Method of reducing surface roughness of sinter paste layer joint surface and apparatus therefor

Abstract

The invention relates to a method for reducing the surface roughness of a connection surface of a sintering paste layer, which connection surface is arranged facing away from a first connection partner on which the sintering paste layer is arranged, the method having the successive method steps: a) arranging the sintering paste layer on the first connection partner, b) applying a vibration to the sintering paste layer by means of a vibration application device, which vibration application device is configured to generate a mechanical vibration. Furthermore, the invention relates to a related sintering connection generation device.

Description

TECHNICAL FIELD

[0001] The invention relates to a method for reducing the surface roughness of a connection surface of a sinter paste layer, and to a sinter connection producing device. BACKGROUND

[0002] DE 10 2010 021 764 B4 discloses a pressure sintering method for producing a sinter connection between a first connection partner and a second connection partner arranged on the first connection partner, wherein, immediately before the sinter paste is applied to the contact surface of the first connection partner, ultrasound is applied to the contact surface and the region directly surrounding the contact surface in order to remove impurities from the contact surface. In order to avoid new impurities, the ultrasound can be applied continuously until the end of the application of the sinter paste.

[0003] In order to produce particularly strong sinter connections, it is advantageous if the connection surface of the sinter paste layer arranged on the first connection partner, which faces the second connection partner, has a low surface roughness and thus the surface structure of the connection surface has only relatively small protrusions and recesses. SUMMARY

[0004] It is an object of the invention to reduce the surface roughness of a connection surface of a sinter paste layer arranged on a first connection partner, which faces away from the first connection partner, in order to produce a sinter connection between the first connection partner and a second connection partner.

[0005] This object is achieved by a method for reducing the surface roughness of a connection surface of a sinter paste layer, which connection surface is arranged to face away from a first connection partner on which the sinter paste layer is arranged, the method having the following successive method steps:

[0006] a) arranging a sinter paste layer on a first connection partner,

[0007] b) applying vibrations to the sinter paste layer by means of a vibration application device which is configured to generate mechanical vibrations.

[0008] It has been found to be advantageous if the frequency range of the vibrations is from 10 Hz to 10 MHz, in particular from 10 kHz to 100 kHz, in particular from 20 kHz to 60 kHz. These frequency ranges are very suitable for reducing the surface roughness of the connection surface of the sinter paste layer.

[0009] Furthermore, it has also been found to be advantageous if the viscosity of the sinter paste layer is from 1 Pa s to 100 Pa s, in particular from 5 Pa s to 30 Pa s.

[0010] It has also been found to be advantageous if the ratio of the viscosity of the sintering paste layer to the frequency of the vibration lies in the range from 0.025 Pa s / kHz to 2.5 Pa s / kHz, in particular from 0.05 Pa s / kHz to 1.25 Pa s / kHz. With this ratio of the viscosity of the sintering paste layer to the frequency of the vibration, the surface roughness of the connecting surface of the sintering paste layer can be reduced particularly effectively.

[0011] Furthermore, it has also been found to be advantageous if the vibration direction of the vibration extends in the direction of the normal to the surface of the first connecting partner facing the sintering paste layer or extends perpendicular to this or if the vibration direction of the vibration has a vibration direction component extending in the direction of the normal and a vibration direction component extending perpendicular to this.

[0012] Furthermore, it has also been found to be advantageous if, in the method step a), the arrangement of the sintering paste layer on the first connecting partner is carried out by means of a screen printing method using a screen, and the screen is removed at the end of the method step a). In comparison with a stencil printing method, by means of which the sintering paste layer can also be arranged on the first connecting partner, the screen printing method has a higher reliability and allows a shorter processing time and a thinner sintering paste layer.

[0013] Furthermore, it has also been found to be advantageous if the vibration application device comprises a vibration generation device which comprises a driven vibration surface which carries out a mechanical vibration, on which the first connecting partner is arranged directly or indirectly in order to carry out the method step b). In this way, the first connecting partner and thus the sintering paste layer are directly coupled to the vibration application device in the vibration.

