness of the entire base station.

[0037] like Figures 1 to 3As shown, the middle part 63 of the upper and lower edges of the heat sink of the heat sink 6 is not provided with heat dissipation teeth, and is used to install the handle 9, which is flush with the heat dissipation teeth or lower than the heat dissipation teeth. This shape is regular, which is conducive to the packaging and transportation of the base station.

[0038] It should be understood that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. For those skilled in the art, the technical solutions described in the above embodiments can be modified, or some of the technical features therein can be replaced by equivalents; and these modifications and replacements should all fall within the scope of protection of the claims attached to the present invention.

Claims

1. A 5G wireless communication base station, characterized in that: It comprises an outer cover, an antenna array, a filter, a shielding cover, a PCB board and a radiator arranged in sequence; the radiator comprises a heat sink and heat dissipation teeth extending from one side of the heat sink, and the outer cover is arranged on the heat sink or the shielding cover of the radiator; the PCB board is arranged in a single layer and is bonded to the other side of the heat sink, the chip on the PCB board and the components with a thickness close to that of the chip are arranged on the side bonded to the radiator, the components with a large thickness difference from the chip are arranged on the other side of the PCB board, and the arrangement of the components with a large thickness on the other side of the PCB board is staggered with the arrangement of the filter on the board surface; the shielding cover is provided with a connector covering area and a component covering area, the connector covering area is arranged at the edge of the shielding cover, and the connector covering area is higher than the electronic component covering area, and the filter is arranged on the plane of the electronic component covering area.

2. The 5G wireless communication base station according to claim 1, characterized in that: The PCB board includes a power amplifier circuit, a digital intermediate frequency circuit, an optical module and a power module, and is a whole board bonded to a heat sink, or is divided into a plurality of small boards that are bonded to the heat sink respectively.

3. The 5G wireless communication base station according to claim 1, characterized in that: The antenna array includes a plurality of antenna elements, each antenna element includes a metal reflector, a feed plate and a radiation plate, the feed plate is connected to the metal reflector; the upper surface of the feed plate is electroplated or chemically plated with a metal feed network, and a support base is provided, and the radiation plate is connected to the support base.

4. The 5G wireless communication base station according to claim 3, characterized in that: The support seat and the feed plate are integrally formed by injection molding.

5. The 5G wireless communication base station according to claim 3, characterized in that: The support seat includes a head chamfer and a waist bevel groove. The radiation plate is provided with a connecting hole connected to the support seat. An elastic tongue is provided in the connecting hole. After the connecting hole of the radiation plate passes through the head of the support seat to the waist bevel groove, the elastic tongue is stuck in the waist bevel groove.

6. The 5G wireless communication base station according to claim 1, characterized in that: The filter is honeycomb-shaped, having more than three connected regularly shaped cylindrical or regular polygonal cavities, a connector is provided in the middle of three adjacent cavities, each filter is connected to the antenna through a pin at one end, and the other end is connected to the PCB board through another pin through a shielding cover.

7. The 5G wireless communication base station according to claim 1, characterized in that: The shielding cover and the filter are die-casted at one time.

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