[0014] In this connection, it has been found to be advantageous if the vibration application device comprises a pressure device which presses the first connecting partner in the direction of the vibration surface in the method step b). In this way, the first connecting partner and thus the sintering paste layer are particularly well coupled to the vibration application device in the vibration.

[0015] Furthermore, it has also been found to be advantageous if the vibration application device comprises a suction device which pulls the first connecting partner in the direction of the vibration surface by generating a reduced pressure in the method step b). In this way, the first connecting partner and thus the sintering paste layer are particularly well coupled to the vibration application device in the vibration.

[0016] It has also been found to be advantageous if, in the method step b), the first connecting partner is fixed to a workpiece carrier and, in order to carry out the method step b), the first connecting partner is indirectly arranged on the vibration surface by arranging the workpiece carrier on the vibration surface. In this way, the first connecting partner and thus the sintering paste layer are directly coupled to the vibration application device in the vibration.

[0017] It has further been found to be advantageous if, in method step b), the first connection partner is fixed to the workpiece carrier, the vibration application device comprises a vibration generation device which places the liquid of the vibration application device arranged in a container of the vibration application device in mechanical vibration and at least a portion of the workpiece carrier is immersed in the liquid in order to perform method step b). In this way, the first connection partner and thus the sinter paste layer is very effectively coupled to the vibration application device in vibration.

[0018] It has further been found to be advantageous if the vibration application device comprises a vibration generation device which places an elastic pad of the vibration application device in mechanical vibration, the first connection partner is arranged on the pad in order to perform method step b). In this way, the first connection partner and thus the sinter paste layer is very effectively coupled to the vibration application device in vibration.

[0019] It has further been found to be advantageous if, in method step b), the first connection partner is fixed to the workpiece carrier, the vibration application device comprises a vibration generation device which places an elastic pad of the vibration application device in mechanical vibration and the workpiece carrier is arranged on the pad in order to perform method step b). In this way, the first connection partner and thus the sinter paste layer is very effectively coupled to the vibration application device in vibration.

[0020] It has further been found to be advantageous that a pressure sintering method for producing a sintered connection between a first connection partner and a second connection partner arranged on the first connection partner, wherein the method for reducing the surface roughness of the connection surface of the sinter paste layer according to the application is performed and subsequently the following successive method steps are performed:

[0021] c) reducing one or more liquid components of the sinter paste layer,

[0022] d) arranging the second connection partner on the sinter paste layer,

[0023] e) applying pressure to the first connection partner and the second connection partner and the sinter paste layer in order to press the first connection partner and the second connection partner against each other and applying heat to the sinter paste layer, the sinter paste layer being converted into a sintered metal layer by the application of pressure and heat.

[0024] The pressure sintering method makes it possible to produce a particularly strong and reliable sintered connection between the first connection partner and the second connection partner.

[0025] This object is also achieved by a sintered joint producing device having a device configured to carry out the method for reducing the surface roughness of a joint surface of a sinter paste layer according to the invention and in particular to carry out a pressure sintering method for producing a sintered joint between a first joint partner and a second joint partner arranged on the first joint partner.

[0026] Advantageous configurations of the sintered joint producing device can be obtained in a manner similar to the advantageous refinements of the method for reducing the surface roughness of a joint surface of a sinter paste layer according to the invention and in particular of the pressure sintering method for producing a sintered joint between a first joint partner and a second joint partner arranged on the first joint partner according to the invention, and vice versa.

[0027] It should be noted that elements described in the singular can optionally be present in plural. BRIEF DESCRIPTION OF DRAWINGS

[0028] Exemplary embodiments of the present invention will be explained below with reference to the following drawings, in which:

[0029] Figure 1 a cross-sectional view of a first joint partner and a screen printing device when a sinter paste layer is arranged on the first joint partner is shown,

[0030] Figure 2 a cross-sectional view of a first joint partner and a sinter paste layer arranged on the first joint partner before the execution of the application of a vibration is shown,

[0031] Figure 3 a cross-sectional view of a first joint partner, a sinter paste layer arranged on the first joint partner and one configuration of a vibration application device is shown,

[0032] Figure 4 a cross-sectional view of a first joint partner, a sinter paste layer arranged on the first joint partner and another configuration of a vibration application device is shown,

[0033] Figure 5 a cross-sectional view of a first joint partner arranged on a workpiece carrier, a sinter paste layer arranged on the first joint partner and one configuration of a vibration application device is shown,

[0034] Figure 6 a cross-sectional view of a first joint partner arranged on a workpiece carrier, a sinter paste layer arranged on the first joint partner and one configuration of a vibration application device is shown,

[0035] Figure 7a cross-sectional view showing a first connection partner arranged on a workpiece carrier, a sintering paste layer arranged on the first connection partner, and a further configuration of a vibration application device,

[0036] Figure 8 a cross-sectional view showing a first connection partner, a sintering paste layer arranged on the first connection partner, and a further configuration of a vibration application device,

[0037] Figure 9 a cross-sectional view showing a first connection partner arranged on a workpiece carrier, a sintering paste layer arranged on the first connection partner, and a vibration application device,

[0038] Figure 10 a cross-sectional view showing a first connection partner and a sintering paste layer arranged on the first connection partner after performing the application of a vibration, and

[0039] Figure 11 a cross-sectional view showing a first connection partner, a sintering paste layer arranged on the first connection partner, and a second connection partner arranged on the sintering paste layer.

[0040] In the drawings, identical elements are provided with the same reference signs. DETAILED DESCRIPTION

[0041] The method for reducing the surface roughness of a connection surface la of a sintering paste layer 1 according to the present application will be described below, the connection surface la being arranged facing away from a first connection partner 5 on which the sintering paste layer 1 is arranged.

[0042] In the first method step a) exemplarily shown in Figure 1 In the first method step a) exemplarily shown in

[0043] In a first method step a), a sintering paste layer 1 is arranged on the first connection partner 5, preferably by means of a screen printing method using a screen 10a. To this end, a screen printing device 10 is arranged on the first connection partner 5, which screen printing device 10 comprises a screen 10a and a cover layer 10b which is bonded, in particular materially bonded, to the screen 10a. In the region in which the sintering paste layer 1 is intended to be arranged on the first connection partner 5, the cover layer 10b comprises openings 10b' on which the material of the cover layer 10b is not arranged. The screen 10a has screen wires 10a' which are preferably arranged in the form of a fabric. Preferably, the sintering paste is pressed through the openings 10b' and through the screen 10a by means of a squeegee 11, so that the sintering paste layer 1 is formed in the openings 10b'. The sintering paste is commercially available and comprises one or more liquids and metal particles, for example silver, and optionally further constituents. At the end of the method step a), i.e. at the end of the screen printing method, the screen 10a is removed by moving the screen printing device 10 away from the first connection partner 5, i.e. in Figure 1 the screen 10a is lifted upwards here. In comparison with a stencil printing method, by means of which the sintering paste layer 1 can likewise be arranged on the first connection partner 5, the screen printing method has a higher reliability and allows a shorter processing time and a thinner sintering paste layer. However, the screen printing method has the following disadvantage in comparison with the stencil printing method when arranging the sintering paste layer 1 : since the lifting of the screen 10a is carried out at the end of the screen printing method, the connection surface 1a of the first connection partner 5 has a relatively high surface roughness. Figure 2 A sectional view of the first connection partner 5 and the sintering paste layer 1 arranged on the first connection partner 5 immediately after carrying out the first method step a) is shown. As is shown in a schematic manner in Figure 2 the connection surface 1a of the sintering paste layer 1 has a high surface roughness and thus relatively large elevations and depressions. The average thickness of the sintering paste layer 1 is preferably from 5 pm to 500 pm, in particular from 20 pm to 50 pm.

[0044] In a second method step b) which is chronologically subsequent to the first method step a), in order to reduce the surface roughness of the connection surface 1a of the sintering paste layer 1, as is shown by way of example in Figures 3 to 9 vibrations are applied to the sintering paste layer 1 by means of a vibration application device 2 which is configured to generate mechanical vibrations.

[0045] By applying the vibration to the sintering paste layer 1, the surface roughness of the connection surface 1a of the sintering paste layer 1 arranged on the first connection counterpart 5 facing away from the first connection counterpart 5 is reduced. This makes it possible to produce a particularly strong sintered connection between the first connection counterpart 5 and the second connection counterpart 6 (see Figure 11 ). It should be noted that if the sintering paste layer 1 is arranged on the first connection counterpart 5 by means of another method than by means of the screen printing method, in particular by means of another printing method, for example a stencil printing method, in method step a), the method according to the application can of course also be used to reduce the surface roughness of the connection surface 1a.

[0046] The frequency range of the vibration is preferably from 10 Hz to 10 MHz, particularly preferably from 10 kHz to 100 kHz, and in particular from 20 kHz to 60 kHz. Thus, the frequency range of the vibration can fall within the ultrasonic range.

[0047] The viscosity of the sintering paste layer 1 is preferably from 1 Pa s to 100 Pa s, in particular from 5 Pa s to 30 Pa s. In this case, the viscosity is determined in accordance with DIN 53019-1 :2008-09 (in which the shear rate is 30 1 / s).

[0048] The ratio of the viscosity of the sintering paste layer 1 to the frequency of the vibration is preferably in the range from 0.025 Pa s / kHz to 2.5 Pa s / kHz, in particular in the range from 0.05 Pa s / kHz to 1.25 Pa s / kHz.

[0049] The vibration direction of the vibration can extend in or perpendicular to the normal direction N of the surface 5d of the first connection counterpart 5 facing the sintering paste layer 1, or the vibration direction of the vibration can comprise a vibration direction component extending in the normal direction N and a vibration direction component extending perpendicular to the normal direction N.

[0050] As is implemented in the exemplary embodiment according to Figures 3 to 6 , the vibration application device 2 can comprise a vibration generation device 2' comprising a driven vibration surface 2a' which performs a mechanical vibration, on which the first connection counterpart 5 is arranged directly or indirectly in order to perform method step b). The vibration generation device 2' may, for example, be in the form of an ultrasonic transducer. In the exemplary embodiment according to Figures 3 to 6 , the vibration surface 2a' is driven by a drive unit 2b. In this case, the vibration surface 2a' is an outer surface of a vibration body 2a which is driven by the drive unit 2b. As is implemented in the exemplary embodiment according to Figure 3 and Figure 4As implemented in exemplary embodiments according to Figure 5 and Figure 6 , the first connection partner 5 can be fixed to the workpiece carrier 8 in method step b) and, for performing method step b), the first connection partner 5 is indirectly arranged on the vibration surface 2a' by arranging the workpiece carrier 8 on the vibration surface 2a'. For fixing the first connection partner 5 to the workpiece carrier 8, the workpiece carrier 8 can comprise a recess 8a in which at least a portion of the first connection partner 5 is arranged. Preferably, the recess 8a is configured in a form-fitting manner to at least one segment of the first connection partner 5. Additionally, or as an alternative, the first connection partner 5 can be fixed on the workpiece carrier 8 by means of a clamping device 9 which presses the first connection partner 5 onto the workpiece carrier 8.

[0051] As implemented in exemplary embodiments according to Figure 3 and Figure 5 , the vibration application device 2 can comprise a pressure device 2c which, in method step b), presses the first connection partner 5 in the direction of the vibration surface 2a' and thus increases the vibration coupling of the first connection partner 5 to the vibration surface 2a' and thus the vibration coupling of the sintering paste layer 1 to the vibration surface 2a'. In this case, the pressure device 2c exerts a pressure D on the first connection partner 5 in the direction of the vibration surface 2a'. As an alternative, or additionally, as implemented in exemplary embodiments according to Figure 4 and Figure 6 , the vibration application device 2 can comprise a suction device 2d which, in method step b), pulls the first connection partner 5 in the direction of the vibration surface 2a' by generating a reduced pressure. The suction device 2d is preferably in the form of a suction channel 2d through which a gaseous medium, preferably ambient air, is sucked in. The suction channel 2d forms a suction opening 2d' at the vibration surface 2a'. The first connection partner 5 (see Figure 4 ) or the workpiece carrier 8 (see Figure 6 ) is arranged above and flush with the suction opening 2d'. The suction device 2d can pull the first connection partner 5 in the direction of the vibration surface 2a' by generating a reduced pressure by either directly pulling the first connection partner 5 in the direction of the vibration surface 2a' or indirectly pulling the first connection partner 5 in the direction of the vibration surface 2a' by pulling the workpiece carrier 8 onto the vibration surface 2a'. It should be noted that, although in Figure 6not shown, but the workpiece carrier 8 can comprise a through-going passage on its side facing the vibrating surface 2a' and the workpiece carrier 8 is arranged on the vibrating surface 2a' in such a way that the first connection partner 5 is sucked through the workpiece carrier 8 by the suction channel 2d with the through-going passage flush arranged above the suction opening 2d'.

[0052] In exemplary embodiments according to Figure 7 and Figure 9 In method step b) the first connection partner 5 is fixed to the workpiece carrier 8. As described in exemplary embodiments according to Figure 5 and Figure 6 Optionally, the workpiece carrier 8 and the fixing of the first connection partner 5 to the workpiece carrier 8 can be performed by means of additional clamping devices 9.

[0053] In exemplary embodiments according to Figure 3 and Figure 4 The sintering paste layer 1 is placed in mechanical vibrations via the first connection partner 5.

[0054] In exemplary embodiments according to Figure 5 and Figure 6 The sintering paste layer 1 is placed in mechanical vibrations via the workpiece carrier 8 and via the first connection partner 5.

[0055] In exemplary embodiments according to Figure 7 The vibration application device 2 comprises a vibration generation device 2' which places a liquid 2f of the vibration application device 2 arranged in a container 2e of the vibration application device 2 in mechanical vibrations and at least a part of the workpiece carrier 8 is immersed in the liquid 2f in order to perform method step b). The sintering paste layer 1 is placed in mechanical vibrations via the container 2e, via the liquid 2f, via the workpiece carrier 8 and via the first connection partner 5.

[0056] In exemplary embodiments according to Figure 8 The vibration application device 2 comprises a vibration generation device 2' which places an elastic mat 2g of the vibration application device 2 in mechanical vibrations, the first connection partner 5 is arranged on the mat 2g in order to perform method step b). In this case, the first connection partner 5 can be at least partially sunk into the mat 2g. The sintering paste layer 1 is placed in mechanical vibrations via the mat 2g and via the first connection partner 5.

[0057] In exemplary embodiments according to Figure 9In the exemplary embodiment of Fig. 1, in method step b) the first connection partner 5 is fixed to the workpiece carrier 8. The vibration application device 2 comprises a vibration generation device 2' which places the elastic mat 2g of the vibration application device 2 in mechanical vibration and the workpiece carrier 8 is arranged on the mat 2g in order to perform method step b). In this case, the workpiece carrier 8 can be at least partially sunk into the mat 2g. The sinter paste layer 1 is placed in mechanical vibration via the mat 2g, via the workpiece carrier 8 and via the first connection partner 5.

[0058] The mat 2g can for example be constructed as a silicone mat or as a mat filled with a gel or a liquid.

[0059] Figure 10 A cross-sectional view of the first connection partner 5 and the sinter paste layer 1 arranged on the first connection partner 5 immediately after performing method step b) or after performing the method according to the application for reducing the surface roughness of the connection surface 1a of the sinter paste layer 1 is shown in Fig. 1. As shown in a schematic manner in Fig. 1, the connection surface 1a of the sinter paste layer 1 has a reduced surface roughness compared to Figure 10 Figure 2

[0060] A pressure sintering method for producing a sintered connection between the first connection partner 5 and a second connection partner 6 arranged on the first connection partner will be described below. The second connection partner 6 can for example be constructed as a power semiconductor component, which is preferably in the form of a power semiconductor switch or a diode. In this case, the individual semiconductor switches are preferably in the form of transistors, for example IGBTs (insulated gate bipolar transistors), or MOSFETs (metal oxide semiconductor field effect transistors) or thyristors. The second connection partner 6 can also for example be constructed as an electrically conductive load connection element.

[0061] First, as part of the pressure sintering method, the method according to the application for reducing the surface roughness of the connection surface 1a of the sinter paste layer 1 is performed, which method comprises method steps a) and b).

[0062] Subsequently, as further part of the pressure sintering method, the following method steps in temporal succession are performed, which are outlined in Figure 11

[0063] In a further method step c) following method step b), one or more liquid components of the sinter paste layer 1 are reduced. The reduction of the one or more liquid components of the sinter paste layer 1 is performed by expelling the one or more liquid components of the sinter paste layer 1, preferably by means of applying heat to the sinter paste layer 1.

[0064] ​​​In a method step d) following the method step c), the second connection partner 6 is arranged on the sinter paste layer 1, or more precisely on the connection surface 1a of the sinter paste layer 1.

[0065] In a method step e) following the method step d), a pressure (S) is applied to the first connection partner 5 and the second connection partner 6 and the sinter paste layer 1, preferably by means of a sinter press, such that the first connection partner 5 and the second connection partner 6 press against one another and heat is applied to the sinter paste layer 1, the application of pressure and heat converting the sinter paste layer 1 into a sinter metal layer. The conversion of the sinter paste layer 1 into the sinter metal layer takes place by sintering the metal particles contained in the sinter paste layer 1. In the exemplary embodiment, the metal particles consist of silver, such that in the exemplary embodiment the sinter metal consists of silver. Figure 11

[0066] It should be noted that the individual connection partners 5 or 6 can also consist of a plurality of components connected to one another. For example, the first connection partner 5 can also comprise a substrate and a power semiconductor component which have been connected to one another conductively by means of sinter metal or solder, and the second connection partner 6 can be in the form of a metal foil. Preferably, the metal foil is structured to form conductor tracks and is part of a foil assembly.

[0067] Furthermore, it should be noted that the features of the various exemplary embodiments of the application can of course be combined with one another in any desired manner without departing from the scope of the application, provided that the features do not exclude one another.​

Claims

1. Method for reducing the surface roughness of a connection surface (1a) of a sintering paste layer (1), which connection surface (1a) is arranged facing away from a first connection partner (5) on which the sintering paste layer (1) is arranged, which method has the following successive method steps: a) arranging the sintering paste layer (1) on the first connection partner (5), b) applying a vibration to the sintering paste layer (1) by means of a vibration application device (2), which vibration application device (2) is configured to generate a mechanical vibration. The frequency of the vibration ranges from 10 Hz to 10 MHz. The viscosity of the sintering paste layer (1) ranges from 1 Pa-s to 100 Pa-s.

2. The method of claim 1, wherein, The ratio of the viscosity of the sintering paste layer (1) to the frequency of the vibration falls within a range from 0.025 Pa-s / kHz to 2.5 Pa-s / kHz.

3. The method according to any of claims 1-2, characterized by, The vibration direction of the vibration extends in the normal direction (N) of a surface (5d) of the first connection partner (5) facing the sintering paste layer (1) or extends perpendicular to the normal direction (N) or has a vibration direction component extending in the normal direction (N) and a vibration direction component extending perpendicular to the normal direction (N).

4. The method according to any one of claims 1-2, characterized by, In method step a), arranging the sintering paste layer (1) on the first connection partner (5) is performed using a screen (10a) by means of a screen printing method, and at the end of method step a), the screen (10a) is removed.

5. The method according to any one of claims 1-2, characterized by, The vibration application device (2) comprises a vibration generation device (2'), which vibration generation device (2') comprises a driven vibration surface (2a') that performs a mechanical vibration, on which vibration surface (2a') the first connection partner (5) is arranged directly or indirectly in order to perform method step b).

6. The method according to any one of claims 1-2, characterized by, The vibration application device (2) comprises a pressure device (2c), which pressure device (2c) presses the first connection partner (5) in the direction of the vibration surface (2a') in method step b).

7. The method according to any of claims 1-2, characterized by, The vibration application device (2) comprises a suction device (2d), which suction device (2d) pulls the first connection partner (5) in the direction of the vibration surface (2a') by generating a reduced pressure in method step b).

8. The method of claim 7, wherein, In method step b), the first connection partner (5) is fixed to a workpiece carrier (8), and in order to perform method step b), the first connection partner (5) is indirectly arranged on the vibration surface (2a') by arranging the workpiece carrier (8) on the vibration surface (2a').

9. The method of claim 7, wherein, ​ 10. The method of claim 7, wherein, ​ 11. The method of any one of claims 1 to 2, wherein, In method step b) the first connection partner (5) is fixed to a workpiece carrier (8), the vibration application device (2) comprises a vibration generation device (2') which puts a liquid (2f) of the vibration application device (2) arranged in a container (2e) of the vibration application device (2) into mechanical vibration and at least a part of the workpiece carrier (8) is immersed in the liquid (2f) in order to perform method step b).

12. The method of any one of claims 1 to 2, wherein, The vibration application device (2) comprises a vibration generation device (2') which puts an elastic pad (2g) of the vibration application device (2) into mechanical vibration and the first connection partner (5) is arranged on the pad (2g) in order to perform method step b).

13. The method of any one of claims 1 to 2, wherein, In method step b) the first connection partner (5) is fixed to a workpiece carrier (8), the vibration application device (2) comprises a vibration generation device (2') which puts an elastic pad (2g) of the vibration application device (2) into mechanical vibration and the workpiece carrier (8) is arranged on the pad (2g) in order to perform method step b).

14. The method of claim 2, wherein, The frequency of the vibration ranges from 10 kHz to 100 kHz.

15. The method of claim 2, wherein, The frequency of the vibration ranges from 20 kHz to 60 kHz.

16. The method of claim 4, wherein, The viscosity of the sintering paste layer (1) ranges from 5 Pa s to 30 Pa s.

17. The method of claim 5, wherein, The ratio of the viscosity of the sintering paste layer (1) to the frequency of the vibration falls in the range from 0.05 Pa s / kHz to 1.25 Pa s / kHz.

18. Pressure sintering method for creating a sintered connection between a first connection partner (5) and a second connection partner (6) arranged on the first connection partner, wherein The method according to any one of claims 1 to 17 is performed and subsequently the following successive method steps are performed: c) reducing one or more liquid components of the sintering paste layer (1), d) arranging the second connection partner (6) on the sintering paste layer (1), e) applying pressure to the first connection partner (5) and the second connection partner (6) and to the sintering paste layer (1) in order to press the first connection partner (5) and the second connection partner (6) against each other and to apply heat to the sintering paste layer (1) which is transformed into a sintered metal layer by the application of pressure and heat.

19. Sintered connection generation device having means configured to perform the method according to any one of claims 1 to 17.

20. Sintered connection generation device having means configured to perform the method according to claim 18.

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